WO2020259462A1 - 柔性基板、其制备方法、显示面板及显示装置 - Google Patents
柔性基板、其制备方法、显示面板及显示装置 Download PDFInfo
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- WO2020259462A1 WO2020259462A1 PCT/CN2020/097575 CN2020097575W WO2020259462A1 WO 2020259462 A1 WO2020259462 A1 WO 2020259462A1 CN 2020097575 W CN2020097575 W CN 2020097575W WO 2020259462 A1 WO2020259462 A1 WO 2020259462A1
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- Prior art keywords
- organic layer
- flexible substrate
- elastic conductor
- metal
- sub
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- 238000002360 preparation method Methods 0.000 title abstract description 12
- 239000004020 conductor Substances 0.000 claims abstract description 159
- 239000012044 organic layer Substances 0.000 claims abstract description 145
- 229910052751 metal Inorganic materials 0.000 claims abstract description 143
- 239000002184 metal Substances 0.000 claims abstract description 143
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 239000010410 layer Substances 0.000 claims abstract description 52
- 238000000034 method Methods 0.000 claims description 19
- 239000002070 nanowire Substances 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims description 3
- 239000002042 Silver nanowire Substances 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000002105 nanoparticle Substances 0.000 claims description 3
- 239000002071 nanotube Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 229910002846 Pt–Sn Inorganic materials 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000005452 bending Methods 0.000 description 21
- 238000001723 curing Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910015844 BCl3 Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- the embodiments of the present disclosure relate to a flexible substrate, a preparation method thereof, a display panel, and a display device.
- OLED Organic Light-Emitting Diode, organic light-emitting diode
- the method to realize the bendable flexible screen is usually to set an island (display area) on the flexible substrate and a bridge connecting every two adjacent islands.
- the island is used to set the pixel structure, and the bridge has a structure to connect adjacent pixels.
- the connection wires (usually metal wires) that transmit signals or currents, when the screen is bent, deform the patterned bridges between the islands to realize the change of the relative positions between the islands.
- the embodiments of the present disclosure provide a flexible substrate, a preparation method thereof, a display panel and a display device.
- At least one embodiment of the present disclosure provides a flexible substrate including: a flexible substrate including a plurality of display areas distributed in an array and a bridge connecting every two adjacent display areas, wherein each The display area is configured to provide a pixel structure; each of the bridges includes a buffer layer, a first organic layer, a wiring layer, a second organic layer, and an inorganic layer arranged in sequence, wherein the wiring layer has wires; and Within at least part of the length of the wire, along the direction in which the wire extends, the wire includes alternately arranged metal segments and elastic conductor segments.
- the bridge includes a bent portion and a straight extension portion, wherein the wire portion in the bent portion includes the metal segments and the elastic conductor segments that are alternately arranged, and the wire portion in the straight extension portion is composed of a continuous metal wire. constitute.
- the end of the metal segment extends into the elastic conductor segment.
- the cross-sectional area of the elastic conductor segment is larger than the cross-sectional area of the metal segment.
- the cross-sectional area of the elastic conductor segment is 3.5 to 4.5 times the cross-sectional area of the metal segment.
- the elastic conductor segment includes an organic conductor and conductive particles distributed in the organic conductor.
- the organic conductor includes at least one of conductive rubber and conductive resin; and the conductive particles include silver nanoparticles, gold nanoparticles, silver nanowires, Ir-Sn nanowires, Ir-Ag nanotubes, Pt -At least one of Sn nanowires and zinc nanowires.
- the ratio of the size of the metal segment to the size of the elastic conductor segment ranges from 0.9 to 1.5.
- the size of the metal segment ranges from 1.0 to 6.0 ⁇ m, and the size of the elastic conductor segment ranges from 1.0 to 6.0 ⁇ m; along the direction perpendicular to the extending direction of the wire, and In the direction perpendicular to the arrangement direction of the first organic layer and the second organic layer, the size of the metal segment ranges from 1.0 to 6.0 ⁇ m, and the size of the elastic conductor segment is 2.4 to 4 ⁇ m; and In the arrangement direction of the first organic layer and the second organic layer, the size of the metal segment ranges from 300 to 1200 nm, and the size of the elastic conductor segment ranges from 1.2 to 2.4 ⁇ m.
- At least one embodiment of the present disclosure further provides a method for preparing a flexible substrate, including: providing a flexible substrate, the flexible substrate is formed with a plurality of arrayed display areas; between every two adjacent display areas A bridge area is formed; a buffer layer and a first organic layer are sequentially formed on the portion of the flexible substrate corresponding to the bridge area; a plurality of groups of metal segments are formed on the first organic layer, wherein each group of the metal
- the segment includes a plurality of metal segments spaced apart along the extension direction of the bridge area; forming a first sub-organic layer on the first organic layer, wherein the first sub-organic layer covers each group of the metal segments; In each group of the metal segments, the part of the first sub-organic layer between every two adjacent metal segments is removed to form a first groove; an elastic conductor segment is formed in the first groove to Connecting two adjacent metal segments; forming a second sub-organic layer on the surface of the first sub-organic layer, the second sub-organic layer covering the elastic conductor segment
- the first organic layer is over-etched to form an undercut structure at both ends of the bridge region of the metal segment in the extending direction.
- the size of the first groove ranges from 1.0 to 6.0 ⁇ m; along a direction perpendicular to the extension direction of the wire, and is connected to the first organic layer and the A direction perpendicular to the arrangement direction of the second organic layer, the size of the first groove is 2.4 to 4 ⁇ m; and along the arrangement direction of the first organic layer and the second organic layer, the first groove The size of the groove ranges from 1.2 to 2.4 ⁇ m.
- the embodiment of the present disclosure further provides a method for preparing a flexible substrate, including: providing a flexible substrate, the flexible substrate is formed with a plurality of arrayed display areas; a bridge area is formed between every two adjacent display areas Forming a buffer layer and a first organic layer in sequence on the portion of the flexible substrate corresponding to the bridge area; forming multiple groups of elastic conductor segments on the first organic layer, wherein each group of the elastic conductor segments includes A plurality of elastic conductor segments spaced apart along the extension direction of the bridge region; forming a third sub-organic layer on the first organic layer, wherein the third sub-organic layer covers each group of the elastic conductor segments; In each group of the elastic conductor segments, the third sub-organic layer portion between every two adjacent elastic conductor segments is removed to form a second groove; a metal segment is formed in the second groove, To connect two adjacent elastic conductor segments; forming a fourth sub-organic layer on the surface of the third sub-organic layer, the fourth sub-organic layer covering the metal segment,
- An embodiment of the indication of the present disclosure also provides a display panel including the flexible substrate.
- An embodiment of the indication of the present disclosure also provides a display device including the display panel.
- 1A is a schematic diagram of a partial structure of a flexible substrate provided by an embodiment of the application.
- Figure 1B is a pixel structure in a display unit
- Figure 2 is a partial enlarged view of A in Figure 1A;
- FIG. 3 is a schematic diagram of the state before and after the wire in the flexible substrate is bent after being stressed
- Figure 4 is a cross-sectional view in the direction of B-B in Figure 2;
- Figure 5 is a cross-sectional view in the direction of C-C in Figure 2;
- Figure 6 is an enlarged view of a top view of a metal segment in Figure 4.
- FIG. 7 is a schematic diagram of the structure formed after the S100 step in the flexible substrate preparation method provided by the embodiment of the application.
- FIG. 8 is a schematic diagram of a structure formed after the S200 step in the method for preparing a flexible substrate according to an embodiment of the application;
- FIG. 9 is a schematic diagram of a structure formed after the S300 step in the method for preparing a flexible substrate provided by an embodiment of the application.
- Figure 10 is a top view of Figure 9;
- FIG. 11 is a schematic diagram of the structure formed after the S400 step in the flexible substrate preparation method provided by the embodiment of the application;
- Figure 12 is a top view of Figure 11;
- FIG. 13 is a schematic diagram of a structure formed after the S500 step in the method for preparing a flexible substrate provided by an embodiment of the application;
- Figure 14 is a top view of Figure 13;
- Fig. 15 is an enlarged schematic diagram of the partial structure in Fig. 13;
- Figure 16 is a top view of the first groove in Figure 13;
- FIG. 17 is a schematic diagram of a structure formed after the S600 step in the method for preparing a flexible substrate provided by an embodiment of the application;
- Figure 18 is a top view of Figure 17;
- FIG. 19 is a schematic diagram of a structure formed after the S700 step in the method for preparing a flexible substrate provided by an embodiment of the application;
- Figure 20 is a top view of Figure 19;
- FIG. 21 is a schematic diagram of the structure formed after the S800 step in the flexible substrate preparation method provided by the embodiment of the application.
- the flexible substrate provided by the embodiment of the present application includes: a flexible substrate 300.
- the flexible substrate 300 has a plurality of display areas 100 distributed in an array.
- the display area 100 is used to provide a pixel structure, and the pixel structure may include Multiple pixel units P are as shown in FIG. 1B.
- a bridge 200 is connected between every two adjacent display areas 100. See FIG. 1A. Along the row direction, a bridge 200 is provided between every two adjacent display areas 100. A bridge 200 is provided between every two adjacent display areas 100 in the column direction. There is a bridge 200 between. It should be understood that the number of bridges between every two adjacent display areas 100 is not limited, and it may be one or two or more.
- the bridge 200 includes a buffer layer 220, a first organic layer 230, a wiring layer 24, a second organic layer 250, and an inorganic layer 260 arranged in sequence, wherein the wiring layer 24 has wires 240 therein.
- the wire 240 includes metal segments 241 and elastic conductor segments 242 alternately arranged.
- the buffer layer 220 and the inorganic layer 260 can prevent water vapor from entering the wiring layer 24 to change the conductive properties of the wire 240.
- the bridge 200 since at least a part of the length of the wire 240 includes alternately arranged metal segments 241 and elastic conductor segments 242, when the flexible substrate is bent, the bridge 200 will bend and deform, and the bridge 200 The wire 240 is bent, and the relative position between the two adjacent metal segments 241 is changed by the bending angle of the elastic conductor segment 242.
- the elastic conductor segment 242 has good flexibility and can release the bending bridge 200.
- the tensile or compressive stress caused by the flexible screen avoids the technical problem that the wires 240 in the bridge 200 are prone to cracks due to the bending of the flexible screen; at the same time, the metal section 241 is arranged between the elastic conductor sections 242, because the metal section 241 is relatively elastic
- the conductor segment 242 has a high electrical conductivity, and under the premise that the bridge 200 will not break when the bridge 200 is bent, the alternately distributed part of the metal segment 241 and the elastic conductor segment 242 of the wire 240 in the wiring layer 24 can have better conductivity
- the elastic conductor section 242 and the wiring layer 24 on one side of the first organic layer 230 and the other side of the second organic layer 250 have The adhesiveness is better.
- the elastic conductor segment 242 prevents the conductor from falling off the first organic layer 230 and the second organic layer 250 easily.
- the shape of the bridge 200 is not limited.
- the bridge 200 includes a bent portion and a linear extension.
- the wire 240 in the bent portion includes alternately arranged metal segments 241 and elastic conductor segments 242, and the wire 240 in the linear extension is composed of continuous metal wires. It can also be composed of alternating metal segments 241 and elastic conductor segments 242.
- the bridge 200 includes a bridge connected to the top of the right side of the left display area 100 and opening toward the left display area 100.
- the curved portion N (for example, it can be an arc shape as shown in FIG. 2 or a curved curve of other shapes), which is connected to the bottom end of the right display area 100 and opens toward the curved portion N of the right display area 100 (for example, it can It is an arc shape as shown in FIG. 2, but it can also be a curved curve of other shapes), and a linear extension M connecting the two curved portions N.
- the wire 240 in the bent portion N is curved, and the wire 240 in the linear extension portion M extends along a straight line.
- the wire 240 in the bent portion N includes metal segments 241 and elastic conductor segments 242 alternately arranged.
- the wire 240 in the linear extension M is composed of a continuous metal wire 243.
- the bridge 200 may also adopt the following forms: the bridge 200 has a curved structure as a whole, such as a circular arc or other curved shapes as a whole, and the wires 240 in the bridge 200 are composed of alternately arranged metal segments 241 and elastic
- the conductor segment 242 is constituted.
- the end of the metal segment 241 extends into the elastic conductor segment 242, and the metal segment 241 is more firmly connected to the elastic conductor segment 242 at both ends, so as to avoid the bridge 200
- the metal segment 241 and the elastic conductor segment 242 undergo bending deformation.
- the cross-sectional area of the elastic conductor section 242 is larger than the cross-sectional area of the metal section 241; since the electrical conductivity of the elastic conductor section 242 is generally lower than the electrical conductivity of the metal section 241, the cross-section of the elastic conductor section 242 is appropriately increased
- the area can reduce the resistance of the elastic conductor section 242, thereby keeping the resistance of the elastic conductor section 242 and the resistance of the metal section 241 as consistent as possible, so that each metal section 241 and each elastic conductor section 242 can maximize their own conductivity. performance.
- the cross-sectional area of the elastic conductor section 242 may be 3.5-4.5 times the cross-sectional area of the metal section 241, for example, it may be about 3.5 times, about 3.7 times, about 4 times, about 4.3 times, or about 4.5 times.
- the elastic conductor section 242 can take various forms so as to have both conductivity and conductivity.
- the elastic conductor section 242 includes an organic conductor and conductive particles distributed in the organic conductor.
- the organic conductor includes at least one of conductive rubber and conductive resin;
- the conductive particles include silver nanoparticles, gold nanoparticles, silver nanowires, Ir-Sn nanowires, Ir-Ag nanotubes, Pt-Sn nanowires, and At least one of zinc nanowires.
- the ratio of the size of the metal segment 241 to the size of the elastic conductor segment 242 ranges from 0.9 to 1.5. As shown in FIG. 4, along the X direction, the ratio of the length of the metal segment 241 to the length of the elastic conductor segment 242 is 0.9-1.5, for example, it can be about 0.9, about 1.0, about 1.2, or about 1.5. When the ratio of the length of the metal section 241 to the length of the elastic conductor section 242 is greater than 1.5 (not including this end value), the metal section 241 is too large and the elastic conductor section 242 is too small.
- the elastic conductor section The bendable size of 242 is too short to release the stress well, and the metal segments 241 are easy to bend together and break.
- the ratio of the length of the metal segment 241 to the length of the elastic conductor segment 242 is less than 0.9 (not including this end value)
- the ratio of the elastic conductor 242 in the wire 240 is too large, and the ratio of the metal conductor 241 is too small, resulting in the overall conductivity of the wire 240 Ability dropped significantly.
- the size of the metal segment 241 ranges from 1.0 ⁇ m to 6.0 ⁇ m.
- the length of the metal segment 241 in the X direction is 1.0 to 6.0 ⁇ m.
- FIG. 6 is a top view of a metal segment 241 in FIG. 4.
- the length of the dimension a ranges from 1.0 to 6.0 ⁇ m, for example, it can be about 1.0 ⁇ m, about 2.0 ⁇ m, about 3.0 ⁇ m, about 4.0 ⁇ m, about 5.0 ⁇ m or about 6.0 ⁇ m, but the embodiments of the present disclosure are not limited thereto.
- the size of the elastic conductor segment 242 ranges from 1.0 to 6.0 ⁇ m.
- the length of the elastic conductor segment 242 in the X direction is 1.0 to 6.0 ⁇ m, for example, it can be about 1.0 ⁇ m, about 2.0 ⁇ m, about 3.0 ⁇ m, about 4.0 ⁇ m, about 5.0 ⁇ m, or about 6.0 ⁇ m; but the embodiments of the present disclosure are not limited thereto.
- the size of the metal segment 241 ranges from 1.0 to 6.0 ⁇ m
- the size of the elastic conductor segment 242 is 2.4 ⁇ 4 ⁇ m.
- the length of the dimension b ranges from 1.0 to 6.0 ⁇ m, and may be, for example, about 1.0 ⁇ m, about 2.0 ⁇ m, about 3.0 ⁇ m, about 4.0 ⁇ m, about 5.0 ⁇ m, or about 6.0 ⁇ m.
- the size of the elastic conductor segment 242 is 2.4-4 ⁇ m, for example, it may be about 2.4 ⁇ m, about 2.7 ⁇ m, about 3.0 ⁇ m, about 3.5 ⁇ m, or about 4 ⁇ m.
- the size of the metal segment 241 ranges from 300 to 1200 nm, and the size of the elastic conductor segment 242 ranges from 1.2 to 2.4 ⁇ m (inclusive). For example, in FIG.
- the size of the metal segment 241 ranges from 300 nm to 1200 nm (inclusive), for example, it may be about 300 nm, about 500 nm, about 600 nm, about 750 nm, about 1000 nm, or about 1200 nm;
- the size of the elastic conductor segment 242 ranges from 1.2 to 2.4 ⁇ m, for example, it may be about 1.2 ⁇ m, about 1.4 ⁇ m, about 1.6 ⁇ m, about 1.8 ⁇ m, about 2.0 ⁇ m, about 2.2 ⁇ m, or about 2.4 ⁇ m.
- the wire since at least part of the length of the wire includes alternately arranged metal segments and elastic conductor segments, when the flexible substrate is bent, the bridge is bent and deformed, and the wire in the bridge is bent, and one of the two adjacent metal segments The relative position between the two is changed by the change of the bending angle of the elastic conductor section, and the elastic conductor section has good flexibility, which can release the tensile or compressive stress caused by the bending bridge, and avoid the bending of the flexible screen.
- the wire is prone to cracks; at the same time, a metal section is arranged between the elastic conductor sections. Since the metal section has a higher conductivity relative to the elastic conductor section, the wiring can be guaranteed without breaking when the bridge is bent.
- the part of the wires in the layer where the metal segments and the elastic conductor segments are alternately distributed can have better conductivity; in addition, since at least part of the length of the wire has the elastic conductor segments, compared with the metal segments, the elastic conductor segments and the wiring layer side
- the first organic layer and the second organic layer on the other side have good adhesion.
- the embodiment of the present application also provides a method for preparing a flexible substrate
- the preparation method of the flexible substrate includes:
- a flexible substrate 300 is provided, and the flexible substrate 300 includes a plurality of display areas 100 distributed in an array;
- a bridge area is connected between every two adjacent display areas 100;
- a buffer layer 220 and a first organic layer 230 are sequentially formed on the flexible substrate 300 corresponding to the bridge area.
- the first organic layer 230 can be formed on the buffer layer 220 by spin coating, and then cured by heating (temperature 200°C ⁇ 250°C, time 10min ⁇ 20min, for example, curing at about 250°C for about 10min, curing at about 230°C About 15min, or curing at about 200°C for about 20min) or ultraviolet curing (radiation energy 2500-3500mJ, for example, about 2500mJ, about 3000mJ or about 3500mJ).
- the thickness of the buffer layer 220 ranges from 300 nm to 1500 nm, such as about 300 nm, about 500 nm, about 600 nm, about 800 nm, about 1000 nm, about 1300 nm, or about 1500 nm.
- the thickness of the first organic layer 230 ranges from 0.8 to 6 ⁇ m, and may be, for example, about 0.8 ⁇ m, about 1.2 ⁇ m, about 2 ⁇ m, about 3 ⁇ m, about 4 ⁇ m, about 5 ⁇ m, and about 6 ⁇ m.
- each group of metal segments includes a plurality of metal segments 241 spaced apart along the extension direction of the bridge region. If the wire 240 to be made has A continuous metal wire is used to form a wire 240, while forming a metal segment, a continuous metal wire connected to the end of each group of metal segments is formed;
- a metal film 241' is first formed on the surface of the first organic layer 230 by evaporation or direct current sputtering.
- the metal film 241' is formed of ITO, Mg/Ag, Al , Ti/Al/Ti, Mo, Mo/Nd/Mo, Ag, Yb, or Au, etc.
- the thickness of the metal film 241' ranges from 300 nm to 1200 nm. The inventor noticed that if the thickness of the metal film 241' is greater than 1200nm (not including the end value), the bridge 200 will be too thick, which will not increase the performance, but will also cause waste of materials. If the thickness of the metal film 241' is less than 300nm (not including the end value), will cause the wire 240 made later to be too thin, increase the resistance, and have poor strength, and it is easy to break when bent;
- the metal film 241' is patterned by etching methods such as dry etching or wet etching, so that the metal film 241' forms a plurality of metal segments 241, and these metal segments 241 may be arranged in an array. It may not be distributed in an array, and includes multiple sets of metal segments 241 arranged side by side, and each set of metal segments 241 includes a plurality of metal segments 241 spaced apart along the extending direction of the bridge 200.
- the gas used for dry etching can be BCl3/Cl2, SF6/Br2, or Cl2/O2.
- a first sub-organic layer 250a is formed on the first organic layer 230, wherein the first sub-organic layer 250a covers each group of metal segments 241.
- the first sub-organic layer 250a may be formed on the surface of the first organic layer 230 by spin coating, and then heated and cured (temperature 200°C to 250°C, time 10min-20min, For example, curing for about 10 minutes at about 250°C, curing for about 15 minutes at about 230°C, or curing for about 20 minutes at about 200°C) or ultraviolet curing (radiation energy 2500-3500mJ, for example, about 2500mJ, about 3000mJ or about 3500mJ), the first The thickness of the sub-organic layer 250a ranges from 0.5 to 6 ⁇ m, and may be, for example, about 0.5 ⁇ m, about 0.6 ⁇ m, about 2 ⁇ m, about 3 ⁇ m, 5 ⁇ m, or about 6 ⁇ m.
- the first sub-organic layer 250a is patterned by means of exposure, development, etc., along the X direction, a first groove 251 is formed between every two adjacent metal segments 241.
- the size of the first groove 251 ranges from 1.0 to 6.0 ⁇ m; along the direction perpendicular to the extension direction of the wire 240 and perpendicular to the arrangement direction of the first organic layer 230 and the second organic layer 250 Direction, the size of the first groove 251 is 2.4 to 4 ⁇ m; along the arrangement direction of the first organic layer 230 and the second organic layer 250, the size of the first groove 251 ranges from 1.2 to 2.4 ⁇ m;
- the depth c of the first groove 251 ranges from 1.2 to 2.4 ⁇ m, for example, it may be about 1.2 ⁇ m, about 1.4 ⁇ m, about 1.6 ⁇ m, about 1.8 ⁇ m, about 2.0 ⁇ m, about 2.2 ⁇ m, or about 2.4 ⁇ m.
- the size e of the first groove 251 ranges from 1 to 6 ⁇ m, and may be, for example, about 1.0 ⁇ m, about 2.0 ⁇ m, about 3.0 ⁇ m, about 4.0 ⁇ m, about 5.0 ⁇ m, or about 6.0 ⁇ m.
- the size f ranges from 2.4 to 4 ⁇ m, and may be, for example, about 2.4 ⁇ m, about 2.7 ⁇ m, about 3.0 ⁇ m, about 3.5 ⁇ m, or about 4 ⁇ m.
- An elastic conductor segment 242 is formed in the first groove 251 to connect two adjacent metal segments 241;
- an ink-jet printing method may be used to put a conductive material that has cured elasticity into the corresponding first groove 251, and then is cured to form an elastic conductor segment 242.
- heating curing heating temperature 200°C ⁇ 250°C, time 45min ⁇ 75min, for example, curing at about 250°C for about 45min, about 230°C for about 60min or about 200°C for about 75min
- UV curing The radiation energy is 5500-7000mJ, for example, about 5500mJ, about 6000mJ, or about 7000mJ), forming an elastic conductor segment 242.
- the elastic conductor section 242 can also be formed by depositing and curing a conductive material on the first sub-organic layer 250a that can have elasticity, depositing part of the conductive material into the first groove 251, exposing and developing, it will be located in the first sub-organic layer 250a. The conductive material outside a groove 251 and on the surface of the first sub-organic layer 250a is removed.
- a second sub-organic layer 250b is formed on the surface of the first sub-organic layer 250a, the second sub-organic layer 250b covers the elastic conductor segment 242, the first sub-organic layer 250a and the second sub-organic layer 250a
- the layer 250b forms a second organic layer 250.
- the second sub-organic layer 250b may be formed on the surface of the first organic layer 230 by spin coating, and then cured by heating (temperature 200°C to 250°C, time 10min-20min, for example, curing at about 250°C for about 10min, Curing at about 230°C for about 15 minutes or at about 200°C for about 20 minutes) or UV curing (radiation energy 2500-3500mJ, for example, about 2500mJ, about 3000mJ or about 3500mJ), the thickness of the first sub-organic layer 250a is in the range of 0.8-6 ⁇ m For example, it may be about 0.8 ⁇ m, about 2 ⁇ m, about 3 ⁇ m, about 5 ⁇ m, or about 6 ⁇ m.
- an inorganic layer 260 is formed on the surface of the second sub-organic layer 250b.
- each group of metal segments 241 includes a plurality of metal segments 241 spaced apart along the extending direction of the bridge area, and then in each group An elastic conductor segment 242 is formed between every two adjacent metal segments 241 in the metal segment 241, which can form the wire 240 in the aforementioned flexible substrate.
- the bridge will bend and deform, and the wires in the bridge will bend.
- the relative position between the segments is changed by the bending angle of the elastic conductor segment, and the elastic conductor segment has good flexibility, which can release the tensile or compressive stress caused by the bending bridge, and avoid the bending of the flexible screen ,
- the wires in the bridge are prone to cracks; at the same time, a metal section is arranged between the elastic conductor sections. Since the metal section has a higher conductivity relative to the elastic conductor section, it can ensure that the bridge does not break when it is bent.
- the alternately distributed metal sections and elastic conductor sections of the wire can have better conductivity; in addition, because at least part of the length of the wire has elastic conductor sections, compared to the metal section, the elastic conductor section and the wiring layer
- the first organic layer on one side and the second organic layer on the other side have good adhesion.
- the elastic conductor section ensures that the conductor is not easy to fall off from the first organic layer and the second organic layer.
- the first organic layer 230 is over-etched to form an undercut structure 2411 at both ends of the bridge region of the metal segment 241 in the extending direction. Refer to FIG. 15, every two The upper surface of the first organic layer 230 between the metal segments 241 is overetched.
- part of the first organic layer 230 on the bottom side of each end of the metal segment 241 is also etched away, and the end of the metal segment 241
- An undercut structure 2411 is formed with the top surface of the first organic layer 230, so that when the first groove 251 is filled with conductive material to form the elastic conductor section 242, the end of the metal section 241 can be embedded in the elastic conductor section 242 to improve the metal The connection strength between the segment 241 and the elastic conductor segment 242.
- each group of elastic conductor segments 242 can also be formed on the first organic layer 230, wherein each group of elastic conductor segments 242 includes a plurality of intervals along the extending direction of the bridge region.
- Distributed elastic conductor segments 242, and then a metal segment 241 is formed between every two adjacent elastic conductor segments 242 in each group of elastic conductor segments 242 to form the conductive wires 240 in the aforementioned flexible substrate, and the flexibility formed by this method
- the substrate has the same advantages as the flexible substrate formed by the aforementioned method. E.g,
- the preparation method of the flexible substrate includes:
- a flexible substrate 300 is provided, and the flexible substrate 300 includes a plurality of display areas 100 distributed in an array;
- a bridge area is formed between every two adjacent display areas 100;
- a buffer layer 220 and a first organic layer 230 are sequentially formed on the flexible substrate corresponding to the bridge area;
- each group of elastic conductor segments 242 includes a plurality of elastic conductor segments 242 spaced apart along the extending direction of the bridge region;
- a third organic sub-layer is formed on the first organic layer 230, wherein the third organic sub-layer covers each group of elastic conductor segments 242;
- each group of elastic conductor segments 242 remove the third sub-organic layer between every two adjacent elastic conductor segments 242 to form a second groove;
- a metal segment 241 is formed in the second groove to connect two adjacent elastic conductor segments 242;
- the fourth sub-organic layer covers the metal segment 241, and the third sub-organic layer and the fourth sub-organic layer form the second organic layer 250;
- An inorganic layer 260 is formed on the surface of the fourth sub-organic layer.
- an embodiment of the present application also provides a display panel including the above-mentioned flexible substrate.
- the bridge 200 will bend and deform, and the wires in the bridge 200 240 is bent, and the relative position between two adjacent metal segments 241 is changed by the bending angle of the elastic conductor segment 242.
- the elastic conductor segment 242 has good flexibility and can release the damage caused by the bending bridge 200.
- Tensile stress or compressive stress avoids the problem that the wires 240 in the bridge 200 are prone to cracks due to the bending of the flexible screen; at the same time, a metal section 241 is arranged between the elastic conductor sections 242, because the metal section 241 is relative to the elastic conductor section 242 It has high electrical conductivity, so that under the premise that the bridge 200 does not break when the bridge 200 is bent, the alternately distributed part of the metal section 241 and the elastic conductor section 242 of the wire 240 in the wiring layer 24 can have a good electrical conductivity; in addition, Since at least part of the length of the wire 240 has an elastic conductor section 242, compared to the metal section 241, the elastic conductor section 242 has better adhesion to the first organic layer 230 on one side of the wiring layer 24 and the second organic layer 250 on the other side. Attachment, when the bridge 200 is bent under a force, the arrangement of the elastic conductor segment 242 also makes it difficult for the conductor to fall off from the first organic layer 230 and the
- an embodiment of the present application also provides a display device, which includes the above-mentioned display panel.
- the wire 240 since at least a part of the length of the wire 240 includes alternately arranged metal segments 241 and elastic conductor segments 242, when the flexible substrate is bent, the bridge 200 is bent and deformed, and the wires in the bridge 200 240 is bent, and the relative position between two adjacent metal segments 241 is changed by the bending angle of the elastic conductor segment 242.
- the elastic conductor segment 242 has good flexibility and can release the damage caused by the bending bridge 200.
- Tensile stress or compressive stress avoids the problem that the wires 240 in the bridge 200 are prone to cracks due to the bending of the flexible screen; at the same time, a metal section 241 is arranged between the elastic conductor sections 242, because the metal section 241 is relative to the elastic conductor section 242 With high electrical conductivity, under the premise of ensuring that the bridge 200 does not break when the bridge 200 is bent, the alternately distributed part of the metal section 241 and the elastic conductor section 242 of the wire 240 in the wiring layer 24 can have good electrical conductivity; in addition, Since at least part of the length of the wire 240 has an elastic conductor section 242, compared to the metal section 241, the elastic conductor section 242 has better adhesion to the first organic layer 230 on one side of the wiring layer 24 and the second organic layer 250 on the other side. Attachment, when the bridge 200 is bent under a force, the elastic conductor segment 242 prevents the conductor from falling off the first organic layer 230 and the second organic layer 250 easily.
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Abstract
Description
Claims (15)
- 一种柔性基板,包括:柔性衬底,所述柔性衬底包括阵列分布的多个显示区以及连接每相邻两个显示区之间的桥,其中,每个所述显示区配置来设置像素结构;每个所述桥包括依次设置的缓冲层、第一有机层、布线层、第二有机层和无机层,其中,所述布线层中具有导线;以及在所述导线的至少部分长度内,沿所述导线延伸的方向,所述导线包括交替设置的金属段和弹性导体段。
- 根据权利要求1所述的柔性基板,其中,所述桥包括弯曲部和直线延伸部,其中,所述弯曲部内的导线部分包括交替设置的所述金属段和所述弹性导体段,所述直线延伸部内的导线部分由连续的金属线构成。
- 根据权利要求1或2所述的柔性基板,其中,所述金属段的端部延伸至所述弹性导体段内。
- 根据权利要求1-3任一项所述的柔性基板,其中,所述弹性导体段的横截面积大于所述金属段的横截面积。
- 根据权利要求4所述的柔性基板,其中,所述弹性导体段的横截面积是所述金属段的横截面积的3.5~4.5倍。
- 根据权利要求1-5任一项所述的柔性基板,其中,所述弹性导体段包括有机导电体和分布于所述有机导电体内的导电粒子。
- 根据权利要求6所述的柔性基板其中,所述有机导电体包括导电橡胶和导电树脂中的至少一种;以及所述导电粒子包括银纳米颗粒、金纳米颗粒、银纳米线、Ir-Sn纳米线、Ir-Ag纳米管、Pt-Sn纳米线和锌纳米线中的至少一种。
- 根据权利要求1-7任一项所述的柔性基板,其中,沿所述导线的延伸方向,所述金属段的尺寸与所述弹性导体段的尺寸比值范围为0.9~1.5。
- 根据权利要求1所述的柔性基板,其特征在于,沿所述导线的延伸方向,所述金属段的尺寸范围为1.0~6.0μm,所述弹性导体段的尺寸范围为1.0~6.0μm;沿与所述导线的延伸方向垂直的方向,且与所述第一有机层和所述第二有机层的排列方向垂直的方向,所述金属段的尺寸范围为1.0~6.0μm,以及所述弹性导体段的尺寸为2.4~4μm;以及沿所述第一有机层和所述第二有机层的排列方向,所述金属段的尺寸范围为300~1200nm,所述弹性导体段的尺寸范围为1.2~2.4μm。
- 一种柔性基板的制备方法,包括:提供柔性衬底,所述柔性衬底形成有多个阵列分布的显示区;每相邻两个所述显示区之间形成桥区;在所述桥区对应的所述柔性衬底的部分上依次形成缓冲层和第一有机层;在所述第一有机层上形成多组金属段,其中,每组所述金属段包括多个沿所述桥区的延伸方向间隔分布的金属段;在所述第一有机层上形成第一子有机层,其中,所述第一子有机层覆盖各组所述金属段;在每组所述金属段中,去除每相邻两个金属段之间的所述第一子有机层的部分,形成第一凹槽;在所述第一凹槽中形成弹性导体段,以连接相邻的两个金属段;在所述第一子有机层表面形成第二子有机层,所述第二子有机层覆盖所述弹性导体段,所述第一子有机层和所述第二子有机层形成第二有机层;以及在所述第二子有机层表面形成无机层。
- 根据权利要求10所述的柔性基板的制备方法,其中,形成所述第一凹槽时,对所述第一有机层进行过刻,以在所述金属段的桥区延伸方向上的两端形成底切结构。
- 根据权利要求10或11所述的柔性基板的制备方法,其中,沿所述导线的延伸方向,所述第一凹槽的尺寸范围为1.0~6.0μm;沿与所述导线的所述延伸方向垂直的方向,且与所述第一有机层和所述第二有机层的排列方向垂直的方向,所述第一凹槽的尺寸为2.4~4μm;以及沿所述第一有机层和所述第二有机层的所述排列方向,所述第一凹槽的尺寸范围为1.2~2.4μm。
- 一种柔性基板的制备方法,包括:提供柔性衬底,所述柔性衬底形成有多个阵列分布的显示区;每相邻两个显示区之间形成有桥区;在所述桥区对应的所述柔性衬底部分上依次形成缓冲层和第一有机层;在所述第一有机层上形成多组弹性导体段,其中,每组所述弹性导体段 包括多个沿所述桥区的延伸方向间隔分布的弹性导体段;在所述第一有机层上形成第三子有机层,其中,所述第三子有机层覆盖各组所述弹性导体段;在每组所述弹性导体段中,去除每相邻两个弹性导体段之间的所述第三子有机层部分,以形成第二凹槽;在所述第二凹槽中形成金属段,以连接相邻的两个所述弹性导体段;在所述第三子有机层表面形成第四子有机层,所述第四子有机层覆盖所述金属段,所述第三子有机层和所述第四子有机层形成第二有机层;以及在所述第四子有机层表面形成无机层。
- 一种显示面板,包括权利要求1-9任一项所述的柔性基板。
- 一种显示装置,包括权利要求14所述的显示面板。
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US11380752B2 (en) * | 2019-08-22 | 2022-07-05 | Boe Technology Group Co., Ltd. | Stretchable display panel, display apparatus, and method of fabricating stretchable display panel |
CN110634406A (zh) * | 2019-09-25 | 2019-12-31 | 昆山工研院新型平板显示技术中心有限公司 | 柔性盖板及其制备方法 |
CN110635014B (zh) * | 2019-09-25 | 2022-01-25 | 昆山工研院新型平板显示技术中心有限公司 | 柔性盖板及显示面板 |
WO2024098293A1 (zh) * | 2022-11-09 | 2024-05-16 | 深圳市韶音科技有限公司 | 一种导电结构及具有该导电结构的柔性传感器 |
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