WO2020233225A1 - 终端 - Google Patents

终端 Download PDF

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Publication number
WO2020233225A1
WO2020233225A1 PCT/CN2020/081034 CN2020081034W WO2020233225A1 WO 2020233225 A1 WO2020233225 A1 WO 2020233225A1 CN 2020081034 W CN2020081034 W CN 2020081034W WO 2020233225 A1 WO2020233225 A1 WO 2020233225A1
Authority
WO
WIPO (PCT)
Prior art keywords
radio frequency
antenna
circuit layer
opening
frequency circuit
Prior art date
Application number
PCT/CN2020/081034
Other languages
English (en)
French (fr)
Inventor
王利荣
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Priority to KR1020217038154A priority Critical patent/KR102655074B1/ko
Priority to JP2021568863A priority patent/JP7307819B2/ja
Priority to EP20809395.5A priority patent/EP3975432A4/en
Publication of WO2020233225A1 publication Critical patent/WO2020233225A1/zh
Priority to US17/528,348 priority patent/US11996870B2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
    • H04B1/0067—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with one or more circuit blocks in common for different bands
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
    • H04B1/0064—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with separate antennas for the more than one band
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module

Definitions

  • the present disclosure relates to the technical field of electronic products, and in particular to a terminal.
  • antennas may need to be provided on the periphery of the middle frame.
  • the antenna feed point needs to be connected to the main board. If the antenna feed point is far away from the main board, the main board needs to be connected to the antenna feed point via a radio frequency coaxial cable. This way, as the number of antennas increases, the number of radio frequency coaxial cables also increases.
  • the antenna small board is equipped with a coaxial line holder, antenna shrapnel, antenna tuning switch and other devices. In this way, each additional antenna needs to take up a lot of structural space.
  • the more the number of antennas the more structural space for the coaxial cable needs to be added inside the terminal.
  • the larger the structural space occupied the less conducive to the internal space layout of the terminal. .
  • the more the number of antennas the more shrapnel used to connect to the middle frame.
  • the antenna shrapnel needs to be in reliable contact, otherwise the antenna performance will deteriorate.
  • the increase in antenna shrapnel may reduce the contact reliability and even affect the antenna performance.
  • the embodiments of the present disclosure provide a terminal to solve the problem that the increase in the number of antennas causes the internal space of the terminal to occupy more space.
  • embodiments of the present disclosure provide a terminal, including a main board, a middle frame, a radio frequency circuit layer, a screen, and multiple antennas;
  • the middle frame is located between the main board and the radio frequency circuit layer, and the radio frequency circuit layer is located between the screen and the middle frame; the plurality of antennas pass through the radio frequency in the radio frequency circuit layer.
  • the wire is connected to the main board.
  • the antenna in the terminal is connected to the main board through the radio frequency line arranged in the radio frequency circuit layer between the screen of the terminal and the middle frame, so as to ensure that the antenna at any position can use a shorter line Or directly connect to the radio frequency circuit layer to avoid the problem that the internal space of the terminal is occupied by the connection of the radio frequency coaxial line to the antenna feed point due to the large number of antennas and the antenna is far from the main board.
  • FIG. 1 shows one of the schematic diagrams of the terminal of the embodiment of the present disclosure
  • Fig. 2 shows a schematic diagram of an antenna in a terminal according to an embodiment of the present disclosure
  • FIG. 3 shows one of the schematic diagrams of the radio frequency circuit layer of the embodiment of the present disclosure
  • FIG. 4 shows the second schematic diagram of the radio frequency circuit layer of the embodiment of the present disclosure
  • FIG. 5 shows one of the schematic diagrams of the structure of the radio frequency circuit layer of the embodiment of the present disclosure
  • FIG. 6 shows one of the schematic diagrams of the connection between the radio frequency circuit layer and the antenna in an embodiment of the present disclosure
  • FIG. 7 shows the second structural diagram of the radio frequency circuit layer of the embodiment of the present disclosure
  • FIG. 8 shows the second schematic diagram of the connection between the radio frequency circuit layer and the antenna of the embodiment of the present disclosure
  • FIG. 9 shows the third schematic diagram of the connection between the radio frequency circuit layer and the antenna in an embodiment of the present disclosure.
  • FIG. 10 shows a schematic diagram of the connection between the radio frequency circuit layer and the main board in an embodiment of the present disclosure.
  • an embodiment of the present disclosure provides a terminal, which includes a main board 1, a middle frame 5, a radio frequency line layer 2, a screen 4, and multiple antennas 3.
  • the middle frame 5 is located between the main board 1 and the radio frequency circuit layer 2, and the radio frequency circuit layer 2 is located between the screen 4 and the middle frame 5; the antenna 3 passes through the radio frequency
  • the radio frequency line in the circuit layer 2 is connected to the main board 1.
  • the middle frame 5 is located between the main board 1 and the radio frequency circuit layer 2
  • the radio frequency circuit layer 2 is located between the screen 4 and the middle frame 5; the antenna 3 in the terminal
  • the radio frequency circuit layer 2 is respectively adhered to the screen 4 and the middle frame 5 of the terminal by glue, so as to avoid the space occupied by the screw positioning.
  • the radio frequency circuit layer 2 can also be connected to the screen 4 through foam, so as to provide support for the radio frequency circuit layer 2 through the foam.
  • the main board 1 is located on the middle frame 5, that is, the main board 1 is located on the side of the middle frame 5 opposite to the side where the radio frequency circuit layer 2 is located.
  • the antenna 3 is arranged on the middle frame 5, and multiple antennas 3 can be arranged around the edge of the screen 4 (as shown in FIG. 2).
  • the radio frequency circuit layer 2 can be set to at least partially cover the area of the screen 4 at a predetermined distance from the edge of the screen.
  • the radio frequency circuit layer 2 covers the entire area of the screen 4.
  • the radio frequency circuit layer 2 covers the entire area of the screen 4, it is ensured that the antenna 3 at any position can be connected with a short circuit or directly with the radio frequency circuit layer. 2 Connection, to avoid the problem that the internal space of the terminal is occupied by the connection of the radio frequency coaxial line with the antenna feed point due to the large number of antennas 3 and the distance between the antenna 3 and the main board 1.
  • the radio frequency circuit layer 2 covers an area of the screen 4 at a predetermined distance from the edge of the screen.
  • the radio frequency circuit layer 2 includes: a first sub-board 201, a second sub-board 202, a third sub-board 203, and a fourth sub-board 204; the radio-frequency circuit layer 2 presents: the first sub-board 201.
  • Fig. 4 shows an example in which the shape of the radio frequency circuit layer 2 is a rectangular frame.
  • the shape of the radio frequency circuit layer 2 can also be other shapes, such as an irregular polygonal frame.
  • Etc., the specific shape of the radio frequency circuit layer 2 can be determined according to the actual layout requirements of the antenna 3, and the present disclosure is not limited thereto.
  • the radio frequency circuit layer 2 covers the area of the screen 4 at a predetermined distance from the edge of the screen. It is ensured that the antenna 3 at any position can have a short circuit or be directly connected to the radio frequency circuit layer 2, avoiding the number of antennas 3 When the antenna 3 is far away from the main board 1, the internal space of the terminal is occupied by the connection of the radio frequency coaxial line with the antenna feed point, and the material of the radio frequency line layer 2 can be reduced, and the cost can be reduced.
  • the radio frequency wiring layer 2 includes: a radio frequency wiring layer 21 provided with a plurality of radio frequency lines, a first ground layer 22 located on the first surface of the radio frequency wiring layer 21, and The second ground layer 23 on the second side of the wiring layer 21.
  • each of the antennas 3 is connected to the main board 1 through a corresponding radio frequency line, that is to say, one of the antennas 3 is connected to the main board 1 through one of the radio frequency lines; the first ground layer 22 is connected to the middle The frame 5 is connected; the second ground 23 is connected to the screen 4.
  • first ground layer 22 and the middle frame 5 are glued together, and the second ground layer 23 and the screen 4 are glued together to avoid the internal space occupation of the terminal caused by screw positioning.
  • the radio frequency circuit layer 2 may be a radio frequency circuit board; wherein, the material of the radio frequency wiring layer 21 is a material with low dielectric loss, such as a liquid crystal polymer (Liquid Crystal Polymer, LCP) soft board to ensure high transmission In the case of high-frequency signals, the loss is small, and the material can be bent to ensure that it is suitable for terminals with folding screens.
  • LCP liquid crystal polymer
  • the first ground layer 22 and the second ground layer 23 may also be provided with wiring of an electronic component 24 (such as an antenna tuner, etc.), and the electronic component 24 may be welded to the wiring.
  • the radio frequency wiring layer 21, the first ground layer 22, and the second ground layer 23 form the radio frequency wiring layer 2 with a stripline structure to ensure that the impedance of the radio frequency line in the radio frequency wiring layer 21 is continuous and the impedance can be controlled at 50 ohms.
  • connection mode of the radio frequency line layer 2 and the antenna 3 arranged on the middle frame 5 in combination with specific examples:
  • Example 1 As shown in Figure 6, the middle frame 5 is provided with a first through hole, and the antenna feed point 31 of the antenna 3 is arranged on the inner wall of the first through hole; optionally, the antenna feed point 31 is made of plastic 51 is disposed on the inner wall of the first through hole, and there is a gap between the antenna feed point 31 and the radio frequency line 210.
  • the radio frequency circuit layer 2 is provided with a first opening, and the radio frequency line 210 passes through the first opening and is connected to the antenna feed point 31.
  • the radio frequency line 210 passes through the first opening and is connected to the antenna feed point 31 through the silver glue 6.
  • the first opening is a hole that penetrates the first ground 22 Opening; wherein, the first ground layer 22 is connected to the middle frame 5.
  • the silver glue 6 is filled in the first through hole, and the radio frequency wire 210 passes through the first opening and is connected to the antenna feed point 31 through the silver glue 6. In this way, the first opening only penetrates the first ground layer 22 to ensure the reliability of the structure of the radio frequency circuit layer 2.
  • a hole is opened in the middle of the metal middle frame 5 to form a first through hole; the antenna feed point 31 is arranged on the inner wall of the first through hole, and there is a gap between the radio frequency line 210 and the silver glue 6 A space is filled so that the silver glue 6 can be electrically connected to the radio frequency line 210, thereby ensuring that the radio frequency line 210 can be electrically connected to the antenna feed point 31 through the silver glue 6.
  • a second filling space filled with silver glue 6 is reserved in the first through hole, and at least one conductive part of the antenna feed point 31 should be exposed in the second filling space so as to be filled in the second filling space.
  • the silver glue 6 in the second filling space can be connected to the conductive part of the antenna feed point 31, so as to ensure that the radio frequency line 210 can be electrically connected to the antenna feed point 31 through the silver glue 6.
  • the radio frequency circuit layer 2 is also connected to the screen 4 through the foam 7, so that the foam 7 provides a supporting force between the radio frequency circuit layer 2 and the middle frame 5, even if the silver glue 6 is injected with a margin, There is also a supporting force at the bottom of the radio frequency line layer 2 so that the antenna feed point 31 and the radio frequency line 210 are in good contact.
  • the contact area between the radio frequency line 210 and the antenna feed point 31 is greater than that of the antenna feed point 31 and the radio frequency through a shrapnel.
  • the contact area between the radio frequency wire 210 and the antenna feed point 31 is large, and the path is short, so as to prevent the small contact area of the shrapnel from causing unreliable contact of the antenna 3, and due to the radio frequency wire 210 and the antenna feed
  • the long contact path between the points 31 has parasitic parameters that affect the performance of the antenna, thereby ensuring the reliability of the connection between the antenna 3 and the radio frequency line layer 2, thereby ensuring the natural performance.
  • Example 2 As shown in Figures 7 and 8, the middle frame 5 is provided with a first through hole, and the antenna feed point 31 is arranged on the inner wall of the first through hole; optionally, the antenna feed point 31 is made of plastic 51 is arranged on the inner wall of the first through hole.
  • the radio frequency circuit layer 2 is provided with a first opening 25, and the radio frequency line passes through the first opening 25 and is connected to the antenna feed point 31.
  • the radio frequency line passes through the first opening 25 and is connected to the antenna feed point 31 through a metal gasket 8.
  • the first opening 25 penetrates the radio frequency circuit layer (2) The opening.
  • the metal gasket 8 covers the first opening 25, and the first surface of the metal gasket 8 is connected to the radio frequency line, and the second surface of the metal gasket 8 is connected to the antenna feeder. Connect at point 31.
  • a first opening 25 is opened on the radio frequency circuit layer 2, and the first opening 25 penetrates the first ground layer 22, the radio frequency wiring layer 21 and the second ground layer 23.
  • the metal pad 8 is soldered to the radio frequency circuit layer 2 by using Surface Mount Technology (SMT).
  • SMT Surface Mount Technology
  • the metal gasket 8 is welded to one side of the first ground layer 22 and electrically connected to the radio frequency wire in the radio frequency wiring layer 21. Since the metal gasket 8 is welded on the side of the radio frequency circuit layer 2 where the first ground layer 22 is located, the metal gasket 8 can be easily connected to the antenna feed point 31 on the middle frame 5.
  • the antenna feed point 31 in the metal middle frame 5 is welded to the metal gasket 8, and the first ground layer 22 is connected to the middle frame 5. Since the first opening 25 penetrates the first ground layer 22, the radio frequency wiring layer 21 and the second ground layer 23, a welding space is provided on the side of the radio frequency circuit layer 2 where the second ground layer 23 is located. During the welding operation, and the antenna feed point 31 is welded to the metal gasket 8, the reliability of the connection between the antenna 3 and the radio frequency circuit layer 2 is also ensured.
  • the metal gasket 8 is welded to the radio frequency circuit layer 2 to protrude from the surface of the first ground layer 22.
  • the metal gasket 8 and the antenna When the feeding point 31 is welded, the metal gasket 8 is located in the first through hole, so as to avoid an increase in the overall thickness of the terminal.
  • the radio frequency circuit layer 2 is arranged on the screen 4, such as: the second ground layer 23 is connected to the screen 4; alternatively, the radio frequency circuit layer 2 can be connected to the screen 4 through foam 7 to connect The radio frequency circuit layer 2 provides support.
  • the contact area between the radio frequency line 210 and the antenna feed point 31 is larger than that of the antenna feed point 31 and the antenna feed point 31 and In the electrical connection of the radio frequency line, the contact area between the radio frequency line 210 and the antenna feed point 31 is large, and the path is short, to prevent the small contact area of the shrapnel from causing unreliable antenna contact, and due to the radio frequency line 210 and the antenna feed point
  • the long contact path between 31 and the existing parasitic parameters affect the performance of the antenna, thereby ensuring the reliability of the connection between the antenna and the radio frequency circuit layer 2, thereby ensuring the natural performance.
  • Example 3 As shown in Figure 9, a feeding antenna 9 is provided between the middle frame 5 and the screen 4.
  • the feeding antenna 9 is connected to the radio frequency line and is connected to the middle frame 5
  • the upper antenna 3 is coupled to avoid the problem of poor contact reliability when the antenna feed point and the radio frequency line are connected through contact.
  • the middle frame 5 is provided with a second through hole, and the antenna 3 is arranged on the inner wall of the second through hole; for example, the antenna 3 is arranged on the inner wall of the second through hole through plastic 51.
  • the radio frequency circuit layer 2 is provided with a second opening 26, and the second opening 26 is an opening penetrating the radio frequency circuit layer 2; for example, the radio frequency circuit layer 2 includes: a radio frequency circuit provided with a plurality of radio frequency lines The wire layer 21, the first ground layer 22 located on the first side of the radio frequency wiring layer 21, and the second ground layer 23 located on the second side of the radio frequency wiring layer 21, the second opening may penetrate all The openings of the first ground layer 22, the radio frequency wiring layer 21 and the second ground layer 23; the feeding antenna 9 is located in the second opening 26.
  • the size of the gap is within a preset distance range to ensure that the antenna 3 and the feed antenna 9 can be coupled and connected, that is, the feed
  • the input antenna 9 can receive the energy radiated by the antenna 3.
  • the second opening 26 penetrates the first ground layer 22, the radio frequency wiring layer 21 and the second ground layer 23, the first ground layer 22 and the second ground layer 23 can prevent the first ground layer 22 and the second ground layer 23 from causing interference to the feeding antenna 9; and
  • the input antenna 9 is arranged in the second opening 26, which can prevent the first stratum 22 and the second stratum 23 from causing interference to the feeding antenna 9, and also meet the thickness requirements of the middle frame 5 and the RF circuit layer 2 after being combined , Avoid increasing the terminal thickness.
  • the radio frequency circuit layer 2 is located between the screen 4 and the middle frame 5, it is ensured that the distance between the radio frequency circuit layer 2 and the middle frame 5 is consistent after the assembly is completed.
  • radio frequency circuit layer 2 can also be connected to the screen 4 through the foam 7 to provide support for the radio frequency circuit layer 2 through the foam 7.
  • the RF line in the RF circuit layer 2 is coupled to the antenna 3 by feeding the antenna 9, avoiding the electrical connection between the antenna feed point and the RF line through the shrapnel, and the antenna contact is unreliable due to the small contact area, and
  • the long contact path between the radio frequency line and the antenna feed point has parasitic parameters that affect the antenna performance, thereby ensuring the reliability of the connection between the antenna 3 and the radio frequency circuit layer 2, thereby ensuring the natural performance.
  • the radio frequency circuit layer 2 is connected to the main board 1 through a board-to-board connector 10.
  • the radio frequency circuit layer 2 is adjacent to the first surface of the middle frame 5, and the main board 1 is adjacent to the second surface of the middle frame 5; optionally, the radio frequency circuit layer 2 is arranged On the first surface of the middle frame 5, the main board 1 is disposed on the second surface of the middle frame 5, and the first surface and the second surface are disposed opposite to each other.
  • the middle frame 5 is provided with a third opening, and the board-to-board connector 10 passes through the third opening and is connected to the radio frequency circuit layer 2 and the main board 1 respectively.
  • the board-to-board connector 10 is arranged on the radio frequency circuit layer 2. Since the radio frequency circuit layer 2 is made of an LCP soft board, it can be bent. The bent radio frequency circuit layer 2 partly ensures the board-to-board connector 10 passes through the third opening and snaps onto the connector seat 11 on the main board 1.
  • the radio frequency circuit layer 2 can ensure that the antenna 3 at any position can be a short circuit or directly connected to the radio frequency circuit layer 2, avoiding the situation that the number of antennas 3 is large and the antenna 3 is far away from the main board 1.
  • the connection of the RF coaxial line with the antenna feed point causes the internal space of the terminal to be occupied. It can also avoid the electrical connection between the antenna feed point and the RF line through the shrapnel, the antenna contact is unreliable due to the small contact area, and the parasitic parameters due to the long contact path between the RF line and the antenna feed point affect the antenna performance , So as to ensure the reliability of the connection between the antenna 3 and the radio frequency line layer 2, thereby ensuring the performance of the antenna.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Telephone Set Structure (AREA)
  • Support Of Aerials (AREA)
  • Transceivers (AREA)

Abstract

本公开涉及一种终端，包括：包括主板、中框、射频线路层、屏幕和多个天线；其中，所述中框位于所述主板与所述射频线路层之间，所述射频线路层位于所述屏幕与所述中框之间；所述多个天线通过所述射频线路层中的射频线与所述主板连接。

Description

终端
相关申请的交叉引用
本申请主张在2019年5月20日在中国提交的中国专利申请No.201910418743.3的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及电子产品技术领域，尤其涉及一种终端。
背景技术
随着通信技术的发展，移动网络的传输速度也越来越快，为了达到更高的速率和支持多模制式，在终端上需要集成天线的数量也越来越多，在终端有限的体积下需要集成更多天线也越来越困难。
目前，多数终端通过中框作为天线，为了满足5G通信技术中天线数量的需求，可能中框的外围均需要设置天线。天线馈点需要和主板连接，如果天线馈点距离主板较远，则主板需要通过射频同轴线与天线馈点连接，这样随着天线数量的增多，射频同轴线的数量也会增多。另外，一般在天线馈点的预定距离内还需要增加天线小板，天线小板上设有同轴线座子，天线弹片，天线调谐开关等器件。这样每增加一个天线就需要占用大量的结构空间，天线数量越多，在终端内部需要增加同轴线的走线结构空间也越多，占用的结构空间就越大，越不利于终端内部空间布局。并且天线数量越多，用于和中框连接的弹片也增多，天线弹片需要可靠的接触，否则天线性能会变差，天线弹片增多可能导致接触可靠性的降低，甚至影响天线性能。
发明内容
本公开实施例提供了一种终端，以解决天线数量的增多，导致终端内部空间占用较多的问题。
为了解决上述技术问题，本公开是这样实现的：
第一方面，本公开实施例提供了一种终端，包括主板、中框、射频线路 层、屏幕和多个天线；
其中，所述中框位于所述主板与所述射频线路层之间，所述射频线路层位于所述屏幕与所述中框之间；所述多个天线通过所述射频线路层中的射频线与所述主板连接。
这样，本公开的上述方案中，终端中的天线通过设置于终端的屏幕与中框之间的射频线路层中的射频线，与主板连接，以保证任意位置的天线均能以较短的线路或者直接与射频线路层连接，避免由于天线数量较多，且天线距离主板较远的情况下，通过射频同轴线与天线馈点连接导致终端内部空间占用较多的问题。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对本公开实施例的描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1表示本公开实施例的终端的示意图之一；
图2表示本公开实施例的终端中天线的示意图；
图3表示本公开实施例的射频线路层的示意图之一；
图4表示本公开实施例的射频线路层的示意图之二；
图5表示本公开实施例的射频线路层的结构示意图之一；
图6表示本公开实施例的射频线路层与天线连接的示意图之一；
图7表示本公开实施例的射频线路层的结构示意图之二；
图8表示本公开实施例的射频线路层与天线连接的示意图之二；
图9表示本公开实施例的射频线路层与天线连接的示意图之三；
图10表示本公开实施例的射频线路层与主板连接的示意图。
具体实施方式
下面将参照附图更详细地描述本公开的示例性实施例。虽然附图中显示了本公开的示例性实施例，然而应当理解，可以以各种形式实现本公开而不 应被这里阐述的实施例所限制。相反，提供这些实施例是为了能够更透彻地理解本公开，并且能够将本公开的范围完整的传达给本领域的技术人员。
如图1和图2，本公开实施例提供了一种终端，包括：主板1、中框5、射频线路层2、屏幕4和多个天线3。
其中，所述中框5位于所述主板1与所述射频线路层2之间，所述射频线路层2位于所述屏幕4与所述中框5之间；所述天线3通过所述射频线路层2中的射频线与所述主板1连接。
该实施例中，所述中框5位于所述主板1与所述射频线路层2之间，所述射频线路层2位于所述屏幕4与所述中框5之间；终端中的天线3通过设置于终端的屏幕4与中框5之间的射频线路层2，与主板1连接，能够保证任意位置的天线均能以较短的线路或者直接与射频线路层连接，避免由于天线数量较多，且天线距离主板较远的情况下，通过射频同轴线与天线馈点连接导致终端内部空间占用较多的问题。
可选地，射频线路层2通过胶分别与终端的屏幕4和中框5粘接，以避免通过螺丝定位的空间占用。
可选地，射频线路层2还可以是通过泡棉与所述屏幕4连接，以通过泡棉对射频线路层2提供支撑力。
具体地，主板1位于中框5之上，即主板1位于中框5上与射频线路层2所在面相背的一面。天线3设置于中框5上，且多个天线3可以围绕屏幕4的屏幕边缘设置(如图2)。为了保证任意位置的天线均能以较短的线路或者直接与射频线路层连接，可以设置所述射频线路层2至少部分覆盖所述屏幕4上距离屏幕边缘预定距离的区域。
如图3，作为一种实现方式：所述射频线路层2覆盖所述屏幕4的全部区域。
该实施例中，由于多个天线3围绕屏幕4的屏幕边缘设置，且射频线路层2覆盖屏幕4的全部区域，以保证任意位置的天线3均能以较短的线路或者直接与射频线路层2连接，避免由于天线3数量较多，且天线3距离主板1较远的情况下，通过射频同轴线与天线馈点连接导致终端内部空间占用较多的问题。
如图4，作为另一种实现方式：所述射频线路层2覆盖所述屏幕4上距离屏幕边缘预定距离的区域。
可选地，所述射频线路层2包括：第一子板201、第二子板202、第三子板203和第四子板204；所述射频线路层2呈：所述第一子板201、所述第二子板202、所述第三子板203和所述第四子板204围成的框形结构。
需要说明的是，图4给出了一种射频线路层2的形状为矩形框的示例，此外，射频线路层2的形状还可以是除此之外的其他形状，如：不规则的多边形框等，具体的射频线路层2的形状可以根据天线3的实际布局需求确定，本公开不以此为限。
该实施例中，射频线路层2覆盖所述屏幕4上距离屏幕边缘预定距离的区域，在保证任意位置的天线3均能较短的线路或者直接与射频线路层2连接，避免由于天线3数量较多，且天线3距离主板1较远的情况下，通过射频同轴线与天线馈点连接导致终端内部空间占用较多的基础上，还可以减少射频线路层2的用料，降低成本。
具体地，如图5，所述射频线路层2包括：设置有多个射频线的射频走线层21、位于所述射频走线层21的第一面的第一地层22以及位于所述射频走线层21的第二面的第二地层23。
其中，各个所述天线3通过对应的射频线与所述主板1连接，也就是说一个所述天线3通过一个所述射频线与所述主板1连接；所述第一地层22与所述中框5连接；所述第二地层23与所述屏幕4连接。
可选地，第一地层22与所述中框5通过胶粘接，所述第二地层23与所述屏幕4通过胶粘接，以避免通过螺丝定位的造成终端内部空间占用。
可选地，射频线路层2可以是射频电路板；其中，射频走线层21的材料采用介质损耗小的材料，如：液晶聚合物(Liquid Crystal Polymer，LCP)软板，以保证在传输高频信号的时候损耗较小，且材料可以弯折还能保证适用于具有折叠屏的终端。
可选地，该第一地层22和第二地层23也可以设置电子元器件24(如：天线调谐器等)的走线，该电子元器件24可以与该走线焊接。该射频走线层21、第一地层22和第二地层23形成带状线结构的射频线路层2，保证射频 走线层21中射频线的阻抗连续，并且阻抗能控制在50欧姆。
以下结合具体示例，对射频线路层2与设置于中框5上的天线3的连接方式进行说明：
示例一：如图6，所述中框5设有第一通孔，所述天线3的天线馈点31设置于所述第一通孔的内壁上；可选地，天线馈点31通过塑胶51设置于第一通孔的内壁上，且所述天线馈点31与所述射频线210之间具有间隙。
所述射频线路层2设有第一开孔，所述射频线210穿过所述第一开孔并与所述天线馈点31连接。
可选地，所述射频线210穿过所述第一开孔并通过银胶6与所述天线馈点31连接。
可选地，在所述射频线210穿过所述第一开孔并通过银胶6与所述天线馈点31连接的情况下，所述第一开孔为贯穿所述第一地层22的开孔；其中，第一地层22与中框5连接。所述银胶6填充于所述第一通孔内，所述射频线210穿过所述第一开孔并通过所述银胶6与所述天线馈点31连接。这样，第一开孔仅贯穿第一地层22，以保证射频线路层2结构的可靠性。
具体地，将金属中框5中间开孔，形成第一通孔；天线馈点31设置于该第一通孔的内壁上，与所述射频线210之间具有间隙，形成银胶6的第一填充空间，以使银胶6能够与射频线210电连接，进而保证射频线210能够通过银胶6与天线馈点31电连接。
可选地，在该第一通孔内还预留有填充银胶6的第二填充空间，天线馈点31的至少一导电部分应露出于该第二填充空间内，以使填充于该第二填充空间内的银胶6能与天线馈点31的导电部分连接，进而保证射频线210能够通过银胶6与天线馈点31电连接。
将射频线路层2设置于屏幕4上，如：第二地层23与屏幕4连接；将中框5设置于射频线路层2上，如：第一地层22和中框5连接；当射频线路层2和屏幕4都组装到中框5后，从中框5上远离该射频线路层2的一侧向第一通孔内填充导电的银胶6，使得导电的银胶6与天线馈点31和第一开孔内的射频线210连接，从而通过银胶6实现天线馈点31和射频线210的电连接。
进一步地，所述射频线路层2还通过泡棉7与所述屏幕4连接，这样通 过泡棉7使射频线路层2和中框5之间具有支撑力，即使银胶6注入有余量，在射频线路层2的底部也有支撑力使得天线馈点31和射频线210良好接触。
该实施例中，通过银胶6实现天线馈点31和射频线210的电连接的方式中，射频线210和天线馈点31的之间的接触面积，比通过弹片实现天线馈点31和射频线210的电连接的方式中，射频线210和天线馈点31的之间的接触面积大，而且路径短，避免弹片的接触面积小导致天线3接触不可靠，以及由于射频线210与天线馈点31之间的接触路径较长存在的寄生参数，影响天线性能，从而保证天线3与射频线路层2之间连接的可靠性，进而保证天性性能。
示例二：如图7和图8，所述中框5设有第一通孔，所述天线馈点31设置于所述第一通孔的内壁上；可选地，天线馈点31通过塑胶51设置于第一通孔的内壁上。所述射频线路层2设有第一开孔25，所述射频线穿过所述第一开孔25并与所述天线馈点31连接。
可选地，所述射频线穿过所述第一开孔25并通过金属垫片8与所述天线馈点31连接。
可选地，在所述射频线穿过所述第一开孔25并通过金属垫片8与所述天线馈点31连接的情况下，所述第一开孔25为贯穿所述射频线路层(2)的开孔。其中，所述金属垫片8覆盖所述第一开孔25，且所述金属垫片8的第一面与所述射频线连接，所述金属垫片8的第二面与所述天线馈点31连接。
具体地，在射频线路层2上开设第一开孔25，该第一开孔25贯穿所述第一地层22、所述射频走线层21和所述第二地层23。
可选地，通过表面贴装技术(Surface Mount Technology，SMT)将金属垫片8焊接到射频线路层2上。
将金属垫片8焊接至第一地层22的一侧，并与射频走线层21中的射频线电连接。由于金属垫片8焊接在射频线路层2上第一地层22所在的一侧，可以便于金属垫片8与中框5上天线馈点31连接。
将金属中框5中天线馈点31焊接于金属垫片8上，且第一地层22与中框5连接。由于第一开孔25贯穿所述第一地层22、所述射频走线层21和所述第二地层23，在射频线路层2上第二地层23所在的一侧，提供了焊接空 间，以便于焊接操作，并且天线馈点31焊接于金属垫片8上，还保证了天线3与射频线路层2连接的可靠性。
可选地，金属垫片8焊接于射频线路层2上，突出于该第一地层22的表面设置，为了保证射频线路层2与中框5组合后的整体厚度，在金属垫片8与天线馈点31焊接时，金属垫片8位于该第一通孔内，从而避免终端整体厚度的增加。
将射频线路层2设置于屏幕4上，如：第二地层23与屏幕4连接；可选地，还可以是射频线路层2通过泡棉7与所述屏幕4连接，以通过泡棉7对射频线路层2提供支撑力。
该实施例中，通过金属垫片8实现天线馈点31和射频线210的电连接的方式中，射频线210和天线馈点31的之间的接触面积，比通过弹片实现天线馈点31和射频线的电连接的方式中，射频线210和天线馈点31的之间的接触面积大，而且路径短，避免弹片的接触面积小导致天线接触不可靠，以及由于射频线210与天线馈点31之间的接触路径较长存在的寄生参数，影响天线性能，从而保证天线与射频线路层2之间连接的可靠性，进而保证天性性能。
示例三：如图9，所述所述中框5与所述屏幕4之间设置有馈入天线9，所述馈入天线9与所述射频线连接，并与设置在所述中框5上的天线3耦合，以避免天线馈点与射频线通过接触连接可能存在接触可靠性差的问题。
可选地，所述中框5设有第二通孔，所述天线3设置于所述第二通孔的内壁上；如：天线3通过塑胶51设置于第二通孔的内壁上。
所述射频线路层2设有第二开孔26，所述第二开孔26为贯穿射频线路层2的开孔；如：所述射频线路层2包括：设置有多个射频线的射频走线层21、位于所述射频走线层21的第一面的第一地层22以及位于所述射频走线层21的第二面的第二地层23，则该第二开孔可以是贯穿所述第一地层22、所述射频走线层21和所述第二地层23的开孔；所述馈入天线9位于所述第二开孔26内。
具体地，中框5上的天线3与馈入天线9之间具有间隙，且该间隙的的尺寸在预设距离范围内，以保证天线3与馈入天线9之间能够耦合连接，即 馈入天线9能够接收天线3辐射的能量。
由于第二开孔26贯穿所述第一地层22、所述射频走线层21和所述第二地层23，可以避免第一地层22和第二地层23对馈入天线9造成干扰；并且馈入天线9设置于该第二开孔26内，在避免第一地层22和第二地层23对馈入天线9造成干扰的同时，还可以满足中框5与射频线路层2组合后的厚度要求，避免增加终端厚度。此外，由于射频线路层2是位于在屏幕4和中框5之间，保证组装完成后射频线路层2和中框5之间的距离一致性较好。
进一步地，射频线路层2还可以通过泡棉7与所述屏幕4连接，以通过泡棉7对射频线路层2提供支撑力。
该实施例中，通过馈入天线9实现射频线路层2中的射频线耦合至天线3，避免通过弹片实现天线馈点和射频线的电连接，由于接触面积小导致天线接触不可靠，以及由于射频线与天线馈点之间的接触路径较长存在的寄生参数，影响天线性能，从而保证天线3与射频线路层2之间连接的可靠性，进而保证天性性能。
以下进一步对上述各实施例中射频线路层2与主板1可能的连接方式进行说明：
如图10，所述射频线路层2通过板对板连接器10与所述主板1连接。
具体地，所述射频线路层2与所述中框5的第一表面相邻，所述主板1与所述中框5的第二表面相邻；可选地，所述射频线路层2设置于所述中框5的第一表面，所述主板1设置于所述中框5的第二表面，所述第一表面和所述第二表面相对设置。
所述中框5设有第三开孔，所述板对板连接器10穿设于所述第三开孔内并分别与所述射频线路层2和所述主板1连接。
可选地，板对板连接器10设置于射频线路层2上，由于射频线路层2采用LCP软板制成，能够进行弯折，通过弯折的射频线路层2部分保证板对板连接器10穿过该第三开孔，并扣合至主板1上的连接器座11上。
上述方案中，通过射频线路层2可以保证任意位置的天线3均能较短的线路或者直接与射频线路层2连接，避免由于天线3数量较多，且天线3距离主板1较远的情况下，通过射频同轴线与天线馈点连接导致终端内部空间 占用。并且还可以避免通过弹片实现天线馈点和射频线的电连接，由于接触面积小导致天线接触不可靠，以及由于射频线与天线馈点之间的接触路径较长存在的寄生参数，影响天线性能，从而保证天线3与射频线路层2之间连接的可靠性，进而保证天线性能。
本说明书中的各个实施例均采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似的部分互相参见即可。
尽管已描述了本公开实施例的可选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例做出另外的变更和修改。所以，所附权利要求意欲解释为包括可选实施例以及落入本公开实施例范围的所有变更和修改。
最后，还需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者终端设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者终端设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者终端设备中还存在另外的相同要素。
以上所述的是本公开的可选实施方式，应当指出对于本技术领域的普通人员来说，在不脱离本公开所述的原理前提下还可以作出若干改进和润饰，这些改进和润饰也在本公开的保护范围内。

Claims (13)

  1. 一种终端，包括主板(1)、中框(5)、射频线路层(2)、屏幕(4)和多个天线(3)；
    其中，所述中框(5)位于所述主板(1)与所述射频线路层(2)之间，所述射频线路层(2)位于所述屏幕(4)与所述中框(5)之间；所述多个天线(3)通过所述射频线路层(2)中的射频线与所述主板(1)连接。
  2. 根据权利要求1所述的终端，其中，所述射频线路层(2)至少部分覆盖所述屏幕(4)上距离屏幕边缘预定距离的区域。
  3. 根据权利要求1所述的终端，其中，所述射频线路层(2)包括：
    设置有多个所述射频线的射频走线层(21)，各个所述天线(3)通过对应的射频线与所述主板(1)连接；
    位于所述射频走线层(21)的第一面的第一地层(22)，所述第一地层(22)与所述中框(5)连接；
    位于所述射频走线层(21)的第二面的第二地层(23)，所述第二地层(23)与所述屏幕(4)连接。
  4. 根据权利要求3所述的终端，其中，所述中框(5)设有第一通孔，所述天线(3)的天线馈点(31)设置于所述第一通孔的内壁上；
    所述射频线路层(2)设有第一开孔，所述射频线穿过所述第一开孔并与所述天线馈点(31)连接。
  5. 根据权利要求4所述的终端，其中，所述射频线穿过所述第一开孔并通过银胶(6)或金属垫片(8)与所述天线馈点(31)连接。
  6. 根据权利要求5所述的终端，其中，在所述射频线穿过所述第一开孔并通过银胶(6)与所述天线馈点(31)连接的情况下，所述第一开孔为贯穿所述第一地层(22)的开孔；所述银胶(6)填充于所述第一通孔内。
  7. 根据权利要求6所述的终端，其中，所述天线馈点(31)与所述射频线之间具有间隙。
  8. 根据权利要求5所述的终端，其中，在所述射频线穿过所述第一开孔并通过金属垫片(8)与所述天线馈点(31)连接的情况下，所述第一开孔为 贯穿所述射频线路层(2)的开孔；
    所述金属垫片(8)覆盖所述第一开孔，且所述金属垫片(8)的第一面与所述射频线连接，所述金属垫片(8)的第二面与所述天线馈点(31)连接。
  9. 根据权利要求1所述的终端，其中，所述中框(5)与所述屏幕(4)之间设置有馈入天线(9)，所述馈入天线(9)与所述射频线连接，并与设置在所述中框(5)上的天线(3)耦合。
  10. 根据权利要求9所述的终端，其中，所述中框(5)设有第二通孔，所述天线(3)设置于所述第二通孔的内壁上；
    所述射频线路层(2)设有第二开孔，所述第二开孔为贯穿所述射频线路层(2)的开孔；所述馈入天线(9)位于所述第二开孔内。
  11. 根据权利要求1所述的终端，其中，所述射频线路层(2)通过板对板连接器(10)与所述主板(1)连接。
  12. 根据权利要求11所述的终端，其中，所述射频线路层(2)与所述中框(5)的第一表面相邻，所述主板(1)与所述中框(5)的第二表面相邻，所述第一表面和所述第二表面相对设置；
    所述中框(5)设有第三开孔，所述板对板连接器(10)穿设于所述第三开孔内并分别与所述线路层(2)和所述主板(1)连接。
  13. 根据权利要求1所述的终端，其中，所述射频线路层(2)通过泡棉(7)与所述屏幕(4)连接。
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