WO2020202006A1 - Composites piézoélectriques sans plomb et leurs procédés de fabrication - Google Patents

Composites piézoélectriques sans plomb et leurs procédés de fabrication Download PDF

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Publication number
WO2020202006A1
WO2020202006A1 PCT/IB2020/053052 IB2020053052W WO2020202006A1 WO 2020202006 A1 WO2020202006 A1 WO 2020202006A1 IB 2020053052 W IB2020053052 W IB 2020053052W WO 2020202006 A1 WO2020202006 A1 WO 2020202006A1
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Prior art keywords
lead
piezoelectric
particles
free piezoelectric
polymeric
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PCT/IB2020/053052
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English (en)
Inventor
Soma Guhathakurta
Jesus Alfonso Caraveo FRESCAS
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Sabic Global Technologies B.V.
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Application filed by Sabic Global Technologies B.V. filed Critical Sabic Global Technologies B.V.
Priority to EP20720862.0A priority Critical patent/EP3948964A1/fr
Priority to CN202080026966.6A priority patent/CN113646911A/zh
Priority to US17/593,968 priority patent/US20220181543A1/en
Publication of WO2020202006A1 publication Critical patent/WO2020202006A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/205—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase
    • C08J3/21—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase the polymer being premixed with a liquid phase
    • C08J3/212—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase the polymer being premixed with a liquid phase and solid additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
    • H10N30/045—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/092—Forming composite materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08J2327/16—Homopolymers or copolymers of vinylidene fluoride
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Definitions

  • the invention generally concerns methods of making lead-free piezoelectric composites that include lead-free piezoelectric particles having an average particle size of 200 nm to 1000 nm dispersed or suspended in a polymeric matrix.
  • the method includes use of a solvent having i) a boiling point > 80 °C at 0.1 MPa and ii) a solubility in water of > 0.10 g/g and/or a dielectric constant > 20 to form a dispersion or suspension of the lead-free particles with polymeric material partially or fully solubilized in the solvent, forming a polymeric matrix from the suspension, and then subjecting the polymeric matrix to an electric polarization treatment.
  • Piezoelectric materials can be polymeric, ceramic, or single crystalline in nature. Ceramics can have relatively high dielectric constants as compared to polymers and good electromechanical coupling coefficients. Ceramics suffer from high acoustic impedance, which results in poor acoustic matching with media such as water and human tissue— the media through which it is typically transmitting or receiving a signal. In addition, ceramics can exhibit high stiffness and brittleness and cannot be formed onto curved surfaces, which contributes to limited design flexibility in a given transducer. Further, the electromechanical resonances of piezoelectric ceramics give rise to a high degree of noise, which is an unwanted artifact in the context of transducer engineering.
  • Single crystal piezoelectric material can include crystals of quartz tourmaline and potassium-sodium tartrate.
  • Other single crystals can include lead metaniobate (Pb >206) or relaxor systems such as Pb(Sci/2Nbi/2)03-PbTi03, Pb(Im/2Nbi/2)0 3 -PbTi0 3 and Pb(Ybi/2Nbi/2)0 3 -PbTi0 3 , (l-2x) BiSc0 3- x PbTi0 3.
  • any one single piezoelectric material phase does not provide all of the desired features for an application, and the performance is thereby limited by the trade-off between high piezoelectric activity and low density with mechanical flexibility.
  • Thin, flexible, high performing piezoelectric materials are of high demand in sensors, actuators, and energy harvesters for emerging healthcare and biomedical applications as well as for wearable electronics.
  • the progress in flexible piezoelectric devices is limited due to the fact that inorganic piezoelectric ceramics are heavy and brittle.
  • piezoelectric polymers for example PVDF and PVDF-TrFE copolymer, offer several advantages, which include mechanical flexibility, light weight, low temperature and ease of processing. Despite such advantages over ceramic materials, these materials suffer due to their lower piezoelectric response (d33 -13 -28 pC/N) compared to the ceramics (d 33 of PZT ranges from 270-400 pC/N) and the requirement of higher driving voltage which poses additional safety and cost concerns.
  • piezoelectric composites are attractive alternatives as they can combine the advantages of both the materials, high piezoelectric response, and high dielectric constant of ceramics with the mechanical flexibility of the polymers.
  • the inherent flexibility or deformability of the piezoelectric materials is also an important parameter for the device performance, flexibility prevents fatigue and improve the lifetime of the device.
  • Addition of piezoceramic fillers in vinylidene fluoride based polymers (homo-, co-, and ter-polymers) to form (0-3) composites have shown good piezoelectric constant (d 33 -40-60 pC/N).
  • these piezocomposites of the prior art are mostly lead-based and also mechanically brittle. As lead is highly toxic, environmental problems and biocompatible integration issues are inevitable.
  • the discovery is premised on making a flexible piezoelectric material by using a solvent having i) a boiling point > 80 °C at 0.1 MPa and ii) a solubility in water of > 0.10 g/g and/or a dielectric constant > 20 to form a dispersion or suspension of lead-free piezoelectric particles with a polymer partially or fully solubilized in the solvent. Removal of the solvent forms a polymeric material having the lead-free piezoelectric particles dispersed therein.
  • the polymeric material can be subjected to electric polarization treatment to form the piezoelectric polymeric material of the present invention.
  • Using the higher boiling solvents during processing provides the advantages of 1) ability to form a flexible piezoelectric material having excellent piezoelectric property with mechanical flexibility, 2) thin film forming ability, both free-standing and supported film on the substrate, 3) simple process of making the piezocomposites, and/or 4) low temperature processability.
  • a method can include a first step (a) of adding lead-free piezoelectric particles having an average particle size of 200 nm to 1000 nm in a solution that includes a polymeric material and a solvent having i) a boiling point > 80 °C at 0.1 MPa and ii) a solubility in water of > 0.10 g/g, preferably 0.15 g/g, more preferably 0.25 g/g and/or a dielectric constant of > 20, preferably > 30, more preferably > 55, to form a dispersion or suspension.
  • the polymeric material can be partially or fully solubilized in the solvent and can include a thermoset polymer, thermoplastic polymer, or blends thereof, preferably a thermoplastic polymer.
  • a thermoplastic polymer include polyvinylidene fluoride (PVDF), a PVDF -based polymer, a PVDF copolymer, a PVDF terpolymer, or blends thereof.
  • PVDF terpolymer can be poly(vinylidene fluoride- trifluoroethylene-chlorofluoroethylene) (PVDF-TRFE-CFE).
  • PVDF type polymers can exhibit electromechanical or ferroelectric properties.
  • the polymeric material can be solubilized in the solvent at a temperature of 15 to 100 °C to produce a solution that include 5 to 20 wt./vol% of polymer, preferably 10 wt./vol.% to 12 wt./vol.% of polymer.
  • the lead-free piezoelectric particles include barium titanate, particles of hydroxyapatite, particles of apatite, particles of lithium sulfate monohydrate, particles of sodium potassium niobate, particles of quartz, and combinations thereof.
  • the lead-free piezoelectric particles are barium titanate particles.
  • Non-limiting examples of solvent include methyl ethyl ketone (MEK), dimethylsulfoxide (DMSO), N-methyl-2-pyrrolidone (NMP), or combinations thereof, preferably DMSO.
  • MEK methyl ethyl ketone
  • DMSO dimethylsulfoxide
  • NMP N-methyl-2-pyrrolidone
  • a volume percentage of lead-free piezoelectric particles in the composite can be from 15 to 65 vol.%, preferably 20 to 60 vol.%.
  • the lead-free piezoelectric particles can have a particle size of 250 to 350 nm, preferably 300 nm.
  • a second step (b) can include forming a polymeric matrix having the lead-free piezoelectric particles dispersed therein.
  • Forming can include (i) casting the dispersion on a substrate to form the polymeric matrix, (ii) drying the polymeric matrix at 25 to 45 °C, and (iii) annealing the dried polymeric matrix at a temperature of 80 to 150 °C for 1 to 50 hours, preferably 110 °C for 5 to 25 hours.
  • a third step (c) can include subjecting the polymeric matrix having the lead-free piezoelectric particles dispersed therein to an electric polarization treatment.
  • Electric polarization can include applying a poling field using corona discharge. For a piezocomposite film, corona poling can be subjected to a top surface (which was exposed to air during drying of the film) and/or a bottom surface (which was in contact with substrate during drying of the film) of the film.
  • a lead-free piezoelectric composite precursor can include a polyvinylidene fluoride (PVDF) based polymer matrix, lead-free piezoelectric particles having an average particle size of 200 to 1000 nm dispersed in the polymeric matrix, and a solvent having i) a boiling point > 80 °C at 0.1 MPa and ii) a solubility in water of > 0.1 g/g and/or a dielectric constant of > 20.
  • PVDF polyvinylidene fluoride
  • a lead-free piezoelectric composite can include a polyvinylidene fluoride (PVDF) based polymer matrix and lead-free piezoelectric particles having an average particle size of 200 to 1000 nm dispersed in the polymeric matrix.
  • the piezoelectric composite can have a piezoelectric strain constant (d33) of at least 40 pC/N and an elongation break of 100 to 500%, and a storage modulus of 100 to 325 MPa as measured using ISO Method 6721.
  • the piezoelectric composite can have a piezoelectric strain constant (d33) of at least 40 pC/N and an elongation break of 100 to 500%, and a storage modulus of 100 to 325 MPa as measured using ISO Method 6721.
  • Elongation break can be measured using a dynamic mechanical analyzer such as a RDA III analyser (TA Instruments, U.S.A.) under unixal loading at ambient temperature.
  • the PVDF terpolymer can be a poly(vinylidene fluoride-trifluoroethylene-chlorofluoroethylene) (PVDF-TRFE- CFE).
  • the lead-free piezoelectric particles can be barium titanate particles having an average particle size of 250 to 350 nm.
  • the composite can be a film or sheet and can have a dimension of 50 to 200 microns in thickness. Such a piezoelectric polymeric composite can be formed in the absence of compatibility improvers and/or is made by the method of the present invention.
  • the lead-free piezoelectric polymeric composite can include, consists of, or consists essentially of poly(vinylidene fluoride-trifluoroethylene- chlorofluoroethylene) (PVDF-TRFE-CFE) and barium titanate particles having an average particle size of 250 to 350 nm.
  • PVDF-TRFE-CFE poly(vinylidene fluoride-trifluoroethylene- chlorofluoroethylene)
  • barium titanate particles having an average particle size of 250 to 350 nm.
  • piezoelectric devices that include the lead-free piezoelectric polymeric composites of the present invention are described.
  • Such devices can be a piezoelectric sensor, a piezoelectric transducer, or a piezoelectric actuator.
  • the device is preferably mechanically flexible.
  • compatibility improvers refers to a compound that improves the dispersability or incorporation of a solid into a polymer.
  • Non-limiting examples of compatibility improvers include surfactants such as non-ionic surfactants, cationic surfactants, and anionic surfactants.
  • the terms“about” or“approximately” are defined as being close to as understood by one of ordinary skill in the art. In one non-limiting embodiment, the terms are defined to be within 10%, preferably within 5%, more preferably within 1%, and most preferably within 0.5%.
  • wt.% refers to a weight percentage of a component, a volume percentage of a component, or molar percentage of a component, respectively, based on the total weight, the total volume of material, or total moles, that includes the component.
  • 10 grams of component in 100 grams of the material is 10 wt.% of component.
  • the piezoelectric composites of the present invention can“comprise,”“consist essentially of,” or “consist of’ particular ingredients, components, compositions, etc. disclosed throughout the specification.
  • a basic and novel characteristic of the piezoelectric composites of the present invention is that they can be lead-free, mechanically flexible, and/or have piezoelectric strain constant (d33) of at least 40 pC/N.
  • FIGs. 1A-D show scanning electron micrographs of top surface of piezoelectric polymer composite made using different solvents: a) MEK, b) THF, c) DMSO, d) NMP.
  • FIGs. 2A-D show surface profilometer plots within the sampling length (5 mm) for top surface of piezoelectric polymer composite made using different solvents: a) MEK, b) THF, c) DMSO, d) NMP.
  • FIG. 3 shows the effect of piezo ceramic filler loading on piezoelectric strain constant of a comparative lead-based piezoelectric polymer composite and a lead-free piezoelectric polymer composite of the present invention.
  • the bottom surface which was in contact with the substrate during drying was exposed to corona during poling.
  • FIG. 4 shows the effect of piezo ceramic filler loading on elongation at break of a comparable lead-based piezoelectric polymer composite and a lead-free piezoelectric polymer composite of the present invention.
  • FIG. 5 shows the effect of piezo ceramic filler loading on storage modulus of comparative lead-based piezoelectric polymer composite and a lead-free piezoelectric polymer composite of the present invention.
  • FIG. 6 is a photographic image of a corona poled lead-free piezocomposite film at 60 vol% BT loading (Example 3), in accordance with the aspects of present invention.
  • the discovery is premised on using a solvent during the preparation of the polymeric matrix.
  • the solvent can have i) a boiling point > 80 °C at 0.1 MPa and ii) a solubility in water of > 0.10 g/g and/or a dielectric constant > 20, which allows for partial or complete solubilization of the polymer. Solubilization of the polymer allows for better dispersion and/or suspension of the lead-free piezoelectric particles in the formed polymeric matrix upon removal of the solvent.
  • the piezoelectric additive can be any lead-free ceramic or single crystal material.
  • piezoelectric materials include inorganic compounds of the perovskite family.
  • Non-limiting examples of piezoelectric ceramics with the perovskite structure include barium titanate (BaTiCh), hydroxyapatite, apatite, lithium sulfate monohydrate, sodium potassium niobate, sodium bismuth titanate, quartz, organic materials (for example, tartaric acid, poly(vinylidene difluoride) fibers), or combinations thereof.
  • the piezoelectric additive is BaTiCh.
  • the lead-free piezoelectric particles can have a particle size of 200 nm to 1000 nm, or 250 nm to 350 nm, or at least, greater than any one of, equal to any one of, or between any two of 200 nm, 225 nm, 250 nm, 275 nm, 300 nm, 325 nm, 350 nm, 375 nm, 400 nm, 425 nm, 450 nm, 475 nm, 500 nm, 525 nm, 550 nm, 575 nm, 600 nm, 625 nm, 650 nm, 675 nm, 700 nm, 725 nm, 750 nm, 775 nm, 800 nm, 825 nm, 850 nm, 875 nm, 900 nm, 925 nm, 950 nm, 975 nm, and 1000 nm.
  • the piezoelectric composite can include a thermoset polymer, copolymer and/or monomer, a thermoplastic polymer, copolymer and/or monomer or a thermoset/thermoplastic polymer or copolymer blend.
  • Thermoset polymers are malleable prior to heating and capable of forming a mold.
  • the matrix can be made from a composition having a thermoplastic polymer and can also include other non-thermoplastic polymers, additives, and the like, that can be added to the composition.
  • Thermoset polymeric matrices are cured or become cross-linked and tend to lose the ability to become pliable or moldable at raised temperatures.
  • thermoset polymers used to make the polymer film include epoxy resins, epoxy vinylesters, alkyds, amino-based polymers (e.g ., polyurethanes, urea-formaldehyde), diallyl phthalate, phenolics polymers, polyesters, unsaturated polyester resins, dicyclopentadiene, polyimides, silicon polymers, cyanate esters of polycyanurates, thermosetting polyacrylic resins, bakelite, Duroplast, benzoxazines, or co-polymers thereof, or blends thereof.
  • epoxy resins epoxy vinylesters, alkyds, amino-based polymers (e.g ., polyurethanes, urea-formaldehyde), diallyl phthalate, phenolics polymers, polyesters, unsaturated polyester resins, dicyclopentadiene, polyimides, silicon polymers, cyanate esters of polycyanurates, thermosetting polyacrylic resins, bakelite, Duroplast, benzox
  • Thermoplastic polymeric matrices have the ability to become pliable or moldable above a specific temperature and solidify below the temperature.
  • the polymeric matrix of the composites can include thermoplastic or thermoset polymers, co-polymers thereof, and blends thereof that are discussed throughout the present application.
  • thermoplastic polymers include polyvinylidene fluoride (PVDF), PVDF-based polymer, PVDF copolymer, PVDF terpolymer, odd-numbered nylon, cyano-polymer, polyethylene terephthalate (PET), a polycarbonate (PC) family of polymers, polybutylene terephthalate (PBT), poly(l,4-cyclohexylidene cyclohexane-l,4-dicarboxylate) (PCCD), glycol modified polycyclohexyl terephthalate (PCTG), poly(phenylene oxide) (PPO), polypropylene (PP), polyethylene (PE), polyvinyl chloride (PVC), polystyrene (PS), polymethyl methacrylate (PMMA), polyethyleneimine or polyetherimide (PEI) and their derivatives, thermoplastic elastomer (TPE), terephthalic acid (TPA) elastomers, poly(cyclohexan
  • thermoplastic polymers known to those of skill in the art, and those hereinafter developed, can also be used in the context of the present invention.
  • the thermoplastic polymer can be included in a composition that includes said polymer and additives.
  • additives include coupling agents, antioxidants, heat stabilizers, flow modifiers, colorants, etc ., or any combinations thereof.
  • a polyvinylidene difluoride (PVDF) polymer, a copolymer thereof, or a terpolymer thereof is used.
  • the terpolymer can be poly(vinylidene fluoride-trifluoroethylene-chlorofluoroethylene) (PVDF-TRFE-CFE).
  • the solvents used in the production of the lead-free piezoelectric composite can be any solvent having i) a boiling point > 80 °C at 0.1 MPa and ii) a solubility in water of > 0.1 g/g and/or a dielectric constant > 20.
  • Non-limiting examples of solvents include methyl ethyl ketone (MEK), dimethyl sulfoxide (DMSO), N-methyl-2-pyrrolidone (NMP), or combinations thereof.
  • the solvent is DMSO.
  • the solubility of the solvent in water can be at least, equal to, or greater than 0.1 g/g, 0.15 g/g, 0.20 g/g, 0.25 g/g, 0.3 g/g, 0.35 g/g, 0.4 g/g, 0.45 g/g/, 0.5 g/g, 0.55 g/g, 0.6 g/g, 0.65 g/g, 0.7 g/g, 0.8 g/g, or 0.9 g/g.
  • the boiling point of the solvent at 0.1 MPa can be at least, equal to, or greater than 80 °C, 85 °C, 90 °C, 95 °C, 100 °C, 105 °C, 110 °C, 115 °C, 120 °C, 125 °C, 130 °C, 135 °C, 140 °C, 145 °C, 150 °C, 155 °C, 160 °C, 165 °C, 170 °C, 180 °C, 185 °C, 190 °C, 195 °C, 200 °C, and 210 °C.
  • a solvent can have a boiling point of 80 and be highly soluble in water (> 0.5 g/g).
  • the solvent can have a boiling point of > 150 °C and be moderately soluble in water (> 0.1 g/g).
  • the solvent has a boiling point > 80 °C at 0.1 MPa and a solubility in water of > 0.25 g/g, boiling point > 180 °C at 0.1 MPa and a solubility in water of > 0.25 g/g, or boiling point > 200 °C at 0.1 MPa and a solubility in water of > 0.25 g/g.
  • the solvent can have a boiling point of 80 and a high dielectric constant (> 50).
  • the solvent can have a boiling point of > 150 °C and a moderate dielectric constant (> 20).
  • the solvent has a boiling point > 80 °C at 0.1 MPa and a dielectric constant > 50, boiling point > 180 °C at 0.1 MPa and a dielectric constant > 50, or boiling point > 200 °C at 0.1 MPa and a dielectric constant > 50.
  • Solvents that do not meet the boiling point and solubility, and/or boiling point and dielectric constant criteria may produce piezoelectric composites with inferior d33 (pC/N) values.
  • Table 1 lists the properties of non-limiting solvents used in the present invention. Table 1
  • the piezoelectric composite can be made using solution casting or forming methodology.
  • a solution of a polymer described in the Materials section can be obtained.
  • the solution can include a solvent described in the Materials section and polymer described in the Materials section.
  • the solution can include at least, greater than any one of, equal to any one of, or between any two of 1.5 wt./vol%, 5 wt./vol%, 10 wt./vol%, 15 wt./vol%, and 20 wt./vol% of the polymer.
  • the solution includes and 10 wt.% to 12 wt.% PVDF or PVDF-TRFE-CFE or a blend thereof.
  • no compatibility improvers are used to make the lead-free polymeric composites of the present invention.
  • the piezoelectric additive can be dispersed or suspended in the polymer solution.
  • the piezoelectric additive can be a plurality ( e.g ., 2 or more, suitably 5 or more, 10 or more, 50 or more, 100 or more, 500 or more, 1000 or more, etc.) of lead-free piezoelectric particles.
  • the lead-free piezoelectric particles can be dispersed in the solution via any suitable method, including mixing, stirring, folding or otherwise integrating the lead-free piezoelectric particles in the matrix so as to generate a uniform dispersion or suspension of the particles in the matrix.
  • the solution is added to the piezoelectric additive.
  • the dispersion or suspension can be subjected to conditions suitable to form the piezoelectric composite of the present invention.
  • the following description references dispersion, but it also applies to a suspension.
  • the dispersion includes PVDF, PVDF-TRFE, or PVDF-TRFE-CFE or a blend thereof, and barium titanate.
  • the dispersion can be shaped or cast. Shaped or shaping, or casting can include a mechanical or physical processes to change to a desired form. Shaping can also include simply placing a dispersion into a desired container or receptacle, thereby providing it with a maintained shape or form.
  • the shaped form is not necessarily the final form, as additional processing (e.g., machining, forming, etc.) can be completed on the final, cured composite.
  • additional processing e.g., machining, forming, etc.
  • the act of shaping the dispersion for use in the methods described herein is primarily to give some initial structure to the dispersion prior to further processing. A rigid or specific shape is not required.
  • Casting can be pouring the dispersion on a casting surface.
  • Non-limiting examples of casting include air casting (e.g ., the dispersion passes under a series of air flow ducts that control the evaporation of the solvents in a particular set period of time such as 24 to 48 hours), solvent or emersion casting, (e.g., the dispersion is spread onto a moving belt and run through a bath or liquid in which the liquid within the bath exchanges with the solvent).
  • the spreading of the dispersion on the casting surface can be done with a doctor blade, rolling spreader bar or any of several configurations of flat sheeting extrusion dies.
  • the solvent can be removed thereby leaving the dispersion on the substrate or in the mold.
  • Heat can be applied to assist in the removal of the solvent.
  • the shaped material can be heated at a temperature of at least, greater than any one of, equal to any one of, or between any two of 50 °C, 55 °C, 60 °C, 65 °C, 70 °C, 75 °C, and 80 °C.
  • the resulting shaped polymeric composite material can be annealed at a temperature of at least, greater than any one of, equal to any one of, or between any two of 80 °C, 85 °C, 90 °C, 95 °C, 100 °C, 105 °C, 110 °C, 115 °C, and 120 °C for a desired amount of time (e.g, 5, 10, 15, 20, 25 hours or any range or value there between).
  • the shaped material can be a film, a sheet or the like. Some or all of the solvent can be removed during the heating process.
  • heating and/or annealing the lead-free piezoelectric polymeric precursor composite material can remove at least, greater than any one of, equal to any one of, or between any two of 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, and 100 wt.% of the solvent.
  • the shaped polymeric composite material can be subjected to conditions to induce electric polarization in the lead-free piezoelectric additive (e.g, plurality of particles) in the polymeric composite material.
  • the piezoelectric particles can be connected to one another in a linear or semi-linear manner (e.g, chains of particles). Columns of piezoelectric particles are suitably formed by the stacking or aligning of more than one chain.
  • the shaped polymeric composite material can be poled.
  • the polymeric composite material can be poled with a selected electric field at room temperature (e.g., after cooling of the composite), or at a selected electric field at a selected temperature, at least one of the selected electric field and the selected temperature being chosen in accordance with a desired dipole orientation, a desired polarization strength, or property of the article of manufacture.
  • the temperature for performing poling can be in accordance with a desired dipole orientation and/or a desired polarization strength, or in accordance with a desired stress state of a finished actuator.
  • the poling can be performed at a selected cooling temperature range, through a selected heating temperature, or through a selected heating temperature heating and cooling temperature range.
  • the poling may occur over a“range” ( e.g ., selected range) of temperatures rather than at a specific constant temperature.
  • poling can be performed at a temperature of at least, greater than any one of, equal to any one of, or between any two of 80 °C, 85 °C, 90 °C, 95 °C, 100 °C, 105 °C, 110 °C, 115 °C, and 120 °C.
  • the applied voltage level parameter for the poling can be selected in various ways. For example, the applied voltage level parameter can be selected as constant, or changing (e.g., ramped) over a period of time. In some embodiments, poling is performed using corona discharge using an electrode gap of 0.5 to 1.5 cm, or about 1 cm for a desired amount of time (e.g, about 1 hour).
  • the piezoelectric composite can include a polymer and a lead-free piezoelectric additive.
  • the piezoelectric composite can include at least, greater than any one of, equal to any one of, or between any two of 1, 10, 20, 30, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, and 99 wt.% polymer matrix.
  • the amount of lead-free piezoelectric additive present in the polymer matrix can be at least, greater than any one of, equal to any one of, or between any two of 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, and 65 vol.%.
  • the piezoelectric composite includes PVDF-TRFE-CFE and 20 vol.% to 60 vol.% barium titanate particles having an average particle size of 250 to 350 nm. In some embodiments, the piezoelectric composite includes, consists of, or consists essentially of PVDF-TRFE-CFE and 20 vol.% to 60 vol.% barium titanate particles having an average particle size of 250 to 350 nm. In some embodiments, the piezoelectric composite can have less than 0.1 wt.% of solvent or between 0 and 0.1 wt.% solvent.
  • the piezoelectric composite can have any shape or form.
  • the piezoelectric composite is a film or sheet.
  • the film or sheet has a thickness dimension of 50 to 200 microns, or at least, greater than any one of, equal to any one of, or between any two of 50, 60, 70, 80, 90, 100, 110, 120, 130, 140, 150, 160, 170, 180, 190, and 200 microns.
  • Properties of the piezoelectric composite include electrical and mechanical properties.
  • electrical properties can include piezoelectric constant, dielectric constant, and the like.
  • the d33 of the piezoelectric composite be at least, equal to, or between 40 pC/N, 45 pC/N, 50 pC/N, 55 pC/N, 56 pC/N, 57 pC/N, 58 pC/N, 59 pC/N, 60 pC/N, 61 pC/N, 62 pC/N, 63 pC/N, 64 pC/N, 65 pC/N, 66 pC/N, 67 pC/N, 68 pC/N, 69 pC/N, and 70 pC/N.
  • the piezoelectric composite can have a dielectric constant that is less than any one of, equal to any one of, or between any two of 120, 115, 110, 105, 100, 95, 90, 85, 80, 75, 70, 65, 60, 55, 50, 45, 40, and 35. In some embodiments, the dielectric constant is from 90 to 210.
  • the lead-free piezoelectric composite can have a storage modulus can range from 100 to 325 MPa, or at least, greater than any one of, equal to any one of, or between any two of 100, 125, 150, 175, 200, 225, 250, 275, 300, and 325 MPa. Storage modulus can be measured according to ISO 6721 at room temperature and a 1 Hz strain of 0.2%.
  • the lead-free piezoelectric composite can have an elongation break of 30 to 500% under uniaxial loading at room temperature (e.g ., 25 to 35 °C). Elongation break can be measured using standard dynamic mechanical analyzer such as a RDA III analyser (TA Instruments, U.S.A.).
  • the piezoelectric device can be included in a device.
  • the device is flexible.
  • the piezoelectric material of the present invention can be used in articles of manufacture that have curved surfaces, flexible surfaces, deformable surfaces, etc.
  • Non-limiting examples of such articles of manufacture include a piezoelectric sensor, a piezoelectric transducer, a piezoelectric actuator.
  • These components can be used in tactile sensitive devices, electronic devices (e.g., smart phones, tablets, computers, etc.), virtual reality devices, augmented reality devices, fixtures that require flexibility such as adjustable mounted wireless headsets and/or ear buds, communication helmets with curvatures, medical batches, flexible identification cards, flexible sporting goods, packaging materials, medical devices, and/or applications where the presence of a bendable material simplifies final product design, engineering, and/or mass production.
  • electronic devices e.g., smart phones, tablets, computers, etc.
  • virtual reality devices e.g., augmented reality devices
  • fixtures that require flexibility such as adjustable mounted wireless headsets and/or ear buds, communication helmets with curvatures, medical batches, flexible identification cards, flexible sporting goods, packaging materials, medical devices, and/or applications where the presence of a bendable material simplifies final product design, engineering, and/or mass production.
  • PVDF-TrFE-CFE resin powder (about 2 g) was dissolved in the solvent (16 mL) taken in round bottom flask fitted with a condenser. The desired amount of barium titanate (BT) was then added slowly under stirring at 200 to 250 rpm using a magnetic stirrer. After stirring for 30 min, the mixture was casted into a thin film using doctor blade on to a substrate, followed by drying in open air. The drying time was adjusted depending on the solvent used for making the composites. After drying, the films were peeled off from the glass plate and annealed under nitrogen.
  • Table 2 The compositions of the piezocomposites prepared following the procedure mentioned above and the solvent used for making the composites are provided in Table 2
  • the piezocomposite films (dimension 3 cm x 3 cm) from Table 2 were subjected to corona poling for the demonstration of piezoelectric response.
  • Corona poling (of top surface which was exposed to air during drying of the film and/or bottom surface which was in contact with substrate during drying of the film) of the piezocomposites was carried out under the conditions detailed below.
  • the needles were kept at high voltage (typically 10 KV).
  • Poling temperature was 110 °C for BT based composites (Examples 1-8) and 115 °C for PZT based composites (Comparative Examples 1-4).
  • the electrode gap was 1 cm, and poling time was lh. The samples were cooled to room temperature under the same applied voltage.
  • the poled films were kept for 48 h and then the piezoelectric strain constant (d33) of the poled films was measured at ambient temperature using Berlin court type d33 meter, (PM300, Piezo Test, UK) at the frequency of 110 Hz, clamping force of 10 N and oscillatory force 0.25 N.
  • the storage modulus (or elastic modulus) of each of the piezoelectric polymer composites was obtained by dynamic mechanical analysis performed on RDA III as a function of time.
  • the tensile test under uniaxial loading was performed at ambient temperature.
  • Table 3 lists the relevant physical properties of the solvent.
  • the Fourier Transform Infra-red (FT-IR) spectroscopy confirms complete removal of the solvents from the composite films.
  • the surface morphology and phase separation in the composite films prepared using different solvents were characterized by scanning electron microscopy (SEM), as shown in FIG 1.
  • FIG. 2 show surface profilometer plots within the sampling length (5 mm) for the top surface of the composite films.
  • Table 4 lists the solvent dependent piezoelectric performance, (d 33 ) and average surface roughness (Ra) of the piezoelectric polymer composites.
  • the composite films prepared using DMSO (Example 5) and NMP (Example 6) have smoother surface and exhibit higher cte as compared to the films which were solution casted using MEK (Example 3) and THF (Example 4).
  • the solvent has a low boiling point ( ⁇ 80 °C) and low dielectric constant ( ⁇ 20), it evaporates before the settling of the filler particles, thus most of the aggregates were found at the top surface. This has resulted in higher surface roughness and lower d33.
  • the solvent has a high boiling point (> 80°C) and high dielectric constant (>20)
  • the filler particles start settling down before the solvent completely evaporates. As the filler particles move away from the top surface, depressions are seen, resulting in smoother surface and higher d 33.
  • the particle size of the piezoceramic filler had a major influence on the piezoelectric strain constant in the lead-free piezoelectric composites, the measurement results summarized in Table 5.
  • Barium titanate powders with average particle size of 300 nm resulted in a significant improvement of d 33.
  • Table 6 A and B shows the effect of annealing time on piezoelectric strain constant for lead-free piezocomposites prepared using solvent having high boiling point, DMSO and NMP. The reduction of piezoelectric strain constant was less than 10% after annealing for 72h at 110°C.
  • FIG. 3 demonstrates the piezoelectric strain constant as a function of filler loading for lead-free and lead-based piezoelectric polymer composites.
  • FIGS. 4 and 5 illustrate the influence of filler loading on elongation at break and storage modulus respectively. From the results, it was determined that a significant reduction of elongation at break when the filler loading exceed 40% by volume in both the two types of piezocomposites. From the data for storage modulus of lead-free piezoelectric polymer composites, it was observed that a reduction in storage modulus occurred when filler loading was increased. In contrast, the storage modulus of lead-based piezoelectric polymer composites initially increased dramatically, and there after declined. The piezocomposite films retain the mechanical flexibility at high loading, a representative example is shown in FIG. 6.
  • the present invention provides criticality for a lead-free piezoelectric composite on particle size attribute and/or a solvent attribute based criteria that effectively can be translated to choose a specific particle size and/or solvent for the particular polymer- piezoelectric filler composite that provides the best combination of mechanical property and d33 value.

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Abstract

L'invention concerne des procédés de production de composites piézoélectriques sans plomb. Le procédé peut comprendre l'ajout d'un additif piézoélectrique sans plomb à une solution qui comprend un solvant et un polymère solubilisé dans celle-ci. Le solvant peut avoir i) un point d'ébullition ≥ 80 °C à 0,1 MPa et ii) une solubilité dans l'eau ≥ 0,1 g/g et/ou une constante diélectrique ≥ 20. Le solvant peut être retiré pour former une matrice polymère ayant les particules piézoélectriques sans plomb dispersées dans celle-ci. Le traitement électrique de la matrice polymère peut former le composant piézoélectrique. L'invention concerne également des composites piézoélectriques sans plomb et des dispositifs qui comprennent les composites piézoélectriques sans plomb.
PCT/IB2020/053052 2019-04-02 2020-03-31 Composites piézoélectriques sans plomb et leurs procédés de fabrication WO2020202006A1 (fr)

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CN116392635A (zh) * 2023-03-31 2023-07-07 山东大学 一种具有超声响应性的纳米压电颗粒/聚合物复合抗菌材料及其制备方法与应用

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