WO2020230283A1

WO2020230283A1 - Rectifying device

Info

Publication number: WO2020230283A1
Application number: PCT/JP2019/019216
Authority: WO
Inventors: 辰也山中; 延是春名
Original assignee: 三菱電機株式会社
Priority date: 2019-05-15
Filing date: 2019-05-15
Publication date: 2020-11-19

Abstract

The objective of the present invention is to provide a rectifying device capable of suppressing voltage variations or current variations that result from common mode electromagnetic noise in electric power supplied from an electric power supply circuit to a control circuit.　A rectifying device (1) is provided with a rectifier circuit (2), a control circuit (3) for controlling the rectifier circuit, an electric power supply circuit (4) for supplying electric power to the control circuit, an electric power supply path (15) joining the electric power supply circuit and the control circuit, and a grounding path (13) running in parallel with the electric power supply path, wherein a gap between the electric power supply path and the grounding path is set to a distance allowing electromagnetic coupling between the electric power supply path and the grounding path, and the grounding path is connected to a ground potential in a position closer to the electric power supply circuit than the center of the grounding path.

Description

Rectifier

This application relates to a rectifier.

Rectifiers such as inverters and converters are widely used in electric motors and other electric appliances and home appliances such as television receivers. The rectifier device includes a rectifier circuit having a switching element, a control circuit for controlling the rectifier circuit, and a power supply circuit for supplying electric power to the control circuit. When electromagnetic noise invades the rectifier device configured in this way from the outside, it induces voltage fluctuations or current fluctuations of the power supplied from the power supply circuit to the control circuit, which causes malfunction of the control circuit. ..

As a conventional rectifier to deal with this problem, an inverter device in which a reference ground serving as a reference potential of a power supply circuit and a frame ground serving as a ground potential are arranged on a control board, and the reference ground and the frame ground are connected by a capacitor. Was disclosed (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2011-139551

The power supply wiring and the ground wiring are connected to the power supply circuit to which power is supplied from the outside, but common mode electromagnetic noise may enter the rectifier through these wirings. In the conventional rectifier, electromagnetic noise that has entered the reference ground from the outside can be released to the ground potential via the frame ground. However, there is no way to escape the common mode electromagnetic noise that enters through the power supply wiring. Therefore, in the conventional rectifier, there is a problem that the voltage fluctuation or the current fluctuation caused by the common mode electromagnetic noise of the power supplied from the power supply circuit to the control circuit cannot be suppressed.

This application has been made to solve the above-mentioned problems, and is a rectification capable of suppressing voltage fluctuations or current fluctuations caused by common-mode electromagnetic noise of power supplied from a power supply circuit to a control circuit. The purpose is to provide the device.

The rectifying device of the present application includes a rectifying circuit, a control circuit that controls the rectifying circuit, a power supply circuit that supplies power to the control circuit, a power supply path that connects the power supply circuit and the control circuit, and a power supply path. It is equipped with a grounding path that runs in parallel, and the distance between the power supply path and the grounding path is set to a distance that allows electromagnetic coupling between the power supply path and the grounding path, and the grounding path is the grounding path. It is connected to the ground potential at a position closer to the power supply circuit than the center.

In the rectifier of the present application, the distance between the power supply path and the ground path is set to a distance at which the power supply path and the ground path can be electromagnetically coupled, and the ground path is a power supply circuit rather than the center of the ground path. Since it is connected to the ground potential at a position close to, it is possible to suppress voltage fluctuations or current fluctuations caused by common mode electromagnetic noise of the power supplied from the power supply circuit to the control circuit.

It is a perspective view of the rectifying apparatus which concerns on Embodiment 1. FIG. It is sectional drawing of the rectifying apparatus which concerns on Embodiment 1. FIG. It is a top view of the rectifier device which concerns on Embodiment 1. FIG. It is a circuit diagram of the rectifier device which concerns on Embodiment 1. FIG. It is explanatory drawing which shows the propagation path of the electromagnetic noise in Embodiment 1. FIG. It is explanatory drawing which shows the propagation path of the electromagnetic noise in Embodiment 1. FIG. It is a top view of the rectifier device which concerns on Embodiment 2. FIG. It is sectional drawing of the rectifying apparatus which concerns on Embodiment 2. FIG. It is sectional drawing of the rectifying apparatus which concerns on Embodiment 2. FIG. It is a top view of the rectifier device which concerns on Embodiment 3. FIG. It is a circuit diagram of the rectifier device which concerns on Embodiment 3. It is a perspective view of the rectifying apparatus which concerns on Embodiment 4. FIG. It is sectional drawing of the rectifying apparatus which concerns on Embodiment 4. FIG. It is a top view of the power supply board of Embodiment 4. It is a top view of the control board of Embodiment 4.

Hereinafter, the rectifying device according to the embodiment for carrying out the present application will be described in detail with reference to the drawings. In each figure, the same reference numerals indicate the same or corresponding parts.

Embodiment 1.
FIG. 1 is a perspective view of the rectifying device according to the first embodiment. The rectifying device of this embodiment is, for example, an inverter device. As shown in FIG. 1, the rectifier 1 includes a rectifier circuit 2 which is an inverter circuit, a control circuit 3 which controls the rectifier circuit 2, and a power supply circuit 4 which supplies electric power to the control circuit 3. ing. Power is supplied to the power supply circuit 4 from the external power supply wiring 6 via the power supply terminal block 5. The rectifier circuit 2, the control circuit 3, the power supply circuit 4, and the power supply terminal block 5 are mounted on the electronic circuit board 7 of the single-layer board. The rectifier circuit 2 is in close contact with the heat sink 8 on a surface opposite to the surface mounted on the electronic circuit board 7. A ground wire 9 is electrically connected to the heat sink 8, and the heat sink 8 is set to a ground potential.

FIG. 2 is a cross-sectional view of the rectifier along the line AA shown in FIG. As shown in FIG. 2, on the back surface of the electronic circuit board 7, a power supply path 11 for supplying power from the power supply circuit 4 to the control circuit 3 and a return path 12 serving as a reference potential for the power supply path 11 are formed. Has been done. The power supply path 11 and the return path 12 form a power supply path 15. Further, on the back surface of the electronic circuit board 7,

grounding paths

13a and 13b running in parallel in the vicinity of the feeding path 11 and the return path 12 are formed, respectively. The power supply path 11, the return path 12, and the

ground paths

13a and 13b are formed of a wiring pattern formed on the back surface of the electronic circuit board 7. A convex portion 8a is formed on the surface of the heat sink 8, and the convex portion 8a is provided with a screw hole. The

ground paths

13a and 13b are screwed to the convex portions 8a and are electrically connected to the heat sink 8 set to the ground potential.

FIG. 3 is a top view of the rectifier shown in FIG. As shown in FIG. 3, grounding

paths

13a and 13b are formed so as to run in parallel near the outside of the feeding path 11 and the return path 12, respectively. At this time, the distance between the power feeding path 11 and the grounding path 13a is set to a distance at which electromagnetic coupling is possible. Similarly, the distance between the return path 12 and the ground path 13b is set to a distance at which electromagnetic coupling is possible. Here, electromagnetic coupling means that two systems are connected by electromagnetic induction or electromagnetic force. Further, the grounding path 13a is connected to the heat sink 8 by a screw 14a at a position closer to the power supply circuit 4 than the center of the grounding path 13a. The screw 14a is fastened to the convex portion 8a provided with the screw hole of the heat sink 8. Similarly, the ground path 13b is connected to the heat sink 8 with a screw 14b at a position closer to the power supply circuit 4 than the center of the ground path 13b. Therefore, the

ground paths

13a and 13b are connected to the ground potential at a position closer to the power supply circuit 4 than the center.

FIG. 4 is a circuit diagram of the rectifier 1 of the present embodiment. As shown in FIG. 4, the rectifier 1 includes a rectifier circuit 2, a control circuit 3 that controls the rectifier circuit 2, a power supply circuit 4 that supplies power to the control circuit 3, and a power supply circuit 4. The power supply path 11 and the return path 12 connecting the control circuit 3 and the grounding path 13a that runs parallel to the power supply path 11 and is electromagnetically coupled to the power supply path 11 and parallel to the return path 12 and electromagnetically coupled to the return path 12. It is provided with a grounding path 13b. Further, the ground path 13a is connected to the ground potential at a position closer to the power supply circuit 4 than the center of the ground path 13a. Similarly, the ground path 13b is connected to the ground potential at a position closer to the power supply circuit 4 than the center of the ground path 13b.

Next, the operation of the rectifying device 1 of the present embodiment will be described. FIG. 5 is an explanatory diagram showing a propagation path of electromagnetic noise of a rectifier device not provided with

ground paths

13a and 13b for comparison. FIG. 6 is an explanatory diagram showing a propagation path of electromagnetic noise of the rectifier device provided with the

grounding paths

13a and 13b of the present embodiment. In FIGS. 5 and 6, the propagation path of the electromagnetic noise when the common mode electromagnetic noise invades from the external electromagnetic noise source 21 is indicated by the broken line arrow 22. Further, since the wiring pattern formed on the electronic circuit board 7 has a parasitic inductance component, the parasitic inductance component 23 of the feeding path 11 and the return path 12 is shown in FIGS. 5 and 6.

FIG. 5 shows a propagation path of electromagnetic noise when common mode electromagnetic noise invades the power supply circuit 4 in a rectifier device that does not have

grounding paths

13a and 13b. Since the feeding path 11 and the return path 12 have a parasitic inductance component 23, a high-frequency noise current flows through the feeding path 11 and the return path 12, and a common mode voltage is induced. If the induced common mode voltage is supplied to the control circuit 3, it causes a malfunction. Further, the common mode magnetic flux 24 is generated by the high frequency noise current flowing through the feeding path 11 and the return path 12.

FIG. 6 shows the propagation path of the electromagnetic noise when the common mode electromagnetic noise invades the power supply circuit 4 in the rectifier device of the present embodiment provided with the

ground paths

13a and 13b. The feeding path 11 and the return path 12 have a parasitic inductance component 23. Similarly, the

grounding paths

13a and 13b running in parallel near the outside of the feeding path 11 and the return path 12 also have the parasitic inductance component 25. Further, since the power feeding path 11 and the grounding path 13a are electromagnetically coupled and the return path 12 and the grounding path 13b are electromagnetically coupled to each other, the feeding path 11 and the grounding path 13a and the return path 12 are respectively. A parasitic capacitance component 26 exists between the ground and the ground path 13b.

As shown in FIG. 6, in the rectifier device of the present embodiment, the high-frequency noise current flowing through the feeding path 11 and the return path 12 flows through the

grounding paths

13a and 13b via the parasitic capacitance component 26. The propagation path of the electromagnetic noise that has flowed into the

ground paths

13a and 13b is indicated by the dotted arrow 27. Since the

ground paths

13a and 13b are connected to the ground potential at a position closer to the power supply circuit 4 than the center thereof, the noise current flowing into the

ground paths

13a and 13b is the noise flowing through the power supply path 11 and the return path 12. It flows in the direction opposite to the current. A magnetic flux 28 is generated by a high-frequency noise current flowing through the

ground paths

13a and 13b. Since the direction of the magnetic flux lines of the magnetic flux 28 is opposite to the direction of the magnetic flux lines of the common mode magnetic flux 24 generated in the feeding path 11 and the return path 12, the magnetic flux 28 and the common mode magnetic flux 24 cancel each other out. Therefore, it is possible to suppress the impedance generated by the noise current in the common mode in the feeding path 11 and the return path 12. The high-frequency noise current that has entered the power supply path 11 and the return path 12 flows to the heat sink 8 set to the ground potential via the

ground paths

13a and 13b with low impedance. As a result, the induction of the common mode voltage in the feeding path 11 and the return path 12 can be suppressed, and the malfunction of the control circuit 3 can be prevented.

As described above, in the rectifier device of the present embodiment, the high-frequency noise current that has entered the power supply path 11 and the return path 12 via the power supply circuit is grounded with low impedance via the

ground paths

13a and 13b. It flows to the heat sink 8 set to the electric potential. Therefore, it is possible to suppress voltage fluctuations or current fluctuations caused by common-mode electromagnetic noise of the power supplied from the power supply circuit 4 to the control circuit 3.

In the present embodiment, the

ground paths

13a and 13b are connected to the ground potential only at a position closer to the power supply circuit 4 than the center thereof, but the ground path is grounded at another position in addition to the connection position. It may be connected to a potential. Further, although an example of an inverter device having an inverter circuit as a rectifier is shown, a converter device having a converter circuit may be used.

Embodiment 2.
FIG. 7 is a top view of the rectifying device according to the second embodiment. FIG. 8 is a cross-sectional view of the rectifying device along the line AA shown in FIG. In the rectifier of the present embodiment, a multilayer board is used for the electronic circuit board 7, and a ground path is formed in the wiring layer inside the multilayer board. Other configurations are the same as those in the first embodiment.

As shown in FIG. 8, the electronic circuit board 7 is a multilayer board, and includes an insulating dielectric layer 29 and an internal wiring layer sandwiched between the dielectric layers 29. On the back surface of the electronic circuit board 7, a power supply path 11 for supplying electric power from the power supply circuit 4 to the control circuit 3 and a return path 12 serving as a reference potential for the power supply path 11 are formed. The power supply path 11 and the return path 12 form a power supply path 15. Further, in the wiring layer inside the electronic circuit board 7, grounding

paths

13a and 13b running in parallel in the vicinity of the feeding path 11 and the return path 12 are formed, respectively. The distance between the power feeding path 11 and the grounding path 13a is set to a distance at which electromagnetic coupling is possible via the dielectric layer 29. Similarly, the distance between the return path 12 and the ground path 13b is set to a distance at which electromagnetic coupling is possible via the dielectric layer 29. Further, as shown in FIG. 7, the grounding path 13a is connected to the heat sink 8 set to the grounding potential at a position closer to the power supply circuit 4 than the center of the grounding path 13a. Similarly, the ground path 13b is connected to the heat sink 8 set to the ground potential at a position closer to the power supply circuit 4 than the center of the ground path 13b.

By using a multilayer board for the electronic circuit board 7, the feeding path 11 and the grounding path 13a, and the return path 12 and the grounding path 13b are arranged via the dielectric layer 29, so that the dielectric layer 29 is sandwiched. Can form a parasitic capacitance component.

In the rectifier device configured in this way, as in the first embodiment, the high-frequency noise current that has entered the power supply path 11 and the return path 12 via the power supply circuit passes through the

ground paths

13a and 13b with low impedance. It flows through the heat sink 8 set to the ground potential. Therefore, it is possible to suppress voltage fluctuations or current fluctuations caused by common-mode electromagnetic noise of the power supplied from the power supply circuit 4 to the control circuit 3.

In the multilayer board, the thinner the dielectric layer 29, the larger the capacitance of the parasitic capacitance component. Therefore, by using a multilayer substrate having a thin dielectric layer 29, the capacitance of the parasitic capacitance component can be increased, so that electromagnetic noise can be released to the heat sink 8 with a lower impedance.

FIG. 9 is a cross-sectional view of another rectifying device according to the present embodiment. In the rectifier device shown in FIG. 8, the rectifier device shown in FIG. 9 has the

grounding paths

13a and 13b as one grounding path 13. In the wiring layer inside the electronic circuit board 7, one grounding path 13 that runs in parallel in the vicinity of the feeding path 11 and the return path 12 is formed. The distance between the power supply path 11 and the return path 12 and the ground path 13 is set to a distance at which electromagnetic coupling is possible via the dielectric layer 29. Further, the ground path 13 is connected to the ground potential at a position closer to the power supply circuit 4 than the center of the ground path 13.

Even in the rectifier device configured in this way, the high-frequency noise current that has entered the power supply path 11 and the return path 12 via the power supply circuit passes through the ground path 13 with low impedance, as in the first embodiment. It flows to the heat sink 8 set to the ground potential. Therefore, it is possible to suppress voltage fluctuations or current fluctuations caused by common-mode electromagnetic noise of the power supplied from the power supply circuit 4 to the control circuit 3.

In the present embodiment, the power supply path and the return path are formed on the back surface of the electronic circuit board, but when a multilayer board is used for the electronic circuit board, the power supply path and the return path are formed as a ground path. It may be formed in an internal wiring layer different from the wiring layer. At this time, it is preferable that the wiring layer in which the feeding path and the return path are formed and the wiring layer in which the grounding path is formed are adjacent wiring layers sandwiched between one dielectric layer. Further, the power supply path and the return path do not necessarily have to be formed in the same wiring layer, and may be formed in the upper and lower wiring layers sandwiching the wiring layer in which the grounding path is formed. Further, even when a multilayer board is used as the electronic circuit board, the power supply path, the return path, and the ground path may be formed in the same layer.

Embodiment 3.
FIG. 10 is a top view of the rectifying device according to the third embodiment. FIG. 11 is a circuit diagram of the rectifier device of the present embodiment. The rectifier device of the present embodiment has the same basic configuration as the rectifier device of the first embodiment, but between the power supply path 11 and the ground path 13a, and between the return path 12 and the ground path 13b. The difference is that the capacitors 30 are connected to each. The power supply path 11, the return path 12, the ground path 13a, and the ground path 13b are formed on the back surface of the electronic circuit board 7, but the capacitor 30 is mounted on the front surface of the board. The capacitance of the capacitor 30 is preferably set to a value at which the impedance becomes low in the frequency band of the electromagnetic noise in the common mode. A plurality of capacitors 30 may be arranged.

ground paths

Further, since the capacitor 30 is connected between the power supply path 11 and the ground path 13a and between the return path 12 and the ground path 13b, respectively, the power supply path 11 and the return path 12 do not go through the power supply circuit. The high-frequency noise current that has entered from the outside can be released to the ground path 13a and the ground path 13b by the capacitor 30. As a result, voltage fluctuations or current fluctuations caused by high-frequency noise invading from the outside of the power supplied from the power supply circuit 4 to the control circuit 3 can be further suppressed.

Embodiment 4.
FIG. 12 is a perspective view of the rectifying device according to the fourth embodiment. In the rectifying device of the present embodiment, the electronic circuit board is composed of two boards, a power supply board and a control board.
As shown in FIG. 12, in the rectifying device 1 of the present embodiment, the power supply board 7a and the control board 7b are arranged so as to overlap each other. A power supply circuit 4 and a power supply terminal block 5 are mounted on the power supply board 7a. A rectifier circuit 2 and a control circuit 3 are mounted on the control board 7b. The rectifier circuit 2 is in close contact with the heat sink 8 on a surface opposite to the surface mounted on the control board 7b. A ground wire 9 is electrically connected to the heat sink 8, and the heat sink 8 is set to a ground potential.

The power supply board 7a and the control board 7b are formed with a power supply path 11 for supplying power from the power supply circuit 4 to the control circuit 3 and a return path 12 serving as a reference potential for the power supply path 11. The power supply path 11 and the return path 12 form a power supply path 15. Further, the power supply board 7a and the control board 7b are formed with

grounding paths

13a and 13b running in parallel in the vicinity of the power feeding path 11 and the return path 12, respectively. The power supply path 11, return path 12,

ground path

13a and 13b formed on the power supply board 7a and the power supply path 11, return path 12,

ground path

13a and 13b formed on the control board 7b are connected to the inter-board connector 40. Each is connected.

The grounding path 13a formed on the power supply board 7a is electrically connected to the convex portion 8a of the heat sink 8 via the screw 41 and the metal spacer 42 at a position closer to the power supply circuit 4 than the center of the grounding path 13a. ing. Similarly, the grounding path 13b is electrically connected to the convex portion 8a of the heat sink 8 via the screw 41 and the metal spacer 42 at a position closer to the power supply circuit 4 than the center of the grounding path 13b.

FIG. 13 is a cross-sectional view of the rectifier along the line AA shown in FIG. As shown in FIG. 13, on the surface of the power supply board 7a, a power supply path 11 for supplying power from the power supply circuit 4 to the control circuit 3 and a return path 12 serving as a reference potential for the power supply path 11 are formed. ing. Further, on the surface of the power supply board 7a, a grounding path 13a and a grounding path 13b running in parallel in the vicinity of the power feeding path 11 and the return path 12 are formed, respectively. Further, a power feeding path 11, a return path 12, a grounding path 13a, and a grounding path 13b are formed on the back surface of the control board 7b.

FIG. 14 is a top view of the power supply board 7a. Further, FIG. 15 is a top view of the control board 7b. The distance between the power supply path 11 and the ground path 13a formed on the power supply board 7a and the control board 7b, respectively, is set to a distance at which electromagnetic coupling is possible. Similarly, the distance between the return path 12 and the ground path 13b formed on the power supply board 7a and the control board 7b, respectively, is set to a distance at which electromagnetic coupling is possible.

ground paths

Further, in the rectifier of the present embodiment, since the electronic circuit board is composed of two boards, a power supply board and a control board, the occupied area is reduced. Further, in the rectifier device of the present embodiment, since the power supply board and the control board are fixed by metal spacers, the structure is stable against vibration and the like.

In the present embodiment, the ground path formed on the power supply board is connected to the ground potential only at a position closer to the power supply circuit than the center of the ground path, but in addition to the connection position, other ground paths are connected. In position, the ground path may be connected to the ground potential.

Although various exemplary embodiments are described in the present application, the various features, embodiments, and functions described in one or more embodiments are limited to the application of the particular embodiment. Rather, it can be applied to embodiments alone or in various combinations.
Therefore, innumerable variations not illustrated are envisioned within the scope of the techniques disclosed in the present application. For example, it is assumed that at least one component is modified, added or omitted, and further, at least one component is extracted and combined with the components of other embodiments.

1 rectifier, 2 rectifier circuit, 3 control circuit, 4 power supply circuit, 5 power terminal block, 6 power wiring, 7 electronic circuit board, 7a power board, 7b control board, 8 heat sink, 8a convex part, 9 ground wiring, 11 power supply path, 12 return path, 13, 13a, 13b ground path, 14a, 14b screw, 15 power supply path, 21 electromagnetic noise source, 23, 25 parasitic inductance component, 24 common mode magnetic flux, 26 parasitic capacitance component, 28 magnetic flux. , 29 dielectric layer, 30 capacitors, 40 board-to-board connectors, 41 screws, 42 metal spacers.

Claims

Rectifier circuit and
The control circuit that controls this rectifier circuit and
The power supply circuit that supplies power to this control circuit and
A power supply path connecting the power supply circuit and the control circuit,
A rectifier having a grounding path running in parallel with the power supply path.
The distance between the power supply path and the grounding path is set to a distance at which the power supply path and the grounding path can be electromagnetically coupled.
A rectifier device characterized in that the grounding path is connected to a grounding potential at a position closer to the power supply circuit than the center of the grounding path.
The rectifier comprises a multilayer substrate and
The rectifier according to claim 1, wherein the power supply path is formed in one layer of the multilayer board, and the grounding path is formed in another layer of the multilayer board.
The rectifier comprises a single layer substrate or a multilayer substrate.
The rectifying device according to claim 1, wherein the power supply path and the grounding path are formed in the same layer of the single-layer substrate or the multilayer substrate.
The rectifier according to any one of claims 1 to 3, wherein a capacitor is connected between the power supply path and the ground path.
The rectifier device includes a control board on which the rectifier circuit and the control circuit are mounted, and a power supply board on which the power supply circuit is mounted.
The control board and the power supply board are arranged so as to overlap each other.
The power supply path and the grounding path are formed on both the control board and the power supply board.
The rectifier according to claim 1, wherein the grounding path formed on the power supply board is connected to the grounding potential at a position closer to the power supply circuit than the center of the grounding path.