WO2020258474A1 - 一种背光模组及其制备方法、显示装置 - Google Patents

一种背光模组及其制备方法、显示装置 Download PDF

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Publication number
WO2020258474A1
WO2020258474A1 PCT/CN2019/101743 CN2019101743W WO2020258474A1 WO 2020258474 A1 WO2020258474 A1 WO 2020258474A1 CN 2019101743 W CN2019101743 W CN 2019101743W WO 2020258474 A1 WO2020258474 A1 WO 2020258474A1
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WO
WIPO (PCT)
Prior art keywords
light
guide plate
light guide
backlight module
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/101743
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English (en)
French (fr)
Inventor
田栋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
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Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to US16/625,733 priority Critical patent/US11256119B2/en
Publication of WO2020258474A1 publication Critical patent/WO2020258474A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/009—Positioning aspects of the light source in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133314—Back frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0065—Manufacturing aspects; Material aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B29C2045/0079—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping applying a coating or covering
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the invention relates to the field of backlights, in particular to a backlight module, a preparation method thereof, and a display device.
  • Full screen has become the mainstream development direction of mobile phone display.
  • Full-screen displays pursue ultra-narrow bezels.
  • narrow bezel displays With the popularization of narrow bezel displays, the backlit bezels are required to be further narrowed.
  • the backlight module is one of the important components of the liquid crystal display. Since the liquid crystal itself does not emit light, the function of the backlight module is to supply sufficient brightness and uniformly distributed light sources so that the liquid crystal display can display images normally. At present, the display technology of liquid crystal displays has become mature, especially in the design of backlight modules. In addition to being used in liquid crystal display devices such as liquid crystal displays and LCD TVs, the backlight module can also provide light sources for display devices such as digital photo frames, electronic paper, and mobile phones.
  • the L/B reverse group technology is usually used.
  • a accommodating groove is provided at the lower end of the iron shell to place the reverse assembled flexible circuit board.
  • the LED lamp is located
  • the flexible circuit board has the same height as the light guide plate, and the reflective sheet is located under the light guide plate, and is also fixed on the groove of the iron shell with adhesive tape.
  • the iron shell in order to align the height of the LED lamp with the light guide plate, the iron shell needs to be designed in a step shape, and the groove is used to accommodate the thickness of the flexible circuit board.
  • the L/B anti-group design effectively reduces the bottom frame of the backlight, but the stepped design of the iron shell brings two problems. One is that the thickness of the backlight is increased, and the back of the backlight has protrusions, which squeezes the assembly space of the whole machine. The uneven back surface of the backlight will affect its assembly with the glass, and special platform fixtures are needed to deal with it.
  • the present invention provides a backlight module, a preparation method thereof, and a display device to solve the problem that in the prior art, the backlight module usually uses an iron shell to align the height of the LED lamp with the light guide plate.
  • the stepped shape makes the assembly space of the whole machine larger.
  • the present invention provides a backlight module, including a housing, the housing is provided with a through hole; the flexible circuit board is arranged in the through hole, the size of which is the same as that of the through hole adaptation.
  • the housing includes a horizontal casing and a vertical casing perpendicular to the horizontal casing, wherein the through hole is provided on a side of the horizontal casing close to the vertical casing.
  • the backlight module further includes a light source, which is arranged on the circuit board; a light guide plate has a light entrance side and a light exit side, the light entrance side is located on the side of the light guide plate, and the light exit side is perpendicular to On the light entrance side, the light guide plate is arranged in the housing, and the light exit side is away from the housing; the light source is located on the light entrance side of the light guide plate and is at the same height as the light guide plate; a reflective sheet, It is arranged between the light guide plate and the housing; the diffusion sheet is arranged on the light exit side of the light guide plate; and the optical film is arranged on the side of the diffusion sheet away from the light guide plate.
  • a light guide plate has a light entrance side and a light exit side, the light entrance side is located on the side of the light guide plate, and the light exit side is perpendicular to On the light entrance side, the light guide plate is arranged in the housing, and the light exit side is away from the housing; the light source is located
  • the circuit board includes a substrate, which is provided on a side of the through hole away from the light source; a conductive layer is provided on the substrate; a protective layer is provided on a side of the conductive layer away from the substrate, wherein A first conductive adhesive layer is provided between the substrate and the conductive layer, and a second conductive adhesive layer is provided between the conductive layer and the protective layer.
  • the materials of the substrate and the protective layer are both polyimide.
  • the material of the conductive layer is copper.
  • the shell is made of metal material.
  • the present invention also provides a method for preparing a backlight module, which includes forming a shell by stamping, and reserving a through hole before stamping and forming; forming a flexible circuit board at the through hole, wherein the size of the circuit board and the through hole Match.
  • the step of preparing the circuit board includes forming a substrate integrally with the casing by injection molding; coating a layer of a first conductive adhesive on the substrate; plating a metal layer on the first conductive adhesive, The circuit structure is etched on the metal layer to form a conductive layer; a second conductive adhesive is coated on the conductive layer; a protective layer is covered on the second conductive adhesive.
  • the present invention also provides a display device including the backlight module.
  • the backlight module, the preparation method thereof, and the display device of the present invention combine the iron case with the flexible circuit board, and use the integrated injection molding technology to directly embed the flexible circuit board in the iron case.
  • This improvement directly avoids the iron case for containing
  • the groove design adopted for the thickness of the flexible circuit board on the one hand reduces the overall thickness of the backlight, and on the other hand makes the back surface of the backlight flat, which is more conducive to subsequent assembly.
  • FIG. 1 is a schematic diagram of a backlight module in the background art.
  • Fig. 2 is a schematic diagram of a backlight module in an embodiment.
  • Fig. 3 is a schematic diagram of a flexible circuit board in an embodiment.
  • Fig. 4 is a schematic diagram of a display device in an embodiment.
  • Substrate 220 conductive layer
  • the backlight module 10 of the present invention includes a housing 100, a flexible circuit board 200, a light source 300, a light guide plate 400, a reflective sheet 500, a diffusion sheet 600 and an optical film 700.
  • the backlight module 10 is used to provide a uniform and soft light source to the display device 1 for displaying images on the display device 1.
  • the display device 1 may be a mobile phone, a tablet computer, etc.
  • the product or component with display function includes the backlight module 10.
  • the shell 100 is a metal shell, generally an iron shell, which has strong pressure and wear resistance and low cost.
  • the shell 100 includes a horizontal shell 110 and is perpendicular to the horizontal The vertical housing 120 of the housing 110.
  • the backlight module 10 adopts an edge-light type, and the light source 300 is provided on the side of the horizontal housing 110 close to the vertical housing 120. It is generally an LED light emitting diode, which converts electrical energy into The light energy is used to provide the light energy required by the backlight module 10.
  • the flexible circuit board 200 is arranged between the light source 300 and the horizontal housing 110 to provide the power required by the light source 300.
  • the flexible circuit board 200 includes The substrate 210, the conductive layer 220, and the protective layer 230.
  • the substrate 210 is made of polyimide material to support the conductive layer 220.
  • the conductive layer 220 is an electroplated copper plate with a number of circuit traces engraved on it.
  • the protective layer 230 is provided on the conductive layer.
  • the material used is polyimide material to protect the conductive layer 220 from being corroded by water and oxygen.
  • the polyimide material is an insulating material, which effectively prevents the conductive layer 220 from appearing Short circuit phenomenon.
  • the light guide plate 400 is disposed on the horizontal housing 110 and has a light exit side 401 and a light entrance side 402, wherein the light entrance side 402 is on the side of the light guide plate 400 and faces the light source 300,
  • the light exit side 401 is perpendicular to the light entrance side 402 and faces away from the horizontal housing 110.
  • the light source 300 In order to ensure that the light emitted by the light source 300 can be diverged to the greatest extent through the light guide plate 400, usually the light source 300 The side far away from the horizontal housing 110 and the light exit side 401 of the light guide plate 400 need to maintain the same height, but because the flexible circuit board 200 is also provided between the light source 300 and the horizontal housing 110, In order to ensure the height of the light guide plate, in the prior art, the horizontal housing 110 is usually designed to be stepped. However, this method complicates the processing of the housing 100, increases the manufacturing cost, and also Increase the difficulty of subsequent assembly.
  • a through hole 101 is opened on the side of the horizontal housing 110 close to the vertical housing 120, and the size of the through hole 101 is adapted to the size of the flexible circuit board 200, It is convenient that the flexible circuit board 200 can be completely embedded in the through hole 101, which reduces the thickness of the backlight module 10, and because the flexible circuit board 200 is embedded in the through hole, the light guide plate 400 can be It is directly arranged on the horizontal casing 110, and there is no need to use a stepped horizontal casing to ensure the height of the light exit side 401 of the light guide plate 400.
  • the reflective sheet 500 is arranged between the light guide plate 400 and the horizontal casing 110 to reflect the light that is deflected toward the horizontal casing 110 from the light source 300 through the light incident side 402 To the light emitting side 401 side, the luminous efficiency of the backlight module 10 is improved, and the picture quality of the display device is increased.
  • the diffusion sheet 600 is arranged on the light exit side 401 side of the light guide plate 400, and the diffusion sheet 600 is used to improve the diffusion effect of the light emitted through the light exit side 401 to make the distribution more uniform and soft, and can also Improve light transmittance.
  • the optical film 700 is disposed on the side of the diffuser 600 away from the light guide plate 400, and the shape of the optical film 700 includes a prism, a diffuser film, etc., to improve the optical performance of the backlight module 10.
  • this embodiment also provides a method for preparing the backlight module 10, including
  • the housing 100 is formed by stamping, and a through hole 101 is reserved before stamping and forming; a flexible circuit board 200 is formed at the through hole 101, wherein the flexible circuit board 200 is adapted to the size of the through hole 101.
  • the preparation method of the flexible circuit board is as follows:
  • a metal layer is plated on the first conductive adhesive 201, and a circuit structure is etched on the metal layer by etching to form a conductive layer 220;
  • a protective layer 230 is covered on the second conductive layer.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
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Abstract

一种背光模组（10）及其制备方法、显示装置（1），背光模组（10）包括外壳（100），外壳（100）设有一通孔（101）；柔性电路板（200），设于通孔（101）内，其尺寸与通孔（101）尺寸相适配。

Description

一种背光模组及其制备方法、显示装置 技术领域
本发明涉及背光领域，特别涉及一种背光模组及其制备方法、显示装置。
 背景技术
全面屏已成为手机显示的主流发展方向。全面屏显示追求超窄边框，随着窄边框显示屏的普及，要求背光的边框进一步减窄。
背光模组为液晶显示器的重要组件之一，由于液晶本身不发光，背光模组的功能就是供应充足的亮度与分布均匀的光源，使液晶显示器能正常显示影像。目前，液晶显示器的显示技术已经趋于成熟，尤其在背光模组的设计方面也有了很大的发展。背光模组除了应用在液晶显示器、液晶电视机等液晶显示装置之外，还可以为数码相框、电子纸、手机等显示装置提供光源。
现阶段，为了实现背光下端窄边框，通常运用L/B反组技术，如图1所示，铁壳下端设置有一个容置凹槽，用来放置反向组装的柔性电路板，LED灯位于柔性电路板上，高度与导光板一致，反射片位于导光板下方，同样用胶带固定在铁壳凹槽上。在柔性电路板设计中，为了使LED灯的高度与导光板对齐，铁壳需设计成台阶状，凹槽用来容置柔性电路板的厚度。L/B反组设计有效减小了背光下端边框，但铁壳台阶状的设计带来两个问题，一是增加了背光厚度，且背光反面有突起，挤占了整机组装的空间，二是背光反面不平整会对其与玻璃的组装产生影响，需要特殊的平台治具来应对。
 技术问题
为了解决上述技术问题：本发明提供了一种背光模组及其制备方法、显示装置，以解决现有技术中由于背光模组为了使LED灯的高度与导光板对齐，通常将铁壳设计成台阶状从而使整机组装的空间变大。
 技术解决方案
解决上述问题的技术方案是：本发明提供了一种背光模组，包括外壳，所述外壳设有一通孔；柔性电路板，设于所述通孔内，其尺寸与所述通孔尺寸相适配。
进一步的，所述外壳包括一水平壳体和与所述水平壳体垂直的竖直壳体，其中，所述通孔设于所述水平壳体靠近所述竖直壳体一侧。
进一步的，所述背光模组还包括光源，设于所述电路板上；导光板，具有入光侧和出光侧，所述入光侧位于所述导光板的侧面，所述出光侧垂直于所述入光侧，所述导光板设于所述外壳内，所述出光侧远离所述外壳；所述光源位于所述导光板的入光侧且与所述导光板同高；反射片，设于所述导光板与所述外壳之间；扩散片，设于所述导光板的出光侧；光学膜片，设于所述扩散片远离所述导光板一侧。
进一步的，所述电路板包括基底，设于所述通孔远离所述光源一侧；导电层，设于所述基底上；保护层，设于所述导电层远离所述基底一侧，其中，所述基板与所述导电层之间设于第一导电胶层，所述导电层与所述保护层之间设有第二导电胶层。
进一步的，所述基板和所述保护层的材料均为聚酰亚胺。
进一步的，所述导电层的材料为铜。
进一步的，所述外壳为金属材质。
本发明还提供了一种背光模组的制备方法，包括冲压形成外壳，在冲压成型前预留一通孔；在所述通孔处形成柔性电路板，其中所述电路板与所述通孔尺寸相适配。
进一步的，所述电路板的制备步骤包括与所述外壳一体化注塑形成基底；在所述基底上涂布一层第一导电胶；在所述第一导电胶上镀上一层金属层，并在所述金属层上刻蚀电路结构形成导电层；在所述导电层上涂布一层第二导电胶；在所述第二导电胶上覆盖一层保护层。
本发明还提供了一种显示装置，包括所述背光模组。
 有益效果
本发明的背光模组及其制备方法、显示装置将铁壳与柔性电路板进行了结合，采用一体化注塑成形技术将柔性电路板直接嵌入铁壳中，此项改进直接避免了铁壳为了容置柔性电路板厚度采取的凹槽设计，一方面减小了背光整体厚度，另一方面使背光反面变得平整，更利于后续组装。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是背景技术中的背光模组示意图。
图2是实施例中的背光模组示意图。
图3是实施例中的柔性电路板示意图。
图4是实施例中的显示装置示意图。
图中
1 显示装置；                            10 背光模组；
100 外壳；                              200 柔性电路板；
300 光源；                              400 导光板；
500 反射片；                            600 扩散片；
700 光学膜片；                          110 水平壳体；
120 竖直壳体；                          401 出光侧；
402 入光侧；                            101 通孔；
210 基底；                              220 导电层；
230 保护层；                            201 第一导电胶；
 本发明的实施方式
以下实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「顶」、「底」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
实施例
如图2所示，本实施例中，本发明的背光模组10包括外壳100、柔性电路板200、光源300、导光板400、反射片500、扩散片600和光学膜片700。
如图4所示，所述背光模组10用于给显示装置1提供均匀、柔和的光源，用以使所述显示装置1显示画面，所述显示装置1可以为：手机、平板电脑等具有显示功能的产品或部件，包括所述背光模组10。
所述外壳100为金属外壳，一般为铁壳，其具有较强的耐压耐磨能力，且成本较低，本实施例中，所述外壳100包括一水平壳体110和垂直于所述水平壳体110的竖直壳体120。
本实施例中，所述背光模组10采用侧光式，所述光源300设于所述水平壳体110靠近所述竖直壳体120一侧，其一般为LED发光二极管，将电能转换为光能用以提供所述背光模组10所需的光能。
如图3所示，所述柔性电路板200设于所述光源300与所述水平壳体110之间，用以提供所述光源300所需的电能，具体的，所述柔性电路板200包括基底210、导电层220和保护层230。
所述基底210的材料为聚酰亚胺材料，用以承接所述导电层220，所述导电层220为电镀铜板，其上刻有若干电路走线，所述保护层230设于所述导电层220上，其所用材料为聚酰亚胺材料，用以保护所述导电层220，防止其被水氧腐蚀，同时所述聚酰亚胺材料为绝缘材料，有效防止所述导电层220出现短路现象。
所述导光板400设于所述水平壳体110上，其具有出光侧401和入光侧402，其中，所述入光侧402在所述导光板400的侧面且正对所述光源300，所述出光侧401垂直于所述入光侧402且背对所述水平壳体110，为了保证所述光源300发出的光线能够最大程度的通过所述导光板400发散出去，通常所述光源300远离所述水平壳体110的一侧与所述导光板400的出光侧401需要保持同一高度，但由于所述光源300与所述水平壳体110之间还设有所述柔性电路板200，为了保证所述导光板的高度，现有技术中，通常采用将所述水平壳体110设计为台阶状，但这种方法使所述外壳100的加工变得复杂，增加了制作成本，同时会增加后续组装的难度。
本实施例中，采用在所述水平壳体110靠近所述竖直壳体120的一侧开设有通孔101，所述通孔101的尺寸与所述柔性电路板200的尺寸相适配，方便所述柔性电路板200可以完全嵌入所述通孔101中，减小了所述背光模组10的厚度，且由于所述柔性电路板200嵌入所述通孔中，所述导光板400可以直接设于所述水平壳体110上，无需采用台阶状水平壳体以确保所述导光板400的所述出光侧401的高度。
所述反射片500设于所述导光板400与所述水平壳体110之间，用以将所述光源300通过所述入光侧402射进的偏向所述水平壳体110方向的光线反射至所述出光侧401一侧，提高所述背光模组10的发光效率，增加所述显示装置的画面质量。
所述扩散片600设于所述导光板400出光侧401一侧，所述扩散片600用以提高经由所述出光侧401射出的光线的扩散效果，使其分布更加均匀，柔和，同时也可以提高光线的透过率。
所述光学膜片700设于所述扩散片600远离所述导光板400一侧，所述光学膜片700的形状包括棱镜、扩散膜等，用以提高所述背光模组10的光学性能。
为了更好的解释本发明，本实施例还提供了一种背光模组10的制备方法，包括
冲压形成外壳100，在冲压成型前预留一通孔101；在所述通孔101处形成柔性电路板200，其中所述柔性电路板200与所述通孔101的尺寸相适配。
具体的，所述柔性电路板的制备方法如下：
在所述通孔处101注塑形成一基底210；
在所述基底210上涂布一层第一导电胶201；
在所述第一导电胶201上镀上一层金属层，并通过刻蚀的方式在所述金属层上刻蚀电路结构形成导电层220；
在所述导电层220上涂布一层第二导电胶202；
在所述第二导电层上覆盖一层保护层230。本实施例中，通过将所述柔性电路板200的成型工艺分解开，通过将所述柔性电路板200的基底210与所述外壳100形成一体避免所述柔性电路板200与所述外壳100的组装偏差，有利于提高所述背光模组10的组装精度。
以上仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (16)

  1. 一种背光模组，其中，包括
    外壳，所述外壳设有一通孔；
    柔性电路板，设于所述通孔内，其尺寸与所述通孔尺寸相适配。
  2. 根据权利要求1所述的背光模组，其中，
    所述外壳包括一水平壳体和与所述水平壳体垂直的竖直壳体，其中，所述通孔设于所述水平壳体靠近所述竖直壳体一侧。
  3. 根据权利要求2所述的背光模组，其中，还包括
    光源，设于所述电路板上；
    导光板，具有入光侧和出光侧，所述入光侧位于所述导光板的侧面，所述出光侧垂直于所述入光侧，所述导光板设于所述外壳内，所述出光侧远离所述外壳；所述光源位于所述导光板的入光侧且与所述导光板同高；
    反射片，设于所述导光板与所述外壳之间；
    扩散片，设于所述导光板的出光侧；
    光学膜片，设于所述扩散片远离所述导光板一侧。
  4. 根据权利要求3所述的背光模组，其中，
    所述电路板包括
    基底，设于所述通孔远离所述光源一侧；
    导电层，设于所述基底上；
    保护层，设于所述导电层远离所述基底一侧，其中，所述基板与所述导电层之间设有第一导电胶层，所述导电层与所述保护层之间设有第二导电胶层。
  5. 根据权利要求4所述的背光模组，其中，
    所述基板和所述保护层的材料均为聚酰亚胺。
  6. 根据权利要求4所述的背光模组，其中，
    所述导电层的材料为铜。
  7. 根据权利要求1所述的背光模组，其中，
    所述外壳为金属材质。
  8. 一种背光模组的制备方法，其中，包括
    冲压形成外壳，在冲压成型前预留一通孔；
    在所述通孔处形成柔性电路板，其中所述电路板与所述通孔尺寸相适配。
  9. 根据权利要求8所述的背光模组的制备方法，其中，
    所述电路板的制备步骤包括
    与所述外壳一体化注塑形成基底；
    在所述基底上涂布一层第一导电胶；
    在所述第一导电胶上镀上一层金属层，并在所述金属层上刻蚀电路结构形成导电层；
    在所述导电层上涂布一层第二导电胶；
    在所述第二导电胶上覆盖一层保护层。
  10. 一种显示装置，其中，包括如权利要求1所述的背光模组。
  11. 根据权利要求10所述的显示装置，其中，所述外壳包括一水平壳体和与所述水平壳体垂直的竖直壳体，其中，所述通孔设于所述水平壳体靠近所述竖直壳体一侧。
  12. 根据权利要求11所述的显示装置，其中，还包括
    光源，设于所述电路板上；
    导光板，具有入光侧和出光侧，所述入光侧位于所述导光板的侧面，所述出光侧垂直于所述入光侧，所述导光板设于所述外壳内，所述出光侧远离所述外壳；所述光源位于所述导光板的入光侧且与所述导光板同高；
    反射片，设于所述导光板与所述外壳之间；
    扩散片，设于所述导光板的出光侧；
    光学膜片，设于所述扩散片远离所述导光板一侧。
  13. 根据权利要求12所述的显示装置，其中，
    所述电路板包括
    基底，设于所述通孔远离所述光源一侧；
    导电层，设于所述基底上；
    保护层，设于所述导电层远离所述基底一侧，其中，所述基板与所述导电层之间设有第一导电胶层，所述导电层与所述保护层之间设有第二导电胶层。
  14. 根据权利要求13所述的显示装置，其中，
    所述基板和所述保护层的材料均为聚酰亚胺。
  15. 根据权利要求13所述的显示装置，其中，
    所述导电层的材料为铜。
  16. 根据权利要求10所述的显示装置，其中，
    所述外壳为金属材质。
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