WO2020258786A1 - 声学装置及电子设备 - Google Patents
声学装置及电子设备 Download PDFInfo
- Publication number
- WO2020258786A1 WO2020258786A1 PCT/CN2019/127843 CN2019127843W WO2020258786A1 WO 2020258786 A1 WO2020258786 A1 WO 2020258786A1 CN 2019127843 W CN2019127843 W CN 2019127843W WO 2020258786 A1 WO2020258786 A1 WO 2020258786A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wall
- cavity
- housing
- acoustic device
- sound
- Prior art date
Links
- 239000002131 composite material Substances 0.000 claims description 8
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- 229920000642 polymer Polymers 0.000 claims description 6
- 229920002379 silicone rubber Polymers 0.000 claims description 6
- 239000004945 silicone rubber Substances 0.000 claims description 6
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 5
- 239000002356 single layer Substances 0.000 claims description 5
- 230000035945 sensitivity Effects 0.000 abstract description 19
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- 230000000694 effects Effects 0.000 description 9
- 230000009286 beneficial effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000011358 absorbing material Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000002955 isolation Methods 0.000 description 3
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
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- 230000007547 defect Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
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- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2807—Enclosures comprising vibrating or resonating arrangements
- H04R1/2815—Enclosures comprising vibrating or resonating arrangements of the bass reflex type
- H04R1/2823—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material
- H04R1/2826—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material for loudspeaker transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2803—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means for loudspeaker transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
- H04R1/2873—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself for loudspeaker transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/12—Non-planar diaphragms or cones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
- H04R2307/023—Diaphragms comprising ceramic-like materials, e.g. pure ceramic, glass, boride, nitride, carbide, mica and carbon materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
- H04R2307/025—Diaphragms comprising polymeric materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/15—Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
Definitions
- the other is to install a passive radiator on the box of the acoustic system (Prior Art 2), as shown in Figure 1, where 10 is sound
- the unit, 20 is the box of the acoustic system
- 30 is the passive radiator
- the sound unit and the passive radiator radiate sound to the outside at the same time, using the principle of strong resonance between the passive radiator and the box at a specific frequency point fp (resonance frequency),
- the sound waves of the sounding unit and the passive radiator are connected and superimposed to enhance the local sensitivity near the resonance frequency point fp (for example, see patent CN1939086A).
- the first solution to add sound-absorbing materials to the cabinet requires a good sealing and packaging of the sound-absorbing materials.
Abstract
Description
Claims (10)
- 一种声学装置,包括:发声单元,所述发声单元包括振动膜片,所述声学装置上设置有出声口,所述振动膜片前侧的声波通过所述出声口对外辐射;其特征在于,所述振动膜片后侧形成第一密闭腔,所述第一密闭腔的腔体壁上开设有安装孔,在所述安装孔上设有柔性形变部,在所述第一密闭腔的外侧设有第二密闭腔,所述柔性形变部位于所述第一密闭腔和所述第二密闭腔之间,所述第二密闭腔将所述柔性形变部在形变时产生的声波封闭在所述第二密闭腔内;所述腔体壁包括第一壁和与所述第一壁连接的第二壁,所述安装孔位于所述第一壁上,所述安装孔周边的所述第一壁上设有朝向所述第一密闭腔的方向凹陷形成的凹槽,所述柔性形变部固定于所述凹槽的槽底,在所述第一壁上还设有朝向所述第一密闭腔的方向凹陷形成的贯穿槽,所述贯穿槽贯通所述凹槽与所述第二壁外表面。
- 如权利要求1所述的声学装置,其特征在于,所述柔性形变部包括本体部,所述本体部为平板状结构;或者所述本体部的至少边缘部分设有凸起;或者所述本体部的至少边缘部分为波浪形结构。
- 如权利要求2所述的声学装置,其特征在于,所述本体部的边缘部分设有一个凸起,所述凸起由所述第一密闭腔朝向所述第二密闭腔的方向凸出;或者,所述凸起由所述第二密闭腔朝向所述第一密闭腔的方向凸出。
- 如权利要求2所述的声学装置,其特征在于,所述柔性形变部还包括结合于所述本体部的中心位置的复合片,所述本体部为片状的整体结构或者所述本体部的中心位置镂空。
- 如权利要求2所述的声学装置,其特征在于,所述柔性形变部的本体 部是单层结构,所述单层结构由高分子塑料、热塑性弹性体和硅橡胶中的一种材料制成;或者,所述柔性形变部的本体部是多层结构,所述多层结构中的至少一层为高分子塑料、热塑性弹性体和硅橡胶中的一种材料制成。
- 根据权利要求1所述的声学装置,其特征在于,所述第二密闭腔的容积大于所述第一密闭腔的容积;用于安装声学装置的电子设备的壳体的至少一部分用于形成所述第一密闭腔和/或所述第二密闭腔。
- 根据权利要求1-6任一权利要求所述的声学装置,其特征在于,所述声学装置包括第一壳体,所述发声单元安装在所述第一壳体上形成发声组件,所述发声单元的振动膜片与所述第一壳体之间形成所述第一密闭腔,在所述第一壳体上开设有所述安装孔,在所述安装孔上设有所述柔性形变部;所述声学装置包括第二壳体,所述发声组件安装于所述第二壳体中,所述第二壳体与所述第一壳体之间形成所述第二密闭腔,所述第二壳体为电子设备的壳体。
- 如权利要求7所述的声学装置,其特征在于,所述第一壳体包括顶壁、底壁和连接于所述顶壁和所述底壁之间的侧壁,其中,所述顶壁或所述底壁为所述第一壁,所述侧壁为所述第二壁。
- 如权利要求7所述的声学装置,其特征在于,在所述第一壳体上开设有多个安装孔,在每个安装孔上设有柔性形变部。
- 一种电子设备,其特征在于:所述电子设备包括电子设备的壳体和如权利要求1-9所述的声学装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020227002884A KR20220025021A (ko) | 2019-06-27 | 2019-12-24 | 음향장치 및 전자장치 |
US17/622,937 US20220248127A1 (en) | 2019-06-27 | 2019-12-24 | Acoustic device and electronic equipment |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920987590.XU CN209949409U (zh) | 2019-06-27 | 2019-06-27 | 声学装置及电子设备 |
CN201920987590.X | 2019-06-27 |
Publications (1)
Publication Number | Publication Date |
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WO2020258786A1 true WO2020258786A1 (zh) | 2020-12-30 |
Family
ID=69136177
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2019/127843 WO2020258786A1 (zh) | 2019-06-27 | 2019-12-24 | 声学装置及电子设备 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20220248127A1 (zh) |
KR (1) | KR20220025021A (zh) |
CN (1) | CN209949409U (zh) |
WO (1) | WO2020258786A1 (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5475764A (en) * | 1992-09-30 | 1995-12-12 | Polk Investment Corporation | Bandpass woofer and method |
CN104754454A (zh) * | 2015-03-25 | 2015-07-01 | 歌尔声学股份有限公司 | 扬声器模组 |
CN109218939A (zh) * | 2018-08-16 | 2019-01-15 | 歌尔股份有限公司 | 发声装置及电子设备 |
CN109803215A (zh) * | 2018-12-18 | 2019-05-24 | 歌尔股份有限公司 | 声学装置及电子设备 |
CN110446139A (zh) * | 2019-08-20 | 2019-11-12 | 歌尔股份有限公司 | 声学装置及电子设备 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202652453U (zh) * | 2012-04-11 | 2013-01-02 | 天津洪波电子集团有限公司 | 扁平形音箱 |
TWI568276B (zh) * | 2014-01-06 | 2017-01-21 | 緯創資通股份有限公司 | 揚聲模組及具有其之薄型電子裝置 |
US9402126B2 (en) * | 2014-04-17 | 2016-07-26 | Merry Electronics (Shenzhen) Co., Ltd. | Earphone with passive radiator |
CN205622754U (zh) * | 2016-05-13 | 2016-10-05 | 微鲸科技有限公司 | 电视机内置音箱 |
-
2019
- 2019-06-27 CN CN201920987590.XU patent/CN209949409U/zh active Active
- 2019-12-24 WO PCT/CN2019/127843 patent/WO2020258786A1/zh active Application Filing
- 2019-12-24 KR KR1020227002884A patent/KR20220025021A/ko not_active Application Discontinuation
- 2019-12-24 US US17/622,937 patent/US20220248127A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5475764A (en) * | 1992-09-30 | 1995-12-12 | Polk Investment Corporation | Bandpass woofer and method |
CN104754454A (zh) * | 2015-03-25 | 2015-07-01 | 歌尔声学股份有限公司 | 扬声器模组 |
CN109218939A (zh) * | 2018-08-16 | 2019-01-15 | 歌尔股份有限公司 | 发声装置及电子设备 |
CN109803215A (zh) * | 2018-12-18 | 2019-05-24 | 歌尔股份有限公司 | 声学装置及电子设备 |
CN110446139A (zh) * | 2019-08-20 | 2019-11-12 | 歌尔股份有限公司 | 声学装置及电子设备 |
Also Published As
Publication number | Publication date |
---|---|
CN209949409U (zh) | 2020-01-14 |
KR20220025021A (ko) | 2022-03-03 |
US20220248127A1 (en) | 2022-08-04 |
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