WO2020202721A1 - Dispositif de mesure de quantité physique - Google Patents

Dispositif de mesure de quantité physique Download PDF

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Publication number
WO2020202721A1
WO2020202721A1 PCT/JP2020/002247 JP2020002247W WO2020202721A1 WO 2020202721 A1 WO2020202721 A1 WO 2020202721A1 JP 2020002247 W JP2020002247 W JP 2020002247W WO 2020202721 A1 WO2020202721 A1 WO 2020202721A1
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WO
WIPO (PCT)
Prior art keywords
lead frame
sensor
hole
thin film
sensor package
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Application number
PCT/JP2020/002247
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English (en)
Japanese (ja)
Inventor
ファハナー ビンティ ハリダン ファティン
吉田　勇
余語　孝之
阿部　博幸
Original Assignee
日立オートモティブシステムズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日立オートモティブシステムズ株式会社 filed Critical 日立オートモティブシステムズ株式会社
Priority to JP2021511133A priority Critical patent/JP7317103B2/ja
Publication of WO2020202721A1 publication Critical patent/WO2020202721A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow

Definitions

  • the present invention relates to a physical quantity measuring device.
  • Patent Document 1 describes a structure in which an intermediate member is provided in order to reduce strain on the thin film portion generated by a difference in linear expansion coefficient between the flow rate sensor and the lead frame on which the flow rate sensor is mounted.
  • the physical quantity measuring device mounted in the intake pipe is required to have a low profile (reduction of pressure loss).
  • the thickness of the flow rate sensor package is increased by providing the intermediate member, and there is room for study to reduce the thickness of the physical quantity measuring device.
  • the intermediate member is simply abolished, the thickness can be reduced, but the detection accuracy deteriorates due to the warp of the thin film portion (detection portion) caused by the difference in the coefficient of linear expansion between the flow sensor and the lead frame. There was a problem.
  • an object of the present invention is to provide a sensor package capable of improving detection accuracy without providing an intermediate member, and a physical quantity measuring device using the sensor package.
  • the flow sensor package of the present invention includes a semiconductor substrate having a cavity formed therein, a thin film portion provided so as to cover the cavity portion, a semiconductor element, and a lead on which the semiconductor element is mounted.
  • the lead frame includes a frame and a resin molded body provided so that the thin film portion of the semiconductor element is exposed, and the lead frame has a hole formed at a position facing the thin film portion, and the opening of the hole. The area is equal to or larger than the area of the thin film portion.
  • FIG. 5 is a plan view showing a state in which the sealing portion of the sensor package of FIG. 4 is removed.
  • FIG. 4 is a cross-sectional view of the sensor package along the VI-VI line shown in FIG. The figure which shows the relationship between the area ratio of a hole of a lead frame and a thin film part, and the amount of deformation of a thin film part.
  • FIG. 5 is a plan view showing a state in which the sealing portion of the sensor package of FIG. 8 is removed.
  • FIG. 8 is a cross-sectional view of the sensor package taken along the X-ray line shown in FIG. An enlarged view of the XI (a) portion surrounded by the alternate long and short dash line shown in FIG. The cross-sectional view corresponding to FIG. 11a of the physical quantity measuring apparatus which concerns on Embodiment 2 of this invention.
  • FIG. 6 is a cross-sectional view corresponding to FIG. 6 of the physical quantity measuring device according to the third embodiment of the present invention. An enlarged view of the XIII-XIII part surrounded by the alternate long and short dash line shown in FIG. The enlarged view which shows the modification of the sensor package of FIG. A perspective plan view showing a modification of the sensor package of FIGS. 12 to 14.
  • FIG. 15 is a cross-sectional view of the sensor package taken along the line XVI-XVI shown in FIG.
  • the physical quantity measuring device 20 measures physical quantities such as the flow rate, temperature, humidity, and pressure of the gas to be measured 2, which is the intake air taken in through the air cleaner 21 and flows through the main passage 22.
  • the physical quantity measuring device 20 outputs an electric signal corresponding to the physical quantity of the intake air.
  • the output signal of the physical quantity measuring device 20 is input to the control device 4.
  • the fuel supply amount and ignition timing which are the main control amounts of the internal combustion engine 10, are both calculated using the output of the physical quantity measuring device 20 as the main parameter. Therefore, it is important to improve the measurement accuracy of the physical quantity measuring device 20, suppress the change with time, and improve the reliability in order to improve the control accuracy and the reliability of the vehicle.
  • the vehicle equipped with the physical quantity measuring device 20 is used in an environment where changes in temperature and humidity are relatively large. It is desirable that the physical quantity measuring device 20 also considers the response to changes in temperature and humidity in the usage environment and the response to dust and pollutants. Further, the physical quantity measuring device 20 is attached to an intake pipe affected by heat generated from the internal combustion engine 10. Therefore, the heat generated by the internal combustion engine 10 is transmitted to the physical quantity measuring device 20 via the intake pipe which is the main passage 22. Since the physical quantity measuring device 20 measures the flow rate of the gas to be measured by transferring heat to the gas to be measured, it is important to suppress the influence of heat from the outside as much as possible.
  • the physical quantity measuring device 20 mounted on the vehicle simply solves the problems described in the problem column to be solved by the invention and exerts the effects described in the effect column of the invention. is not.
  • the physical quantity measuring device 20 fully considers the various problems described above, solves various problems required as a product, and exerts various effects. Specific problems to be solved by the physical quantity measuring device 20 and specific effects to be achieved will be described in the description of the following embodiments.
  • the physical quantity measuring device 20 is used by being inserted into the inside of the main passage 22 through a mounting hole provided in the passage wall of the main passage 22.
  • the physical quantity measuring device 20 includes a housing 201 and a cover 202 attached to the housing 201.
  • the housing 201 is formed by injection molding a synthetic resin material.
  • the cover 202 is a plate-shaped member made of a conductive material such as an aluminum alloy, or a plate-shaped member made of a conductive resin material or an insulating resin material.
  • the housing 201 is formed from a flange 201f fixed to the intake body, which is the main passage 22, a connector 201c protruding from the flange 201f and exposed to the outside from the intake body in order to make an electrical connection with an external device, and a flange 201f. It has a measuring unit 201 m extending so as to project toward the center of the main passage 22.
  • the flange 201f has, for example, a substantially rectangular shape in a plan view having a predetermined plate thickness, and has through holes at the corners.
  • the flange 201f is fixed to the main passage 22 by, for example, inserting a fixing screw into the through hole at the corner and screwing it into the screw hole of the main passage 22.
  • the connector 201c is provided with, for example, four external terminals and a correction terminal inside the connector 201c.
  • the external terminals are terminals for outputting physical quantities such as flow rate and temperature, which are measurement results of the physical quantity measuring device 20, and power supply terminals for supplying DC power for operating the physical quantity measuring device 20.
  • the correction terminal is a terminal used to measure the manufactured physical quantity measuring device 20, obtain a correction value for each physical quantity measuring device 20, and store the correction value in the memory inside the physical quantity measuring device 20. ..
  • the measuring unit 201m has a thin and long shape extending from the flange 201f toward the center of the main passage 22, and has a wide front surface 221 and a back surface, and a pair of narrow side surfaces, an upstream end surface 223 and a downstream end surface 224. Have.
  • the measuring unit 201m is inserted into the inside through, for example, a mounting hole provided in the main passage 22, and the flange 201f is brought into contact with the main passage 22 and fixed to the main passage 22 with a screw, whereby the main passage 201f is inserted through the flange 201f. It is fixed to the passage 22.
  • the housing 201 includes a sub-passage groove 250.
  • the sub-passage groove 250 forms a sub-passage 234 that takes in a part of the fluid flowing through the intake pipe, which is the main passage, in cooperation with the cover 202.
  • the sub-passage 234 is provided so as to extend along the longitudinal direction of the measuring unit 201m, which is the protruding direction of the measuring unit 201m.
  • the sub-passage groove 250 forming the sub-passage 234 has a first sub-passage groove 251 and a second sub-passage groove 252 that branches in the middle of the first sub-passage groove 251.
  • the first sub-passage 234a communicates with the first outlet 232
  • the second sub-passage 234b communicates with the second outlet 233.
  • the flow rate sensor 205 is provided so that one surface side of the thin film portion 205d, which is a measuring unit, is exposed to the fluid flowing through the second sub-passage 234b.
  • the shape of the sub-passage in this embodiment is not limited to this shape.
  • the second outlet 233 is omitted, the downstream portion 239 of the second sub-passage 234b is connected to the downstream side of the branch portion 236 of the first sub-passage 234a, and the second sub-passage 234b is connected to the second sub-passage 234b. 1 It may be merged with the sub-passage 234a.
  • the circuit board 207 is housed in a circuit chamber 235 provided on one side of the measuring unit 201 m in the lateral direction.
  • the circuit board 207 has a rectangular shape extending along the longitudinal direction of the measuring unit 201 m, and has a sensor package 208 having a flow rate sensor 205, a pressure sensor 204, and a temperature / humidity sensor 206 on its surface. And the intake air temperature sensor 203 are mounted.
  • the required sensor By mounting the required sensor on the circuit board 207, it can be commonly used for various sensor mounting patterns with the same structure.
  • the sensor package 208 is mounted on the circuit board 207, and the flow rate sensor 205 is provided at the tip thereof.
  • the tip of the sensor package 208 is mounted at the center position in the longitudinal direction of the circuit board 207 in a state of protruding from the circuit board 207 into the second sub-passage 234b.
  • the flow rate sensor 205 provided at the tip of the sensor package 208 is arranged in the second sub-passage 234b.
  • the sensor package 208 is arranged between the sub-passage 234 and the circuit chamber 235.
  • the mounting structure of the sensor package 208 is not limited to this structure, and may be mounted directly on the housing 201. Further, if the circuit board 207 is not an indispensable structure and it is not necessary to measure the pressure and humidity, only the sensor package 208 may be mounted on the housing 201.
  • the sensor package 208 has at least a flow rate sensor 205, a lead frame 208f, and a sealing portion 208r. Further, the sensor package 208 may have, for example, any one or more of the electronic component 208e, the adhesive member 208d, and the passage forming member 208p.
  • the flow rate sensor 205 is a semiconductor element mounted on the lead frame 208f.
  • the flow rate sensor 205 is driven by, for example, an electronic component 208e such as an LSI in which a control circuit is formed.
  • an electronic component 208e such as an LSI in which a control circuit is formed.
  • a control circuit may be integrally formed with the flow rate sensor 205.
  • the flow rate sensor 205 is arranged on one surface of the lead frame 208f. More specifically, the flow rate sensor 205 is adhered to the lead frame 208f via the adhesive member 208d.
  • the flow sensor 205 includes a semiconductor substrate 205s made of a semiconductor such as silicon (Si), a laminated portion formed by laminating an insulating film or a wiring film on the semiconductor substrate 205s, and a cavity formed in the semiconductor substrate 205s.
  • a portion 205c and a thin film portion 205d (thin-walled portion, membrane, diaphragm) which is a region provided so as to cover the cavity portion in the laminated portion are provided.
  • the thin film portion 205d is formed with a heat generating portion and a temperature sensitive portion provided upstream and downstream of the heat generating portion, and the flow rate is measured by reading the temperature change due to the flow of the fluid.
  • the temperature sensitive part include a temperature sensitive resistor, a thermocouple, a thermopile, and the like.
  • the wiring film include polysilicon, single crystal silicon, molybdenum, platinum and the like.
  • the thin film portion 205d has shown an example of being a laminated portion, it may be composed of the semiconductor substrate 205s. That is, the thin film unit 205d is a measuring unit for measuring the physical quantity of the medium to be measured. In the case of a thermal sensor, it is necessary to increase the thermal insulation property in order to form a temperature distribution, and the thickness of the thin film portion 205d becomes very thin, so that the problem to be solved by the present invention appears remarkably. ..
  • the thin film portion 205d is provided by forming a concave cavity portion 205c provided by removing a part of the back surface side of the semiconductor substrate 205s by wet etching or dry etching treatment.
  • the bottom of the recess is formed by a part of the laminated portion.
  • the planar shape of the thin film portion 205d and the cavity portion 205c is a rectangle such as a square or a rectangle.
  • the hollow portion 205c is a recess of the semiconductor element opened on one surface of the semiconductor element facing the lead frame 208f, and a thin film portion 205d is provided at the bottom thereof.
  • the side wall of the cavity 205c is inclined with respect to the thickness direction of the semiconductor substrate 205s (in other words, the direction perpendicular to the surface on which the laminated portion of the semiconductor elements is formed).
  • the side wall of the hollow portion 205c is inclined so as to move away from the outer edge of the thin film portion 205d toward the outside as the thin film portion 205d approaches the lead frame 208f.
  • the opening area of the hollow portion 205c that opens to the back surface of the semiconductor substrate 205s is larger than the area of the thin film portion 205d.
  • the side wall of the hollow portion 205c may be parallel to the thickness direction of the thin film portion 205d. In other words, the cavity does not have to have an inclined portion as shown in the drawing. In this case, the opening area of the hollow portion 205c is equal to the area of the thin film portion 205d.
  • the lead frame 208f is a flat metal member having conductivity such as copper, and has a pattern shape including a portion protruding from the sealing portion 208r and serving as a terminal portion of the sensor package 208. At least the flow sensor 205 is mounted on one surface of the lead frame 208f. On one surface of the lead frame 208f, an electronic component 208e, a chip thermistor (not shown), or a capacitor as a protective element may be mounted. A film-like covering member 208c may be adhered to the other surface (back surface) of the lead frame 208f to cover the holes 211. Since it is possible to prevent the pollutants flowing through the sub-passage from flying into the cavity and accumulating the pollutants on the back surface of the cavity or the thin film portion, there is an advantage that the stain resistance is improved.
  • the lead frame 208f and the flow rate sensor 205 and the electronic component 208e are connected, and the flow rate sensor 205 and the electronic component 208e are connected by, for example, a bonding wire.
  • the electronic component 208e may be arranged outside the sensor package 208, such as by mounting it on the circuit board 207.
  • the lead frame 208f has a hole having at least an opening region in a region facing the thin film portion 205d in a direction perpendicular to the surface of the sensor element 205 (thickness direction of the semiconductor element 205). 211 is formed.
  • the hole 211 having an opening region in the projection region of the thin film portion 205d when the semiconductor element 205 is projected onto the lead frame 208f from a direction perpendicular to the mounting surface of the lead frame 208f on which the sensor element 205 is mounted is provided.
  • the hole 211 is formed so as to communicate with one surface of the lead frame 208f and the other surface.
  • the opening area of the ventilation hole 211 is equal to or larger than the area of the thin film portion 205d.
  • the lead frame 208f and the sensor element 205 have a difference in the amount of deformation due to a temperature change due to a difference in the coefficient of linear expansion.
  • the plate-shaped lead frame 208f has higher rigidity than the sensor element 205 having the thin film portion 205d, and the sensor element 205 follows the deformation of the lead frame 208f, and the deformation of the thin film portion 205d deteriorates the measurement accuracy. I had done it.
  • holes 211 are formed in the sensor element mounting region directly under the sensor element 205, which is a region having a large influence on the distortion of the thin film portion 205d, and the opening area of the holes 211 is set to be equal to or larger than the area of the thin film portion 205d and in the vicinity of the thin film portion 205d.
  • the rigidity of the lead frame 208f was reduced. As a result, it becomes difficult for the sensor element 205 to follow the deformation of the lead frame 208f, and the amount of deformation of the thin film portion 205d can be reduced.
  • the strain of the thin film portion 205d can be made closer to half or more of the conventional ventilation hole when the intermediate member is provided. It is possible to improve the detection accuracy even when no intermediate member is provided, and it is possible to achieve both a thin sensor package and an improved performance.
  • the opening shape of the hole 211 corresponds to the shape of the thin film portion 205d. That is, if the shape of the thin film portion 205d is rectangular, the opening shape of the hole 211 is also the same shape or a rectangle having a similar relationship, and if the shape of the thin film portion 205d is square, the opening shape of the hole 211 is also the same shape or similar. If the shape of the thin film portion 205d is circular, the opening shape of the hole 211 is also a circular shape having the same shape or a similar relationship.
  • the opening shape of the hole 211 correspond to the shape of the thin film portion 205d, it is possible to bring the deformation of the lead frame 208f in the mounting region where the sensor element 205 is mounted close to the deformation of the sensor element 205. As a result, it is possible to reduce the stress generated at the corners of the thin film portion 205d, it is possible to suppress the deformation of the thin film portion to the same extent as when the intermediate member is provided, and the detection accuracy is further improved. It becomes possible.
  • the opening area of the hole 211 is twice or more that of the thin film portion, it is possible to suppress the deformation of the thin film portion 205d more than the case where the intermediate member is provided, and the detection accuracy can be further improved. It will be possible.
  • the thin film portion 205d is provided inside the opening of the hole 211 in a plan view of the sensor package 208 viewed from a direction perpendicular to the surface of the thin film portion 205d. Since the lead frame 208f does not exist in the portion facing the thin film portion 205d in the thickness direction, the influence of the thermal stress from the lead frame 208f can be further reduced, so that the deformation of the thin film portion 205d can be further suppressed. Become.
  • the sealing portion 208r seals a part of the flow rate sensor 205 and the lead frame 208f in a state where the thin film portion 205d provided in the flow rate sensor 205, which is a sensor element, is exposed.
  • the sealing portion 208r is, for example, a resin portion formed by transfer molding. It is desirable that an adhesive member is formed on the entire circumference of the back surface of the sensor element 205 so that the sealing resin does not flow into the cavity 205c during transfer mold molding. In that case, since the entire circumference of the back surface is adhered, there arises a problem that the sensor element 205 is strongly affected by the thermal deformation of the lead frame 208f, but the above-mentioned structure can solve the problem. It will be possible.
  • the sealing portion 208r forms a concave groove in which the flow rate sensor 205 is arranged at the bottom thereof.
  • This concave groove has a throttle shape in which the width gradually narrows from both ends in the flow direction of the gas to be measured 2 flowing in the upstream portion of the second sub-passage 234b toward the central portion, and the flow rate is reached in the narrowest central portion.
  • the sensor 205 is arranged.
  • This throttle shape is more preferable because the gas to be measured 2 flowing through the sub-passage 234 is rectified and the influence of noise on the flow rate sensor 205 can be reduced.
  • the sealing portion 208r is not limited to this shape.
  • the sensor package 208 of the present embodiment includes a semiconductor substrate 205s in which the cavity 205c is formed, a thin film 205d provided so as to cover the cavity 205c, a semiconductor element 205, and a lead frame 208f on which the semiconductor element 205 is mounted.
  • the semiconductor element 205 and the sealing portion 208r for sealing the lead frame 208f are provided so that the thin film portion 205d of the semiconductor element 205 is exposed, and the lead frame 208f has a hole 211 formed at a position facing the thin film portion 205d.
  • the opening area of the hole 211 is equal to or larger than the area of the thin film portion.
  • the present embodiment by reducing the rigidity (improving the flexibility) of the lead frame 208f in the vicinity of the thin film portion 205d, it is possible to suppress the sensor element 205 from following the thermal deformation of the lead frame 208f. Therefore, the thermal stress received from the lead frame 208f is reduced, and the deformation (deflection) of the thin film portion 205d can be suppressed.
  • the intermediate member it is possible to eliminate the intermediate member, so that it is possible to achieve both a thin sensor package 208 and an improvement in the detection accuracy of the flow rate sensor 205 which is a sensor element.
  • the intermediate member it is possible to increase the depth of the concave groove of the sealing portion 208r without increasing the thickness of the sensor package 208, and the resin constituting the sensor package 208 on the measuring unit side. It is possible to form a throttle with a part of the flow path of. Therefore, according to this embodiment, it is possible to reduce the tolerance variation of the passage near the measuring unit, and it is also possible to improve the measurement accuracy of the physical quantity measuring device 20 provided with the sensor package 208.
  • the authors may provide a slit larger than the thin film portion outside the mounting area of the flow sensor 205, or provide a plurality of through holes around the flow sensor 205.
  • a structure for separating the part on which the flow rate sensor 205 is mounted from other parts and reducing the wall thickness in the area where the flow rate sensor 205 is arranged and its surroundings is examined as compared with other parts has been investigated. It was not possible to obtain such a sufficient effect.
  • Embodiment 2 of the present invention will be described with reference to FIGS. 8 to 11.
  • holes 215 provided outside the sensor element 205 mounting region and a surface (back surface) opposite to the sensor element 205 mounting surface are formed. It is provided with a groove 213.
  • the groove 213 is connected to the hole 211 on one end side and to the hole 215 on the other end side.
  • a passage forming member 208p which is a film-like member, is adhered to the back surface side of the lead frame 208f so as to cover the groove 213, the hole 211, and the hole 215.
  • the sensor package 208 is provided with a communication passage 213 for communicating the cavity with the outside of the sensor package.
  • the passage forming member 208p is, for example, an adhesive tape in which an adhesive layer is provided on the surface of a resin base material.
  • a resin base material for example, film-shaped polyimide can be used.
  • the adhesive layer for example, an acrylic-based or silicone-based adhesive can be used. That is, the passage forming member 208p is, for example, a polyimide tape.
  • the passage forming member 208p and the lead frame 208f form a communication passage 213 that communicates the ventilation hole 211 and the outside of the sensor package 208. More specifically, for example, the lead frame 208f is provided with a concave groove, and the opening of the concave groove is closed by the passage forming member 208p to form the communication passage 213. Further, in the example shown in FIG. 5, a plurality of communication passages 213, specifically, two communication passages 213 are provided at one end of the lead frame 208f and at the other end. It is provided between the through hole 215 and connects the ventilation hole 211 and the through hole 215.
  • the adhesive member 208d is arranged between the flow rate sensor 205, which is a sensor element, and the lead frame 208f. More specifically, the adhesive member 208d is, for example, a die attach film, a die bonding film, or a liquid die bond material.
  • the adhesive member 208d includes a through hole 214 that communicates the hollow portion 205c of the flow sensor 205 with the ventilation hole 211 of the lead frame 208f.
  • the physical quantity measuring device 20 of the present embodiment is a film-shaped passage forming member that is attached to a surface opposite to one surface of the lead frame 208f on which the flow rate sensor 205, which is a sensor element, is mounted and covers the ventilation holes 211. It has 208p.
  • the passage forming member 208p and the lead frame 208f form a communication passage 213 that communicates the ventilation hole 211 provided in the lead frame 208f with the outside of the sensor package 208.
  • the cavity 205c of the flow sensor 205 and the outside of the sensor package 208 are connected via the ventilation hole 211 communicating with the cavity 205c of the flow sensor 205 and the communication passage 213 communicating with the ventilation hole 211. can do.
  • the ventilation holes 211 not only reduce the stress acting on the thin film portion 205d of the flow rate sensor 205, but also prevent the cavity portion 205c from being sealed, so that the detection accuracy of the flow rate sensor 205 can be further improved.
  • the opening area of the ventilation hole 211 of the lead frame 208f is larger than the area of the thin film portion 205d of the flow rate sensor 205. Then, in the plan view of the sensor package 208, the thin film portion 205d is provided inside the opening of the ventilation hole 211.
  • the ventilation hole 211 of the lead frame 208f is provided inside the opening end portion 205f of the flow rate sensor 205, but the present invention is not limited to this.
  • FIG. 11b it is a diagram showing a configuration in which the ventilation hole 211 of the lead frame 208f is the same as the opening end portion 205f of the flow rate sensor 205.
  • the area of the ventilation holes 211 can be expanded, so that there is no limitation on the formability, and the reliability of the detection accuracy of the flow rate sensor 205 can be further improved.
  • the physical quantity measuring device of the present embodiment is different from the physical quantity measuring device 20 according to the first embodiment in that the sensor package 208 includes the covering member 208c. Since the other points of the physical quantity measuring device of the present embodiment are the same as those of the physical quantity measuring device 20 according to the above-described first or second embodiment, the same reference numerals are given to the same parts and the description thereof will be omitted.
  • the covering member 208c is a film-like member that is attached to the lead frame 208f and covers a part of the ventilation holes 211. More specifically, the covering member 208c is, for example, an adhesive tape in which an adhesive layer is provided on the surface of a resin base material. As the base material, for example, film-shaped polyimide can be used. Further, as the adhesive layer, for example, an acrylic-based or silicone-based adhesive can be used. That is, the covering member 208c is, for example, a polyimide tape.
  • the covering member 208c is provided with a through hole 212 for communicating the hollow portion 205c of the flow rate sensor 205, which is a sensor element, and the ventilation hole 211 of the lead frame 208f.
  • the covering member 208c is, for example, in the lead frame 208f shown in FIG. 5, a region from the end where the flow sensor 205 is arranged to the through hole 215 provided on the side opposite to the end and the electronic component 208e. Can be covered.
  • the electronic component 208e is arranged on the covering member 208c as shown in FIG.
  • the covering member 208c may be arranged only between the flow rate sensor 205 and the lead frame 208f.
  • the flow rate sensor 205 is arranged on, for example, the covering member 208c. More specifically, the covering member 208c is attached to a surface opposite to one surface of the passage forming member 208p to which the passage forming member 208p is attached, and the flow rate sensor 205 is attached to, for example, a film-shaped adhesive member 208d. It is adhered to the covering member 208c via. When the covering member 208c has adhesive layers on both sides, for example, the adhesive member 208d between the flow rate sensor 205 and the covering member 208c or between the electronic component 208e and the covering member 208c can be omitted. ..
  • the communication passage 213 may be formed by the covering member 208c and the lead frame 208f. .. Specifically, for example, the communication passage 213 may be formed by closing the opening of the concave groove formed on one surface of the lead frame 208f on which the lead frame 208f is mounted by the covering member 208c.
  • the adhesive member 208d is arranged on the covering member 208c, is arranged between the flow rate sensor 205 which is a sensor element and the covering member 208c, and adheres the flow rate sensor 205 and the covering member 208c.
  • the adhesive member 208d is provided with a through hole 214 for communicating the cavity 205c of the flow sensor 205 and the ventilation hole 211 of the lead frame 208f.
  • the opening edge of the through hole 214 of the adhesive member 208d arranged on the covering member 208c is provided outside the opening edge of the through hole 212 of the covering member 208c. That is, the through hole 212 of the covering member 208c is provided inside the opening of the through hole 214 of the adhesive member 208d.
  • the opening area of the ventilation hole 211 of the lead frame 208f is equal to or larger than the area of the thin film portion 205d of the flow sensor 205. Therefore, according to the physical quantity measuring device of the present embodiment, similarly to the physical quantity measuring device 20 of the first embodiment described above, the sensor package 208 can be made thinner and the detection accuracy of the flow sensor 205, which is a sensor element, can be improved at the same time. Can be done.
  • the physical quantity measuring device of the present embodiment includes a film-shaped covering member 208c that is attached to the lead frame 208f and covers a part of the ventilation holes 211.
  • the flow rate sensor 205 which is a sensor element, is arranged on the covering member 208c.
  • the ventilation hole 211 of the lead frame 208f is set to be equal to or larger than the area of the thin film portion 205d of the flow rate sensor 205, the ventilation hole 211 is formed from the outer edge of the flow rate sensor 205 in the direction along the surface of the lead frame 208f. The distance to the opening edge may be shorter.
  • the sealing portion 208r when the sealing portion 208r is formed by the transfer mold, there is a high risk that the material of the sealing portion 208r flows into the ventilation hole 211 from between the flow rate sensor 205 and the lead frame 208f.
  • the physical quantity measuring device since the physical quantity measuring device includes the film-shaped covering member 208c that covers a part of the ventilation hole 211, the risk that the material of the sealing portion 208r flows into the ventilation hole 211 is reduced, and the ventilation hole 211 is prevented from being blocked. It is possible to improve the yield of the sensor package 208.
  • the physical quantity measuring device of the present embodiment includes a film-shaped adhesive member 208d between the flow rate sensor 205, which is a sensor element, and the covering member 208c.
  • the covering member 208c and the adhesive member 208d are provided with through holes 212 and 214 for communicating the hollow portion 205c of the flow rate sensor 205, which is a sensor element, and the ventilation hole 211 of the lead frame 208f, respectively.
  • the through hole 212 of the covering member 208c is provided inside the opening of the through hole 214 of the adhesive member 208d.
  • the opening edge of the through hole 214 of the plasticized adhesive member 208d is the through hole of the covering member 208c. It will be located outside the opening of 212.
  • the opening edge of the through hole 214 of the adhesive member 208d is supported by the covering member 208c and is prevented from hanging inside the through hole 212 of the covering member 208c. Therefore, the ventilation holes 211, the through holes 212, the communication passage 213, and the like are prevented from being blocked by the adhesive member 208d, and the yield in the manufacturing process of the sensor package 208 can be improved.
  • FIG. 11 is a perspective plan view of the sensor package 208 showing a modification of the physical quantity measuring device according to the present embodiment.
  • FIG. 12 is a cross-sectional view of the sensor package 208 along the line XII-XII shown in FIG.
  • the sensor package 208 has a plurality of connecting portions 216 for connecting the plurality of communication passages 213. More specifically, the sensor package 208 has two communication passages 213 between the ventilation holes 211 and the through holes 215 of the lead frame 208f.
  • a plurality of connecting portions 216 are provided in the area where the electronic component 208e is mounted.
  • the plurality of connecting portions 216 are provided at intervals in the length direction of the communication passage 213 from the ventilation hole 211 of the lead frame 208f to the through hole 215.
  • Each connecting portion 216 connects two communication passages 213 extending in parallel. Even with such a configuration, the same effect as that of the physical quantity measuring device of the present embodiment can be obtained.

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Volume Flow (AREA)

Abstract

L'invention concerne un dispositif de mesure de quantité physique qui permet à la fois d'affiner un boîtier de capteur et d'améliorer la précision de détection d'un élément de capteur. Le présent dispositif de mesure de quantité physique comprend un boîtier de capteur 208. Le boîtier de capteur 208 comprend une grille de connexion 208f, un capteur de débit 205 qui est un élément de capteur monté dans la grille de connexion 208f, et une partie d'étanchéité 208r qui scelle des parties de l'élément de capteur et de la grille de connexion 208f de telle sorte qu'une partie de film mince 205d prévue dans l'élément de capteur est exposée. La grille de connexion 208f a un trou de ventilation 211 qui est en communication avec une partie creuse 205c de l'élément de capteur qui fait face à la partie de film mince 205d. La zone d'ouverture du trou de ventilation 211 est supérieure ou égale à la zone de la partie de film mince 205d.
PCT/JP2020/002247 2019-03-29 2020-01-23 Dispositif de mesure de quantité physique WO2020202721A1 (fr)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011122984A (ja) * 2009-12-11 2011-06-23 Hitachi Automotive Systems Ltd 流量センサとその製造方法、及び流量センサモジュール
WO2015033589A1 (fr) * 2013-09-05 2015-03-12 日立オートモティブシステムズ株式会社 Capteur de débit et dispositif de capteur de débit

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0797647B2 (ja) * 1989-02-21 1995-10-18 三菱電機株式会社 半導体圧力センサの製造方法
JP5763590B2 (ja) 2012-06-15 2015-08-12 日立オートモティブシステムズ株式会社 熱式流量計
JP5819784B2 (ja) 2012-06-15 2015-11-24 日立オートモティブシステムズ株式会社 熱式流量計
JP2014001983A (ja) 2012-06-15 2014-01-09 Hitachi Automotive Systems Ltd 熱式流量計

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011122984A (ja) * 2009-12-11 2011-06-23 Hitachi Automotive Systems Ltd 流量センサとその製造方法、及び流量センサモジュール
WO2015033589A1 (fr) * 2013-09-05 2015-03-12 日立オートモティブシステムズ株式会社 Capteur de débit et dispositif de capteur de débit

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