WO2020186602A1 - 刚性oled显示面板的制备方法及显示面板 - Google Patents

刚性oled显示面板的制备方法及显示面板 Download PDF

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Publication number
WO2020186602A1
WO2020186602A1 PCT/CN2019/084467 CN2019084467W WO2020186602A1 WO 2020186602 A1 WO2020186602 A1 WO 2020186602A1 CN 2019084467 W CN2019084467 W CN 2019084467W WO 2020186602 A1 WO2020186602 A1 WO 2020186602A1
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Prior art keywords
display panel
substrate
glass substrate
area
display
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PCT/CN2019/084467
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English (en)
French (fr)
Inventor
王超梁
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/499,284 priority Critical patent/US11233221B2/en
Publication of WO2020186602A1 publication Critical patent/WO2020186602A1/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the invention relates to the field of display technology, in particular to a method for preparing a rigid OLED display panel and a display panel
  • OLED Organic Light-Emitting Diode, organic light-emitting diode
  • organic electroluminescence display also known as organic electroluminescence display
  • OLED Organic Light-Emitting Diode, organic light-emitting diode
  • OLED Organic Light-Emitting Diode
  • organic electroluminescence display is an emerging display device, due to its simple manufacturing process, low cost, low power consumption, high luminous brightness, working It has the advantages of wide temperature adaptability, light and thin size, fast response speed, easy realization of color display and large screen display, easy realization of matching with integrated circuit driver, easy realization of flexible display, etc., so it has broad application prospects.
  • Rigid OLED rigid organic light-emitting diodes
  • Flexible OLED flexible organic light-emitting diodes
  • Rigid OLED also has certain disadvantages, such as 1. Thick product thickness; 2.
  • the terminal area is a glass substrate, which cannot be bent by bending (Pad).
  • the subsequent assembly process of the mobile phone will The non-display area of the mobile phone is too large, which affects the mobile phone screen ratio.
  • This aspect provides a method for manufacturing a rigid OLED display panel and a display panel, which can increase the screen-to-body ratio of the display area in the rigid OLED display panel.
  • the present invention addresses the problem of relatively low screen occupancy of rigid OLED display panels in the prior art, and proposes a method for manufacturing a rigid OLED display panel.
  • the method includes:
  • a first substrate is provided, the first substrate includes a first glass substrate and a flexible film, the flexible film covers the first glass substrate, and the flexible film includes a first area and a second area, the first area Corresponding to the display area of the display panel, and the second area corresponds to the non-display area of the display panel;
  • the second substrate being arranged opposite to the first substrate
  • the first glass substrate is provided with a groove inside, and coating the first glass substrate includes:
  • Organic coating is performed on the first glass substrate in the groove.
  • the method further includes: disposing an encapsulating material between the first substrate and the second substrate and attaching them in position to encapsulate the display area, and attaching a flexible circuit board to the encapsulated second substrate. In the non-display area of a glass substrate.
  • a method for preparing a rigid OLED display panel includes:
  • a first substrate is provided, the first substrate includes a first glass substrate and a flexible film, the flexible film covers the first glass substrate, and the flexible film includes a first area and a second area, the first area Corresponding to the display area of the display panel, and the second area corresponds to the non-display area of the display panel;
  • the second substrate being arranged opposite to the first substrate
  • a groove is provided inside the first glass substrate, and coating the first glass substrate includes:
  • Organic coating is performed on the first glass substrate in the groove.
  • the organic coating on the first glass substrate in the groove is the polyimide coating on the glass substrate.
  • the depth of the groove is 10-30 ⁇ m.
  • the upper surface of the trench after the organic coating is applied is level with the upper surface of the first glass substrate.
  • the method further includes:
  • An encapsulating material is arranged between the first substrate and the second substrate and bonded in position to encapsulate the display area, and a flexible circuit board is attached to the non-display of the encapsulated first glass substrate within the area.
  • the flexible circuit board includes a first circuit and a second circuit.
  • the method further includes:
  • the flexible circuit board and the flexible film are bent to fit the side surfaces of the first substrate and the display panel.
  • the cutting and peeling of the first glass substrate in the non-display area of the display panel after packaging includes:
  • the method may further include: fixing and protecting the flexible circuit board and the flexible film after bending.
  • the present invention also provides a display panel, including: a first substrate, the first substrate includes a first glass substrate and a flexible film, the flexible film is located above the first glass substrate and includes a first area And a second area, where the first area corresponds to the display area of the display panel, the second area is attached to the side surface of the display panel, and the first glass substrate is provided with grooves for organic coating;
  • the second substrate is arranged opposite to the first substrate
  • the packaging material is located between the first substrate and the second substrate, and is used for packaging the display area.
  • the surface of the groove after organic coating is level with the upper surface of the first glass substrate.
  • the groove is used for polyimide coating.
  • the display panel further includes a flexible circuit board located in the non-display area, and the flexible circuit board is attached to the non-display area of the display panel.
  • the flexible circuit board includes a first circuit and a second circuit.
  • the flexible circuit board and the flexible film are bent to adhere to the side surfaces of the first substrate and the display panel.
  • the non-display area of the first glass substrate is cut and peeled off.
  • the non-display area of the first glass substrate is cut and stripped for laser stripping.
  • the display panel may further include a protective layer to protect the flexible film and flexible circuit board after bending.
  • the beneficial effects of the present invention are: by adding the technology of the flexible OLED process in the rigid OLED manufacturing process, the coating and stripping technology is added, so that the organic coating and peeling technology is added in the manufacturing process without changing the general direction of the rigid OLED.
  • the first glass substrate corresponding to the non-display area in the rigid OLED display panel is coated and peeled off with organic matter, so that the non-display area in the rigid OLED display panel can be bent, thereby reducing the size of the non-display area in the rigid OLED display panel. This increases the screen-to-body ratio of the display area in the rigid OLED display panel.
  • FIG. 1 is a flowchart of an embodiment of a method for manufacturing a rigid OLED display panel provided by the present invention
  • step S2 is a flowchart of step S2 in an embodiment of a method for manufacturing a rigid OLED display panel provided by the present invention
  • FIG. 3 is a cross-sectional structure diagram of a display panel formed after the display panel is packaged according to an embodiment of the present invention
  • step S5 is a flowchart of step S5 in an embodiment of a method for manufacturing a rigid OLED display panel provided by the present invention
  • FIG. 5 is a cross-sectional view of the display panel structure after peeling off the first glass substrate provided by the present invention.
  • FIG. 6 is a structural cross-sectional view of an embodiment of a display panel provided by the present invention.
  • FIG. 1 it is a flowchart of an embodiment of a method for manufacturing a rigid OLED display panel provided by the present invention.
  • the method includes:
  • the first substrate includes a first glass substrate 11 and a flexible film 12, the flexible film 12 covers the first glass substrate 11, and the flexible film 12 includes a first area 12a and The second area 12b, the first area corresponds to the display area of the display panel, and the second area corresponds to the non-display area of the display panel;
  • step S1 includes:
  • a plurality of grooves are provided on the first glass substrate 11, and the depth and width of the grooves are changed according to the requirements of different products, and the depth of the grooves is 10-30 ⁇ m.
  • the plurality of grooves may be three, four, etc.; the depth of the grooves may be 10 ⁇ m, 20 ⁇ m, 30 ⁇ m, etc.
  • the flexible film 12 includes a first area 12a and a second area 12b, and the first area 12a corresponds to the display area of the display panel, and the second area 12b corresponds to the non-display area of the display panel. .
  • the organic coating on the first glass substrate 11 in step S2 may be polyimide coating on the first glass substrate 11.
  • the organic coating of the first glass substrate 11 is to apply organic coating to the grooves on the first glass substrate, and the upper surface of the grooves after the organic coating and the first glass substrate 11 The upper surface is flat. It should be noted that the method for coating the groove can refer to the prior art, which is not limited here.
  • step S4 further includes filling a liquid crystal layer 30 between the first substrate 11 and the second substrate 12.
  • FIG. 3 is a display panel formed after packaging according to an embodiment of the present invention. The cross-sectional structure diagram of the display panel.
  • Step S5 is a flowchart of step S5 in an embodiment of a method for manufacturing a rigid OLED display panel provided by the present invention.
  • Step S5 may include:
  • S401 Perform laser cutting on the first glass substrate in the non-display area of the display panel after packaging;
  • S402 Peel off the cut first glass substrate in the non-display area of the display panel.
  • the non-display area of the first glass substrate 11 is cut off based on the structure of the display panel shown in FIG.
  • the first substrate 10 includes a first glass substrate 11 and a flexible film 12 covering all the first glass substrate 11, and the first area 12a of the flexible film is located in the display area of the first substrate 10, and the second area of the flexible film 12 is The area 12b corresponds to the display area beyond the first substrate 10.
  • the method further includes: disposing an encapsulating material between the first substrate and the second substrate and attaching it in position to encapsulate the display area, and encapsulating the flexible circuit board 60 is attached to the non-display area of the first glass substrate after packaging.
  • the flexible circuit board 60 includes a first circuit 60a and a second circuit 60b, and the first circuit 60a is attached to the second area 12b of the flexible film 12, and the second circuit 60b exceeds the flexibility.
  • the method further includes:
  • the flexible circuit board and the flexible film are bent to fit the side surfaces of the first substrate and the display panel.
  • the second area 12b of the flexible film 12 and the flexible circuit board 60 are bent, so that the second area 12b of the flexible film 12 and the flexible circuit board 60 and the first The side surfaces of the substrate 10 are attached.
  • the flexible circuit board 60 can also be bent.
  • the flexible film 12 and the flexible circuit board are fixed and protected.
  • scotch tape, polyimide glue, etc. can be used to fix the bent flexible film 12 and the flexible circuit board 60.
  • you can also use Optical transparent adhesive, ultraviolet curing adhesive and first-level thermal curing adhesive, etc. protect the flexible film 12 and flexible circuit board 60 after bending.
  • the flexible circuit board 60 has an abnormality. If an optical transparent glue is used to protect the bent flexible circuit board 60, the circuit failure can be directly observed for detection of defects.
  • the present invention also provides a display panel, which may include:
  • the first substrate 10 includes a first glass substrate 11 and a flexible film 12.
  • the flexible film 12 is located above the first glass substrate 11, and includes a first area 12a and a second area 12b.
  • An area corresponds to the display area of the display panel, and the second area is attached to the side surface of the display panel;
  • the second substrate 20 is arranged opposite to the first substrate 10.
  • the packaging material 40 is located between the first substrate 10 and the second substrate 20, and the packaging area of the packaging material 40 is the display area.
  • a plurality of grooves are provided on the first glass substrate 11 for organic coating, and the depth and width of the grooves are changed according to the requirements of different products, and the depth of the grooves is 10-30 ⁇ m.
  • the plurality of grooves may be three, four, etc.; the depth of the grooves may be 10 ⁇ m, 20 ⁇ m, 30 ⁇ m, etc.
  • the organic substance coated with the organic substance on the groove may be polyimide, and the upper surface of the groove after the organic substance coating is flat with the upper surface of the first glass substrate 11. It should be noted that the method for coating the groove can refer to the prior art, which is not limited here.
  • the display panel further includes a flexible circuit board 60, and the flexible circuit board 60 includes a first circuit 60a and a second circuit 60b, and the first circuit 60a is attached to the flexible film 12 On the second area 12b, the second circuit 60b extends beyond the second area 12b of the flexible film 12.
  • FIG. 6 it is a structural cross-sectional view of an embodiment of a display panel provided by the present invention.
  • the second area of the flexible film 12 in the display panel and the flexible circuit board 60 are in a bent state, and the flexible film 12 The second area is attached to the side of the flexible circuit board 60 and the first substrate 10.
  • the excess part is bent and attached to the first substrate 10. The bottom surface of the substrate 10.
  • the bent flexible film 12 and the flexible circuit board may also be fixed and protected.
  • scotch tape, polyimide glue, etc. can be used to fix the bent flexible film 12 and the flexible circuit board 60.
  • Optical transparent adhesive, ultraviolet curing adhesive and first-level thermal curing adhesive, etc. protect the flexible film 12 and flexible circuit board 60 after bending.
  • the flexible circuit board 60 has an abnormality. If an optical transparent glue is used to protect the bent flexible circuit board 60, the circuit failure can be directly observed for detection of defects.
  • a display panel including the above-mentioned manufacturing method of the rigid OLED display panel.
  • the working principle of the display panel provided in this embodiment is consistent with the working principle of the foregoing embodiment of the method for preparing a rigid OLED display panel.
  • a display module including the above display panel.
  • the working principle of the display panel provided in this embodiment is consistent with the working principle of the aforementioned display module embodiment, and the specific structural relationship and working principle can be referred to the aforementioned display panel embodiment, which will not be repeated here.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种刚性OLED显示面板的制备方法及显示面板，该方法包括：提供第一基板，所述第一基板包括第一玻璃基板和柔性薄膜（S1）；对所述第一玻璃基板进行有机物涂布（S2）；提供第二基板（S3）；对所述显示区域进行封装（S4）；对封装后所述显示面板的非显示区域的第一玻璃基板进行切割和剥离（S5）。增加刚性OLED显示面板中显示区域的屏占比。

Description

刚性OLED显示面板的制备方法及显示面板 技术领域
本发明涉及显示技术领域，尤其涉及一种刚性OLED显示面板的制备方法及显示面板
 背景技术
OLED(Organic Light-Emitting  Diode，有机发光二极管)显示器，也称为有机电致发光显示器，是一种新兴的显示装置，由于其具有制备工艺简单、成本低、功耗低、发光亮度高、工作温度适应范围广、体积轻薄、响应速度快，而且易于实现彩色显示和大屏幕显示、易于实现和集成电路驱动器相匹配、易于实现柔性显示等优点，因而具有广阔的应用前景。
目前存在两种类型OLED，包括：刚性有机发光二极管（Rigid OLED）和柔性有机发光二极管（Flexible OLED），两者的制备工艺和流程相差极大，Rigid OLED是已玻璃为基板进行制备，相对技术更加成熟，稳定，但相比Flexible OLED，Rigid OLED也存在一定缺点，如1.产品厚度厚；2.端子区域为玻璃基底，无法进行焊盘弯曲（Pad bending），后续在手机组装过程中会造成手机非显示区域过大，影响手机屏占比。
 技术问题
在目前的窄边框设计中，即使减小边框的宽度，但是因为受外围电路的尺寸限制，液晶显示屏的边框很难再减小。同时，由于为了减小边框，外围电路缩小到极限，也容易影响充电效果及电路的良率。
 技术解决方案
本方面提供一种刚性OLED显示面板的制备方法及显示面板，可以增加刚性OLED显示面板中显示区域的屏占比。
为了解决上述问题，第一方面，本发明针对现有技术下的刚性OLED显示面板屏占比较低的问题，提出一种刚性OLED显示面板的制备方法，所述方法包括：
提供第一基板，所述第一基板包括第一玻璃基板和柔性薄膜，所述柔性薄膜覆盖所述第一玻璃基板，且所述柔性薄膜包括第一区域和第二区域，所述第一区域与显示面板的显示区域对应，所述第二区域与显示面板的非显示区域对应；
对所述第一玻璃基板进行有机物涂布；
提供第二基板，所述第二基板与所述第一基板相对设置；
在所述第一基板与所述第二基板之间设置封装材料并对位贴合以对所述显示区域进行封装；
对封装后所述显示面板的非显示区域的第一玻璃基板进行切割和剥离。
所述第一玻璃基板内部设置有沟槽，对所述第一玻璃基板进行涂布，包括：
在所述沟槽内对所述第一玻璃基板进行有机物涂布。
所述方法还包括：在所述第一基板与所述第二基板之间设置封装材料并对位贴合以对所述显示区域进行封装，将柔性电路板贴合在封装后的所述第一玻璃基板的非显示区域内。
一种刚性OLED显示面板的制备方法，所述方法包括：
提供第一基板，所述第一基板包括第一玻璃基板和柔性薄膜，所述柔性薄膜覆盖所述第一玻璃基板，且所述柔性薄膜包括第一区域和第二区域，所述第一区域与显示面板的显示区域对应，所述第二区域与显示面板的非显示区域对应；
对所述第一玻璃基板进行有机物涂布；
提供第二基板，所述第二基板与所述第一基板相对设置；
在所述第一基板与所述第二基板之间设置封装材料并对位贴合以对所述显示区域进行封装；
对封装后所述显示面板的非显示区域的第一玻璃基板进行切割和剥离。
进一步的，所述第一玻璃基板内部设置有沟槽，对所述第一玻璃基板进行涂布，包括：
在所述沟槽内对所述第一玻璃基板进行有机物涂布。
进一步的，在所述沟槽内对所述第一玻璃基板进行有机物涂布为对所述玻璃基板进行聚酰亚胺涂布。
进一步的，所述沟槽的深度为10-30μm。
进一步的，进行有机物涂布后的沟槽的上表面与所述第一玻璃基板的上表面持平。
进一步的，所述方法还包括：
在所述第一基板与所述第二基板之间设置封装材料并对位贴合以对所述显示区域进行封装，将柔性电路板贴合在封装后的所述第一玻璃基板的非显示区域内。
进一步的，所述柔性电路板包括第一电路和第二电路。
进一步的，所述方法还包括：
对所述柔性电路板和所述柔性薄膜进行弯折以贴合所述第一基板及所述显示面板的侧面。
进一步的，所述对封装后所述显示面板的非显示区域的第一玻璃基板进行切割和剥离，包括：
对封装后的所述显示面板的非显示区域的第一玻璃基板进行激光剥离。
进一步的，所述方法还可以包括：对进行弯折后的柔性电路板和柔性薄膜进行固定和保护。
第二方面，本发明还提供一种显示面板，包括：第一基板，所述第一基板包括第一玻璃基板和柔性薄膜，所述柔性薄膜位于所述第一玻璃基板上方，包括第一区域和第二区域，所述第一区域与显示面板的显示区域对应，所述第二区域与显示面板的侧面贴合，所述第一玻璃基板上设置有用以进行有机物涂布的沟槽；
第二基板，与所述第一基板相对设置；
封装材料，位于所示第一基板与所述第二基板之间，用以对所述显示区域进行封装。
进一步的，所述沟槽进行有机物涂布后的表面与所述第一玻璃基板的上表面持平。
进一步的，所述沟槽用以进行聚酰亚胺涂布。
进一步的，所述显示面板还包括位于所述非显示区域的柔性电路板，所述柔性电路板贴合在所述显示面板的非显示区域。
进一步的，所述柔性电路板包括第一电路和第二电路。
进一步的，所述柔性电路板和所述柔性薄膜进行弯折以贴合所述第一基板及所述显示面板的侧面。
进一步的，所述第一玻璃基板中非显示区域的部分被切割和剥离。
进一步的，所述第一玻璃基板中非显示区域的部分被切割和剥离为激光剥离。
进一步的，所述显示面板还可以包括保护层，用以对弯折后的柔性薄膜和柔性电路板进行保护。
 有益效果
本发明的有益效果为：通过在刚性OLED制程中掺杂柔性OLED工艺的技术，增加涂布与剥离技术，使得在不改变刚性OLED大方向的制程中，通过增加有机物涂布与剥离技术，对刚性OLED显示面板中非显示区域对应的第一玻璃基板进行有机物涂布和剥离，使得刚性OLED显示面板中的非显示区域可以进行弯折，从而减小刚性OLED显示面板中非显示区域的大小，从而增加刚性OLED显示面板中显示区域的屏占比。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明提供的刚性OLED显示面板制备方法的一实施例流程图；
图2为本发明提供的刚性OLED显示面板制备方法的一实施例中步骤S2的流程图；
图3为本发明实施例提供的显示面板封装后所形成的显示面板剖面结构图；
图4为本发明提供的刚性OLED显示面板制备方法的一实施例中步骤S5的流程图；
图5为本发明提供的第一玻璃基板进行剥离后的显示面板结构剖面图；
图6为本发明提供的一种显示面板的一实施例的结构剖面图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
附图和说明被认为在本质上是示出性的，而不是限制性的。在图中，结构相似的单元是用以相同标号表示。另外，为了理解和便于描述，附图中示出的每个组件的尺寸和厚度都是任意示出的，但是本发明不限于此。
在附图中，为了清晰起见，夸大了层、膜、面板、区域等的厚度。在附图中，为了理解方便和便于描述，夸大了一些层和区域的厚度。需要说明的是，当例如层、膜、区域或基底的组件被称作“在”另一组件“上”时。所述组件可以直接在所述另一组件上，或者也可以存在中间组件。
另外，在说明书中，除非明确地描述为相反的，否则词语“包括”将被理解为意指包括所述组件，但是不排除任何其他组件。此外在说明书中，“在……上”意指位于目标组件上方或者下方，而不意指必须位于基于重力方向的顶部上。
为更进一步阐述本发明为达成预定发明所采取的技术手段及功效，以下结合附图及较佳实施例，对依据本发明提出的刚性OLED显示面板的制备方法及显示面板，其具体实施方式、结构、特征及其功效，详细说明如下。
如图1所示，为本发明提供的刚性OLED显示面板制备方法的一实施例流程图，该方法包括：
S1、提供第一基板10，所述第一基板包括第一玻璃基板11和柔性薄膜12，所述柔性薄膜12覆盖所述第一玻璃基板11，且所述柔性薄膜12包括第一区域12a和第二区域12b，所述第一区域与显示面板的显示区域对应，所述第二区域与显示面板的非显示区域对应；
S2、对所述第一玻璃基板11进行有机物涂布；
S3、提供第二基板20，所述第二基板20与所述第一基板10相对设置；
S4、在所述第一基板10与所述第二基板20之间设置封装材料并对位贴合以对所述显示区域进行封装；
S5、对封装后所述显示面板的非显示区域的第一玻璃基板11进行切割和剥离。
在本发明的一些实施例中，如图2所示，步骤S1包括：
S201、提供第一玻璃基板11；
S202、在所述第一玻璃基板上制备柔性薄膜12。
需要说明的是，第一玻璃基板11上设置有多个沟槽，且该沟槽的深度和宽度根据不同产品的需求来进行改变，沟槽的深度为10-30μm。
优选的，该多个沟槽可以为三个、四个等；沟槽的深度可以为10μm、20μm、30μm等。
在本方面提供的一些实施例中，该柔性薄膜12包括第一区域12a和第二区域12b，且第一区域12a与显示面板的显示区域对应，第二区域12b与显示面板的非显示区域对应。
在本发明的另一些实施例中，步骤S2对所述第一玻璃基板11进行有机物涂布可以为对第一玻璃基板11进行聚酰亚胺涂布。
需要说明的是，对所述第一玻璃基板11进行有机物涂布为对第一玻璃基板上的沟槽进行有机物涂布，且进行有机物涂布后的沟槽上表面与第一玻璃基板11的上表面持平。需要说明的是，对该沟槽进行涂布的方法可以参考现有技术，此处不做限定。
在本发明的一些实施例中，步骤S4还包括在第一基板11和第二基板12之间填充液晶层30，请参考图3，图3为本发明实施例提供的显示面板封装后所形成的显示面板剖面结构图。
在本发明的一些其他实施例中，请参考图4，本发明提供的刚性OLED显示面板制备方法的一实施例中步骤S5的流程图，步骤S5可以包括：
S401、对封装后所述显示面板的非显示区域的第一玻璃基板进行激光切割；
S402、对切割后的显示面板的非显示区域的第一玻璃基板进行剥离。
如图5所示，为本发明提供的第一玻璃基板进行剥离后的显示面板结构剖面图，在图3所示的显示面板的结构的基础上，切除第一玻璃基板11的非显示区域，此时第一基板10包括第一玻璃基板11和全部覆盖所述第一玻璃基板11的柔性薄膜12，且柔性薄膜的第一区域12a位于第一基板10的显示区域，柔性薄膜12的第二区域12b对应超出第一基板10的显示区域。
在本发明的一些实施例中，所述方法还包括：在所述第一基板与所述第二基板之间设置封装材料并对位贴合以对所述显示区域进行封装，将柔性电路板60贴合在封装后的所述第一玻璃基板的非显示区域内。
具体的，所述柔性电路板60包括第一电路60a和第二电路60b，且第一电路60a贴合在所述柔性薄膜12的第二区域12b上，所述第二电路60b超出所述柔性薄膜12的第二区域12b。
在步骤在所述第一基板与所述第二基板之间设置封装材料并对位贴合以对所述显示区域进行封装，将柔性电路板60贴合在封装后的所述第一玻璃基板的非显示区域内之后，所述方法还包括：
对所述柔性电路板和所述柔性薄膜进行弯折以贴合所述第一基板及所述显示面板的侧面。
具体的，对所述柔性薄膜12的第二区域12b和所述柔性电路板60进行弯折，使得弯折后的柔性薄膜12的第二区域12b和所述柔性电路板60与所述第一基板10的侧面贴合。
在上述步骤中，为了减小使用上述面板制作的显示器的边框的宽度，若所述柔性电路板60的长度超出所述第一基板10的厚度，则将超出的部分弯折贴合至所述第一基板10的下表面。
在步骤：对所述柔性电路板和所述柔性薄膜进行弯折以贴合所述第一基板及所述显示面板的侧面之后，为了便于检测柔性电路板60的不良，还可以将弯折后的柔性薄膜12和柔性电路板进行固定和保护。例如，可以采用透明胶带、聚酰亚胺胶等将弯折后的柔性薄膜12和柔性电路板60进行固定，在将弯折后的柔性薄膜12和柔性电路板60进行固定之后，还可以采用光学透明胶、紫外线固化胶一级热固化胶等对弯折后的柔性薄膜12和柔性电路板60进行保护。特别是柔性电路板60有异常，若采用光学透明胶胶对弯折后的柔性电路板60进行保护，则可以直接观察出来电路故障以供检测不良所用。
本发明还提供一种显示面板，该显示面板可以包括：
第一基板10，该玻璃基板10包括第一玻璃基板11和柔性薄膜12，所述柔性薄膜12位于所述第一玻璃基板11的上方，包括第一区域12a和第二区域12b，所述第一区域与显示面板的显示区域对应，所述第二区域与显示面板的侧面贴合；
第二基板20，与所述第一基板10相对设置。
封装材料40，位于所述第一基板10和第二基板20之间，且位于封装材料40的封装区域为所述显示区域。
需要说明的是，第一玻璃基板11上设置有多个沟槽以进行有机物涂布，且该沟槽的深度和宽度根据不同产品的需求来进行改变，沟槽的深度为10-30μm。
优选的，该多个沟槽可以为三个、四个等；沟槽的深度可以为10μm、20μm、30μm等。
对该沟槽进行有机物涂布的有机物可以为聚酰亚胺，且进行有机物涂布后的沟槽上表面与第一玻璃基板11的上表面持平。需要说明的是，对该沟槽进行涂布的方法可以参考现有技术，此处不做限定。
在本发明的一些其他实施例中，该显示面板还包括柔性电路板60，且柔性电路板60包括第一电路60a和第二电路60b，且第一电路60a贴合在所述柔性薄膜12的第二区域12b上，所述第二电路60b超出所述柔性薄膜12的第二区域12b。
如图6所示，为本发明提供的一种显示面板的一实施例结构剖面图，该显示面板中的柔性薄膜12的第二区域与柔性电路板60处于弯折状态，且柔性薄膜12的第二区域与柔性电路板60与所述第一基板10的侧面贴合。
进一步的，为了减小使用上述面板制作的显示器的边框的宽度，若所述柔性电路板60的长度超出所述第一基板10的厚度，则将超出的部分弯折贴合至所述第一基板10的下表面。
在本发明的一些实施例中，为了便于检测柔性电路板60的不良，还可以将弯折后的柔性薄膜12和柔性电路板进行固定和保护。例如，可以采用透明胶带、聚酰亚胺胶等将弯折后的柔性薄膜12和柔性电路板60进行固定，在将弯折后的柔性薄膜12和柔性电路板60进行固定之后，还可以采用光学透明胶、紫外线固化胶一级热固化胶等对弯折后的柔性薄膜12和柔性电路板60进行保护。特别是柔性电路板60有异常，若采用光学透明胶胶对弯折后的柔性电路板60进行保护，则可以直接观察出来电路故障以供检测不良所用。
根据本发明的上述目的，提出一种显示面板，包括上述的刚性OLED显示面板的制备方法。本实施例提供的显示面板的工作原理，与前述刚性OLED显示面板的制备方法的实施例工作原理一致，具体结构关系及工作原理参见前述刚性OLED显示面板的制备方法实施例，此处不再赘述。
根据本发明的上述目的，提出一种显示模组，包括上述的显示面板。本实施例提供的显示面板的工作原理，与前述显示模组的实施例工作原理一致，具体结构关系及工作原理参见前述显示面板实施例，此处不再赘述。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种刚性OLED显示面板的制备方法，其中，所述方法包括：
    提供第一基板，所述第一基板包括第一玻璃基板和柔性薄膜，所述柔性薄膜覆盖所述第一玻璃基板，且所述柔性薄膜包括第一区域和第二区域，所述第一区域与显示面板的显示区域对应，所述第二区域与显示面板的非显示区域对应；
    对所述第一玻璃基板进行有机物涂布；
    提供第二基板，所述第二基板与所述第一基板相对设置；
    在所述第一基板与所述第二基板之间设置封装材料并对位贴合以对所述显示区域进行封装；
    对封装后所述显示面板的非显示区域的第一玻璃基板进行切割和剥离。
    所述第一玻璃基板内部设置有沟槽，对所述第一玻璃基板进行涂布，包括：
    在所述沟槽内对所述第一玻璃基板进行有机物涂布。
    所述方法还包括：在所述第一基板与所述第二基板之间设置封装材料并对位贴合以对所述显示区域进行封装，将柔性电路板贴合在封装后的所述第一玻璃基板的非显示区域内。
  2. 一种刚性OLED显示面板的制备方法，其中，所述方法包括：
    提供第一基板，所述第一基板包括第一玻璃基板和柔性薄膜，所述柔性薄膜覆盖所述第一玻璃基板，且所述柔性薄膜包括第一区域和第二区域，所述第一区域与显示面板的显示区域对应，所述第二区域与显示面板的非显示区域对应；
    对所述第一玻璃基板进行有机物涂布；
    提供第二基板，所述第二基板与所述第一基板相对设置；
    在所述第一基板与所述第二基板之间设置封装材料并对位贴合以对所述显示区域进行封装；
    对封装后所述显示面板的非显示区域的第一玻璃基板进行切割和剥离。
  3. 根据权利要求2所述的刚性OLED显示面板的制备方法，其中，所述第一玻璃基板内部设置有沟槽，对所述第一玻璃基板进行涂布，包括：
    在所述沟槽内对所述第一玻璃基板进行有机物涂布。
  4. 根据权利要求3所述的显示面板的制备方法，其中，在所述沟槽内对所述第一玻璃基板进行有机物涂布为对所述玻璃基板进行聚酰亚胺涂布。
  5. 根据权利要求3所述的显示面板的制备方法，其中，所述沟槽的深度为10-30μm。
  6. 根据权利要求3所述的刚性OLED显示面板制备方法，其中，进行有机物涂布后的沟槽的上表面与所述第一玻璃基板的上表面持平。
  7. 根据权利要求2所述的刚性OLED显示面板的制备方法，其中，所述方法还包括：
    在所述第一基板与所述第二基板之间设置封装材料并对位贴合以对所述显示区域进行封装，将柔性电路板贴合在封装后的所述第一玻璃基板的非显示区域内。
  8. 根据权利要求7所述的刚性OLED显示面板的制备方法，其中，所述柔性电路板包括第一电路和第二电路。
  9. 根据权利要求7所述的刚性OLED显示面板的制备方法，其中，所述方法还包括：
    对所述柔性电路板和所述柔性薄膜进行弯折以贴合所述第一基板及所述显示面板的侧面。
  10. 根据权利要求2所述的刚性OLED显示面板的制备方法，其中，所述对封装后所述显示面板的非显示区域的第一玻璃基板进行切割和剥离，包括：
    对封装后的所述显示面板的非显示区域的第一玻璃基板进行激光剥离。
  11. 根据权利要求2所述的刚性OLED显示面板的制备方法，其中，所述方法还可以包括：对进行弯折后的柔性电路板和柔性薄膜进行固定和保护。
  12. 一种显示面板，其中，包括：
    第一基板，所述第一基板包括第一玻璃基板和柔性薄膜，所述柔性薄膜位于所述第一玻璃基板上方，包括第一区域和第二区域，所述第一区域与显示面板的显示区域对应，所述第二区域与显示面板的侧面贴合，所述第一玻璃基板上设置有用以进行有机物涂布的沟槽；
    第二基板，与所述第一基板相对设置；
    封装材料，位于所示第一基板与所述第二基板之间，用以对所述显示区域进行封装。
  13. 根据权利要求12所述的显示面板，其中，所述沟槽进行有机物涂布后的表面与所述第一玻璃基板的上表面持平。
  14. 根据权利要求13所述的显示面板，其中，所述沟槽用以进行聚酰亚胺涂布。
  15. 根据权利要求12所述的显示面板，其中，所述显示面板还包括位于所述非显示区域的柔性电路板，所述柔性电路板贴合在所述显示面板的非显示区域。
  16. 根据权利要求15所述的显示面板，其中，所述柔性电路板包括第一电路和第二电路。
  17. 根据权利要求15所述的显示面板，其中，所述柔性电路板和所述柔性薄膜进行弯折以贴合所述第一基板及所述显示面板的侧面。
  18. 根据权利要求12所述的显示面板，其中，所述第一玻璃基板中非显示区域的部分被切割和剥离。
  19. 根据权利要求18所述的显示面板，其中，所述第一玻璃基板中非显示区域的部分被切割和剥离为激光剥离。
  20. 根据权利要求12所述的显示面板，其中，所述显示面板还可以包括保护层，用以对弯折后的柔性薄膜和柔性电路板进行保护。
PCT/CN2019/084467 2019-03-19 2019-04-26 刚性oled显示面板的制备方法及显示面板 Ceased WO2020186602A1 (zh)

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