WO2020248353A1 - 有机发光显示面板及其制造方法、封装薄膜 - Google Patents

有机发光显示面板及其制造方法、封装薄膜 Download PDF

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Publication number
WO2020248353A1
WO2020248353A1 PCT/CN2019/099713 CN2019099713W WO2020248353A1 WO 2020248353 A1 WO2020248353 A1 WO 2020248353A1 CN 2019099713 W CN2019099713 W CN 2019099713W WO 2020248353 A1 WO2020248353 A1 WO 2020248353A1
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Prior art keywords
layer
inorganic
organic light
auxiliary
pixel definition
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PCT/CN2019/099713
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English (en)
French (fr)
Inventor
王杲祯
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/619,187 priority Critical patent/US20210328181A1/en
Publication of WO2020248353A1 publication Critical patent/WO2020248353A1/zh
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering

Definitions

  • the present invention relates to the field of Organic Light-Emitting Diode (OLED) display, in particular to an organic light-emitting display panel, a manufacturing method thereof, and a packaging film.
  • OLED Organic Light-Emitting Diode
  • Organic light-emitting display panels have the advantages of low cost, wide viewing angle, high contrast, and bendable. At present, they have achieved remarkable results in small-size and large-size applications, and continue to invade liquid crystal displays (Liquid Crystal Display, LCD) market share.
  • LCD Liquid Crystal Display
  • Organic light-emitting devices are an important part of organic light-emitting display panels, and water and oxygen have a great impact on their lifespan.
  • One is easy to react with the conductive material of the cathode of the organic light-emitting device; the other is easy to interact with the hole transport layer of the organic light-emitting device.
  • a chemical reaction occurs with the electron transport layer, which causes the organic light-emitting device to fail.
  • the prior art organic light emitting display panel adopts thin film packaging (Thin Film Encapsulation, TFE) method for packaging organic light-emitting devices.
  • the packaging film used in the TFE method includes overlapping inorganic and organic layers to prevent water and oxygen from entering the organic light-emitting device.
  • the current packaging film used in the TFE method still has insufficient water and oxygen barrier capability, especially in the case of a package protruding structure, the packaging film is prone to peeling in the area covering the protruding structure.
  • the inorganic layer breaks, thereby forming a water and oxygen channel. Specifically, water and oxygen molecules invade from the holes of the inorganic layer through the water and oxygen channels.
  • the organic layer has no ability to block water and oxygen. The water and oxygen molecules will quickly pass through the organic layer, and then continue to move at the boundary between the organic layer and the inorganic layer. When the hole in the next inorganic layer is found, the intrusion continues until it invades the organic light-emitting device. It can be seen that the fracture of the inorganic layer will seriously affect the barrier ability of the packaging film to water and oxygen molecules.
  • the present disclosure provides an organic light emitting diode display panel.
  • the organic light emitting diode display panel includes a pixel defining layer, a supporting column, and a first inorganic layer for packaging the organic light emitting device.
  • the supporting column is located on the pixel defining layer, and the first inorganic layer covers the supporting column and the pixel.
  • the top surface of the area above the pixel definition layer is not flush with the top surface of other areas.
  • the organic light emitting display panel further includes an auxiliary encapsulation layer, and the auxiliary encapsulation layer is located on at least one of the first inorganic layer. And at least cover the orthographic projection area of the support column on the pixel definition layer.
  • the present disclosure additionally provides a packaging film.
  • the packaging film includes a main packaging layer and an auxiliary packaging layer.
  • the top surface of the main packaging layer in a predetermined area is not flush with the top surfaces of other areas, and the auxiliary packaging layer is located on at least one side surface of the main packaging layer and covers at least the predetermined area.
  • the present disclosure also provides a method for manufacturing the organic light emitting display panel.
  • the method includes:
  • a first inorganic layer and an auxiliary encapsulation layer are formed.
  • the first inorganic layer covers the organic light-emitting device, the supporting column and the pixel definition layer, and is located on the top surface of the area above the pixel definition layer and the top surface of other areas.
  • the auxiliary encapsulation layer is located on at least one side of the first inorganic layer, and at least covers the orthographic projection area of the support column on the pixel definition layer;
  • a second inorganic layer covering the organic layer is formed.
  • an auxiliary encapsulation layer is added on at least one side of the first inorganic layer, and the auxiliary encapsulation layer covers the orthographic projection area of the support column on the pixel definition layer. Even if the inorganic layer is broken when covering the support column, the The water and oxygen channel generated at the fracture will also be blocked by the auxiliary packaging layer, thereby ensuring the water and oxygen barrier ability of the packaging film to the organic light-emitting device.
  • FIG. 1 is a schematic diagram of the structure of the first embodiment of the packaging film of the present invention.
  • FIG. 2 is a schematic diagram of the structure of a second embodiment of the packaging film of the present invention.
  • FIG. 3 is a schematic diagram of the structure of a third embodiment of the packaging film of the present invention.
  • FIG. 4 is a schematic structural diagram of the first embodiment of the organic light emitting display panel of the present invention.
  • FIG. 5 is a schematic structural diagram of a second embodiment of the organic light emitting display panel of the present invention.
  • FIG. 6 is a schematic structural diagram of a third embodiment of the organic light emitting display panel of the present invention.
  • FIG. 7 is a schematic flowchart of an embodiment of a method for manufacturing an organic light emitting display panel of the present invention.
  • the primary purpose of the present invention is to add an auxiliary encapsulation layer on at least one side of the inorganic layer, and the auxiliary encapsulation layer covers the orthographic projection area of the support column on the pixel defining layer, even if the inorganic layer is broken when covering the support column, The water and oxygen channel at the fracture will also be blocked by the auxiliary packaging layer, so as to ensure the water and oxygen barrier capability of the packaging film to the organic light-emitting device.
  • FIG. 1 is a schematic structural diagram of an embodiment of the packaging film of the present invention.
  • the packaging film 100 includes a main packaging layer 110 and an auxiliary packaging layer 120.
  • the present invention takes an application scenario where the main packaging layer 110 is broken due to the height difference as an example.
  • the area where the protruding structure is located is marked as 130, and the main packaging layer 110 can be broken into two parts when covering the protruding structure, namely the main body part 110a and the protruding part 110b as shown in FIG.
  • the top surface of the exit portion 110b and the top surface of the main body portion 110a are not flush.
  • the auxiliary packaging layer 120 covers one side of the main packaging layer 110, such as the lower side shown in FIG. 1, and it covers at least the area 130 where the protruding structure is located.
  • the auxiliary encapsulation layer 120 may completely cover the area 130 where the protruding structure is located, and at the same time, it may extend outward and partially overlap the lower side of the main portion 110a to achieve a larger area of coverage.
  • the packaging film 100 adds an auxiliary packaging layer 120 on at least one side of the main packaging layer 110, and the auxiliary packaging layer 120 covers the area 130 where the protrusion structure is located, even if the main packaging layer 110 covers the area 130 where the protrusion structure is located.
  • the auxiliary packaging layer 120 covers the area 130 where the protrusion structure is located, even if the main packaging layer 110 covers the area 130 where the protrusion structure is located.
  • the material of the main encapsulation layer 110 may be an inorganic substance, such as one or more of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and the like.
  • the presence of the protruding portion 110b allows the main packaging layer 110 to cover the device it protects.
  • the covered device may have an uneven surface, such as a protruding mesa structure.
  • the main body portion 110a covers the part with a flat surface of the protected device, and the protruding part 110b covers the above-mentioned protruding mesa structure, so as to realize the adaptability of the main packaging layer 110 to the device it protects And coverage.
  • the auxiliary encapsulation layer 120 may be made of materials with high step coverage and good film-forming compactness, such as inorganic substances, including but not limited to one or more of aluminum oxide, zirconium oxide, and titanium oxide.
  • the material of the auxiliary encapsulation layer 120 is aluminum oxide, and the auxiliary encapsulation layer 120 may be made by an atomic layer deposition (ALD) process.
  • ALD atomic layer deposition
  • physical vapor deposition Physical Vapor Deposition
  • PVD Physical Vapor Deposition
  • Pulsed laser deposition Pulsed laser
  • the auxiliary packaging layer 120 is produced by any film forming process such as PLD and magnetron sputtering.
  • the thickness of the auxiliary encapsulation layer 120 may be smaller than the thickness of the main encapsulation layer 110, and the step coverage of the main encapsulation layer 110 may be smaller than the step coverage of the auxiliary encapsulation layer 120.
  • the above-mentioned step coverage can be understood as the coverage effect of the encapsulation layer on the structure with a height difference.
  • the encapsulation layer covers the higher part and covers the lower part, and the encapsulation layer (ie the main encapsulation layer 110) at the junction of the height Discontinuity occurs, that is, a fracture occurs, and complete coverage of this area is not formed.
  • the step coverage of the encapsulation layer and the material constituting the encapsulation layer is low; if there is no such discontinuity or fracture, It is considered that the step coverage of the encapsulation layer and the material constituting the encapsulation layer is relatively high.
  • the auxiliary encapsulation layer 120 may cover one side of the main encapsulation layer 110, and is not limited to the lower side shown in FIG. 1, or it may cover the upper side of the main encapsulation layer 110 (as shown in FIG. 2), or it may cover Both sides of the main packaging layer 110 (as shown in FIG. 3).
  • the aforementioned encapsulation film 100 covers the surface to be encapsulated with different characteristics through the combination of the main encapsulation layer 110 and the auxiliary encapsulation layer 120 according to their respective structural characteristics, that is, the main encapsulation layer 110 covers the entire coverage area, and the auxiliary encapsulation
  • the layer 120 forms compensation or enhanced coverage for the area where the main packaging layer 110 is not well covered (referred to as the predetermined area, such as the area 130 where the aforementioned protrusion structure is located).
  • the predetermined area such as the area 130 where the aforementioned protrusion structure is located.
  • the auxiliary encapsulation layer 120 can be used to strengthen the main encapsulation layer 110.
  • the water and oxygen barrier properties can be between 10 -4 to 10 -6 g/cm 2 /day, and the water and oxygen barrier properties are very good.
  • the aforementioned packaging film 100 can be applied to the packaging structure of an organic light emitting display panel to provide protection for components including organic light emitting devices.
  • the encapsulation of the organic light emitting device is taken as an example below, and detailed description will be given in conjunction with the drawings. It should be noted that the same reference numbers are used throughout the present invention to identify the same structural elements.
  • FIG. 4 is a schematic structural diagram of the first embodiment of the organic light emitting display panel of the present invention.
  • the organic light emitting display panel may include an encapsulation film 100, a substrate 200, a pixel definition layer 300, a supporting pillar 400, and an organic light emitting device 700.
  • Pixel Define Layer Layer (PDL) 300 is located on the substrate 200 and is used to define the pixel area of the organic light-emitting display panel.
  • the organic light-emitting device 700 is disposed on the substrate 200 and is located in the pixel area defined by the pixel definition layer 300.
  • PDL Pixel Define Layer Layer
  • the organic light-emitting device 700 is disposed on the substrate 200 and is located in the pixel area defined by the pixel definition layer 300.
  • the support column (Photo Spacer, PS) ) 400 is located on the pixel definition layer 300, the support pillar 400 can be a cylinder, truncated cone, cube, cuboid, prism, etc.
  • the packaging film 100 covers the pixel definition layer 300 and the support pillar 400.
  • the substrate 200 is a base substrate of an organic light-emitting display panel, and is used to carry various structural layers and electronic components of the organic light-emitting display panel.
  • the substrate 200 is a flexible plate with bendable characteristics, and its main component includes but is not limited to polyimide (PI).
  • the substrate 200 may be covered with a buffer layer, which has a water and oxygen barrier function, and its main components include but are not limited to silicon nitrogen compounds, silicon oxygen compounds, silicon oxynitride, and the like.
  • the substrate 200 may also be provided with various switching devices and wiring for realizing screen display of the organic light emitting display panel, such as TFT (Thin Film Transistor, thin film transistor).
  • the organic light emitting device 700 may include a control circuit layer (also called an Array circuit layer), an anode, a hole transport layer (HTL), an organic light emitting layer, an electron transport layer (ETL), and a cathode, which are sequentially disposed on the substrate 200.
  • a control circuit layer also called an Array circuit layer
  • an anode also called an Array circuit layer
  • HTL hole transport layer
  • organic light emitting layer organic light emitting layer
  • ETL electron transport layer
  • cathode cathode
  • the packaging film 100 may include a first inorganic layer 110 (that is, the aforementioned main packaging layer 110), an auxiliary packaging layer 120, an organic layer 500, and a second inorganic layer 600.
  • the first inorganic layer 110 covers the cathode of the organic light emitting device 700 and covers the pixel defining layer 300 and the supporting pillar 400.
  • the first inorganic layer 110 also extends to the side of the organic light emitting device 700 to connect the organic light emitting device 700 Packaged on the substrate 200.
  • the organic substance layer 500 is located on the first inorganic substance layer 110, and it can be produced by using an ink-jet printing (IJP) process.
  • IJP ink-jet printing
  • the second inorganic layer 600 covers the organic layer 500 and extends to the side of the organic layer 500 to cover the first inorganic layer 110.
  • the second inorganic material layer 600 has the function of blocking water and oxygen, and can be made of inorganic materials.
  • the material and manufacturing process of the second inorganic layer 600 and the first inorganic layer 110 may be the same, for example, chemical vapor deposition (Chemical Vapor Deposition) may be used. Vapor Deposition, CVD) process.
  • the support pillar 400 as shown in FIG. 4 serves as a support between the mask plate and the pixel definition layer 300.
  • the height of the support pillar 400 is generally between 1-3 ⁇ m.
  • the step coverage of the first inorganic substance layer 110 is poor, and the first inorganic substance layer 110
  • the thickness of the material layer 110 is usually between 0.5-1.5 ⁇ m, so that when the first inorganic material layer 110 is formed on the support column 400, there is a high probability that fracture will occur, causing the first inorganic material layer 110 to cover the support column.
  • 400 and the pixel definition layer 300 are easily broken into two parts, namely the main part 110a and the protruding part 110b as shown in FIG. 4. The top surface of the protruding part 110b and the top surface of the main part 110a are not flush.
  • the auxiliary encapsulation layer 120 is disposed on the lower side of the first inorganic layer 110, and it covers at least the orthographic projection area of the support pillar 400 on the pixel definition layer 300, that is, the auxiliary encapsulation layer 120 covers at least the top of the support pillar 400. Face and side.
  • the auxiliary encapsulation layer 120 may completely cover the orthographic projection area of the pixel definition layer 300 on the substrate 200. In other words, the orthographic projection of the pixel definition layer 300 on the first inorganic layer 110 falls on the auxiliary encapsulation layer 120.
  • the auxiliary encapsulation layer 120 overlaps a part of the lower side of the main portion 110a of the first inorganic layer 110, so as to achieve a larger area of coverage.
  • the thickness of the auxiliary encapsulation layer 120 can be between 20 and 100 nm, and the material can be made of materials with higher step coverage and better film-forming compactness, such as inorganic substances, including but not limited to alumina, One or more of zirconium oxide and titanium oxide.
  • the auxiliary encapsulation layer 120 may be made by an atomic layer deposition process.
  • any film forming process such as physical vapor deposition, pulsed laser deposition, magnetron sputtering, etc. may also be used to prepare the auxiliary encapsulation layer 120.
  • the thickness of the auxiliary encapsulation layer 120 may be smaller than the thickness of the main encapsulation layer 110, and the step coverage of the first inorganic layer 110 may be smaller than the step coverage of the auxiliary encapsulation layer 120.
  • the organic light emitting display panel through the combination of the first inorganic layer 110 and the auxiliary encapsulation layer 120, covers the surfaces of the support pillar 400 and the pixel definition layer 300 with different characteristics according to their respective structural characteristics, that is, the first inorganic layer
  • the object layer 110 covers the entire coverage area, and the auxiliary encapsulation layer 120 compensates or strengthens the coverage for areas where the first inorganic layer 110 has a poor coverage effect (for example, the orthographic projection area of the support pillar 400 on the pixel definition layer 300)
  • the auxiliary encapsulation layer 120 makes the encapsulation film 100 still have a complete film layer that blocks water and oxygen molecules, and it should not
  • the auxiliary encapsulation layer 120 can be used to strengthen the above-mentioned area of the first inorganic material layer 110 that may be fractured, so as to provide a film with a higher
  • the auxiliary encapsulation layer 120 may also cover the upper side of the first inorganic layer 110. As shown in FIG. 5, the auxiliary encapsulation layer 120 directly covers the supporting pillar 400, specifically covering the supporting pillar. The top surface and the side surface of 400, and the upper surface area of the pixel definition layer 300 adjacent to the support pillar 400.
  • the auxiliary encapsulation layer 120 also covers the area with poor coverage of the first inorganic layer 110 (for example, the orthographic projection area of the support pillar 400 on the pixel definition layer 300) to compensate or strengthen the coverage, and the first inorganic layer 110 is The water and oxygen channel at the fracture will be blocked by the auxiliary encapsulation layer 120, so as to ensure the water and oxygen barrier ability of the organic light emitting device 700, which is beneficial to guarantee the normal use of the organic light emitting device 700.
  • the auxiliary encapsulation layer 120 may also cover both sides of the first inorganic layer 110, that is, the auxiliary encapsulation layer 120 includes two parts, one part directly covers the support pillar 400, specifically covering the support pillar 400 The top surface and the side surface, and the upper surface area of the pixel definition layer 300 adjacent to the support pillar 400; the other part covers the upper side of the first inorganic layer 110, which may be the same as the arrangement of the auxiliary encapsulation layer 120 in the embodiment shown in FIG. 4 .
  • the auxiliary encapsulation layer 120 forms compensation and enhanced coverage for the first inorganic layer 110, and makes full use of the relatively high step coverage and high density of the auxiliary encapsulation layer 120.
  • the first inorganic layer 110 is used as the encapsulation body.
  • a relatively complete barrier film layer of water and oxygen molecules is formed, which provides effective packaging protection for the organic light emitting device 700 on one side of the covering surface.
  • the packaging structure of the organic light-emitting device 700 further includes an organic layer 500 and a second inorganic layer 600.
  • the first inorganic layer 110, the organic layer 500, and the second inorganic layer At least one of the two inorganic layer 600 and the auxiliary encapsulation layer 120 may be doped with a water-absorbing material.
  • the water-absorbing material can be used to absorb water molecules invaded into the first inorganic material layer 110, the organic material layer 500, the second inorganic material layer 600 and the auxiliary encapsulation layer 120.
  • the introduction of the water-absorbing material provides another layer for blocking water molecules. The guarantee increases the difficulty for water molecules to reach the organic light emitting device 700, and further improves the ability to block water molecules.
  • the water-absorbing material may be nano-scale calcium oxide, that is, nano-scale calcium oxide particles, and the doping concentration of the water-absorbing material may be directed along the second inorganic layer 600 to the direction of the supporting pillar 400 and the pixel defining layer 300 Increasing sequentially, that is, the closer the first inorganic layer 110 is to the area where fracture may occur, the higher the doping concentration of the water-absorbing material is.
  • FIG. 7 is a schematic flowchart of an embodiment of a method for manufacturing an organic light emitting display panel of the present invention. Referring to FIG. 7, the manufacturing method of the organic light emitting display panel includes:
  • S702 forming a pixel definition layer and a support pillar on the pixel definition layer on the substrate.
  • S703 Form an organic light emitting device on the substrate, where the organic light emitting device is located in an area defined by the pixel definition layer.
  • S704 Form a first inorganic layer and an auxiliary encapsulation layer, the first inorganic layer covers the organic light-emitting device, the supporting column and the pixel definition layer, and the top surface of the area above the pixel definition layer is not flush with the top surface of other areas
  • the auxiliary encapsulation layer is located on at least one side of the first inorganic layer and covers at least the orthographic projection area of the support column on the pixel definition layer.
  • an auxiliary encapsulation layer is added on at least one side of the first inorganic layer, and the auxiliary encapsulation layer covers the orthographic projection area of the support column on the pixel definition layer, even if the inorganic layer is broken when covering the support column, The water and oxygen channel generated at the fracture will also be blocked by the auxiliary encapsulation layer, thereby ensuring the water and oxygen barrier capability of the organic light-emitting device.
  • the manufacturing method can be used to manufacture the aforementioned organic light-emitting display panel, and the various structural elements prepared by the manufacturing method can be referred to above, and will not be repeated here.

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Abstract

一种有机发光显示面板及其制造方法、封装薄膜。封装薄膜包括主封装层（110）和辅助封装层（120），通过在主封装层的至少一侧增设辅助封装层，且该辅助封装层覆盖支撑柱（400）在像素定义层（300）上的正投影区域，即使主封装层在覆盖支撑柱时发生断裂，在该断裂处产生的水氧通道也会被辅助封装层阻断，从而确保封装薄膜对有机发光器件的水氧阻隔能力。

Description

有机发光显示面板及其制造方法、封装薄膜 技术领域
本发明涉及有机发光（Organic Light-Emitting Diode, OLED）显示领域，尤其涉及一种有机发光显示面板及其制造方法、封装薄膜。
 背景技术
有机发光显示面板具有成本低、视角宽、对比度高、以及可弯折等优点，目前在小尺寸和大尺寸等方面的应用均取得显著成效，并在不断侵占液晶显示器（Liquid Crystal Display, LCD）的市场份额。
有机发光器件作为有机发光显示面板的重要组成部分，水氧对其寿命存在较大影响，一是容易与有机发光器件的阴极的导电材料发生反应；二是容易与有机发光器件的空穴传输层和电子传输层发生化学反应，进而引起有机发光器件失效。为了解决这个问题，现有技术的有机发光显示面板采用薄膜封装（Thin Film Encapsulation, TFE）方式对有机发光器件进行封装。TFE方式所采用的封装薄膜包括交叠的无机物层和有机物层，用以防止水氧入侵至有机发光器件。
但是，当前TFE方式所采用的封装薄膜对水氧的阻隔能力仍有不足，尤其是对于封装凸出结构的情况下，封装薄膜在覆盖该凸出结构的区域容易发生断裂（peeling），其中最常见的是无机物层发生断裂，从而形成水氧通道。具体地，水氧分子通过水氧通道从无机物层的孔洞侵入，有机物层没有阻隔水氧的能力，水氧分子会快速通过有机物层，然后在有机物层和无机物层的交界继续移动，并在找到下一个无机物层的孔洞时继续向内侵入，直至入侵至有机发光器件。由此可见，无机物层的断裂会严重影响封装薄膜对水氧分子的阻隔能力。
 技术问题
由于现有的无机物层发生断裂会导致封装薄膜对有机发光器件的水氧阻隔能力不足的问题。
 技术解决方案
本揭示提供一种有机发光二极管显示面板。所述有机发光二极管显示面板包括像素定义层、支撑柱及用于封装有机发光器件的第一无机物层，所述支撑柱位于像素定义层上，所述第一无机物层覆盖支撑柱和像素定义层，且其位于像素定义层上方区域的顶面与其他区域的顶面未齐平，所述有机发光显示面板还包括辅助封装层，所述辅助封装层位于第一无机物层的至少一侧，且至少覆盖支撑柱在像素定义层上的正投影区域。
本揭示另外提供一种封装薄膜。所述封装薄膜包括主封装层和辅助封装层，主封装层在预定区域的顶面与其他区域的顶面未齐平，辅助封装层位于主封装层的至少一个侧面，且至少覆盖预定区域。
本揭示还提供一种有机发光显示面板的制造方法。该方法包括：
提供基板；
在所述基板上形成像素定义层和位于像素定义层上的支撑柱；
在所述基板上形成有机发光器件，且所述有机发光器件位于所述像素定义层所限定的区域内；
形成第一无机物层和辅助封装层，所述第一无机物层覆盖所述有机发光器件、支撑柱和像素定义层，且其位于像素定义层上方区域的顶面与其他区域的顶面未齐平，所述辅助封装层位于所述第一无机物层的至少一侧，且至少覆盖所述支撑柱在像素定义层上的正投影区域；
在所述第一无机物层上形成有机物层；
形成覆盖所述有机物层的第二无机物层。
 有益效果
本发明通过在第一无机物层的至少一侧增设辅助封装层，且该辅助封装层覆盖支撑柱在像素定义层上的正投影区域，即使无机物层在覆盖支撑柱时发生断裂，在该断裂处产生的水氧通道也会被辅助封装层阻断，从而确保封装薄膜对有机发光器件的水氧阻隔能力。
 附图说明
图1为本发明的封装薄膜第一实施例的结构示意图；
图2为本发明的封装薄膜第二实施例的结构示意图；
图3为本发明的封装薄膜第三实施例的结构示意图；
图4为本发明的有机发光显示面板第一实施例的结构示意图；
图5为本发明的有机发光显示面板第二实施例的结构示意图；
图6为本发明的有机发光显示面板第三实施例的结构示意图；
图7为本发明的有机发光显示面板的制造方法一实施例的流程示意图。
 本发明的实施方式
本发明的首要目的是：通过在无机物层的至少一侧增设辅助封装层，且辅助封装层覆盖支撑柱在像素定义层上的正投影区域，即使无机物层在覆盖支撑柱时发生断裂，该断裂处的水氧通道也会被辅助封装层阻断，以此确保封装薄膜对有机发光器件的水氧阻隔能力。
下面将结合本发明实施例中的附图，对本发明所提供的各个示例性的实施例的技术方案进行清楚、完整地描述。在不冲突的情况下，下述各个实施例及其技术特征可以相互组合。
本发明提到的方向用语，例如上、下、顶、底、前、后、左、右、内、外、侧、周围、中央、水平、横向、垂直、纵向、轴向、径向、最上层或最下层等，仅是参考附图的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
图1为本发明的封装薄膜一实施例的结构示意图。参见图1，所述封装薄膜100包括主封装层110和辅助封装层120。
在封装薄膜100覆盖凸出结构时，所述主封装层110覆盖凸出结构的区域的顶面和其他区域的顶面具有高度差，即这两个区域的顶面未齐平。为了更贴切地描述相比现有技术的改进，本发明以主封装层110因存在所述高度差而发生断裂的应用场景为例进行说明。请参阅图1所示，凸出结构所在的区域标示为130，主封装层110在覆盖凸出结构时可以断裂为两部分，即如图1所示的主体部分110a和凸出部分110b，凸出部分110b的顶面和主体部分110a的顶面未齐平。
所述辅助封装层120覆盖在主封装层110的一侧，例如图1所示的下侧，且其至少覆盖凸出结构所在的区域130。可选地，辅助封装层120可以全部覆盖凸出结构所在的区域130，同时还会向外延伸并与主体部分110a的下侧有一部分重叠以实现较大面积的覆盖。
所述封装薄膜100通过在主封装层110的至少一侧增设辅助封装层120，且该辅助封装层120覆盖凸出结构所在的区域130，即使主封装层110在覆盖凸出结构所在的区域130时发生断裂，在该断裂处产生的水氧通道也会被辅助封装层120阻断，从而确保主封装层110对所封装器件的水氧阻隔能力，有利于保障所封装器件的正常使用。
详细而言，所述主封装层110的材料可以是无机物，例如硅的氮化物、硅的氮氧化物、硅的氧化物、铝的氧化物等的一种或多种。所述凸出部分110b的存在允许主封装层110在覆盖其所保护的器件时，被覆盖的器件可以具有不平整的表面，例如具有凸出的台状结构，在这种情况下，主体部分110a覆盖在被保护器件的具有平整表面的部分，而所述凸出部分110b覆盖在上述凸出的台状结构上，以此实现主封装层110对其所保护的器件具有适应性的贴合以及覆盖。
所述辅助封装层120可选用台阶覆盖率较高、成膜致密性较好的材料制得，例如无机物，包括但不限于为氧化铝、氧化锆、氧化钛的一种或多种。在一具体实施例中，所述辅助封装层120的材质为氧化铝，辅助封装层120可以通过原子层沉积（Atomic Layer Deposition, ALD）工艺制得。当然，根据各种材质的成膜特性，具体实施例也可以采用物理气相沉积（Physical Vapor Deposition, PVD）、脉冲激光沉积（Pulsed laser deposition, PLD）、磁控溅射等任一种成膜工艺制得辅助封装层120。所述辅助封装层120的厚度可以小于主封装层110的厚度，而主封装层110的台阶覆盖率可以小于辅助封装层120的台阶覆盖率。
应当指出的是，上述台阶覆盖率可以理解为封装层对存在高度落差的结构的覆盖效果。举例而言，对于上述存在高度落差的结构的覆盖场景，封装层对较高的部分形成了覆盖，对较低的部分也形成了覆盖，而在高低交界处封装层（即主封装层110）产生了不连续，即发生了断裂，没有对这一区域形成完整的覆盖，此时就认为该封装层和构成该封装层的材料的台阶覆盖率较低；若不存在上述不连续或断裂，则认为该封装层和构成该封装层的材料的台阶覆盖率较高。
该辅助封装层120可以覆盖在主封装层110的一侧，并不限于图1所示的下侧，或者可以覆盖在主封装层110的上侧（如图2所示），也可以覆盖在主封装层110的两侧（如图3所示）。
前述封装薄膜100通过主封装层110和辅助封装层120的组合，根据各自的结构特点，对所要封装的表面形成不同特点的覆盖，即主封装层110为整个覆盖范围内的覆盖，而辅助封装层120针对主封装层110覆盖效果欠佳的区域（称为预定区域，例如前述凸出结构所在的区域130）形成弥补或加强覆盖，当主封装层110上出现主体部分110a和凸出部分110b之间发生断裂时，辅助封装层120使得封装薄膜100依然具有完整的阻隔水氧分子的膜层，而当不存在上述断裂时，辅助封装层120可用于加强主封装层110的上述有可能产生断裂的预定区域，从而在被保护器件的一侧提供水氧阻隔能力较高的膜层。例如，对于采用氧化铝制得的辅助封装层120，其水氧阻隔性可以介于10 -4~10 -6 g/cm 2/day之间，水氧阻隔能力非常良好。
应当指出的是，上述封装薄膜100可以应用于有机发光显示面板的封装结构中，为包括有机发光器件在内的部件提供保护。下面以对有机发光器件进行封装为例，并结合附图进行详细介绍。需要注意的是，本发明全文采用相同的标号标识相同的结构元件。
图4为本发明的有机发光显示面板第一实施例的结构示意图。参见图4，有机发光显示面板可以包括封装薄膜100、基板200、像素定义层300、支撑柱400及有机发光器件700。像素定义层（Pixel Define Layer, PDL）300位于基板200上，并用于限定有机发光显示面板的像素区域，有机发光器件700设置于基板200上且位于像素定义层300所限定的像素区域内，支撑柱（Photo Spacer, PS）400位于像素定义层300上，该支撑柱400可以是圆柱体、圆台、正方体、长方体、棱台等结构，封装薄膜100覆盖于像素定义层300和支撑柱400上。
所述基板200为有机发光显示面板的衬底基板，用于承载有机发光显示面板的各结构层及电子元件。为适应于有机发光显示面板的可弯折特性，基板200为具有可弯折特性的柔性板件，其主要成分包括但不限于为聚酰亚胺（Polyimide, PI）。可选地，基板200可覆盖有缓冲层（buffer layer），该缓冲层具有阻水隔氧功能，其主要成分包括不限于硅氮化合物、硅氧化合物、硅氮氧化物等。另外，该基板200还可以设置有用于实现有机发光显示面板进行画面显示的各种开关器件以及走线等，例如TFT（Thin Film Transistor, 薄膜晶体管）。
所述有机发光器件700可以包括依次设置于基板200上的控制电路层（又称Array电路层 ）、阳极、空穴传输层（HTL）、有机发光层、电子传输层（ETL）以及阴极，具体可参阅现有技术。
所述封装薄膜100可以包括第一无机物层110（即前述主封装层110）、辅助封装层120、有机物层500以及第二无机物层600。第一无机物层110覆盖于有机发光器件700的阴极上，并覆盖像素定义层300和支撑柱400，同时第一无机物层110还向有机发光器件700的侧方延伸以将有机发光器件700封装于基板200上。所述有机物层500位于第一无机物层110上，其可以采用喷墨打印(Ink-jet Printing, IJP)工艺制得。所述第二无机物层600覆盖有机物层500，并向有机物层500的侧方延伸以覆盖第一无机物层110。其中，第二无机物层600具有阻水隔氧功能，可以采用无机材料制得。可选地，所述第二无机物层600和第一无机物层110的材质、制造工艺等可以相同，例如可以均采用化学气相沉积（Chemical Vapor Deposition, CVD）工艺。
有机发光器件700的制作过程中会使用精密的掩膜板（FMM）来蒸镀有机发光层等。为了避免掩膜板直接和基板200接触而导致像素定义层300损坏，如图4所示的支撑柱400作为掩膜板和像素定义层300之间的支撑。该支撑柱400的高度一般介于1-3μm之间，由于氮化硅、氧化硅、氮氧化硅等无机物的材料特性导致第一无机物层110的台阶覆盖率较差，并且第一无机物层110的厚度通常介于0.5-1.5μm之间，从而使得第一无机物层110在支撑柱400上成膜时很大几率会发生断裂，导致该第一无机物层110在覆盖支撑柱400和像素定义层300时容易断裂为两部分，即如图4所示的主体部分110a和凸出部分110b，该凸出部分110b的顶面和主体部分110a的顶面未齐平。
所述辅助封装层120设置于第一无机物层110的下侧，且其至少覆盖支撑柱400在像素定义层300上的正投影区域，即所述辅助封装层120至少覆盖支撑柱400的顶面及侧面。可选地，所述辅助封装层120可以全部覆盖像素定义层300在基板200上的正投影区域，换言之，像素定义层300在第一无机物层110上的正投影落于辅助封装层120的覆盖区域内，于此，所述辅助封装层120与第一无机物层110的主体部分110a的下侧有一部分重叠，以此实现较大面积的覆盖。
所述辅助封装层120的厚度可以介于20~100nm之间，其材料可选用台阶覆盖率较高、成膜致密性较好的材料制得，例如无机物，包括但不限于为氧化铝、氧化锆、氧化钛的一种或多种。在一种具体实施例中，所述封辅助封装层120可以采用原子层沉积的工艺制得。当然，根据具体实施中所使用的材料的性质，也可以采用如物理气相沉积、脉冲激光沉积、磁控溅射等任一种成膜工艺制备辅助封装层120。所述辅助封装层120的厚度可以小于主封装层110的厚度，而第一无机物层110的台阶覆盖率可以小于辅助封装层120的台阶覆盖率。
所述有机发光显示面板通过第一无机物层110和辅助封装层120的组合，根据两者各自的结构特点，对支撑柱400和像素定义层300的表面形成不同特点的覆盖，即第一无机物层110为整个覆盖范围内的覆盖，而辅助封装层120针对第一无机物层110覆盖效果欠佳的区域（例如支撑柱400在像素定义层300上的正投影区域）形成弥补或加强覆盖，当第一无机物层110上出现主体部分110a和凸出部分110b之间的断裂现象时，所述辅助封装层120使得封装薄膜100依然具有完整的阻隔水氧分子的膜层，而当不存在上述断裂时，所述辅助封装层120可用于加强第一无机物层110的上述有可能产生断裂的区域，从而在被保护的有机发光器件700的一侧提供水氧阻隔能力较高的膜层。
基于辅助封装层120的特点，该辅助封装层120还可以覆盖在第一无机物层110的上侧，如图5所示，辅助封装层120直接覆盖于支撑柱400上，具体地覆盖支撑柱400的顶面及侧面，以及像素定义层300的邻近支撑柱400的上表面区域。此时，辅助封装层120同样对第一无机物层110覆盖效果欠佳的区域（例如支撑柱400在像素定义层300上的正投影区域）形成弥补或加强覆盖，第一无机物层110在断裂处的水氧通道会被辅助封装层120阻断，从而确保对有机发光器件700的水氧阻隔能力，有利于保障有机发光器件700的正常使用。
如图6所示，辅助封装层120也可以覆盖在第一无机物层110的两侧，即，辅助封装层120包括两部分，一部分直接覆盖于支撑柱400上，具体地覆盖支撑柱400的顶面及侧面，以及像素定义层300的邻近支撑柱400的上表面区域；另一部分覆盖于第一无机物层110的上侧，可以与图4所示实施例的辅助封装层120的设置相同。
辅助封装层120对第一无机物层110形成弥补和加强覆盖，充分利用辅助封装层120的台阶覆盖率相对较高、致密性高的特点，同时又利用第一无机物层110作为封装主体，共同构成较为完整的阻隔水氧分子膜层，为覆盖面一侧的有机发光器件700提供有效的封装保护。
请继续参见图4~图6，有机发光器件700的封装结构还包括有机物层500和第二无机物层600，在一具体实施例中，所述第一无机物层110、有机物层500、第二无机物层600以及辅助封装层120中的至少一者可以掺杂有吸水材料。该吸水材料可用于对侵入至第一无机物层110、有机物层500、第二无机物层600及辅助封装层120中的水分子进行吸收，吸水材料的引入为阻隔水分子提供了又一层保障，增加了水分子到达有机发光器件700的难度，进一步提高了阻隔水分子的能力。
可选地，该吸水材料可以是大小尺度在纳米级别的氧化钙，即纳米级氧化钙颗粒，吸水材料的掺杂浓度可以沿第二无机物层600指向支撑柱400和像素定义层300的方向依次递增，即越靠近第一无机物层110的可能发生断裂的区域，吸水材料的掺杂浓度越高。
图7为本发明的有机发光显示面板的制造方法一实施例的流程示意图。请参见图7，所述有机发光显示面板的制造方法包括：
S701：提供基板。
S702：在基板上形成像素定义层和位于像素定义层上的支撑柱。
S703：在所述基板上形成有机发光器件，有机发光器件位于像素定义层所限定的区域内。
S704：形成第一无机物层和辅助封装层，第一无机物层覆盖有机发光器件、支撑柱和像素定义层，且其位于像素定义层上方区域的顶面与其他区域的顶面未齐平，辅助封装层位于第一无机物层的至少一侧，且至少覆盖支撑柱在像素定义层上的正投影区域。
S705：在所述第一无机物层上形成有机物层。
S706：形成覆盖所述有机物层的第二无机物层。
所述制造方法通过在第一无机物层的至少一侧增设辅助封装层，且该辅助封装层覆盖支撑柱在像素定义层上的正投影区域，即使无机物层在覆盖支撑柱时发生断裂，在该断裂处产生的水氧通道也会被辅助封装层阻断，从而确保对有机发光器件的水氧阻隔能力。
所述制造方法可用于制造前述有机发光显示面板，该制造方法所制备的各个结构元件可参阅上述，此处不再赘述。
尽管已经相对于一个或多个实现方式示出并描述了本发明，但是本领域技术人员基于对本说明书和附图的阅读和理解将会想到等价变型和修改。本发明包括所有这样的修改和变型，并且仅由所附权利要求的范围限制。特别地关于由上述组件执行的各种功能，用于描述这样的组件的术语旨在对应于执行所述组件的指定功能（例如其在功能上是等价的）的任意组件（除非另外指示），即使在结构上与执行本文所示的本说明书的示范性实现方式中的功能的公开结构不等同。此外，尽管本说明书的特定特征已经相对于若干实现方式中的仅一个被公开，但是这种特征可以与如可以对给定或特定应用而言是期望和有利的其他实现方式的一个或多个其他特征组合。而且，就术语“包括”、“具有”、“含有”或其变形被用在具体实施方式或权利要求中而言，这样的术语旨在以与术语“包含”相似的方式包括。进一步地，应当理解的是，在本文中提及的“多个”是指两个或两个以上。对于本文中提及的步骤，其通过数字后缀仅仅是为了清晰表述实施例，便于理解，并不完全代表步骤执行的先后顺序，应当以逻辑关系的先后设定为思考。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，例如各实施例之间技术特征的相互结合，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (19)

  1. 一种有机发光显示面板，包括像素定义层、支撑柱及用于封装有机发光器件的第一无机物层，所述支撑柱位于像素定义层上，其中，所述第一无机物层覆盖所述支撑柱和像素定义层，且其覆盖于像素定义层上方区域的顶面与覆盖于其他区域的顶面未齐平，所述有机发光显示面板还包括辅助封装层，所述辅助封装层位于所述第一无机物层的至少一侧，且至少覆盖所述支撑柱在像素定义层上的正投影区域。
  2. 根据权利要求1所述的有机发光显示面板，其中，所述像素定义层在第一无机物层上的正投影落于辅助封装层的覆盖区域内。
  3. 根据权利要求1所述的有机发光显示面板，其中，所述辅助封装层的材料成分包括氧化铝、氧化锆、氧化钛的一种或多种。
  4. 根据权利要求1所述的有机发光显示面板，其中，所述有机发光显示面板还包括用于封装有机发光器件且依次层叠于所述第一无机物层上的有机物层和第二无机物层，所述第一无机物层、有机物层、第二无机物层及辅助封装层的至少一者掺杂有吸水材料。
  5. 根据权利要求4所述的有机发光显示面板，其中，沿所述第二无机物层指向所述支撑柱和所述像素定义层的方向，所述吸水材料的浓度依次递增。
  6. 一种封装薄膜，其中，所述封装薄膜包括主封装层和辅助封装层，所述主封装层在预定区域的顶面与其他区域的顶面未齐平，所述辅助封装层位于主封装层的至少一侧，且至少覆盖所述预定区域。
  7. 根据权利要求6所述的封装薄膜，其中，所述辅助封装层的材料成分包括氧化铝、氧化锆、氧化钛的一种或多种。
  8. 根据权利要求6所述的封装薄膜，其中，所述主封装层的主要材料成份为无机物。
  9. 根据权利要求6所述的封装薄膜，其中，所述主封装层和辅助封装层的至少一者掺杂有吸水材料。
  10. 根据权利要求9所述的封装薄膜，其中，沿朝向所述预定区域的方向，所述吸水材料的浓度依次递增。
  11. 一种有机发光显示面板的制造方法，其中，所述方法包括：
    提供基板；
    在所述基板上形成像素定义层和位于像素定义层上的支撑柱；
    在所述基板上形成有机发光器件，且所述有机发光器件位于所述像素定义层所限定的区域内；
    形成第一无机物层和辅助封装层，所述第一无机物层覆盖所述有机发光器件、支撑柱和像素定义层，且其位于像素定义层上方区域的顶面与其他区域的顶面未齐平，所述辅助封装层位于所述第一无机物层的至少一侧，且至少覆盖所述支撑柱在像素定义层上的正投影区域；
    在所述第一无机物层上形成有机物层；
    形成覆盖所述有机物层的第二无机物层。
  12. 根据权利要求11所述的方法，其中，所述像素定义层在第一无机物层上的正投影落于辅助封装层的覆盖区域内。
  13. 根据权利要求11所述的方法，其中，采用包括氧化铝、氧化锆、氧化钛的一种或多种的材料形成所述辅助封装层。
  14. 根据权利要求11所述的方法，其中，所述形成第一无机物层和辅助封装层，包括：
    形成掺杂有吸水材料的第一无机物层；
    或者，形成掺杂有吸水材料的辅助封装层；
    或者，形成掺杂有吸水材料的第一无机物层和辅助封装层。
  15. 根据权利要求14所述的方法，其中，沿所述第二无机物层指向所述支撑柱的方向，所述吸水材料的浓度依次递增。
  16. 根据权利要求11所述的方法，其中，所述在所述第一无机物层上形成有机物层，包括：
    在所述第一无机物层上形成掺杂有吸水材料的有机物层。
  17. 根据权利要求16所述的方法，其中，沿所述第二无机物层指向所述支撑柱的方向，所述吸水材料的浓度依次递增。
  18. 根据权利要求11所述的方法，其中，所述形成覆盖所述有机物层的第二无机物层，包括：
    形成覆盖所述有机物层的且掺杂有吸水材料的第二无机物层。
  19. 根据权利要求18所述的方法，其中，沿所述第二无机物层指向所述支撑柱的方向，所述吸水材料的浓度依次递增。
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