WO2021000472A1 - Mini LED背光面板及背光模组 - Google Patents

Mini LED背光面板及背光模组 Download PDF

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Publication number
WO2021000472A1
WO2021000472A1 PCT/CN2019/114606 CN2019114606W WO2021000472A1 WO 2021000472 A1 WO2021000472 A1 WO 2021000472A1 CN 2019114606 W CN2019114606 W CN 2019114606W WO 2021000472 A1 WO2021000472 A1 WO 2021000472A1
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WO
WIPO (PCT)
Prior art keywords
panel
light
backlight
sub
backlight sub
Prior art date
Application number
PCT/CN2019/114606
Other languages
English (en)
French (fr)
Inventor
刘凡成
Original Assignee
武汉华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US16/623,721 priority Critical patent/US11211365B1/en
Publication of WO2021000472A1 publication Critical patent/WO2021000472A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Definitions

  • This application relates to the field of display technology, in particular to a Mini LED backlight panel and a backlight module.
  • Mini LED chip is an LED chip with a chip size of about 100 ⁇ m ⁇ 100 ⁇ m. It has the advantages of high color saturation, local dimming, high brightness, and energy saving, and can be used in backlight displays.
  • the large-size mini LED backlight panel generally adopts the splicing method of multiple light panels to achieve a larger size.
  • the left light board 101 and the right light board 102 are spliced together to produce a splicing position 1012, where the left The light board 101 and the right light board 102 are respectively provided with a plurality of LED light sources 1011 and LED light sources 1021. Due to problems such as warping, unevenness, breakage, light cut off, and black edges at the splicing position 1012, the Mini LED light board produces dark lines at the splicing position.
  • the purpose of this application is to provide a Mini LED backlight panel and a backlight module, which can solve the mini A dark line is generated at the splicing position of the LED light board, and the color tone of the splicing position is inconsistent with the brightness of the normal light-emitting area, which affects the technical problem of the light quality in the backlight module.
  • an embodiment of the present application provides a Mini LED backlight panel.
  • the LED backlight panel includes: a first backlight sub-panel and a second backlight sub-panel arranged in butt, and the joint of the first backlight sub-panel and the second backlight sub-panel is set as a light supplement area, and the light supplement area It is provided with supplementary light materials.
  • the light supplement material is phosphor or quantum dot particles.
  • the height of the first backlight sub-panel is the same as the height of the light-emitting surface of the second backlight sub-panel, and the first backlight sub-panel and the second backlight sub-panel are arranged separately to form the supplementary light
  • a light-filling material is arranged in the light-filling area.
  • the shape and size of the first backlight sub-panel and the second backlight sub-panel are the same.
  • the height of the light-emitting surface of the first backlight sub-panel is smaller than the height of the light-emitting surface of the second backlight sub-panel, the bottom of one side of the second backlight sub-panel is provided with a cutout, and one end of the first backlight sub-panel is connected to The length of the cut is 1 to 3 light sources.
  • the light supplement area is located at the junction of the surface of the first backlight sub-panel and the end of the second backlight sub-panel, and the light supplement layer in the light supplement area is used to connect the first backlight sub-panel And the fluorescent layer in the second backlight sub-panel.
  • the height of the light supplement layer is 0.01 to 1 mm
  • the light emitting angle of the first LED light source in the first backlight sub-panel is ⁇ 1
  • the light emitting angle of the second LED light source in the second backlight sub-panel is ⁇ 2
  • ⁇ 1 is equal to ⁇ 2.
  • the height of the light supplement layer is greater than 1 mm
  • the light emitting angle of the first LED light source in the first backlight sub-panel is ⁇ 1
  • the light emitting angle of the second LED light source in the second backlight sub-panel is ⁇ 2
  • ⁇ 1 is less than ⁇ 2.
  • an embodiment of the present application also provides a backlight module, which includes:
  • the back plate includes a reinforcing plate and a back glue on the surface of the reinforcing plate.
  • the Mini LED backlight panel is located on the surface of the backplane.
  • the Mini LED backlight panel includes: a first backlight sub-panel and a second backlight sub-panel arranged in butt connection, the first backlight sub-panel and the second backlight sub-panel
  • the splicing part is set as a light supplement area, and the light supplement layer is provided with a light supplement material in the light supplement area, and the light supplement material is phosphor or quantum dot particles.
  • the optical film is located above the Mini LED backlight panel, and is used to condense the light emitted by the Mini LED backlight panel in a preset range and emit it, thereby enhancing the brightness of the backlight module.
  • the height of the light-emitting surface of the first backlight sub-panel is smaller than the height of the light-emitting surface of the second backlight sub-panel, the bottom of one side of the second backlight sub-panel is provided with a cutout, and one end of the first backlight sub-panel is connected to The length of the cut is 1 to 3 light sources.
  • the height of the light supplement layer is 0.1 to 1 mm, the light emitting angle of the first LED light source in the first backlight sub-panel is ⁇ 1, and the light emitting angle of the second LED light source in the second backlight sub-panel is ⁇ 2, and ⁇ 1 Equal to ⁇ 2.
  • the height of the light supplement layer is greater than 1 mm, the light emitting angle of the first LED light source in the first backlight sub-panel is ⁇ 1, and the light emitting angle of the second LED light source in the second backlight sub-panel is ⁇ 2, and ⁇ 1 is less than ⁇ 2.
  • any two adjacent backlight sub-panel light supplement areas in the Mini LED backlight panel are filled with light supplement material.
  • the light supplement material is phosphor or quantum dots.
  • the light supplement material keeps the color of the splicing position consistent with other areas to ensure the Mini The appearance of the LED backlight panel is flat.
  • the Mini LED backlight panel emits light to stimulate the splicing position supplementary light material to emit light, so that the color tone of the splicing position is consistent with the normal area, which improves the brightness of the splicing position and avoids the splicing position.
  • the design scheme of mixing large and small light-emitting angles on the light-emitting surfaces of different heights in the Mini LED backlight panel is conducive to the ultra-thin design of the backlight module.
  • FIG. 1 is a schematic diagram of the structure of a Mini LED backlight panel in the prior art
  • FIG. 2 is a schematic structural diagram of a Mini LED backlight panel provided by an embodiment of the application.
  • FIG. 3 is a schematic structural diagram of another Mini LED backlight panel provided by an embodiment of the application.
  • FIG. 4 is a schematic diagram of a light emitting angle of another Mini LED backlight panel provided by an embodiment of the application.
  • FIG. 5 is a schematic diagram of another light-emitting angle of another Mini LED backlight panel provided by an embodiment of the application.
  • FIG. 6 is a schematic structural diagram of a backlight module provided by an embodiment of the application.
  • FIG. 7 is a schematic diagram of another backlight module structure according to an embodiment of the application.
  • This application addresses the technical problem that the splicing position of the mini LED light panels in the prior art produces dark lines, and the color tone of the splicing position is inconsistent with the brightness of the normal light-emitting area, which affects the light quality of the backlight module. This embodiment can solve this defect.
  • the embodiment of the present application provides a Mini LED backlight panel, which includes: a first backlight sub-panel and a second backlight sub-panel arranged in docking; the joint of the first backlight sub-panel and the second backlight sub-panel is set as a light supplement area; A supplementary light material is arranged in the light zone.
  • This implementation is not limited to the splicing of two backlight sub-panels, multiple backlight sub-panels can also be set to be spliced with each other.
  • the splicing position of any two adjacent backlight sub-panels is provided with a supplementary light area, which can be located adjacent to each other.
  • the two backlight sub-panels can also be located at the junction of two adjacent backlight sub-panels.
  • the supplemental light area is to realize that the brightness of the light emitted by the junction of the two adjacent backlight sub-panels is the same as the bright line emitted by the backlight sub-panel , The appearance is smooth and beautiful.
  • the light-filling area is provided with light-filling materials.
  • the light-filling materials include color conversion materials such as phosphors or quantum dots.
  • the backlight sub-panel emits blue light. After passing through the color conversion material, the blue light is converted into red light, green light or Blue light, and then achieve red, green and blue light.
  • the LED light source in any backlight sub-panel is arranged in the white oil layer of the backlight sub-panel, and protrudes from the surface of the white oil layer, and extends to the fluorescent layer of the backlight sub-panel; among them, the LED light source in the backlight sub-panel close to the light supplement area emits light Then, after passing through the light-filling layer in the light-filling area, it is converted into corresponding light and propagates out. Some of the light that is not absorbed by the light-filling layer and reflected back. This part of the light passes through the upper surface of the white oil layer, at the upper surface of the white oil layer. Reflecting, after the conversion of the light supplement layer again, is converted into the corresponding light, and spread out, which improves the light extraction efficiency of the light supplement layer, thereby improving the Mini The overall light output efficiency of the LED backlight panel.
  • an embodiment of the present application provides a Mini LED backlight panel 200, which includes: a first backlight sub-panel 201 and a second backlight sub-panel 202 that are butt-mounted, the height of the light-emitting surface of the first backlight sub-panel 201 and the The light-emitting surfaces of the two backlight sub-panels 202 have the same height, and the first backlight sub-panel 201 and the second backlight sub-panel 202 are arranged separately to form a light supplement area 203, that is, the area between the end surface 2015 and the end surface 2025.
  • the light-filling area 203 is provided with a light-filling material, which is phosphor or quantum dot particles.
  • the thickness of the light-filling layer at the light-filling area 203 is equal to or slightly thicker than the thickness of the fluorescent layer of the backlight sub-panel to ensure the Mini LED backlight panel 200 has a flat appearance; when the backlight module is in the bright state, the backlight sub-panel can also excite the phosphor or quantum dot particles in the light supplement area 203 to emit light, so that the color tone of the light supplement area 203 is consistent with the normal area, which improves the light supplement area 203 brightness, to avoid color aberration in the light supplement area 203, improve the uneven brightness of the light supplement area 203, thereby improving the quality of the light emitted by the Mini LED backlight panel 200.
  • the shape and size of the first backlight sub-panel 201 and the second backlight sub-panel 202 are the same.
  • the first backlight sub-panel 201 includes a first carrier 2011, a first white oil layer 2012, a first LED light source 2013 and a first phosphor layer 2014;
  • the second backlight sub-panel 202 includes a second carrier 2021, a second white oil layer 2022, and a second
  • the LED light source 2023 and the second fluorescent layer 2024, the structure and function of the first backlight sub-panel 201 and the corresponding structure and function of the second backlight sub-panel 202 are the same.
  • the first carrier 2011 includes a circuit layer for providing electrical energy to the first LED light source 2013, the first white oil layer 2012 is disposed on the surface of the first carrier 2011, and the first LED light source 2013 is arrayed in the first white oil layer 2012. And the first LED light source 2013 protrudes from the surface of the first white oil layer 2012 and extends into the first fluorescent layer 2014.
  • the upper surface of each first LED light source 2013 is provided with a first concave structure, and the bottom of the first concave structure is placed LED After the chip, the first LED light source 2013 emits light, it is converted into corresponding light by the first fluorescent layer 2014, and then spreads out.
  • Some of the light that is not absorbed by the first fluorescent layer 2014 and reflected back is on the upper surface of the first white oil layer 2012
  • the reflection passes through the first phosphor layer 2014 again, is converted into corresponding light, and spreads out, which improves the light extraction efficiency of the first phosphor layer 2014, thereby improving the overall light extraction efficiency of the Mini LED backlight panel 200.
  • the first backlight sub-panel 201 and the second backlight sub-panel 202 have the same shape and are manufactured separately and modularly produced, which improves the production efficiency of the backlight sub-panel.
  • This implementation is not limited to the splicing of two backlight sub-panels. Multiple backlight sub-panels can also be set to be spliced with each other. The light-filling area of any two adjacent backlight sub-panels can be filled with light-filling materials to improve the Mini The quality of the light emitted by the LED backlight panel 200.
  • an embodiment of the present application provides another Mini LED backlight panel 300.
  • the height of the light-emitting surface of the first backlight sub-panel 301 is smaller than the height of the light-emitting surface of the second backlight sub-panel 302.
  • a cutout 304 is provided at the bottom, which is step-shaped.
  • the cross-sectional shape of the first backlight sub-panel 301 is a rectangle, and the height of the rectangle is the same as the height of the cutout 304.
  • One end of the first backlight sub-panel 301 is inserted into the cutout 304, and
  • the length is 1 to 3 light source spacing D, where the light source spacing D is the sum of the width of one LED light source and the gap distance between two adjacent LED light sources.
  • the second backlight sub-panel 302 is located above the cutout 304 and is provided with a Two LED light sources 3023, the first backlight sub-panel 301 part of the access cutout 304 is not provided with the first LED light source 3013; the fill light area 303 is located on the surface 30141 of the first backlight sub-panel 301 and is attached to the second backlight sub-panel 302 and The side surface 30241 adjacent to the first backlight sub-panel 301, that is, the light supplement area 303 is located at the junction of the surface 30141 of the first backlight sub-panel 301 and the side surface 30241 of the second backlight sub-panel 302.
  • the light supplement layer in the light supplement area 303 is used for connection The first backlight sub-panel 301 and the second backlight sub-panel 302.
  • the light-filling area 303 is provided with a light-filling material.
  • the light-filling material is phosphor or quantum dot particles.
  • the thickness of the light-filling layer at the light-filling area 303 is equal to or slightly thicker than that of the fluorescent layer of the backlight sub-panel.
  • the appearance of the LED backlight panel 300 is flat; when the backlight module is in the bright state, the backlight sub-panel can also stimulate the phosphor or quantum dot particles in the light supplement area 303 to emit light, so that the color tone of the light supplement area 303 is consistent with the normal area, which improves
  • the brightness of the light-filling area 303 avoids chromatic aberration in the light-filling area 303, and improves the uneven brightness of the light-filling area 303, thereby improving the quality of the light emitted by the Mini LED backlight panel 300.
  • the first backlight sub-panel 301 has a rectangular cross-section and includes a first carrier 3011, a first white oil layer 3012, a first LED light source 3013 and a first fluorescent layer 3014; wherein, the first carrier 3011 includes a circuit layer, To provide power to the first LED light source 3013, the first white oil layer 3012 is arranged on the surface of the first carrier 3011, and the first LED light source 3013 is arranged in the first white oil layer 3012 and protrudes from the surface of the first white oil layer 3012, and Extending into the first fluorescent layer 3014, the upper surface of each first LED light source 3013 is provided with a first concave structure, and an LED chip is placed at the bottom of the first concave structure.
  • the first LED light source 3013 After the first LED light source 3013 emits light, it passes through the first fluorescent layer 3014 It is converted into corresponding light and propagated. Some of the light that is not absorbed by the first fluorescent layer 3014 and reflected back is reflected on the upper surface of the first white oil layer 3012, passes through the first fluorescent layer 3014 again, and is converted into corresponding light, which is transmitted Going out improves the light extraction efficiency of the first phosphor layer 3014, thereby improving the overall light extraction efficiency of the Mini LED backlight panel 300.
  • the second backlight sub-panel 302 has a stepped cross section, and includes a second carrier 3021, a second white oil layer 3022, a second LED light source 3023, and a second fluorescent layer 3024; wherein, the second carrier 3021 includes a circuit layer for feeding Two LED light sources 3023 provide electrical energy, the second white oil layer 3022 is arranged on the surface of the second carrier 3021, a plurality of second LED light sources 3023 are arranged at intervals in the second white oil layer 3022, and the second LED light sources 3023 protrude from the second white oil layer 3022, and extend into the second fluorescent layer 3024, each second LED light source 3023 is provided with a second concave structure on the upper surface, the bottom of the second concave structure is placed LED chip, the second LED light source 3023 emits light after passing through the second The fluorescent layer 3024 converts into corresponding light rays and spreads out.
  • the second carrier 3021 includes a circuit layer for feeding Two LED light sources 3023 provide electrical energy
  • Some of the light reflected by the second fluorescent layer 3024 is reflected on the upper surface of the second white oil layer 3022, passes through the second fluorescent layer 3024 again, and is converted into corresponding light rays. Going out improves the light extraction efficiency of the second phosphor layer 3024, thereby improving the overall light extraction efficiency of the Mini LED backlight panel 300.
  • the shapes of the first backlight sub-panel 301 and the second backlight sub-panel 302 are different, and they are manufactured separately and produced in a modular manner to improve the production efficiency of the backlight sub-panel.
  • This implementation is not limited to the splicing of two backlight sub-panels. Multiple backlight sub-panels can also be set to be spliced with each other.
  • the light-filling area of any two adjacent backlight sub-panels can be filled with light-filling materials to improve the Mini The quality of the light emitted by the LED backlight panel 300.
  • an embodiment of the present application provides a schematic diagram of a light-emitting angle of another Mini LED backlight panel 300; the light-emitting surface of the first backlight sub-panel 301 is lower than the light-emitting surface of the second backlight sub-panel 302, when the first backlight
  • the height difference between the light-emitting surface of the sub-panel 301 and the light-emitting surface of the second backlight sub-panel 302 is small, the height of the light-filling layer in the light-filling area 303 is 0.01 to 1 mm, and the length of the side 30142 is 0.01 to 1 mm
  • the first backlight sub-panel 301 The light emitting angle of the first LED light source 3013 is ⁇ 1, and the light emitting angle of the second LED light source 3023 in the second backlight sub-panel 302 is ⁇ 2, and ⁇ 1 is equal to ⁇ 2.
  • the path length S1 of the light emitted by the first LED light source 3013 is equal to The route length S2 of the light emitted by the second LED light source 3023 ensures that the brightness of the emitted light source of the Mini LED backlight panel 300 is consistent.
  • the embodiment of the present application provides a schematic diagram of another light-emitting angle of another Mini LED backlight panel 300.
  • the light-emitting surface of the first backlight sub-panel 301 is lower than the light-emitting surface of the second backlight sub-panel 302.
  • the height difference between the light-emitting surface of the backlight sub-panel 301 and the light-emitting surface of the second backlight sub-panel 302 is relatively large.
  • the first backlight sub-panel 301 When the height of the light-filling layer in the light-filling area 303 is greater than 1 mm, and the length of the side 30142 is greater than 1 mm, the first backlight sub-panel 301
  • the light-emitting angle of the LED light source 3013 is ⁇ 1
  • the light-emitting angle of the second LED light source 3023 in the second backlight sub-panel 302 is also ⁇ 2.
  • ⁇ 1 is 110° and ⁇ 2 is 140°.
  • the route length S11 of the light emitted by the first LED light source 3013 is equal to the route length S21 of the light emitted by the second LED light source 3023, and the first LED light source 3013 close to the light supplement area 303 emits light to reach the light supplement.
  • the side 30142 of the light supplement layer in the light zone 303 will reflect, such as light S3, which ensures that the brightness of the light source emitted by the Mini LED backlight panel 300 is consistent.
  • the small-angle and large-angle mixing scheme is adopted to improve the uneven brightness of the backlight sub-panel splicing area, improve the overall light output efficiency and light quality of the Mini LED backlight panel 300, and at the same time help the backlight module's super Thin design.
  • This implementation is not limited to the access of two backlight sub-panels. Multiple backlight sub-panels can also be connected to each other.
  • the light-filling area of any two adjacent backlight sub-panels is filled with light-filling materials to improve the Mini The quality of the light emitted by the LED backlight panel.
  • a backlight module 400 is provided, as shown in FIG. 6, including:
  • the back plate 401 includes a reinforcing plate 4011 and a back glue 4012 located on the surface of the reinforcing plate 4011.
  • the reinforcing plate 4011 is preferably aluminum alloy with a thickness ranging from 10 to 40um.
  • the surface is slotted and punched, which is beneficial to Mini
  • the LED backlight panel 200 dissipates heat; the adhesive 4012 is used to fix the backlight sub-panel in the Mini LED backlight panel 200.
  • the aforementioned Mini LED backlight panel 200 is located on the surface of the back plate 401. Due to the limited space in Figure 6, the structure and area of the Mini LED backlight panel 200 are not marked with symbols. The corresponding structure and area labels are the same as those in Figure 2.
  • the LED backlight panel 200 includes: a first backlight sub-panel 201 and a second backlight sub-panel 202 which are arranged in a butt connection. The joint of the first backlight sub-panel 201 and the second backlight sub-panel 202 is set as a light supplement area 203, and a light supplement area 203
  • the internal light-filling layer is provided with light-filling material, which is phosphor or quantum dot particles.
  • the height of the light-emitting surface of the first backlight sub-panel 201 and the height of the light-emitting surface of the second backlight sub-panel 202 are the same. It is arranged separately from the second backlight sub-panel 202 to form a light supplement area 203, and a light supplement material is arranged in the light supplement area 203. Among them, the first backlight sub-panel 201 and the second backlight sub-panel 202 have the same shape and size. Both the first backlight sub-panel 201 and the second backlight sub-panel 202 include a carrier, a white oil layer, an LED light source and a fluorescent layer, and the LED light source is arranged In the white oil layer, it protrudes from the surface of the white oil layer and extends into the fluorescent layer.
  • the optical film 402 is located above the Mini LED backlight panel 200, and is used to condense the light emitted by the Mini LED backlight panel 200 into a preset range and emit it, thereby enhancing the brightness of the backlight module 400.
  • another backlight module 500 is provided, as shown in FIG. 7, including:
  • the back plate 501 includes a reinforcing plate 5011 and a back glue 5012 on the surface of the reinforcing plate 5011.
  • the reinforcing plate 5011 is preferably aluminum alloy with a thickness ranging from 10 to 40um.
  • the surface is slotted and punched, which is beneficial to Mini
  • the LED backlight panel 300 dissipates heat; the adhesive 5012 is used to fix the backlight sub-panel in the Mini LED backlight panel 300.
  • the aforementioned Mini LED backlight panel 300 is located on the surface of the back plate 501. Due to the limited space in Figure 7, the structure and area of the Mini LED backlight panel 300 are not marked with symbols. The corresponding structure and area labels are the same as those in Figure 3.
  • the LED backlight panel 300 includes: a first backlight sub-panel 301 and a second backlight sub-panel 302 which are butt-connected, and a supplementary light area 303 and a supplementary light area 303 are provided at the joint of the first backlight sub-panel 301 and the second backlight sub-panel 302
  • the internal light supplement layer is provided with light supplement material, and the light supplement material is phosphor or quantum dot particles.
  • the height of the light-emitting surface of the first backlight sub-panel 301 is smaller than the height of the light-emitting surface of the second backlight sub-panel 302, a cutout 304 is provided at the bottom of one side of the second backlight sub-panel 302, and one end of the first backlight sub-panel 301 is inserted into the cutout 304, and
  • the length of the access is 1 to 3 light source pitches;
  • the height of the fill light layer is 0.1 to 1 mm, the light emitting angle of the first LED light source 3013 in the first backlight sub-panel 301 is ⁇ 1, and the second LED in the second backlight sub-panel 302
  • the light-emitting angle of the light source 3023 is ⁇ 2, and ⁇ 1 is equal to ⁇ 2;
  • the height of the fill light layer is greater than 1mm, the light-emitting angle of the first LED light source 3013 in the first backlight sub-panel 301 is ⁇ 1, and the second LED light source in the second backlight sub-panel 302
  • the optical film 502 is located above the Mini LED backlight panel 300, and is used to condense the light emitted by the Mini LED backlight panel 300 into a preset range and emit it, thereby enhancing the brightness of the backlight module 500.
  • any two adjacent backlight sub-panel light-filling areas of the Mini LED backlight panel are filled with light-filling materials.
  • the light-filling materials are phosphors or quantum dots.
  • the light-filling materials keep the color of the splicing position consistent with other areas to ensure Mini The appearance of the LED backlight panel is flat.
  • the Mini LED backlight panel emits light to stimulate the splicing position supplementary light material to emit light, so that the color tone of the splicing position is consistent with the normal area, which improves the brightness of the splicing position and avoids the splicing position.
  • the design scheme of mixing large and small light-emitting angles on the light-emitting surfaces of different heights in the Mini LED backlight panel is conducive to the ultra-thin design of the backlight module.

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Abstract

本申请提供一种Mini LED背光面板，包括对接设置多个子面板，任意相邻两个子面板的拼接处设置有补光区，所述补光区内填充了荧光粉或者量子点，Mini LED背光面板发光激发补光区材料发光，其次高低发光面采用大小发光角度混排的设计方案，提高了拼接位置上亮度，从而提升Mini LED背光面板发出光的品质，同时有利于背光模组的超薄设计。

Description

Mini LED背光面板及背光模组 技术领域
本申请涉及显示技术领域，具体涉及一种Mini LED背光面板及背光模组。
 背景技术
Mini LED芯片是一种芯片尺寸在100μm× 100μm左右的LED芯片，其具有色彩饱和度高、可局部调光、亮度高、节能等优点，可应用于背光显示器。
如图1所示，大尺寸的mini LED背光面板一般采取多片灯板拼接方式来实现更大尺寸，左侧灯板101和右侧灯板102拼接在一起，产生拼接位置1012，其中左侧灯板101和右侧灯板102分别设置有多个LED光源1011和LED光源1021。由于拼接位置1012翘曲、不平整、断裂、光截断、裁切黑边等问题，导致Mini LED灯板在拼接位置产生暗线。
综上所述，需要设计出一种新的结构，以解决现有技术中mini LED灯板拼接位置产生暗线，拼接位置发光的色调和正常发光区域亮度不一致，影响背光模组中出光品质的技术问题。
 技术问题
本申请的目的在于提供一种Mini LED背光面板及背光模组，能够解决现有技术中mini LED灯板拼接位置产生暗线，拼接位置发光的色调和正常发光区域亮度不一致，影响背光模组中出光品质的技术问题。
 技术解决方案
为了解决上述问题，本申请实施例提供了一种Mini LED背光面板，该Mini LED背光面板包括：对接设置的第一背光子面板和第二背光子面板，所述第一背光子面板与所述第二背光子面板的拼接处设置为补光区，所述补光区内设置有补光材料。
其中，所述补光材料为荧光粉或者量子点粒子。
其中，所述第一背光子面板的高度和所述第二背光子面板的发光面高度相同，所述第一背光子面板和所述第二背光子面板之间分离设置以形成所述补光区，所述补光区内设置有补光材料。
其中，所述第一背光子面板和所述第二背光子面板形状和大小均相同。
其中，所述第一背光子面板的发光面高度小于所述第二背光子面板的发光面高度，所述第二背光子面板一侧底部设置有切口，所述第一背光子面板一端接入所述切口内，且接入的长度为1至3个光源间距。
其中，所述补光区位于所述第一背光子面板表面与所述第二背光子面板端部的交接处，且所述补光区中补光层用于连接所述第一背光子面板和所述第二背光子面板中荧光层。
其中，所述补光层的高度为0.01至1mm，所述第一背光子面板中第一LED光源的发光角度为θ1，所述第二背光子面板中第二LED光源的发光角度为θ2，且θ1等于θ2。
其中，所述补光层的高度大于1mm，所述第一背光子面板中第一LED光源的发光角度为θ1，所述第二背光子面板中第二LED光源的发光角度为θ2，θ1小于θ2。
为了解决上述问题，本申请实施例还提供了一种背光模组，该背光模组包括：
背板，包括补强板和位于所述补强板表面的背胶。
Mini LED背光面板，位于所述背板表面，所述Mini LED背光面板包括：对接设置的第一背光子面板和第二背光子面板，所述第一背光子面板与所述第二背光子面板的拼接处设置为补光区，所述补光区内补光层设置有补光材料，所述补光材料为荧光粉或者量子点粒子。
光学膜材，位于所述Mini LED背光面板上方，用于将所述Mini LED背光面板发射的光线聚集在预设范围内出射，提升所述背光模组的亮度。
其中，所述第一背光子面板的发光面高度小于所述第二背光子面板的发光面高度，所述第二背光子面板一侧底部设置有切口，所述第一背光子面板一端接入所述切口内，且接入的长度为1至3个光源间距。
所述补光层的高度为0.1至1mm，所述第一背光子面板中第一LED光源的发光角度为θ1，所述第二背光子面板中第二LED光源的发光角度为θ2，且θ1等于θ2。
所述补光层的高度大于1mm，所述第一背光子面板中第一LED光源的发光角度为θ1，所述第二背光子面板中第二LED光源的发光角度为θ2，θ1小于θ2。
 有益效果
Mini LED背光面板中任意相邻两个背光子面板补光区填充补光材料，该补光材料为荧光粉或者量子点，该补光材料使拼接位置颜色和其他区域保持一致，确保Mini LED背光面板外观平整，背光模组亮态时，Mini LED背光面板发光激发拼接位置补光材料发光，以使拼接位置发光的色调和正常区域一致，提高了拼接位置上亮度，避免拼接位置上产生色差，从而提升Mini LED背光面板发出光的品质，其次在Mini LED背光面板中不同高度的发光面上采用大小发光角度混排的设计方案，有利于背光模组的超薄设计。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有技术中一种Mini LED背光面板结构示意图；
图2为本申请实施例提供一种Mini LED背光面板结构示意图；
图3为本申请实施例提供另一种Mini LED背光面板结构示意图；
图4为本申请实施例提供另一种Mini LED背光面板一种发光角度示意图；
图5为本申请实施例提供另一种Mini LED背光面板另一种发光角度示意图；
图6为本申请实施例提供一种背光模组结构示意图；
图7为本申请实施例提供另一种背光模组结构示意图。
 本发明的实施方式
下面结合附图和实施例，对本申请作进一步的详细描述。特别指出的是，以下实施例仅用于说明本申请，但不对本申请的范围进行限定。同样的，以下实施例仅为本申请的部分实施例而非全部实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。
本申请针对现有技术中mini LED灯板拼接位置产生暗线，拼接位置发光的色调和正常发光区域亮度不一致，影响背光模组中出光品质的技术问题，本实施例能够解决该缺陷。
本申请实施例提供一种Mini LED背光面板，包括：对接设置的第一背光子面板和第二背光子面板，第一背光子面板与第二背光子面板的拼接处设置为补光区，补光区内设置有补光材料。
本实施并不限于两个背光子面板拼接，还可以设置多个背光子面板相互拼接，任意相邻两个背光子面板的拼接位置，拼接位置设置有补光区，补光区可以位于相邻两个背光子面板之间，还可以位于在相邻两个背光子面板交接处，补光区是为了实现相邻两个背光子面板衔接处发出的光线亮度与背光子面板发出的亮线相同，外观平整美观。该补光区内设置有补光材料，补光材料包括荧光粉或者量子点等色转换材料，例如，背光子面板发射出蓝光，经过色转换材料后，将蓝光转换为红光、绿光或者蓝光，进而实现红绿蓝三色光。
任意背光子面板中LED光源设置在背光子面板的白油层内，并凸出白油层的表面，延伸至背光子面板的荧光层中；其中，背光子面板中靠近补光区的LED光源散发光线后，经过补光区中补光层转换成相应的光线，传播出去，有部分未被补光层吸收，反射回来的光，这部分光经过白油层的上表面时，在白油层上表面处反射，再次经过补光层的转换，转换成相应的光线，传播出去，提升了补光层取光效率，从而提升了Mini LED背光面板的整体出光效率。
如图2所示，本申请实施例提供一种Mini LED背光面板200，包括：对接设置的第一背光子面板201和第二背光子面板202，第一背光子面板201的发光面高度和第二背光子面板202的发光面高度相同，第一背光子面板201和第二背光子面板202之间分离设置以形成补光区203，即端面2015和端面2025之间的区域。补光区203内设置有补光材料，该补光材料为荧光粉或者量子点粒子，补光区203处的补光层厚度与背光子面板荧光层厚度相当或者略厚，确保Mini LED背光面板200外观平整；当背光模组处于亮态时，背光子面板发光也可以激发补光区203处荧光粉或量子点粒子发光，以使补光区203色调和正常区域一致，提高了补光区203亮度，避免补光区203上产生色差，改善补光区203亮度不均的问题，从而提升Mini LED背光面板200发出光的品质。
第一背光子面板201和第二背光子面板202的形状和大小均相同。第一背光子面板201包括第一载体2011、第一白油层2012，第一LED光源2013和第一荧光层2014；第二背光子面板202包括第二载体2021、第二白油层2022，第二LED光源2023和第二荧光层2024，第一背光子面板201的结构及其作用和第二背光子面板202相应的结构和作用相同。
其中，第一载体2011包括线路层，用于给第一LED光源2013提供电能，第一白油层2012设置在第一载体2011的表面，第一LED光源2013阵列分布于第一白油层2012中，且第一LED光源2013凸出第一白油层2012的表面，并延伸至第一荧光层2014中，每个第一LED光源2013上表面设置有第一凹型结构，第一凹型结构的底部放置LED芯片，第一LED光源2013散发光线后，经过第一荧光层2014转换成相应的光线，传播出去，有部分未被第一荧光层2014吸收，反射回来的光，在第一白油层2012上表面反射，再次经过第一荧光层2014，转换成相应的光线，传播出去，提升了第一荧光层2014取光效率，从而提升了Mini LED背光面板200的整体出光效率。
本实施例中第一背光子面板201和第二背光子面板202的形状相同，单独制作，模块化生产，提高背光子面板生产的效率。本实施并不限于两个背光子面板拼接，还可以设置多个背光子面板相互拼接，任意相邻两个背光子面板的补光区中填充补光材料，以提高提升Mini LED背光面板200发出光的品质。
如图3所示，本申请实施例提供另一种Mini LED背光面板300，第一背光子面板301的发光面高度小于第二背光子面板302的发光面高度，第二背光子面板302一侧底部设置有切口304，呈台阶状，第一背光子面板301的截面形状为长方形，该长方形的高与切口304的高度相同，第一背光子面板301一端接入切口304内，且接入的长度为1至3个光源间距D，其中，光源间距D为一个LED光源的宽度和相邻两个LED光源之间的间隙距离之和，第二背光子面板302位于切口304上方部分设置有第二LED光源3023，接入切口304内第一背光子面板301部分未设置第一LED光源3013；补光区303位于第一背光子面板301的表面30141，并贴合第二背光子面板302与第一背光子面板301相邻的侧面30241，即补光区303位于第一背光子面板301表面30141与第二背光子面板302侧面30241的交接处，补光区303中补光层用于连接第一背光子面板301和第二背光子面板302。补光区303内设置有补光材料，该补光材料为荧光粉或者量子点粒子，补光区303处的补光层厚度与背光子面板荧光层厚度相当或者略厚，确保Mini LED背光面板300外观平整；当背光模组处于亮态时，背光子面板发光也可以激发补光区303处荧光粉或量子点粒子发光，以使补光区303色调和正常区域一致，提高了补光区303亮度，避免补光区303上产生色差，改善补光区303亮度不均的问题，从而提升Mini LED背光面板300发出光的品质。
本实施例中第一背光子面板301的截面呈长方形，包括第一载体3011、第一白油层3012，第一LED光源3013和第一荧光层3014；其中，第一载体3011包括线路层，用于给第一LED光源3013提供电能，第一白油层3012设置在第一载体3011的表面，第一LED光源3013设置在第一白油层3012中，且凸出第一白油层3012的表面，并延伸至第一荧光层3014中，每个第一LED光源3013上表面设置有第一凹型结构，第一凹型结构的底部放置LED芯片，第一LED光源3013散发光线后，经过第一荧光层3014转换成相应的光线，传播出去，有部分未被第一荧光层3014吸收，反射回来的光，在第一白油层3012上表面反射，再次经过第一荧光层3014，转换成相应的光线，传播出去，提升了第一荧光层3014取光效率，从而提升了Mini LED背光面板300的整体出光效率。
第二背光子面板302的截面呈台阶状，包括第二载体3021、第二白油层3022，第二LED光源3023和第二荧光层3024；其中，第二载体3021包括线路层，用于给第二LED光源3023提供电能，第二白油层3022设置在第二载体3021的表面，第二白油层3022中间隔设置有多个第二LED光源3023，且第二LED光源3023凸出第二白油层3022，并延伸至第二荧光层3024中，每个第二LED光源3023上表面设置有第二凹型结构，第二凹型结构的底部放置LED芯片，第二LED光源3023散发光线后，经过第二荧光层3024转换成相应的光线，传播出去，有部分被第二荧光层3024反射回来的光，在第二白油层3022上表面反射，再次经过第二荧光层3024，转换成相应的光线，传播出去，提升了第二荧光层3024取光效率，从而提升了Mini LED背光面板300的整体出光效率。
本实施例中第一背光子面板301和第二背光子面板302的形状不同，单独制作，模块化生产，提高背光子面板生产的效率。本实施并不限于两个背光子面板拼接，还可以设置多个背光子面板相互拼接，任意相邻两个背光子面板的补光区中填充补光材料，以提高提升Mini LED背光面板300发出光的品质。
如图4所示，本申请实施例提供另一种Mini LED背光面板300一种发光角度示意图；第一背光子面板301的发光面低于第二背光子面板302的发光面，当第一背光子面板301发光面与第二背光子面板302发光面高度差较小，补光区303中补光层的高度为0.01至1mm，边30142的长度为0.01至1mm时，第一背光子面板301中第一LED光源3013的发光角度为θ1，第二背光子面板302中第二LED光源3023的发光角度为θ2，θ1等于θ2。由于补光区303中补光层的高度较小，当第一LED光源3013和第二LED光源3023发射的光到达同一预设水平位置306时，第一LED光源3013发射光的路线长度S1等于第二LED光源3023发射光的路线长度S2，确保了Mini LED背光面板300发射光源亮度一致。
如图5所示，本申请实施例提供另一种Mini LED背光面板300另一种发光角度示意图，第一背光子面板301的发光面低于第二背光子面板302的发光面，当第一背光子面板301发光面与第二背光子面板302发光面高度差较大，补光区303中补光层的高度大于1mm，边30142的长度大于1mm时，第一背光子面板301中第一LED光源3013的发光角度为θ1，第二背光子面板302中第二LED光源3023的发光角度也为θ2，例如，θ1为110°，θ2为140°，当第一LED光源3013和第二LED光源3023到达同一预设水平位置306时，第一LED光源3013发射光的路线长度S11等于第二LED光源3023发射光的路线长度S21，靠近补光区303的第一LED光源3013发射光线到达补光区303中补光层的边30142，会发生反射，如光线S3，确保了Mini LED背光面板300发射光源亮度一致。
在高低位置上采用小角度和大角度混排的方案，改善背光子面板拼接处亮度不均匀的现象，提升了Mini LED背光面板300的整体出光效率和出光品质，同时有利于背光模组的超薄设计。本实施并不限于两个背光子面板接入，还可以设置多个背光子面板相互接入，任意相邻两个背光子面板的补光区填充有补光材料，以提高提升Mini LED背光面板发出光的品质。
依据本申请的上述目的，提供一种背光模组400，如图6所示，包括：
背板401，包括补强板4011和位于补强板4011表面的背胶4012，补强板4011优选为铝合金，厚度范围为10至40um，并对其表面进行开槽冲切，有利于Mini LED背光面板200散热；背胶4012，用于固定Mini LED背光面板200中背光子面板。
上述Mini LED背光面板200，位于背板401表面，由于图6的空间有限，Mini LED背光面板200的结构和区域未用符号标出，相应的结构和区域标号跟图2的一样，Mini LED背光面板200包括：对接设置的第一背光子面板201和第二背光子面板202，第一背光子面板201与第二背光子面板202的拼接处设置为补光区203，补光区203内补光层设置有补光材料，补光材料为荧光粉或者量子点粒子，第一背光子面板201的发光面高度和第二背光子面板202的发光面高度相同，第一背光子面板201和第二背光子面板202之间分离设置以形成补光区203，补光区203内设置有补光材料。其中，第一背光子面板201和第二背光子面板202形状和大小均相同，第一背光子面板201和第二背光子面板202均包括载体、白油层、LED光源和荧光层，LED光源设置在白油层内，并凸出白油层的表面，延伸至荧光层中。
光学膜材402，位于Mini LED背光面板200上方，用于将Mini LED背光面板200发射的光线聚集在预设范围内出射，提升背光模组400的亮度。
依据本申请的上述目的，提供另一种背光模组500，如图7所示，包括：
背板501，包括补强板5011和位于补强板5011表面的背胶5012，补强板5011优选为铝合金，厚度范围为10至40um，并对其表面进行开槽冲切，有利于Mini LED背光面板300散热；背胶5012，用于固定Mini LED背光面板300中背光子面板。
上述Mini LED背光面板300，位于背板501表面，由于图7的空间有限，Mini LED背光面板300的结构和区域未用符号标出，相应的结构和区域标号跟图3的一样，Mini LED背光面板300包括：对接设置的第一背光子面板301和第二背光子面板302，第一背光子面板301与第二背光子面板302的拼接处设置有补光区303，补光区303内补光层设置有补光材料，补光材料为荧光粉或者量子点粒子。第一背光子面板301的发光面高度小于第二背光子面板302的发光面高度，第二背光子面板302一侧底部设置有切口304，第一背光子面板301一端接入切口304内，且接入的长度为1至3个光源间距；补光层的高度为0.1至1mm，第一背光子面板301中第一LED光源3013的发光角度为θ1，第二背光子面板302中第二LED光源3023的发光角度为θ2，且θ1等于θ2；补光层的高度大于1mm，第一背光子面板301中第一LED光源3013的发光角度为θ1，第二背光子面板302中第二LED光源3023的发光角度为θ2，θ1小于θ2，例如θ1=110°，θ2=140°，其中，第一背光子面板301和第二背光子面板302均包括载体、白油层、LED光源和荧光层，LED光源设置在白油层内，并凸出白油层的表面，延伸至荧光层中。
光学膜材502，位于Mini LED背光面板300上方，用于将Mini LED背光面板300发射的光线聚集在预设范围内出射，提升背光模组500的亮度。
本申请中Mini LED背光面板中任意相邻两个背光子面板补光区填充补光材料，该补光材料为荧光粉或者量子点，该补光材料使拼接位置颜色和其他区域保持一致，确保Mini LED背光面板外观平整，背光模组亮态时，Mini LED背光面板发光激发拼接位置补光材料发光，以使拼接位置发光的色调和正常区域一致，提高了拼接位置上亮度，避免拼接位置上产生色差，从而提升Mini LED背光面板发出光的品质，其次在Mini LED背光面板中不同高度的发光面上采用大小发光角度混排的设计方案，有利于背光模组的超薄设计。
综上，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (10)

  1. 一种Mini LED背光面板，其包括：
    对接设置的第一背光子面板和第二背光子面板，所述第一背光子面板与所述第二背光子面板的拼接处设置为补光区，所述补光区内设置有补光材料。
  2. 根据权利要求1所述的Mini LED背光面板，其中，
    所述补光材料为荧光粉或者量子点粒子。
  3. 根据权利要求1所述的Mini LED背光面板，其中，所述第一背光子面板的高度和所述第二背光子面板的发光面高度相同，所述第一背光子面板和所述第二背光子面板之间分离设置以形成所述补光区，所述补光区内设置有补光材料。
  4. 根据权利要求3所述的Mini LED背光面板，其中，所述第一背光子面板和所述第二背光子面板形状和大小均相同。
  5. 根据权利要求1所述的Mini LED背光面板，其中，所述第一背光子面板的发光面高度小于所述第二背光子面板的发光面高度，所述第二背光子面板一侧底部设置有切口，所述第一背光子面板一端接入所述切口内，且接入的长度为1至3个光源间距。
  6. 根据权利要求5所述的Mini LED背光面板，其中，所述补光区位于所述第一背光子面板表面与所述第二背光子面板端部的交接处，且所述补光区中补光层用于连接所述第一背光子面板和所述第二背光子面板中荧光层。
  7. 根据权利要求6所述的Mini LED背光面板，其中，所述补光层的高度为0.01至1mm，所述第一背光子面板中第一LED光源的发光角度为θ1，所述第二背光子面板中第二LED光源的发光角度为θ2，且θ1等于θ2。
  8. 根据权利要求6所述的Mini LED背光面板，其中，所述补光层的高度大于1mm，所述第一背光子面板中第一LED光源的发光角度为θ1，所述第二背光子面板中第二LED光源的发光角度为θ2，θ1小于θ2。
  9. 一种背光模组，其包括：
    背板，包括补强板和位于所述补强板表面的背胶；
    Mini LED背光面板，位于所述背板表面，所述Mini LED背光面板包括：对接设置的第一背光子面板和第二背光子面板，所述第一背光子面板与所述第二背光子面板的拼接处设置为补光区，所述补光区内补光层设置有补光材料，所述补光材料为荧光粉或者量子点粒子；
    光学膜材，位于所述Mini LED背光面板上方，用于将所述Mini LED背光面板发射的光线聚集在预设范围内出射，提升所述背光模组的亮度。
  10. 根据权利要求9所述的背光模组，其中，所述第一背光子面板的发光面高度小于所述第二背光子面板的发光面高度，所述第二背光子面板一侧底部设置有切口，所述第一背光子面板一端接入所述切口内，且接入的长度为1至3个光源间距；
    所述补光层的高度为0.1至1mm，所述第一背光子面板中第一LED光源的发光角度为θ1，所述第二背光子面板中第二LED光源的发光角度为θ2，且θ1等于θ2；
    所述补光层的高度大于1mm，所述第一背光子面板中第一LED光源的发光角度为θ1，所述第二背光子面板中第二LED光源的发光角度为θ2，θ1小于θ2。
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