CN103906358A - 电连接器 - Google Patents

电连接器 Download PDF

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CN103906358A
CN103906358A CN201410116308.2A CN201410116308A CN103906358A CN 103906358 A CN103906358 A CN 103906358A CN 201410116308 A CN201410116308 A CN 201410116308A CN 103906358 A CN103906358 A CN 103906358A
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metal
contact pad
melting
point
electric connectors
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朱德祥
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Lotes Guangzhou Co Ltd
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Lotes Guangzhou Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2203/04—Soldering or other types of metallurgic bonding
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    • H05K2203/04—Soldering or other types of metallurgic bonding
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    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

本发明公开了一种电连接器，包括：一电路板，所述电路板开设有数个第一接触垫，所述每一第一接触垫上设置有一低熔点金属，所述低熔点金属的熔点低于40°C；一芯片模块，所述芯片模块对应所述第一接触设有数个第二接触垫，所述第一接触垫通过所述低熔点金属与所述第二接触垫进行电性导接。本发明电连接器的芯片模块通过低熔点金属直接与电路板电性导接，大大的降低了电连接器的厚度，简化了制作工艺，降低了生产成本。

Description

电连接器
技术领域
本发明涉及一种电连接器，尤其是指一种超薄的电连接器。 
背景技术
业界的电子产品越做越薄，为了响应市场的需求，厂商们通过将CPU直接焊接在电路板上，以降低电连接器的厚度。由于这种连接方式采用焊接连接，当CPU损坏时，CPU不易更换，从而难以维修和升级。 
因此，有必要设计一种新的电连接器，以克服上述问题。 
发明内容
针对背景技术所面临的问题，本发明的目的在于提供一种超薄且容易更换CPU的电连接器。 
为了达到上述目的，本发明采用如下技术方案：包括：一电路板，所述电路板开设有多个第一接触垫，每一所述第一接触垫上设置有一低熔点金属，所述低熔点金属的熔点低于40°C； 一芯片模块，所述芯片模块对应每一所述第一接触垫设有一第二接触垫，所述第一接触垫通过所述低熔点金属与所述第二接触垫进行电性导接。 
进一步，所述第二接触垫是pin针或者锡球或者弹片。 
进一步，所述低熔点金属的体积不超过所述锡球体积的1/2。 
进一步，所述低熔点金属为镓或者镓合金。 
进一步，所述镓合金含有铟、镓、锡。 
进一步，所述低熔点金属中设有一些填充物。 
进一步，所述填充物外表设有与所述低熔点金属相容的材质。 
进一步，所述材质为铟或者锡或者锌。 
进一步，所述填充物为弹性体。 
进一步，所述弹性体为弹片或者海绵或者弹性硅胶。 
进一步，所述填充物为颗粒状物体。 
进一步，所述颗粒状物体为金属颗粒或者非金属颗粒。 
进一步，所述颗粒状物体具有磁性。 
进一步，所述电路板与所述芯片模块中间设有一隔离部。 
进一步，所述隔离部设于相邻的两个所述低熔点金属之间。 
进一步，所述隔离部可为疏水材料或者弹性高分子材料或者绝缘胶片。 
进一步，所述电路板与所述芯片模块中间设有一挡块，所述挡块的高度低于所述低熔点金属顶端的高度。 
进一步，所述第一接触垫与所述第二接触垫接触形成一接触点，所述液态金属包覆在所述接触点的周围。 
本发明还提供一种电连接器，包括一电路板，所述电路板上设有多个第一接触垫，所述第一接触垫表面设有一第一金属；一芯片模块，所述芯片模块上设有多个第二接触垫，所述第二接触垫表面设有一第二金属；当所述第一接触垫与所述第二接触垫接触时，所述第一金属与所述第二金属形成低于40°C的一合金，并电性导接所述第一接触垫与所述第二接触垫，所述合金的熔点不高于所述第一金属的熔点或者所述第二金属的熔点。 
进一步，所述第一金属与所述第二金属可以为铟、镓、锡或者锌中的一种或者几种。 
进一步，所述第一金属为铟，所述第二金属为镓。 
进一步，所述第一金属为镓，所述第二金属为铟。 
进一步，所述第一金属和所述第二金属表面还可以设置第三金属或者第四金属。 
进一步，所述电路板与所述芯片模块中间设有一隔离部。 
进一步，所述隔离部设于相邻的两个所述低熔点金属之间。 
进一步，所述第一接触垫与第一金属之间设有一保护层，所述第二接触垫与所述第二金属之间设有一保护层。 
本发明还提供一种电连接器，包括一第一电子元件，所述第一电子元件上设有多个第一接触垫，所述第一接触垫表面设有一第一金属；一第二电子元件，所述第二电子元件上设有多个第二接触垫，所述第二接触垫表面设有一第二金属；当所述第一接触垫与所述第二接触垫接触时，所述第一金属与所述第二金属形成一低于40°C的合金，并电性导接所述第一接触垫与所述第二接触垫，所述合金的熔点不高于所述第一金属的熔点或者所述第二金属的熔点。 
　 与现有技术相比，本发明电连接器的所述芯片模块通过所述低熔点金属直接与所述电路板电性导接，大大的降低了所述电连接器的厚度，同时当所述芯片模块损坏时，也能快速方便的更换所述芯片模块，所设置的隔离部还能有效的减少短路现象的发生，在所述低熔点金属中设置填充物，可以减少所述低熔点金属的使用量，降低生产成本。 
【附图说明】
图1为本发明芯片模块下压后的示意图；
图2为图1中另一种压合模式的示意图；
图3为图1中另一种压合模式的示意图；
图4为图1中液态金属设有金属颗粒的示意图；
图5为图1中液态金属设有海绵的示意图；
图6为本发明的总装示意图；
图7为本发明另一实施例中芯片模块未下压的示意图；
图8为图7中芯片模块下压后的示意图。
  
具体实施方式的附图标号说明：
电路板 10 第一接触垫 11 隔离部 20
低熔点金属 30 颗粒状物体 31 海绵 32
第一金属 33 第二金属 34 合金 35
芯片模块 40 第二接触垫 41 锡球 42
pin针 43 背板 50 压板 60
紧固装置 70 挡块 80    
【具体实施方式】
　　为便于更好的理解本发明的目的、结构、特征以及功效等，现结合附图和具体实施方式对本发明作进一步说明。
    如图1至图6所示，作为本发明的第一实施例，本发明的电连接器包括一电路板10与一芯片模块40，所述电路板10通过一低熔点金属30与芯片模块40电性导接。 
如图1至图3所示，所述电路板10设有多个第一接触垫11，所述每一第一接触垫11上设有一所述低熔点金属30，所述芯片模块40对应每一所述第一接触垫11设有多个第二接触垫41，所述第二接触垫41还可以是锡球42或者是pin针43或者是弹片（未图示），所述第一接触垫11通过所述低熔点金属30与所述第二接触垫41进行电性导接。在所述电路板10与所述芯片模块40中间还设有一隔离部20，所述隔离部20设于相邻的两个所述低熔点金属30之间，起到一个防止所述低熔点金属30短路的作用，所述隔离部20可以是疏水材料或者弹性高分子材料或者绝缘胶片。在所述电路板10与所述芯片模块40中间设有一挡块80，所述挡块80的高度低于所述低熔点金属30顶端的高度，所述挡块80用来支撑所述芯片模块40。 
所述低熔点金属30选自镓金属，铟镓合金，铟锡合金，镓锡合金及铟镓锡合金其中任意一种。由于镓的熔点在29.76℃左右，因此，所述低熔点金属30可直接使用镓金属；由于铟的熔点在156.61℃左右，锡的熔点在231.93℃左右，但铟、镓、锡的二元或者三元合金的熔点却可以大幅降低，上述合金的熔点根据不同比例而异，例如，铟-镓比例为24.5:75.5时，铟镓二元合金的熔点为15.7℃，铟-镓-锡比例为20.5:66.5:13.0时，铟镓锡三元合金的熔点为10.7℃，因此所述低熔点金属30还可以是铟-镓, 铟-锡,镓-锡, 铟-镓-锡其中任意一种。使用者可使用镓金属，或利用铟、镓、锡金属根据比例配出合金，使得在常温下，所述镓金属和所述铟镓合金，所述铟锡合金，所述镓锡合金及所述铟镓锡合金呈液态，从而金属之间的接触面积大，阻抗小，在电流传输时，不会因阻抗消耗能量，从而保证所述电流传输的稳定性，电性连接效果好。 
如图4、图5所示，所述低熔点金属30中设有一些填充物，所述填充物的外表设有与所述低熔点金属30相容的材质，所述材质可以是铟或者锡或者锌。所述填充物可以是颗粒状物体31或者弹性体（未图示）。所述颗粒状物体31可以是金属颗粒，例如：铜球、银球等，也可以是非金属颗粒，例如塑料球或者硅胶塑球等，所述颗粒状物体31还可以具有磁性；所述弹性体可以是海绵32或者弹片（未图示）。 
如图6所示，所述电路板10下方设有一背板50，所述芯片模块40的上方还设有一压板60，所述压板60通过紧固装置70固定于所述背板50，所述紧固装置70及所述压板60提供所述芯片模块40下压的力量。 
如图7图8所示，作为发明第二实施方式，其与第一实施例的结构大致相同，其中所述电路板10上设有多个第一接触垫11，所述第一接触垫11表面设有一第一金属33；所述芯片模块40上设有多个第二接触垫41，所述第二接触垫41表面设有一第二金属34；当所述第一接触垫11与第二接触垫41结合时，所述第一金属33与所述第二金属34形成一低于40°C的合金35，并电性导接所述第一接触垫11与第二接触垫41，所述合金35的熔点不高于所述第一金属33的熔点或者所述第二金属34的熔点。 
所述第一金属33与所述第二金属34可以为铟、镓、锡或者锌中的一种或者几种。在本实施例中所述第一金属33为铟，所述第二金属34为镓，所述第一金属33和所述第二金属34上面还可以设置第三金属（未图示）或者第四金属（未图示），所述第三金属与所述第四金属也可以为铟、镓、锡或者锌中的一种或者几种，还可以与所述第一金属33及所述第二金属34形成所述合金35，同时还能降低所述合金35的流动性，提升其导接性能。所述第一接触垫11与第一金属33之间设有一保护层（未图示），所述第二接触垫41与所述第二金属34之间设有一保护层，所述保护层可以防止所述第一金属33与所述第二金属34腐蚀所述第一接触垫11及所述第二接触垫41，延长其使用寿命。本实施例还有其他形式的应用。 
本发明的电连接器具有以下有益效果： 
（1）、本发明电连接器的芯片模块40通过低熔点金属30直接与电路板10电性导接，大大的降低了所述电连接器的厚度， 同时当所述芯片模块40损坏时，也能快速方便的更换所述芯片模块40。
（2）、所设置的隔离部20还能有效的减少短路现象的发生。 
（3）、通过在所述低熔点金属30中设置填充物，可以降低所述低熔点金属30的流动性，并能防止短路的现象发生；还可以增加所述低熔点金属30的高度，并降低与外接电子元件（例如CPU或晶片）接触不到或者振动冲击产生断电的风险； 
 （4）在所述低熔点金属30中设置填充物，可以减少低熔点金属30的使用量，降低生产成本；
（5）在所述低熔点金属30中设置一些具有弹性的填充物，则可使接触部具有弹性，还可以降低与外接电子元件（例如CPU或晶片）接触不到或者振动冲击产生断电的风险。
上详细说明仅为发明之较佳实施例的说明，非因此局限本发明的专利范围，所以，凡运用本创作说明书及图示内容所为的等效技术变化，均包含于本发明的专利范围内。 

Claims (27)

1.一种电连接器，其特征在于，包括：
   一电路板，所述电路板开设有多个第一接触垫，每一所述第一接触垫上设置有一低熔点金属，所述低熔点金属的熔点低于40°C；
   一芯片模块，所述芯片模块对应每一所述第一接触垫设有一第二接触垫，所述第一接触垫通过所述低熔点金属与所述第二接触垫进行电性导接。
2.如权利要求1所述的电连接器，其特征在于：所述第二接触垫是pin针或者锡球或者弹片。
3.如权利要求2所述的电连接器，其特征在于：所述低熔点金属的体积不超过所述锡球体积的1/2。
4.如权利要求1所述的电连接器，其特征在于：所述低熔点金属为镓或者镓合金。
5.如权利要求4所述的电连接器，其特征在于：所述镓合金含有铟、镓、锡。
6.如权利要求1所述的电连接器，其特征在于：所述低熔点金属中设有一些填充物。
7.如权利要求6所述的电连接器，其特征在于：所述填充物外表设有与所述低熔点金属相容的材质。
8.如权利要求7所述的电连接器，其特征在于：所述材质为铟或者锡或者锌。
9.如权利要求6所述的电连接器，其特征在于：所述填充物为弹性体。
10.如权利要求9所述的电连接器，其特征在于：所述弹性体为弹片或者海绵或者弹性硅胶。
11.如权利要求6所述的电连接器，其特征在于：所述填充物为颗粒状物体。
12.如权利要求11所述的电连接器，其特征在于：所述颗粒状物体为金属颗粒或者非金属颗粒。
13.如权利要求11所述的电连接器，其特征在于：所述颗粒状物体具有磁性。
14.如权利要求1所述的电连接器，其特征在于：所述电路板与所述芯片模块中间设有一隔离部。
15.如权利要求14所述的电连接器，其特征在于：所述隔离部设于相邻的两个所述低熔点金属之间。
16.如权利要求14所述的电连接器，其特征在于：所述隔离部可为疏水材料或者弹性高分子材料或者绝缘胶片。
17.如权利要求1所述的电连接器，其特征在于：所述电路板与所述芯片模块中间设有一挡块，所述挡块的高度低于所述低熔点金属顶端的高度。
18.如权利要求1所述的电连接器，其特征在于：所述第一接触垫与所述第二接触垫接触形成一接触点，所述液态金属包覆在所述接触点的周围。
19.一种电连接器，其特征在于，包括：
    一电路板，所述电路板上设有多个第一接触垫，所述第一接触垫表面设有一第一金属；
    一芯片模块，所述芯片模块上设有多个第二接触垫，所述第二接触垫表面设有一第二金属；
    当所述第一接触垫与第二接触垫结合时，所述第一金属与所述第二金属形成一低于40°C的合金，并电性导接所述第一接触垫与第二接触垫，所述合金的熔点不高于所述第一金属的熔点或者所述第二金属的熔点。
20.如权利要求19所述的电连接器，其特征在于：所述第一金属与所述第二金属可以为铟、镓、锡或者锌中的一种或者几种。
21.如权利要求20所述的电连接器，其特征在于：所述第一金属为铟，所述第二金属为镓。
22.如权利要求20所述的电连接器，其特征在于：所述第一金属为镓，所述第二金属为铟。
23.如权利要求19所述的电连接器，其特征在于：所述第一金属和所述第二金属表面还可以设置第三金属或者第四金属。
24.如权利要求19所述的电连接器，其特征在于：所述电路板与所述芯片模块中间设有一隔离部。
25.如权利要求19所述的电连接器，其特征在于：所述隔离部设于相邻的两个所述低熔点金属之间。
26.如权利要求19所述的电连接器，其特征在于：所述第一接触垫与第一金属之间设有一保护层，所述第二接触垫与所述第二金属之间设有一保护层。
27.一种电连接器，其特征在于，包括：
    一第一电子元件，所述第一电子元件上设有多个第一接触垫，所述第一接触垫表面设有一第一金属；
    一第二电子元件，所述第二电子元件上设有多个第二接触垫，所述第二接触垫表面设有一第二金属；
    当所述第一接触垫与所述第二接触垫接触时，所述第一金属与所述第二金属形成低于40°C的一合金，并电性导接所述第一接触垫与所述第二接触垫，所述合金的熔点不高于所述第一金属的熔点或者所述第二金属的熔点。
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