WO2020262580A1 - 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 - Google Patents
樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 Download PDFInfo
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- WO2020262580A1 WO2020262580A1 PCT/JP2020/025142 JP2020025142W WO2020262580A1 WO 2020262580 A1 WO2020262580 A1 WO 2020262580A1 JP 2020025142 W JP2020025142 W JP 2020025142W WO 2020262580 A1 WO2020262580 A1 WO 2020262580A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/308—Heat stability
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
Definitions
- the present invention relates to a resin composition, a resin sheet, a multilayer printed wiring board, and a semiconductor device.
- the insulating layer is also required to be thinned, and a resin sheet containing no glass cloth is required.
- Thermosetting resin is the mainstream of the resin composition used as the material of the insulating layer, and drilling for obtaining continuity between the insulating layers is generally performed by laser processing.
- an exposure method a method of exposing through a photomask using a mercury lamp as a light source is used. Further, in recent years, as an exposure method, a direct drawing exposure method for directly drawing on a photosensitive resin composition layer based on digital data of a pattern without using a photomask has been introduced. This direct drawing exposure method has better alignment accuracy than the exposure method using a photomask and can obtain a high-definition pattern. Therefore, it is particularly introduced in a substrate that requires high-density wiring formation. I'm out.
- the light source uses monochromatic light such as a laser, and among them, a light source having a wavelength of 405 nm (h line) is used in a DMD (Digital Micromirror Device) type device capable of forming a high-definition resist pattern.
- a light source having a wavelength of 405 nm (h line) is used in a DMD (Digital Micromirror Device) type device capable of forming a high-definition resist pattern.
- DMD Digital Micromirror Device
- Patent Document 1 describes a carboxyl-modified epoxy (meth) acrylate resin obtained by reacting a bisphenol type epoxy resin with (meth) acrylic acid and then reacting with an acid anhydride, a biphenyl type epoxy resin, and the like.
- a photosensitive thermosetting resin composition containing a photocuring initiator and a diluent is described.
- Patent Document 2 describes a photocurable binder polymer, a photopolymerization compound having an ethylenically unsaturated bond, a photopolymerization (curing) initiator, a sensitizer, and a thermosetting agent, bisallyl nagic.
- a resin composition containing an imide compound and a bismaleimide compound is described.
- Patent Document 3 describes a resin composition containing a bismaleimide compound (curable resin) and a photoradical polymerization initiator (curing agent) as a photosensitive resin composition used for a laminated board or a resin sheet. ing.
- the cured product obtained from the resin composition described in Patent Document 1 has excellent flexibility and folding resistance as a solder resist, and although it is described that it is also excellent in heat resistance, it has heat resistance. No specific value is shown for, and there is a problem that the heat resistance and thermal stability are inferior when used as an interlayer insulating layer.
- Patent Document 2 describes that a bismaleimide compound is used, but it is described as a thermosetting compound, and (meth) acrylate is used as a photopolymerizable compound. Therefore, there is a problem that it is inferior in heat resistance and thermal stability when used as an interlayer insulating layer.
- Patent Document 3 a bismaleimide compound is used as a curable resin.
- the maleimide compound usually has poor light transmittance, if the maleimide compound is contained, the light does not sufficiently reach the photocuring initiator and the photocuring is performed. The initiator is less likely to generate radicals and its reactivity is very low. Therefore, in Patent Document 3, the maleimide compound is cured by performing additional heating before development, but since it is accompanied by heating, a high-definition resist pattern cannot be obtained.
- Patent Document 3 does not describe the use of an active energy ray having a wavelength of 405 nm (h line) as an irradiable light source.
- the present invention has been made in view of the above problems, and is capable of photocuring when exposed to an active energy ray containing a wavelength of 405 nm (h line), and is particularly used for a multilayer printed wiring board. It is an object of the present invention to provide a resin composition, a resin sheet, a multilayer printed wiring board using them, and a semiconductor device having excellent photocurability, heat resistance, and thermal stability.
- R 1 , R 2 , and R 3 each independently represent an alkyl group or an alkoxy group that may have a hydrogen atom, a halogen atom, a hydroxyl group, or a substituent
- R 4 it may have a substituent, an alkylene group, an alkenylene group, alkoxylene group, or an arylene group
- R 5 and R 6 are each independently a hydrogen atom, a straight-chain having 1 to 6 carbon atoms Alternatively, it indicates a branched alkyl group or a linear or branched alkoxy group having 1 to 6 carbon atoms.
- the content of the maleimide compound (A) is 50 to 99.9 parts by mass with respect to a total of 100 parts by mass of the maleimide compound (A) and the photocuring initiator (B) [1]. ] Or the resin composition according to [2]. [4] The resin composition according to any one of [1] to [3], wherein the photocuring initiator (B) contains a compound represented by the following formula (3).
- R 7 independently represents a substituent or a phenyl group represented by the following formula (4).
- ⁇ * indicates a bond
- R 8 independently represents a hydrogen atom or a methyl group.
- the support has a support and a resin layer arranged on one side or both sides of the support, and the resin layer contains the resin composition according to any one of [1] to [4].
- Resin sheet [6] The resin sheet according to [5], wherein the resin layer has a thickness of 1 to 50 ⁇ m. [7] It has an insulating layer and a conductor layer formed on one side or both sides of the insulating layer, and the insulating layer contains the resin composition according to any one of [1] to [4].
- Multi-layer printed wiring board. [8] A semiconductor device comprising the resin composition according to any one of [1] to [4].
- the present invention is exposed to light when exposed to an active energy ray containing a wavelength of 405 nm (h line) and can be photocured. Especially when it is used for a multilayer printed wiring board, it has photocurability, heat resistance and It is possible to provide a resin composition having excellent thermal stability, a resin sheet, a multilayer printed wiring board using them, and a semiconductor device.
- FIG. 1 is a 1 H-NMR chart of the amic acid compound (MA-TMDA) obtained in Example 1.
- FIG. 2 is a 1 H-NMR chart of the maleimide compound (TMDM) obtained in Example 1.
- resin solid content or “resin solid content in the resin composition” refers to the photocuring initiator (B), the additive, the solvent and the like in the resin composition unless otherwise specified.
- the component excluding the filler is referred to as "100 parts by mass of the resin solid content", and the total of the components excluding the photocuring initiator (B), the additive, the solvent and the filler in the resin composition is 100 parts by mass. It shall be said that.
- the resin composition of the present embodiment contains a maleimide compound (A) represented by the formula (1) and a photocuring initiator (B) having an absorbance of 0.1 or more at a wavelength of 405 nm (h line). .. [Maleimide compound (A) represented by the formula (1)]
- the maleimide compound (A) (also referred to as the component (A)) according to the present embodiment has the structure of the formula (1).
- R 1 , R 2 , and R 3 each independently represent an alkyl group or an alkoxy group that may have a hydrogen atom, a halogen atom, a hydroxyl group, or a substituent
- R 4 it may have a substituent, an alkylene group, an alkenylene group, alkoxylene group, or an arylene group
- R 5 and R 6 are each independently a hydrogen atom, a straight-chain having 1 to 6 carbon atoms Alternatively, it indicates a branched alkyl group or a linear or branched alkoxy group having 1 to 6 carbon atoms.
- the maleimide compound has poor light transmittance, so if the resin composition contains the maleimide compound, the light does not sufficiently reach the photocuring initiator dispersed in the resin composition, and the photocuring initiator radicalizes. Hard to occur. Therefore, in general, the photoradical reaction of maleimide is difficult to proceed, and even if the radical polymerization or dimerization reaction of maleimide alone proceeds, the reactivity is very low. However, since the maleimide compound (A) has an alicyclic skeleton, it is extremely excellent in light transmission. Therefore, sufficient light reaches the photo-curing initiator, and the photoradical reaction of maleimide occurs efficiently together with the photo-curing initiator (B) described later.
- the photocuring initiator tends to have a low absorbance when a long wavelength light beam is used.
- the light having a wavelength of this wavelength is relatively long, so that the light is not absorbed by a normal photocuring initiator, and this light is suitable.
- the polymerization does not proceed unless a photocuring initiator that can absorb the light and generate a radical is used. That is, even if a light-transmitting maleimide compound is used, the polymerization does not proceed unless the photocuring initiator absorbs light having a wavelength of 405 nm (h line) and generates radicals.
- the photocuring initiator described later according to the present embodiment has an absorbance of 0.1 or more at a wavelength of 405 nm (h line) and exhibits extremely excellent absorbency for light having a wavelength of 405 nm (h line).
- the maleimide compound (A) Since the maleimide compound (A) has excellent light transmission as described above, even if light having a wavelength of 405 nm is used, the light sufficiently reaches the photocuring initiator, and radicals using radicals generated from the photocuring initiator are used. The reaction proceeds, and even a composition containing a large amount of the maleimide compound (A) can be photocured. According to this embodiment, homopolymerization of the maleimide compound (A) is also possible.
- the cured product obtained by containing the resin composition of the present embodiment is suitably photocured, and therefore has excellent heat resistance, insulation reliability, and thermal stability. Therefore, according to the present embodiment, the protective film and the insulating layer in the multilayer printed wiring board and the semiconductor device can be suitably formed.
- R 1 , R 2 , and R 3 each independently represent a hydrogen atom, a halogen atom, a hydroxyl group, an alkyl group, or an alkoxy group.
- the alkyl group or alkoxy group may have a substituent.
- halogen atom examples include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
- alkyl group which may have a substituent examples include a linear or branched alkyl group having 1 to 8 carbon atoms which may have a substituent.
- Examples include a group and a heptyl group.
- the hydrogen atom in the alkyl group may be substituted with a fluorine atom, a halogen atom such as a chlorine atom, a cyano group or the like.
- a fluorine atom such as a chlorine atom, a cyano group or the like.
- a halogen atom such as a chlorine atom, a cyano group or the like.
- these alkyl groups from the viewpoint of exhibiting excellent photocurability, heat resistance, and thermal stability, good solubility in a solvent, low melting point, low water absorption, and good compatibility with other resins. , Methyl group, ethyl group, isopropyl group, tert-butyl group is preferable, methyl group, ethyl group, tert-butyl group is more preferable, and methyl group is further preferable.
- alkoxy group which may have a substituent examples include a linear or branched alkoxy group having 1 to 4 carbon atoms which may have a substituent.
- a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, an n-butoxy group, an isobutoxy group, a tert-butoxy group and the like can be mentioned.
- the hydrogen atom in the alkoxy group may be substituted with a fluorine atom, a halogen atom such as a chlorine atom, a cyano group or the like.
- alkoxy groups from the viewpoint of exhibiting excellent photocurability, heat resistance, and thermal stability, good solubility in a solvent, low melting point, low water absorption, and good compatibility with other resins. , A methoxy group is preferred.
- R 4 represents an alkylene group, an alkenylene group, an alkoxylen group, or an arylene group. These groups may have substituents.
- alkylene group which may have a substituent examples include a linear or branched alkylene group having 1 to 8 carbon atoms which may have a substituent.
- the group etc. can be mentioned.
- the hydrogen atom in the alkoxy group may be substituted with a fluorine atom, a halogen atom such as a chlorine atom, a cyano group or the like.
- Methylene group is preferable.
- alkenylene group which may have a substituent examples include a linear or branched alkenylene group having 1 to 10 carbon atoms which may have a substituent.
- vinylene group 1-methylvinylene group, arylene group, propenylene group, isopropenylene group, 1-butenylene group, 2-butenylene group, 1-pentenylene group, 2-pentenylene group, isopentenylene group, cyclopentenylene group.
- Cyclohexenylene group dicyclopentadienylene group and the like.
- the hydrogen atom in the alkenylene group may be substituted with a halogen atom such as a fluorine atom and a chlorine atom, a cyano group or the like.
- a halogen atom such as a fluorine atom and a chlorine atom, a cyano group or the like.
- these alkenylene groups from the viewpoint of exhibiting excellent photocurability, heat resistance, and thermal stability, good solubility in a solvent, low melting point, low water absorption, and good compatibility with other resins. , Vinylene group is preferable.
- alkoxylen group which may have a substituent examples include a linear or branched alkoxylen group having 1 to 4 carbon atoms which may have a substituent.
- a methoxylen group, an ethoxylen group, a propoxylen group, an isopropoxylen group, a butoxylen group, an isobutoxylen group and the like can be mentioned.
- the hydrogen atom in the alkoxylen group may be substituted with a halogen atom such as a fluorine atom and a chlorine atom, a cyano group or the like.
- alkoxylen groups the viewpoint of exhibiting excellent photocurability, heat resistance, and thermal stability, good solubility in a solvent, low melting point, low water absorption, and good compatibility with other resins. Therefore, a methoxylene group is preferable.
- arylene group which may have a substituent examples include an arylene group having 6 to 48 carbon atoms which may have a substituent.
- a phenylene group such as a 1,4-phenylene group, a 1,3-phenylene group, and a 1,2-phenylene group; a 1,4-naphthalenedyl group, a 1,5-naphthalenedyl group, a 2,6-naphthalenedyl group.
- naphthalenedyl groups such as 2,7-naphthalenediyl groups
- anthranes such as 1,4-anthracendiyl groups, 1,5-anthracendiyl groups, 2,6-anthracendiyl groups, and 9,10-anthracendiyl groups.
- Phenyleneyl group such as 3,8-perylenediyl group, 3,9-perylenediyl group, and 3,10-perylenediyl group; 9,9' -Spirophenylolene-2,7-diyl group, 9,9'-spirophenylene-3,6-diyl group, and 9,9'-spirophenylene-2,2'-diyl group, etc.
- the hydrogen atom in the arylene group may be substituted with a halogen atom such as a fluorine atom and a chlorine atom, a cyano group or the like.
- alkoxylene groups the viewpoint of exhibiting excellent photocurability, heat resistance, and thermal stability, good solubility in a solvent, low melting point, low water absorption, and good compatibility with other resins. Therefore, a 1,4-phenylene group is preferable.
- R 5 and R 6 are independently hydrogen atoms, halogen atoms, linear or branched alkyl groups having 1 to 6 carbon atoms, or linear or branched alkyl groups having 1 to 6 carbon atoms. Shows a branched alkenyl group. R 5 and R 6 may all be the same or different. Halogen atom, a linear or branched alkyl group having 1 to 6 carbon atoms, can be referred to the description of the aforementioned R 1.
- the linear or branched alkenyl group having 1 to 6 carbon atoms is not particularly limited, and examples thereof include a vinyl group, an allyl group, a 4-pentenyl group, an isopropenyl group, and an isopentenyl group.
- R 5 and R 6 are excellent in photocurability, heat resistance, and thermal stability, and exhibit good solubility in a solvent, low melting point, low water absorption, and good compatibility with other resins. Therefore, a hydrogen atom and a methyl group are preferable, and it is more preferable that all of R 5 and R 6 are hydrogen atoms.
- the maleimide compound (A) is excellent in photocurability, heat resistance, and thermal stability, and exhibits good solubility in a solvent, low melting point, low water absorption, and good compatibility with other resins. , It is preferable that it is represented by the formula (2).
- the content of the maleimide compound (A) makes it possible to obtain a cured product containing the maleimide compound as a main component, and improves photocurability, heat resistance, and thermal stability.
- it is preferably 50 to 99.9 parts by mass, more preferably 60 to 99.9 parts by mass, based on 100 parts by mass of the total of the maleimide compound (A) and the photocuring initiator (B).
- it is 70 to 99.8 parts by mass, more preferably 80 to 99.7 parts by mass, even more preferably 85 to 99 parts by mass, and 90 to 95 parts by mass. Is particularly preferable.
- the content of the maleimide compound (A) in the resin composition of the present embodiment makes it possible to obtain a cured product containing the maleimide compound as a main component, and improves photocurability, heat resistance, and thermal stability. From this viewpoint, it is preferably 5 to 100 parts by mass, more preferably 5 to 99.9 parts by mass, and 10 to 95 parts by mass with respect to 100 parts by mass of the resin solid content in the resin composition. It is even more preferably 15 to 85 parts by mass, even more preferably 20 to 83 parts by mass, particularly preferably 55 to 80 parts by mass, and 70 to 80 parts by mass. Is more particularly preferable. When the content of the maleimide compound (A) in the resin composition is 100 parts by mass, it means that the resin content is only the maleimide compound (A).
- the maleimide compound (A) can be used alone or in admixture of two or more.
- the maleimide compound (A) can be obtained, for example, by the following synthetic method. That is, the amine compound represented by the formula (5) and the acid anhydride represented by the formula (6) are subjected to an addition reaction to obtain an amic acid compound represented by the formula (7), and then It can be obtained by subjecting the obtained amic acid compound to a dehydration ring closure reaction.
- R 1 , R 2 , and R 3 each independently represent an alkyl group or an alkoxy group that may have a hydrogen atom, a halogen atom, a hydroxyl group, or a substituent
- R 4 Indicates an alkylene group, an alkenylene group, an alkoxylene group, or an arylene group which may have a substituent.
- R 1, R 2, R 3, and for R 4 is, preferred embodiments also include the same as equation (1).
- R 5 and R 6 are independently hydrogen atoms, linear or branched alkyl groups having 1 to 6 carbon atoms, or linear or branched alkyl groups having 1 to 6 carbon atoms, respectively. Indicates an alkenyl group.
- R 5 and R 6 are the same as in the formula (1), including the preferred embodiment.
- R 1 , R 2 , and R 3 each independently represent an alkyl group or an alkoxy group that may have a hydrogen atom, a halogen atom, a hydroxyl group, or a substituent
- R 4 it may have a substituent, an alkylene group, an alkenylene group, alkoxylene group, or an arylene group
- R 5 and R 6 are each independently a hydrogen atom, a straight-chain having 1 to 6 carbon atoms Alternatively, it indicates a branched alkyl group or a linear or branched alkoxy group having 1 to 6 carbon atoms.
- R 1, R 2, R 3 , R 4, R 5, and the R 6 is a preferred embodiment be included, is the same as equation (1).
- the amic acid compound represented by the formula (7) can be obtained, for example, by the following synthetic method. That is, it can be obtained by subjecting the amine compound represented by the formula (5) to an addition reaction with the acid anhydride represented by the formula (6).
- Examples of the amine compound represented by the formula (5) include 5-amino-1,3,3-trimethyl-1- (4-aminophenyl) -indane and 6-amino-1,3,3-trimethyl-.
- (4-Aminophenyl) -indane 5-amino-1,3-diethyl-3-methyl-1- (4-aminophenyl) -indane, 6-amino-1,3-diethyl-3-methyl-
- Examples of the acid anhydride represented by the formula (6) include maleic anhydride, 3-methylmaleic anhydride, 3-ethylmaleic anhydride, 3,4-dimethylmaleic anhydride, and 3,4-diethylmaleic anhydride. Acids, 3-chloromaleic anhydride, and 3,4-dichloromaleic anhydride can be mentioned. These acid anhydrides may be used alone or in combination of two or more.
- the amount of the acid anhydride represented by the formula (6) is usually 1.5 to 3.0 times the mole, preferably 1.8 to 1 mol, with respect to 1 mol of the amine compound represented by the formula (5). 2.2 times the mole.
- the entire amount of the amine compound and the acid anhydride may be charged from the beginning, but since the reaction between the amine compound and the acid anhydride is an exothermic reaction, excessive heat generation is performed by adding either one in small amounts. It is preferable to react while suppressing. More preferably, the acid anhydride is dissolved in a solvent, and the mixture is stirred under normal pressure (1 atm) so that the internal temperature of the reaction vessel is maintained in the range of 100 ° C. or lower, preferably 30 to 100 ° C. However, the amine compound is added dropwise. At this time, the amine compound of the raw material to be dropped may be dissolved in the same solvent as the reaction solvent.
- the dropping time of the raw material amine compound is preferably 5 to 180 minutes, but more preferably the entire amount is dropped in the range of 30 to 120 minutes.
- the addition reaction is preferably carried out in an atmosphere of an inert gas such as nitrogen, helium and argon.
- a dehydration ring closure reaction of the produced amic acid compound may be carried out, but it is preferable to age the amic acid compound at 30 to 120 ° C. for about 0.5 to 3.0 hours. It is more preferable to carry out a dehydration ring closure reaction after aging at 50 to 100 ° C. for about 1.0 to 2.0 hours.
- Organic solvents include saturated hydrocarbons such as pentane, hexane, heptane, and cyclohexane; aromatic hydrocarbons such as benzene, toluene, xylene, and ethylbenzene; dichloromethane, chloroform, carbon tetrachloride, dichloroethane, chlorobenzene, etc.
- halogenated hydrocarbons such as dichlorobenzene; diethyl ether, diisopropyl ether, 1,2-dimethoxyethane, bis (2-methoxyethyl) ether, 1,2-bis (2-methoxyethoxy) ethane, bis [2- (2-methoxyethoxy) ethyl] Ethers such as ether, tetrahirodofuran, 1,3-dioxane, 1,4-dioxane, and anisole; phenol, o-chlorophenol, m-chlorophenol, p-chlorophenol , O-cresol, m-cresol, p-cresol, 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, 3,4-xyleno Solvents such as-l and 3,5-xylenoal; N, N-dimethylformamide,
- Amidos such as amides; lactams such as N-methylpyrrolidone (NMP) and N-methylcaprolactam; sulfur-containing solvents such as dimethylsulfoxide, diphenylsulfoxide, dimethylsulfone, diphenylsulfone, and sulfolane; -2-Imidazolidinone and the like. These organic solvents may be used alone or in combination of two or more.
- organic solvents may coexist with these organic solvents.
- organic solvents include benzene, toluene, o-xylene, m-xylene, p-xylene, o-chlorotoluene, m-chlorotoluene, p-chlorotoluene, o-bromotoluene, and m-bromotoluene.
- P-Bromotoluene chlorobenzene, bromobenzene and the like. They act as an azeotropic solvent for removing (dehydrating) the water produced in the reaction solution.
- These organic solvents may be used alone or in combination of two or more.
- the amount of the organic solvent used is not particularly limited and varies depending on the solvent type and composition used, but is usually 1 to 1000 parts by mass, preferably 31 to 100 parts by mass with respect to a total of 1 part by mass of the raw material amine compound and acid anhydride. It is a mass part.
- the reaction solvent is preferably a solution in which the raw materials are dissolved, but the reaction may be carried out in a slurry state.
- the maleimide compound (A) represented by the formula (1) can be obtained, for example, by the following synthetic method. That is, it can be obtained by dehydrating and ring-closing the amic acid compound represented by the formula (7) obtained by the above synthesis method.
- the dehydration ring closure reaction is preferably carried out in an organic solvent.
- the organic solvent the solvent used in the addition reaction can be referred to, and it may be the same as or different from the solvent used in the addition reaction.
- the dehydration ring closure reaction is preferably carried out in the presence of an organic base catalyst, an acid catalyst, or an imidizing agent, if necessary.
- organic base catalyst examples include triethylamine, tributylamine, trypentylamine, N, N-dimethylaniline, N, N-diethylaniline, pyridine, ⁇ -picoline, ⁇ -picoline, ⁇ -picoline, and 2,4-lutidine. Included are 2,6-lutidine, quinoline, and isoquinoline.
- organic base catalysts can be used alone or in combination of two or more.
- Acid catalysts include, for example, inorganic acids such as hydrochloric acid, hydrogen bromide, hydrogen iodide, sulfuric acid, anhydrous sulfuric acid, nitrate, phosphoric acid, phosphite, phosphoric acid, and molybdenum phosphate; methanesulfonic acid, ethanesulfon.
- inorganic acids such as hydrochloric acid, hydrogen bromide, hydrogen iodide, sulfuric acid, anhydrous sulfuric acid, nitrate, phosphoric acid, phosphite, phosphoric acid, and molybdenum phosphate
- methanesulfonic acid ethanesulfon.
- Sulfonic acids such as acids, trifluoromethanesulfonic acids, benzenesulfonic acids, and p-toluenesulfonic acids; carboxylic acids such as acetic acid and oxalic acid; chloroacetic acid, dichloroacetic acid, trichloroacetic acid, fluoroacetic acid, difluoroacetic acid, and trifluoro Examples thereof include halogenated carboxylic acids such as acetic acid; solid acids such as silica, alumina, and active white clay; cationic ion exchange resins and the like. Further, these acid catalysts may be salts with a diamine compound.
- the amount of the organic base catalyst and the acid catalyst used is not particularly limited as long as the reaction rate of the dehydration ring closure reaction is substantially improved, but is usually 0.001 to 10 times the molar amount of the raw material amine compound, and is 0.
- the molar amount is preferably 005 to 5 times, more preferably 0.01 to 1 time.
- the imidizing agent for example, a known method in which acetic anhydride or the like is used as a dehydrating agent and the reaction is carried out in an organic solvent in the presence of a catalyst and a base (for example, Japanese Patent Publication No. 46-23250, Japanese Patent Publication No. 49-40231). No. and the method described in Japanese Patent Publication No. 59-52660) can be used. Further, as the imidizing agent, a condensing agent such as polyphosphate and dicyclohexylcarbodiimide can also be used.
- the amount used is preferably 1.0 to 10 times the molar amount of the raw material amine compound, and is preferably 1.8 to 10 times the molar amount. More preferably, it is 6.0 times mol.
- the catalyst for example, oxides of alkaline earth metals, iron (II and III), nickel (II), manganese (II and III), copper (I and II) or cobalt (II and III) carbonates. Examples include salts, sulfates, phosphates, acetates and the like. These catalysts may be used alone or in combination of two or more.
- the amount of the catalyst used is usually 5 ⁇ 10 -4 to 0.1 mol per 1 mol of the amic acid compound.
- Examples of the base include sodium acetate, potassium acetate, trimethylamine, triethylamine, tributylamine and the like. These bases can be used alone or in combination of two or more.
- the amount of the base used is usually 0.05 to 1.1 mol with respect to 1 mol of the amic acid compound.
- the reaction temperature and reaction time in the dehydration ring closure reaction vary depending on the type of raw material used, the type of solvent, the type of catalyst, the type and amount of azeotropic dehydration solvent, the type and amount of imidizing agent, and the like, but are usually 20. 1 to 24 hours in the range of ⁇ 180 ° C.
- the reaction pressure may usually be atmospheric pressure.
- the reaction atmosphere is usually an atmosphere of air, nitrogen, helium, neon, or argon, and it is preferable to carry out the reaction in an atmosphere of nitrogen or argon, which is an inert gas.
- the method for isolating the target maleimide compound from the reaction mixture containing the maleimide compound is not particularly limited, but when the target product is precipitated from the reaction solvent, it can be isolated by filtration or centrifugation. .. On the other hand, when the target product is dissolved in the reaction solvent, the solvent is distilled off under reduced pressure, an appropriate poor solvent is added to the reaction mixture, or the reaction mixture is discharged into the poor solvent to cause precipitation. It can be isolated by filtration or centrifugation. When it is necessary to further purify the isolated maleimide compound, it may be purified by a known method. Examples of such a method include a distillation purification method, a recrystallization method, a column chromatography method, a sludge treatment, and an activated carbon treatment.
- the obtained maleimide compound can be identified by a known method such as NMR (nuclear magnetic resonance analysis).
- the purity of the maleimide compound can be analyzed by, for example, liquid chromatography or IR spectral method.
- Volatile components such as by-products and residual solvents in the maleimide compound can be quantitatively analyzed by, for example, gas chromatography.
- the halogen compound remaining in the maleimide compound can be identified by, for example, a liquid chromatograph mass spectrometer, and can be quantified by ion chromatography after potentiometric titration using a silver nitrate solution or decomposition by a combustion method. ..
- the polymerization reactivity of the maleimide compound can be evaluated by, for example, the reaction enthalpy by differential scanning calorimetry and the gelation time by the hot plate method or the torque measurement method.
- the photocurable initiator (B) (also referred to as component (B)) according to the present embodiment is not particularly limited as long as the absorbance at a wavelength of 405 nm (h line) is 0.1 or more, and is generally a photocurable resin composition. Those known in the field used in the above can be used.
- the photocuring initiator (B) is irradiated with an active energy ray having an absorbance of 405 nm (h line) of 0.1 or more and containing a wavelength of 405 nm (h line).
- the absorbance at a wavelength of 405 nm (h line) is 0.1 or more
- a chloroform solution containing 0.01% by mass of the component (B) is prepared, and light rays having a wavelength of 405 nm (h line) are used.
- the absorbance of this chloroform solution is measured, it means that the absorbance is 0.1 or more.
- a photocuring initiator (B) for example, when a printed wiring board having a high-density and high-definition wiring formation (pattern) is manufactured by using a direct drawing exposure method, a wavelength of 405 nm (h line) is used. Even when an active energy ray containing the above is used, the photoradical reaction of maleimide occurs efficiently.
- the absorbance is preferably 0.15 or more.
- the upper limit is, for example, 99.9 or less.
- the compound represented by the formula (3) is preferable.
- the compound represented by the formula (3) is obtained when a chloroform solution containing 0.01% by mass of this compound is prepared and the absorbance of the chloroform solution is measured using light having a wavelength of 405 nm (h line).
- the absorbance is 0.1 or more, it exhibits extremely excellent absorbency for light having a wavelength of 405 nm (h line). Therefore, this compound preferably generates radicals for light having a wavelength of 405 nm (h line).
- the absorbance is preferably 0.15 or more because a resin composition having better photocurability can be obtained.
- the upper limit is, for example, 2.0 or less.
- R 7 independently represents a substituent or phenyl group represented by formula (4).
- R 8 independently represents a hydrogen atom or a methyl group.
- ⁇ * indicates a bond with the phosphorus atom (P) in formula (3).
- R 7 independently represents a substituent or a phenyl group represented by the formula (4). It is preferable that one or more of R 7 are substituents represented by the formula (4).
- R 8 independently represents a hydrogen atom or a methyl group. Among R 8, preferably more than one is a methyl group, and more preferably a methyl group.
- Examples of the compound represented by the formula (3) include acylphos such as 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide and bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide.
- Examples include fin oxides. These can be used alone or in admixture of two or more.
- Acylphosphine oxides show extremely excellent absorption to active energy rays including a wavelength of 405 nm (h rays), and the maleimide compound (A) can be suitably radically polymerized. Therefore, particularly when used for a multilayer printed wiring board, a resin composition having excellent photocurability, heat resistance and thermal stability, a resin sheet with a support, a multilayer printed wiring board using them, and a semiconductor device are preferably used. It becomes possible to manufacture.
- the content of the photocuring initiator (B) is such that the maleimide compound (A) is sufficiently cured by using an active energy ray containing a wavelength of 405 nm (h line) to improve heat resistance.
- the maleimide compound (A) and the photoinitiator (B) total 100 parts by mass, it is preferably 0.1 to 50 parts by mass, and 0.1 to 40 parts by mass. Is more preferably 0.2 to 30 parts by mass, further preferably 0.3 to 20 parts by mass, even more preferably 1 to 15 parts by mass, and 5 to 10 parts by mass. It is particularly preferable that it is by mass.
- photocuring initiator (B) a commercially available product can also be used, for example, IGM Resins B.I. V. Omnirad (registered trademark) 819 (trade name), IGM Resins B.I. V. Omnirad (registered trademark) 819DW (trade name) and IGM Resins B.I. V. Omnirad (registered trademark) TPO (trade name) and the like.
- a maleimide compound other than the maleimide compound (A) hereinafter, also referred to as “another maleimide compound”
- a cyanate ester compound a phenol resin, an epoxy resin, and oxetane
- one or more selected from the group consisting of a resin, a benzoxazine compound, a carbodiimide compound, and a compound having an ethylenically unsaturated group can be further contained.
- the maleimide compound (A) is extremely excellent in light transmission, even if these resins or compounds are used, sufficient light reaches the photocuring initiator, and the photoradical reaction of maleimide occurs efficiently, resulting in various types. It can be photocured using active energy rays. Therefore, for example, even if an active energy ray having a wavelength of 405 nm is used, the light sufficiently reaches the photocuring initiator, and the radical reaction using the radical generated from the photocuring initiator proceeds, and these resins or compounds are released. Photocuring is also possible in the blended composition. Hereinafter, each of these components will be described.
- a maleimide compound other than the maleimide compound (A) can be used as long as the resin composition is exposed to light and photocures when exposed to an active energy ray containing a wavelength of 405 nm (h line). ..
- the other maleimide compound is not particularly limited as long as it is a compound other than the maleimide compound (A) and has one or more maleimide groups in the molecule.
- Specific examples thereof include N-phenylmaleimide, N-cyclohexylmaleimide, N-hydroxyphenylmaleimide, N-anilinophenylmaleimide, N-carboxyphenylmaleimide, and N- (4-carboxy-3-hydroxyphenyl) maleimide.
- the compound, 1,6-bismaleimide- (2,2,4-trimethyl) hexane (maleimide compound represented by the formula (16)), the maleimide compound represented by the formula (17), and the formula (18).
- maleimide compounds to be used examples thereof include maleimide compounds to be used, prepolymers of these maleimide compounds, and prepolymers of maleimide compounds and amine compounds.
- the maleimide compound represented by the formula (12) and the maleimide compound represented by the formula (18) are preferable because they have more excellent photocurability, heat resistance and thermal stability, and the maleimide compound represented by the formula (18) is preferable.
- the maleimide compound represented by) is more preferable.
- R 9 independently represents a hydrogen atom or a methyl group.
- n 1 represents an integer of 1 or more, preferably an integer of 1 to 10, and more preferably an integer of 1 to 5.
- R 10 independently represents a hydrogen atom or a methyl group.
- n 2 represents an integer of 1 or more, preferably an integer of 1 to 5.
- n 3 (average) is 1 or more, preferably 1 to 21, and more preferably 1 to 16 from the viewpoint of exhibiting excellent photocurability.
- the number of x is 10 to 35. In formula (11), the number of y is 10 to 35.
- Ra represents a linear or branched alkyl group having 1 to 16 carbon atoms or a linear or branched alkenyl group having 1 to 16 carbon atoms.
- the R a preferably a linear or branched alkyl group, since it shows excellent photo-curable, and more preferably a linear alkyl group.
- the alkyl group preferably has 4 to 12 carbon atoms because it exhibits excellent photocurability.
- the alkenyl group preferably has 4 to 12 carbon atoms because it exhibits excellent photocurability.
- the alkyl group in the formula (1) can be referred to.
- an n-heptyl group, an n-octyl group, and an n-nonyl group are preferable, and an n-octyl group is more preferable, because they exhibit excellent photocurability.
- the alkenyl group in the formula (1) can be referred to.
- 2-heptenyl group, 2-octenyl group and 2-nonenyl group are preferable, and 2-octenyl group is more preferable, because they show excellent photocurability.
- R b represents a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 1 to 16 carbon atoms.
- R b is preferably a linear or branched alkyl group, and more preferably a linear alkyl group because it exhibits excellent photocurability.
- the number of carbon atoms of the alkyl group is preferably 1 to 16, and more preferably 4 to 12 because it exhibits excellent photocurability.
- the alkenyl group preferably has 1 to 16 carbon atoms, and more preferably 4 to 12 because it exhibits excellent photocurability.
- the alkyl group in Ra can be referred to.
- an n-heptyl group, an n-octyl group, and an n-nonyl group are preferable, and an n-octyl group is more preferable, because they exhibit excellent photocurability.
- the alkenyl group in Ra can be referred to.
- a 2-heptenyl group, a 2-octenyl group, and a 2-nonenyl group are preferable, and a 2-octenyl group is more preferable, because they exhibit excellent photocurability.
- the number of n a is 1 or more, preferably from 2 to 16, more preferably, from the viewpoint of showing excellent photocuring is 3-14.
- n b is 1 or more, preferably 2 to 16, and more preferably 3 to 14 from the viewpoint of exhibiting excellent photocurability.
- n a and n b may be the same or different.
- n 4 (average) is 0.5 or more, preferably 0.8 to 10, and more preferably 1 to 8 from the viewpoint of exhibiting excellent photocurability.
- n 5 represents an integer of 1 or more, preferably an integer of 1 to 10.
- n 6 represents an integer of 1 or more, preferably an integer of 1 to 10.
- R 11 independently represents a hydrogen atom, a methyl group, or an ethyl group
- R 12 independently represents a hydrogen atom or a methyl group
- n 7 represents an integer from 1 to 10.
- n 7 is preferably an integer of 1 to 6 from the viewpoint that a more suitable viscosity can be obtained and the increase in the viscosity of the varnish can be more controlled.
- maleimide compound represented by the formula (8) examples include BMI-2300 (manufactured by Daiwa Kasei Kogyo Co., Ltd., trade name).
- Examples of the maleimide compound represented by the formula (9) include MIR-3000 (manufactured by Nippon Kayaku Co., Ltd., trade name).
- n 3 in formula (10) 8.8 (average)
- Examples of the maleimide compound represented by the formula (12) include Designer Molecules Inc. (DMI) BMI-689 (trade name, formula (19), functional group equivalent: 346 g / eq.) And the like can be mentioned.
- BMI-3000J (trade name) manufactured by (DMI), Designer Moleculars Inc. BMI-5000 (trade name) manufactured by (DMI), Designer Moleculars Inc. BMI-9000 (trade name) manufactured by (DMI)
- the maleimide compound represented by the formula (16) a commercially available product can also be used, and examples thereof include BMI-TMH (trade name) manufactured by Daiwa Kasei Co., Ltd.
- the maleimide compound represented by the formula (17) a commercially available product can also be used, and examples thereof include BMI-70 (trade name) manufactured by KAI Kasei Co., Ltd.
- the maleimide compound containing the maleimide compound represented by the formula (18) a commercially available product can also be used, and examples thereof include MIZ-001 (trade name) manufactured by Nippon Kayaku Co., Ltd.
- maleimide compounds can be used alone or in admixture of two or more.
- the total content of the other maleimide compounds is not particularly limited, but from the viewpoint of obtaining better photocurability, heat resistance and thermal stability, 100 parts by mass of the resin solid content in the resin composition is obtained. On the other hand, it is preferably 0.01 to 95 parts by mass, more preferably 5 to 90 parts by mass, further preferably 15 to 85 parts by mass, and 17 to 80 parts by mass. Even more preferably, it is even more preferably 20 to 45 parts by mass, and particularly preferably 20 to 30 parts by mass.
- the cyanate ester compound is not particularly limited as long as it is a resin having an aromatic moiety in the molecule in which at least one cyanato group (cyanic acid ester group) is substituted.
- Ar 1 represents a benzene ring, a naphthalene ring, or a single bond of two benzene rings. When there are a plurality of them, they may be the same or different from each other.
- Ra independently has a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group having 6 to 12 carbon atoms, an alkoxyl group having 1 to 4 carbon atoms, and 1 to 6 carbon atoms. Indicates a group in which an alkyl group and an aryl group having 6 to 12 carbon atoms are bonded.
- the aromatic ring in Ra may have a substituent, and the substituent in Ar 1 and Ra can be selected at any position.
- p indicates the number of cyanato groups attached to Ar 1 , and each is an integer of 1 to 3 independently.
- q represents the number of Ra to bind to Ar 1, the 4-p when Ar 1 is a benzene ring, when the naphthalene ring when those 6-p, 2 one benzene ring is a single bond is 8-p .
- t indicates the average number of repetitions and is an integer of 0 to 50, and the cyanate ester compound may be a mixture of compounds having different t.
- each of them has a single bond, a divalent organic group having 1 to 50 carbon atoms (the hydrogen atom may be replaced with a hetero atom), and a divalent group having 1 to 10 nitrogen atoms.
- Organic group for example, -N-RN- (where R indicates an organic group)
- the alkyl group in Ra of the formula (20) may have either a linear or branched chain structure or a cyclic structure (for example, a cycloalkyl group). Further, even if the hydrogen atom in the alkyl group in the formula (20) and the aryl group in Ra is substituted with a halogen atom such as a fluorine atom or a chlorine atom, an alkoxyl group such as a methoxy group or a phenoxy group, or a cyano group. Good.
- alkyl group examples include methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, isobutyl group, tert-butyl group, n-pentyl group, 1-ethylpropyl group and 2,2-dimethylpropyl group.
- alkyl group examples include a group, a cyclopentyl group, a hexyl group, a cyclohexyl group, a trifluoromethyl group and the like.
- alkenyl group examples include vinyl group, (meth) allyl group, isopropenyl group, 1-propenyl group, 2-butenyl group, 3-butenyl group, 1,3-butandienyl group, 2-methyl-2-propenyl. , 2-Pentenyl group, 2-hexenyl group and the like.
- aryl group include phenyl group, xylyl group, mesityl group, naphthyl group, phenoxyphenyl group, ethylphenyl group, o-, m- or p-fluorophenyl group, dichlorophenyl group, dicyanophenyl group and trifluorophenyl.
- Groups, methoxyphenyl groups, o-, m- or p-tolyl groups and the like can be mentioned.
- alkoxyl group include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, an n-butoxy group, an isobutoxy group, a tert-butoxy group and the like.
- divalent organic group having 1 to 50 carbon atoms in X of the formula (20) include a methylene group, an ethylene group, a trimethylene group, a cyclopentylene group, a cyclohexylene group, a trimethylcyclohexylene group and a biphenylylmethylene.
- examples thereof include a group, a dimethylmethylene-phenylene-dimethylmethylene group, a fluorinatedyl group, and a phthalidodiyl group.
- the hydrogen atom in the divalent organic group may be substituted with a halogen atom such as a fluorine atom or a chlorine atom, an alkoxyl group such as a methoxy group or a phenoxy group, a cyano group or the like.
- a halogen atom such as a fluorine atom or a chlorine atom
- an alkoxyl group such as a methoxy group or a phenoxy group
- a cyano group or the like examples of the divalent organic group having a nitrogen number of 1 to 10 in X of the formula (20) include an imino group and a polyimide group.
- examples of the organic group of X in the formula (20) include those having a structure represented by the formula (21) or the formula (22).
- Ar 2 represents a benzenediyl group, a naphthalenediyl group or a biphenyldiyl group, and when u is an integer of 2 or more, they may be the same or different from each other.
- Rb, Rc, Rf, and Rg each independently have a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 12 carbon atoms, a trifluoromethyl group, or an aryl having at least one phenolic hydroxy group. Indicates a group.
- Rd and Re are independently selected from one of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 12 carbon atoms, an alkoxyl group having 1 to 4 carbon atoms, or a hydroxy group. .. u represents an integer from 0 to 5.
- Ar 3 represents a benzenediyl group, a naphthalenediyl group or a biphenyldiyl group, and when v is an integer of 2 or more, they may be the same or different from each other.
- Ri and Rj are independently hydrogen atoms, alkyl groups having 1 to 6 carbon atoms, aryl groups having 6 to 12 carbon atoms, benzyl groups, alkoxyl groups having 1 to 4 carbon atoms, hydroxy groups, trifluoromethyl groups, respectively. Alternatively, it indicates an aryl group in which at least one cyanato group is substituted.
- v represents an integer of 0 to 5, it may be a mixture of compounds in which v is different.
- z represents an integer of 4 to 7.
- Rk independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
- Ar 2 of the formula (21) and Ar 3 of the formula (22) the two carbon atoms represented by the formula (21) or the two oxygen atoms represented by the formula (21) are 1,4.
- the biphenyldiyl group bonded to the 3,3'position or the 3,4'position and the two carbon atoms or two oxygen atoms are located at the 2,6, 1,5, 1,6 positions, Examples thereof include a naphthalenediyl group bonded to the 1,8, 1,3, 1,4, or 2,7 positions.
- the alkyl and aryl groups in Rb, Rc, Rd, Re, Rf and Rg of formula (21) and Ri and Rj of formula (22) are synonymous with those in formula (20).
- cyanato-substituted aromatic compound represented by the formula (20) include cyanatobenzene, 1-cyanato-2-, 1-cyanato-3-, or 1-cyanato-4-methylbenzene, 1-cyanato. -2-, 1-Cyanato-3-, or 1-Cyanato-4-methoxybenzene, 1-Cyanato-2,3-,1-Cyanato-2,4-,1-Cyanato-2,5-,1- Cianato-2,6-,1-Cyanato-3,4- or 1-Cyanato-3,5-dimethylbenzene, Cyanatoethylbenzene, Cyanatobutylbenzene, Cyanatooctylbenzene, Cyanatononylbenzene, 2- (4) -Cyanafel) -2-phenylpropane (cyanate of 4- ⁇ -cumylphenol), 1-cyanato-4-cyclohexylbenzene, 1-cyanato-4-vinylbenzene, 1-
- cyanate ester compounds can be used alone or in admixture of two or more.
- cyanate ester compound represented by the formula (20) examples include phenol novolac resin and cresol novolac resin (by a known method, phenol, alkyl-substituted phenol or halogen-substituted phenol, and formalin, paraformaldehyde, etc.
- Formaldehyde compound reacted in an acidic solution trisphenol novolac resin (hydroxybenzaldehyde and phenol reacted in the presence of an acidic catalyst), fluorennovolac resin (fluorenone compound and 9,9-bis) (hydroxyaryl) that the fluorenes were reacted in the presence of an acid catalyst), phenol aralkyl resins, cresol aralkyl resin, (by known methods, Ar 4 - (CH 2 Y) naphthol aralkyl resins and biphenyl aralkyl resin 2 (Ar 4 indicates a phenyl group and Y indicates a halogen atom.
- phenol-modified xyleneformaldehyde resin a reaction of xyleneformaldehyde resin and phenol compound in the presence of an acidic catalyst by a known method
- modified naphthaleneformaldehyde resin by a known method, naphthaleneformaldehyde resin
- a hydroxy-substituted aromatic compound reacted in the presence of an acidic catalyst a phenol-modified dicyclopentadiene resin
- a phenol resin having a polynaphthylene ether structure by a known method, 2 phenolic hydroxy groups are contained in one molecule.
- Examples thereof include a phenolic resin obtained by dehydrating and condensing a polyvalent hydroxynaphthalene compound having one or more of them in the presence of a basic catalyst), which is cyanated by the same method as described above, and prepolymers thereof. .. These cyanate ester compounds may be used alone or in admixture of two or more.
- the method for producing these cyanate ester compounds is not particularly limited, and known methods can be used.
- An example of such a production method is a method in which a hydroxy group-containing compound having a desired skeleton is obtained or synthesized, and the hydroxy group is modified by a known method to cyanate.
- Examples of the method for cyanating a hydroxy group include the methods described in Ian Hamerton, "Chemistry and Technology of Cyanate Ester Resins," Blackie Academic & Professional.
- the cured product using these cyanate ester compounds has excellent properties such as glass transition temperature, low thermal expansion, and plating adhesion.
- the total content of the cyanate ester compound is preferably 0.01 to 40 parts by mass in 100 parts by mass of the resin solid content in the resin composition.
- phenol resin As the phenol resin, generally known phenol resins can be used as long as they have two or more hydroxyl groups in one molecule.
- phenol resin generally known phenol resins can be used as long as they have two or more hydroxyl groups in one molecule.
- bisphenol A type phenol resin bisphenol E type phenol resin, bisphenol F type phenol resin, bisphenol S type phenol resin, phenol novolac resin, bisphenol A novolac type phenol resin, glycidyl ester type phenol resin, aralkyl novolac type phenol resin, biphenyl Aralkyl type phenol resin, cresol novolac type phenol resin, polyfunctional phenol resin, naphthol resin, naphthol novolak resin, polyfunctional naphthol resin, anthracene type phenol resin, naphthalene skeleton modified novolak type phenol resin, phenol aralkyl type phenol resin, naphthol aralkyl type Phenolic resin, dicyclopen
- the total content of the phenolic resin is preferably 0.01 to 40 parts by mass in 100 parts by mass of the resin solid content in the resin composition.
- Epoxy resin The epoxy resin is not particularly limited, and generally known epoxy resins can be used.
- the epoxy resin a commercially available product can be used.
- an epoxy resin represented by the formula (23) (NC-3000FH (trade name) manufactured by Nippon Kayaku Co., Ltd., n 8 in the formula (23)). Is about 4
- a naphthalene type epoxy resin represented by the formula (24) HP-4710 (trade name) manufactured by DIC Corporation
- epoxy resins can be used alone or in admixture of two or more.
- the total content of the epoxy resin is preferably 0.01 to 40 parts by mass in 100 parts by mass of the resin solid content in the resin composition.
- oxetane resin As the oxetane resin, generally known ones can be used. For example, alkyl oxetane such as oxetane, 2-methyloxetane, 2,2-dimethyloxetane, 3-methyloxetane, 3,3-dimethyloxetane, 3-methyl-3-methoxymethyloxetane, 3,3-di (trifluoro).
- the total content of the oxetane resin is preferably 0.01 to 40 parts by mass in 100 parts by mass of the resin solid content in the resin composition.
- any compound having two or more dihydrobenzoxazine rings in one molecule can be generally known.
- bisphenol A type benzoxazine BA-BXZ manufactured by Konishi Chemical Industry Co., Ltd., trade name
- bisphenol F type benzoxazine BF-BXZ manufactured by Konishi Chemical Industry Co., Ltd., trade name
- bisphenol S type benzoxazine BS -BXZ manufactured by Konishi Chemical Industry Co., Ltd., trade name
- phenolphthaline type benzoxazine and the like can be mentioned.
- These benzoxazine compounds may be used alone or in admixture of two or more.
- the total content of the benzoxazine compound is preferably 0.01 to 40 parts by mass in 100 parts by mass of the resin solid content in the resin composition.
- the carbodiimide compound is not particularly limited as long as it has at least one or more carbodiimide groups in the molecule, and generally known compounds can be used.
- the total content of the carbodiimide compound is preferably 0.01 to 40 parts by mass in 100 parts by mass of the resin solid content in the resin composition.
- the compound having an ethylenically unsaturated group is not particularly limited as long as it is a compound having one or more ethylenically unsaturated groups in one molecule, and generally known compounds can be used.
- a compound having a (meth) acryloyl group, a vinyl group and the like can be mentioned.
- Examples of the compound having a (meth) acryloyl group include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, lauryl (meth) acrylate, polyethylene glycol (meth) acrylate, and polyethylene glycol (meth) acrylate monomethyl ether.
- Phenylethyl (meth) acrylate isobornyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, butanediol di (meth) acrylate, hexanediol di (meth) acrylate, Neopentyl glycol di (meth) acrylate, nonanediol di (meth) acrylate, glycol di (meth) acrylate, diethylene di (meth) acrylate, polyethylene glycol di (meth) acrylate, tris (meth) acryloyloxyethyl isocyanurate, polypropylene glycol Di (meth) acrylate, epoxy di (meth) acrylate of adipate, bisphenolethylene oxide di (meth) acrylate, hydride bisphenolethylene oxide (meth) acrylate
- urethane (meth) acrylates having a (meth) acryloyl group and a urethane bond in the same molecule
- polyester (meth) acrylates having a (meth) acryloyl group and an ester bond in the same molecule
- epoxy Epoxy (meth) acrylates derived from a resin and also having a (meth) acryloyl group; reactive oligomers in which these bonds are used in combination can also be mentioned.
- urethane (meth) acrylates include reaction products of hydroxyl group-containing (meth) acrylates and polyisocyanates, and other alcohols used as needed.
- hydroxyalkyl (meth) acrylates such as hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate and hydroxybutyl (meth) acrylate
- glycerin (meth) such as glycerin mono (meth) acrylate and glycerin di (meth) acrylate.
- Alacrylates such as pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and toluene diisocyanate.
- sugar alcohol (meth) acrylates such as pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and toluene diisocyanate.
- polyester (meth) acrylates examples include caprolactone-modified 2-hydroxyethyl (meth) acrylate, ethylene oxide and / or propylene oxide-modified phthalic acid (meth) acrylate, ethylene oxide-modified succinic acid (meth) acrylate, and caprolactone-modified tetrahydro.
- Monofunctional (poly) ester (meth) acrylates such as furfuryl (meth) acrylate; hydroxypivalic acid ester neopentyl glycol di (meth) acrylate, caprolactone-modified hydroxypivalic acid ester neopentyl glycol di (meth) acrylate, epichlorohydrin-modified Di (poly) ester (meth) acrylates such as phthalic acid di (meth) acrylate; 1 mol or more of cyclic lactone compounds such as ⁇ -caprolactone, ⁇ -butyrolactone and ⁇ -valerolactone per 1 mol of trimethylolpropane or glycerin. Examples thereof include mono, di or tri (meth) acrylates of triol obtained by addition.
- a cyclic lactone compound such as ⁇ -caprolactone, ⁇ -butyrolactone, and ⁇ -valerolactone
- cyclic lactone compounds such as ⁇ -caprolactone, ⁇ -butyrolactone and ⁇ -valerolactone
- dipentaerythritol examples thereof include mono (meth) acrylate and poly (meth) acrylate of polyhydric alcohols such as triol, tetraol, pentaol or hexaol of meta) acrylate.
- diol components such as (poly) ethylene glycol, (poly) propylene glycol, (poly) tetramethylene glycol, (poly) butylene glycol, 3-methyl-1,5-pentanediol, and hexanediol, and maleic acid and fumal.
- polybasic acids such as acids, succinic acid, adipic acid, phthalic acid, isophthalic acid, hexahydrophthalic acid, tetrahydrophthalic acid, dimer acid, sebatic acid, azelaic acid, 5-sodium sulfoisophthalic acid, and anhydrides thereof.
- (Meta) acrylate of polyester polyol which is the reaction product of the above; Polyfunctional (poly) ester (meth) acrylates and the like can be mentioned.
- Epoxy (meth) acrylates are carboxylate compounds of a compound having an epoxy group and (meth) acrylic acid.
- phenol novolac type epoxy (meth) acrylate cresol novolac type epoxy (meth) acrylate, trishydroxyphenylmethane type epoxy (meth) acrylate, dicyclopentadienephenol type epoxy (meth) acrylate, bisphenol A type epoxy (meth) acrylate.
- Bisphenol F type epoxy (meth) acrylate Bisphenol F type epoxy (meth) acrylate, biphenol type epoxy (meth) acrylate, bisphenol A novolak type epoxy (meth) acrylate, naphthalene skeleton-containing epoxy (meth) acrylate, glyoxal type epoxy (meth) acrylate, heterocyclic epoxy ( Examples thereof include meta) acrylates and the like, and these acid anhydride-modified epoxy acrylates and the like.
- Examples of the compound having a vinyl group include vinyl ethers such as ethyl vinyl ether, propyl vinyl ether, hydroxyethyl vinyl ether, and ethylene glycol divinyl ether.
- Examples of styrenes include styrene, methylstyrene, ethylstyrene, divinylbenzene and the like.
- Examples of other vinyl compounds include triallyl isocyanurate, trimetaallyl isocyanurate, and bisallyl nadiimide.
- These compounds having an ethylenically unsaturated group can be used alone or in admixture of two or more.
- the total content of the compounds having an ethylenically unsaturated group is preferably 0.01 to 40 parts by mass in 100 parts by mass of the resin solid content in the resin composition.
- the resin composition may further contain a filler in order to improve various properties such as coating film property and heat resistance.
- the filler preferably has insulating properties and does not impede permeability to a wavelength of 405 nm (h line).
- Examples of the filler include silica (natural silica, fused silica, amorphous silica, hollow silica, etc.), aluminum compounds (bemite, aluminum hydroxide, alumina, aluminum nitride, etc.), boron compounds (boron nitride, etc.), magnesium.
- silica, boehmite, barium sulfate, silicone powder, fluororesin-based filler, urethane resin-based filler, (meth) acrylic resin-based filler, polyethylene-based filler, styrene-butadiene rubber, and silicone rubber are preferable. .. These fillers may be surface-treated with a silane coupling agent or the like described later.
- Silica is preferable, and fused silica is more preferable, from the viewpoint of improving the heat resistance of the cured product and obtaining good coating film properties.
- Specific examples of silica include SFP-130MC (trade name) manufactured by Denka Co., Ltd., SC2050-MB (trade name) manufactured by Admatex Co., Ltd., SC1050-MLE (trade name), and YA010C-MFN (trade name). ), YA050C-MJA (trade name) and the like.
- the particle size of the filler is usually 0.005 to 10 ⁇ m, preferably 0.01 to 1.0 ⁇ m, from the viewpoint of ultraviolet light transmission of the resin composition.
- the content of the filler is based on 100 parts by mass of the resin solid content in the resin composition from the viewpoint of improving the ultraviolet light transmittance of the resin composition and the heat resistance of the cured product. It is preferably 300 parts by mass or less, more preferably 200 parts by mass or less, and further preferably 100 parts by mass or less.
- the lower limit is usually 1 with respect to 100 parts by mass of the resin solid content in the resin composition from the viewpoint of obtaining the effect of improving various properties such as coating film property and heat resistance. It is more than a part by mass.
- silane coupling agent and wet dispersant A silane coupling agent and / or a wet dispersant can also be used in combination with the resin composition in order to improve the dispersibility of the filler and the adhesive strength between the polymer and / or the resin and the filler. ..
- the silane coupling agent is not particularly limited as long as it is a silane coupling agent generally used for surface treatment of inorganic substances. Specific examples include, for example, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, 3-aminopropyldiethoxymethylsilane, N- (2-aminoethyl) -3.
- vinylsilane series such as 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropyldimethoxymethylsilane, 3-methacryloxypropyldiethoxymethylsilane, 3-acryloxy Acrylicsilanes such as propyltrimethoxysilane and 3-acryloxypropyltriethoxysilane; isocyanatesilanes such as 3-isocyanatepropyltrimethoxysilane and 3-isocyanatepropyltriethoxysilane; tris- (trimethoxysilylpropyl) Isocyanuratesilanes such as isocyanurate; mercaptosilanes such as 3-mercaptopropyltrimethoxysilane and 3-mercaptopropyldimethoxymethylsilane; 3-ureidopropyltriethoxysilane Ureidosilanes such as; s
- the total content of the silane coupling agent is usually 0.1 to 10 parts by mass with respect to 100 parts by mass of the resin solid content in the resin composition.
- the wet dispersant is not particularly limited as long as it is a dispersion stabilizer used for paints. Specific examples include, for example, DISPERBYK (registered trademark) -110 (trademark), 111 (product name), 118 (product name), 180 (product name), 161 (product name) manufactured by Big Chemie Japan Co., Ltd. , BYK®-W996 (trade name), W9010 (trade name), W903 (trade name) and the like. These wet dispersants can be used alone or in admixture of two or more.
- the total content of the wet dispersant is usually 0.1 to 10 parts by mass with respect to 100 parts by mass of the resin solid content in the resin composition.
- the resin composition may contain an organic solvent, if necessary.
- an organic solvent is used, the viscosity of the resin composition at the time of preparation can be adjusted.
- the type of the organic solvent is not particularly limited as long as it can dissolve a part or all of the resin in the resin composition. Specific examples include, for example, ketones such as acetone, methyl ethyl ketone, and methyl isobutyl ketone; alicyclic ketones such as cyclopentanone and cyclohexanone; cellosolvent solvents such as propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate.
- Ester solvents such as ethyl lactate, methyl acetate, ethyl acetate, butyl acetate, isoamyl acetate, ethyl lactate, methyl methoxypropionate, methyl hydroxyisobutyrate, and ⁇ -butyrolactone; amides such as dimethylacetamide and dimethylformamide.
- Polar solvents Non-polar solvents such as toluene and aromatic hydrocarbons such as xylene. These organic solvents may be used alone or in admixture of two or more.
- the resin composition includes various polymer compounds such as thermosetting resins, thermoplastic resins, oligomers thereof, and elastomers which have not been mentioned so far, as long as the characteristics of the present embodiment are not impaired; Flame-retardant compounds not listed above; additives and the like can be used in combination. These are not particularly limited as long as they are generally used.
- flame-retardant compounds include nitrogen-containing compounds such as melamine and benzoguanamine, phosphate compounds of phosphorus compounds, aromatic condensed phosphoric acid esters, halogen-containing condensed phosphoric acid esters, and the like.
- Additives include UV absorbers, antioxidants, optical brighteners, photosensitizers, dyes, pigments, thickeners, lubricants, defoamers, surface conditioners, brighteners, polymerization inhibitors, and cures.
- accelerators include accelerators. These components may be used alone or in admixture of two or more. In the resin composition, the content of the other components is usually 0.1 to 10 parts by mass with respect to 100 parts by mass of the resin solid content in the resin composition.
- the resin composition appropriately contains a maleimide compound (A), a photoinitiator (B), and if necessary, a resin or compound other than the maleimide compound (A), a filler, other components, and additives. Prepared by mixing.
- the resin composition can be suitably used as a varnish for producing the resin sheet of the present embodiment described later.
- the organic solvent used for preparing the varnish is not particularly limited, and specific examples thereof are as described above.
- Examples of the method for producing the resin composition include a method in which each of the above-mentioned components is sequentially mixed with a solvent and sufficiently stirred.
- a known treatment for uniformly dissolving or dispersing each component can be performed.
- the dispersibility of the bismaleimide compound (A) and the filler in the resin composition is improved by performing the stirring and dispersing treatment using a stirring tank equipped with a stirring machine having an appropriate stirring ability.
- the stirring, mixing, and kneading treatments include, for example, a stirring device for dispersing an ultrasonic homogenizer, a device for mixing three rolls, a ball mill, a bead mill, a sand mill, and the like, and a revolution or rotation type mixing.
- an organic solvent can be used if necessary.
- the type of the organic solvent is not particularly limited as long as it can dissolve the resin in the resin composition, and specific examples thereof are as described above.
- the resin composition can be suitably used as a varnish when producing the resin sheet of the present embodiment described later.
- the varnish can be obtained by a known method. For example, in the varnish, 10 to 900 parts by mass of an organic solvent is added to 100 parts by mass of the component excluding the organic solvent in the resin composition of the present embodiment, and the above-mentioned known mixing treatment (stirring, kneading treatment, etc.) is performed. Can be obtained by doing.
- the resin composition can be used in applications where an insulating resin composition is required, and is not particularly limited.
- the resin composition is excellent in photocurability, heat resistance, and thermal stability, and therefore can be suitably used for an insulating layer of a multilayer printed wiring board and for a solder resist.
- the cured product of the present embodiment is obtained by curing the resin composition.
- the cured product can be obtained, for example, by melting or dissolving the resin composition in a solvent, pouring it into a mold, and curing it under normal conditions using heat, light, or the like.
- the curing temperature is preferably in the range of 120 to 300 ° C. from the viewpoint of efficient curing and prevention of deterioration of the obtained cured product.
- photo-curing it is preferable that the wavelength region of light is cured in the range of 100 to 500 nm, which is efficiently cured by a photo-curing initiator or the like.
- the resin sheet of the present embodiment is a resin sheet with a support having a support and resin layers arranged on one side or both sides of the support, and the resin layer contains a resin composition.
- the resin sheet can be produced by applying the resin composition on the support and drying it.
- the resin layer in the resin sheet has excellent insulation reliability, heat resistance, and thermal stability.
- a known support can be used, but a resin film is preferable.
- the resin film include polyimide film, polyamide film, polyester film, polyethylene terephthalate (PET) film, polybutylene terephthalate (PBT) film, polypropylene (PP) film, polyethylene (PE) film, polyethylene naphthalate film, and polyvinyl alcohol.
- PET film is preferable.
- the resin film is preferably coated with a release agent on the surface in order to facilitate peeling from the resin layer.
- the thickness of the resin film is preferably in the range of 5 to 100 ⁇ m, and more preferably in the range of 10 to 50 ⁇ m. If the thickness is less than 5 ⁇ m, the support tends to be torn easily when the support is peeled off before development, and if the thickness exceeds 100 ⁇ m, the resolution when exposed from above the support tends to decrease. is there.
- the resin film has excellent transparency.
- the resin layer may be protected by a protective film.
- a protective film By protecting the resin layer side with a protective film, it is possible to prevent dust and the like from adhering to the surface of the resin layer and scratches.
- the protective film a film made of the same material as the resin film can be used.
- the thickness of the protective film is preferably in the range of 1 to 50 ⁇ m, more preferably in the range of 5 to 40 ⁇ m. If the thickness is less than 1 ⁇ m, the handleability of the protective film tends to decrease, and if it exceeds 50 ⁇ m, the cost tends to be inferior.
- the protective film preferably has a smaller adhesive force between the resin layer and the protective film than the adhesive force between the resin layer and the support.
- Examples of the method for producing a resin sheet include a method for producing a resin sheet by applying a resin composition to a support such as a PET film and drying it to remove an organic solvent.
- the coating method can be performed by a known method using, for example, a roll coater, a comma coater, a gravure coater, a die coater, a bar coater, a lip coater, a knife coater, a squeeze coater, or the like. Drying can be performed, for example, by heating in a dryer at 60 to 200 ° C. for 1 to 60 minutes.
- the amount of the organic solvent remaining in the resin layer is preferably 5% by mass or less with respect to the total mass of the resin layer from the viewpoint of preventing the diffusion of the organic solvent in a later step.
- the thickness of the resin layer is preferably 1 to 50 ⁇ m from the viewpoint of improving handleability.
- the resin sheet can be used for manufacturing an insulating layer of a multilayer printed wiring board.
- the multilayer printed wiring board of the present embodiment has an insulating layer and a conductor layer formed on one side or both sides of the insulating layer, and the insulating layer contains a resin composition.
- the insulating layer can also be obtained, for example, by stacking one or more resin sheets and curing them.
- the number of layers of the insulating layer and the conductor layer can be appropriately set according to the intended use. Further, the order of the insulating layer and the conductor layer is not particularly limited.
- the conductor layer may be a metal foil used for various printed wiring board materials, and examples thereof include metal foils such as copper and aluminum. Examples of the copper metal foil include rolled copper foil and copper foil such as electrolytic copper foil.
- the thickness of the conductor layer is usually 1 to 100 ⁇ m. Specifically, it can be produced by the following method.
- the resin layer side of the resin sheet is laminated on one side or both sides of the circuit board using a vacuum laminator.
- the circuit board include a glass epoxy board, a metal substrate, a ceramic substrate, a silicon substrate, a semiconductor encapsulating resin substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, and a thermosetting polyphenylene ether substrate.
- the circuit board refers to a board on which a patterned conductor layer (circuit) is formed on one side or both sides of the board as described above.
- a circuit board is also a circuit board in which one or both sides of the outermost layer of the multi-layer printed wiring board is a patterned conductor layer (circuit).
- the insulating layer laminated on the multilayer printed wiring board may be an insulating layer obtained by stacking one or more resin sheets of the present embodiment and curing the resin sheet of the present embodiment.
- the insulating layer may be obtained by stacking one or more of the resin sheet of the present embodiment and a known resin sheet different from the resin sheet of the present embodiment.
- the method of stacking the resin sheet of the present embodiment and a known resin sheet different from the resin sheet of the present embodiment is not particularly limited.
- the surface of the conductor layer may be roughened in advance by blackening treatment and / or copper etching or the like.
- the protective film is peeled off and removed, and then the resin sheet and the circuit board are preheated as necessary, and the resin layer of the resin sheet is pressurized and heated. While crimping to the circuit board.
- a method of laminating a resin layer of a resin sheet on a circuit board under reduced pressure by a vacuum laminating method is preferably used.
- the conditions of the laminating process are, for example, a crimping temperature (lamination temperature) of 50 to 140 ° C., a crimping pressure of 1 to 15 kgf / cm 2 , a crimping time of 5 to 300 seconds, and an air pressure of 20 mmHg or less under reduced pressure. It is preferable to laminate. Further, the laminating step may be a batch type or a continuous type using a roll.
- the vacuum laminating method can be performed using a commercially available vacuum laminator. Examples of the commercially available vacuum laminator include a two-stage build-up laminator manufactured by Nikko Materials Co., Ltd.
- a predetermined portion of the resin layer is irradiated with active energy rays as a light source to cure the resin layer of the irradiated portion.
- Irradiation may be performed through a mask pattern, or a direct drawing method of direct irradiation may be used.
- the active energy ray include ultraviolet rays, visible rays, electron beams, X-rays and the like.
- the wavelength of the active energy ray is, for example, in the range of 200 to 600 nm. When ultraviolet rays are used, the irradiation amount is about 10 to 1000 mJ / cm 2 .
- the active energy ray for example, an active energy ray containing a wavelength of 405 nm (h line) is used. It is preferable to use it.
- the irradiation amount thereof is approximately 10 to 10,000 mJ / cm 2 .
- the exposure method through which the mask pattern is passed includes a contact exposure method in which the mask pattern is brought into close contact with a multilayer printed wiring board and a non-contact exposure method in which the mask pattern is exposed using parallel light rays without being brought into close contact with each other. It doesn't matter.
- the support is present on the resin layer, it may be exposed from above the support, or the support may be exposed after peeling.
- the non-photocured portion is removed by wet development and developed to form a pattern of the insulating layer. be able to.
- the support is removed after the exposure step, and then the non-photocured portion (unexposed portion) is removed by wet development and developed. Thereby, the pattern of the insulating layer can be formed.
- the developing solution is not particularly limited as long as it selectively elutes the unexposed portion.
- organic solvents such as cyclohexanone, cyclopentanone, and ⁇ -butyrolactone
- alkaline developing solutions such as tetramethylammonium hydroxide aqueous solution, sodium carbonate aqueous solution, potassium carbonate aqueous solution, sodium hydroxide aqueous solution, and potassium hydroxide aqueous solution are used. ..
- These developers can be used alone or in admixture of two or more.
- a developing method for example, a known method such as dipping, paddle, spraying, rocking dipping, brushing, scraping, etc. can be performed. In pattern formation, these developing methods may be used in combination, if necessary. Further, as a developing method, it is preferable to use a high-pressure spray because the resolution is further improved. When the spray method is adopted, the spray pressure is preferably 0.02 to 0.5 MPa.
- a post-baking step is performed to form an insulating layer (cured product).
- the post-baking step include an ultraviolet irradiation step using a high-pressure mercury lamp and a heating step using a clean oven, and these can be used in combination.
- the irradiation amount can be adjusted as needed, and for example, irradiation can be performed at an irradiation amount of about 50 to 10,000 mJ / cm 2 .
- the heating conditions can be appropriately selected as needed, but are preferably selected in the range of 150 to 220 ° C. for 20 to 180 minutes, and more preferably in the range of 160 to 200 ° C. for 30 to 150 minutes.
- a conductor layer is formed on the surface of the insulating layer by dry plating.
- dry plating known methods such as a thin film deposition method, a sputtering method, and an ion plating method can be used.
- a metal film can be formed on an insulating layer by placing a multilayer printed wiring board in a vacuum vessel and heating and evaporating the metal.
- a multilayer printed wiring board is placed in a vacuum vessel, an inert gas such as argon is introduced, a DC voltage is applied, and the ionized inert gas collides with the target metal and is beaten out.
- a metal film can be formed on the insulating layer by the metal.
- a conductor layer is formed by electroless plating or electrolytic plating.
- a subsequent pattern forming method for example, a subtractive method, a semi-additive method, or the like can be used.
- the semiconductor device of this embodiment includes a resin composition. Specifically, it can be produced by the following method.
- a semiconductor device can be manufactured by mounting a semiconductor chip on a conductive portion of a multilayer printed wiring board.
- the conductive portion is a portion of the multilayer printed wiring board that transmits an electric signal, and the location may be a surface or an embedded portion.
- the semiconductor chip is not particularly limited as long as it is an electric circuit element made of a semiconductor.
- the mounting method of the semiconductor chip in manufacturing a semiconductor device is not particularly limited as long as the semiconductor chip functions effectively, but specifically, a wire bonding mounting method, a flip chip mounting method, and a bumpless build-up layer (BBUL). ), A mounting method using an anisotropic conductive film (ACF), a mounting method using a non-conductive film (NCF), and the like.
- ACF anisotropic conductive film
- NCF non-conductive film
- a semiconductor device can also be manufactured by forming an insulating layer containing a resin composition on a semiconductor chip or a substrate on which the semiconductor chip is mounted.
- the shape of the substrate on which the semiconductor chip is mounted may be a wafer shape or a panel shape. After the formation, it can be manufactured by the same method as the above-mentioned multilayer printed wiring board.
- MA-TMDA amic acid compound
- 0.01% by mass of bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide (manufactured by IGM Resins BV, Omnirad® 819) is contained as the photocuring initiator (B).
- the chloroform solution was prepared and the absorbance at a wavelength of 405 nm was measured using an ultraviolet-visible spectrophotometer (Hitachi spectrophotometer U-4100, manufactured by Hitachi High-Tech Science Co., Ltd.).
- 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1 (IGM Resins BV Omnirad® 369) and 2-methyl as photoinitiators.
- Example 1 Preparation of resin composition and resin sheet
- This varnish is applied on a 38 ⁇ m-thick PET film (Unitika Ltd., Unipeel (registered trademark) TR1-38 (trade name)) with an automatic coating device (Tester Sangyo Co., Ltd., PI-1210 (trade name)). ) was applied and dried by heating at 90 ° C. for 5 minutes to obtain a resin sheet having a PET film as a support and a resin layer having a thickness of 30 ⁇ m.
- Example 2 72 parts by mass of TMDM as the maleimide compound (A), 18 parts by mass of MIZ-001 (trade name) manufactured by Nippon Kayaku Co., Ltd. as another maleimide compound, and bis (2,4,6) as the photoinitiator (B).
- -Trimethylbenzoyl) -Phenylphosphine oxide manufactured by IGM Resins BV, Omnirad (registered trademark) 819) is mixed with 10 parts by mass, diluted with 100 parts by mass of methyl ethyl ketone (manufactured by Idemitsu Kosan Co., Ltd.), and then diluted.
- a crocodile was obtained by stirring with an ultrasonic homogenizer. Using the obtained varnish, a resin sheet and an evaluation laminate were obtained in the same manner as in Example 1.
- Example 3 54 parts by mass of TMDM as the maleimide compound (A), 36 parts by mass of MIZ-001 (trade name) manufactured by Nippon Kayaku Co., Ltd. as another maleimide compound, and bis (2,4,6) as the photoinitiator (B).
- -Trimethylbenzoyl) -Phenylphosphine oxide manufactured by IGM Resins BV, Omnirad (registered trademark) 819) is mixed with 10 parts by mass, diluted with 100 parts by mass of methyl ethyl ketone (manufactured by Idemitsu Kosan Co., Ltd.), and then diluted.
- a crocodile was obtained by stirring with an ultrasonic homogenizer. Using the obtained varnish, a resin sheet and an evaluation laminate were obtained in the same manner as in Example 1.
- Example 4 36 parts by mass of TMDM as the maleimide compound (A), 54 parts by mass of MIZ-001 (trade name) manufactured by Nippon Kayaku Co., Ltd. as another maleimide compound, and bis (2,4,6) as the photoinitiator (B).
- -Trimethylbenzoyl) -Phenylphosphine oxide manufactured by IGM Resins BV, Omnirad (registered trademark) 819) is mixed with 10 parts by mass, diluted with 100 parts by mass of methyl ethyl ketone (manufactured by Idemitsu Kosan Co., Ltd.), and then diluted.
- a crocodile was obtained by stirring with an ultrasonic homogenizer. Using the obtained varnish, a resin sheet and an evaluation laminate were obtained in the same manner as in Example 1.
- Example 5 18 parts by mass of TMDM as the maleimide compound (A), 72 parts by mass of MIZ-001 (trade name) manufactured by Nippon Kayaku Co., Ltd. as another maleimide compound, and bis (2,4,6) as the photoinitiator (B).
- -Trimethylbenzoyl) -Phenylphosphine oxide manufactured by IGM Resins BV, Omnirad (registered trademark) 819) is mixed with 10 parts by mass, diluted with 100 parts by mass of methyl ethyl ketone (manufactured by Idemitsu Kosan Co., Ltd.), and then diluted.
- a crocodile was obtained by stirring with an ultrasonic homogenizer. Using the obtained varnish, a resin sheet and an evaluation laminate were obtained in the same manner as in Example 1.
- Example 1 A resin sheet was obtained in the same manner as in Example 1 except that 10 parts by mass of Omnirad (registered trademark) 369 was used instead of Omnirad (registered trademark) 819 as the photocuring initiator. Using this, a laminate for evaluation was obtained in the same manner as in Example 1.
- Example 2 A resin sheet was obtained in the same manner as in Example 1 except that 10 parts by mass of Omnirad (registered trademark) 907 was used instead of Omnirad (registered trademark) 819 as the photocuring initiator. Using this, a laminate for evaluation was obtained in the same manner as in Example 1.
- Example 1 except that 90 parts by mass of a maleimide compound (BMI-80 (trade name) manufactured by Keiai Kasei Co., Ltd.) was used instead of the maleimide compound (A) (TMDM obtained in Synthesis Example 1). A resin sheet was obtained in the same manner as above. Using this, a laminate for evaluation was obtained in the same manner as in Example 1.
- BMI-80 trade name
- TMDM maleimide compound
- Photo DSC (TA Instruments Japan) (TA Instruments Japan) equipped with a light source (Omcure (registered trademark) S2000 (trade name) manufactured by Uvics Co., Ltd.) capable of irradiating active energy rays including a wavelength of 405 nm (h line).
- a light source Omcure (registered trademark) S2000 (trade name) manufactured by Uvics Co., Ltd.
- DSC-2500 trade name
- the obtained evaluation laminate was irradiated with an illuminance of 30 mW and an exposure time of 3.5 minutes, the horizontal axis being time (sec) and the vertical axis being heat flow (heat flow). A graph of mW) was obtained.
- the peak area when a horizontal line was drawn from the end point of this graph was defined as enthalpy (J / g).
- the photocurability was evaluated according to the following criteria. "AA”: The enthalpy was 1 (J / g) or more. “CC”: The enthalpy was less than 1 (J / g).
- the evaluation laminate photocured in the photocurability test was heat-treated at 180 ° C. for 120 minutes, and then the PET film as a support was peeled off on both sides to obtain an evaluation cured product.
- the obtained cured product for evaluation was measured using a differential thermogravimetric simultaneous measuring device (manufactured by Hitachi High-Tech Science Co., Ltd., TG / DTA6200 (trade name)) at a measurement start temperature of 20 ° C., an end temperature of 500 ° C., and a temperature rise rate.
- the mass was measured under a nitrogen atmosphere at 10 ° C./min. The temperature at which the mass reduction rate was 5% was evaluated as thermal stability (° C.).
- the resin composition of the present embodiment is well exposed to light when exposed to active energy rays containing a wavelength of 405 nm (h line), and can be photocured. Further, the cured product obtained from the resin composition of the present embodiment exhibits excellent heat resistance as compared with the acrylate-based resin.
- the resin composition of the present embodiment is industrially useful because it exhibits excellent photocurability, heat resistance, and thermal stability.
- a photosensitive film for example, a photosensitive film, a photosensitive film with a support, a prepreg, and a resin. It can be used for sheets, circuit boards (laminated board applications, multilayer printed wiring board applications, etc.), solder resists, underfill materials, die bonding materials, semiconductor encapsulants, hole filling resins, component embedding resins, etc. ..
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Abstract
Description
例えば、特許文献1には、ビスフェノール型エポキシ樹脂と(メタ)アクリル酸とを反応させた後、酸無水物を反応させて得られるカルボキシル変性エポキシ(メタ)アクリレート樹脂と、ビフェニル型エポキシ樹脂と、光硬化開始剤と、希釈剤とを含む感光性熱硬化型樹脂組成物が記載されている。
[1]下記式(1)で表されるマレイミド化合物(A)と、波長405nm(h線)の吸光度が0.1以上である光硬化開始剤(B)と、を含有する樹脂組成物。
[4]前記光硬化開始剤(B)が、下記式(3)で表される化合物を含む、[1]~[3]のいずれかに記載の樹脂組成物。
[6]前記樹脂層の厚さが1~50μmである、[5]に記載の樹脂シート。
[7]絶縁層と、前記絶縁層の片面又は両面に形成された導体層と、を有し、前記絶縁層が、[1]~[4]のいずれかに記載の樹脂組成物を含む、多層プリント配線板。
[8][1]~[4]のいずれかに記載の樹脂組成物を含む、半導体装置。
なお、本明細書における「(メタ)アクリロイル基」とは「アクリロイル基」及びそれに対応する「メタクリロイル基」の両方を意味し、「(メタ)アクリレート」とは「アクリレート」及びそれに対応する「メタクリレート」の両方を意味し、「(メタ)アクリル酸」とは「アクリル酸」及びそれに対応する「メタクリル酸」の両方を意味する。「(メタ)アリル」とは「アリル」及びそれに対応する「メタアリル」の両方を意味する。また、本実施形態において、「樹脂固形分」又は「樹脂組成物中の樹脂固形分」とは、特に断りのない限り、樹脂組成物における、光硬化開始剤(B)、添加剤、溶剤及び充填材を除いた成分をいい、「樹脂固形分100質量部」とは、樹脂組成物における、光硬化開始剤(B)、添加剤、溶剤及び充填材を除いた成分の合計が100質量部であることをいうものとする。
本実施形態の樹脂組成物は、式(1)で表されるマレイミド化合物(A)と、波長405nm(h線)の吸光度が0.1以上である光硬化開始剤(B)と、を含む。
〔式(1)で表されるマレイミド化合物(A)〕
本実施形態に係るマレイミド化合物(A)(成分(A)とも称す)は、式(1)の構造を有する。
そして、本実施形態の樹脂組成物を含んで得られる硬化物は、好適に光硬化するため、耐熱性、絶縁信頼性、及び熱安定性に優れる。そのため、本実施形態によれば、多層プリント配線板及び半導体装置における、保護膜、及び絶縁層を好適に形成することができる。
ハロゲン原子、炭素数1~6の直鎖状若しくは分岐状のアルキル基としては、前記のR1の記載を参照できる。
炭素数1~6の直鎖状若しくは分岐状のアルケニル基としては、特に限定されず、例えば、ビニル基、アリル基、4-ペンテニル基、イソプロペニル基、及びイソペンテニル基が挙げられる。
R5及びR6としては、光硬化性、耐熱性、及び熱安定性により優れ、溶剤に対する良好な溶解性、低融点、低吸水性、及び他の樹脂との良好な相溶性を発現する観点から、水素原子、及びメチル基が好ましく、R5及びR6の全てが、水素原子であることがより好ましい。
マレイミド化合物(A)は、例えば、次の合成方法により得ることができる。すなわち、式(5)で表されるアミン化合物と、式(6)で表される酸無水物とを付加反応させることで、式(7)で表されるアミド酸化合物を得て、その後、得られたアミド酸化合物を脱水閉環反応させることで得ることができる。
R1、R2、R3、及びR4については、好ましい態様も含めて、式(1)と同じである。
R5及びR6については、好ましい態様も含めて、式(1)と同じである。
R1、R2、R3、R4、R5、及びR6については、好ましい態様も含めて、式(1)と同じである。
式(7)で表されるアミド酸化合物は、例えば、次の合成方法により得ることができる。すなわち、式(5)で表されるアミン化合物と、式(6)で表される酸無水物とを付加反応させることで得ることができる。
これらのアミン化合物としては、市販品を利用することもできる。
式(6)で表される酸無水物の量は、式(5)で表されるアミン化合物1モルに対して、通常1.5~3.0倍モルであり、好ましくは1.8~2.2倍モルである。
式(1)で表されるマレイミド化合物(A)は、例えば、次の合成方法により得ることができる。すなわち、前記の合成方法で得られた式(7)で表されるアミド酸化合物を脱水閉環反応させることで得ることができる。また、脱水閉環反応は、有機溶媒中で行うことが好ましい。有機溶媒としては、前記の付加反応に用いる溶媒が参照でき、付加反応に用いる溶媒と同じであっても、異なっていてもよい。
酸触媒としては、例えば、塩酸、臭化水素、ヨウ化水素、硫酸、無水硫酸、硝酸、りん酸、亜りん酸、りんタングステン酸、及びりんモリブデン酸などの無機酸類;メタンスルホン酸、エタンスルホン酸、トリフルオロメタンスルホン酸、ベンゼンスルホン酸、及びp-トルエンスルホン酸などのスルホン酸類;酢酸、及びシュウ酸などのカルボン酸類;クロロ酢酸、ジクロロ酢酸、トリクロロ酢酸、フルオロ酢酸、ジフルオロ酢酸、及びトリフルオロ酢酸などのハロゲン化カルボン酸類;シリカ、アルミナ、及び活性白土などの固体酸類;カチオン型イオン交換樹脂などが挙げられる。また、これらの酸触媒は、ジアミン化合物との塩であってもよい。この中では、硫酸、りん酸、及びp-トルエンスルホン酸が好ましい。これらの酸溶媒は、1種類を単独で又は2種類以上を組み合わせて用いることができる。
有機塩基触媒及び酸触媒の使用量は、脱水閉環反応の反応速度が実質的に向上すれば特に限定されないが、原料のアミン化合物に対して、通常0.001~10倍モルであり、0.005~5倍モルであることが好ましく、0.01~1倍モルであることがより好ましい。
また、触媒としては、例えば、アルカリ土類金属の酸化物、鉄(II及びIII)、ニッケル(II)、マンガン(II及びIII)、銅(I及びII)またはコバルト(II及びIII)の炭酸塩、硫酸塩、リン酸塩、及び酢酸塩などが挙げられる。これらの触媒は、1種類を単独で又は2種類以上を組み合わせて用いることができる。触媒の使用量は、アミド酸化合物1モルに対して、通常5×10-4~0.1モルである。
塩基としては、例えば、酢酸ナトリウム、酢酸カリウム、トリメチルアミン、トリエチルアミン、及びトリブチルアミンなどが挙げられる。これらの塩基は、1種類を単独で又は2種類以上を組み合わせて用いることができる。塩基の使用量は、アミド酸化合物1モルに対して、通常0.05~1.1モルである。
単離したマレイミド化合物を更に精製する必要がある場合には、公知方法を採用して精製すればよい。このような方法としては、例えば、蒸留精製法、再結晶法、カラムクロマトグラフィー法、スラッジ処理、及び活性炭処理などが挙げられる。
本実施形態に係る光硬化開始剤(B)(成分(B)とも称す)は、波長405nm(h線)の吸光度が0.1以上であれば特に限定されず、一般に光硬化性樹脂組成物で用いられる分野で公知のものを使用することができる。本実施形態において、光硬化開始剤(B)とは、波長405nm(h線)の吸光度が0.1以上であり、かつ、波長405nm(h線)を含む活性エネルギー線を照射することにより、マレイミド化合物(A)のマレイミド基を重合させることができる活性物質(ラジカル)を放出する化合物を称す。また、波長405nm(h線)の吸光度が0.1以上であるとは、成分(B)が0.01質量%で含まれるクロロホルム溶液を調製し、波長405nm(h線)の光線を用いてこのクロロホルム溶液の吸光度を測定した場合に、吸光度が0.1以上であることを意味する。このような光硬化開始剤(B)を用いると、例えば、直接描画露光法を用いて高密度で高精細な配線形成(パターン)を有するプリント配線板を製造するに際し、波長405nm(h線)を含む活性エネルギー線を用いた場合でも、マレイミドの光ラジカル反応が効率的に起こる。吸光度は、0.15以上であることが好ましい。上限値は、例えば、99.9以下である。
式(4)中、R8は、各々独立に、水素原子又はメチル基を表す。R8のうち、1つ以上がメチル基であることが好ましく、全てメチル基であることがより好ましい。
本実施形態の樹脂組成物には、樹脂又は化合物として、マレイミド化合物(A)以外のマレイミド化合物(以下、「他のマレイミド化合物」ともいう。)、シアン酸エステル化合物、フェノール樹脂、エポキシ樹脂、オキセタン樹脂、ベンゾオキサジン化合物、カルボジイミド化合物、及びエチレン性不飽和基を有する化合物からなる群より選択される1種以上を更に含むことができる。マレイミド化合物(A)は、光透過性に非常に優れるため、これらの樹脂又は化合物を用いても、光硬化開始剤まで十分に光が届き、マレイミドの光ラジカル反応が効率的に起き、種々の活性エネルギー線を用いて光硬化させることができる。そのため、例えば、波長405nmを含む活性エネルギー線を用いても、光が光硬化開始剤まで十分に届き、光硬化開始剤から発生したラジカルを用いたラジカル反応が進行し、これらの樹脂又は化合物が配合されている組成物においても光硬化が可能となる。以下、これらの各成分について説明する。
樹脂組成物においては、波長405nm(h線)を含む活性エネルギー線で露光した場合に、樹脂組成物が感光して、光硬化する限り、マレイミド化合物(A)以外のマレイミド化合物を用いることができる。
式(11)中、yの数は、10~35である。
アルキル基の炭素数としては、優れた光硬化性を示すことから、4~12が好ましい。
アルケニル基の炭素数としては、優れた光硬化性を示すことから、4~12が好ましい。
直鎖状若しくは分岐状のアルケニル基としては、式(1)におけるアルケニル基を参照できる。これらの中でも、優れた光硬化性を示すことから、2-ヘプテニル基、2-オクテニル基、2-ノネニル基が好ましく、2-オクテニル基がより好ましい。
アルキル基の炭素数としては、1~16が好ましく、優れた光硬化性を示すことから、4~12がより好ましい。
アルケニル基の炭素数としては、1~16が好ましく、優れた光硬化性を示すことから、4~12がより好ましい。
アルケニル基の具体例としては、前記のRaにおけるアルケニル基を参照できる。この中でも、優れた光硬化性を示すことから、2-ヘプテニル基、2-オクテニル基、2-ノネニル基が好ましく、2-オクテニル基がより好ましい。
式(8)で表されるマレイミド化合物としては、例えば、BMI-2300(大和化成工業(株)製、商品名)が挙げられる。
式(9)で表されるマレイミド化合物としては、例えば、MIR-3000(日本化薬(株)製、商品名)が挙げられる。
式(10)で表されるマレイミド化合物としては、例えば、ケイ・アイ化成(株)製BMI-1000P(商品名、式(10)中のn3=13.6(平均))、ケイ・アイ化成(株)製BMI-650P(商品名、式(10)中のn3=8.8(平均))、ケイ・アイ化成(株)製BMI-250P(商品名、式(10)中のn3=3~8(平均))、ケイ・アイ化成(株)製CUA-4(商品名、式(10)中のn3=1)等が挙げられる。
式(11)で表されるマレイミド化合物としては、例えば、Designer Molecules Inc.(DMI)製BMI-6100(商品名、式(11)中のx=18、y=18)等が挙げられる。
式(12)で表されるマレイミド化合物としては、例えば、Designer Molecules Inc.(DMI)製BMI-689(商品名、式(19)、官能基当量:346g/eq.)等が挙げられる。
式(14)で表されるマレイミド化合物としては、市販品を利用することもでき、例えば、Designer Molecules Inc.(DMI)製BMI-1700(商品名)が挙げられる。
式(15)で表されるマレイミド化合物としては、市販品を利用することもでき、例えば、Designer Molecules Inc.(DMI)製BMI-3000(商品名)、Designer Molecules Inc.(DMI)製BMI-3000J(商品名)、Designer Molecules Inc.(DMI)製BMI-5000(商品名)、Designer Molecules Inc.(DMI)製BMI-9000(商品名)が挙げられる。
式(16)で表されるマレイミド化合物としては、市販品を利用することもでき、例えば、大和化成(株)製BMI-TMH(商品名)が挙げられる。
式(17)で表されるマレイミド化合物としては、市販品を利用することもでき、例えば、ケイ・アイ化成(株)製BMI-70(商品名)があげられる。
式(18)で表されるマレイミド化合物を含むマレイミド化合物としては、市販品を利用することもでき、例えば、日本化薬(株)製MIZ-001(商品名)が挙げられる。
シアン酸エステル化合物としては、シアナト基(シアン酸エステル基)が少なくとも1個置換された芳香族部分を分子内に有する樹脂であれば特に限定されない。
また、式(20)におけるアルキル基及びRaにおけるアリール基中の水素原子は、フッ素原子、塩素原子等のハロゲン原子、メトキシ基、フェノキシ基等のアルコキシル基、又はシアノ基等で置換されていてもよい。
アルケニル基の具体例としては、ビニル基、(メタ)アリル基、イソプロペニル基、1-プロペニル基、2-ブテニル基、3-ブテニル基、1,3-ブタンジエニル基、2-メチル-2-プロペニル、2-ペンテニル基、及び2-ヘキセニル基等が挙げられる。
アリール基の具体例としては、フェニル基、キシリル基、メシチル基、ナフチル基、フェノキシフェニル基、エチルフェニル基、o-,m-又はp-フルオロフェニル基、ジクロロフェニル基、ジシアノフェニル基、トリフルオロフェニル基、メトキシフェニル基、及びo-,m-又はp-トリル基等が挙げられる。
アルコキシル基としては、例えば、メトキシ基、エトキシ基、プロポキシ基、イソプロポキシ基、n-ブトキシ基、イソブトキシ基、及びtert-ブトキシ基等が挙げられる。
式(20)のXにおける窒素数1~10の2価の有機基としては、イミノ基、ポリイミド基等が挙げられる。
式(21)のAr2及び式(22)のAr3の具体例としては、式(21)に示す2個の炭素原子、又は式(21)に示す2個の酸素原子が、1,4位又は1,3位に結合するベンゼンジイル基、前記2個の炭素原子又は2個の酸素原子が4,4’位、2,4’位、2,2’位、2,3’位、3,3’位、又は3,4’位に結合するビフェニルジイル基、及び、前記2個の炭素原子又は2個の酸素原子が、2,6位、1,5位、1,6位、1,8位、1,3位、1,4位、又は2,7位に結合するナフタレンジイル基が挙げられる。
式(21)のRb、Rc、Rd、Re、Rf及びRg、並びに式(22)のRi、Rjにおけるアルキル基及びアリール基は、式(20)におけるものと同義である。
フェノール樹脂としては、1分子中に2個以上のヒドロキシル基を有するフェノール樹脂であれば、一般に公知のものを使用できる。例えば、ビスフェノールA型フェノール樹脂、ビスフェノールE型フェノール樹脂、ビスフェノールF型フェノール樹脂、ビスフェノールS型フェノール樹脂、フェノールノボラック樹脂、ビスフェノールAノボラック型フェノール樹脂、グリシジルエステル型フェノール樹脂、アラルキルノボラック型フェノール樹脂、ビフェニルアラルキル型フェノール樹脂、クレゾールノボラック型フェノール樹脂、多官能フェノール樹脂、ナフトール樹脂、ナフトールノボラック樹脂、多官能ナフトール樹脂、アントラセン型フェノール樹脂、ナフタレン骨格変性ノボラック型フェノール樹脂、フェノールアラルキル型フェノール樹脂、ナフトールアラルキル型フェノール樹脂、ジシクロペンタジエン型フェノール樹脂、ビフェニル型フェノール樹脂、脂環式フェノール樹脂、ポリオール型フェノール樹脂、リン含有フェノール樹脂、重合性不飽和炭化水素基含有フェノール樹脂、及び水酸基含有シリコーン樹脂類等が挙げられる。これらのフェノール樹脂は、1種単独又は2種以上を適宜混合して使用することも可能である。
エポキシ樹脂としては、特に限定されず、一般に公知のものを使用できる。例えば、ビスフェノールA型エポキシ樹脂、ビスフェノールE型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、ビスフェノールAノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、キシレンノボラック型エポキシ樹脂、多官能フェノール型エポキシ樹脂、ナフタレン型エポキシ樹脂、ナフタレン骨格変性ノボラック型エポキシ樹脂、ナフチレンエーテル型エポキシ樹脂、フェノールアラルキル型エポキシ樹脂、アントラセン型エポキシ樹脂、3官能フェノール型エポキシ樹脂、4官能フェノール型エポキシ樹脂、トリグリシジルイソシアヌレート、グリシジルエステル型エポキシ樹脂、脂環式エポキシ樹脂、ジシクロペンタジエンノボラック型エポキシ樹脂、ビフェニルノボラック型エポキシ樹脂、フェノールアラルキルノボラック型エポキシ樹脂、ナフトールアラルキルノボラック型エポキシ樹脂、アラルキルノボラック型エポキシ樹脂、ナフトールアラルキル型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、ポリオール型エポキシ樹脂、リン含有エポキシ樹脂、グリシジルアミン、ブタジエン等の二重結合をエポキシ化した化合物、水酸基含有シリコーン樹脂類とエピクロルヒドリンとの反応により得られる化合物、及びこれらのハロゲン化物が挙げられる。これらのエポキシ樹脂は、1種単独又は2種以上を適宜混合して使用することも可能である。
オキセタン樹脂としては、一般に公知のものを使用できる。例えば、オキセタン、2-メチルオキセタン、2,2-ジメチルオキセタン、3-メチルオキセタン、3,3-ジメチルオキセタン等のアルキルオキセタン、3-メチル-3-メトキシメチルオキセタン、3,3-ジ(トリフルオロメチル)パーフルオキセタン、2-クロロメチルオキセタン、3,3-ビス(クロロメチル)オキセタン、ビフェニル型オキセタン、OXT-101(東亞合成(株)製、商品名)、OXT-121(東亞合成(株)製、商品名)、及びOXT-221(東亞合成(株)製、商品名)等が挙げられる、特に制限されるものではない。これらのオキセタン樹脂は、1種単独又は2種以上を適宜混合して使用することも可能である。
ベンゾオキサジン化合物としては、例えば、1分子中に2個以上のジヒドロベンゾオキサジン環を有する化合物であれば、一般に公知のものを用いることができる。例えば、ビスフェノールA型ベンゾオキサジンBA-BXZ(小西化学工業(株)製、商品名)、ビスフェノールF型ベンゾオキサジンBF-BXZ(小西化学工業(株)製、商品名)、ビスフェノールS型ベンゾオキサジンBS-BXZ(小西化学工業(株)製、商品名)、及びフェノールフタレイン型ベンゾオキサジン等が挙げられる。これらのベンゾオキサジン化合物は、1種単独又は2種以上を適宜混合して使用することも可能である。
カルボジイミド化合物としては、少なくとも分子中に1個以上のカルボジイミド基を有していれば特に限定されず、一般に公知のものを使用できる。例えば、ジシクロヘキシルカルボジイミド、ジイソプロピルカルボジイミド、ジメチルカルボジイミド、ジイソブチルカルボジイミド、ジオクチルカルボジイミド、t-ブチルイソプロピルカルボジイミド、ジフェニルカルボジイミド、ジ-t-ブチルカルボジイミド、ジ-β-ナフチルカルボジイミド、N,N’-ジ-2,6-ジイソプロピルフェニルカルボジイミド、2,6,2’,6’-テトライソプロピルジフェニルカルボジイミド、環状カルボジイミド、カルボジライト(登録商標:日清紡ケミカル(株)製)、及びスタバクゾール(登録商標:LANXESS Deutschland GmbH製)等のポリカルボジイミド等が挙げられる。これらのカルボジイミド化合物は、1種単独又は2種以上を適宜混合して使用することも可能である。
エチレン性不飽和基を有する化合物としては、1分子中に1個以上のエチレン性不飽和基を有する化合物であれば、特に限定されず、一般に公知のものを使用できる。例えば、(メタ)アクリロイル基、及びビニル基等を有する化合物が挙げられる。
樹脂組成物には、塗膜性や耐熱性等の諸特性を向上させるために、充填材を更に含むことができる。充填材としては、絶縁性を有し、波長405nm(h線)に対する透過性を阻害しないものであることが好ましい。充填材としては、例えば、シリカ(天然シリカ、溶融シリカ、アモルファスシリカ、及び中空シリカ等)、アルミニウム化合物(ベーマイト、水酸化アルミニウム、アルミナ、及び窒化アルミニウム等)、ホウ素化合物(窒化ホウ素等)、マグネシウム化合物(酸化マグネシウム、及び水酸化マグネシウム等)、カルシウム化合物(炭酸カルシウム等)、モリブデン化合物(酸化モリブデン、及びモリブデン酸亜鉛等)、バリウム化合物(硫酸バリウム、及びケイ酸バリウム等)、タルク(天然タルク、及び焼成タルク等)、マイカ、ガラス(短繊維状ガラス、球状ガラス、微粉末ガラス、Eガラス、Tガラス、及びDガラス等)、シリコーンパウダー、フッ素樹脂系充填材、ウレタン樹脂系充填材、(メタ)アクリル樹脂系充填材、ポリエチレン系充填材、スチレン・ブタジエンゴム、並びにシリコーンゴム等が挙げられる。これらの充填材は、1種単独又は2種以上を適宜混合して使用することも可能である。
これらの充填材は、後述のシランカップリング剤等で表面処理されていてもよい。
樹脂組成物には、充填材の分散性、並びにポリマー及び/又は樹脂と、充填材との接着強度を向上させるために、シランカップリング剤及び/又は湿潤分散剤を併用することも可能である。
これらのシランカップリング剤としては、一般に無機物の表面処理に使用されているシランカップリング剤であれば、特に限定されない。具体例としては、例えば、3-アミノプロピルトリメトキシシラン、3-アミノプロピルトリエトキシシラン、3-アミノプロピルジメトキシメチルシラン、3-アミノプロピルジエトキシメチルシラン、N-(2-アミノエチル)-3-アミノプロピルトリメトキシラン、N-(2-アミノエチル)-3-アミノプロピルトリエトキシシラン、N-(2-アミノエチル)-3-アミノプロピルジメトキシメチルシラン、N-(2-アミノエチル)-3-アミノプロピルジエトキシメチルシラン、N-フェニル-3-アミノプロピルトリメトキシシラン、N-フェニル-3-アミノプロピルトリエトキシシラン、[3-(6-アミノヘキシルアミノ)プロピル]トリメトキシシラン、及び[3-(N,N-ジメチルアミノ)-プロピル]トリメトキシシランなどのアミノシラン系;3-グリシドキシプロピルトリメトキシシラン、3-グリシドキシプロピルトリエトキシシラン、3-グリシドキシプロピルジメトキシメチルシラン、3-グリシドキシプロピルジエトキシメチルシラン、2-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン、及び[8-(グリシジルオキシ)-n-オクチル]トリメトキシシランなどのエポキシシラン系;ビニルトリス(2-メトキシエトキシ)シラン、ビニルトリメトキシシラン、ビニルトリエトキシシラン、ジメトキシメチルビニルシラン、ジエトキシメチルビニルシラン、トリメトキシ(7-オクテン-1-イル)シラン、及びトリメトキシ(4-ビニルフェニル)シランなどのビニルシラン系;3-メタクリロキシプロピルトリメトキシシラン、3-メタクリロキシプロピルトリエトキシシラン、3-メタクリロキシプロピルジメトキシメチルシラン、3-メタクリロキシプロピルジエトキシメチルシランなどのメタクリルシラン系、3-アクリロキシプロピルトリメトキシシラン、及び3-アクリロキシプロピルトリエトキシシランなどのアクリルシラン系;3-イソシアネートプロピルトリメトキシシラン、及び3-イソシアネートプロピルトリエトキシシランなどのイソシアネートシラン系;トリス-(トリメトキシシリルプロピル)イソシアヌレートなどのイソシアヌレートシラン系;3-メルカプトプロピルトリメトキシシラン、及び3-メルカプトプロピルジメトキシメチルシランなどのメルカプトシラン系;3-ウレイドプロピルトリエトキシシランなどのウレイドシラン系;p-スチリルトリメトキシシランなどのスチリルシラン系;N-[2-(N-ビニルベンジルアミノ)エチル]-3-アミノプロピルトリメトキシシラン塩酸塩などのカチオニックシラン系;[3-(トリメトキシシリル)プロピル]コハク酸無水物などの酸無水物系;フェニルトリメトキシシラン、フェニルトリエトキシシラン、ジメトキシメチルフェニルシラン、ジエトキシメチルフェニルシラン、及びp-トリルトリメトキシシランなどのフェニルシラン系;トリメトキシ(1-ナフチル)シランなどのアリールシラン系が挙げられる。これらのシランカップリング剤は、1種単独又は2種以上を適宜混合して使用することも可能である。
湿潤分散剤としては、塗料用に使用されている分散安定剤であれば、特に限定されない。具体例としては、例えば、ビッグケミー・ジャパン(株)製のDISPERBYK(登録商標)-110(商品名)、111(商品名)、118(商品名)、180(商品名)、161(商品名)、BYK(登録商標)-W996(商品名)、W9010(商品名)、及びW903(商品名)等の湿潤分散剤が挙げられる。これらの湿潤分散剤は、1種単独又は2種以上を適宜混合して使用することも可能である。
樹脂組成物において、湿潤分散剤の合計の含有量は、樹脂組成物中の樹脂固形分100質量部に対して、通常0.1~10質量部である。
樹脂組成物には、必要に応じて、有機溶剤を含有していてもよい。有機溶剤を用いると、樹脂組成物の調製時における粘度を調整することができる。有機溶剤の種類は、樹脂組成物中の樹脂の一部又は全部を溶解可能なものであれば、特に限定されない。具体例としては、例えば、アセトン、メチルエチルケトン、及びメチルイソブチルケトン等のケトン類;シクロペンタノン、及びシクロヘキサノン等の脂環式ケトン類;プロピレングリコールモノメチルエーテル、及びプロピレングリコールモノメチルエーテルアセテート等のセロソルブ系溶媒;乳酸エチル、酢酸メチル、酢酸エチル、酢酸ブチル、酢酸イソアミル、乳酸エチル、メトキシプロピオン酸メチル、ヒドロキシイソ酪酸メチル、及びγ―ブチロラクトン等のエステル系溶媒;ジメチルアセトアミド、及びジメチルホルムアミド等のアミド類などの極性溶剤類;トルエン、及びキシレン等の芳香族炭化水素等の無極性溶剤が挙げられる。
これらの有機溶剤は、1種単独又は2種以上を適宜混合して使用することも可能である。
樹脂組成物には、本実施形態の特性が損なわれない範囲において、これまでに挙げられていない熱硬化性樹脂、熱可塑性樹脂、及びそのオリゴマー、並びにエラストマー類等の種々の高分子化合物;これまでに挙げられていない難燃性の化合物;添加剤等の併用も可能である。これらは一般に使用されているものであれば、特に限定されない。例えば、難燃性の化合物では、メラミン及びベンゾグアナミン等の窒素含有化合物、リン系化合物のホスフェート化合物、芳香族縮合リン酸エステル、並びに含ハロゲン縮合リン酸エステル等が挙げられる。添加剤としては、紫外線吸収剤、酸化防止剤、蛍光増白剤、光増感剤、染料、顔料、増粘剤、滑剤、消泡剤、表面調整剤、光沢剤、重合禁止剤、及び硬化促進剤等が挙げられる。これらの成分は、1種単独又は2種以上を適宜混合して使用することも可能である。
樹脂組成物において、その他の成分の含有量は、通常、樹脂組成物中の樹脂固形分100質量部に対して、それぞれ0.1~10質量部である。
樹脂組成物は、マレイミド化合物(A)、光硬化開始剤(B)と、必要に応じて、マレイミド化合物(A)以外の、樹脂又は化合物、充填材、その他の成分、及び添加剤等を適宜混合することにより調製される。樹脂組成物は、後述する本実施形態の樹脂シートを作製する際のワニスとして、好適に使用することができる。なお、ワニスの調製に使用する有機溶媒は、特に限定されず、その具体例は、前記したとおりである。
樹脂組成物は、絶縁性の樹脂組成物が必要とされる用途に使用することができ、特に限定されない。例えば、感光性フィルム、支持体付き感光性フィルム、プリプレグ、樹脂シート、回路基板(積層板用途、及び多層プリント配線板用途等)、ソルダーレジスト、アンダーフィル材、ダイボンディング材、半導体封止材、穴埋め樹脂、及び部品埋め込み樹脂等の用途に使用することができる。それらの中でも、樹脂組成物は、光硬化性、耐熱性、及び熱安定性に優れるため、多層プリント配線板の絶縁層用として、及びソルダーレジスト用として好適に使用することができる。
本実施形態の硬化物は、樹脂組成物を硬化させてなる。硬化物は、例えば、樹脂組成物を溶融又は溶媒に溶解させた後、型内に流し込み、熱や光などを用いて通常の条件で硬化させることにより得ることができる。熱硬化の場合、硬化温度は、硬化が効率的に進み、かつ得られる硬化物の劣化を防止する観点から、120~300℃の範囲内が好ましい。光硬化の場合、光の波長領域は、光硬化開始剤等により効率的に硬化が進む100~500nmの範囲で硬化させることが好ましい。
本実施形態の樹脂シートは、支持体と、支持体の片面又は両面に配された樹脂層と、を有し、樹脂層が、樹脂組成物を含む、支持体付き樹脂シートである。樹脂シートは、樹脂組成物を支持体上に塗布、及び乾燥して製造することができる。樹脂シートにおける樹脂層は、優れた絶縁信頼性、耐熱性、及び熱安定性を有する。
樹脂層側を保護フィルムで保護することにより、樹脂層表面へのゴミ等の付着やキズを防止することができる。保護フィルムとしては、樹脂フィルムと同様の材料により構成されたフィルムを用いることができる。保護フィルムの厚さは、1~50μmの範囲であることが好ましく、5~40μmの範囲であることがより好ましい。厚さが1μm未満では、保護フィルムの取り扱い性が低下する傾向にあり、50μmを超えると廉価性に劣る傾向にある。なお、保護フィルムは、樹脂層と支持体との接着力に対して、樹脂層と保護フィルムとの接着力の方が小さいものが好ましい。
塗布方法は、例えば、ロールコーター、コンマコーター、グラビアコーター、ダイコーター、バーコーター、リップコーター、ナイフコーター、及びスクイズコーター等を用いた公知の方法で行うことができる。乾燥は、例えば、60~200℃の乾燥機中で、1~60分加熱させる方法等により行うことができる。
本実施形態の多層プリント配線板は、絶縁層と、絶縁層の片面又は両面に形成された導体層と、を有し、絶縁層が、樹脂組成物を含む。絶縁層は、例えば、樹脂シートを1枚以上重ねて硬化して得ることもできる。絶縁層と導体層のそれぞれの積層数は、目的とする用途に応じて適宜積層数を設定することができる。また、絶縁層と導体層の順番も特に限定されない。導体層としては、各種プリント配線板材料に用いられる金属箔であってもよく、例えば、銅、及びアルミニウム等の金属箔が挙げられる。銅の金属箔としては、圧延銅箔、及び電解銅箔等の銅箔が挙げられる。導体層の厚みは、通常1~100μmである。具体的には、以下の方法により製造することができる。
ラミネート工程では、樹脂シートの樹脂層側を、真空ラミネーターを用いて回路基板の片面又は両面にラミネートする。回路基板としては、例えば、ガラスエポキシ基板、金属基板、セラミック基板、シリコン基板、半導体封止樹脂基板、ポリエステル基板、ポリイミド基板、BTレジン基板、及び熱硬化型ポリフェニレンエーテル基板等が挙げられる。なお、回路基板とは、前記のような基板の片面又は両面にパターン加工された導体層(回路)が形成された基板をいう。また、導体層と絶縁層とを交互に積層してなる多層プリント配線板において、多層プリント配線板の最外層の片面又は両面がパターン加工された導体層(回路)となっている基板も回路基板に含まれる。なお、この多層プリント配線板に積層されている絶縁層は、本実施形態の樹脂シートを1枚以上重ねて硬化して得られた絶縁層であってもよく、本実施形態の樹脂シートと、本実施形態の樹脂シートと異なる公知の樹脂シートとをそれぞれ1枚以上重ねて得られた絶縁層であってもよい。なお、本実施形態の樹脂シートと、本実施形態の樹脂シートと異なる公知の樹脂シートとの重ね方は、特に限定されない。導体層表面には、黒化処理、及び/又は銅エッチング等により予め粗化処理が施されていてもよい。ラミネート工程において、樹脂シートが保護フィルムを有している場合には、保護フィルムを剥離除去した後、必要に応じて樹脂シート及び回路基板をプレヒートし、樹脂シートの樹脂層を加圧及び加熱しながら回路基板に圧着する。本実施形態においては、真空ラミネート法により減圧下で回路基板に樹脂シートの樹脂層をラミネートする方法が好適に用いられる。
露光工程では、ラミネート工程により、回路基板上に樹脂層が設けられた後、樹脂層の所定部分に光源として、活性エネルギー線を照射し、照射部の樹脂層を硬化させる。
照射は、マスクパターンを通してもよいし、直接照射する直接描画法を用いてもよい。活性エネルギー線としては、例えば、紫外線、可視光線、電子線、及びX線等が挙げられる。活性エネルギー線の波長としては、例えば、200~600nmの範囲である。紫外線を用いる場合、その照射量はおおむね10~1000mJ/cm2である。また、直接描画露光法を用いて高密度で高精細な配線形成(パターン)を有するプリント配線板を製造するに際しては、活性エネルギー線として、例えば、波長405nm(h線)を含む活性エネルギー線を用いることが好ましい。波長405nm(h線)を含む活性エネルギー線を用いた場合、その照射量は、おおむね10~10,000mJ/cm2である。
マスクパターンを通す露光方法には、マスクパターンを多層プリント配線板に密着させて行う接触露光法と、密着させずに平行光線を使用して露光する非接触露光法とがあるが、どちらを用いてもかまわない。また、樹脂層上に支持体が存在している場合は、支持体上から露光してもよいし、支持体を剥離後に露光してもよい。
樹脂層上に支持体が存在していない場合には、露光工程後、ウエット現像にて光硬化されていない部分(未露光部)を除去し、現像することにより、絶縁層のパターンを形成することができる。
また、樹脂層上に支持体が存在している場合には、露光工程後、その支持体を除去した後に、ウエット現像にて光硬化されていない部分(未露光部)を除去し、現像することにより、絶縁層のパターンを形成することができる。
本実施形態では、現像工程終了後、ポストベーク工程を行い、絶縁層(硬化物)を形成する。ポストベーク工程としては、高圧水銀ランプによる紫外線照射工程やクリーンオーブンを用いた加熱工程等が挙げられ、これらを併用することも可能である。紫外線を照射する場合は、必要に応じてその照射量を調整することができ、例えば、50~10,000mJ/cm2程度の照射量で照射を行うことができる。また加熱の条件は、必要に応じて適宜選択できるが、好ましくは150~220℃で20~180分間の範囲、より好ましくは160~200℃で30~150分間の範囲で選択される。
絶縁層(硬化物)を形成後、乾式めっきにより絶縁層表面に導体層を形成する。乾式めっきとしては、蒸着法、スパッタリング法、及びイオンプレーティング法等の公知の方法を使用することができる。蒸着法(真空蒸着法)は、例えば、多層プリント配線板を真空容器内に入れ、金属を加熱蒸発させることにより、絶縁層上に金属膜を形成することができる。スパッタリング法も、例えば、多層プリント配線板を真空容器内に入れ、アルゴン等の不活性ガスを導入し、直流電圧を印加して、イオン化した不活性ガスをターゲット金属に衝突させ、叩き出された金属により絶縁層上に金属膜を形成することができる。
本実施形態の半導体装置は、樹脂組成物を含む。具体的には、以下の方法により製造することができる。多層プリント配線板の導通箇所に、半導体チップを実装することにより半導体装置を製造することができる。ここで、導通箇所とは、多層プリント配線板における電気信号を伝える箇所のことであって、その場所は表面であっても、埋め込まれた箇所であってもよい。また、半導体チップは、半導体を材料とする電気回路素子であれば特に限定されない。
反応溶液を一部分取し、水と、酢酸エチルとを加えて振盪した。その後、有機層を取り出して、硫酸マグネシウムで乾燥した。上澄みを40℃で溶媒留去し、黄色オイルを得た。1H-NMR測定を行い、式(25)で表されるMA-TMDAであることを確認した。
式(25)で表されるMA-TMDAの1H-NMRの帰属を以下に示す。また、1H-NMRチャートを図1に示す。
前記の反応溶液に、p-トルエンスルホン酸一水和物0.67g(3.5mmol)を加え、127℃で2.5時間加熱還流した。室温まで冷却した後、冷却後の反応溶液を、飽和炭酸水素ナトリウム水溶液50mLと、酢酸エチル100mLとの混合溶液に攪拌しながら注いだ。更に、水100mLと、酢酸エチル100mLとを加えて撹拌し、5分間静置した。その後、分液し、水層を酢酸エチル50mLで3回抽出した。有機層を全て合わせて、水100mLで1回、飽和食塩水10mLで1回、飽和食塩水5mLで2回洗浄した。硫酸マグネシウムで乾燥して、固体分を濾別した後、40℃で溶媒留去し、黄色固体を得た。
得られた黄色固体をアセトン6.5mLに溶解させ、アセトン溶液を水300mLに注いだ。析出した固体をろ取し、少量のイソプロピルアルコール(IPA)で洗浄した後、50℃で20時間減圧乾燥して黄色固体5.71gを得た。1H-NMR測定を行い、式(2)で表されるマレイミド化合物(TMDM)であること確認した。
式(2)で表されるTMDMの1H-NMRの帰属を以下に示す。また、1H-NMRチャートを図2に示す。
〔透過率及び吸光度〕
マレイミド化合物(A)として合成例1で得られたTMDMを用いて、このTMDMが1質量%で含まれるクロロホルム溶液を調製し、UV-vis測定装置((株)日立ハイテクサイエンス製、日立分光光度計 U-4100)を用いて、波長405nmにおける透過率の測定を行った。
同様に、他のマレイミド化合物として日本化薬(株)製MIZ-001(商品名、質量平均分子量(Mw):3000)を用いて、波長405nmにおける透過率の測定を行った。
同様に、マレイミド化合物(ケイ・アイ化成(株)社製BMI-80(商品名))を用いて、波長405nmにおける透過率の測定を行った。
同様に、光硬化開始剤として、2-ベンジル-2-ジメチルアミノ-1-(4-モルフォリノフェニル)-ブタノン-1(IGM ResinsB.V.製Omnirad(登録商標)369)、及び2-メチル-1-[4-(メチルチオ)フェニル]-2-モルフォリノプロパン-1-オン(IGM ResinsB.V.製Omnirad(登録商標)907)を用いて、0.01質量%クロロホルム溶液の波長405nmにおける吸光度の測定を行った。
結果を表1に示す。
(樹脂組成物及び樹脂シートの作製)
マレイミド化合物(A)として合成例1で得られたTMDM90質量部と、光硬化開始剤(B)としてビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド(IGM Resins B.V.製、Omnirad(登録商標)819)10質量部とを混合し、メチルエチルケトン(出光興産(株)製)100質量部で希釈した後、超音波ホモジナイザーで攪拌してワニスを得た。このワニスを厚さ38μmのPETフィルム(ユニチカ(株)製、ユニピール(登録商標)TR1-38(商品名))上に自動塗工装置(テスター産業(株)製、PI-1210(商品名))を用いて塗布し、90℃で5分間加熱乾燥して、PETフィルムを支持体とし樹脂層の厚さが30μmである樹脂シートを得た。
得られた樹脂シート2枚を樹脂面が向かい合うように積層し、真空ラミネーター(ニッコー・マテリアルズ(株)製、CVP-600(商品名))を用いて、30秒間真空引き(到達圧力5.0kPa以下)を行った後、圧力10kgf/cm2、温度70℃で30秒間の積層成形を行った。さらに圧力10kgf/cm2、温度70℃で60秒間の積層成形を行うことで、両面に支持体を有する評価用積層体を得た。
マレイミド化合物(A)としてTMDM72質量部と、他のマレイミド化合物として日本化薬(株)製MIZ-001(商品名)18質量部と、光硬化開始剤(B)としてビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド(IGM Resins B.V.製、Omnirad(登録商標)819)10質量部とを混合し、メチルエチルケトン(出光興産(株)製)100質量部で希釈した後、超音波ホモジナイザーで攪拌してワニスを得た。得られたワニスを用い、実施例1と同様にして、樹脂シート及び評価用積層体を得た。
マレイミド化合物(A)としてTMDM54質量部と、他のマレイミド化合物として日本化薬(株)製MIZ-001(商品名)36質量部と、光硬化開始剤(B)としてビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド(IGM Resins B.V.製、Omnirad(登録商標)819)10質量部とを混合し、メチルエチルケトン(出光興産(株)製)100質量部で希釈した後、超音波ホモジナイザーで攪拌してワニスを得た。得られたワニスを用い、実施例1と同様にして、樹脂シート及び評価用積層体を得た。
マレイミド化合物(A)としてTMDM36質量部と、他のマレイミド化合物として日本化薬(株)製MIZ-001(商品名)54質量部と、光硬化開始剤(B)としてビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド(IGM Resins B.V.製、Omnirad(登録商標)819)10質量部とを混合し、メチルエチルケトン(出光興産(株)製)100質量部で希釈した後、超音波ホモジナイザーで攪拌してワニスを得た。得られたワニスを用い、実施例1と同様にして、樹脂シート及び評価用積層体を得た。
マレイミド化合物(A)としてTMDM18質量部と、他のマレイミド化合物として日本化薬(株)製MIZ-001(商品名)72質量部と、光硬化開始剤(B)としてビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド(IGM Resins B.V.製、Omnirad(登録商標)819)10質量部とを混合し、メチルエチルケトン(出光興産(株)製)100質量部で希釈した後、超音波ホモジナイザーで攪拌してワニスを得た。得られたワニスを用い、実施例1と同様にして、樹脂シート及び評価用積層体を得た。
光硬化開始剤として、Omnirad(登録商標)819の代わりに、Omnirad(登録商標)369を10質量部用いた以外は、実施例1と同様にして、樹脂シート得た。これを用いて、実施例1と同様にして、評価用積層体を得た。
光硬化開始剤として、Omnirad(登録商標)819の代わりに、Omnirad(登録商標)907を10質量部用いた以外は、実施例1と同様にして、樹脂シート得た。これを用いて、実施例1と同様にして、評価用積層体を得た。
マレイミド化合物(A)(合成例1で得られたTMDM)の代わりに、マレイミド化合物(ケイ・アイ化成(株)製BMI-80(商品名))を90質量部用いた以外は、実施例1と同様にして、樹脂シート得た。これを用いて、実施例1と同様にして、評価用積層体を得た。
TrisP-PA型エポキシアクリレート(日本化薬(株)製、KAYARAD(登録商標)ZCR-6007H、不揮発分65質量%、酸価:70mgKOH/g)116.9質量部(不揮発分換算で76質量部)と、ジペンタエリスリトールヘキサアクリレート(日本化薬(株)製、KAYARAD(登録商標)DPHA)16質量部と、光硬化開始剤(B)としてOmnirad(登録商標)819を8質量部とを混合し、メチルエチルケトン(出光興産(株)製)100質量部で希釈した後、超音波ホモジナイザーで攪拌してワニスを得た。このワニスを厚さ38μmのPETフィルム(ユニチカ(株)製、ユニピール(登録商標)TR1-38(商品名))上に自動塗工装置(テスター産業(株)、PI-1210製)を用いて塗布し、80℃で7分間加熱乾燥して、PETフィルムを支持体とし樹脂層の厚さが30μmである樹脂シートを得た。これを用いて、実施例1と同様にして、評価用積層体を得た。
ビスフェノールF型エポキシアクリレート(日本化薬(株)製、KAYARAD(登録商標)ZFR-1553H、不揮発分68質量%、酸価:70mgKOH/g)105.9質量部(不揮発分換算で72質量部)と、ジペンタエリスリトールヘキサアクリレート(日本化薬(株)製、KAYARAD(登録商標)DPHA)19質量部と、光硬化開始剤(B)としてOmnirad(登録商標)819を9質量部とを混合し、メチルエチルケトン(出光興産(株)製)100質量部で希釈した後、超音波ホモジナイザーで攪拌してワニスを得た。このワニスを厚さ38μmのPETフィルム(ユニチカ(株)製、ユニピール(登録商標)TR1-38(商品名))上に自動塗工装置(テスター産業(株)、PI-1210製)を用いて塗布し、80℃で7分間加熱乾燥して、PETフィルムを支持体とし樹脂層の厚さが30μmである樹脂シートを得た。これを用いて、実施例1と同様にして、評価用積層体を得た。
上記方法で作製した評価用積層体を用いて、以下の方法により評価した。それらの結果を表2に示す。
波長405nm(h線)を含む活性エネルギー線を照射可能な光源(ユーヴィックス(株)製Omnicure(登録商標) S2000(商品名))を付属したフォトDSC(ティー・エイ・インスツルメント・ジャパン(株)製DSC-2500(商品名))を用い、得られた評価用積層体に照度30mW、露光時間3.5分間照射して、横軸が時間(sec)、及び縦軸がヒートフロー(mW)のグラフを得た。このグラフの終点から、水平に線を引いた際のピーク面積をエンタルピー(J/g)とした。光硬化性は、以下の基準に従って評価した。
「AA」:エンタルピーが1(J/g)以上であった。
「CC」:エンタルピーが1(J/g)未満であった。
光硬化性試験にて光硬化した評価用積層体を180℃で120分間加熱処理し、その後、支持体であるPETフィルムを両面共に剥離して評価用硬化物を得た。
得られた評価用硬化物について、示差熱質量同時測定装置((株)日立ハイテクサイエンス製、TG/DTA6200(商品名))を用い、測定開始温度20℃、終了温度500℃、及び昇温速度10℃/分の条件で、窒素雰囲気下にて質量を測定した。質量減少率が5%となった温度を熱安定性(℃)として評価した。
Claims (8)
- 前記マレイミド化合物(A)の含有量が、前記マレイミド化合物(A)及び前記光硬化開始剤(B)の合計100質量部に対して、50~99.9質量部である、請求項1又は2に記載の樹脂組成物。
- 支持体と、
前記支持体の片面又は両面に配された樹脂層と、を有し、
前記樹脂層が、請求項1~4のいずれか一項に記載の樹脂組成物を含む、
樹脂シート。 - 前記樹脂層の厚さが1~50μmである、請求項5に記載の樹脂シート。
- 絶縁層と、
前記絶縁層の片面又は両面に形成された導体層と、を有し、
前記絶縁層が、請求項1~4のいずれか一項に記載の樹脂組成物を含む、
多層プリント配線板。 - 請求項1~4のいずれか一項に記載の樹脂組成物を含む、半導体装置。
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JP (1) | JP6886133B1 (ja) |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020033471A (ja) * | 2018-08-30 | 2020-03-05 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板及び半導体装置 |
WO2022264987A1 (ja) * | 2021-06-15 | 2022-12-22 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
CN117355545A (zh) * | 2021-06-15 | 2024-01-05 | 三菱瓦斯化学株式会社 | 树脂组合物、树脂片、多层印刷电路板及半导体装置 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4940231A (ja) | 1972-08-26 | 1974-04-15 | ||
JPS5952660A (ja) | 1982-09-20 | 1984-03-27 | Fujitsu Ltd | インクジエツトプリンタ |
JP2005062450A (ja) | 2003-08-12 | 2005-03-10 | Kyocera Chemical Corp | 感光性熱硬化型樹脂組成物 |
JP2010204298A (ja) | 2009-03-02 | 2010-09-16 | Hitachi Chem Co Ltd | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線用基板 |
JP2011153248A (ja) * | 2010-01-28 | 2011-08-11 | Dic Corp | 硬化性樹脂組成物、その硬化物、及びプラスチックレンズ |
WO2018056466A1 (ja) | 2016-09-26 | 2018-03-29 | 日立化成株式会社 | 樹脂組成物、半導体用配線層積層体及び半導体装置 |
CN108219134A (zh) * | 2018-01-10 | 2018-06-29 | 苏州生益科技有限公司 | 一种改性复合双马来酰亚胺树脂的预聚物、树脂组合物及使用其制作的半固化片及层压板 |
JP2019122162A (ja) | 2018-01-09 | 2019-07-22 | アイシン精機株式会社 | コジェネレーション装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI329214B (en) | 2003-12-18 | 2010-08-21 | Sharp Kk | Display element and display device, driving method of display element, and program |
JP6317253B2 (ja) * | 2012-05-17 | 2018-04-25 | 太陽インキ製造株式会社 | 液状現像型のマレイミド組成物、プリント配線板 |
KR20150026557A (ko) * | 2013-09-03 | 2015-03-11 | 삼성전기주식회사 | 인쇄회로기판용 절연 수지 조성물 및 이를 이용한 제품 |
WO2016194927A1 (ja) * | 2015-06-02 | 2016-12-08 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板 |
CN107848261A (zh) * | 2015-07-24 | 2018-03-27 | 拓自达电线株式会社 | 带树脂的铜箔、及印刷电路板 |
JP2018189851A (ja) * | 2017-05-09 | 2018-11-29 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物および電子部品 |
KR102635354B1 (ko) * | 2019-04-02 | 2024-02-07 | 닛뽄 가야쿠 가부시키가이샤 | 비스말레이미드 화합물 및 그의 제조 방법, 그리고 그것을 이용한 감광성 수지 조성물, 그의 경화물 및 반도체 소자 |
-
2020
- 2020-06-26 KR KR1020217027587A patent/KR102379256B1/ko active IP Right Grant
- 2020-06-26 US US17/621,918 patent/US11447658B2/en active Active
- 2020-06-26 WO PCT/JP2020/025142 patent/WO2020262580A1/ja unknown
- 2020-06-26 JP JP2020555246A patent/JP6886133B1/ja active Active
- 2020-06-26 EP EP20832460.8A patent/EP3950334B1/en active Active
- 2020-06-26 CN CN202080032908.4A patent/CN113795522B/zh active Active
- 2020-06-29 TW TW109121903A patent/TWI771702B/zh active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4940231A (ja) | 1972-08-26 | 1974-04-15 | ||
JPS5952660A (ja) | 1982-09-20 | 1984-03-27 | Fujitsu Ltd | インクジエツトプリンタ |
JP2005062450A (ja) | 2003-08-12 | 2005-03-10 | Kyocera Chemical Corp | 感光性熱硬化型樹脂組成物 |
JP2010204298A (ja) | 2009-03-02 | 2010-09-16 | Hitachi Chem Co Ltd | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線用基板 |
JP2011153248A (ja) * | 2010-01-28 | 2011-08-11 | Dic Corp | 硬化性樹脂組成物、その硬化物、及びプラスチックレンズ |
WO2018056466A1 (ja) | 2016-09-26 | 2018-03-29 | 日立化成株式会社 | 樹脂組成物、半導体用配線層積層体及び半導体装置 |
JP2019122162A (ja) | 2018-01-09 | 2019-07-22 | アイシン精機株式会社 | コジェネレーション装置 |
CN108219134A (zh) * | 2018-01-10 | 2018-06-29 | 苏州生益科技有限公司 | 一种改性复合双马来酰亚胺树脂的预聚物、树脂组合物及使用其制作的半固化片及层压板 |
Non-Patent Citations (2)
Title |
---|
ANONZMOUS: "UV-LED 29", SAGA-ITC.JP, 2018, pages 69 - 74, XP055778988, Retrieved from the Internet <URL:https://www.saga-itc.jp/var/rev0/0004/2854/10_sigaisen_koukagata_suisei_toryou.pdf> * |
I. M. BROWN AND T. C. SANDRECZKI: "Cross-linking reactions in Maleimide and Bis(maleimide) polymers. An ESR study", MACROMOLECULES, vol. 23, no. 1, 1990, pages 94 - 100, XP055778979 * |
Cited By (6)
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JP2020033471A (ja) * | 2018-08-30 | 2020-03-05 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板及び半導体装置 |
JP7212301B2 (ja) | 2018-08-30 | 2023-01-25 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板及び半導体装置 |
WO2022264987A1 (ja) * | 2021-06-15 | 2022-12-22 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
JPWO2022264987A1 (ja) * | 2021-06-15 | 2022-12-22 | ||
JP7305110B2 (ja) | 2021-06-15 | 2023-07-10 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
CN117355545A (zh) * | 2021-06-15 | 2024-01-05 | 三菱瓦斯化学株式会社 | 树脂组合物、树脂片、多层印刷电路板及半导体装置 |
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US11447658B2 (en) | 2022-09-20 |
KR20210111346A (ko) | 2021-09-10 |
CN113795522B (zh) | 2022-08-12 |
EP3950334A1 (en) | 2022-02-09 |
JPWO2020262580A1 (ja) | 2021-09-13 |
KR102379256B1 (ko) | 2022-03-25 |
EP3950334B1 (en) | 2023-08-16 |
TW202108666A (zh) | 2021-03-01 |
JP6886133B1 (ja) | 2021-06-16 |
CN113795522A (zh) | 2021-12-14 |
EP3950334A4 (en) | 2022-06-01 |
TWI771702B (zh) | 2022-07-21 |
US20220204810A1 (en) | 2022-06-30 |
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