WO2020258864A1 - Ensemble de conversion de couleurs et son procédé de fabrication, et panneau d'affichage - Google Patents

Ensemble de conversion de couleurs et son procédé de fabrication, et panneau d'affichage Download PDF

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Publication number
WO2020258864A1
WO2020258864A1 PCT/CN2020/072461 CN2020072461W WO2020258864A1 WO 2020258864 A1 WO2020258864 A1 WO 2020258864A1 CN 2020072461 W CN2020072461 W CN 2020072461W WO 2020258864 A1 WO2020258864 A1 WO 2020258864A1
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Prior art keywords
layer
light
color conversion
substrate
color
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PCT/CN2020/072461
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English (en)
Chinese (zh)
Inventor
李静静
黄飞
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成都辰显光电有限公司
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Priority to KR1020217038300A priority Critical patent/KR102599014B1/ko
Publication of WO2020258864A1 publication Critical patent/WO2020258864A1/fr

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • G02F1/133385—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133512—Light shielding layers, e.g. black matrix
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133553—Reflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]

Definitions

  • This application relates to the field of display, and in particular to a color conversion component, a manufacturing method thereof, and a display panel.
  • LCD Liquid Crystal Display
  • OLED Organic Light-Emitting Diode
  • LED Light Emitting Diode
  • LCD Liquid Crystal Display
  • LCD Organic Light-Emitting Diode
  • LED Light Emitting Diode
  • the advantages of power saving, thin body and wide application range have been widely used in various consumer electronic products such as mobile phones, TVs, personal digital assistants, digital cameras, notebook computers, desktop computers, and have become the mainstream of display devices.
  • the display device can support the display of color patterns through multiple colorization schemes.
  • colorization is achieved by adding a layer of color film on the light-emitting substrate.
  • the current color film usually has the problems of cross-color between adjacent sub-pixels and low light output efficiency.
  • the first aspect of the present application provides a color conversion component, which includes:
  • the light blocking layer is located on the substrate and has multiple channels
  • the color conversion layer is located in at least part of the channel, and the color conversion layer converts incident light into light of the target color
  • the light blocking layer includes:
  • Support layer located on the substrate
  • the black matrix layer continuously extends on the upper surface and the side surface of the support layer, the upper surface of the support layer faces away from the substrate;
  • the reflective layer continuously extends on the upper surface and the side surface of the black matrix layer, and the upper surface of the black matrix layer faces away from the substrate.
  • an embodiment of the present application provides a display panel, which includes:
  • the light-emitting substrate has a light-emitting surface, and the light-emitting substrate includes a plurality of light-emitting units;
  • the color conversion component covers the light-emitting surface of the light-emitting substrate, wherein multiple channels correspond to multiple light-emitting units respectively.
  • an embodiment of the present application provides a method for manufacturing a color conversion component, which includes:
  • the step of forming the light blocking layer includes:
  • a color conversion layer is formed in at least part of the channels, and the color conversion layer converts incident light into light of a target color.
  • the light blocking layer of the color conversion component includes a supporting layer, a black matrix layer, and a reflective layer that are stacked.
  • the support layer is used to support the black matrix layer, which increases the height of the black matrix layer and effectively increases the thickness of the light blocking layer, thereby avoiding color crosstalk between adjacent outgoing rays, and further increasing the thickness of the color conversion layer , So that the incident light is fully utilized in the color conversion layer, and the utilization rate of the incident light is improved, thereby improving the light extraction efficiency.
  • the reflective layer reduces the transmittance of light penetrating the wall of the channel, and the black matrix layer absorbs the incident light passing through the reflective layer, thereby preventing the light in the channel from being transmitted to adjacent channels and preventing the existence between adjacent sub-pixels. Cross color.
  • the reflective layer can reflect light that has not been fully utilized by the color conversion layer to the color conversion layer again, thereby increasing the utilization rate of incident light, thereby increasing the light extraction efficiency.
  • FIG. 1 shows a schematic diagram of a cross-sectional structure of a color conversion component according to an embodiment of the present application
  • FIG. 2 shows a schematic diagram of a cross-sectional structure of a display panel provided according to an embodiment of the present application
  • Fig. 3 shows a flowchart of a method for manufacturing a color conversion component according to an embodiment of the present application
  • 4a to 4g show schematic cross-sectional structure diagrams of the steps of forming the various components included in the color conversion component in the manufacturing method of the color conversion component according to an embodiment of the present application.
  • a layer or an area when referred to as being “on” or “above” another layer or another area, it can mean that it is directly on the other layer or area, or is in contact with it. There are other layers or regions between another layer and another area. Moreover, if the component is turned over, the layer or area will be “below” or “below” the other layer or area.
  • the embodiment of the present application provides a color conversion component, which can be applied to a display panel to realize colorization of light emitted by the display panel.
  • the display panel may be a display panel using light-emitting diode devices, such as a micro-LED (Micro-LED) display panel.
  • it may also be a display panel of an organic light-emitting diode (OLED) device or a liquid crystal display panel. (LCD) and other display panels.
  • OLED organic light-emitting diode
  • LCD liquid crystal display panel.
  • the display panel is a display panel using Micro-LED devices as an example for description.
  • the Micro-LED emits monochromatic light
  • the color conversion component converts the monochromatic light into multiple colors of light for display.
  • Fig. 1 shows a schematic diagram of a cross-sectional structure of a color conversion component according to an embodiment of the present application.
  • the color conversion component 100 includes a substrate 110, a light blocking layer 120 and a color conversion layer 140.
  • the light blocking layer 120 includes a support layer 121, a black matrix (BM) layer 122, and a reflective layer 123.
  • BM black matrix
  • the light blocking layer 120 is located on the substrate 110 and has a plurality of channels 130.
  • the plurality of channels 130 can be arranged in any manner, and an array arrangement is preferred.
  • the supporting layer 121 in the light blocking layer 120 is located on the substrate 110.
  • the black matrix layer 122 continuously extends on the upper surface and the side surface of the support layer 121, and the upper surface of the support layer 121 faces away from the substrate 110.
  • the reflective layer 123 continuously extends on the upper surface and the side surface of the black matrix layer 122, and the upper surface of the black matrix layer 122 faces away from the substrate 110.
  • the color conversion layer 140 is located in at least a part of the channel 130, and the color conversion layer 140 can convert the incident light L1 into light of the target color.
  • the incident light L1 is blue light
  • the color conversion layer 140 can convert the blue light into red light or green light.
  • the substrate 110 is a transparent substrate through which light emitted from the color conversion layer 140 passes.
  • the substrate 110 may be, for example, an inorganic material transparent substrate including glass or quartz, a plastic transparent material including polyethylene terephthalate, polyethylene dicarboxylate, polytianxian sublimation or polycarbonate, or any Type of transparent film.
  • the support layer 121 is made of an organic material.
  • the support layer 121 may be formed by film sticking, photolithography, laser processing, inkjet printing, 3D printing, screen printing, micro-contact printing, or the like.
  • the black matrix layer 122 may be formed on the upper surface and the side surface of the support layer 121 by filming, photolithography, laser processing, inkjet printing, 3D printing, screen printing, micro-contact printing, and the like.
  • the reflective layer 123 may be formed on the upper surface and the side surface of the black matrix layer 122 by filming, photolithography, laser processing, inkjet printing, 3D printing, screen printing, micro-contact printing, and the like.
  • the thickness of the support layer 121 (the distance from the substrate 110 to the top surface of the support layer 121) can be set according to actual requirements. Affected by the current black matrix process capability, it is difficult to prepare a thicker black matrix, so the thickness of the color conversion layer cannot be thick, resulting in low light conversion efficiency of the color conversion layer.
  • Using the support layer 121 to support the black matrix layer 122 indirectly increases the thickness of the black matrix layer, so that the incident light L1 is fully utilized in the color conversion layer 140, and the utilization rate of the incident light is improved, thereby improving the light extraction efficiency.
  • the reflective layer 123 may be a metal layer with high light reflection properties.
  • the metal may include, for example, one or more of silver, metal, aluminum, uranium, button, gold, metal, iron, and inscription.
  • the light blocking layer 120 has a plurality of channels 130 arranged in an array, the arrangement of the plurality of channels 130 matches the pixel arrangement of the corresponding display panel, and the shape of the channels 130 can be adjusted according to actual design.
  • the shape of the cross section of the channel 130 parallel to the base 110 can be circular, elliptical, rectangular, trapezoidal, and a shape with arc-shaped sides, etc.; the shape of the cross section of the channel 130 perpendicular to the base 110 can be rectangular, trapezoidal, Shapes with arc-shaped sides, etc.
  • the shape of the cross section of the channel 130 perpendicular to the base 110 is a trapezoid. Specifically, it is an isosceles trapezoid.
  • the shape of the cross section of the channel 130 perpendicular to the substrate 110 is a trapezoid, so that the light is easily reflected in the exit direction, and the intensity of the exit light is improved.
  • the color conversion layer 140 is located in at least a part of the channel 130, and the color conversion layer 140 can convert the incident light L1 into light of the target color.
  • the color conversion layer 140 may be a color conversion layer including a photoluminescent material.
  • the photoluminescent material can be quantum dots, fluorescent particles, and the like.
  • the color conversion layer is a quantum dot layer as an example.
  • the incident light L1 may be blue light
  • the color conversion layer 140 is located in at least a part of the channel 130.
  • the left channel 130 and the middle channel 130 respectively contain the color conversion layer 140.
  • the color conversion layer 140 in the partial channel 130 can emit red light.
  • the color conversion layer 140 in the left channel 130 is a red quantum dot layer, which absorbs incident light L1 of blue light and converts it into red light and emits it outward.
  • the color conversion layer 140 in the partial channel 130 can emit green light.
  • the color conversion layer 140 in the middle channel 130 is a green quantum dot layer, which absorbs the incident light L1 of blue light and converts it into green light and emits it outward.
  • the color of the incident light L1 and the color conversion method of the color conversion layer 140 are just an example, and in other embodiments, other configurations can be performed.
  • the incident light L1 may be ultraviolet (UV) light.
  • the light blocking layer 120 includes a supporting layer 121, a black matrix layer 122, and a reflective layer 123 that are stacked.
  • the support layer 121 is used to support the black matrix layer 122, which increases the height of the black matrix layer 122 and effectively increases the thickness of the light blocking layer, thereby avoiding color crosstalk between adjacent exiting lights, and further increasing the color conversion
  • the thickness of the layer 140 is such that the incident light L1 is fully utilized in the color conversion layer 140, the utilization rate of the incident light is improved, and the light extraction efficiency is improved.
  • the reflective layer 123 reduces the transmittance of light penetrating the wall of the channel, and the black matrix layer 122 absorbs the incident light passing through the reflective layer 123, thereby preventing the light in the channel from being transmitted to adjacent channels and preventing adjacent sub-pixels. There is a cross-color between.
  • the reflective layer 123 can reflect the light that is not fully utilized by the color conversion layer 140 to the color conversion layer 140 again, so as to increase the utilization rate of incident light, thereby improving the light extraction efficiency.
  • the thickness of the color conversion layer 140 is less than or equal to the height from the surface of the substrate 110 toward the light blocking layer 120 to the top surface of the light blocking layer 120. In this way, the color conversion layer 140 may not fill the space of the channel 130 to avoid direct contact between the color conversion layer 140 and the light-emitting source, thereby preventing the color conversion layer 140 from being affected by the heat of the light-emitting source, resulting in performance degradation, resulting in affecting the color conversion layer 140 The problem of light conversion efficiency.
  • each channel 130 has a first opening OP1 and a second opening OP2 opposite to each other.
  • the first opening OP1 is close to the incident light L1 and the second opening OP2 is away from the incident light L1.
  • the size of the first opening OP1 is larger than the size of the second opening OP2, which can increase the path of the incident light L1 in the color conversion layer 140, so that the incident light L1 is fully converted and utilized in the color conversion layer 140, and the light utilization rate is improved.
  • the color conversion component 100 may further include a heat dissipation layer 150 on the upper surface of the reflective layer 123 facing away from the substrate 110.
  • the heat dissipation layer 150 may be made of graphene material, or may be made of other thermally conductive materials.
  • the heat dissipation layer 150 can conduct heat generated by a light source (such as an LED) to reduce the temperature around the color conversion layer 140, thereby extending the life of the color conversion layer 140.
  • the color conversion assembly 100 may further include a first color filter layer 161 covering the first opening OP1 of the channel 130 containing the color conversion layer 140.
  • the first color filter layer 161 can allow light of the same wavelength range as the incident light L1 to pass through and reflect light of at least one other wavelength range, thereby improving color purity.
  • the first color filter layer 161 is a distributed Bragg reflective layer. Specifically, in this embodiment, the incident light L1 is a blue light.
  • the color conversion layer 140 in the left channel 130 is a red quantum dot layer.
  • the first color filter layer 161 covering the first opening OP1 of the left channel 130 can be configured to allow blue light to pass through and reflect red light.
  • the color conversion layer 140 in the middle channel 130 is a green quantum dot layer.
  • the first color filter layer 161 covering the first opening OP1 of the middle channel 130 may be configured to allow blue light to pass through and reflect green light.
  • the color conversion component 100 further includes a second color filter layer 162.
  • the second color filter layer 162 covers the second opening OP2 of the channel 130 containing the color conversion layer 140.
  • the second color filter layer 162 can reflect or absorb the incident light L1 that is not completely absorbed by the color conversion layer 140 in the corresponding channel 130, reducing the incident light L1 mixed in the outgoing light, thereby slowing down the color gamut during display Poor problem.
  • the second color filter layer 162 is a distributed Bragg reflective layer.
  • the second color filter layer 162 is configured to allow the light emitted by the color conversion layer 140 in the corresponding channel 130 to pass through and reflect at least one other wavelength range of light.
  • the second color filter layer 162 reflects, for example, light in the same wavelength range as the incident light L1.
  • the incident light L1 is a blue light.
  • the color conversion layer 140 in the left channel 130 is a red quantum dot layer.
  • the second color filter layer 162 covering the second opening OP2 of the left channel 130 may be configured to allow red light to pass through and reflect blue light.
  • the color conversion layer 140 in the middle channel 130 is a green quantum dot layer.
  • the second color filter layer 162 covering the second opening OP2 of the middle channel 130 can be configured to allow green light to pass through and reflect blue light.
  • the light emitted by the color conversion layer 140 can pass through the second color filter layer 162, while the incident light L1 not absorbed by the color conversion layer 140 is reflected by the second color filter layer 162 back to the channel 130 Inside, the color conversion layer 140 is activated again.
  • the above structure enhances the intensity of the emitted light of the color conversion component 100, and effectively improves the color conversion efficiency and luminous efficiency of the display panel and display device including the color conversion component 100.
  • the color conversion component 100 further includes a transmission layer 170.
  • the transmissive layer 170 is located in the channel 130 where the color conversion layer 140 is not provided among the multiple channels 130, and the transmissive layer 170 allows light with the same wavelength range as the incident light L1 to pass through.
  • the right channel 130 contains a transmission layer 170.
  • the incident light L1 is blue light
  • the transmission layer 170 allows the blue light to pass through
  • the emitted light of the corresponding channel is blue light.
  • the exit light of the left channel 130 is red
  • the exit light of the middle channel 130 is green
  • the exit light of the right channel 130 is blue
  • the The blue-ray channels 130 are arranged in an array, which can realize the full-color display of the picture.
  • the color conversion component 100 may further include a third color filter layer 163.
  • the third color filter layer 163 covers the first opening OP1 of the channel 130 containing the transmission layer 170.
  • the third color filter layer 163 is configured to allow light of the same wavelength range as the incident light L1 to pass through and reflect light of at least one other wavelength range.
  • the third color filter layer 163 is configured to allow only light with the same wavelength range as the incident light L1 to pass through, so as to improve the purity of the light emitted by the corresponding channel 130.
  • the third color filter layer 163 may not be provided in the color conversion component 100.
  • the color conversion component 100 of the embodiment of the present application can be applied to a display panel for color display of the display panel.
  • An embodiment of the present application further provides a display panel, which includes a light-emitting substrate and a color conversion component.
  • the color conversion component of the display panel may be the color conversion component 100 of any embodiment of the present application.
  • FIG. 2 shows a schematic cross-sectional structure diagram of a display panel 1000 according to an embodiment of the present application.
  • the display panel 1000 includes a light-emitting substrate 200 and the color conversion component 100 of the foregoing embodiment.
  • the light-emitting substrate 200 has a light-emitting surface, and the light-emitting substrate 200 includes a plurality of light-emitting units 210.
  • the plurality of light-emitting units 210 may be arranged in any manner, preferably in an array arrangement.
  • the light-emitting substrate 200 is, for example, a light-emitting substrate including LED devices, wherein the multiple light-emitting units 210 are respectively LED light-emitting units and are arranged in an array.
  • the LED light emitting unit may be a monochromatic LED light emitting unit, so that the plurality of light emitting units 210 emit light of the same color.
  • the light emitting unit 210 is a Micro-LED light emitting unit.
  • the light-emitting substrate 200 includes a driving circuit, and the driving circuit is used to drive the corresponding light-emitting unit 210 to emit light.
  • the driving circuit at least includes a thin film transistor, and the Micro-LED is electrically connected to the thin film transistor.
  • the light-emitting substrate 200 is not limited to being a light-emitting substrate including LED devices.
  • the light-emitting substrate 200 may also be a light-emitting substrate for an OLED display panel or a light-emitting substrate for an LCD. That is, the light-emitting substrate 200 may include at least part of the functional layer of the OLED display panel, and is combined with the color conversion component 100. An OLED display panel is obtained; or the light-emitting substrate 200 may include at least part of the functional layer of the LCD, and the LCD is obtained by combining with the color conversion component 100.
  • the light-emitting substrate 200 is a light-emitting substrate using LED devices
  • its light-emitting unit 210 is not limited to a blue LED light-emitting unit.
  • the light-emitting unit 210 may also be an ultraviolet LED light-emitting unit.
  • the color conversion component 100 covers the light-emitting surface of the light-emitting substrate 200, wherein a plurality of channels 130 correspond to a plurality of light-emitting units 210 respectively, and a filling material 211, such as liquid optical glue, is provided between the light-emitting unit 210 and the color conversion component 100 ( Liquid Optical Clear Adhesive, LOCA).
  • LOCA Liquid Optical Clear Adhesive
  • the filling material 211 fills the gap between the light emitting unit 210 and the first color filter layer 161 and the third color filter layer 163 to increase the light output rate of the light source and ensure a uniform light propagation path.
  • the multiple light-emitting units 210 are all blue LED light-emitting units.
  • the light emitted by the blue LED light-emitting unit excites the color conversion layer 140, so that the light is converted into red light and emitted outward; in the middle channel 130 in FIG. 2, the light emitted by the blue LED light-emitting unit excites The color conversion layer 140 converts light into green light and emits it outward; in the right channel 130 in FIG. 2, the blue light emitted by the blue LED light-emitting unit passes through the transmission layer 170 and emits blue light outward.
  • the channel 130 that emits red light, the channel 130 that emits green light, and the channel 130 that emits blue light are arranged in an array to realize full-color display of the screen.
  • the light blocking layer 120 includes a supporting layer 121, a black matrix layer 122, and a reflective layer 123 that are stacked.
  • the support layer 121 is used to support the black matrix layer 122, which increases the height of the black matrix layer 122 and effectively increases the thickness of the light blocking layer, thereby avoiding color crosstalk between adjacent exiting lights, and further increasing the color conversion
  • the thickness of the layer 140 is such that the incident light L1 is fully utilized in the color conversion layer 140, the utilization rate of the incident light is improved, and the light extraction efficiency is improved.
  • the reflective layer 123 reduces the transmittance of light penetrating the wall of the channel, and the black matrix layer 122 absorbs the incident light passing through the reflective layer 123, thereby preventing the light in the channel from being transmitted to adjacent channels and preventing adjacent sub-pixels. There is a cross-color problem between.
  • the reflective layer 123 can reflect the light that is not fully utilized by the color conversion layer 140 to the color conversion layer 140 again, so as to increase the utilization rate of incident light, thereby improving the light extraction efficiency.
  • the embodiment of the present application also provides a manufacturing method of the color conversion component, which will be described below.
  • FIG. 3 shows a flowchart of a manufacturing method of a color conversion component according to an embodiment of the present application.
  • the manufacturing method of the color conversion component includes steps S10 to S20.
  • a light blocking layer is formed on the substrate, and the light blocking layer has a plurality of channels.
  • the step of forming the light blocking layer includes:
  • a patterned support layer is formed on the substrate.
  • 4a shows a schematic cross-sectional structure diagram of a step of forming a support layer in a manufacturing method of a color conversion component according to an embodiment of the present application.
  • the supporting layer 121 may be formed on the substrate 110 by film sticking, photolithography, laser processing, inkjet printing, 3D printing, screen printing, micro-contact printing, etc.
  • the supporting layer 121 has a plurality of channels 130 arranged in an array.
  • FIG. 4b shows a schematic cross-sectional structure diagram of the step of forming a black matrix layer in a method for manufacturing a color conversion component according to an embodiment of the present application.
  • the black matrix layer 122 can be formed on the upper surface and side surfaces of the support layer 121 by filming, photolithography, laser processing, inkjet printing, 3D printing, screen printing, micro-contact printing, etc.
  • the thickness of the black matrix layer 122 The optical density (OD) of the black matrix layer 122 is 4.0 or more.
  • FIG. 4c shows a schematic cross-sectional structure diagram of a step of forming a reflective layer in a manufacturing method of a color conversion component according to an embodiment of the present application.
  • the reflective layer 123 may be formed on the upper surface and the side surface of the black matrix layer 122 by filming, photolithography, laser processing, inkjet printing, 3D printing, screen printing, micro-contact printing, and the like.
  • a color conversion layer is formed in at least part of the channels, and the color conversion layer converts incident light into light of a target color.
  • a second color filter layer may be formed in a part of the channel near the opening of the substrate.
  • 4d shows a schematic cross-sectional structure diagram of the step of forming the second color filter layer in the manufacturing method of the color conversion component according to an embodiment of the present application.
  • the second color filter layer 162 may be a Bragg reflective layer.
  • the thickness of the second color filter layer 162 can be selectively adjusted. Transmits the light emitted by the color conversion layer to avoid the problem of light leakage from the backlight.
  • FIG. 4e shows a schematic cross-sectional structure diagram of a step of forming a color conversion layer in a method for manufacturing a color conversion component according to an embodiment of the present application.
  • the color conversion layer 140 may be a color conversion layer including a photoluminescent material, where the photoluminescent material may be quantum dots, fluorescent particles, and the like.
  • the color conversion layer 140 may be configured into two or more types according to different light emission configurations. For example, it may include a color conversion layer 140 emitting red light and a color conversion layer 140 emitting green light.
  • a photolithography process may be used to form a red-emitting color conversion layer 140 in a portion of the channels 130, wherein the channel where the red-emitting color conversion layer 140 is formed may be a channel corresponding to the red sub-pixel. 130.
  • a photolithography process may be used to form a green light-emitting color conversion layer 140 in a part of the channels 130, wherein the channel where the green light-emitting color conversion layer 140 is formed may be the channel 130 corresponding to the green sub-pixel. It is also possible to form the color conversion layer 140 emitting green light first, and then form the color conversion layer 140 emitting red light.
  • the incident light is blue light
  • a transmission layer 170 may be formed in a part of the channel, and the transmission layer 170 transmits blue light.
  • Part of the channels may be filled with light-transmitting materials to form the transmission layer 170, or part of the channels may not be filled with any material to form the transmission layer 170.
  • the first color filter layer can be formed above the color conversion layer 140, that is, part of the channel away from the opening of the substrate.
  • a physical or chemical vapor deposition method is used to form the first color filter layer 161.
  • the first color filter layer 161 may be a Bragg reflective layer.
  • the first color filter layer 161 transmits incident light and reflects a wavelength range different from that of the incident light. Light, thereby improving the purity of light emitted from the color conversion layer.
  • Fig. 4g shows a schematic cross-sectional structure diagram of a step of forming a heat dissipation layer in a method for manufacturing a color conversion component according to an embodiment of the present application.
  • a heat dissipation layer 150 may be formed on the reflective layer 123.
  • a chemical vapor deposition method is used to deposit a graphene film on the reflective layer 123 to form the heat dissipation layer 150.
  • the total thickness of the heat dissipation layer 150, the reflective layer 123, the black matrix layer 122, and the support layer 121 is greater than the total thickness of the first color filter layer 161, the color conversion layer 140, and the second color filter layer 162, so as to avoid the light emitting unit It is in direct contact with the color conversion layer 140.
  • Graphene has excellent thermal conductivity and can conduct heat generated by the light source in time to reduce the ambient temperature around the color conversion layer and extend the life of the color conversion layer.
  • the light blocking layer of the color conversion component prepared by the color conversion component includes a supporting layer, a black matrix layer, and a reflective layer that are stacked.
  • the support layer is used to support the black matrix layer, which increases the height of the black matrix layer and effectively increases the thickness of the light blocking layer, thereby avoiding color crosstalk between adjacent outgoing lights, and further increasing the thickness of the color conversion layer , So that the incident light is fully utilized in the color conversion layer, and the utilization rate of the incident light is improved, thereby improving the light extraction efficiency.
  • the reflective layer reduces the transmittance of light penetrating the wall of the channel, and the black matrix layer absorbs the incident light passing through the reflective layer, thereby preventing the light in the channel from being transmitted to adjacent channels and preventing the existence between adjacent sub-pixels. Cross color.
  • the reflective layer can reflect the light that is not fully utilized by the color conversion layer to the color conversion layer again, thereby increasing the utilization rate of incident light, thereby increasing the light extraction efficiency.

Abstract

L'invention concerne un ensemble de conversion de couleurs (100) et son procédé de fabrication, et un panneau d'affichage, celui-ci pouvant atténuer le problème de coloration croisée entre des sous-pixels voisins et pouvant améliorer l'efficacité d'extraction de lumière. L'ensemble de conversion de couleurs (100) comprend : un substrat (110); une couche de blocage de lumière (120) située sur le substrat (110) et ayant une pluralité de canaux; et une couche de conversion de couleurs (140) située dans au moins certains des canaux, la couche de conversion de couleurs (140) convertissant la lumière incidente (L1) en une lumière d'une couleur cible. La couche de blocage de lumière (120) comprend : une couche de support (121) située sur le substrat (110); une couche de matrice noire (122) s'étendant de façon continue sur une surface supérieure et une surface latérale de la couche de support (121), la surface supérieure de la couche de support (121) faisant face dans une direction opposée au substrat (110); et une couche réfléchissante (123) s'étendant de façon continue sur une surface supérieure et une surface latérale de la couche de matrice noire (122), la surface supérieure de la couche de matrice noire (122) faisant face dans une direction opposée au substrat (110).
PCT/CN2020/072461 2019-06-27 2020-01-16 Ensemble de conversion de couleurs et son procédé de fabrication, et panneau d'affichage WO2020258864A1 (fr)

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