WO2020221002A1 - 激光投射模组及终端设备 - Google Patents

激光投射模组及终端设备 Download PDF

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Publication number
WO2020221002A1
WO2020221002A1 PCT/CN2020/084786 CN2020084786W WO2020221002A1 WO 2020221002 A1 WO2020221002 A1 WO 2020221002A1 CN 2020084786 W CN2020084786 W CN 2020084786W WO 2020221002 A1 WO2020221002 A1 WO 2020221002A1
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WIPO (PCT)
Prior art keywords
optical element
projection module
laser
laser projection
circuit layer
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Ceased
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PCT/CN2020/084786
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English (en)
French (fr)
Inventor
杨望来
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Publication of WO2020221002A1 publication Critical patent/WO2020221002A1/zh
Priority to US17/513,786 priority Critical patent/US12255435B2/en
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0236—Fixing laser chips on mounts using an adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/06825—Protecting the laser, e.g. during switch-on/off, detection of malfunctioning or degradation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing

Definitions

  • the present disclosure relates to the technical field of communication equipment, and in particular to a laser projection module and terminal equipment.
  • Terminal devices on the market have more and more functions, and more and more terminal devices adopt 3D recognition technology, which can recognize the user's face.
  • the core of the 3D recognition technology is to measure the depth information, and then merge it with the acquired 2D plane image information to obtain a 3D image.
  • 3D recognition technologies include structured light technology, time-of-flight ranging technology, binocular stereo vision technology, etc. Regardless of the technology, a light source needs to be projected during the recognition process. Because of the advantages of better collimation, better directionality, and higher energy, laser has become the first choice for projection light source in 3D recognition technology.
  • the laser projection module of the terminal device usually includes an optical element, which diffuses the energy of the laser, so as to avoid harm to the human body.
  • the terminal device may be bumped, dropped, etc., which may easily cause the optical element to break.
  • the effect of the optical element on the laser disappears and the laser is directly projected onto the skin.
  • manufacturers usually install connection lines on the optical components.
  • the connection lines are used as part of the power supply circuit of the laser emitting module. When the optical components are broken, the connection lines will also be broken, resulting in the power supply circuit. When the circuit breaks, the laser emission of the laser chip is finally stopped, thereby avoiding the damage of the laser caused by the fragmentation of the optical element.
  • connection lines on the side wall of the base of the laser projection module has the problem of complicated production work, which will undoubtedly lead to higher manufacturing costs of the laser projection module.
  • the present disclosure discloses a laser projection module to solve the problem of high manufacturing cost of the laser projection module.
  • a laser projection module includes a base, a laser chip, an optical element, and a first wire.
  • the base has an inner cavity and an opening communicating with the inner cavity.
  • the laser chip is arranged in the inner cavity to face On the bottom wall of the opening, the optical element is installed in the opening, a circuit layer is provided on the optical element, and the laser chip, the first wire, and the circuit layer are sequentially connected in series.
  • a terminal device includes the above-mentioned laser projection module.
  • the laser chip and the circuit layer are electrically connected by a first wire, and the laser chip, the first wire and the circuit layer are serially connected in series.
  • the optical element is broken, the circuit layer will be broken.
  • the power supply circuit where the laser chip is located can be disconnected, and finally the laser chip can be stopped from continuing to emit the laser, so as to prevent the laser from harming the human body.
  • the first wire can be directly used to realize the connection between the laser chip and the circuit layer. This method does not require a complicated process, which is beneficial to reduce the manufacturing cost of the laser projection module.
  • FIG. 1 is a schematic structural diagram of a base of a laser projection module disclosed in some embodiments of the present disclosure
  • FIG. 2 is a schematic diagram of a partial structure of a laser projection module disclosed in some embodiments of the disclosure.
  • Figure 3 is a top view of part of the structure in Figure 2;
  • FIG. 4 is a schematic structural diagram of a laser projection module disclosed in some embodiments of the disclosure.
  • Figures 5 and 6 are schematic diagrams of optical elements of two structures disclosed in some embodiments of the present disclosure, respectively.
  • the disclosed laser projection module includes a base 100, a laser chip 200, an optical element 300 and a first wire 400.
  • the base 100 is a basic component of the laser projection module, and the base 100 can provide an installation foundation for other components of the laser projection module.
  • both the laser chip 200 and the optical element 300 may be installed on the base 100.
  • the base 100 is usually installed on the circuit board of the terminal device, so as to realize the installation of the entire laser projection module.
  • An external electrode 700 may be provided at the bottom of the base 100, and the external electrode 700 may be electrically connected to the circuit board, and then the entire laser projection module can be provided with electrical energy through the circuit board.
  • the base 100 has an inner cavity 110 and an opening 120 communicating with the inner cavity 110, and the inner cavity 110 has a bottom wall 111 facing the opening 120.
  • the laser chip 200 is used to emit laser light, and the laser chip 200 is disposed on the bottom wall 111.
  • the optical element 300 is installed in the opening 120 to cover the laser chip 200.
  • the optical element 300 is usually a diffusion element.
  • the laser light generated during the operation of the laser chip 200 can be projected onto the optical element 300 and diffused by the optical element 300. Reduce the energy of the laser.
  • the optical element 300 is provided with a circuit layer 310.
  • the circuit layer 310 serves as a part of the power supply circuit for the laser chip 200.
  • the laser chip 200, the first wire 400, and the circuit layer 310 are connected in series, and then serve as Part of the power supply loop.
  • the circuit layer 310 attached to the optical element 300 may break.
  • the first wire 400 is usually a connection cable with a certain degree of flexibility. In a specific connection process, a wire bond process is usually used.
  • the laser chip 200 and the circuit layer 310 are electrically connected through the first wire 400, and the laser chip 200, the first wire 400 and the circuit layer 310 are serially connected in series, and the When the element 300 is broken, the circuit layer 310 will be disconnected, which can break the power supply circuit where the laser chip 200 is located, and eventually stop the laser chip 200 from continuing to emit laser light, so as to prevent the laser from harming the human body.
  • the first wire 400 can be directly used to realize the gap between the laser chip 200 and the circuit layer 310. This method does not require complicated processes, which is beneficial to reduce the manufacturing cost of the laser projection module.
  • connection lines are usually arranged on the outer side wall of the base, and bumps are more likely to occur during the installation of the laser projection module, and the connection lines are more likely to be damaged.
  • the connection The circuit layer 310 and the first wire 400 of the laser chip 200 are located in the cavity 110, which can avoid circuit damage caused by bumps during the installation of the laser projection module.
  • the optical element 300 can be directly fixed on the end surface where the opening 120 is located.
  • the opening 120 of the base 100 can have a step surface 121, and the optical element 300 can be lapped and fixed on the step.
  • the optical element 300 is limited to the stepped surface 121 after being installed in place, which reduces the probability of the optical element 300 falling off.
  • the first wire 400 can be electrically connected to the circuit layer 310 in a variety of ways.
  • the step surface 121 can be provided with a first pad 122, and the circuit layer 310 can pass through the first pad 122 and the first pad 122.
  • a wire 400 is electrically connected.
  • the first bonding pad 122 and the circuit layer 310 can be bonded and fixed by the first adhesive connection part 500.
  • the first adhesive connection part 500 is the first conductive adhesive layer, and the first conductive adhesive layer ensures the On the premise that a pad 122 is electrically connected to the circuit layer 310, a fixed connection between the first pad 122 and the circuit layer 310 can also be realized.
  • the stepped surface 121 and the edge of the optical element 300 can be bonded and fixed by the second adhesive connection part.
  • the optical element 300 can further improve the connection with the stepped surface 121 under the auxiliary connection of the second adhesive connection part. The stability of the connection.
  • the bottom wall 111 of the cavity 110 may be provided with a second pad 600, the laser chip 200 may be fixed on the second pad 600, and the laser chip 200 may be electrically connected to the second pad 600.
  • the two pads 600 may be electrically connected to the external electrode 700 on the bottom of the base 100.
  • the laser chip 200 may be electrically connected to the laser chip 200 through the second conductive adhesive layer 210.
  • the circuit layer 310 is disposed on the optical element 300.
  • the circuit layer 310 can be arranged on the outer surface of the optical element 300 or on the inner surface of the optical element 300 facing the bottom wall 111, in order to avoid damage to the circuit layer due to bumps during the installation of the laser projection module. 310.
  • the circuit layer 310 is disposed on the inner surface of the optical element 300 facing the bottom wall 111.
  • the circuit layer 310 can also be provided in the optical element 300.
  • the circuit layer 310 may be a conductive layer coated on the surface of the optical element 300, or a conductive film pasted on the surface of the optical element 300. Some embodiments of the present disclosure do not limit the specific forming method of the optical element 300, as long as It is sufficient to ensure that when the optical element 300 is broken, the circuit layer 310 is broken under the breaking stress of the optical element 300.
  • the circuit layer 310 can have various shapes. As shown in FIGS. 5 and 6, in order to better ensure that the breaking of the circuit layer 310 is synchronized with the breaking of the optical element 300, the circuit layer 310 needs to cover the surface of the optical element 300 as much as possible. Area, usually, the circuit layer 310 can be bent to extend from one end of the optical element 300 to the other end of the optical element 300.
  • the base 100 may be a ceramic base, a resin base, etc., and some embodiments of the present disclosure do not limit the specific material of the base 100.
  • some embodiments of the present disclosure disclose a terminal device, and the disclosed terminal device includes the laser projection module described in the above embodiments.
  • the terminal devices disclosed in some embodiments of the present disclosure may be terminal devices such as mobile phones, tablet computers, e-book readers, game consoles, wearable devices (for example, smart watches), etc. Some embodiments of the present disclosure do not limit the specific types of terminal devices. .

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Projection Apparatus (AREA)

Abstract

一种激光投射模组，其包括基座（100）、激光芯片（200）、光学元件（300）和第一导线（400），基座（100）具有内腔（110）和与内腔连通的开口（120），激光芯片（200）设置在内腔（110）中朝向开口（120）的底壁上，光学元件（300）安装于开口（120），光学元件（300）上设置有线路层（310），激光芯片（200）、第一导线（400）和线路层（310）依次串联。

Description

激光投射模组及终端设备
相关申请的交叉引用
本申请主张在2019年4月29日在中国提交的中国专利申请号No.201910355256.7的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及通讯设备技术领域，尤其涉及一种激光投射模组及终端设备。
背景技术
市场上的终端设备的功能越来越多，越来越多的终端设备采用3D识别技术，3D识别技术能够实现对用户人脸的识别。3D识别技术的核心在于测出深度信息，然后与已获取的2D平面图像信息融合得到3D图像。当前，3D识别技术有结构光技术、飞行时间测距技术、双目立体视觉技术等。无论哪种技术，在识别的过程中均需要投射光源。激光由于准直性较好、方向性较好、能量较高等优势，成为3D识别技术中投射光源的首选。
但是，激光由于能量较高，因此在直接照射皮肤会对人体造成伤害。基于此，终端设备的激光投射模组通常包括光学元件，光学元件会将激光的能量扩散，从而能够避免对人体造成伤害。
在实际的应用过程中，终端设备有可能会发生磕碰、摔落等情况，进而较容易导致光学元件破碎，此种情况下，光学元件对激光的作用消失，激光会直接投射到皮肤上。为了解决此问题，生产厂商通常会在光学元件上设置连接线路，连接线路作为构成激光发射模组的供电回路的一部分，当光学元件发生破碎时，连接线路也会随之断裂，进而导致供电回路发生断路，最终停止激光芯片的激光发射，进而能够避免光学元件碎裂导致激光对人体的伤害。
通常在激光投射模组的基座的侧壁上制作衔接线路，从而实现光学元件上的连接线路与激光芯片之间形成供电回路。但是，在基座的侧壁制作连接线路，存在制作工作复杂的问题，这无疑会导致激光投射模组的制造成本较 高。
发明内容
本公开公开一种激光投射模组，以解决激光投射模组的制造成本较高的问题。
为了解决上述问题，本公开采用下述技术方案：
一种激光投射模组，包括基座、激光芯片、光学元件和第一导线，所述基座具有内腔和与所述内腔连通的开口，所述激光芯片设置在所述内腔中朝向所述开口的底壁上，所述光学元件安装于所述开口，所述光学元件上设置有线路层，所述激光芯片、所述第一导线和所述线路层依次串联。
一种终端设备，包括上文所述的激光投射模组。
本公开采用的技术方案能够达到以下有益效果：
本公开公开的激光投射模组中，激光芯片与线路层之间通过第一导线进行电连接，而且激光芯片、第一导线和线路层依次串联，在光学元件发生断裂时，线路层会发生断开，进而能够使得激光芯片所在的供电回路发生断路，最终能够停止激光芯片继续发射激光，达到防止激光对人体的伤害。相比于相关技术中通过在基座的侧壁设置导电层而言，本公开的一些实施例公开的激光投射模组中，可以直接采用第一导线实现激光芯片和线路层之间的连接，此种方式无需复杂的工艺，有利于降低激光投射模组的制造成本。
附图说明
此处所说明的附图用来提供对本公开的进一步理解，构成本公开的一部分，本公开的示意性实施例及其说明用于解释本公开，并不构成对本公开的不当限定。在附图中：
图1为本公开的一些实施例公开的激光投射模组的基座的结构示意图；
图2为本公开的一些实施例公开的激光投射模组的部分结构示意图；
图3为图2中部分结构的俯视图；
图4为本公开的一些实施例公开的激光投射模组的结构示意图；以及
图5和图6分别为本公开的一些实施例公开的两种结构的光学元件的示 意图。
附图标记说明：
100-基座、110-内腔、111-底壁、120-开口、121-台阶面、122-第一焊盘、
200-激光芯片、210-第二导电胶层、
300-光学元件、310-线路层、
400-第一导线、
500-第一胶连接部、600-第二焊盘、700-外接电极。
具体实施方式
为使本公开的目的、技术方案和优点更加清楚，下面将结合本公开具体实施例及相应的附图对本公开技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
以下结合附图，详细说明本公开各个实施例公开的技术方案。
请参考图1-图6，本公开的一些实施例公开一种激光投射模组，所公开的激光投射模组包括基座100、激光芯片200、光学元件300和第一导线400。
基座100为激光投射模组的基础构件，基座100能够为激光投射模组的其它组成构件提供安装基础。本公开的一些实施例中，激光芯片200和光学元件300均可以安装在基座100上。在具体的安装过程中，基座100通常安装在终端设备的电路板上，进而实现整个激光投射模组的安装。基座100的底部可以设置有外接电极700，外接电极700可以与电路板电连接，进而能够通过电路板为整个激光投射模组提供电能。
本公开的一些实施例中，基座100具有内腔110和与内腔110连通的开口120，内腔110具有朝向开口120的底壁111。
激光芯片200用于发射激光，激光芯片200设置在底壁111上。光学元件300安装于开口120中，从而实现对激光芯片200的覆盖，光学元件300通常为扩散元件，激光芯片200工作中产生的激光能够投射到光学元件300 上，并被光学元件300扩散，从而降低激光的能量。
光学元件300上设置有线路层310，线路层310作为激光芯片200能够工作的供电回路的一部分，本公开的一些实施例中，激光芯片200、第一导线400和线路层310依次串联，进而作为供电回路的一部分。在光学元件300发生破裂的情况下，依附于光学元件300的线路层310会发生断裂。
第一导线400通常为具有一定柔性的连接线缆，在具体的连接过程中，通常采用wire bond工艺实现。
本公开的一些实施例公开的激光投射模组中，激光芯片200与线路层310之间通过第一导线400进行电连接，而且激光芯片200、第一导线400和线路层310依次串联，在光学元件300发生断裂时，线路层310会发生断开，进而能够使得激光芯片200所在的供电回路发生断路，最终能够停止激光芯片200继续发射激光，达到防止激光对人体的伤害。相比于相关技术中通过在基座的侧壁设置导电层而言，本公开的一些实施例公开的激光投射模组中，可以直接采用第一导线400实现激光芯片200和线路层310之间的连接，此种方式无需复杂的工艺，有利于降低激光投射模组的制造成本。
另外，通常在基座的外侧壁设置连接线路，在激光投射模组安装的过程中较容易发生磕碰，进而较容易损坏连接线路，而本公开的一些实施例公开的激光投射模组中，连接线路层310和激光芯片200的第一导线400位于内腔110中，能够避免激光投射模组在安装过程中由于磕碰导致的电路损坏。
光学元件300可以直接固定在开口120所在的端面上，为了提高安装的稳定性，更为可选的方案中，基座100的开口120可以具有台阶面121，光学元件300可以搭接固定在台阶面121上，此种情况下，光学元件300安装到位后受限于台阶面121，降低光学元件300脱落的概率。
第一导线400可以通过多种方式实现与线路层310之间的电连接，可选的方案中，台阶面121可以设置有第一焊盘122，线路层310可以通过第一焊盘122与第一导线400电连接。
为了提高连接的稳定性，第一焊盘122与线路层310之间可以通过第一胶连接部500粘接固定，第一胶连接部500为第一导电胶层，第一导电胶层确保第一焊盘122与线路层310导电连接的前提下，还能实现第一焊盘122 与线路层310之间的固定连接。
当然，台阶面121与光学元件300的边缘可以通过第二胶连接部粘接固定，此种情况下，光学元件300能够在第二胶连接部的辅助连接作用下，进一步提高与台阶面121之间连接的稳定性。
本公开的一些实施例中，内腔110的底壁111可以设置有第二焊盘600，激光芯片200可以固定在第二焊盘600上，激光芯片200与第二焊盘600电连接，第二焊盘600可以与基座100底部的外接电极700电连接。
同样，为了提高激光芯片200安装的稳定性，更为可选的方案中，激光芯片200可以通过第二导电胶层210与激光芯片200电连接。
如上文所述，线路层310设置在光学元件300上。具体的，线路层310可以设置在光学元件300的外侧表面上，也可以设置在光学元件300朝向底壁111的内侧表面上，为了避免激光投射模组在安装过程中由于发生磕碰而损坏线路层310，更为可选的方案中，线路层310设置在光学元件300朝向底壁111的内侧表面上。当然，线路层310也可以设置在光学元件300内。
线路层310可以是涂覆在光学元件300的表面上的导电层，也可以是粘贴在光学元件300的表面上的导电膜，本公开的一些实施例不限制光学元件300的具体形成方式，只要确保光学元件300发生破裂时，线路层310在光学元件300的破裂应力下发生断裂即可。
线路层310的形状可以有多种，如图5和图6所示，为了更好地确保线路层310的断裂与光学元件300的破裂同步，线路层310需要尽可能大地覆盖光学元件300的表面区域，通常情况下，线路层310可以折弯地从光学元件300的一端延伸至光学元件300的另一端。
本公开的一些实施例公开的激光投射模组中，基座100可以为陶瓷基座、树脂基座等，本公开的一些实施例不限制基座100的具体材质。
基于本公开的一些实施例公开的激光投射模组，本公开的一些实施例公开一种终端设备，所公开的终端设备包括上文实施例描述的激光投射模组。
本公开的一些实施例公开的终端设备可以是手机、平板电脑、电子书阅读器、游戏机、可穿戴设备(例如智能手表)等终端设备，本公开的一些实施例不限制终端设备的具体种类。
本公开上文实施例中重点描述的是各个实施例之间的不同，各个实施例之间不同的优化特征只要不矛盾，均可以组合形成更优的实施例，考虑到行文简洁，在此则不再赘述。
以上所述仅为本公开的实施例而已，并不用于限制本公开。对于本领域技术人员来说，本公开可以有各种更改和变化。凡在本公开的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本公开的权利要求范围之内。

Claims (10)

  1. 一种激光投射模组，包括基座、激光芯片、光学元件和第一导线，所述基座具有内腔和与所述内腔连通的开口，所述激光芯片设置在所述内腔中朝向所述开口的底壁上，所述光学元件安装于所述开口，所述光学元件上设置有线路层，所述激光芯片、所述第一导线和所述线路层依次串联。
  2. 根据权利要求1所述的激光投射模组，其中，所述基座的开口具有台阶面，所述光学元件搭接固定在所述台阶面。
  3. 根据权利要求2所述的激光投射模组，其中，所述台阶面设置有第一焊盘，所述线路层通过所述第一焊盘与所述第一导线电连接。
  4. 根据权利要求3所述的激光投射模组，其中，所述第一焊盘与所述线路层之间通过第一胶连接部粘接固定，所述第一胶连接部为第一导电胶层。
  5. 根据权利要求4所述的激光投射模组，其中，所述台阶面与所述光学元件的边缘通过第二胶连接部粘接固定。
  6. 根据权利要求1所述的激光投射模组，其中，所述底壁设置有第二焊盘，所述激光芯片固定在第二焊盘上，所述激光芯片与第二焊盘电连接。
  7. 根据权利要求6所述的激光投射模组，其中，所述激光芯片通过第二导电胶层与所述激光芯片电连接。
  8. 根据权利要求1所述的激光投射模组，其中，所述线路层设置在所述光学元件朝向所述底壁的内侧表面上。
  9. 根据权利要求1所述的激光投射模组，其中，所述线路层折弯地从光学元件的一端延伸至所述光学元件的另一端。
  10. 一种终端设备，包括权利要求1-9中任一项所述的激光投射模组。
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