WO2020186516A1 - 电连接组件、电子设备及电连接组件的制备方法 - Google Patents

电连接组件、电子设备及电连接组件的制备方法 Download PDF

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Publication number
WO2020186516A1
WO2020186516A1 PCT/CN2019/079072 CN2019079072W WO2020186516A1 WO 2020186516 A1 WO2020186516 A1 WO 2020186516A1 CN 2019079072 W CN2019079072 W CN 2019079072W WO 2020186516 A1 WO2020186516 A1 WO 2020186516A1
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WIPO (PCT)
Prior art keywords
conductive
electrical connection
layer
connection assembly
stretchable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/079072
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English (en)
French (fr)
Inventor
雷晓华
张瑶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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Publication date
Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Priority to PCT/CN2019/079072 priority Critical patent/WO2020186516A1/zh
Priority to CN201980073115.4A priority patent/CN113261161A/zh
Publication of WO2020186516A1 publication Critical patent/WO2020186516A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts

Definitions

  • the present invention relates to the field of electronic technology, in particular to an electrical connection assembly, an electronic device and a preparation method of the electrical connection assembly.
  • An embodiment of the present invention provides an electrical connection component, the electrical connection component includes a flexible substrate, a stretchable conductive layer, a conductive connector, and a protective layer, the flexible substrate, the stretchable conductive layer, and the conductive connection
  • the stretchable conductive layer is electrically connected to the conductive connecting member.
  • the protective layer is located on the side of the stretchable conductive layer away from the flexible substrate.
  • the protective layer includes The first part and the second part, the first part covers the stretchable conductive layer, the second part covers the conductive connector, and the protective layer is used to improve the stretchable conductive layer and The endurance of the conductive connector when it is stretched.
  • the electrical connection assembly includes a flexible substrate, a stretchable conductive layer, a conductive connector, and a protective layer, wherein the flexible substrate, the stretchable conductive layer, and the conductive connector are stacked in sequence,
  • the protective layer is located on a side of the stretchable conductive layer away from the flexible substrate, the protective layer includes a first part and a second part connected, the first part covers the stretchable conductive layer, so The second part covers the conductive connector, and the protective layer is used to improve the tensile strength of the stretchable conductive layer and the conductive connector when stretched.
  • the protective layer can bear a part of the stretching force, which helps to improve the tensile strength of the stretchable conductive layer and the conductive connector when stretched and ensure electrical connection
  • the electrical connection relationship of the components is maintained normal, and the service life of the electrical connection components is guaranteed.
  • An embodiment of the present invention also provides an electronic device, which includes the above-mentioned electrical connection component.
  • the embodiment of the present invention also provides a method for manufacturing an electrical connection assembly, the method for manufacturing the electrical connection assembly includes:
  • a first part covering the stretchable conductive layer and a second part covering the conductive connector are formed, the first part and the second part constitute a protective layer, and the protective layer is used to improve the stretchable The resistance of the conductive layer and the conductive connection member when stretched.
  • Fig. 1 is a schematic structural diagram of a first electrical connection assembly provided by an embodiment of the present invention.
  • Fig. 2 is a schematic structural diagram of a second type of electrical connection assembly provided by an embodiment of the present invention.
  • Fig. 3 is a schematic structural diagram of a third type of electrical connection assembly provided by an embodiment of the present invention.
  • Fig. 4 is a schematic structural diagram of a fourth type of electrical connection assembly provided by an embodiment of the present invention.
  • Fig. 5 is a schematic structural diagram of a fifth electrical connection assembly provided by an embodiment of the present invention.
  • Fig. 6 is a schematic structural diagram of a sixth electrical connection assembly provided by an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of another structure of the electrical connection assembly provided in FIG. 6.
  • Fig. 8 is a schematic structural diagram of a seventh electrical connection assembly provided by an embodiment of the present invention.
  • FIG. 9 is a schematic diagram of another structure of the electrical connection assembly provided in FIG. 8.
  • Fig. 10 is a schematic structural diagram of an eighth electrical connection assembly provided by an embodiment of the present invention.
  • FIG. 11 is a schematic structural diagram of a first electronic device provided by an embodiment of the present invention.
  • FIG. 12 is a flow chart of the first method of manufacturing the electrical connection assembly provided by the embodiment of the present invention.
  • FIG. 13 is a schematic diagram of the structure corresponding to step S100 of the flowchart of the first method for manufacturing the electrical connection assembly.
  • FIG. 14 is a schematic diagram of the structure corresponding to step S200 of the flowchart of the first method of manufacturing the electrical connection assembly.
  • FIG. 15 is a schematic diagram of the structure corresponding to step S300 of the flowchart of the first method for manufacturing the electrical connection assembly.
  • Fig. 16 is a schematic structural diagram of an electrical connection assembly prepared by using the first method for preparing an electrical connection assembly.
  • Fig. 17 is a flow chart of a second method for manufacturing an electrical connection assembly provided by an embodiment of the present invention.
  • FIG. 18 is a schematic diagram of the structure corresponding to step S210 of the second method for manufacturing the electrical connection assembly.
  • FIG. 19 is a schematic diagram of the structure corresponding to step S220 of the second method for manufacturing the electrical connection assembly.
  • FIG. 20 is a flowchart of a third method for manufacturing an electrical connection assembly provided by an embodiment of the present invention.
  • FIG. 21 is a schematic diagram of the structure corresponding to step S211 of the third method for manufacturing the electrical connection assembly.
  • FIG. 22 is a schematic diagram of the structure corresponding to step S212 of the third method for manufacturing the electrical connection assembly.
  • FIG. 23 is a schematic diagram of the structure corresponding to step S213 of the third method of manufacturing the electrical connection assembly.
  • FIG. 24 is a flowchart of a fourth method for manufacturing an electrical connection assembly provided by an embodiment of the present invention.
  • FIG. 25 is a schematic diagram of the structure corresponding to step S230 of the fourth method for manufacturing an electrical connection assembly.
  • FIG. 26 is a schematic diagram of the structure corresponding to step S240 of the fourth method for manufacturing an electrical connection assembly.
  • Fig. 27 is a flowchart of a fifth method for manufacturing an electrical connection assembly provided by an embodiment of the present invention.
  • FIG. 28 is a schematic diagram of the structure corresponding to step S250 of the fifth method for manufacturing an electrical connection assembly.
  • FIG. 29 is a schematic diagram of the structure corresponding to step S260 of the fifth method for manufacturing an electrical connection assembly.
  • FIG. 30 is a schematic diagram of the structure corresponding to step S270 of the fifth method for manufacturing an electrical connection assembly.
  • FIG. 1 is a schematic structural diagram of a first electrical connection assembly provided by an embodiment of the present invention.
  • the electrical connection assembly 10 includes a flexible substrate 100, a stretchable conductive layer 200, a conductive connector 300, and a protective layer 400.
  • the flexible substrate 100, the stretchable conductive layer 200, and the conductive connector 300 are sequentially stacked Provided that the stretchable conductive layer 200 is electrically connected to the conductive connector 300, the protective layer 400 is located on the side of the stretchable conductive layer 200 away from the flexible substrate 100, and the protective layer 400 includes a first portion 410 and a second portion 420 that are connected, the first portion 410 covers the stretchable conductive layer 200, the second portion 420 covers the conductive connector 300, and the protective layer 400 is To improve the tensile strength of the stretchable conductive layer 200 and the conductive connecting member 300 when stretched.
  • the flexible substrate 100 may be an elastic base, such as high elongation silicone rubber.
  • the stretchable conductive layer 200 can be made of liquid silicone silver powder conductive ink.
  • the protective layer 400 may be an elastic packaging layer, such as silicone rubber.
  • the protective layer 400 includes a first part 410 and a second part 420 that are connected, the first part 410 covers the stretchable conductive layer 200, and the second part 420 covers the conductive connector 300.
  • the stretchable conductive layer 200 and the conductive connector 300 are stretched at the same time, due to the different material properties of the stretchable conductive layer 200 and the conductive connector 300, the stretchable conductive layer 200 and the conductive connector 300 will be out of sync Of stretching. Covering the protective layer 400 on the stretchable conductive layer 200 and the conductive connecting member 300 can bear part of the stretching force between the stretchable conductive layer 200 and the conductive connecting member 300, which helps to improve the stretchable conductive layer 200 and the conductive connecting member 300. The resistance of the conductive connecting member 300 when it is stretched can thereby maintain a stable electrical connection relationship of the electrical connection assembly 10 and ensure the service life of the electrical connection assembly 10.
  • the hardness of the protective layer 400 is greater than the hardness of the flexible substrate 100, and the stretch rate of the protective layer 400 is smaller than the stretch rate of the flexible substrate 100.
  • the protective layer 400 is made of silicone rubber with a hardness greater than 40 Shore A and the elongation at break ⁇ 300%.
  • the protective layer 400 has a relatively high hardness and a small stretch rate, when the electrical connection assembly 10 is subjected to a tensile force, the protective layer 400 can bear a part of the tensile force, thereby increasing the stretchable conductive layer 200
  • the tensile strength with the conductive connection member 300 ensures that the stretchable conductive layer 200 and the conductive connection member 300 maintain a stable electrical connection relationship, thereby ensuring the normal use of the electrical connection assembly 10.
  • the electrical connection assembly 10 provided by the embodiment of the present invention includes a flexible substrate 100, a stretchable conductive layer 200, a conductive connector 300, and a protective layer 400, wherein the flexible substrate 100, the stretchable conductive layer 200, and the The conductive connectors 300 are stacked in sequence, and the protective layer 400 is located on the side of the stretchable conductive layer 200 away from the flexible substrate 100.
  • the protective layer 400 includes a first portion 410 and a second portion 420 connected to each other. The first portion 410 covers the stretchable conductive layer 200, the second portion 420 covers the conductive connector 300, and the protective layer 400 is used to improve the stretchable conductive layer 200 and the conductive The resistance of the connecting member 300 when it is stretched.
  • the protective layer 400 can bear a part of the stretching force, thereby helping to improve the tensile strength of the stretchable conductive layer 200 and the conductive connecting member 300 when stretched. It ensures that the electrical connection relationship of the electrical connection assembly 10 is maintained normal, and the service life of the electrical connection assembly 10 is guaranteed.
  • FIG. 2 is a schematic structural diagram of a second type of electrical connection assembly according to an embodiment of the present invention.
  • the structure diagram of the second type of electrical connection assembly is basically the same as that of the first type of electrical connection assembly, except that the first part 410 and the second part 420 are directly connected.
  • the first part 410 covers the stretchable conductive layer 200
  • the second part 420 covers the conductive connector 300
  • the first part 410 is directly connected to the second part 420.
  • the end surface of the first portion 410 close to the conductive connector 300 is directly attached to the conductive connector 300.
  • the protective layer 400 is closely attached to the conductive connector 300 and covers the stretchable conductive layer 200 and the conductive connector 300, when the stretchable conductive layer 200 and the conductive connector 300 are simultaneously stretched, the protective layer 400
  • the stretchable conductive layer 200 and the conductive connecting member 300 can bear part of the stretching force, so as to reduce the amount of asynchronous stretching between the stretchable conductive layer 200 and the conductive connecting member 300, thereby avoiding stretchability.
  • the electrical connection failure of the conductive layer 200 and the conductive connection member 300 due to unsynchronized stretching helps to ensure that the stretchable conductive layer 200 and the conductive connection member 300 maintain a stable electrical connection relationship, and ensure that the electrical connection assembly 10 can Normal use.
  • FIG. 3 is a schematic structural diagram of a third type of electrical connection assembly provided by an embodiment of the present invention.
  • the structure of the third type of electrical connection assembly is basically the same as the structure of the first type of electrical connection assembly, except that the first part 410 is close to the end face of the conductive connector 300 and the conductive connector 300 There is a gap A between.
  • the protective layer 400 further includes a third portion 430 connected between the first portion 410 and the second portion 420, the first portion 410 covers the stretchable conductive layer 200, and the second portion 420 Covering the conductive connecting member 300, the third portion 430 does not cover the conductive connecting member 300, that is, there is a gap A between the third portion 430 and the stretchable conductive layer 200.
  • the gap A is used to eliminate the internal stress formed between the protective layer 400 and the stretchable conductive layer 200 and between the stretchable conductive layer 200 and the conductive connecting member 300. If the third part 430 also covers the conductive connector 300, that is to say, the protective layer 400 closely adheres to the stretchable conductive layer 200 and the conductive connector 300.
  • the stretch rates of the three materials are not the same, they will be stretched The tensile force will inevitably exhibit different degrees of tensile deformation. In other words, when subjected to the tensile force, uneven internal deformation will occur between the protective layer 400, the stretchable conductive layer 200, and the conductive connector 300. Stress. When the inside of the electrical connection assembly 10 is subjected to such internal stress for a long time, cracks may be generated under the action of the internal stress, which may lead to the problem of electrical connection failure of the electrical connection assembly 10. Therefore, when a gap A is formed between the third portion 430 and the stretchable conductive layer 200, the stretchable conductive layer 200 in the portion corresponding to the gap A can undergo normal tensile deformation without being affected by the protective layer 400.
  • the uneven internal stress generated in the electrical connection assembly 10 can be released from the stretchable conductive layer 200 in the corresponding part of the gap A, so that the electrical connection assembly 10 maintains a uniform force. , Which helps to maintain a stable electrical connection relationship of the electrical connection assembly 10, thereby ensuring the normal use of the electrical connection assembly 10.
  • FIG. 4 is a schematic structural diagram of a fourth electrical connection assembly provided by an embodiment of the present invention.
  • the structure of the fourth type of electrical connection assembly is basically the same as the structure of the first type of electrical connection assembly.
  • the conductive connector 300 includes a flexible circuit board 310 and an elastic conductive adhesive layer 320.
  • the circuit board 310 is disposed away from the stretchable conductive layer 200 relative to the elastic conductive adhesive layer 320, and the second part 420 covers the flexible circuit board 310.
  • the elastic conductive adhesive layer 320 may be liquid organic silicon silver powder conductive adhesive, room temperature vulcanized organic silicon conductive adhesive.
  • the elastic conductive adhesive layer 320 has high elasticity, conductivity and high adhesion.
  • the elastic conductive adhesive layer 320 is disposed between the flexible circuit board 310 and the stretchable conductive layer 200, and the flexible circuit board 310 and the stretchable conductive layer 200 can be bonded together.
  • the elastic conductive adhesive layer 320 can be deformed to share part of the stretching force, so that the flexible circuit board 310 and the stretchable conductive layer 200 remain stable Connect to avoid separation of the flexible circuit board 310 and the stretchable conductive layer 200.
  • the elastic conductive adhesive layer 320 itself has conductive properties, when the elastic conductive adhesive layer 320 is located between the flexible circuit board 310 and the stretchable conductive layer 200, and at the same time it is bonded to the flexible circuit board 310 and the stretchable conductive layer. At 200 hours, the flexible circuit board 310 can be connected to the stretchable conductive layer 200, that is, the function of electrically connecting the flexible circuit board 310 and the stretchable conductive layer 200 is realized.
  • the elastic conductive adhesive layer 320 covers the stretchable conductive layer 200
  • the flexible circuit board 310 covers the elastic conductive adhesive 320, that is, the flexible circuit board 310 passes through the elastic conductive adhesive layer 320 and the Electrical connections are formed between the stretched conductive layers 200. Since the stretch rates of the flexible circuit board 310 and the stretchable conductive layer 200 are different, when the flexible circuit board 310 and the stretchable conductive layer 200 are simultaneously subjected to a stretching force, the flexible circuit board 310 and the stretchable conductive layer 200 are The layer 200 will deform to varying degrees.
  • the elastic conductive adhesive layer 320 is arranged between the flexible circuit board 310 and the stretchable conductive layer 200, which can effectively coordinate the different degrees of deformation between the flexible circuit board 310 and the stretchable conductive layer 200, that is, elasticity.
  • the conductive adhesive layer 320 can compensate the deformation generated by the flexible circuit board 310 and the stretchable conductive layer 200, so that the elastic conductive adhesive layer 320 reduces the deformation between the flexible circuit board 310 and the stretchable conductive layer 200.
  • the gap makes the flexible circuit board 310 and the stretchable conductive layer 200 tend to produce synchronous tensile deformation, avoiding cracks between the flexible circuit board 310 and the stretchable conductive layer 200 due to uneven stretching. It helps to ensure a stable electrical connection relationship between the flexible circuit board 310 and the stretchable conductive layer 200, and to ensure the normal use of the electrical connection assembly 10.
  • FIG. 5 is a schematic structural diagram of a fifth electrical connection assembly according to an embodiment of the present invention.
  • the structure of the fifth type of electrical connection assembly is basically the same as that of the fourth type of electrical connection assembly. The difference is that the second part 420 has a first side surface 420a away from the first part 410.
  • the flexible circuit board 310 has a second side surface 310a away from the first portion 410, the elastic conductive adhesive layer 320 has a third side surface 320a away from the first portion 410, and the first side surface 420a is located on the second side surface 310a And the third side surface 320a.
  • the second side surface 310a protrudes from the first side surface 420a
  • the first side surface 420a protrudes from the third side surface. 320a.
  • the second part 420 of the protective layer 400 can cover more flexible circuit board 310.
  • the second part 420 of the protective layer 400 can bear part of the tensile force from the flexible circuit board 310, which can reduce the amount of deformation generated by the flexible circuit board 310, thereby improving flexibility
  • the occurrence of cracks in the circuit board 310 helps protect the flexible circuit board 310.
  • staggering the first side surface 420a, the second side surface 310a, and the third side surface 320a can effectively release the tensile stress formed between the protective layer 400, the flexible circuit board 310 and the elastic conductive adhesive layer 320. If the first side surface 420a is flush with the third side surface 320a, the position of the first side surface 420a corresponding to the flexible circuit board 310 and the position of the third side surface 320a corresponding to the flexible circuit board 310 will cause tensile stress concentration.
  • the position of the board 310 corresponding to the first side surface 420a or the third side surface 320a will generate shear stress, which easily causes the flexible circuit board 310 to crack at the position corresponding to the first side surface 420a and the third side surface 320a, thereby causing the problem of fracture. Therefore, the staggered arrangement of the first side surface 420a, the second side surface 310a, and the third side surface 320a helps to eliminate the internal stress generated between the protective layer 400, the flexible circuit board 310 and the elastic conductive adhesive layer 320, and due to the flexibility The circuit board 310 forms protection to prevent the flexible circuit board 310 from breaking due to shear stress on the flexible circuit board 310.
  • FIG. 6 is a schematic structural diagram of a sixth electrical connection assembly according to an embodiment of the present invention.
  • the structure diagram of the sixth type of electrical connection assembly is basically the same as the structure diagrams of the fourth and fifth types of electrical connection components.
  • the difference is that the elastic conductive adhesive layer 320 has a conductive body 321 and a self-conducting body.
  • An extension 322 extending from one side of the 321, the conductive body 321 is located between the stretchable conductive layer 200 and the flexible circuit board 310, the flexible circuit board 310 has a through hole 311, and the extension 322 It is received in the through hole 311.
  • the through hole 311 is a through hole
  • the through hole 311 penetrates the flexible circuit board 310
  • the extension 322 is located in the through hole 311 and abuts against the second part 420, so that the conductive body 321 and the flexible circuit board 310 form a stable electrical connection relationship.
  • the through hole 311 is a through hole
  • the extension portion 322 passes through the through hole 311 and abuts against the second portion 420, that is, the second portion 420 covers the extension portion 322, which can provide partial adhesion to the extension portion 322 Therefore, it is possible to prevent the extension portion 322 from falling off from the through hole 311, thereby ensuring that the flexible circuit board 310 and the conductive body 321 maintain a stable electrical connection relationship.
  • FIG. 7 is another schematic structural diagram of the electrical connection assembly 10 provided in FIG. 6.
  • the through hole 311 is a blind hole
  • the opening of the blind hole faces a side adjacent to the conductive body 321
  • the extension portion 322 is located in the through hole 311 so that the The conductive body 321 and the flexible circuit board 310 form a stable electrical connection relationship.
  • the through hole 311 is a blind hole, that is, the extension 322 is embedded in a part of the flexible circuit board 310, the connection strength between the flexible circuit board 310 and the conductive body 321 can be increased, and the connection between the flexible circuit board 310 and the conductive body 321 can be avoided.
  • the disconnection between the flexible circuit board 310 and the conductive body 321 ensures a stable electrical connection relationship.
  • FIG. 8 is a schematic structural diagram of a seventh electrical connection assembly according to an embodiment of the present invention.
  • the structure of the seventh type of electrical connection assembly is basically the same as the structure of the fourth type of electrical connection assembly.
  • the conductive connector 300 further includes a non-solid conductive adhesive 500, and the elastic conductive adhesive layer 320
  • the non-solid conductive adhesive 500 is received in the receiving hole 320b, and is electrically connected to the stretchable conductive layer 200 and the flexible circuit board 310 at the same time, the non-solid conductive adhesive 500 is used To repair the cracks generated during the stretching process of the stretchable conductive layer 200.
  • the non-solid conductive adhesive 500 may be a non-solid film-forming conductive adhesive such as organic silicon conductive silicone grease, conductive gel, liquid metal, etc. Or a partial mixture of it and the elastic conductive adhesive layer 320.
  • the non-solid conductive adhesive 500 has the characteristics of standing thickening and shear thinning. When standing still, the viscosity is high and the fluidity is small. When it is under pressure or stretched, the viscosity decreases and the fluidity increases. When cracks occur in the stretchable conductive layer 200, the viscosity of the non-solid conductive adhesive 500 decreases and the fluidity increases, and it can flow into the cracks of the stretchable conductive layer 200. When the non-solid conductive adhesive 500 is cured, it will be filled The cracks in the conductive layer 200 are stretched to repair the cracks.
  • the non-solid conductive adhesive 500 is electrically connected to the stretchable conductive layer 200 and the flexible circuit board 310 at the same time, so that an electrical connection relationship can be formed between the stretchable conductive layer 200 and the flexible circuit board 310 .
  • an elastic conductive adhesive layer 320 is further provided between the stretchable conductive layer 200 and the flexible circuit board 310, the elastic conductive adhesive layer 320 can form an electrical connection between the stretchable conductive layer 200 and the flexible circuit board 310.
  • at least two electrical connection paths can be formed between the stretchable conductive layer 200 and the flexible circuit board 310.
  • the board 310, the non-solid conductive adhesive 500, the elastic conductive adhesive layer 320, and the stretchable conductive layer 200 form a stable electrical connection relationship, thereby ensuring a stable electrical connection relationship of the electrical connection assembly 10, and ensuring the electrical connection assembly 10 Normal use.
  • the receiving hole 320b is a tapered hole
  • the non-solid conductive adhesive 500 has a tapered shape, which helps to promote the non-solid conductive adhesive 500 to be stretchable and conductive.
  • the non-solid conductive adhesive 500 has the characteristics of standing thickening and shear thinning. When standing still, the viscosity is high and the fluidity is small. When it is under pressure or stretched, the viscosity decreases and the fluidity increases. When cracks occur in the stretchable conductive layer 200, the viscosity of the non-solid conductive adhesive 500 decreases and the fluidity increases, and it can flow into the cracks of the stretchable conductive layer 200. When the non-solid conductive adhesive 500 is cured, it will be filled The cracks in the conductive layer 200 are stretched to repair the cracks. That is, the non-solid conductive adhesive 500 can protect the stretchable conductive layer, prevent the stretchable conductive layer 200 from cracking, and help ensure the stable electrical connection relationship of the electrical connection components.
  • FIG. 10 is a schematic structural diagram of an eighth type of electrical connection assembly according to an embodiment of the present invention.
  • the structure of the eighth type of electrical connection assembly is basically the same as the structure of the fourth type of electrical connection assembly.
  • the difference is that the conductive connector 300 also includes a non-solid conductive adhesive 500, and the elastic conductive adhesive layer 320
  • the flexible circuit board 310 has a first through hole 320c, the flexible circuit board 310 has a second through hole 310b, the second through hole 310b is connected to the first through hole 320c, and the non-solid conductive adhesive 500 is accommodated in the first through hole.
  • the non-solid conductive adhesive 500 is used to connect the stretchable conductive layer 200 Cracks generated during the stretching process are repaired.
  • the non-solid conductive adhesive 500 may be a non-solid film-forming conductive adhesive such as organic silicon conductive silicone grease, conductive gel, liquid metal, etc. Or a partial mixture of it and the elastic conductive adhesive layer 320.
  • the non-solid conductive adhesive 500 is located in the first through hole 320c and the second through hole 310b.
  • the elastic conductive adhesive layer 320 when the elastic conductive adhesive layer 320 is cracked, it can prevent the cracks generated in the elastic conductive adhesive layer 320. Repairing, on the other hand, when the flexible circuit board 310 has cracks, the cracks generated by the flexible circuit board 310 can also be repaired.
  • the non-solid conductive glue 500 is located on the surface of the stretchable conductive layer 200, when the stretchable conductive layer 200 has cracks due to stretching, the non-solid conductive glue 500 can resist the stretchable conductive layer 200. Cracks generated during the stretching process are repaired.
  • the first through hole 320c is arranged directly opposite to the second through hole 310b, and the radial size of the first through hole 320c is consistent with the radial size of the second through hole 310b. Since the first through hole 320c communicates with the second through hole 310b, the first through hole 320c and the second through hole 310b can be formed together in the preparation process, which helps to save processing steps.
  • the first through hole 320c may also be offset from the second through hole 310b, and the size of the first through hole 320c may also be the same as the size of the second through hole 310b. Inconsistent. That is, the radial dimension of the first through hole 320c is greater than the radial dimension of the second through hole 310b, or the radial dimension of the first through hole 320c is smaller than the radial dimension of the second through hole 310b .
  • FIG. 11 is a schematic structural diagram of the first electronic device 1 according to an embodiment of the present invention.
  • the electronic device 1 includes the electrical connection assembly 10 provided in any of the above embodiments.
  • the electronic device 1 may be any device with communication and storage functions.
  • tablet computers mobile phones, e-readers, remote controls, personal computers (Personal Computer, PC), notebook computers, in-vehicle devices, Internet TVs, wearable devices and other smart devices with network functions.
  • PC Personal Computer
  • the electronic device 1 is a flexible folding mobile phone as an example for description.
  • the electronic device 1 includes a middle frame 1000, a circuit board 1100 and a button 2000.
  • the button 2000 is a control button, which can be a power button, a volume button, or Buttons for other functions.
  • the electrical signal generated after the button 2000 is pressed is transmitted to the circuit board 1100 via the flexible circuit board 310, and then the circuit board 1100 implements corresponding control functions.
  • One end of the flexible circuit board 310 needs to be electrically connected to the circuit board 1100.
  • the electrical connection assembly 10 provided by the embodiment of the present invention can be used to bind one end of the flexible circuit board 310 to the circuit board 1100 to ensure Stable electrical connection within the electronic device 1.
  • FIG. 12 is a flowchart of the first method for manufacturing the electrical connection assembly 10 according to an embodiment of the present invention.
  • the preparation method of the electrical connection assembly 10 includes but is not limited to steps S100, S200, and S300.
  • the details of the steps S100, S200 and S300 are as follows.
  • the flexible substrate 100 may be an elastic base, such as high elongation silicone rubber.
  • the stretchable conductive layer 200 can be made of liquid organic silicon silver powder conductive ink.
  • the protection layer 400 may be an elastic packaging layer, such as silicone rubber.
  • the protective layer 400 includes a first part 410 and a second part 420 that are connected, the first part 410 covers the stretchable conductive layer 200, and the second part 420 covers the conductive connector 300.
  • the stretchable conductive layer 200 and the conductive connector 300 are stretched at the same time, due to the different material properties of the stretchable conductive layer 200 and the conductive connector 300, the stretchable conductive layer 200 and the conductive connector 300 will be out of sync Of stretching. Covering the protective layer 400 on the stretchable conductive layer 200 and the conductive connecting member 300 can bear part of the stretching force between the stretchable conductive layer 200 and the conductive connecting member 300, which helps to improve the stretchable conductive layer 200 and the conductive connecting member 300. The resistance of the conductive connecting member 300 when it is stretched, thereby maintaining a stable electrical connection relationship of the electrical connection assembly 10 and prolonging the service life of the electrical connection assembly 10.
  • the hardness of the protective layer 400 is greater than the hardness of the flexible substrate 100, and the stretching rate of the protective layer 400 is smaller than the stretching rate of the flexible substrate 100.
  • the protective layer 400 is made of silicone rubber with a hardness greater than 40 Shore A and the elongation at break ⁇ 300%.
  • the protective layer 400 has a relatively high hardness and a small stretch rate, when the electrical connection assembly 10 is subjected to a tensile force, the protective layer 400 can bear a part of the tensile force, thereby increasing the stretchable conductive layer 200
  • the tensile strength with the conductive connection member 300 ensures that the stretchable conductive layer 200 and the conductive connection member 300 maintain a stable electrical connection relationship, thereby ensuring the normal use of the electrical connection assembly 10.
  • the first part 410 and the second part 420 are directly connected.
  • the first part 410 covers the stretchable conductive layer 200
  • the second part 420 covers the conductive connector 300
  • the first part 410 is directly connected to the second part 420.
  • the end surface of the first portion 410 close to the conductive connector 300 is directly attached to the conductive connector 300.
  • the protective layer 400 is closely attached to the conductive connector 300 and covers the stretchable conductive layer 200 and the conductive connector 300, when the stretchable conductive layer 200 and the conductive connector 300 are simultaneously stretched, the protective layer 400
  • the stretchable conductive layer 200 and the conductive connecting member 300 can bear part of the stretching force, so as to reduce the amount of asynchronous stretching between the stretchable conductive layer 200 and the conductive connecting member 300, thereby avoiding stretchability.
  • the electrical connection failure of the conductive layer 200 and the conductive connection member 300 due to unsynchronized stretching helps to ensure that the stretchable conductive layer 200 and the conductive connection member 300 maintain a stable electrical connection relationship, and ensure that the electrical connection assembly 10 can Normal use.
  • the protective layer 400 further includes a third portion 430 connected between the first portion 410 and the second portion 420, the first portion 410 covers the stretchable conductive layer 200, and the second portion 420 Covering the conductive connecting member 300, the third portion 430 does not cover the conductive connecting member 300, that is, there is a gap A between the third portion 430 and the stretchable conductive layer 200.
  • the gap A is used to eliminate the internal stress formed between the protective layer 400 and the stretchable conductive layer 200 and between the stretchable conductive layer 200 and the conductive connecting member 300. If the third part 430 also covers the conductive connector 300, that is to say, the protective layer 400 closely adheres to the stretchable conductive layer 200 and the conductive connector 300.
  • the stretch rates of the three materials are not the same, they will be stretched The tensile force will inevitably exhibit different degrees of tensile deformation. In other words, when subjected to the tensile force, uneven internal deformation will occur between the protective layer 400, the stretchable conductive layer 200, and the conductive connector 300. Stress. When the inside of the electrical connection assembly 10 is subjected to such internal stress for a long time, cracks may be generated under the action of the internal stress, which may lead to the problem of electrical connection failure of the electrical connection assembly 10. Therefore, when a gap A is formed between the third portion 430 and the stretchable conductive layer 200, the stretchable conductive layer 200 in the portion corresponding to the gap A can undergo normal tensile deformation without being affected by the protective layer 400.
  • the uneven internal stress generated in the electrical connection assembly 10 can be released from the stretchable conductive layer 200 in the corresponding part of the gap A, so that the electrical connection assembly 10 maintains a uniform force. , Which helps to maintain a stable electrical connection relationship of the electrical connection assembly 10, thereby ensuring the normal use of the electrical connection assembly 10.
  • the conductive connection member 300 includes a flexible circuit board 310 and an elastic conductive adhesive layer 320.
  • the preparation method of the electrical connection assembly 10 further includes but is not limited to steps S210 and S220. Steps S210 and S220 are described in detail as follows.
  • the elastic conductive adhesive layer 320 may be liquid organic silicon silver powder conductive adhesive, room temperature vulcanized organic silicon conductive adhesive. Specifically, the elastic conductive adhesive layer 320 can be formed into the center and the edges of the binding area of the electrical connection assembly 10 by means of glue dispensing, printing, transfer printing, or the like.
  • S220 Form a flexible circuit board 310 covering the elastic conductive adhesive layer 320, wherein the flexible circuit board 310 is covered by the second portion 420. Refer to Figure 19.
  • the elastic conductive adhesive layer 320 covers the stretchable conductive layer 200
  • the flexible circuit board 310 covers the stretchable conductive layer 200, that is, the flexible circuit board 310 passes through the elastic conductive adhesive layer 320.
  • An electrical connection is formed with the stretchable conductive layer 200. Since the stretch rates of the flexible circuit board 310 and the stretchable conductive layer 200 are different, when the flexible circuit board 310 and the stretchable conductive layer 200 are simultaneously subjected to a stretching force, the flexible circuit board 310 and the stretchable conductive layer 200 are The layer 200 will deform to varying degrees.
  • the elastic conductive adhesive layer 320 is arranged between the flexible circuit board 310 and the stretchable conductive layer 200, which can effectively coordinate the different degrees of deformation between the flexible circuit board 310 and the stretchable conductive layer 200, that is, elasticity.
  • the conductive adhesive layer 320 can compensate the deformation generated by the flexible circuit board 310 and the stretchable conductive layer 200, so that the elastic conductive adhesive layer 320 reduces the gap between the flexible circuit board 310 and the stretchable conductive layer 200.
  • the second portion 420 has a first side surface 420a away from the first portion 410
  • the flexible circuit board 310 has a second side surface 310a away from the first portion 410
  • the conductive adhesive layer 320 has a third side surface 320a away from the first portion 410, and the first side surface 420a is located between the second side surface 310a and the third side surface 320a.
  • the second side surface 310a protrudes from the first side surface 420a
  • the first side surface 420a protrudes from the third side surface. 320a.
  • the second part 420 of the protective layer 400 can cover more flexible circuit board 310.
  • the second part 420 of the protective layer 400 can bear part of the tensile force from the flexible circuit board 310, which can reduce the amount of deformation generated by the flexible circuit board 310, thereby improving flexibility
  • the occurrence of cracks in the circuit board 310 helps protect the flexible circuit board 310.
  • staggering the first side surface 420a, the second side surface 310a, and the third side surface 320a can effectively release the tensile stress formed between the protective layer 400, the flexible circuit board 310 and the elastic conductive adhesive layer 320. If the first side surface 420a is flush with the third side surface 320a, the position of the first side surface 420a corresponding to the flexible circuit board 310 and the position of the third side surface 320a corresponding to the flexible circuit board 310 will cause tensile stress concentration.
  • the position of the board 310 corresponding to the first side surface 420a or the third side surface 320a will generate shear stress, which easily causes the flexible circuit board 310 to crack at the position corresponding to the first side surface 420a and the third side surface 320a, thereby causing the problem of fracture. Therefore, the staggered arrangement of the first side surface 420a, the second side surface 310a, and the third side surface 320a helps to eliminate the internal stress generated between the protective layer 400, the flexible circuit board 310 and the elastic conductive adhesive layer 320, and due to the flexibility The circuit board 310 forms protection to prevent the flexible circuit board 310 from breaking due to the shear stress generated on the flexible circuit board 310.
  • FIG. 20 is a flowchart of a third method for manufacturing the electrical connection assembly 10 according to an embodiment of the present invention.
  • the elastic conductive adhesive layer 320 has a conductive body 321 and an extension portion 322 extending from one side of the conductive body 321.
  • the preparation method of the electrical connection assembly 10 further includes but is not limited to steps S211, S212 and S213, the details of steps S211, S212 and S213 are as follows.
  • the conductive body 321 constitutes a part of the elastic conductive adhesive layer 320
  • the elastic conductive adhesive layer 320 may be liquid organic silicon silver powder conductive adhesive or room temperature vulcanized organic silicon conductive adhesive.
  • the elastic conductive adhesive layer 320 can be formed into the center and the edges of the binding area of the electrical connection assembly 10 by means of glue dispensing, printing, transfer printing, or the like.
  • S212 Form an extension 322 covering the conductive body 321. Refer to Figure 22.
  • the through hole 311 is a through hole
  • the through hole 311 penetrates the flexible circuit board 310
  • the extension 322 is located in the through hole 311 so that the conductive body 321 is connected to the
  • the flexible circuit boards 310 form a stable electrical connection relationship. Since the through hole 311 is a through hole, so that the extension portion 322 passes through the through hole 311, the flexible circuit board 310 can provide a part of the adhesion force to the extension portion 322, which can prevent the extension portion 322 from falling off from the through hole 311, and thus It can be ensured that the flexible circuit board 310 and the conductive body 321 maintain a stable electrical connection relationship.
  • the through hole 311 is a blind hole, the opening of the blind hole faces a side adjacent to the conductive body 321, and the extension portion 322 is located in the through hole 311 so that the The conductive body 321 and the flexible circuit board 310 form a stable electrical connection relationship. Since the through hole 311 is a blind hole, that is, the extension 322 is embedded in a part of the flexible circuit board 310, the connection strength between the flexible circuit board 310 and the conductive body 321 can be increased, and the connection between the flexible circuit board 310 and the conductive body 321 can be avoided. The disconnection between the flexible circuit board 310 and the conductive body 321 ensures a stable electrical connection relationship.
  • FIG. 24 is a flowchart of a fourth method for manufacturing the electrical connection assembly 10 according to an embodiment of the present invention.
  • the conductive connection member 300 further includes a non-solid conductive adhesive 500
  • the preparation method of the electrical connection assembly 10 further includes but is not limited to steps S230 and S240. The details of steps S230 and S240 are as follows.
  • S230 Form a non-solid conductive adhesive 500 covering the stretchable conductive layer 200, where the non-solid conductive glue 500 is used to repair cracks generated in the stretchable conductive layer 200 during the stretching process.
  • the non-solid conductive glue 500 is used to repair cracks generated in the stretchable conductive layer 200 during the stretching process.
  • the non-solid conductive adhesive 500 can be a non-solid film-forming conductive adhesive such as silicone conductive silicone grease, conductive gel, liquid metal, or a partial mixture of it and the elastic conductive adhesive layer 320; it can be dispensed, printed, or transferred.
  • the non-solid conductive glue 500 is formed into the central part of the binding area of the electrical connection assembly 10 by printing or the like.
  • S240 forming an elastic conductive adhesive layer 320 covering the stretchable conductive layer 200, wherein the elastic conductive adhesive layer 320 has a receiving hole 320b, and the non-solid conductive adhesive 500 is received in the receiving hole 320b, and The non-solid conductive adhesive 500 is electrically connected to the stretchable conductive layer 200 and the flexible circuit board 310 at the same time.
  • the elastic conductive adhesive layer 320 has a receiving hole 320b, and the non-solid conductive adhesive 500 is received in the receiving hole 320b, and The non-solid conductive adhesive 500 is electrically connected to the stretchable conductive layer 200 and the flexible circuit board 310 at the same time.
  • the non-solid conductive adhesive 500 may be a non-solid film-forming conductive adhesive such as organic silicon conductive silicone grease, conductive gel, liquid metal, etc. Or a partial mixture of it and the elastic conductive adhesive layer 320.
  • the non-solid conductive adhesive 500 is electrically connected to the stretchable conductive layer 200 and the flexible circuit board 310 at the same time, so that an electrical connection relationship can be formed between the stretchable conductive layer 200 and the flexible circuit board 310 .
  • an elastic conductive adhesive layer 320 is further provided between the stretchable conductive layer 200 and the flexible circuit board 310, the elastic conductive adhesive layer 320 can form an electrical connection between the stretchable conductive layer 200 and the flexible circuit board 310.
  • at least two electrical connection paths can be formed between the stretchable conductive layer 200 and the flexible circuit board 310.
  • the board 310, the non-solid conductive adhesive 500, the elastic conductive adhesive layer 320, and the stretchable conductive layer 200 form a stable electrical connection relationship, thereby ensuring a stable electrical connection relationship of the electrical connection assembly 10, and ensuring the electrical connection assembly 10 Normal use.
  • FIG. 27 is a flowchart of a fifth method for manufacturing the electrical connection assembly 10 according to an embodiment of the present invention.
  • the conductive connection member 300 further includes a non-solid conductive glue 500
  • the preparation method of the electrical connection assembly 10 further includes, but is not limited to, steps S250, S260, and S270. Details about steps S250, S260, and S270 The introduction is as follows.
  • the non-solid conductive adhesive 500 can be a non-solid film-forming conductive adhesive such as silicone conductive silicone grease, conductive gel, liquid metal, or a partial mixture of it and the elastic conductive adhesive layer 320; it can be dispensed, printed, or transferred.
  • the non-solid conductive glue 500 is formed into the central part of the binding area of the electrical connection assembly 10 by printing or the like.
  • S260 Form an elastic conductive adhesive layer 320 covering the stretchable conductive layer 200, wherein the elastic conductive adhesive layer 320 has a first through hole 320c, and the non-solid conductive adhesive 500 is partially received in the first through hole. Inside the hole 320c. Refer to Figure 29.
  • the elastic conductive adhesive layer 320 may be liquid organic silicon silver powder conductive adhesive, room temperature vulcanized organic silicon conductive adhesive. Specifically, the elastic conductive adhesive layer 320 can be formed into the center and the edges of the binding area of the electrical connection assembly 10 by means of glue dispensing, printing, transfer printing, or the like.
  • S270 Form a flexible circuit board 310 covering the elastic conductive adhesive layer 320, wherein the flexible circuit board 310 has a second through hole 310b, and the second through hole 310b communicates with the first through hole 320c.
  • the non-solid conductive glue 500 is partially received in the second through hole 310b, and the non-solid conductive glue 500 is electrically connected to the stretchable conductive layer 200 and the second portion 420 at the same time.
  • the non-solid conductive adhesive 500 may be a non-solid film-forming conductive adhesive such as organic silicon conductive silicone grease, conductive gel, liquid metal, etc. Or a partial mixture of it and the elastic conductive adhesive layer 320.
  • the non-solid conductive adhesive 500 is located in the first through hole 320c and the second through hole 310b.
  • the elastic conductive adhesive layer 320 when the elastic conductive adhesive layer 320 is cracked, it can prevent the cracks generated in the elastic conductive adhesive layer 320. Repairing, on the other hand, when the flexible circuit board 310 has cracks, the cracks generated by the flexible circuit board 310 can also be repaired.
  • the non-solid conductive glue 500 is located on the surface of the stretchable conductive layer 200, when the stretchable conductive layer 200 has cracks due to stretching, the non-solid conductive glue 500 can resist the stretchable conductive layer 200. Cracks generated during the stretching process are repaired.
  • the first through hole 320c is arranged directly opposite to the second through hole 310b, and the radial size of the first through hole 320c is consistent with the radial size of the second through hole 310b. Since the first through hole 320c communicates with the second through hole 310b, the first through hole 320c and the second through hole 310b can be formed together in the preparation process, which helps to save processing steps.
  • the first through hole 320c may also be offset from the second through hole 310b, and the size of the first through hole 320c may also be the same as the size of the second through hole 310b. Inconsistent. That is, the radial dimension of the first through hole 320c is greater than the radial dimension of the second through hole 310b, or the radial dimension of the first through hole 320c is smaller than the radial dimension of the second through hole 310b .

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Abstract

本发明提供一种电连接组件(10)、电子设备(1)及电连接组件的制备方法。所述电连接组件(10)包括柔性基板(100)、可拉伸导电层(200)、导电连接件(300)和保护层(400)，所述柔性基板(100)、所述可拉伸导电层(200)和所述导电连接件(300)依次层叠设置，所述可拉伸导电层(200)与所述导电连接件(300)之间电连接，所述保护层(400)位于所述可拉伸导电层(200)远离所述柔性基板(100)的一侧，所述保护层(400)包括相连的第一部分(410)和第二部分(420)，所述第一部分(410)覆盖于所述可拉伸导电层(200)，所述第二部分(420)覆盖于所述导电连接件(300)，所述保护层(400)用于提高所述可拉伸导电层(200)与所述导电连接件(300)拉伸时的承受力。

Description

电连接组件、电子设备及电连接组件的制备方法 技术领域
本发明涉及电子技术领域，尤其涉及一种电连接组件、电子设备及电连接组件的制备方法。
背景技术
为了将两个电子器件进行电连接，相关技术中，通常采用硬质连接的方式，如导线焊接、导电胶粘接或者插接等。但是针对柔性电子设备而言，由于电子设备的不同部位拉伸率不同，此时就会出现拉伸不同步的情况，容易导致电连接失效的问题。
发明内容
本发明实施例提供一种电连接组件，所述电连接组件包括柔性基板、可拉伸导电层、导电连接件和保护层，所述柔性基板、所述可拉伸导电层和所述导电连接件依次层叠设置，所述可拉伸导电层与所述导电连接件之间电连接，所述保护层位于所述可拉伸导电层远离所述柔性基板的一侧，所述保护层包括相连的第一部分和第二部分，所述第一部分覆盖于所述可拉伸导电层，所述第二部分覆盖于所述导电连接件，所述保护层用于提高所述可拉伸导电层与所述导电连接件拉伸时的承受力。
本发明实施例提供的电连接组件包括柔性基板、可拉伸导电层、导电连接件和保护层，其中，所述柔性基板、所述可拉伸导电层和所述导电连接件依次层叠设置，所述保护层位于所述可拉伸导电层远离所述柔性基板的一侧，所述保护层包括相连的第一部分和第二部分，所述第一部分覆盖于所述可拉伸导电层，所述第二部分覆盖于所述导电连接件，所述保护层用于提高所述可拉伸导电层与所述导电连接件拉伸时的承受力。当可拉伸导电层与导电连接件同时受到拉伸作用时，保护层可以承担一部分拉伸力，从而有助于提高可拉伸导电层与导电连接件拉伸时的承受力，确保电连接组件的电连接关系维持正常，且保证电连接组件的使用寿命。
本发明实施例还提供一种电子设备，所述电子设备包括如上所述的电连接组件。
本发明实施例还提供一种电连接组件的制备方法，所述电连接组件的制备方法包括：
提供柔性基板；
依次形成覆盖所述柔性基板的可拉伸导电层以及导电连接件；
形成覆盖所述可拉伸导电层的第一部分以及覆盖所述导电连接件的第二部分，所述第一部分和所述第二部分构成保护层，所述保护层用于提高所述可拉伸导电层与所述导电连接件拉伸时的承受力。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例提供的第一种电连接组件的结构示意图。
图2是本发明实施例提供的第二种电连接组件的结构示意图。
图3是本发明实施例提供的第三种电连接组件的结构示意图。
图4是本发明实施例提供的第四种电连接组件的结构示意图。
图5是本发明实施例提供的第五种电连接组件的结构示意图。
图6是本发明实施例提供的第六种电连接组件的结构示意图。
图7是图6提供的电连接组件的另一种结构示意图。
图8是本发明实施例提供的第七种电连接组件的结构示意图。
图9是图8提供的电连接组件的另一种结构示意图。
图10是本发明实施例提供的第八种电连接组件的结构示意图。
图11是本发明实施例提供的第一种电子设备的结构示意图。
图12是本发明实施例提供的第一种电连接组件的制备方法的流程图。
图13是第一种电连接组件的制备方法的流程图的步骤S100对应的结构示意图。
图14是第一种电连接组件的制备方法的流程图的步骤S200对应的结构示意图。
图15是第一种电连接组件的制备方法的流程图的步骤S300对应的结构示意图。
图16是采用第一种电连接组件的制备方法制备出的一种电连接组件的结构示意图。
图17是本发明实施例提供的第二种电连接组件的制备方法的流程图。
图18是第二种电连接组件的制备方法的步骤S210对应的结构示意图。
图19是第二种电连接组件的制备方法的步骤S220对应的结构示意图。
图20是本发明实施例提供的第三种电连接组件的制备方法的流程图。
图21是第三种电连接组件的制备方法的步骤S211对应的结构示意图。
图22是第三种电连接组件的制备方法的步骤S212对应的结构示意图。
图23是第三种电连接组件的制备方法的步骤S213对应的结构示意图。
图24是本发明实施例提供的第四种电连接组件的制备方法的流程图。
图25是第四种电连接组件的制备方法的步骤S230对应的结构示意图。
图26是第四种电连接组件的制备方法的步骤S240对应的结构示意图。
图27是本发明实施例提供的第五种电连接组件的制备方法的流程图。
图28是第五种电连接组件的制备方法的步骤S250对应的结构示意图。
图29是第五种电连接组件的制备方法的步骤S260对应的结构示意图。
图30是第五种电连接组件的制备方法的步骤S270对应的结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1，图1是本发明实施例提供的第一种电连接组件的结构示意图。所述电连接组件10包括柔性基板100、可拉伸导电层200、导电连接件300和保护层400，所述柔性基板100、所述可拉伸导电层200和所述导电连接件300依次层叠设置，所述可拉伸导电层200与所述导电连接件300之间电连接，所述保护层400位于所述可拉伸导电层200远离所述柔性基板100的一侧，所述保护层400包括相连的第一部分410和第二部分420，所述第一部分410覆盖于所述可拉伸导电层200，所述第二部分420覆盖于所述导电连接件300，所述保护层400用于提高所述可拉伸导电层200与所述导电连接件300拉伸时的承受力。
其中，所述柔性基板100可以为弹性基底，如高延伸率有机硅橡胶。所述可拉伸导电层200可以为液体有机硅银粉导电油墨制备而成。所述保护层400可以为弹性封装层，如有机硅橡胶。
所述保护层400包括相连的第一部分410和第二部分420，所述第一部分410覆盖于所述可拉伸导电层200，所述第二部分420覆盖于所述导电连接件300。当可拉伸导电层200和导电连接件300同时受到拉伸时，由于可拉伸导电层200和导电连接件300的材料特性不同，可拉伸导电层200和导电连接件300会产生不同步的拉伸。将保护层400覆盖于可拉伸导电层200以及导电连接件300，可以承担可拉伸导电层200和导电连接件300之间的部分拉伸力，有助于提高可拉伸导电层200与导电连接件300拉伸时的承受力，进而维持电连接组件10稳定的电连接关系，保证电连接组件10的使用寿命。
在一实施方式中，所述保护层400的硬度大于所述柔性基板100的硬度，且所述保护层 400的拉伸率小于所述柔性基板100的拉伸率。例如，当柔性基板100的硬度为30邵氏A，断裂延伸率为500％时，则保护层400采用硬度大于40邵氏A，断裂延伸率<300％的有机硅橡胶。由于保护层400具有较高的硬度，且具有较小的拉伸率，因此，当电连接组件10受到拉力作用时，保护层400可以承受部分拉伸力，从而可以提高可拉伸导电层200与导电连接件300拉伸时的承受力，确保可拉伸导电层200与导电连接件300之间保持稳定的电连接关系，进而保证电连接组件10的正常使用。
本发明实施例提供的电连接组件10包括柔性基板100、可拉伸导电层200、导电连接件300和保护层400，其中，所述柔性基板100、所述可拉伸导电层200和所述导电连接件300依次层叠设置，所述保护层400位于所述可拉伸导电层200远离所述柔性基板100的一侧，所述保护层400包括相连的第一部分410和第二部分420，所述第一部分410覆盖于所述可拉伸导电层200，所述第二部分420覆盖于所述导电连接件300，所述保护层400用于提高所述可拉伸导电层200与所述导电连接件300拉伸时的承受力。当可拉伸导电层200与导电连接件300同时受到拉伸作用时，保护层400可以承担一部分拉伸力，从而有助于提高可拉伸导电层200与导电连接件300拉伸时的承受力，确保电连接组件10的电连接关系维持正常，且保证电连接组件10的使用寿命。
请继续参阅图2，图2是本发明实施例提供的第二种电连接组件的结构示意图。第二种电连接组件的结构示意图与第一种电连接组件的结构示意图的结构基本相同，不同之处在于，所述第一部分410与所述第二部分420直接相连。
具体的，在本实施例中，第一部分410覆盖可拉伸导电层200，第二部分420覆盖导电连接件300，且第一部分410直接相连于第二部分420。此时，第一部分410靠近导电连接件300的端面与导电连接件300直接贴合。由于保护层400紧密贴合于导电连接件300，且覆盖于可拉伸导电层200以及导电连接件300，当可拉伸导电层200与导电连接件300同时受到拉伸作用时，保护层400可以为可拉伸导电层200以及导电连接件300承担部分拉伸力，以减小可拉伸导电层200以及导电连接件300之间产生的不同步的拉伸量，从而可以避免可拉伸导电层200与导电连接件300由于拉伸不同步导致电连接失效的情况，有助于确保可拉伸导电层200与导电连接件300之间维持稳定的电连接关系，确保电连接组件10可以正常使用。
请继续参阅图3，图3是本发明实施例提供的第三种电连接组件的结构示意图。第三种电连接组件的结构示意图与第一种电连接组件的结构示意图的结构基本相同，不同之处在于，所述第一部分410靠近所述导电连接件300的端面与所述导电连接件300之间具有间隙A。
具体的，在本实施例中，所述保护层400还包括连接于第一部分410和第二部分420之间的第三部分430，第一部分410覆盖于可拉伸导电层200，第二部分420覆盖于导电连接件300，第三部分430未覆盖导电连接件300，即第三部分430与可拉伸导电层200之间具有间隙A。所述间隙A用于消除所述保护层400与所述可拉伸导电层200以及所述可拉伸导电层200与所述导电连接件300之间形成的内应力。假如第三部分430也覆盖导电连接件300，也就是说保护层400紧密贴合于可拉伸导电层200以及导电连接件300，由于三者材料的拉伸率均不相同，那么在受到拉伸力的作用时必然会表现出不同程度的拉伸形变，换言之，在受到拉伸力的作用时，保护层400、可拉伸导电层200以及导电连接件300之间会产生不均匀的内应力，当电连接组件10的内部长期受到这种内应力的作用时就可能会在内应力的作用下产生裂纹，进而导致电连接组件10出现电连接失效的问题。因此，当第三部分430与可拉伸导电层200之间形成间隙A时，所述间隙A对应部分的可拉伸导电层200可以产生正常的拉伸形变，不会受到保护层400的第三部分430的干扰，那么电连接组件10内部产生的不均匀的内应力就可以从所述间隙A对应部分的可拉伸导电层200处释放出 去，使得电连接组件10内部保持均匀的受力，有助于使得电连接组件10维持稳定的电连接关系，进而保证电连接组件10的正常使用。
请继续参阅图4，图4是本发明实施例提供的第四种电连接组件的结构示意图。第四种电连接组件的结构示意图与第一种电连接组件的结构示意图的结构基本相同，不同之处在于，所述导电连接件300包括柔性电路板310和弹性导电胶层320，所述柔性电路板310相对于所述弹性导电胶层320远离所述可拉伸导电层200设置，所述第二部分420覆盖于所述柔性电路板310。
其中，弹性导电胶层320可以为液体有机硅银粉导电胶，室温硫化有机硅导电胶。弹性导电胶层320具有高弹性、导电性和高粘接性。将弹性导电胶层320设置在柔性电路板310与可拉伸导电层200之间，可以将柔性电路板310和可拉伸导电层200粘接在一起。当柔性电路板310和可拉伸导电层200产生不同步的拉伸时，弹性导电胶层320可产生形变以分担部分拉伸力，使得柔性电路板310和可拉伸导电层200保持稳定的连接，避免柔性电路板310和可拉伸导电层200出现分离。进一步的，由于弹性导电胶层320本身具有导电性能，当弹性导电胶层320位于柔性电路板310与可拉伸导电层200之间，且同时粘接与柔性电路板310与可拉伸导电层200时，可以使得柔性电路板310与可拉伸导电层200的导通，即实现了将柔性电路板310与可拉伸导电层200进行电连接的功能。
具体的，在本实施例中，弹性导电胶层320覆盖于可拉伸导电层200上，然后柔性电路板310覆盖于弹性导电胶320上，即柔性电路板310通过弹性导电胶层320与可拉伸导电层200之间形成电连接。由于柔性电路板310与可拉伸导电层200二者的拉伸率不同，当柔性电路板310和可拉伸导电层200同时受到拉伸力的作用时，柔性电路板310和可拉伸导电层200会产生不同程度的形变。将弹性导电胶层320设置在柔性电路板310和可拉伸导电层200之间，可以有效的协调好柔性电路板310与可拉伸导电层200之间产生的不同程度的形变量，即弹性导电胶层320可以对柔性电路板310以及可拉伸导电层200产生的形变量产生补偿作用，使得弹性导电胶层320减小柔性电路板310与可拉伸导电层200之间产生形变量的差距，进而使得柔性电路板310与可拉伸导电层200趋向于产生同步的拉伸形变，避免柔性电路板310与可拉伸导电层200之间由于不均匀的拉伸作用而产生裂纹，有助于保证柔性电路板310与可拉伸导电层200之间产生稳定的电连接关系，且保证电连接组件10的正常使用。
请继续参阅图5，图5是本发明实施例提供的第五种电连接组件的结构示意图。第五种电连接组件的结构示意图与第四种电连接组件的结构示意图的结构基本相同，不同之处在于，所述第二部分420具有远离所述第一部分410的第一侧面420a，所述柔性电路板310具有远离所述第一部分410的第二侧面310a，所述弹性导电胶层320具有远离所述第一部分410的第三侧面320a，所述第一侧面420a位于所述第二侧面310a和所述第三侧面320a之间。
具体的，在本实施例中，当第一侧面420a位于第二侧面310a与第三侧面320a之间时，第二侧面310a凸出于第一侧面420a，第一侧面420a凸出于第三侧面320a。此时可以便于柔性电路板310的第二侧面310a与其他功能器件的控制按钮之间形成电连接。且当第一侧面420a凸出于第三侧面320a时，可以使得保护层400的第二部分420覆盖更多的柔性电路板310。当柔性电路板310受到外部拉伸力的作用时，保护层400的第二部分420可以承受来自柔性电路板310的部分拉伸力，可以减小柔性电路板310产生的形变量，进而改善柔性电路板310产生裂纹的情况，有助于对柔性电路板310形成保护。
进一步的，将第一侧面420a、第二侧面310a和第三侧面320a错开设置，可以有效的将保护层400、柔性电路板310和弹性导电胶层320之间形成的拉伸应力释放。假如第一侧面420a与第三侧面320a平齐，那么第一侧面420a对应柔性电路板310的部位以及第三侧面320a对应柔性电路板310的部位就会产生拉伸应力集中的现象，对柔性电路板310对应第 一侧面420a或者第三侧面320a的位置就会产生剪应力的作用，容易导致柔性电路板310在对应第一侧面420a以及第三侧面320a的位置产生裂纹，进而产生断裂的问题。因此，将第一侧面420a、第二侧面310a和第三侧面320a错开排布，有助于消除保护层400、柔性电路板310和弹性导电胶层320之间产生的内应力，且由于对柔性电路板310形成保护，避免在柔性电路板310上产生剪应力的作用导致柔性电路板310发生断裂的情况。
请继续参阅图6，图6是本发明实施例提供的第六种电连接组件的结构示意图。第六种电连接组件的结构示意图与第四种以及第五种电连接组件的结构示意图的结构基本相同，不同之处在于，所述弹性导电胶层320具有导电本体321和自所述导电本体321一侧延伸出来的延伸部322，所述导电本体321位于所述可拉伸导电层200和所述柔性电路板310之间，所述柔性电路板310具有贯孔311，所述延伸部322收容于所述贯孔311内。
在一实施方式中，所述贯孔311为通孔，所述贯孔311贯穿所述柔性电路板310，所述延伸部322位于所述贯孔311内，且抵接于所述第二部分420，以使得所述导电本体321与所述柔性电路板310之间形成稳定的电连接关系。由于所述贯孔311为通孔，使得延伸部322穿过所述贯孔311抵接于第二部分420，即第二部分420覆盖于延伸部322，可以对延伸部322提供部分粘结力，可以避免延伸部322从贯孔311中脱落，进而可以保证柔性电路板310与导电本体321之间维持稳定的电连接关系。
请继续参阅图7，图7是图6提供的电连接组件10的另一种结构示意图。在另一实施方式中，所述贯孔311为盲孔，所述盲孔的开口朝向邻近所述导电本体321的一侧，所述延伸部322位于所述贯孔311内，以使得所述导电本体321与所述柔性电路板310之间形成稳定的电连接关系。由于所述贯孔311为盲孔，即延伸部322内嵌于部分柔性电路板310内，可以增加柔性电路板310与导电本体321之间的连接强度，避免柔性电路板310与导电本体321之间脱离连接，保证柔性电路板310与导电本体321之间形成稳定的电连接关系。
请继续参阅图8，图8是本发明实施例提供的第七种电连接组件的结构示意图。第七种电连接组件的结构示意图与第四种电连接组件的结构示意图的结构基本相同，不同之处在于，所述导电连接件300还包括非固态导电胶500，所述弹性导电胶层320具有收容孔320b，所述非固态导电胶500收容于所述收容孔320b内，且同时电连接于所述可拉伸导电层200和所述柔性电路板310，所述非固态导电胶500用于对所述可拉伸导电层200在拉伸过程中产生的裂纹进行修复。
其中，非固态导电胶500可以为有机硅导电硅脂、导电凝胶、液态金属等非固态成膜导电胶。或是其与弹性导电胶层320的部分混合物。非固态导电胶500具有静置增稠和剪切变稀的特性。在静置的时候，粘度大，流动性小，在受到压力或者被拉伸时，粘度变小，流动性增加。当可拉伸导电层200产生裂纹时，非固态导电胶500粘度变小，流动性增加，进而可以流动至可拉伸导电层200的裂纹中，当非固态导电胶500固化后会填充于可拉伸导电层200的裂纹中，进而对裂纹进行修复。
具体的，在本实施例中，非固态导电胶500同时电连接于可拉伸导电层200和柔性电路板310，从而可以在可拉伸导电层200和柔性电路板310之间形成电连接关系。此外，由于可拉伸导电层200和柔性电路板310之间还设置有弹性导电胶层320，弹性导电胶层320又可以在可拉伸导电层200和柔性电路板310之间形成电连接关系。也就是说，由于非固态导电胶500以及弹性导电胶层320的存在，可以在可拉伸导电层200和柔性电路板310之间形成至少两条电连接的通路。且由于非固态导电胶500位于弹性导电胶层320形成的收容孔320b内，使得非固态导电胶500与弹性导电胶层320之间又形成的稳定的电连接关系，因此，就可以使得柔性电路板310、非固态导电胶500、弹性导电胶层320和可拉伸导电层200四者之间形成稳定的电连接关系，进而保证电连接组件10稳定的电连接关系，保证电连接组件10的正常使用。
请继续参阅图9，在一种可能的实施方式中，所述收容孔320b为锥形孔，所述非固态导电胶500呈现锥形，有助于促进非固态导电胶500朝向可拉伸导电层200流动，
非固态导电胶500具有静置增稠和剪切变稀的特性。在静置的时候，粘度大，流动性小，在受到压力或者被拉伸时，粘度变小，流动性增加。当可拉伸导电层200产生裂纹时，非固态导电胶500粘度变小，流动性增加，进而可以流动至可拉伸导电层200的裂纹中，当非固态导电胶500固化后会填充于可拉伸导电层200的裂纹中，进而对裂纹进行修复。即非固态导电胶500可以对可拉伸导电层形成保护，防止可拉伸导电层200产生裂纹，有助于保证电连接组件稳定的电连接关系。
请继续参阅图10，图10是本发明实施例提供的第八种电连接组件的结构示意图。第八种电连接组件的结构示意图与第四种电连接组件的结构示意图的结构基本相同，不同之处在于，所述导电连接件300还包括非固态导电胶500，所述弹性导电胶层320具有第一通孔320c，所述柔性电路板310具有第二通孔310b，所述第二通孔310b连通所述第一通孔320c，所述非固态导电胶500收容于所述第一通孔320c以及所述第二通孔310b内，且同时连接于所述可拉伸导电层200和所述第二部分420，所述非固态导电胶500用于对所述可拉伸导电层200在拉伸过程中产生的裂纹进行修复。
其中，非固态导电胶500可以为有机硅导电硅脂、导电凝胶、液态金属等非固态成膜导电胶。或是其与弹性导电胶层320的部分混合物。
具体的，在本实施例中，非固态导电胶500位于第一通孔320c和第二通孔310b内，一方面当弹性导电胶层320产生裂纹时，可以对弹性导电胶层320产生的裂纹进行修复，另一方面当柔性电路板310产生裂纹时，还可以对柔性电路板310产生的裂纹进行修复。此外，由于非固态导电胶500位于可拉伸导电层200的表面，因此，当可拉伸导电层200由于拉伸作用而产生裂纹时，非固态导电胶500可以对可拉伸导电层200在拉伸过程中产生的裂纹进行修复。
在一实施方式中，所述第一通孔320c正对所述第二通孔310b设置，且第一通孔320c的径向尺寸与第二通孔310b的径向尺寸大小保持一致。由于第一通孔320c连通第二通孔310b，因此，可以在制备工艺中一并形成第一通孔320c和第二通孔310b，有助于节省加工工序。
可以理解的，在其他实施方式中，所述第一通孔320c也可以偏离所述第二通孔310b设置，且所述第一通孔320c的大小也可以与第二通孔310b的大小保持不一致。即所述第一通孔320c的径向尺寸大于所述第二通孔310b的径向尺寸，或者，所述第一通孔320c的径向尺寸小于所述第二通孔310b的径向尺寸。
请继续参阅图11，图11是本发明实施例提供的第一种电子设备1的结构示意图。所述电子设备1包括如上任意实施例提供的电连接组件10。
其中，所述电子设备1可以是任何具备通信和存储功能的设备。例如：平板电脑、手机、电子阅读器、遥控器、个人计算机(Personal Computer，PC)、笔记本电脑、车载设备、网络电视、可穿戴设备等具有网络功能的智能设备。
具体的，以电子设备1为柔性折叠手机为例进行说明，电子设备1包括中框1000、电路板1100和按键2000，按键2000为控制按钮，可以为电源键，也可以为音量键，还可以为其他的功能按键。按键2000被按压后产生的电信号经由柔性电路板310传递至电路板1100，然后由电路板1100实现相应的控制功能。柔性电路板310的一端需要与电路板1100之间进行电连接，此时就可以采用本发明实施例提供的电连接组件10，将柔性电路板310的一端与电路板1100进行绑定，以确保电子设备1内部稳定的电连接关系。
请继续参阅图12，图12是本发明实施例提供的第一种电连接组件10的制备方法的流程图。所述电连接组件10的制备方法包括但不限于步骤S100、S200和S300，关于步骤S100、 S200和S300的详细介绍如下。
S100：提供柔性基板100。请参阅图13。
其中，所述柔性基板100可以为弹性基底，如高延伸率有机硅橡胶。
S200：依次形成覆盖所述柔性基板100的可拉伸导电层200以及导电连接件300。请参阅图14。
其中，所述可拉伸导电层200可以为液体有机硅银粉导电油墨制备而成。
S300：形成覆盖所述可拉伸导电层200的第一部分410以及覆盖所述导电连接件300的第二部分420，所述第一部分410和所述第二部分420构成保护层400，所述保护层400用于提高所述可拉伸导电层200与所述导电连接件300拉伸时的承受力。请参阅图15。
其中，所述保护层400可以为弹性封装层，如有机硅橡胶。
所述保护层400包括相连的第一部分410和第二部分420，所述第一部分410覆盖于所述可拉伸导电层200，所述第二部分420覆盖于所述导电连接件300。当可拉伸导电层200和导电连接件300同时受到拉伸时，由于可拉伸导电层200和导电连接件300的材料特性不同，可拉伸导电层200和导电连接件300会产生不同步的拉伸。将保护层400覆盖于可拉伸导电层200以及导电连接件300，可以承担可拉伸导电层200和导电连接件300之间的部分拉伸力，有助于提高可拉伸导电层200与导电连接件300拉伸时的承受力，进而维持电连接组件10稳定的电连接关系，延长电连接组件10的使用寿命。
其中，所述保护层400的硬度大于所述柔性基板100的硬度，且所述保护层400的拉伸率小于所述柔性基板100的拉伸率。例如，当柔性基板100的硬度为30邵氏A，断裂延伸率为500％时，则保护层400采用硬度大于40邵氏A，断裂延伸率<300％的有机硅橡胶。由于保护层400具有较高的硬度，且具有较小的拉伸率，因此，当电连接组件10受到拉力作用时，保护层400可以承受部分拉伸力，从而可以提高可拉伸导电层200与导电连接件300拉伸时的承受力，确保可拉伸导电层200与导电连接件300之间保持稳定的电连接关系，进而保证电连接组件10的正常使用。
在一种实施方式中，所述第一部分410与所述第二部分420直接相连。
具体的，在本实施例中，第一部分410覆盖可拉伸导电层200，第二部分420覆盖导电连接件300，且第一部分410直接相连于第二部分420。此时，第一部分410靠近导电连接件300的端面与导电连接件300直接贴合。由于保护层400紧密贴合于导电连接件300，且覆盖于可拉伸导电层200以及导电连接件300，当可拉伸导电层200与导电连接件300同时受到拉伸作用时，保护层400可以为可拉伸导电层200以及导电连接件300承担部分拉伸力，以减小可拉伸导电层200以及导电连接件300之间产生的不同步的拉伸量，从而可以避免可拉伸导电层200与导电连接件300由于拉伸不同步导致电连接失效的情况，有助于确保可拉伸导电层200与导电连接件300之间维持稳定的电连接关系，确保电连接组件10可以正常使用。
请继续参阅图16，在另一种实施方式中，所述第一部分410靠近所述导电连接件300的端面与所述导电连接件300之间具有间隙A。
具体的，在本实施例中，所述保护层400还包括连接于第一部分410和第二部分420之间的第三部分430，第一部分410覆盖于可拉伸导电层200，第二部分420覆盖于导电连接件300，第三部分430未覆盖导电连接件300，即第三部分430与可拉伸导电层200之间具有间隙A。所述间隙A用于消除所述保护层400与所述可拉伸导电层200以及所述可拉伸导电层200与所述导电连接件300之间形成的内应力。假如第三部分430也覆盖导电连接件300，也就是说保护层400紧密贴合于可拉伸导电层200以及导电连接件300，由于三者材料的拉伸率均不相同，那么在受到拉伸力的作用时必然会表现出不同程度的拉伸形变，换言之，在受到拉伸力的作用时，保护层400、可拉伸导电层200以及导电连接件300之间会 产生不均匀的内应力，当电连接组件10的内部长期受到这种内应力的作用时就可能会在内应力的作用下产生裂纹，进而导致电连接组件10出现电连接失效的问题。因此，当第三部分430与可拉伸导电层200之间形成间隙A时，所述间隙A对应部分的可拉伸导电层200可以产生正常的拉伸形变，不会受到保护层400的第三部分430的干扰，那么电连接组件10内部产生的不均匀的内应力就可以从所述间隙A对应部分的可拉伸导电层200处释放出去，使得电连接组件10内部保持均匀的受力，有助于使得电连接组件10维持稳定的电连接关系，进而保证电连接组件10的正常使用。
请继续参阅图17，图17是本发明实施例提供的第二种电连接组件10的制备方法的流程图。在本实施例中，所述导电连接件300包括柔性电路板310和弹性导电胶层320，所述电连接组件10的制备方法还包括但不限于步骤S210和S220，关于步骤S210和S220详细介绍如下。
S210：形成覆盖所述可拉伸导电层200的弹性导电胶层320。请参阅图18。
其中，弹性导电胶层320可以为液体有机硅银粉导电胶，室温硫化有机硅导电胶。具体的，可通过点胶、印刷、转印等方式将弹性导电胶层320形成电连接组件10的绑定区的中心以及边缘。
S220：形成覆盖所述弹性导电胶层320的柔性电路板310，其中，所述柔性电路板310被所述第二部分420覆盖。请参阅图19。
具体的，在本实施例中，弹性导电胶层320覆盖于可拉伸导电层200上，然后柔性电路板310覆盖于可拉伸导电层200上，即柔性电路板310通过弹性导电胶层320与可拉伸导电层200之间形成电连接。由于柔性电路板310与可拉伸导电层200二者的拉伸率不同，当柔性电路板310和可拉伸导电层200同时受到拉伸力的作用时，柔性电路板310和可拉伸导电层200会产生不同程度的形变。将弹性导电胶层320设置在柔性电路板310和可拉伸导电层200之间，可以有效的协调好柔性电路板310与可拉伸导电层200之间产生的不同程度的形变量，即弹性导电胶层320可以对柔性电路板310以及可拉伸导电层200产生的形变量进行补偿，使得弹性导电胶层320减小柔性电路板310与可拉伸导电层200之间产生形变量的差距，进而使得柔性电路板310与可拉伸导电层200趋向于产生同步的拉伸形变，避免柔性电路板310与可拉伸导电层200之间由于不均匀的拉伸作用而产生裂纹，有助于柔性电路板310与可拉伸导电层200之间产生稳定的电连接关系，且保证电连接组件10的正常使用。
在一种可能的实施例中，所述第二部分420具有远离所述第一部分410的第一侧面420a，所述柔性电路板310具有远离所述第一部分410的第二侧面310a，所述弹性导电胶层320具有远离所述第一部分410的第三侧面320a，所述第一侧面420a位于所述第二侧面310a和所述第三侧面320a之间。
具体的，在本实施例中，当第一侧面420a位于第二侧面310a与第三侧面320a之间时，第二侧面310a凸出于第一侧面420a，第一侧面420a凸出于第三侧面320a。此时可以便于柔性电路板310的第二侧面310a与其他功能器件的控制按钮之间形成电连接。且当第一侧面420a凸出于第三侧面320a时，可以使得保护层400的第二部分420覆盖更多的柔性电路板310。当柔性电路板310受到外部拉伸力的作用时，保护层400的第二部分420可以承受来自柔性电路板310的部分拉伸力，可以减小柔性电路板310产生的形变量，进而改善柔性电路板310产生裂纹的情况，有助于对柔性电路板310形成保护。
进一步的，将第一侧面420a、第二侧面310a和第三侧面320a错开设置，可以有效的将保护层400、柔性电路板310和弹性导电胶层320之间形成的拉伸应力释放。假如第一侧面420a与第三侧面320a平齐，那么第一侧面420a对应柔性电路板310的部位以及第三侧面320a对应柔性电路板310的部位就会产生拉伸应力集中的现象，对柔性电路板310对应第一侧面420a或者第三侧面320a的位置就会产生剪应力的作用，容易导致柔性电路板310在 对应第一侧面420a以及第三侧面320a的位置产生裂纹，进而产生断裂的问题。因此，将第一侧面420a、第二侧面310a和第三侧面320a错开排布，有助于消除保护层400、柔性电路板310和弹性导电胶层320之间产生的内应力，且由于对柔性电路板310形成保护，避免在柔性电路板310上产生的剪应力导致柔性电路板310发生断裂的情况。
请继续参阅图20，图20是本发明实施例提供的第三种电连接组件10的制备方法的流程图。在本实施例中，所述弹性导电胶层320具有导电本体321和自所述导电本体321一侧延伸出来的延伸部322，所述电连接组件10的制备方法还包括但不限于步骤S211、S212和S213，关于步骤S211、S212和S213的详细介绍如下。
S211：形成覆盖所述可拉伸导电层200的导电本体321。请参阅图21。
其中，导电本体321构成弹性导电胶层320的一部分，弹性导电胶层320可以为液体有机硅银粉导电胶，室温硫化有机硅导电胶。具体的，可通过点胶、印刷、转印等方式将弹性导电胶层320形成电连接组件10的绑定区的中心以及边缘。
S212：形成覆盖所述导电本体321的延伸部322。请参阅图22。
S213：形成覆盖所述导电本体321的柔性电路板310，所述柔性电路板310具有贯孔311，所述延伸部322收容于所述贯孔311内。请参阅图23。
在一实施方式中，所述贯孔311为通孔，所述贯孔311贯穿所述柔性电路板310，所述延伸部322位于所述贯孔311内，以使得所述导电本体321与所述柔性电路板310之间形成稳定的电连接关系。由于所述贯孔311为通孔，使得延伸部322穿过所述贯孔311，柔性电路板310可以对延伸部322提供部分粘结力，可以避免延伸部322从贯孔311中脱落，进而可以保证柔性电路板310与导电本体321之间维持稳定的电连接关系。
在另一实施方式中，所述贯孔311为盲孔，所述盲孔的开口朝向邻近所述导电本体321的一侧，所述延伸部322位于所述贯孔311内，以使得所述导电本体321与所述柔性电路板310之间形成稳定的电连接关系。由于所述贯孔311为盲孔，即延伸部322内嵌于部分柔性电路板310内，可以增加柔性电路板310与导电本体321之间的连接强度，避免柔性电路板310与导电本体321之间脱离连接，保证柔性电路板310与导电本体321之间形成稳定的电连接关系。
请继续参阅图24，图24是本发明实施例提供的第四种电连接组件10的制备方法的流程图。在本实施例中，所述导电连接件300还包括非固态导电胶500，所述电连接组件10的制备方法还包括但不限于步骤S230和S240，关于步骤S230和S240的详细介绍如下。
S230：形成覆盖所述可拉伸导电层200的非固态导电胶500，所述非固态导电胶500用于对所述可拉伸导电层200在拉伸过程中产生的裂纹进行修复。请参阅图25。
其中，非固态导电胶500可为有机硅导电硅脂、导电凝胶、液态金属等非固态成膜导电胶；或是其与弹性导电胶层320的部分混合物；可通过点胶、印刷、转印等方式将非固态导电胶500形成电连接组件10的绑定区的中心部分。
S240：形成覆盖所述可拉伸导电层200的弹性导电胶层320，其中，所述弹性导电胶层320具有收容孔320b，所述非固态导电胶500收容于所述收容孔320b内，且所述非固态导电胶500同时电连接于所述可拉伸导电层200和所述柔性电路板310。请参阅图26。
其中，非固态导电胶500可以为有机硅导电硅脂、导电凝胶、液态金属等非固态成膜导电胶。或是其与弹性导电胶层320的部分混合物。
具体的，在本实施例中，非固态导电胶500同时电连接于可拉伸导电层200和柔性电路板310，从而可以在可拉伸导电层200和柔性电路板310之间形成电连接关系。此外，由于可拉伸导电层200和柔性电路板310之间还设置有弹性导电胶层320，弹性导电胶层320又可以在可拉伸导电层200和柔性电路板310之间形成电连接关系。也就是说，由于非固态导电胶500以及弹性导电胶层320的存在，可以在可拉伸导电层200和柔性电路板310之间形 成至少两条电连接的通路。且由于非固态导电胶500位于弹性导电胶层320形成的收容孔320b内，使得非固态导电胶500与弹性导电胶层320之间又形成的稳定的电连接关系，因此，就可以使得柔性电路板310、非固态导电胶500、弹性导电胶层320和可拉伸导电层200四者之间形成稳定的电连接关系，进而保证电连接组件10稳定的电连接关系，保证电连接组件10的正常使用。
请继续参阅图27，图27是本发明实施例提供的第五种电连接组件10的制备方法的流程图。在本实施例中，所述导电连接件300还包括非固态导电胶500，所述电连接组件10的制备方法还包括但不限于步骤S250、S260和S270，关于步骤S250、S260和S270的详细介绍如下。
S250：形成覆盖所述可拉伸导电层200的非固态导电胶500，所述非固态导电胶500用于对所述可拉伸导电层200在拉伸过程中产生的裂纹进行修复。请参阅图28。
其中，非固态导电胶500可为有机硅导电硅脂、导电凝胶、液态金属等非固态成膜导电胶；或是其与弹性导电胶层320的部分混合物；可通过点胶、印刷、转印等方式将非固态导电胶500形成电连接组件10的绑定区的中心部分。
S260：形成覆盖所述可拉伸导电层200的弹性导电胶层320，其中，所述弹性导电胶层320具有第一通孔320c，所述非固态导电胶500部分收容于所述第一通孔320c内。请参阅图29。
其中，弹性导电胶层320可以为液体有机硅银粉导电胶，室温硫化有机硅导电胶。具体的，可通过点胶、印刷、转印等方式将弹性导电胶层320形成电连接组件10的绑定区的中心以及边缘。
S270：形成覆盖所述弹性导电胶层320的柔性电路板310，其中，所述柔性电路板310具有第二通孔310b，所述第二通孔310b连通所述第一通孔320c，所述非固态导电胶500部分收容于所述第二通孔310b内，且所述非固态导电胶500同时电连接于所述可拉伸导电层200和所述第二部分420。请参阅图30。
其中，非固态导电胶500可以为有机硅导电硅脂、导电凝胶、液态金属等非固态成膜导电胶。或是其与弹性导电胶层320的部分混合物。
具体的，在本实施例中，非固态导电胶500位于第一通孔320c和第二通孔310b内，一方面当弹性导电胶层320产生裂纹时，可以对弹性导电胶层320产生的裂纹进行修复，另一方面当柔性电路板310产生裂纹时，还可以对柔性电路板310产生的裂纹进行修复。此外，由于非固态导电胶500位于可拉伸导电层200的表面，因此，当可拉伸导电层200由于拉伸作用而产生裂纹时，非固态导电胶500可以对可拉伸导电层200在拉伸过程中产生的裂纹进行修复。
在一实施方式中，所述第一通孔320c正对所述第二通孔310b设置，且第一通孔320c的径向尺寸与第二通孔310b的径向尺寸大小保持一致。由于第一通孔320c连通第二通孔310b，因此，可以在制备工艺中一并形成第一通孔320c和第二通孔310b，有助于节省加工工序。
可以理解的，在其他实施方式中，所述第一通孔320c也可以偏离所述第二通孔310b设置，且所述第一通孔320c的大小也可以与第二通孔310b的大小保持不一致。即所述第一通孔320c的径向尺寸大于所述第二通孔310b的径向尺寸，或者，所述第一通孔320c的径向尺寸小于所述第二通孔310b的径向尺寸。
最后应说明的是：以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到的变化或替换，都应涵盖在本发明的保护范围之内。

Claims (19)

  1. 一种电连接组件，其特征在于，所述电连接组件包括柔性基板、可拉伸导电层、导电连接件和保护层，所述柔性基板、所述可拉伸导电层和所述导电连接件依次层叠设置，所述可拉伸导电层与所述导电连接件之间电连接，所述保护层位于所述可拉伸导电层远离所述柔性基板的一侧，所述保护层包括相连的第一部分和第二部分，所述第一部分覆盖于所述可拉伸导电层，所述第二部分覆盖于所述导电连接件，所述保护层用于提高所述可拉伸导电层与所述导电连接件拉伸时的承受力。
  2. 如权利要求1所述的电连接组件，其特征在于，所述第一部分与所述第二部分直接相连。
  3. 如权利要求1所述的电连接组件，其特征在于，所述第一部分靠近所述导电连接件的端面与所述导电连接件之间具有间隙。
  4. 如权利要求1-3任一项所述的电连接组件，其特征在于，所述保护层的硬度大于所述柔性基板的硬度，且所述保护层的拉伸率小于所述柔性基板的拉伸率。
  5. 如权利要求1所述的电连接组件，其特征在于，所述导电连接件包括柔性电路板和弹性导电胶层，所述柔性电路板相对于所述弹性导电胶层远离所述可拉伸导电层设置，所述第二部分覆盖于所述柔性电路板。
  6. 如权利要求5所述的电连接组件，其特征在于，所述第二部分具有远离所述第一部分的第一侧面，所述柔性电路板具有远离所述第一部分的第二侧面，所述弹性导电胶层具有远离所述第一部分的第三侧面，所述第一侧面位于所述第二侧面和所述第三侧面之间。
  7. 如权利要求5或者6所述的电连接组件，其特征在于，所述弹性导电胶层具有导电本体和自所述导电本体一侧延伸出来的延伸部，所述导电本体位于所述可拉伸导电层和所述柔性电路板之间，所述柔性电路板具有贯孔，所述延伸部收容于所述贯孔内。
  8. 如权利要求5所述的电连接组件，其特征在于，所述导电连接件还包括非固态导电胶，所述弹性导电胶层具有收容孔，所述非固态导电胶收容于所述收容孔内，且同时电连接于所述可拉伸导电层和所述柔性电路板，所述非固态导电胶用于对所述可拉伸导电层在拉伸过程中产生的裂纹进行修复。
  9. 如权利要求5所述的电连接组件，其特征在于，所述导电连接件还包括非固态导电胶，所述弹性导电胶层具有第一通孔，所述柔性电路板具有第二通孔，所述第二通孔连通所述第一通孔，所述非固态导电胶收容于所述第一通孔以及所述第二通孔内，且同时连接于所述可拉伸导电层和所述第二部分，所述非固态导电胶用于对所述可拉伸导电层在拉伸过程中产生的裂纹进行修复。
  10. 一种电子设备，其特征在于，所述电子设备包括如权利要求1-9任一项所述的电连接组件。
  11. 一种电连接组件的制备方法，其特征在于，所述电连接组件的制备方法包括：
    提供柔性基板；
    依次形成覆盖所述柔性基板的可拉伸导电层以及导电连接件；
    形成覆盖所述可拉伸导电层的第一部分以及覆盖所述导电连接件的第二部分，所述第一部分和所述第二部分构成保护层，所述保护层用于提高所述可拉伸导电层与所述导电连接件拉伸时的承受力。
  12. 如权利要求11所述的电连接组件的制备方法，其特征在于，所述第一部分与所述第二部分直接相连。
  13. 如权利要求11所述的电连接组件的制备方法，其特征在于，所述第一部分靠近所述导电连接件的端面与所述导电连接件之间具有间隙。
  14. 如权利要求11-13任一项所述的电连接组件的制备方法，其特征在于，所述保护层的硬度大于所述柔性基板的硬度，且所述保护层的拉伸率小于所述柔性基板的拉伸率。
  15. 如权利要求11所述的电连接组件的制备方法，其特征在于，所述导电连接件包括柔性电路板和弹性导电胶层，所述电连接组件的制备方法还包括：
    形成覆盖所述可拉伸导电层的弹性导电胶层；
    形成覆盖所述弹性导电胶层的柔性电路板，其中，所述柔性电路板被所述第二部分覆盖。
  16. 如权利要求15所述的电连接组件的制备方法，其特征在于，所述第二部分具有远离所述第一部分的第一侧面，所述柔性电路板具有远离所述第一部分的第二侧面，所述弹性导电胶层具有远离所述第一部分的第三侧面，所述第一侧面位于所述第二侧面和所述第三侧面之间。
  17. 如权利要求15或者16所述的电连接组件的制备方法，其特征在于，所述弹性导电胶层具有导电本体和自所述导电本体一侧延伸出来的延伸部，所述电连接组件的制备方法还包括：
    形成覆盖所述可拉伸导电层的导电本体；
    形成覆盖所述导电本体的延伸部；
    形成覆盖所述导电本体的柔性电路板，所述柔性电路板具有贯孔，所述延伸部收容于所述贯孔内。
  18. 如权利要求15所述的电连接组件的制备方法，其特征在于，所述导电连接件还包括非固态导电胶，所述电连接组件的制备方法还包括：
    形成覆盖所述可拉伸导电层的非固态导电胶，所述非固态导电胶用于对所述可拉伸导电层在拉伸过程中产生的裂纹进行修复；
    形成覆盖所述可拉伸导电层的弹性导电胶层，其中，所述弹性导电胶层具有收容孔，所述非固态导电胶收容于所述收容孔内，且所述非固态导电胶同时电连接于所述可拉伸导电层和所述柔性电路板。
  19. 如权利要求15所述的电连接组件的制备方法，其特征在于，所述导电连接件还包括非固态导电胶，所述电连接组件的制备方法还包括：
    形成覆盖所述可拉伸导电层的非固态导电胶，所述非固态导电胶用于对所述可拉伸导电层在拉伸过程中产生的裂纹进行修复；
    形成覆盖所述可拉伸导电层的弹性导电胶层，其中，所述弹性导电胶层具有第一通孔，所述非固态导电胶部分收容于所述第一通孔内；
    形成覆盖所述弹性导电胶层的柔性电路板，其中，所述柔性电路板具有第二通孔，所述第二通孔连通所述第一通孔，所述非固态导电胶部分收容于所述第二通孔内，且所述非固态导电胶同时电连接于所述可拉伸导电层和所述第二部分。
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