WO2020220550A1 - 投影设备的光机组件及投影设备 - Google Patents

投影设备的光机组件及投影设备 Download PDF

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Publication number
WO2020220550A1
WO2020220550A1 PCT/CN2019/104486 CN2019104486W WO2020220550A1 WO 2020220550 A1 WO2020220550 A1 WO 2020220550A1 CN 2019104486 W CN2019104486 W CN 2019104486W WO 2020220550 A1 WO2020220550 A1 WO 2020220550A1
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WIPO (PCT)
Prior art keywords
housing
galvanometer
optical
assembly
projection device
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/CN2019/104486
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English (en)
French (fr)
Inventor
刘祥彬
戴洁
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Qingdao Hisense Laser Display Co Ltd
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Qingdao Hisense Laser Display Co Ltd
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Application filed by Qingdao Hisense Laser Display Co Ltd filed Critical Qingdao Hisense Laser Display Co Ltd
Publication of WO2020220550A1 publication Critical patent/WO2020220550A1/zh
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Ceased legal-status Critical Current

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00Projectors or projection-type viewers; Accessories therefor
    • G03B21/005Projectors using an electronic spatial light modulator but not peculiar thereto
    • G03B21/008Projectors using an electronic spatial light modulator but not peculiar thereto using micromirror devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00Projectors or projection-type viewers; Accessories therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00Projectors or projection-type viewers; Accessories therefor
    • G03B21/14Details
    • G03B21/16Cooling; Preventing overheating

Definitions

  • the present disclosure relates to the technical field of projection equipment, and in particular to an optical-mechanical assembly of the projection equipment and the projection equipment.
  • Digital Light Processing (DLP) projectors are based on the Digital Micromirror Device (DMD) technology to display visual digital information.
  • the principle is: for example, as shown in Figure 1, the white light generated by the light source 01 passes through the color wheel 02 into the three primary colors of red, green and blue, and the three primary colors pass through the light collecting rod 03, the relay optical system 04, the reflector 05 and TIR (Total Internal (Reflection, total internal reflection) After the prism group 06, it is projected onto the digital micro-mirror element 07.
  • the digital micro-mirror element 07 is composed of multiple micro lenses. A micro lens is equivalent to a pixel unit, and each micro lens can be rotated to a certain extent. The angle is determined by the charge.
  • the signal input acts on the digital micro-mirror element 07 to control the deflection of the micro-lens.
  • the deflection angle of the micro-lens is different, light may be reflected into the projection lens 08 or leave the projection lens 08.
  • the micro lens when the micro lens is positively deflected (when the micro lens is in the on state), the light is reflected by the micro lens to the projection lens 08; when the micro lens is negatively deflected (when the micro lens is in the off state), the light is reflected by the micro lens to the projection lens 08 Elsewhere, without entering the projection lens 08, the light is projected and imaged by the projection lens 08 after being selectively reflected by the micro lens of the digital micro mirror element 07.
  • the embodiments of the present disclosure provide an opto-mechanical component of a projection device and a projection device, which are used to reduce the aging of components such as galvanometer coils.
  • an embodiment of the present disclosure provides an opto-mechanical component of a projection device, including a digital micro-mirror component, a galvanometer component, a shield, and a heat dissipation device.
  • the galvanometer assembly includes a galvanometer, the galvanometer is located on the optical path of the first reflected light, and the first reflected light is the light reflected when the microlens of the digital micromirror element is in an open state.
  • the blocking member is located on the light incident side of the galvanometer assembly, and the blocking member is located on the optical path of the second reflected light to block the second reflected light, and the second reflected light is the digital micromirror element The light reflected when the micro lens is in the off state.
  • the heat dissipation device is used for dissipating heat to the shielding member.
  • the embodiments of the present disclosure also provide a projector, including the optical and mechanical components of the projector described in the above embodiments.
  • Fig. 1 shows a schematic diagram of the principle of a projection device according to an embodiment of the present disclosure
  • Fig. 2 shows a schematic structural diagram of a projection device according to an embodiment of the present disclosure
  • Fig. 3 shows an optical path diagram between a galvanometer assembly and a TIR prism group in a projection device according to an embodiment of the present disclosure
  • Fig. 4 shows a schematic structural diagram of a projection device according to an embodiment of the present disclosure
  • FIG. 5 shows a schematic structural diagram of an optical machine assembly according to an embodiment of the present disclosure
  • Figure 6 is an exploded view of the opto-mechanical assembly shown in Figure 5 with the housing removed;
  • Fig. 7 shows an optical path diagram in the optical machine assembly shown in Fig. 5;
  • FIG. 8 is a schematic diagram of the structure of the connection between the shielding member and the heat sink in FIG. 5;
  • Fig. 9 shows a schematic structural diagram of an optical machine assembly according to an embodiment of the present disclosure.
  • Figure 10 is an exploded view of the opto-mechanical assembly shown in Figure 9 (only half of the housing is shown);
  • Figure 11 shows a diagram of the light path in the opto-mechanical assembly shown in Figure 9 (the shielding sheet is connected to the radiator);
  • Fig. 12 shows a cross-sectional view of an optical-mechanical assembly according to an embodiment of the present disclosure
  • FIG. 13 shows a perspective view of a housing of an optical machine assembly according to an embodiment of the present disclosure
  • Fig. 14 shows a schematic structural diagram of a shielding member of an optical-mechanical assembly according to an embodiment of the present disclosure
  • Fig. 15 shows a schematic structural diagram of a shielding member of an opto-mechanical assembly according to an embodiment of the present disclosure.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the present disclosure, unless otherwise specified, “plurality” means two or more.
  • connection should be interpreted broadly. For example, they can be fixed or detachable. Connected or integrally connected; for those of ordinary skill in the art, the specific meaning of the above terms in the present disclosure can be understood in specific situations.
  • a galvanometer assembly 09 is arranged between the TIR prism group 06 and the projection lens 08.
  • the galvanometer assembly 09 includes a vibration
  • the mirror bracket 091 and the galvanometer set on the galvanometer bracket 091 are provided with a blocking member 092 on the side of the galvanometer bracket 091 where the off-state reflected light (off light) is incident, and the off-state reflected light is the micro lens of the digital micro mirror element 07
  • the light reflected in the off state; the blocking member 092 is located on the light path of the off state reflected light, and the blocking member 092 is used to absorb the off state reflected light.
  • the lens vibration makes two consecutive frames of images misaligned.
  • the two image beams enter the projection lens 08 sequentially.
  • the human eye uses visual persistence to perceive the display of high-definition images. .
  • the temperature of the shielding member 092 will increase due to the off-state reflected light. Since the shielding member 092 is in direct contact with the galvanometer bracket 091, the shielding member 092 will The heat is transferred to the galvanometer bracket 091, so that the temperature of the galvanometer coil and other components set on the galvanometer bracket 091 will increase, and the galvanometer coil and other components have strict requirements on the working temperature. Excessive temperature will accelerate its aging and affect Its normal operation will affect the normal operation of the galvanometer assembly 09, thereby causing a reduction in the definition and resolution of the projected picture, which cannot meet the picture quality requirements.
  • the embodiment of the present disclosure provides an opto-mechanical assembly of a projection device, as shown in FIG. 5 and FIG. 6, including a digital micro-mirror element 1, a galvanometer assembly 2, a shield 3 and a heat dissipation device 4.
  • the galvanometer assembly 2 includes a galvanometer 22, which is located on the optical path of the first reflected light (for example, the dashed line with an arrow shown in FIG. 7, also called on light).
  • a reflected light is the light reflected when the micro lens of the digital micro mirror element 1 is in the open state.
  • the shielding member 3 is located on the light incident side of the galvanometer assembly 2, and the shielding member 3 is located outside the optical path of the first reflected light and is located at the second reflected light (for example, the solid line with arrows shown in FIG. 7 is also called off light) to block the second reflected light, which is the light reflected when the micro lens of the digital micro mirror element 1 is in the off state.
  • the heat dissipation device 4 is used for dissipating heat to the shield 3.
  • the galvanometer assembly 2 includes a galvanometer bracket 21 and a galvanometer 22 arranged on the galvanometer bracket 21; the blocking member 3 is located outside the optical path of the first reflected light, so as to prevent the blocking member 3 from pairing The first reflected light is blocked, so that the shape and brightness of the projection screen are not affected.
  • the optical-mechanical component of the projection equipment provided by the embodiment of the present disclosure includes a heat dissipation device 4, so that during the working process of the projection equipment, the heat dissipation device 4 can dissipate heat for the shielding member 3, avoiding the temperature of the shielding member 3 from being too high, thereby reducing the shielding member 3
  • the heat transferred to the galvanometer assembly 2 prevents the coils and other components in the galvanometer assembly 2 from being damaged due to excessive temperature. In this way, the normal operation of the galvanometer assembly 2 can be ensured, and the clarity and resolution of the projected picture can be improved.
  • the structure of the heat dissipation device 4 is not unique, and may at least include the following embodiments:
  • the housing 5 of the opto-mechanical component is used as the heat dissipation device 4 to dissipate heat to the shield 3.
  • the opto-mechanical assembly further includes a housing 5.
  • the shield 3, the digital micro-mirror element 1, and the galvanometer assembly 2 are located in the housing 5; the heat sink 4 includes the housing 5, the shield 3 and the housing The body 5 is thermally connected.
  • the shield 3 since the shield 3 is thermally connected to the housing 5, during operation, the heat generated by the shield 3 can be transferred to the housing 5, and the housing 5 can exchange heat with the outside air, thereby The heat generated by the shield 3 is radiated to the surrounding air. Since the outer surface of the housing 5 is relatively large, a better heat dissipation effect can be achieved, thereby avoiding the temperature of the shield 3 from being too high during the working process.
  • the digital micro-mirror element 1 can be embedded on the wall of the housing 5 (as shown in Figures 12 and 13), or can be located in the housing 5 and installed on the inner wall of the housing 5.
  • the galvanometer assembly 2 may be located in the housing 5 (as shown in FIGS. 12 and 13), or it may be embedded on the wall of the housing 5, and there is no specific limitation here.
  • the material of the housing 5 is not unique.
  • the housing 5 may be a metal housing, such as an aluminum housing; in addition, the housing 5 may also be an alloy housing, such as an aluminum alloy housing or a magnesium alloy. Shell, etc.;
  • the shell 5 can also be a plastic shell. Compared with a plastic shell, a metal shell or an alloy shell has a higher thermal conductivity, and the heat generated by the shield 3 can be quickly diffused to the entire shell 5, so that the heat dissipation effect of the shield 3 can be improved.
  • the shield 3 is dissipated by the heat sink 41 provided outside the housing 5.
  • the heat dissipation device 4 includes a radiator 41 which is located outside the casing 5.
  • the housing 5 is provided with an escape hole 51, the first part of the shield 3 is located in the housing 5 to shield the second reflected light, and the second part of the shield 3 passes through the escape hole 51 and the heat sink. 41 thermal connection.
  • the shield 3 can transfer heat to the radiator 41 to reduce the heat transferred from the shield 3 to the housing 5, thereby reducing the heat transferred from the housing 5 to the digital micro-mirror element 1 and avoiding the digital micro-mirror
  • the temperature of element 1 is too high and affects the normal delivery of the projection screen.
  • the digital micro-mirror element 1 can be embedded on the wall of the housing 5 (as shown in Figures 12 and 13), or can be located in the housing 5 and installed on the inner wall of the housing 5.
  • the galvanometer assembly 2 may be located in the housing 5 (as shown in FIGS. 12 and 13), or it may be embedded on the wall of the housing 5, and there is no specific limitation here.
  • the heat dissipation device 4 further includes a heat-insulating member 42 which is arranged on the second part of the shielding member 3 and the escape hole 51 between the wall of the hole.
  • a heat-insulating member 42 By providing the heat insulating member 42, the heat transfer between the shielding member 3 and the shell wall of the housing 5 can be avoided, so that the temperature of the housing 5 will not be affected by the temperature of the shielding member 3, so that the digital micromirror element 1 is It will not be affected by the heat transferred by the shield 3, thereby ensuring the normal operation of the digital micro-mirror element 1.
  • the heat insulating member 42 may be made of heat insulating material such as fluoro rubber.
  • the way of connecting the shielding member 3 and the heat sink 41 is not unique.
  • the shielding member 3 can be connected to the heat sink 41 through a heat-conducting member 43.
  • the heat sink 4 further includes a heat-conducting member 43.
  • the shield 3 is connected to the radiator 41 through a heat conductive member 43, and the heat conductive member 43 wraps the part of the shield 3 outside the housing 5.
  • the shield 3 can also be directly connected to the heat sink 41.
  • the embodiment in which the shield 3 is connected to the radiator 41 through the heat-conducting member 43 can increase the heat transfer area between the shield 3 and the radiator 41, thereby The heat transfer efficiency between the shield 3 and the heat sink 41 is improved, and the heat dissipation effect of the heat sink 41 to the shield 3 is improved.
  • the heat conducting member 43 can be made of heat conducting materials such as aluminum, aluminum alloy, copper, etc.
  • the positional relationship between the shielding member 3 and the galvanometer assembly 2 is also not unique.
  • the shielding member 3 may be spaced apart from the galvanometer assembly 2.
  • the blocking member 3 can also be in contact with the galvanometer assembly 2.
  • the shield 3 and the galvanometer assembly 2 are spaced apart, which can further reduce the heat transferred from the shield 3 to the galvanometer assembly 2, which can better prevent the galvanometer assembly 2.
  • the coils and other components in the battery are damaged due to excessive temperature, so as to ensure the normal operation of the galvanometer assembly 2 and to better ensure that the clarity and resolution of the projection screen meet the requirements.
  • the opto-mechanical assembly further includes a TIR prism group 6, which is arranged on the optical path between the galvanometer assembly 2 and the digital micro-mirror element 1.
  • the TIR prism group 6 can change the light path to match the incident light and the reflected light required by the digital micromirror element 1.
  • the shielding member 3 may be located on the light emitting side of the TIR prism group 6.
  • the blocking member 3 may also be located on the light incident side of the TIR prism group 6.
  • the distance between the blocking member 3 and the digital micro-mirror element 1 is relatively long, where the second reflected light
  • the distance between the optical path of the first reflected light and the optical path of the first reflected light is relatively large. Disposing the shield 3 on the light exit side of the TIR prism group 6 can more easily ensure that the shield 3 is located outside the optical path of the first reflected light to prevent blocking Block 3 of the first reflected light.
  • the structure of the shield 3 is not unique.
  • the shield 3 may have the following structure: as shown in FIG. 12 and FIG. 15, along the axial direction of the galvanometer, the shield 3 The surface on the side far away from the galvanometer assembly 2 (for example, the surface 33 shown in FIG.
  • the 12 includes a plurality of uneven reflective microstructures 32, so that when the second reflected light is irradiated on the surface 33, the multiple reflective microstructures 32 can diffusely reflect the second reflected light, so that the second reflected light is scattered and reflected to different positions, so as to prevent the second reflected light from irradiating the galvanometer assembly 2; at the same time, a plurality of reflective microstructures 32 diffuse the second reflected light Reflect, which can disperse the energy of the second reflected light, and prevent the second reflected light from being reflected on other components causing the component to become too hot.
  • the reflective microstructures 32 may be dot-shaped protrusions or strip-shaped protrusions, which are not specifically limited here; when the reflective microstructures 32 are dot-shaped protrusions, the shielding member 3 is far away from one part of the galvanometer assembly 2.
  • the side surface 32 may be frosted to form a plurality of uneven reflective microstructures 32.
  • the shielding member 3 may also have the following structure: as shown in FIGS. 12 and 14, along the axial direction of the galvanometer, the surface of the shielding member 3 away from the galvanometer assembly 2 (for example, the surface 33 shown in FIG. 12) covers There is a layer 31 of light-absorbing material.
  • the light-absorbing material layer 31 can absorb the second reflected light, which not only prevents the second reflected light from irradiating the galvanometer assembly 2, but also prevents the shielding member 3 from irradiating the second reflected light.
  • the reflected light is reflected to other parts, thereby avoiding the temperature rise of other parts.
  • the light-absorbing material layer 31 may be a black light-absorbing material layer, or may be a light-absorbing material layer of other colors. Compared with light-absorbing material layers of other colors, the black light-absorbing material layer has a stronger ability to absorb the second reflected light.
  • the shape of the shielding member 3 is not unique.
  • the shielding member 3 may be a shielding sheet; in addition, the shielding member 3 may also be a shielding rod. Compared with the shielding rod, when the area of the shielded area on the galvanometer assembly 2 is constant, the occupied volume of the shielding sheet is smaller, thereby making the structure of the optomechanical assembly more compact.
  • the digital micro-mirror element 1 can be embedded on the wall of the housing 5 through the following structure: As shown in FIG. 12, the housing 5 A through hole 52 is opened on the shell wall of the, and the through hole 52 is a stepped hole. The digital micromirror element 1 is disposed in the through hole 52, and the edge area of the digital micromirror element 1 abuts the step surface of the through hole 52.
  • the opto-mechanical assembly further includes a heat sink 7, a circuit board 8, and a connector 9.
  • the circuit board 8 is electrically connected to the digital micro-mirror element 1 through the connector 9;
  • the heat sink 7 includes a heat sink 71
  • the connecting portion 72, the connecting portion 72 passes through the circuit board 8 and the connector 9 and then contacts the digital micromirror element 1 in heat conduction.
  • the heat generated by the digital micro-mirror element 1 can be transferred from the connecting portion 72 to the heat-dissipating part 71, and the heat-dissipating part 71 dissipates the heat to the surrounding air, thereby avoiding the temperature of the digital micro-mirror element 1 being too high. Affect its normal operation.
  • An embodiment of the present disclosure also provides a projection device, as shown in FIG. 4, which includes the optical machine assembly 100 in the foregoing embodiment.
  • the projection device may be a device capable of image projection, such as a laser TV and a projector.
  • the projection device further includes a lens assembly 200, the lens assembly 200 is connected to the optical-mechanical assembly 100 and is located on the light-emitting side of the optical-mechanical assembly 100.
  • the lens assembly 200 includes multiple sets of lenses, and each set of lenses includes one or more lenses, so that through the refraction between different lenses, the light emitted from the optical assembly can be focused on the projection screen, thereby displaying normal Picture.

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Abstract

一种投影设备的光机组件及投影设备。投影设备的光机组件包括数字微镜元件(1)、振镜组件(2)、遮挡件(3)及散热装置(4)。振镜组件(2)包括振镜(22),振镜(22)位于第一反射光线的光路上,第一反射光线为数字微镜元件(1)的微镜片处于开态时所反射的光线。遮挡件(3)位于振镜组件(2)的入光侧,遮挡件(3)位于第二反射光线的光路上,以遮挡第二反射光线,第二反射光线为数字微镜元件(1)的微镜片处于关态时所反射的光线。散热装置(4)用于对遮挡件(3)散热。

Description

投影设备的光机组件及投影设备
相关申请的交叉引用
本专利申请要求于2019年4月28日提交的、申请号为201910350842.2的中国专利申请的优先权,该申请的全文以引用的方式并入本文中。
技术领域
本公开涉及投影设备技术领域,尤其涉及一种投影设备的光机组件及投影设备。
背景技术
数字光处理(Digital Light Processing,简称DLP)投影机是基于数字微镜元件(Digital Micromirror Device,简称DMD)来完成可视数字信息显示的技术。其原理是:例如图1所示,光源01产生的白光经过色轮02分成红绿蓝三基色光,三基色光经过集光棒03、中继光学系统04、反射镜05和TIR(Total Internal Reflection,全内反射)棱镜组06后,投射到数字微镜元件07上,数字微镜元件07上由多个微镜片组成,一个微镜片相当于一个像素单元,每个微镜片均可旋转一定角度并且由电荷定位,信号输入经过处理后作用于数字微镜元件07,从而控制微镜片的偏转,随着微镜片偏转角度的不同,光线可能会反射进入投影镜头08或离开投影镜头08,具体而言:当微镜片正偏转时(微镜片处于开态时),光线被微镜片反射至投影镜头08中;当微镜片负偏转时(微镜片处于关态时),光线被微镜片反射到别处,不进入投影镜头08中,光线在经过数字微镜元件07的微镜片的选择性地反射后由投影镜头08投影成像。
发明内容
本公开实施例提供了一种投影设备的光机组件及投影设备,用于减缓振镜线圈等部件的老化。
第一方面,本公开的实施例提供了一种投影设备的光机组件,包括数字微镜元件、振镜组件、遮挡件及散热装置。所述振镜组件包括振镜,所述振镜位于第一反射光线的光路上,所述第一反射光线为所述数字微镜元件的微镜片处于开态时所反射的光线。所述遮挡件位于所述振镜组件的入光侧,所述遮挡件位于第二反射光线的光路上,以遮挡所述第二反射光线,所述第二反射光线为所述数字微镜元件的微镜片处于关态时所反射的光线。所述散热装置用于对所述遮挡件散热。
第二方面,本公开实施例还提供了一种投影机,包括上述实施例中所述的投影机的光机组件。
附图说明
为了更清楚地说明本公开实施例的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本公开的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1示出了根据本公开实施例的投影设备的原理示意图;
图2示出了根据本公开实施例的一种投影设备的结构示意图;
图3示出了根据本公开实施例的一种投影设备中振镜组件与TIR棱镜组之间的光路图;
图4示出了根据本公开实施例的投影设备的结构示意图;
图5示出了根据本公开实施例的光机组件的结构示意图;
图6为图5中示出的光机组件拆去壳体后的爆炸图;
图7示出了图5所示光机组件中的光路图;
图8为图5中遮挡件与散热器连接的结构示意图;
图9示出了根据本公开实施例的光机组件的结构示意图;
图10为图9中示出的光机组件的爆炸图(只示出一半的壳体);
图11示出了图9所示光机组件中的光路图(遮挡片与散热器相连接);
图12示出了根据本公开实施例的光机组件的剖面视图;
图13示出了根据本公开实施例的光机组件的壳体的透视图;
图14示出了根据本公开实施例的光机组件的遮挡件的结构示意图;
图15示出了根据本公开实施例的光机组件的遮挡件的结构示意图。
具体实施方式
下面将结合本公开实施例中的附图,对本公开实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本公开一部分实施例,而不是全部的实施例。基 于本公开中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本公开保护的范围。
在本公开的描述中,需要理解的是,术语“中心”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本公开和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本公开的限制。
术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开的描述中,除非另有说明,“多个”的含义是两个或两个以上。
在本公开的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;对于本领域的普通技术人员而言,可以具体情况理解上述术语在本公开中的具体含义。
为了提高投影画面的清晰度和分辨率,相关技术中,如图2所示,在TIR棱镜组06和投影镜头08之间设置振镜组件09,如图3所示,振镜组件09包括振镜支架091和设置在振镜支架091上的振镜,在振镜支架091关态反射光线(off光线)入射的一侧设置遮挡件092,关态反射光线为数字微镜元件07的微镜片处于关态时所反射的光线;遮挡件092位于关态反射光线的光路上,遮挡件092用于吸收关态反射光线。在工作时,镜片振动使得连续两帧图像发生错位,利用错位叠加的方式,使得这两束影像光束依次进入投影镜头08,在投影屏幕上,人眼利用视觉暂留感知高清晰度图像的显示。
针对图3示出的投影设备,在工作一段时间后,遮挡件092会因关态反射光线的照射而温度升高,由于遮挡件092是与振镜支架091直接相接触,这样遮挡件092会将热量传递给振镜支架091,从而使振镜支架091上设置的振镜线圈等部件温度升高,而振镜线圈等部件对工作温度有着严格的要求,温度过高会加速其老化以影响其正常工作,从而会影响振镜组件09的正常工作,进而会造成投影画面的清晰度和分辨率的降低,不能满足画面质量要求。
本公开实施例提供了一种投影设备的光机组件,如图5和图6所示,包括数字微镜元件1、振镜组件2、遮挡件3及散热装置4。如图6和图7所示,振镜组件2包括振镜22,振镜位于第一反射光线(例如图7中所示的带箭头的虚线,也被称为on光线)的 光路上,第一反射光线为数字微镜元件1的微镜片处于开态时所反射的光线。遮挡件3位于振镜组件2的入光侧,遮挡件3位于第一反射光线的光路之外,且位于第二反射光线(例如图7中所示的带箭头的实线,也被称为off光线)的光路上,以遮挡第二反射光线,第二反射光线为数字微镜元件1的微镜片处于关态时所反射的光线。散热装置4用于对遮挡件3散热。
如图6和图7所示,振镜组件2包括振镜支架21和设置于振镜支架21上的振镜22;遮挡件3位于第一反射光线的光路之外,以避免遮挡件3对第一反射光线进行遮挡,从而使投影画面的形状、亮度不受影响。
本公开实施例提供的投影设备的光机组件包括散热装置4,这样,在该投影设备工作过程中,散热装置4可以为遮挡件3散热,避免遮挡件3的温度过高,从而减少遮挡件3向振镜组件2传递的热量,避免振镜组件2中的线圈等部件出现因温度过高而损坏。这样,可以保证振镜组件2的正常工作,改善投影画面的清晰度和分辨率。
在上述实施例中,散热装置4的结构并不唯一,至少可以包括以下几个实施例:
在本公开的某些实施例中,如图9~图13所示将光机组件的壳体5作为散热装置4对遮挡件3散热。如图9-12所示,光机组件还包括壳体5,遮挡件3、数字微镜元件1和振镜组件2位于壳体5内;散热装置4包括壳体5,遮挡件3与壳体5导热连接。在该实施例中,由于遮挡件3与壳体5导热连接,在工作的过程中,遮挡件3产生的热量就可以传递给壳体5,壳体5就可以外界的空气发生热交换,从而将遮挡件3产生的热量散发到周围的空气中。由于壳体5的外表面相对较大,因而可以取得较佳的散热效果,从而避免遮挡件3在工作过程中的温度过高。
在该实施例中,数字微镜元件1可以嵌设于壳体5的壳壁上(如图12和图13所示),也可以位于壳体5内且安装于壳体5的内壁上,在此不做具体限定;振镜组件2可以位于壳体5内(如图12和图13所示),也可以嵌设于壳体5的壳壁上,在此也不做具体限定。
在该实施例中,壳体5的材质也不唯一,比如壳体5可以为金属壳体,例如铝壳体;此外,壳体5还可以为合金壳体,例如铝合金壳体、镁合金壳体等;另外,壳体5还可以为塑料壳体。相比塑料壳体,金属壳体或者合金壳体的导热率更高,遮挡件3所产生的热量能够较快地扩散至整个壳体5上,从而可以提高遮挡件3的散热效果。
在本公开的某些实施例中,如图5~图8所示通过设置在壳体5外的散热器41对遮挡件3进行散热。散热装置4包括散热器41,散热器41位于壳体5外。如图8所示,壳体5上开设有避让孔51,遮挡件3的第一部分位于壳体5内,以遮挡第二反射光线, 遮挡件3的第二部分穿过避让孔51与散热器41导热连接。在工作的过程中,遮挡件3可以将热量传递给散热器41,以减少遮挡件3向壳体5传递的热量,从而减少壳体5向数字微镜元件1传递的热量,避免数字微镜元件1的温度过高而影响投影画面的正常投放。
在该实施例中,数字微镜元件1可以嵌设于壳体5的壳壁上(如图12和图13所示),也可以位于壳体5内且安装于壳体5的内壁上,在此不做具体限定;振镜组件2可以位于壳体5内(如图12和图13所示),也可以嵌设于壳体5的壳壁上,在此也不做具体限定。
在该实施例中,为了进一步减少遮挡件3向壳体5传递的热量,如图8所示,散热装置4还包括绝热件42,绝热件42设置于遮挡件3的第二部分与避让孔51的孔壁之间。通过设置绝热件42,可以避免遮挡件3与壳体5的壳壁之间发生的热传递,这样壳体5的温度就不会受到遮挡件3的温度的影响,从而数字微镜元件1就不会受到遮挡件3所传递热量的影响,进而保证数字微镜元件1的正常工作。
其中,绝热件42可以由氟橡胶等绝热材料制成。
在该实施例中,遮挡件3与散热器41的连接方式也不唯一,比如遮挡件3可以通过导热件43与散热器41连接,如图8所示,散热装置4还包括导热件43,遮挡件3通过导热件43与散热器41连接,并且导热件43将遮挡件3位于壳体5外的部分包裹。另外,遮挡件3还可以直接与散热器41相连接。相比遮挡件3直接与散热器41相连接的实施例,遮挡件3通过导热件43与散热器41连接的实施例,可以增大遮挡件3与散热器41之间的传热面积,从而提高遮挡件3与散热器41之间的传热效率,进而提高散热器41对遮挡件3的散热效果。
其中,导热件43可由铝、铝合金、铜等导热材料制成。
本公开实施例提供的投影设备的光机组件中,遮挡件3与振镜组件2的位置关系也不唯一,比如,如图12所示,遮挡件3可以与振镜组件2相隔设置。另外,遮挡件3还可以与振镜组件2相接触。相比遮挡件3与振镜组件2相接触,遮挡件3与振镜组件2相隔设置,可以进一步减少遮挡件3向振镜组件2所传递的热量,这样可以更好地防止振镜组件2中的线圈等部件出现因温度过高而损坏,从而保证振镜组件2的正常工作,进而更好地保证投影画面的清晰度和分辨率满足要求。
如图6-7和图11所示,该光机组件还包括TIR棱镜组6,TIR棱镜组6设置于振镜组件2与数字微镜元件1之间的光路上。TIR棱镜组6可以改变光路,用以匹配数字微镜元件1所需要的入射光线和反射光线。
其中,遮挡件3与TIR棱镜组6的位置关系也不唯一,比如,如图7所示,遮挡件3可以位于TIR棱镜组6的出光侧。另外,遮挡件3还可以位于TIR棱镜组6的入光侧。相比遮挡件3位于TIR棱镜组6的入光侧,遮挡件3位于TIR棱镜组6的出光侧时,遮挡件3离数字微镜元件1的距离相对较远,在此处第二反射光线的光路与第一反射光线的光路之间的距离相对较大,将遮挡件3设置于TIR棱镜组6的出光侧可以更加容易确保遮挡件3位于第一反射光线的光路之外,以防止遮挡件3对第一反射光线的遮挡。
本公开实施例提供的投影设备的光机组件中,遮挡件3的结构也不唯一,比如遮挡件3可以为以下结构:如图12和图15所示,沿振镜的轴向,遮挡件3远离振镜组件2的一侧表面(例如图12所示的面33)包括多个凹凸不平的反射微结构32,这样在第二反射光线照射至该表面33上时,多个反射微结构32就可以将第二反射光线漫反射,使第二反射光线分散反射至不同的位置,避免第二反射光线照射至振镜组件2上;同时,多个反射微结构32将第二反射光线漫反射,这样可以分散第二反射光线的能量,避免第二反射光线被反射到其它部件上时导致该部件温度过高。其中,反射微结构32可以为点状凸起,也可以为条状凸起,在此不做具体限定;当反射微结构32为点状凸起时,遮挡件3远离振镜组件2的一侧表面32可以通过磨砂处理以形成多个凹凸不平的反射微结构32。
另外,遮挡件3还可以为以下结构:如图12和图14所示,沿振镜的轴向,遮挡件3远离振镜组件2的一侧表面(例如图12所示的面33)覆盖有吸光材料层31。这样在第二反射光线照射至遮挡件3时,吸光材料层31就可以将第二反射光线吸收,不但可以避免第二反射光线照射至振镜组件2上,还可以避免遮挡件3将第二反射光线反射至其它部件上,从而避免其它部件温度升高。
其中,吸光材料层31可以为黑色吸光材料层,也可以为其它颜色的吸光材料层。相比其它颜色的吸光材料层,黑色吸光材料层的对第二反射光线的吸收能力更强。
本公开实施例提供的投影设备的光机组件中,遮挡件3的形状也不唯一,比如,如图7所示,遮挡件3可以为遮挡片;另外,遮挡件3还可以为遮挡棒。相比遮挡棒,在振镜组件2上被遮挡的区域面积一定时,遮挡片的占用体积更小,从而使该光机组件的结构更加紧凑。
在数字微镜元件1嵌设于壳体5的壳壁上的实施例中,数字微镜元件1可以通过以下结构嵌设于壳体5的壳壁上:如图12所示,壳体5的壳壁上开设有通孔52,通孔52为台阶孔,数字微镜元件1设置于通孔52内,并且数字微镜元件1的边缘区域与通孔52的台阶面相抵靠。
如图5和图6所示,该光机组件还包括散热装置7、电路板8以及连接件9,电路板8通过连接件9与数字微镜元件1电连接;散热装置7包括散热部71和连接部72,连接部72穿过电路板8、连接件9后与数字微镜元件1导热接触。这样在工作过程中,数字微镜元件1产生的热量就可以由连接部72传递至散热部71,散热部71将热量散至周围的空气中,从而避免数字微镜元件1的温度过高而影响其正常工作。
本公开实施例还提供了一种投影设备,如图4所示,包括上述实施例中的光机组件100。
其中,投影设备可以为激光电视、投影仪等能够进行影像投影的设备。如图4所示,该投影设备还包括镜头组件200,镜头组件200与光机组件100相连接,且位于光机组件100的出光侧。镜头组件200包含有多组镜片,各组镜片中均包括有一个或一个以上镜片,这样通过不同镜片之间的折射,能够让从光学组件中出射的光线在投影屏幕上实现聚焦,从而显示正常的画面。
本公开实施例提供的投影设备所解决的技术问题以及取得的技术效果,均与第一方面中的光机组件100所解决的技术问题以及取得的技术效果相同,在此不再赘述。
在本说明书的描述中,具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上,仅为本公开的具体实施方式,但本公开的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本公开揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本公开的保护范围之内。因此,本公开的保护范围应以权利要求的保护范围为准。

Claims (12)

  1. 一种投影设备的光机组件,包括:
    数字微镜元件;
    振镜组件,所述振镜组件包括振镜,所述振镜位于第一反射光线的光路上,所述第一反射光线为所述数字微镜元件的微镜片处于开态时所反射的光线;
    遮挡件,所述遮挡件位于所述振镜组件的入光侧,所述遮挡件位于第二反射光线的光路上,以遮挡所述第二反射光线,所述第二反射光线为所述数字微镜元件的微镜片处于关态时所反射的光线;和
    第一散热装置,所述第一散热装置用于对所述遮挡件散热。
  2. 根据权利要求1所述的投影设备的光机组件,其中,
    所述光机组件还包括壳体,
    所述遮挡件位于所述壳体内;
    所述第一散热装置包括所述壳体,所述遮挡件与所述壳体导热连接。
  3. 根据权利要求2所述的投影设备的光机组件,其中,所述壳体为金属壳体或者合金壳体。
  4. 根据权利要求1所述的投影设备的光机组件,其中,
    所述光机组件还包括壳体;
    所述第一散热装置包括散热器,所述散热器位于所述壳体外;
    所述壳体上开设有避让孔,所述遮挡件的第一部分位于所述壳体内、第二部分穿过所述避让孔与所述散热器导热连接。
  5. 根据权利要求4所述的投影设备的光机组件,其中,
    所述第一散热装置还包括绝热件,
    所述绝热件设置于所述遮挡件与所述避让孔的孔壁之间。
  6. 根据权利要求4所述的投影设备的光机组件,其中,
    所述第一散热装置还包括导热件,
    所述遮挡件通过所述导热件与所述散热器连接,并且所述导热件将所述遮挡件位于所述壳体外的部分包裹。
  7. 根据权利要求1~6中任一项所述的投影设备的光机组件,其中,所述遮挡件与所述振镜组件相隔设置。
  8. 根据权利要求1~6中任一项所述的投影设备的光机组件,其中,
    所述光机组件还包括全内反射TIR棱镜组,
    所述TIR棱镜组设置于所述振镜组件与所述数字微镜元件之间的光路上,所述遮挡件位于所述TIR棱镜组的出光侧。
  9. 根据权利要求1~6中任一项所述的投影设备的光机组件,其中,沿所述振镜的轴向,所述遮挡件远离所述振镜组件的一侧表面包括多个凹凸不平的反射微结构。
  10. 根据权利要求1~6中任一项所述的投影设备的光机组件,其中,沿所述振镜的轴向,所述遮挡件远离所述振镜组件的一侧表面覆盖有吸光材料层。
  11. 根据权利要求1~10中任一项所述的投影设备的光机组件,还包括:
    与所述数字微镜元件连接的第二散热装置。
  12. 一种投影设备,其特征在于,包括权利要求1~11中任一项所述的光机组件。
PCT/CN2019/104486 2019-04-28 2019-09-05 投影设备的光机组件及投影设备 Ceased WO2020220550A1 (zh)

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