WO2020241990A1 - Broche conductrice à ressort, et prise de test et interposeur l'utilisant - Google Patents

Broche conductrice à ressort, et prise de test et interposeur l'utilisant Download PDF

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Publication number
WO2020241990A1
WO2020241990A1 PCT/KR2019/016228 KR2019016228W WO2020241990A1 WO 2020241990 A1 WO2020241990 A1 WO 2020241990A1 KR 2019016228 W KR2019016228 W KR 2019016228W WO 2020241990 A1 WO2020241990 A1 WO 2020241990A1
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WO
WIPO (PCT)
Prior art keywords
pin
connection bar
conductive
main body
conductive pin
Prior art date
Application number
PCT/KR2019/016228
Other languages
English (en)
Korean (ko)
Inventor
문해중
이은주
정주연
임길웅
Original Assignee
주식회사 이노글로벌
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 이노글로벌 filed Critical 주식회사 이노글로벌
Publication of WO2020241990A1 publication Critical patent/WO2020241990A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Definitions

  • the present invention relates to a conductive pin using a spring, a test socket and an interposer using the same, and in more detail, the manufacturing cost can be significantly reduced, so that it is possible to replace the pogo-pin type semiconductor test socket while providing stable signal transmission.
  • Conductive pins using springs which can be tested at high speed and applicable to an interposer that connects two devices requiring high speed implementation, such as high-speed CPUs and boards, and tests using the same It relates to sockets and interposers.
  • a semiconductor device undergoes a manufacturing process and then performs an inspection to determine whether or not the electrical performance is good or bad.
  • the test of a semiconductor device is performed in a state in which a semiconductor test socket (or a contactor or connector) formed so as to be in electrical contact with a terminal of the semiconductor device is inserted between the semiconductor device and the test circuit board.
  • the semiconductor test socket is used in a burn-in test process during the manufacturing process of a semiconductor device in addition to the final pass/fail inspection of a semiconductor device.
  • 1 to 3 are views showing an example of a conventional pogo-pin type semiconductor test socket disclosed in Korean Patent Laid-Open No. 10-2011-0065047.
  • the conventional semiconductor test socket 1100 includes a housing 1110 in which a through hole 1111 is formed in a vertical direction at a position corresponding to the terminal 1131 of the semiconductor device 1130, A pogo-pin 1120 that is mounted in the through hole 1111 of the housing 1110 and electrically connects the terminal 1131 of the semiconductor device 1130 and the pad 1141 of the test apparatus 1140 Consists of
  • the configuration of the pogo-pin 1120 includes a barrel 1124 that is used as a pogo-pin body and has a cylindrical shape with an empty inside, and is formed on the lower side of the barrel 1124.
  • the contact tip 1123 and the spring 1122 connected to the contact tip 1123 in the barrel 1124 to perform contraction and expansion movement, and the spring 1122 connected to the contact tip 1123 are connected to the opposite side of the semiconductor device ( It is composed of a contact pin 1121 that performs vertical motion according to the contact with the 1130.
  • the spring 1122 contracts and expands while absorbing the mechanical shock transmitted to the contact pin 1121 and the contact tip 1123, and the terminal 1131 of the semiconductor device 1130 and the test apparatus 1140
  • the pad 1141 is electrically connected to check for electrical defects.
  • the conventional pogo-pin type semiconductor test socket as described above uses a physical spring to maintain the elasticity in the vertical direction, and the spring and pin are inserted into the barrel, and the barrel is Since it must be inserted into the through hole of the housing again, the process is complicated, and the manufacturing price increases due to the complexity of the process.
  • the physical configuration itself for realizing an electrical contact structure having elasticity in the vertical direction has a limitation in implementing a fine pitch, and it is applied to an integrated semiconductor device in recent years, and has reached the limit.
  • a pogo-pin is used in a structure that electrically connects two devices in addition to testing a semiconductor device.
  • it is applied as an interposer that connects pins of the CPU and terminals of the board between a board and a CPU used in a high-speed CPU, such as a large-capacity server.
  • a pogo-pin type interposer elastically connects the two devices in the vertical direction.
  • the present invention was conceived to solve the above problems, and it is possible to significantly reduce the manufacturing cost, so that it is possible to replace the pogo-pin type semiconductor test socket and to perform a high-speed test with stable signal transmission. And, it provides a conductive pin using a spring that can be applied to an interposer that connects two devices requiring high speed implementation, such as a high-speed CPU and a board, and a test socket and an interposer using the same. There is a purpose.
  • a conductive pin for electrically connecting an upper device and a lower device comprising: an upper pin in contact with the upper device, a lower pin in contact with the lower device, the upper pin and the lower An elastic spring disposed between pins and providing a restoring force when the upper pin and the lower pin are pressed in the vertical direction;
  • the upper pin includes an upper body having a rectangular cylindrical shape, an upper engaging groove formed on an inner wall surface of the upper body, an upper connection bar extending from the upper body in the direction of the lower pin and passing through the inside of the elastic spring, and the And an upper hook formed by bending an end of the upper connecting bar;
  • the lower pin includes a lower body having a rectangular cylindrical shape, a lower engaging groove formed on an inner wall surface of the lower body, the upper hook at the end of the upper connecting bar inserted into the lower body, and the lower body And a lower connection bar extending in the direction of the upper pin from and inserted into the upper body through the inside of the elastic spring, and a lower hook formed by
  • the upper pin and the lower pin are integrally manufactured by processing a conductive thin plate;
  • the upper body of the upper pin and the lower body of the lower pin may be manufactured in a rectangular cylindrical shape through stamping a thin plate.
  • connection bar integrally extends from one side of the upper body of the square cylindrical shape;
  • the lower connecting bar integrally extends from one side of the lower body having a rectangular cylindrical shape;
  • the upper connection bar and the lower connection bar may be inserted into the lower body and the upper body, respectively, with the upper pin and the lower pin disposed so that the plate surface of the upper connection bar and the plate surface of the lower connection bar face each other. have.
  • the plate surface of the end region of the upper connection bar is in contact with one of the inner wall surfaces of the lower body, and the plate surface of the end region of the lower connection bar is inside one of the inner wall surfaces of the upper body. It is in contact along the wall surface, and the upper pin and the lower pin may be electrically connected through surface contact.
  • the upper connection bar and the lower connection bar are inserted into the lower body and the upper body, respectively, between the upper connection bar and the lower connection bar.
  • bent portions that are double bent toward each other may be formed.
  • the upper pin may further include an upper contact portion integrally extending upward from at least one of four sides of the upper body.
  • the lower pin may further include a lower contact portion integrally extending downward from at least one of four sides of the lower body of the lower body.
  • manufacturing cost can be significantly reduced, so that it is possible to replace the pogo-pin type semiconductor test socket, and test at high-speed with stable signal transmission.
  • a conductive pin using a spring applicable to an interposer connecting two devices requiring high speed implementation such as a CPU and a board, and a test socket and an interposer using the same are provided.
  • 1 to 3 are views for explaining a conventional pogo-pin type semiconductor test socket
  • FIG. 4 is a perspective view of a conductive pin according to an embodiment of the present invention.
  • FIG. 5 is an exploded perspective view of the conductive pin of FIG. 4,
  • FIG. 6 is a cross-sectional view of the conductive pin of FIG. 4,
  • FIG. 7 is a view showing an example of a thin plate for manufacturing a conductive pin according to an embodiment of the present invention.
  • FIG. 8 is a cross-sectional view of an interposer to which a conductive pin is applied according to an exemplary embodiment of the present invention.
  • interposer 100 conductive pin
  • the conductive pin according to the present invention is disposed between an upper pin in contact with the upper device, a lower pin in contact with the lower device, and between the upper pin and the lower pin, and the upper pin and the lower pin are vertically Including an elastic spring that provides a restoring force when pressed;
  • the upper pin includes an upper body having a rectangular cylindrical shape, an upper engaging groove formed on an inner wall surface of the upper body, an upper connection bar extending from the upper body in the direction of the lower pin and passing through the inside of the elastic spring, and the And an upper hook formed by bending an end of the upper connecting bar;
  • the lower pin includes a lower body having a rectangular cylindrical shape, a lower engaging groove formed on an inner wall surface of the lower body, the upper hook at the end of the upper connecting bar inserted into the lower body, and the lower body And a lower connection bar extending in the direction of the upper pin from and inserted into the upper body through the inside of the elastic spring, and a lower hook formed by bending an end of the lower connection bar to catch the upper locking
  • FIG. 4 is a perspective view of a conductive pin 100 according to an embodiment of the present invention
  • FIG. 5 is an exploded perspective view of the conductive pin 100 of FIG. 4
  • FIG. 6 is a cross-sectional view of the conductive pin 100 of FIG. 4.
  • the conductive pin 100 according to the present invention electrically connects the upper device and the lower device.
  • a test object for example, a semiconductor device becomes an upper device
  • an inspection circuit board becomes a lower device.
  • the conductive pin 100 according to the present invention is applied to the interposer 10
  • the upper device may be a CPU
  • the lower device may be a board.
  • the conductive pin 100 includes an upper pin, a lower pin, and an elastic spring.
  • the upper pin 110 is in contact with the upper device, and includes an upper body 111, an upper engaging groove 112, an upper connecting bar 113 and an upper hook 114, as shown in FIGS. 5 and 6 do.
  • the lower pin 120 is in contact with the lower device, and includes a lower body 121, a lower engaging groove 122, a lower connecting bar 123, and a lower hook 124.
  • the upper body 111 has a substantially rectangular cylindrical shape with an empty inside.
  • An upper engaging groove 112 is formed on the inner wall surface of the upper body 111, and the lower hook 124 of the lower pin 120 is caught when the lower connecting bar 123 of the lower pin 120 is inserted into the interior. The state is maintained, and a detailed description thereof will be described later.
  • the upper locking groove 112 is provided in the form of a hole through which the plate surface of the upper main body 111 passes, but the lower hook 124 is disposed on the inner wall surface of the upper main body 111. If it can be hung, it may have a shape that is recessed toward the inner wall side rather than a complete hole.
  • the upper connection bar 113 extends from the upper body 111 in the direction of the lower pin 120. At this time, the upper connection bar 113 passes through the inside of the elastic spring and extends in the direction of the lower pin 120 as shown in FIG. 4, and is inserted into the lower body 121 of the lower pin 120. do.
  • the upper hook 114 is formed by bending the end of the upper connection bar 113, and when the upper connection bar 113 is inserted into the lower body 121, the lower portion formed on the inner wall surface of the lower body 121 It maintains a state caught in the locking groove 122.
  • the lower pin 120 is provided in a shape corresponding to the upper pin 110. More specifically, the lower body 121 has a substantially rectangular cylindrical shape with an empty inside.
  • the lower engaging groove 122 is formed on the inner wall surface of the lower body 121, and as described above, the upper hook of the upper pin 110 when the upper connecting bar 113 of the upper pin 110 is inserted into the interior. (114) will remain stuck.
  • the lower locking groove 122 is provided in the form of a hole through which the plate surface of the lower body 121 passes, but the upper hook 114 is If it is a shape that can be hung on the inner wall, it may have a shape that is recessed toward the inner wall rather than a complete hole.
  • the lower connection bar 123 extends from the lower body 121 in the direction of the upper pin 110. At this time, the lower connection bar 123 passes through the interior of the elastic spring and extends in the direction of the upper pin 110, as shown in FIG. 4, and is inserted into the upper body 111 of the upper pin 110. do.
  • the lower hook 124 is formed by bending the end of the lower connection bar 123, and when the lower connection bar 123 is inserted into the upper body 111, the upper part formed on the inner wall surface of the upper body 111 It maintains a state caught in the locking groove 112.
  • the elastic spring is disposed between the upper pin 110 and the lower pin 120 and provides a restoring force when the upper pin 110 and the lower pin 120 are pressed in the vertical direction.
  • the elastic spring provides a restoring force between the upper body 111 of the upper pin 110 and the lower body 121 of the lower pin 120 in opposite directions to each other It is prepared to do.
  • the elastic spring elastically supports it and provides a restoring force, so that the conventional pogo pin type test
  • the advantages of the socket or the interposer 10 pin can be maintained.
  • the upper fin 110 and the lower fin 120 have the same structure, so that the fin structure may be easily manufactured. That is, the upper pin 110 and the lower pin 120 according to the present invention may be integrally manufactured by processing a thin plate having a degree of polishing, and the thin plate having the shape shown in FIG. 7 may be manufactured through stamping. .
  • the upper body 111 or the lower body 121 having a rectangular cylindrical shape can be manufactured.
  • the upper connection bar 113 or the lower connection bar 123 can be used as it is in a thin plate shape, and the upper hook 114 and the lower hook 124 can be formed by bending around line B3 in FIG. 7. . Therefore, it is possible to easily solve the manufacturing problems of the existing pogo pin.
  • the upper connection bar 113 is integrally extended from one side of the upper body 111 of the square cylindrical shape, likewise, the lower connection bar 123 It extends integrally from one side of the rectangular cylindrical lower body 121.
  • the plate surface of the upper connection bar 113 and the plate surface of the lower connection bar 123 are, as shown in FIG. 6, in a state in which the upper pins 110 and the lower pins 120 face each other.
  • the connection bar 113 and the lower connection bar 123 are inserted into the lower body 121 and the upper body 111, respectively.
  • bent portions 116 and 126 that are double-bent toward each other are formed in an intermediate region of the upper connection bar 113 and the lower connection bar 123.
  • the upper main body 111 and the lower main body 121 are arranged in a line in the vertical direction, and the upper connecting bar 113 and the lower connecting bar 123 are respectively formed in the lower main body ( 121) and the upper body 111 can be inserted.
  • the plate surface of the upper connection bar 113 is inserted while contacting along one of the four inner wall surfaces inside the lower body 121, and similarly, the lower connection The plate surface of the bar 123 is inserted while contacting along one of the four inner wall surfaces of the lower body 121, so that the electrical connection between the upper pin 110 and the lower pin 120 is made through surface contact.
  • the resistance is improved, and the stability of the signal can be guaranteed during high-speed signal processing.
  • the upper pin 110 may include an upper contact portion 115 integrally extending from one side of the upper side of the upper body 111 in the upper direction even if it dies.
  • the lower pin 120 according to the present invention may include a lower contact portion 125 integrally extending downward from at least one of the four lower sides of the lower body 121.
  • FIG. 4 to 6 illustrate an example in which the pair of upper contact portions 115 and lower contact portions 125 extend in the upper and lower directions on the sides facing each other, but is not limited thereto.
  • the upper contact portion 115 and the lower contact portion 125 are formed to be bent at a predetermined angle in the inward direction.
  • FIG. 8 is a view showing a cross section of the interposer 10 to which the conductive pin 100 is applied according to an embodiment of the present invention.
  • the interposer 10 has a number of through holes 310 formed in the insulating body 300, and the above-described conductive pins 100 are inserted into each through hole 310.
  • FIG. 8 shows an example in which the conductive pin 100 is applied to the interposer 10, it is of course applicable to a test socket in a corresponding manner.
  • the present invention can be applied to a test socket for a pass/fail test of an electronic device such as a semiconductor device, and is also applicable to an interposer.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

La présente invention concerne une broche conductrice à ressort, ainsi qu'une prise de test et un interposeur l'utilisant. Selon la présente invention, la broche conductrice comprend : une broche supérieure en contact avec un dispositif supérieur ; une broche inférieure en contact avec un dispositif inférieur ; et un ressort élastique disposé entre la broche supérieure et la broche inférieure de façon à fournir une force de rappel lorsque la broche supérieure et la broche inférieure sont mises sous pression dans la direction verticale. La broche supérieure comprend : un corps principal supérieur comportant une forme de récipient rectangulaire ; une rainure d'arrêt supérieure formée dans une surface de paroi interne du corps principal supérieur ; une barre de liaison supérieure s'étendant du corps principal supérieur vers la direction de la broche inférieure, et traversant l'intérieur du ressort élastique ; et un crochet supérieur formé par le pliage d'une extrémité terminale de la barre de liaison supérieure. La broche inférieure comprend : un corps principal inférieur comportant une forme de contenant rectangulaire ; une rainure d'arrêt inférieure formée dans une surface de paroi interne du corps principal inférieur et logeant le crochet supérieur de l'extrémité terminale de la barre de liaison supérieure insérée à l'intérieur du corps principal inférieur ; une barre de liaison inférieure s'étendant du corps principal inférieur vers la direction de la broche supérieure, et traversant l'intérieur du ressort élastique de façon à être insérée à l'intérieur du corps principal supérieur ; et un crochet inférieur formé par le pliage d'une extrémité terminale de la barre de liaison inférieure, et en prise dans la rainure d'arrêt supérieure. En conséquence, les coûts de fabrication peuvent être considérablement réduits, et ainsi la présente invention peut remplacer une prise de test de semi-conducteur de type broche Pogo tout en permettant un transfert du signal stable conjointement avec un test à haute vitesse, et peut être appliquée à un interposeur pour connecter deux dispositifs, tels qu'une UC à haute vitesse et une carte, qui nécessitent l'implémentation d'une haute vitesse.
PCT/KR2019/016228 2019-05-31 2019-11-25 Broche conductrice à ressort, et prise de test et interposeur l'utilisant WO2020241990A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2019-0064332 2019-05-31
KR1020190064332A KR102183498B1 (ko) 2019-05-31 2019-05-31 스프링을 이용한 도전성 핀과, 이를 이용한 테스트 소켓 및 인터포저

Publications (1)

Publication Number Publication Date
WO2020241990A1 true WO2020241990A1 (fr) 2020-12-03

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KR102437967B1 (ko) * 2020-12-31 2022-08-30 한국자동차연구원 전기전도성 복합소재의 저항측정장치
KR102659686B1 (ko) * 2021-10-14 2024-04-23 (주)마이크로컨텍솔루션 포고 핀

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KR20080114374A (ko) * 2007-06-27 2008-12-31 주식회사 오킨스전자 프로브 핀의 제조방법, 이에 의하여 제조되는 프로브 핀 및이를 포함하는 테스트 소켓
KR101309694B1 (ko) * 2011-08-24 2013-09-17 (주)마이크로컨텍솔루션 반도체 공정용 프로브 핀
JP2017146118A (ja) * 2016-02-15 2017-08-24 オムロン株式会社 プローブピンおよびそれを用いた検査装置
KR101865375B1 (ko) * 2017-12-05 2018-06-07 주식회사 오킨스전자 트위스트 타입 ｐｉｏｎ 핀 및 그 조립 방법
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KR101525120B1 (ko) * 2013-11-08 2015-06-02 (주)아이윈 공차가 확대된 인너브릿지 타입 스프링 프로 브 핀

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KR20080114374A (ko) * 2007-06-27 2008-12-31 주식회사 오킨스전자 프로브 핀의 제조방법, 이에 의하여 제조되는 프로브 핀 및이를 포함하는 테스트 소켓
KR101309694B1 (ko) * 2011-08-24 2013-09-17 (주)마이크로컨텍솔루션 반도체 공정용 프로브 핀
JP2017146118A (ja) * 2016-02-15 2017-08-24 オムロン株式会社 プローブピンおよびそれを用いた検査装置
KR20180111221A (ko) * 2017-03-31 2018-10-11 주식회사 오킨스전자 코일 스프링의 쐐기 작용에 의하여 틸트 가능한 핀셋 타입 플런저, 그리고 이를 이용하여 테스트 소켓에서 코일 스프링의 간섭이 최소화되는 ｐｉｏｎ 핀
KR101865375B1 (ko) * 2017-12-05 2018-06-07 주식회사 오킨스전자 트위스트 타입 ｐｉｏｎ 핀 및 그 조립 방법

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