WO2020248911A1 - 显示装置和触控器 - Google Patents
显示装置和触控器 Download PDFInfo
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- WO2020248911A1 WO2020248911A1 PCT/CN2020/094624 CN2020094624W WO2020248911A1 WO 2020248911 A1 WO2020248911 A1 WO 2020248911A1 CN 2020094624 W CN2020094624 W CN 2020094624W WO 2020248911 A1 WO2020248911 A1 WO 2020248911A1
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- photosensitive element
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- photosensitive
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- 230000001681 protective effect Effects 0.000 claims abstract description 56
- 239000010410 layer Substances 0.000 claims description 158
- 238000002955 isolation Methods 0.000 claims description 34
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- 238000000034 method Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 5
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- 238000005516 engineering process Methods 0.000 description 7
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
- G06F3/0421—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means by interrupting or reflecting a light beam, e.g. optical touch-screen
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
Definitions
- This application relates to the field of display technology, and in particular to a display device and a touch controller.
- Optical touch technology is another mainstream touch technology in addition to resistive and capacitive touch technologies.
- Optical sensors respond to detailed actions. The quick response can be applied to conference venues, commercial exhibition venues, education and training venues, exhibitions, financial industries, military and many other industries.
- the distance of the optical touch is usually reflected by the light source illuminating the finger, which is received by the sensing element to identify the specific location of the touch.
- the purpose of this application is to provide a display device and a touch controller.
- the present application discloses a display device, including: a protective screen, a display panel, a photosensitive element, and a condensing element.
- the protective screen is arranged on the light-emitting surface of the display device, and the photosensitive element is arranged on the display panel and the protective screen.
- the photosensitive element includes a photosensitive surface that receives light; the photosensitive surface of the photosensitive element is provided with a condensing element.
- the application also discloses a display device, including: a protective screen arranged on the light-emitting surface of the display device; a display panel arranged opposite to the protective screen; a photosensitive element arranged between the display panel and the protective screen; wherein ,
- the photosensitive element includes a photosensitive surface that receives light; the photosensitive surface is provided with a condensing element; the photosensitive element includes a first electrode layer, a first doped layer, and an intrinsic layer that are sequentially formed toward the protective screen , A second doped layer and a second electrode layer; a protective layer is provided between the second doped layer and the second electrode layer, the protective layer is provided with via holes, and the second electrode layer passes through the The hole is connected to the second doped layer; the photosensitive element is provided with multiple, an isolation layer is arranged between two adjacent photosensitive elements, and the thickness of the isolation layer is greater than the thickness of the photosensitive element;
- the isolation layer includes a recessed area formed around the photosensitive element and gradually decreasing in thickness toward the photosensitive element;
- the present application also discloses a touch controller, including: a protective screen, a backlight source and a photosensitive element, the protective screen is arranged on the touch surface of the touch controller; the photosensitive element is arranged on the display panel and the protective screen
- the photosensitive element includes a photosensitive surface that receives light; the photosensitive surface of the photosensitive element is provided with a condensing element.
- the photosensitive element of the present application is provided with a condensing element on the photosensitive surface.
- the condensing element makes part of the light that cannot reach the photosensitive element (such as finger touch)
- the incident reflected light) is converged toward the photosensitive surface of the photosensitive element, which can increase the amount of light reaching the photosensitive surface of the photosensitive element, thereby increasing the intensity of the formed photosensitive current, thereby improving the accuracy of finger positioning.
- increasing the amount of light reaching the photosensitive surface of the photosensitive element can improve the clarity of the fingerprint pattern formed, thereby improving the accuracy of fingerprint recognition.
- the photosensitive element is arranged between the display panel and the protective screen, which makes the light propagation path between the protective screen and the photosensitive element shorter, and the number of glass layers or film structure that the light reflected by the finger waits for the light to reach the photosensitive element.
- the number is reduced, so the possibility that the reflected light from the finger will be received by the photosensitive element increases, which improves the sensitivity of the photosensitive element; the placement of the photosensitive element close to the protective screen and the concentrating element double enhance the ability of the photosensitive element to obtain the light to be measured. Improve the sensitivity of sensitivity and reduce the possibility of misjudgment.
- FIG. 1 is a schematic diagram of a display device according to an embodiment of the present application.
- FIG. 2 is a schematic diagram of a display device according to an embodiment of the present application.
- FIG. 3 is a schematic diagram of a display panel according to an embodiment of the present application.
- FIG. 4 is a schematic diagram of a display device according to an embodiment of the present application.
- FIG. 5 is a schematic diagram of an isolation layer according to an embodiment of the present application.
- FIG. 6 is a schematic diagram of another isolation layer according to an embodiment of the present application.
- FIG. 7 is a schematic diagram of another display device according to an embodiment of the present application.
- FIG. 8 is a schematic diagram of a touch controller according to an embodiment of the present application.
- first and second are only used for descriptive purposes, and cannot be understood as indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, unless otherwise specified, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features; “plurality” means two or more.
- the term “comprising” and any variations thereof means non-exclusive inclusion, the possibility of the presence or addition of one or more other features, integers, steps, operations, units, components, and/or combinations thereof.
- the terms “installed”, “connected” and “connected” should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection , It can also be electrical connection; it can be directly connected, it can also be indirectly connected through an intermediate medium, or the internal connection of two components.
- installed should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection , It can also be electrical connection; it can be directly connected, it can also be indirectly connected through an intermediate medium, or the internal connection of two components.
- the exemplary photosensitive element 300 is generally arranged on the same layer as the active switch of the array substrate, but such arrangement makes the distance between the photosensitive element 300 and the protective screen 100 farther, so when the photosensitive element 300 is used for the touch function, the finger touches When reaching the protective screen 100 of the display device, diffuse reflection occurs due to the presence of the finger. After the light to be measured is reflected and propagated over a large distance, the large-angle light cannot enter the photosensitive element 300, which will cause inaccurate recognition of the touch position The problem. In view of this problem, the inventor of the present application improved and obtained the following solution:
- the present application discloses a display device, which includes a display device 10 and a driving circuit 20 for driving the display device 10.
- the display device 10 includes: a protective screen 100, a display panel 200, The photosensitive element 300 and the condensing element 400, the protective screen 100 is arranged on the light-emitting surface of the display device 10, and the photosensitive element 300 is arranged between the display panel 200 and the protective screen 100; the photosensitive element 300 includes The photosensitive surface that receives light; the photosensitive surface of the photosensitive element 300 is provided with a condensing element 400.
- the photosensitive element 300 of the present application is provided with a condensing element 400 on the photosensitive surface.
- the condensing element 400 makes part of the photosensitive element 300 unable to reach the original Light (eg, reflected light touched by a finger) converges toward the photosensitive surface of the photosensitive element 300, which can increase the amount of light reaching the photosensitive surface of the photosensitive element 300, thereby increasing the intensity of the formed photosensitive current, thereby improving the accuracy of finger positioning.
- the photosensitive element 300 is used for fingerprint recognition, increasing the amount of light reaching the photosensitive surface of the photosensitive element 300 can improve the clarity of the fingerprint pattern formed, thereby improving the accuracy of fingerprint recognition.
- the photosensitive element 300 is arranged between the display panel 200 and the protective screen 100, which makes the light propagation path between the protective screen 100 and the photosensitive element 300 shorter, and the light reflected by the finger waits for the light to reach the photosensitive element 300 to pass through the glass.
- the number of layers or the number of film structures is reduced, so the possibility that the reflected light from the finger will be received by the photosensitive element 300 increases, and the sensitivity of the photosensitive element 300 is improved;
- the photosensitive element 300 is arranged close to the protective screen 100 to cooperate with the condensing element 400
- the ability of the photosensitive element 300 to obtain the light to be measured is double enhanced, the sensitivity of the photosensitive element is improved, and the possibility of misjudgment is reduced.
- the display panel 200 in the present application can be an OELD (Organic Light-Emitting Diode, organic electro-laser display) panel, or a Micro-LED (Micro Light Emitting Diode, micro light-emitting diode) panel, wherein the display panel 200 It includes an organic active light emitting pixel matrix 210 or a micro light emitting diode pixel matrix 220; the display device 10 includes a front panel, which is located between the active light emitting display panel 210 and the protective screen 100, or the micro light emitting diode pixels Between the matrix 220 and the protective screen 100; the photosensitive element 300 is arranged on the front plate.
- OELD Organic Light-Emitting Diode, organic electro-laser display
- Micro-LED Micro Light Emitting Diode, micro light-emitting diode
- Such an arrangement can make the photosensitive element 300 and the condensing element 400 be arranged on the front panel as close to the protective screen 100 as possible, which is beneficial to reduce the propagation path of the light to be detected, thereby increasing the light to be detected by the photosensitive element 300.
- the possibility of improving the sensitivity of the photosensitive element 300 can make the photosensitive element 300 and the condensing element 400 be arranged on the front panel as close to the protective screen 100 as possible, which is beneficial to reduce the propagation path of the light to be detected, thereby increasing the light to be detected by the photosensitive element 300.
- the possibility of improving the sensitivity of the photosensitive element 300 can improve the sensitivity of the photosensitive element 300.
- the organic active light-emitting pixel matrix 210 includes white light-emitting diodes 210a, or the micro-light-emitting diode pixel matrix 220 includes white light-emitting diodes 210b; the photosensitive element 300 is arranged corresponding to the white light-emitting diodes.
- the white light-emitting diode is beneficial to improve the brightness of the display device 10.
- the photosensitive element 300 is arranged at a position corresponding to the white light-emitting diode.
- the layers of the photosensitive element 300 have a weak influence on white light, which can avoid the effect of the photosensitive element 300 on the red, green and blue light-emitting diodes.
- the light transmittance constitutes an influence; and the photosensitive element 300 is not arranged on the red light emitting diode, the green light emitting diode and the blue light emitting diode, and the photosensitive element 300 is not arranged on one of the red light emitting diode, the green light emitting diode or the blue light emitting diode. , Which affects the light transmittance of the corresponding light-emitting diodes, and makes the light transmittances of the RGB pixels inconsistent, resulting in color deviation, affecting the display effect, and retaining the higher display effect of the display device 10.
- the display panel 200 in this application can also be a pixel array of a TFT-LCD (Thin Film Transistor-Liquid Crystal Display) display device 10, as shown in FIG. 3, where the display panel 200 includes a backlight module 230, A substrate 240, a second substrate 250 disposed opposite to the first substrate 240, and a liquid crystal layer disposed between the first substrate 240 and the second substrate 250; the first substrate 240 is provided with an active switch array
- the photosensitive element 300 is disposed between the second substrate 250 and the protective screen 100.
- the display panel 200 in the present application is a pixel array of TFT-LCD
- the film layer of the TFT-LCD is thicker
- the photosensitive element 300 is arranged on the first substrate (array substrate)
- the light to be detected will travel farther.
- the loss is greater. Therefore, in this application, the photosensitive element 300 is arranged between the second substrate 250 and the protective screen 100, closer to the protective screen 100, the propagation path of the light to be detected reflected when touched is shorter, and the recognition effect is better.
- the second substrate 250 may also be provided on the side of the first substrate close to the protective screen 100, and the photosensitive element 300 may be on the second substrate 250.
- the second substrate includes a pixel unit.
- the pixel unit 251 includes multiple red sub-pixels 251a, multiple blue sub-pixels 251b, multiple green sub-pixels 251c, and multiple white sub-pixels 251d.
- the photosensitive element 300 corresponds to It is arranged at the position of the white sub-pixel 251d.
- the white sub-pixel 251d includes a pixel electrode and a white color resistance corresponding to the pixel electrode.
- the white color resistance has a high light transmittance, which is beneficial to increase the brightness of the display device 10, and can prevent the photosensitive element 300 from interacting with the red sub-pixel 251a and the green sub-pixel 251b.
- the light transmittance of the blue sub-pixel 251c, and the light-sensing element 300 is disposed on one of the red light-emitting diodes, green light-emitting diodes, or blue light-emitting diodes.
- the light transmittance corresponding to the pixels is inconsistent, resulting in color deviation, affecting the display effect, and retaining the higher display effect of the display device 10.
- the thickness of the protective screen 100 is between 0.07-0.5 mm.
- the thinner the thickness of the protective screen 100 the shorter the distance the emitted light travels to enter the photosensitive element 300, and the lower the loss.
- the shorter the path the light to be detected at the corresponding position can also be received by the photosensitive element 300 at the corresponding position, and the distance is reflected The light is closer, which can effectively increase the light concentration of the concentrating element 400.
- the thickness of the protective screen 100 is not too thin, and it cannot protect the elements in other parts of the display device 10, and it is not too thick.
- the transmission loss of the light to be detected is large, and the light transmittance is reduced.
- the isolation layer 500 includes a recessed area formed around the photosensitive element 300 and gradually decreasing in thickness toward the photosensitive element 300;
- a semi-transmissive mask is used.
- the semi-transparent mask includes three parts, namely: a light-transmitting area 510, a light-shielding area 530, and a semi-transmitting area 520.
- the light-shielding area 510 forms the isolation layer 500 with the largest thickness
- the light-transmitting area 530 does not form the isolation layer 500
- the semi-transmitting area 520 forms a recessed area with a gradually changing thickness
- the corresponding light transmittance of the recessed area is gradually changed to form an arc
- the recessed area corresponds to the shape of the light-concentrating element 400 and is used to protect the light-concentrating element 400.
- the photosensitive element 300 is formed in the corresponding light-transmitting area, and the condensing element 400 is formed above the photosensitive element 300 and the recessed area, so that it is formed in the recessed area.
- the condensing element 400 is in the shape of a convex lens 410 to enhance the condensing effect; the diameter of the convex lens 410 is set to 10-75um, and the range of light transmittance is 60%-90%; the diameter of the convex lens cannot be set too large or too small, The light-collecting area of a photosensitive element is fixed. If it is too large, it will not collect more light.
- an encapsulation layer 430 is provided between the plurality of convex lenses 410 and the protective screen 100 to ensure that the convex lens 410 is flat.
- the condensing element 400 in the present application can be a convex lens, a micro lens, etc., or other optical elements that can condense light from different angles, as long as it is applicable.
- a light shielding layer 420 can be provided between the isolation layer 500 in the recessed area and the light concentrating element 400 to prevent the light emitted by the display panel 200 from passing through the light concentrating element 400, causing refraction or reflection, thereby affecting display effect.
- the photosensitive element 300 includes a first electrode layer 350, a first doped layer 340, an intrinsic layer 330, a second doped layer 320, and a second electrode layer 310 that are sequentially formed toward the protection screen 100;
- the light-concentrating element 400 is disposed above the second electrode layer 310;
- a protective layer 360 is disposed between the second doped layer 340 and the second electrode layer 310, the protective layer 360 is provided with via holes, and the The second electrode layer 310 is connected to the second doped layer 320 through the via hole.
- the thickness of the intrinsic layer 330 is greater than the thickness of the second doped layer 340 and also greater than the thickness of the second doped layer 320.
- the first doped layer 340 is an N-type doped layer
- the second doped layer 320 is a P-type doped layer
- the first electrode layer 350 is an anode
- the second electrode layer is a cathode.
- the photosensitive element 300 further includes a separation layer disposed between the P-type doped layer 321 and the N-type doped layer 341, and the separation layer covers the sidewall of the N-type doped layer 341.
- the separation layer is used to isolate the electrical properties of the N-type doped layer 341 and the P-type doped layer 321, and prevent the N-type doped layer 341 and the P-type doped layer 321 from being electrically connected during the formation process.
- a separation layer can also be formed above the N-type doped layer 341, an opening is provided in the separation layer, and the square-shaped levy layer 330 is connected to the N-type doped layer 341 through the opening;
- the display device 10 further includes a readout active switch 600 connected to the photosensitive element 300 in a one-to-one correspondence, and the readout active switch 600 includes a transparent electrode layer 610 formed above the readout active switch 600 ; The transparent electrode layer 610 and the first electrode layer 350 are formed by the same process.
- the readout active switch 600 further includes a gate 630, a source 640, and a drain 650.
- the source 640 is connected to the transparent electrode layer 610.
- the display device 10 further includes an identification circuit.
- the gate 630 And the drain electrode 650 are respectively connected to the identification circuit, the transparent electrode layer 610 is connected to the first electrode layer 350, and the readout active switch 600 is used to identify the photosensitive element 300 after collecting light of different intensity.
- the active read switch 600 transmits the photosensitive current to the corresponding photosensitive current identification chip for data processing.
- a touch controller which includes a protective screen 100, a backlight 710, and a photosensitive element 300.
- the protective screen 100 is disposed on the touch controller.
- the touch surface; the photosensitive element 300 is arranged between the display panel 200 and the protective screen 100; the photosensitive element 300 includes a photosensitive surface that receives light; the photosensitive surface of the photosensitive element 300 is provided with a condensing element 400, so
- the structure of the photosensitive element 300 and the structure of the isolation layer 500 are as described above, and will not be repeated here.
- the touch controller in this embodiment can be used for fingerprint recognition or as a touch module. After improvement It is installed on the display device 10 and used together.
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Abstract
Description
Claims (20)
- 一种显示装置,包括:保护屏,设置在所述显示装置的出光面;显示面板,与保护屏相对设置;以及感光元件,设置在所述显示面板和保护屏之间;其中,所述感光元件包括接收光线的感光面;所述感光面设置有聚光元件。
- 如权利要求1所述的一种显示装置,其中,所述显示面板包括有机主动发光像素矩阵或微型发光二极管像素矩阵;所述显示装置包括前板,所述前板位于所述有机主动发光像素矩阵和所述保护屏之间;所述感光元件设置在所述前板上。
- 如权利要求1所述的一种显示装置,其中,所述显示面板包括微型发光二极管像素矩阵;所述显示装置包括前板,所述前板位于所述微型发光二极管像素矩阵和所述保护屏之间;所述感光元件设置在所述前板上。
- 如权利要求2所述的一种显示装置,其中,所述有机主动发光像素矩阵包括白色发光二极管,所述感光元件对应所述白色发光二极管设置。
- 如权利要求3所述的一种显示装置,其中,所述微型发光二极管像素矩阵包括白色发光二极管;所述感光元件对应所述白色发光二极管设置.
- 如权利要求1所述的一种显示装置,其中,所述感光元件包括向所述保护屏方向依次形成的第一电极层、第一掺杂层、本征层、第二掺杂层和第二电极层;所述第二掺杂层和第二电极层之间设置有保护层,所述保护层设置有过孔,所述第二电极层通过所述过孔与所述第二掺杂层连接;所述感光元件设置有多个,相邻两个所述感光元件之间设置有隔离层,所述隔离层的厚度大于所述感光元件的厚度;所述隔离层包括形成在围绕所述感光元件,且厚度向靠近所述感光元件方向逐渐减小的凹陷区;所述第二电极层形成在所述隔离层上方,所述聚光元件位于所述第二电极层靠近保护屏的一侧,对应所述凹陷区设置。
- 如权利要求6所述的一种显示装置,其中,所述显示装置还包括与所述感光元件一一对应连接的读出主动开关,所述读出主动开关包括形成在所述读出主动开关上方的透明电极层;所述透明电极层和所述第一电极层通过同一制程形成。
- 如权利要求1所述的一种显示装置,其中,所述保护屏的厚度在0.07-0.5mm之间。
- 如权利要求1所述的一种显示装置,其中,所述显示面板包括:第一基板,所述第一基板上设置有主动开关阵列;与所述第一基板相对设置的第二基板;以及液晶层,设置在所述第一基板和所述第二基板之间;所述显示装置包括背光模组,为所述显示面板提供背光;其中,所述感光元件设置在所述第二基板与所述保护屏之间。
- 如权利要求9所述的一种显示装置,其中,所述第二基板包括像素单元,所述像素单元包括多个红色子像素、多个蓝色子像素、多个绿色子像素和多个白色子像素,所述感光元件与所述白色子像素对应设置。
- 如权利要求1所述的一种显示装置,其中,所述聚光元件为凸透镜或微透镜。
- 如权利要求11所述的一种显示装置,其中,所述凸透镜的直径设置为10-75um,透光率的范围为60%-90%。
- 如权利要求6所述的一种显示装置,其中,所述隔离层的使用半透掩膜板形成,所述半透掩模板包括三个部分,分别为:透光区、遮光区和半透区,所述遮光区形成隔离层厚度最大,所述透光区不形成隔离层,所述半透区形成厚度逐渐变化的凹陷区,所述凹陷区对应的透光率渐变,以形成弧形的所述凹陷区。
- 如权利要求6所述的一种显示装置,其中,多个所述聚光元件与所述保护屏之间设置封装层。
- 如权利要求6所述的一种显示装置,其中,所述隔离层与所述聚光元件之间设置遮光层,所述遮光层对应所述凹陷区设置。
- 一种显示装置,包括:保护屏,设置在所述显示装置的出光面;显示面板,与保护屏相对设置;以及感光元件,设置在所述显示面板和保护屏之间;其中,所述感光元件包括接收光线的感光面;所述感光面设置有聚光元件;所述感光元件包括向所述保护屏方向依次形成的第一电极层、第一掺杂层、本征层、第二掺杂层和第二电极层;所述第二掺杂层和第二电极层之间设置有保护层,所述保护层设置有过孔,所述第二电极层通过所述过孔与所述第二掺杂层连接;所述感光元件设置有多个,相邻两个所述感光元件之间设置有隔离层,所述隔离层的厚 度大于所述感光元件的厚度;所述隔离层包括形成在围绕所述感光元件,且厚度向靠近所述感光元件方向逐渐减小的凹陷区;所述第二电极层形成在所述隔离层上方,所述聚光元件位于所述第二电极层靠近保护屏的一侧,对应所述凹陷区设置;所述显示装置还包括与所述感光元件一一对应连接的读出主动开关,所述读出主动开关包括形成在所述读出主动开关上方的透明电极层;所述透明电极层和所述第一电极层通过同一制程形成。
- 一种触控器,包括:保护屏,设置在所述触控器的触摸面;以及感光元件,设置在一背光源和所述保护屏之间;其中,所述感光元件包括接收光线的感光面;所述感光元件的感光面设置有聚光元件。
- 如权利要求17所述的一种触控器,其中,所述感光元件包括向所述保护屏方向依次形成的第一电极层、第一掺杂层、本征层、第二掺杂层和第二电极层;所述第二掺杂层和第二电极层之间设置有保护层,所述保护层设置有过孔,所述第二电极层通过所述过孔与所述第二掺杂层连接;所述感光元件设置有多个,相邻两个所述感光元件之间设置有隔离层,所述隔离层的厚度大于所述感光元件的厚度;所述隔离层包括形成在围绕所述感光元件,且厚度向靠近所述感光元件方向逐渐减小的凹陷区;所述第二电极层形成在所述隔离层上方,所述聚光元件位于所述第二电极层靠近保护屏的一侧,对应所述凹陷区设置;所述隔离层的使用半透掩膜板形成,所述半透掩模板包括三个部分,分别为:透光区、遮光区和半透区,所述遮光区形成隔离层厚度最大,所述透光区不形成隔离层,所述半透区形成厚度逐渐变化的凹陷区,凹陷区对应的透光率渐变,以形成弧形的凹陷区。
- 如权利要求17所述的一种触控器,其中,所述聚光元件为凸透镜或微透镜;所述多个聚光元件与所述保护屏之间设置封装层;所述隔离层与所述聚光元件之间设置遮光层,所述遮光层对应所述凹陷区设置。
- 如权利要求19所述的一种触控器,其中,所述凸透镜的直径设置为10-75um,透光率的范围为60%-90%。
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