WO2020183996A1 - Procédé de fabrication d'inducteur - Google Patents

Procédé de fabrication d'inducteur Download PDF

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Publication number
WO2020183996A1
WO2020183996A1 PCT/JP2020/004236 JP2020004236W WO2020183996A1 WO 2020183996 A1 WO2020183996 A1 WO 2020183996A1 JP 2020004236 W JP2020004236 W JP 2020004236W WO 2020183996 A1 WO2020183996 A1 WO 2020183996A1
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WIPO (PCT)
Prior art keywords
sheet
magnetic
magnetic sheet
wiring
magnetic particles
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PCT/JP2020/004236
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English (en)
Japanese (ja)
Inventor
圭佑 奥村
佳宏 古川
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日東電工株式会社
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Priority to CN202080019744.1A priority Critical patent/CN113544806A/zh
Publication of WO2020183996A1 publication Critical patent/WO2020183996A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H01F27/255—Magnetic cores made from particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils

Definitions

  • the present invention relates to a method for manufacturing an inductor.
  • inductors are mounted on electronic devices and used as passive elements such as voltage conversion members.
  • Patent Document 1 a plurality of conductor layers made of conductor paste are laminated by printing to manufacture an inductor.
  • inductors are required to have even higher inductance.
  • the present invention provides a manufacturing method capable of manufacturing an inductor having excellent inductance.
  • the present invention (1) comprises a first step of arranging a wire and an insulating layer covering the wire and having a substantially circular shape in cross section on one surface in the thickness direction of the substrate, and a first magnetic particle.
  • the first magnetic sheet containing the first magnetic particles and the first binder for dispersing the first magnetic particles is covered with a region of the circumferential surface of the wiring that exceeds 180 ° in a cross-sectional view.
  • It contains a second step of arranging on one surface in the thickness direction, a second magnetic particle containing a second anisotropic magnetic particle oriented in the surface direction, and a second binder for dispersing the second magnetic particle.
  • Includes a method of manufacturing an inductor comprising a fourth step of covering the region of the circumferential surface and one surface of the substrate with the second magnetic sheet in the thickness direction of the first magnetic sheet. ..
  • the first magnetic sheet is arranged on one surface in the thickness direction of the substrate so as to cover the region exceeding 180 ° in cross section on the circumferential surface of the wiring.
  • the magnetic particles can be arranged densely. As a result, an inductor having excellent inductance can be manufactured.
  • the second magnetic sheet covers one surface of the first magnetic sheet in the thickness direction, the first magnetic particles and the second magnetic particles in the peripheral region of the wiring can be densely arranged. it can. Therefore, it is possible to manufacture an inductor that is more excellent in inductance.
  • the first magnetic particles and the second magnetic particles can be densely arranged in the peripheral region, and an inductor having excellent inductance can be manufactured.
  • the present invention (2) includes the method for manufacturing an inductor according to (1), wherein the first magnetic particles include first anisotropic magnetic particles that are oriented in the plane direction in the first magnetic sheet.
  • the first magnetic sheet is arranged on one surface in the thickness direction of the substrate, and in the first magnetic sheet, the first anisotropic magnetic particles are arranged along one surface in the thickness direction of the substrate. Orientate. Therefore, it is possible to prevent the first anisotropic magnetic particles from being oriented along the circumferential direction of the wiring at both end edges in the circumferential direction in the above-mentioned region of the wiring, facing one surface in the thickness direction. Therefore, the inductor is excellent in DC superimposition characteristics.
  • the first magnetic sheet covers a region exceeding 180 ° of the circumferential surface of the wiring, at both edges of the circumferential direction of such a region, the direction from the circumferential direction of the wiring to the direction along one surface of the substrate.
  • the first anisotropic magnetic particles can be densely arranged while changing the orientation direction of the first anisotropic magnetic particles. As a result, an inductor having a higher inductance can be manufactured.
  • an inductor having excellent inductance and DC superimposition characteristics can be manufactured.
  • the substrate is a release sheet and contains a third step of removing the substrate, a third magnetic particle, and a third binder for dispersing the third magnetic particle.
  • the third magnetic sheet is further provided with a fifth step of arranging the third magnetic sheet on the other surface in the thickness direction of the first magnetic sheet so as to cover the circumferential surface exposed from the other surface in the thickness direction of the first magnetic sheet. , (1) or (2).
  • the third magnetic sheet is further arranged on the other surface in the thickness direction of the first magnetic sheet, the first magnetic particles, the second anisotropic magnetic particles, and the third magnetic particles in the peripheral region of the wiring are further arranged. Can be placed densely. Therefore, it is possible to manufacture an inductor that is more excellent in inductance.
  • the third magnetic sheet covers the circumferential surface exposed from the other surface in the thickness direction of the first magnetic sheet, the third magnetism in the region corresponding to the circumferential surface of the wiring exposed from the first magnetic sheet.
  • the particles can be arranged densely. As a result, an inductor having excellent inductance can be manufactured.
  • the present invention (4) includes the method for manufacturing an inductor according to (3), wherein the third magnetic particles include a third anisotropic magnetic particle that is oriented in the plane direction in the third magnetic sheet.
  • the third anisotropic magnetic particles are oriented in the region corresponding to the circumferential surface of the wiring exposed from the first magnetic sheet.
  • it can be arranged densely. As a result, an inductor having a higher inductance can be manufactured.
  • the first step, the second step, and the third step are carried out in order, and then the fourth step and the fifth step are carried out simultaneously, (3) or ( The method for manufacturing an inductor according to 4) is included.
  • the manufacturing time can be shortened as compared with the method in which the fourth step and the fifth step are carried out in order. Therefore, the inductor can be manufactured efficiently.
  • the first binder in the second step and the third binder in the fifth step contain a thermosetting component of the B stage, and further, the first binder and the first binder and the like.
  • thermosetting components of the B stage of the first binder and the third binder are simultaneously C-staged, so that the thermosetting components of the B stage of the first binder and the third binder are thermosetting.
  • the production time can be shortened as compared with the method in which the components are sequentially implemented. Therefore, the inductor can be manufactured efficiently.
  • the substrate is a third magnetic sheet containing a third magnetic particle and a third binder for dispersing the third magnetic particle, and the third binder is a thermal sheet.
  • the substrate is a third magnetic sheet, it is not necessary to carry out a step of removing the substrate such as a release film. Therefore, the man-hours can be reduced and the inductor can be easily manufactured.
  • the present invention (8) includes the method for manufacturing an inductor according to (7), wherein the third magnetic particles include a third anisotropic magnetic particle that is oriented in the plane direction in the third magnetic sheet.
  • the third magnetic particles include the third anisotropic magnetic particles that are oriented in the plane direction on the third magnetic sheet, the third anisotropic magnetic particles are surfaced on the third magnetic sheet in the wiring. Can be oriented along the part to be. Therefore, it is possible to manufacture an inductor that is more excellent in inductance.
  • the inductor manufacturing method of the present invention can manufacture an inductor having excellent inductance.
  • FIG. 1A to 1B are cross-sectional views of an inductor obtained by the first embodiment of the present invention
  • FIG. 1A is a cross-sectional view in which the cross section is hatched
  • FIG. 1B is a cross-sectional view of anisotropic magnetic particles in a magnetic layer. It is sectional drawing which shows the orientation.
  • 2A to 2C are process diagrams illustrating a method of manufacturing the inductor of the first embodiment
  • FIG. 2A is a first step of arranging the wiring on the first release sheet
  • FIG. 2B is the first magnetism.
  • FIG. 2C shows the third step of removing the first release sheet.
  • FIG. 3D to 3F are process diagrams for explaining the method of manufacturing the inductor of the first embodiment, following FIG. 2C, and FIG. 3D shows a process of arranging the second magnetic sheet and the third magnetic sheet, FIG. 3E.
  • FIG. 3F shows the inductor.
  • the process of taking out is shown.
  • 4A to 4C are process diagrams illustrating a manufacturing method of a modified example of the first embodiment, FIG. 4A is a first step of arranging the wiring on the first release sheet, and FIG. 4B is the first magnetism.
  • FIG. 4C shows the step of arranging the second magnetic sheet.
  • 5D to 5F are process diagrams for explaining the manufacturing method of the modified example of the first embodiment, following FIG. 4C, in which FIG. 5D covers one surface of the first magnetic sheet with the second magnetic sheet. 4 steps, FIG. 5E shows a third step of removing the first release sheet, and FIG. 5F shows a step of arranging the third magnetic sheet.
  • 6G to 6H are process diagrams for explaining the manufacturing method of the modified example of the first embodiment, following FIG. 5F.
  • FIG. 6G shows the other surface of the first magnetic sheet of the B stage by the third magnetic sheet.
  • the fifth step of covering, FIG. 6H shows a step of taking out the inductor.
  • FIG. 7A-7B are cross-sectional views of the inductor obtained by the second embodiment of the present invention
  • FIG. 7A is a cross-sectional view in which the cross section is hatched
  • FIG. 7B is a cross-sectional view of anisotropic magnetic particles in the magnetic layer. It is sectional drawing which shows the orientation.
  • 8A-8C are process diagrams illustrating a method of manufacturing the inductor of the second embodiment
  • FIG. 8A is a first process of arranging the wiring on the first release sheet
  • FIG. 8B is the first magnetism.
  • the second step of covering the wiring with the sheet, FIG. 8C shows the third step of removing the first release sheet.
  • 9D to 9F are process diagrams for explaining the method of manufacturing the inductor of the second embodiment following FIG.
  • FIG. 10A to 10C are process diagrams for explaining the manufacturing method of the modified example of the second embodiment.
  • FIG. 10A is a first step of arranging the wiring on the first release sheet
  • FIG. 10B is the first magnetism.
  • the second step of covering the wiring with the sheet, FIG. 10C shows the step of arranging the second magnetic sheet.
  • FIG. 11D to 11F are process diagrams for explaining the manufacturing method of the modified example of the second embodiment, following FIG. 10C, in which FIG. 11D covers one surface of the first magnetic sheet with the second magnetic sheet.
  • FIG. 11E shows a third step of removing the first release sheet
  • FIG. 11F shows a step of arranging the third magnetic sheet.
  • 12G to 12H are process diagrams for explaining the manufacturing method of the modified example of the second embodiment, following FIG. 11F.
  • FIG. 12G shows the other surface of the first magnetic sheet of the C stage by the third magnetic sheet.
  • the fifth step of covering, FIG. 12H shows a step of taking out the inductor.
  • 13A to 13C are process diagrams for explaining a manufacturing method of a further modification of the second embodiment, FIG.
  • FIG. 13A is a process of arranging the wiring on the third magnetic sheet of the C stage
  • FIG. 13B is a process diagram of the third. 1 A step of covering the wiring and one surface of the third magnetic sheet with the magnetic sheet
  • FIG. 13C shows a step of arranging the second magnetic sheet.
  • 14D to 14E are process diagrams for explaining a manufacturing method of a further modification of the second embodiment, following FIG. 13C
  • FIG. 14D shows a process of coating the first magnetic sheet with the second magnetic sheet.
  • 14E shows a step of taking out the inductor.
  • 15A to 15C are cross-sectional views of a modified example of the method for manufacturing an inductor.
  • FIG. 13B is a process diagram of the third. 1 A step of covering the wiring and one surface of the third magnetic sheet with the magnetic sheet
  • FIG. 13C shows a step of arranging the second magnetic sheet.
  • 14D to 14E are process diagrams for explaining a manufacturing method of a further modification of the second embodiment, following FIG.
  • FIG. 15A shows a step of arranging wiring on one surface of a first release sheet via a pressure-sensitive adhesive layer, FIG. 15B. , A region of the first magnetic sheet that exceeds 180 ° in cross-sectional view on the circumferential surface of the wiring, a step of covering one surface of the first magnetic sheet, and FIG. 15C shows a step of obtaining an inductor.
  • 16A to 16C are cross-sectional views of a modified example of the method for manufacturing an inductor.
  • FIG. 16A is a step of arranging wiring with respect to a first release sheet with a gap
  • FIG. 16B is a first magnetic sheet.
  • 16C shows a step of covering the circumferential surface of the wiring and one surface of the first magnetic sheet, and FIG.
  • FIG. 16C shows a step of obtaining an inductor.
  • 17A to 17B are image processing diagrams of the SEM photograph of the first embodiment
  • FIG. 17A is an SEM photograph after the second step
  • FIG. 17B is an SEM photograph of the inductor.
  • FIG. 18 is an image processing diagram of an SEM photograph of the inductor of the second embodiment.
  • FIG. 19 is an image processing diagram of an SEM photograph of the inductor of Comparative Example 1.
  • FIG. 1A is a cross-sectional view obtained by hatching a cross section
  • FIG. 1B is a cross-sectional view showing the orientation of anisotropic magnetic particles in the magnetic layer.
  • the shapes and arrangements of magnetic particles are exaggerated and drawn in order to facilitate understanding of the present invention.
  • the inductor 1 has a shape extending in the plane direction. Specifically, the inductor 1 has one surface and the other surface facing each other in the thickness direction, and both the one surface and the other surface are included in the surface direction, and the wiring 2 (described later). ) Has a flat shape along the first direction orthogonal to the direction of transmitting the current (corresponding to the depth direction of the paper surface) and the thickness direction.
  • the inductor 1 includes a wiring 2 and a magnetic layer 3.
  • Wiring 2 has a substantially circular shape in cross section. Specifically, the wiring 2 has a substantially circular shape when cut in a cross section (first direction cross section) orthogonal to the second direction (transmission direction) (paper depth direction), which is the direction in which the current is transmitted.
  • the wiring 2 is an electric wire coated with an insulating layer, and specifically includes a conducting wire 6 and an insulating layer 7 covering the lead wire 6.
  • the conductor wire 6 is a conductor wire having a shape extending long in the second direction. Further, the lead wire 6 has a substantially circular shape in cross section that shares the central axis with the wiring 2.
  • Examples of the material of the conducting wire 6 include metal conductors such as copper, silver, gold, aluminum, nickel, and alloys thereof, and copper is preferable.
  • the conducting wire 6 may have a single-layer structure, or may have a multi-layer structure in which the surface of a core conductor (for example, copper) is plated (for example, nickel).
  • the radius R1 of the lead wire 6 is, for example, 25 ⁇ m or more, preferably 50 ⁇ m or more, and for example, 2000 ⁇ m or less, preferably 200 ⁇ m or less.
  • the insulating layer 7 protects the lead wire 6 from chemicals and water, and also prevents a short circuit between the lead wire 6 and the magnetic layer 3.
  • the insulating layer 7 covers the entire outer peripheral surface (circumferential surface) of the conducting wire 6.
  • the insulating layer 7 has a substantially annular shape in cross section that shares the central axis (center C) with the wiring 2.
  • Examples of the material of the insulating layer 7 include insulating resins such as polyvinylformal, polyester, polyesterimide, polyamide (including nylon), polyimide, polyamideimide, and polyurethane. These may be used alone or in combination of two or more.
  • insulating resins such as polyvinylformal, polyester, polyesterimide, polyamide (including nylon), polyimide, polyamideimide, and polyurethane. These may be used alone or in combination of two or more.
  • the insulating layer 7 may be composed of a single layer or may be composed of a plurality of layers.
  • the thickness R2 of the insulating layer 7 is substantially uniform in the radial direction of the wiring 2 at any position in the circumferential direction, for example, 1 ⁇ m or more, preferably 3 ⁇ m or more, and for example, 100 ⁇ m or less, preferably 100 ⁇ m or less. , 50 ⁇ m or less.
  • the ratio (R1 / R2) of the radius R1 of the lead wire 6 to the thickness R2 of the insulating layer 7 is, for example, 1 or more, preferably 10 or more, and for example, 500 or less, preferably 100 or less.
  • the magnetic layer 3 improves the inductance of the inductor 1.
  • the magnetic layer 3 covers the entire outer peripheral surface (circumferential surface) of the wiring 2.
  • the magnetic layer 3 forms the outer shape of the inductor 1.
  • the magnetic layer 3 has a rectangular shape extending in the plane direction (first direction and second direction). More specifically, the magnetic layer 3 has one surface and the other surface facing each other in the thickness direction, and each of the one surface and the other surface of the magnetic layer 3 is one surface and the other surface of the inductor 1, respectively. To form.
  • the magnetic layer 3 contains anisotropic magnetic particles 8 and a binder 9.
  • the material of the magnetic layer 3 is a magnetic composition containing anisotropic magnetic particles 8 and a binder 9.
  • the magnetic layer 3 is a cured product of a thermosetting resin composition (composition containing anisotropic magnetic particles 8 and a thermosetting component described later).
  • Examples of the magnetic material constituting the anisotropic magnetic particles 8 include a soft magnetic material and a hard magnetic material.
  • a soft magnetic material is preferably used from the viewpoint of inductance.
  • the soft magnetic material examples include a single metal body containing one kind of metal element in a pure substance state, for example, one or more kinds of metal elements (first metal element) and one or more kinds of metal elements (second metal element).
  • first metal element one or more kinds of metal elements
  • second metal element one or more kinds of metal elements
  • the single metal body examples include a single metal composed of only one kind of metal element (first metal element).
  • the first metal element is appropriately selected from, for example, iron (Fe), cobalt (Co), nickel (Ni), and other metal elements that can be contained as the first metal element of the soft magnetic material. ..
  • the single metal body includes, for example, a core containing only one kind of metal element and a surface layer containing an inorganic substance and / or an organic substance that modifies a part or all of the surface of the core, for example.
  • examples thereof include an organic metal compound containing a first metal element and a form in which an inorganic metal compound is decomposed (thermal decomposition, etc.).
  • thermal decomposition etc.
  • iron powder obtained by thermally decomposing an organic iron compound (specifically, carbonyl iron) containing iron as the first metal element (sometimes referred to as carbonyl iron powder). And so on.
  • the position of the layer containing the inorganic substance and / or the organic substance that modifies the portion containing only one kind of metal element is not limited to the above-mentioned surface.
  • the organometallic compound or inorganic metal compound capable of obtaining a single metal body is not particularly limited, and a known or commonly used organometallic compound or inorganic metal compound capable of obtaining a soft magnetic single metal body is not particularly limited. Can be appropriately selected from.
  • the alloy body is a eutectic of one or more kinds of metal elements (first metal element) and one or more kinds of metal elements (second metal element) and / or non-metal elements (carbon, nitrogen, silicon, phosphorus, etc.). It is not particularly limited as long as it is a body and can be used as an alloy body of a soft magnetic material.
  • the first metal element is an essential element in the alloy body, and examples thereof include iron (Fe), cobalt (Co), and nickel (Ni). If the first metal element is Fe, the alloy body is an Fe-based alloy, and if the first metal element is Co, the alloy body is a Co-based alloy, and the first metal element is Ni. For example, the alloy body is a Ni-based alloy.
  • the second metal element is an element (sub-component) secondarily contained in the alloy body, and is a metal element that is compatible (cofusable) with the first metal element.
  • iron (Fe) the first. 1 When the metal element is other than Fe), Cobalt (Co) (when the first metal element is other than Co), Nickel (Ni) (when the first metal element is other than Ni), Chromium (Cr), Aluminum (Al), silicon (Si), copper (Cu), silver (Ag), manganese (Mn), calcium (Ca), barium (Ba), titanium (Ti), zirconium (Zr), ruthenium (Hf), vanadium (V), Niob (Nb), Tantal (Ta), Molybdenum (Mo), Tungsten (W), Ruthenium (Ru), Rodium (Rh), Zinc (Zn), Gallium (Ga), Indium (In), Germanium Examples thereof include (Ge), tin (Sn), lead (Pb), scandium (Sc), rut
  • the non-metal element is an element (sub-component) secondarily contained in the alloy body, and is a non-metal element that is compatible (combined) with the first metal element.
  • boron (B) and carbon examples thereof include (C), nitrogen (N), silicon (Si), phosphorus (P) and sulfur (S). These can be used alone or in combination of two or more.
  • Fe-based alloys examples include magnetic stainless steel (Fe-Cr-Al-Si alloy) (including electromagnetic stainless steel), sentust (Fe-Si-Al alloy) (including super sentust), and permalloy (including supersendust).
  • magnetic stainless steel Fe-Cr-Al-Si alloy
  • sentust Fe-Si-Al alloy
  • permalloy including supersendust
  • Fe-Ni alloy Fe-Ni alloy
  • Fe-Ni-Mo alloy Fe-Ni-Mo-Cu alloy
  • Fe-Ni-Co alloy Fe-Cr alloy
  • Fe-Cr-Al alloy Fe-Ni-Cr alloy
  • Fe- Ni—Cr—Si alloy silicon copper (Fe—Cu—Si alloy)
  • Fe—Si alloy Fe—Si—B (—Cu—Nb) alloy
  • Fe—B—Si—Cr alloy Fe—Si—Cr -Ni alloy
  • Fe-Si-Cr alloy Fe-Si-Al-Ni-Cr alloy
  • Fe-Ni-Si-Co alloy Fe-N alloy, Fe-C alloy, Fe-B alloy, Fe-P alloy
  • Ferrites stainless ferrites, Mn-Mg-based ferrites, Mn-Zn-based ferrites, Ni-Zn-based ferrites, Ni-Zn-Cu-based ferrites, Cu-Zn-based ferrites, Cu-Mg-Zn-based
  • Co-based alloys examples include Co-Ta-Zr and cobalt (Co) -based amorphous alloys.
  • Ni-based alloys which are examples of alloys, include Ni—Cr alloys.
  • an alloy body is preferable, an Fe-based alloy is more preferable, and Sendust (Fe—Si—Al alloy) is more preferable, from the viewpoint of magnetic properties.
  • the soft magnetic material preferably a single metal body, more preferably a single metal body containing an iron element in a pure substance state, still more preferably iron alone or iron powder (carbonyl iron powder). Can be mentioned.
  • examples of the shape of the anisotropic magnetic particles 8 include a flat shape (plate shape) and a needle shape, and preferably, the relative magnetic permeability is good in the plane direction (two-dimensional). From a certain point of view, there is a flat shape.
  • the flatness (flatness) of the flat anisotropic magnetic particles 8 is, for example, 8 or more, preferably 15 or more, and for example, 500 or less, preferably 450 or less.
  • the flatness is calculated as, for example, an aspect ratio obtained by dividing the average particle diameter (average length) (described later) of the anisotropic magnetic particles 8 by the average thickness of the anisotropic magnetic particles 8.
  • the average particle diameter (average length) of the anisotropic magnetic particles 8 is, for example, 3.5 ⁇ m or more, preferably 10 ⁇ m or more, and for example, 200 ⁇ m or less, preferably 150 ⁇ m or less. If the anisotropic magnetic particles 8 are flat, the average thickness thereof is, for example, 0.1 ⁇ m or more, preferably 0.2 ⁇ m or more, and for example, 3.0 ⁇ m or less, preferably 2.5 ⁇ m. It is as follows.
  • the binder 9 disperses the anisotropic magnetic particles 8 in the magnetic layer 3. Further, the binder 9 is dispersed in the magnetic layer 3 in a predetermined direction. Preferably, the binder 9 contains a cured product of the thermosetting component of the B stage.
  • the binder 9 will be described in detail in the description of the first magnetic sheet 51, the second magnetic sheet 52, and the third magnetic sheet 53 in the later manufacturing method.
  • the anisotropic magnetic particles 8 are uniformly arranged while being oriented in the binder 9.
  • the magnetic layer 3 has a peripheral region 4 and an outer region 5 in a cross-sectional view (when cut in the first direction cross section).
  • the peripheral region 4 is a peripheral region of the wiring 2 and is located around the wiring 2 so as to be in contact with the entire outer peripheral surface (circumferential surface) of the wiring 2.
  • the peripheral region 4 has a substantially annular shape in cross section that shares the central axis with the wiring 2. More specifically, the peripheral region 4 is a region of the magnetic layer 3 located within a range within 1.5 times the radius R of the wiring 2 from the center C of the wiring 2. That is, the peripheral region 4 is a region located within a distance of 0.5 times the radius R of the wiring 2 from the outer peripheral edge of the wiring 2 (inner peripheral edge of the peripheral region 4) to the outside in the radial direction.
  • the peripheral area 4 includes a first area 11 and a second area 12.
  • first regions 11 are arranged in the peripheral region 4 at intervals in the circumferential direction.
  • the first region 11 includes a third region 13 and a fourth region 14 arranged on the other side in the thickness direction at intervals with respect to the third region 13.
  • the third region 13 covers at least the outer peripheral arc surface including the one end edge E1 in the thickness direction of the wiring 2, and for example, the first half arc including the one end edge E1 in the thickness direction of the wiring 2 (on one side in the thickness direction of the wiring 2). At least a part or all of the surface 23 (one semicircle connecting the edges E2 and E3 in the first direction) of the wiring 2 is covered.
  • the third region 13 covers a part of the first semicircular arc surface 23 of the wiring 2, and more specifically, when projected in the radial direction, one semicircular arc of the wiring 2. While included in the surface, it does not overlap with the first-direction both end edges E2 and E3 of the wiring 2 and is arranged inside the first-direction both end edges E2 and E3.
  • the one end edge E1 in the thickness direction of the wiring 2 is a first virtual line L1 that passes through the center C of the wiring 2 along the thickness direction and an arc surface (first semi-arc surface 23) on one side of the wiring 2 in the thickness direction. This is the intersection with.
  • first-direction both end edges E2 and E3 of the wiring 2 are two portions where the third virtual line L3 passing through the center C of the wiring 2 along the first direction and the circumferential surface of the wiring 2 intersect. ..
  • the fourth region 14 is arranged to face the third region 13 with the center C of the wiring 2 interposed therebetween.
  • the fourth region 14 covers at least the outer peripheral arc surface including the other end edge E4 in the thickness direction of the wiring 2, and for example, the second half arc including the other end edge E4 in the thickness direction of the wiring 2 (the other side in the thickness direction of the wiring 2). Covers a part of the surface 24 (another semicircular arc connecting the edges E2 and E3 in the first direction).
  • the fourth region 14 is included in the second semicircular arc surface 24 of the wiring 2 when projected in the radial direction, but does not overlap with the first-direction both end edges E2 and E3 of the wiring 2. It is arranged inside the first-direction both end edges E2 and E3 of the wiring 2.
  • the other end edge E4 in the thickness direction of the wiring 2 is a portion where the first virtual line L1 passing through the center C of the wiring 2 along the thickness direction and the second arc surface 24 intersect.
  • the angle ⁇ 1 of the central angle C1 of the third region 13 and the angle ⁇ 2 of the central angle C2 of the fourth region 14 are appropriately set according to the intended use and purpose, and the total angle ( ⁇ 1 + ⁇ 2) thereof is set. For example, it is less than 360 °, preferably 270 ° or less, and, for example, more than 180 °, preferably 200 ° or more.
  • the angle ⁇ 1 of the central angle C1 of the third region 13 is, for example, 90 ° or more, preferably more than 90 °, more preferably 120 ° or more, and for example, less than 180 °, preferably. Is 165 ° or less.
  • the angle ⁇ 1 is preferably an obtuse angle.
  • the angle ⁇ 2 of the central angle C2 of the fourth region 14 is, for example, 15 ° or more, and for example, 60 ° or less, preferably 45 ° or less. Further, the angle ⁇ 2 is preferably an acute angle.
  • the angle ⁇ 1 of the central angle C1 of the third region 13 is large with respect to the angle ⁇ 2 of the central angle C2 of the fourth region 14, and the ratio (angle ⁇ 1 / angle ⁇ 2) is, for example, more than 1, preferably 1. It is .5 or more, and 3 or less, preferably 2 or less.
  • the anisotropic magnetic particles 8 are oriented along the circumferential direction of the wiring 2.
  • the direction in which the specific magnetic permeability of the anisotropic magnetic particles 8 is high is approximately the same as the circumferential direction. Specifically, when the angle formed by the surface direction of the anisotropic magnetic particles 8 and the tangent line tangent to the circumferential surface facing the anisotropic magnetic particles 8 inward in the radial direction is 15 ° or less. It is defined that the anisotropic magnetic particles 8 are oriented in the circumferential direction.
  • the ratio of the number of anisotropic magnetic particles 8 oriented in the circumferential direction to the total number of anisotropic magnetic particles 8 contained in the first region 11 exceeds, for example, 50%, preferably 70. % Or more, more preferably 80% or more. That is, the first region 11 may contain anisotropic magnetic particles 8 that are not oriented in the circumferential direction, for example, less than 50%, preferably 30% or less, and more preferably 20% or less.
  • the area ratio of the first region 11 (total area of the third region 13 and the fourth region 14) is, for example, 40% or more, preferably 50% or more, and more preferably 60% with respect to the entire peripheral region 4.
  • the above and for example, 90% or less, preferably 80% or less.
  • the circumferential relative permeability of the first region 11 is, for example, 5 or more, preferably 10 or more, more preferably 30 or more, and for example, 500 or less.
  • the radial relative magnetic permeability is, for example, 1 or more, preferably 5 or more, and for example, 100 or less, preferably 50 or less, more preferably 25 or less.
  • the ratio of the relative magnetic permeability in the circumferential direction to the radial direction (circumferential direction / radial direction) is, for example, 2 or more, preferably 5 or more, and for example, 50 or less. If the relative magnetic permeability is in the above range, the inductance is excellent.
  • the specific magnetic permeability can be measured by, for example, an impedance analyzer (manufactured by Agilent, “4291B”) using a magnetic material test fixture.
  • the second region 12 is a circumferential non-aligned region in which the anisotropic magnetic particles 8 are not oriented along the circumferential direction of the wiring 2.
  • the anisotropic magnetic particles 8 are oriented or not oriented along a direction other than the circumferential direction of the wiring 2 (for example, the first direction or the radial direction).
  • Two second regions 12 are arranged in the peripheral region 4 at intervals in the circumferential direction.
  • the second region 12 is a fifth region 15 and a sixth region arranged so as to be spaced apart from each other with the first virtual straight line L1 passing through the one end edge E1 and the other end edge E2 in the thickness direction of the wiring 2 interposed therebetween. It includes a region 16.
  • the fifth region 15 is arranged on one side in the first direction with respect to the first virtual straight line L1.
  • the fifth region 15 is sandwiched between one end surface in the circumferential direction of the third region 13 and the other end surface in the circumferential direction of the fourth region 14. Specifically, one end surface in the circumferential direction of the third region 13. Is continuous with the other end surface of the fourth region 14 in the circumferential direction.
  • the sixth region 16 is arranged to face the fifth region 15 on the other side of the first direction at intervals.
  • the sixth region 16 is arranged on the other side of the first virtual straight line L1 in the first direction, and is line-symmetrical with respect to the fifth region 15 about the first virtual straight line L1. That is, the sixth region 16 is continuous with the other end surface in the circumferential direction of the third region 13 and the one end surface in the circumferential direction of the fourth region 14.
  • the third region 13 the fifth region 15, the fourth region 14, and the sixth region 16 are arranged in order in the circumferential direction.
  • the center C3 of the first virtual arc A1 as an example of the virtual arc connecting the first end E5 which is one end in the circumferential direction and the second end E6 which is the other end in the circumferential direction in the fifth region 15 and the sixth region.
  • No. 16 as an example of a virtual straight line connecting the center C4 of the second virtual arc A2 as an example of a virtual arc connecting the third end E7 which is one end in the circumferential direction and the fourth end E8 which is the other end in the circumferential direction. 2
  • the center C of the wiring 2 does not exist on the virtual straight line L2.
  • the first end E5 is a portion located at the central portion in the radial direction on one end surface in the circumferential direction in the fifth region 15.
  • the second end E6 is a portion located at the central portion in the radial direction on the other end surface in the circumferential direction in the fifth region 15.
  • the third end E7 is a portion located at the central portion in the radial direction on one end surface in the circumferential direction in the sixth region 16.
  • the fourth end E8 is a portion located at the central portion in the radial direction on the other end surface in the circumferential direction in the sixth region 16.
  • the center C of the wiring 2 is arranged on one side of the second virtual straight line L2 in the first direction at intervals.
  • the center C of the wiring 2 is located on one side in the thickness direction by a distance of 0.2 times or more and 0.7 times or less the radius R of the wiring 2 with respect to the second virtual straight line L2, preferably. , It is located on one side in the thickness direction by a distance of 0.3 times or more and 0.5 times or less of the radius R of the wiring 2 with respect to the second virtual straight line L2.
  • the other end edge E4 of the wiring 2 in the thickness direction does not exist on the second virtual straight line L2, and specifically, is located on the other side of the second virtual straight line L2 in the thickness direction at intervals.
  • the intersection (top) 20 is formed by at least two kinds of anisotropic magnetic particles 8 having different orientation directions.
  • the first particle 17, which is the magnetic magnetic particle 8, and the second particle 18, which is the anisotropic magnetic particle 8 that is oriented in the first direction from the second end E6 to the first end E5 are at least substantially triangular in shape. Two sides are formed, thereby forming a first intersection (first top) 21.
  • the first particle 17 and the second particle 18 are together with the third particle 19 which is an anisotropic magnetic particle 8 oriented in the circumferential direction in the region where the wiring 2 is in close contact with the fifth region 15. It forms a substantially triangular shape (preferably an acute-angled triangular shape).
  • an anisotropy oriented radially outward of the wiring 2 from the fourth end E8 (the portion in contact with the third region 13) toward the third end E7 (the portion in contact with the fourth region 14).
  • the first particle 17, which is the magnetic magnetic particle 8, and the second particle 18, which is the anisotropic magnetic particle 8 that is oriented in the first direction from the third end E7 to the fourth end E8, are at least substantially triangular in shape. Two sides are formed, thereby forming a second intersection (second top) 22.
  • the first particle 17 and the second particle 18 are together with the third particle 19 which is an anisotropic magnetic particle 8 oriented in the circumferential direction in the region where the wiring 2 is in close contact with the sixth region 16. It forms a substantially triangular shape (preferably an acute-angled triangular shape).
  • intersection 20 (each of the first intersection 21 and the second intersection 22) does not overlap with the center C of the wiring 2 when projected in the first direction. Specifically, the intersection 20 is arranged at a distance from the center C of the wiring 2 on the other side in the thickness direction when projected in the first direction.
  • intersection 20 is arranged at a distance on one side in the thickness direction of the other end edge E4 in the thickness direction of the wiring 2 when projected in the first direction.
  • the direction in which the specific magnetic permeability of the anisotropic magnetic particles 8 is high (for example, in the case of flat anisotropic magnetic particles, the plane direction of the particles) is , Does not match the tangent of the circumferential surface centered on the center C of the wiring 2. More specifically, the case where the angle formed by the surface direction of the anisotropic magnetic particles 8 and the outer peripheral surface (circumferential surface) of the wiring 2 where the anisotropic magnetic particles 8 are located exceeds 15 degrees. , It is defined that the anisotropic magnetic particles 8 are not oriented in the circumferential direction.
  • the ratio of the number of anisotropic magnetic particles 8 not oriented in the circumferential direction to the total number of anisotropic magnetic particles 8 contained in the second region 12 exceeds, for example, 50%, preferably 70. % Or more, and for example, 95% or less, preferably 90% or less.
  • the second region 12 may include, for example, anisotropic magnetic particles 8 oriented in the circumferential direction.
  • the ratio of the number of anisotropic magnetic particles 8 oriented in the circumferential direction to the total number of anisotropic magnetic particles 8 contained in the second region 12 is, for example, less than 50%, preferably 30% or less. And, for example, 5% or more, preferably 10% or more.
  • the anisotropic magnetic particles 8 oriented in the circumferential direction are preferably the innermost region of the second region 12, that is, the surface of the wiring 2. Placed in the vicinity.
  • the area ratio of the second region 12 (total area of the fifth region 15 and the sixth region 16) is, for example, 10% or more, preferably 20% or more, and, for example, the total area of the peripheral region 4. It is 60% or less, preferably 50% or less, and more preferably 40% or less.
  • the filling rate (presence ratio) of the anisotropic magnetic particles 8 is, for example, 40% by volume or more, preferably 45% by volume or more, more preferably 50% by volume or more, still more preferably. 55% by volume or more, particularly preferably 60% by volume or more.
  • the filling rate of the anisotropic magnetic particles 8 in the peripheral region 4 is at least the above lower limit, the inductor 1 can obtain an excellent inductance.
  • the filling rate of the anisotropic magnetic particles 8 in the peripheral region 4 is, for example, 95% by volume or less, preferably 90% by volume or less.
  • the filling rate of the anisotropic magnetic particles 8 is equal to or less than the above-mentioned upper limit, the inductor 1 has excellent mechanical strength.
  • the filling rate of the anisotropic magnetic particles 8 is, for example, 40% by volume or more, preferably 45% by volume or more, and more preferably 50% by volume. As mentioned above, it is more preferably 55% by volume or more, particularly preferably 60% by volume or more, and for example, 95% by volume or less, preferably 90% by volume or less.
  • the filling rate of the anisotropic magnetic particles 8 in the first region 11 and the filling rate of the anisotropic magnetic particles 8 in the second region 12 may be the same or different from each other.
  • the filling rate of the anisotropic magnetic particles 8 can be calculated by measuring the actual specific gravity, binarizing the SEM photograph, and the like.
  • the abundance ratio of the binder 9 in the peripheral region 4 is, for example, the remainder of the above-mentioned filling rate of the anisotropic magnetic particles 8.
  • the formation of voids is suppressed as much as possible in the peripheral region 4, and preferably, there are no voids between the wiring 2 and the magnetic layer 3. That is, the peripheral region 4 is preferably a voidless.
  • the outer region 5 is a region other than the peripheral region 4 in the magnetic layer 3.
  • the outer region 5 is arranged outside the peripheral region 4 so as to be continuous with the peripheral region 4.
  • the anisotropic magnetic particles 8 are oriented along the plane direction (particularly, the first direction).
  • the direction in which the specific magnetic permeability of the anisotropic magnetic particles 8 is high substantially coincides with the first direction. More specifically, when the angle formed by the plane direction of the anisotropic magnetic particles 8 and the first direction is 15 ° or less, the anisotropic magnetic particles 8 are oriented in the first direction. Define.
  • the ratio of the number of the anisotropic magnetic particles 8 oriented in the first direction to the total number of the anisotropic magnetic particles 8 contained in the outer region 5 exceeds 50%. It is preferably 70% or more, more preferably 90% or more. That is, the outer region 5 may contain less than 50%, preferably 30% or less, more preferably 10% or less of the anisotropic magnetic particles 8 that are not oriented in the first direction.
  • the filling rate of the anisotropic magnetic particles 8 in the outer region 5 may be the same as or different from the filling rate of the anisotropic magnetic particles 8 in the peripheral region 4.
  • the specific magnetic permeability in the first direction is, for example, 5 or more, preferably 10 or more, more preferably 30 or more, and for example, 500 or less.
  • the specific magnetic permeability in the thickness direction is, for example, 1 or more, preferably 5 or more, and for example, 100 or less, preferably 50 or less, more preferably 25 or less.
  • the ratio of the relative magnetic permeability in the first direction to the thickness direction (first direction / thickness direction) is, for example, 2 or more, preferably 5 or more, and for example, 50 or less.
  • the filling rate of the anisotropic magnetic particles 8 is not particularly limited, and is, for example, 40% by volume or more, preferably 45% by volume or more, more preferably 50% by volume or more, still more preferably 55.
  • volume or more particularly preferably 60% by volume or more, and for example, 95% by volume or less, preferably 90% by volume or less.
  • the thickness of the magnetic layer 3 is, for example, twice or more, preferably three times or more, and for example, 20 times or less the radius R of the wiring 2. Specifically, the thickness of the magnetic layer 3 is, for example, 100 ⁇ m or more, preferably 200 ⁇ m or more, and for example, 2000 ⁇ m or less, preferably 1000 ⁇ m or less. The thickness of the magnetic layer 3 is the distance between one surface and the other surface of the magnetic layer 3.
  • the manufacturing method of the inductor 1 includes the first step to the sixth step.
  • the first step, the second step, and the third step are carried out in order, and then the fourth step, the fifth step, and the sixth step are carried out at the same time.
  • First step As shown in FIG. 2A, in the first step, first, the wiring 2 and the first release sheet 41 as a release film, which is an example of the substrate, are prepared.
  • the first release sheet 41 has a substantially sheet shape extending in the surface direction.
  • the material of the first release sheet 41 is appropriately selected according to its use and purpose, and specifically, for example, polyester such as polyethylene terephthalate (PET), for example, polyolefin such as polymethylpentene and polypropylene, and the like. Can be mentioned. Further, one surface and / or the other surface in the thickness direction of the first release sheet 41 may be subjected to a release process.
  • the thickness of the first release sheet 41 is, for example, 1 ⁇ m or more, and for example, 1000 ⁇ m or less.
  • the wiring 2 and the first release sheet 41 are arranged on the flat plate press 42.
  • the flat plate press 42 includes a first plate 43 and a second plate 44 that can be pressurized in the thickness direction.
  • the second plate 44 is arranged to face each other on one side in the thickness direction of the first plate 43 at intervals.
  • the flat plate press 42 includes a heat source (not shown).
  • the flat plate press 42 is provided with a chamber for evacuating the members arranged in the flat plate press 42 and used for the press.
  • the first release sheet 41 is arranged on the first plate 43, and then the wiring 2 is arranged on one side of the first release sheet 41 in the thickness direction. Specifically, the other end edge E4 of the wiring 2 in the thickness direction is brought into contact with one surface of the first release sheet 41.
  • the first release sheet 41 and the first plate 43 are arranged in the chamber.
  • Each member arranged in the subsequent steps is arranged in the chamber.
  • Step 2 In the second step, first, as shown in FIG. 2A, the first magnetic sheet 51 is prepared. At the same time, the second release sheet 45 and the release cushion sheet 46 are prepared.
  • the first magnetic sheet 51 has a substantially sheet shape extending in the surface direction. Specifically, the first magnetic sheet 51 has one surface and the other surface facing each other in the thickness direction.
  • the first magnetic sheet 51 is a magnetic sheet for forming at least a second region 12, (a part or all) of the third region 13 and a part of the outer region 5 in the magnetic layer 3.
  • the first magnetic sheet 51 is configured to be deformed (flowed) by a hot press (see FIG. 2B) in the second step.
  • the first magnetic sheet 51 contains the first anisotropic magnetic particles 81 as an example of the first magnetic particles and the first binder 91.
  • the first anisotropic magnetic particle 81 is the same as the anisotropic magnetic particle 8.
  • the first magnetic sheet 51 is formed in a substantially sheet shape from the first magnetic composition containing the first anisotropic magnetic particles 81 and the first binder 91.
  • the first anisotropic magnetic particles 81 are uniformly dispersed by the first binder 91 so as to be oriented in the plane direction.
  • the first magnetic sheet 51 is a single sheet or a laminated body (laminated sheet) of a plurality of sheets, preferably a laminated sheet, more preferably an inner sheet 54 that comes into contact with the wiring 2 during hot pressing, and an inner sheet 54. It is a two-layer sheet composed of an outer sheet 55 arranged on one side in the thickness direction of the above.
  • the volume ratio of the first anisotropic magnetic particles 81 in the first magnetic composition (first magnetic sheet 51) is, for example, 40% by volume or more, preferably 45% by volume or more, and more preferably 50% by volume. As mentioned above, it is more preferably 55% by volume or more, particularly preferably 60% by volume or more, and for example, 95% by volume or less, preferably 90% by volume or less.
  • the volume ratio of the first anisotropic magnetic particles 81 is within the above range, the first anisotropic magnetic particles 81 can be densely arranged in the peripheral region 4. As a result, the inductor 1 having excellent inductance can be obtained.
  • the volume ratio of the first anisotropic magnetic particles 81 in the first magnetic composition (first magnetic sheet 51) is, for example, 40% by volume or less, further 35% by volume or less, and 20. It is also preferable that the volume is 25% by volume or more, and more preferably 25% by volume or more.
  • the volume ratio of the first anisotropic magnetic particles 81 is within the above range, the presence of voids in the peripheral region 4 can be suppressed as much as possible. Therefore, in the peripheral region 4, the first anisotropic magnetic particles The 81 can be closely arranged together with the second anisotropic magnetic particles 82 and the third anisotropic magnetic particles 83 (described later). As a result, an inductor 1 having excellent inductance can be obtained.
  • the volume ratio of the anisotropic magnetic particles 8 of the outer sheet 55 is preferably higher than that of the inner sheet 54. high. By doing so, the first magnetic sheet 51 can more flexibly follow a region (hereinafter, referred to as a superior arc) exceeding 180 ° in cross-sectional view on the circumferential surface of the wiring 2.
  • the first binder 91 examples include a thermoplastic component such as an acrylic resin, and a thermosetting component such as an epoxy resin composition.
  • Acrylic resins include, for example, carboxyl group-containing acrylic acid ester copolymers.
  • the epoxy resin composition contains, for example, an epoxy resin (cresol novolac type epoxy resin or the like) as a main agent, a curing agent for epoxy resin (phenol resin or the like), and a curing accelerator for epoxy resin (imidazole compound or the like).
  • thermoplastic component and the thermosetting component can be used alone or in combination, respectively, and preferably the thermoplastic component and the thermosetting component are used in combination.
  • the first binder 91 contains at least a thermosetting component. If the first binder 91 contains at least a thermosetting component, the first magnetic sheet 51 can be used as a B stage having fluidity, and the first anisotropic magnetic particles 81 can be uniformly dispersed in a high blending ratio, and the first In the two-step heat pressing, the first magnetic sheet 51 can be flexibly deformed and covered by following the superior arc on the circumferential surface of the wiring 2.
  • first binder 91 first magnetic composition
  • the volume ratio of the first binder 91 in the first magnetic composition (first magnetic sheet 51) is the balance of the volume ratio of the magnetic particles 48 described above.
  • the first anisotropic magnetic particles 81 and the first binder 91 are blended and uniformly mixed to prepare the first magnetic composition.
  • a solvent organic solvent
  • the varnish is applied to a release film (not shown) and dried to prepare a first magnetic sheet 51.
  • the thickness of the first magnetic sheet 51 (in the case of a laminated sheet, the total thickness) is maintained so that the outer region 5 can cover at least one edge E1 in the thickness direction of the wiring 2 by the heat press in the second step.
  • the thickness of the first magnetic sheet 51 is, for example, 3 times or less, preferably 2 times or less, more preferably less than 2 times, and further preferably 1.5 times the radius R of the wiring 2. Below, it is particularly preferably 1.25 times or less, and for example, 0.1 times or more, preferably 0.2 times or more.
  • the second release sheet 45 has the same structure as the first release sheet 41, and the material thereof is appropriately selected from the above according to the application and purpose.
  • the release cushion sheet 46 is a release sheet capable of releasing the first magnetic sheet 51 from the second plate 44 after hot pressing (see FIG. 2C) in the second step described below. Further, the release cushion sheet 46 disperses the pressure of the second plate 44 at the time of hot pressing in the second step (see FIG. 2B) according to the shape of the dominant arc on the circumferential surface of the wiring 2, and the first It is also a cushion sheet for acting on the magnetic sheet 51 to cause deformation of the first magnetic sheet 51 and causing the first magnetic sheet 51 to follow the superior arc of the circumferential surface of the wiring 2.
  • the release cushion sheet 46 has a sheet shape extending in the surface direction, and has one surface and the other surface in the thickness direction.
  • One surface of the release cushion sheet 46 can come into contact with the second plate 44 (described later) in a planar manner in the second step.
  • One surface of the release cushion sheet 46 is a flat surface along the surface direction.
  • the other surface of the release cushion sheet 46 can come into contact with one surface of the second release sheet 45 in the thickness direction to deform the first magnetic sheet 51.
  • the other surface of the release cushion sheet 46 is arranged to face one surface and the other side in the thickness direction at intervals.
  • the other surface of the release cushion sheet 46 is a flat surface parallel to one surface and along the surface direction.
  • the release cushion sheet 46 includes a first layer 47, a second layer 48, and a third layer 49 in order on one side in the thickness direction.
  • the first layer 47 is a release layer (first release layer) with respect to the first magnetic sheet 51.
  • the first layer 47 is a thin film (skin film) having a shape extending along the plane direction.
  • the first layer 47 is a coating layer (outer shell layer) that covers the second layer 48 described below from the other side in the thickness direction. The other surface of the first layer 47 in the thickness direction may be subjected to an appropriate peeling treatment.
  • the first layer 47 can follow one surface of the first magnetic sheet 51 via the second release sheet 45 in the heat press in the next second step, while its thickness is substantially before and after the heat press. Has physical properties that do not change to. Further, the first layer 47 is a layer that can be extended in the plane direction (specifically, the first direction) in a hot press. The first layer 47 is harder than the second layer 48 described below at the temperature of the hot press in the second step (for example, 110 ° C.).
  • Examples of the material of the first layer 47 include a non-thermally flowing material that does not flow in at least the first direction by the heat pressing in the second step described later.
  • the non-thermally fluid material contains, for example, an aromatic polyester such as polybutylene terephthalate (PBT), for example, polyolefin as a main component.
  • PBT polybutylene terephthalate
  • the second layer 48 is an intermediate layer sandwiched between the first layer 47 and the third layer 49.
  • the second layer 48 is a fluidized layer that flows in the first direction and the thickness direction during hot pressing in the first step to make the first layer 47 follow one surface of the first magnetic sheet 51.
  • the second layer 48 is a flexible layer that is softer than the first layer 47, and can be specifically deformed during hot pressing in the second step. Specifically, the tensile storage elastic modulus E'of the second layer 48 at 110 ° C. is lower than, for example, the tensile storage elastic modulus E'of the first layer 47 at 110 ° C.
  • thermofluid material examples include a heat-fluid material that flows in the first direction and the thickness direction by the heat press in the second step described later.
  • the thermofluid material contains, for example, an olefin- (meth) acrylate copolymer (ethylene-methyl (meth) acrylate copolymer, etc.), an olefin-vinyl acetate copolymer, or the like as a main component.
  • the third layer 49 is a release layer (second release layer) with respect to the second plate 44.
  • the shape, physical properties, material and thickness of the third layer 49 are the same as those in the first layer 47.
  • the thickness of the release cushion sheet 46 is, for example, 50 ⁇ m or more, and is, for example, 500 ⁇ m or less.
  • the thicknesses of the first layer 47 and the third layer 49 are, for example, 5 ⁇ m or more and 50 ⁇ m or less, respectively, and the thickness of the second layer 48 is, for example, 30 ⁇ m or more and 300 ⁇ m or less.
  • the ratio of the thickness of the second layer 48 to the thickness of the first layer 47 is, for example, 2 or more, preferably 5 or more, more preferably 7 or more, and for example, 15 or less.
  • release cushion sheet 46 a commercially available product can be used.
  • a release film OT series manufactured by Sekisui Chemical Co., Ltd.
  • a release film OT-A and a release film OT-E is used.
  • the first release sheet 41, the wiring 2, the first magnetic sheet 51, the second release sheet 45, and the release cushion sheet 46 are sandwiched in this order by the flat plate press 42.
  • the wiring 2 and the first magnetic sheet 51 are heat-pressed by the flat plate press 42 via the first release sheet 41, the second release sheet 45, and the release cushion sheet 46.
  • the second plate 44 is moved so as to be close to the first plate 43, and the second plate 44 is pressed against the first magnetic sheet 51 via the release cushion sheet 46 and the second release sheet 45. (Press).
  • the first magnetic sheet 51 and the release cushion sheet 46 are heated by the heat source.
  • the press pressure is, for example, 0.1 MPa or more, preferably 0.3 MPa or more, and for example, 10 MPa or less, preferably 5 MPa or less.
  • the heating temperature is, for example, 100 ° C. or higher, preferably 105 ° C. or higher, and for example, 190 ° C. or lower, preferably 150 ° C. or lower.
  • the press time is, for example, 10 seconds or more, preferably 20 seconds or more, and for example, 1000 seconds or less, preferably 100 seconds or less.
  • the movement of the second plate 44 with respect to the first plate 43 closes the chamber, subsequently evacuating the atmosphere in the chamber, followed by the first plate 43, the first release.
  • the members adjacent to each other in the thickness direction are in contact with each other (close contact with each other). Subsequently, the movement of the second plate 44 further proceeds (heat pressing starts).
  • the overlapping portion 34 overlapping with the wiring 2 in the release cushion sheet 46 is narrowed in the thickness direction by the first semicircular arc surface 23 in the wiring 2 and the second plate 44. It is pressed (narrow pressure).
  • the non-overlapping portion 35 that does not overlap with the wiring 2 in the release cushion sheet 46 does not receive the above-mentioned narrowing pressure.
  • the heat-fluid material in the overlapping portion 34 of the second layer 48 flows (extrudes) (deforms) toward the non-overlapping portion 35 (specifically, plastically deforms). Then, the flow pressure based on the flow (extrusion) of the heat-fluid material from the overlapped portion 34 increases in the non-overlapping portion 35.
  • the flow pressure in the non-overlapping portion 35 acts on both sides in the thickness direction.
  • the flow pressure acting on the other side in the thickness direction pushes (pushes down) the first layer 47 in the non-overlapping portion 35 to the other side in the thickness direction, and at the same time, the first magnetism is pushed through the first layer 47.
  • the extruded portion 38 facing the non-overlapping portion 35 in the thickness direction is pushed out (pushed down) to the other side in the thickness direction.
  • the extruded portion 38 goes around the both end edges E3 and E4 of the wiring 2 in the first direction, and further, the second arc surface 24 of the wiring 2 ( However, it continues until the coating (excluding the other end edge E4 in the thickness direction) is covered (contacted with).
  • the other surface of the release cushion sheet 46 has a shape corresponding to, for example, the first semicircular arc surface 23 of the wiring 2.
  • the second release sheet 45 follows the other surface of the release cushion sheet 46, and specifically, follows the first layer 47.
  • the first magnetic sheet 51 after hot pressing is, for example, the B stage.
  • the thermosetting component contained in the first binder 91 of the first magnetic sheet 51 is the B stage.
  • the first magnetic sheet 51 after hot pressing has a shape including at least the second region 12 described above. That is, as shown in the enlarged view of FIG. 2B, in the second region 12, the anisotropic magnetic particles 8 are not oriented along the circumferential direction of the wiring 2.
  • the first magnetic sheet 51 has a raised portion 25 and a flat portion 26.
  • the raised portion 25 covers the outer peripheral surface of the wiring 2 (excluding the other end edge E4 in the thickness direction), and has a curved cross-sectional view similar to (or similar to) the first semicircular arc surface 23.
  • the raised portion 25 has a shape in which the center in the first direction protrudes (raised) toward one side in the thickness direction.
  • the ridge 25 has one second apex 27.
  • the flat portion 26 has a substantially flat plate shape extending from both end faces in the first direction of the raised portion 25 to both outer sides in the first direction.
  • the first magnetic sheet 51 is arranged on one surface in the thickness direction of the first release sheet 41 so as to cover the superior arc of the circumferential surface of the wiring 2.
  • the dominant arc on the circumferential surface of the wiring 2 is directed from the first semicircular arc surface 23 and both ends in the circumferential direction to the other end edge E4 in the thickness direction along the circumferential direction, but the other end edge in the thickness direction. It is an arc surface (a part of the circumferential surface) that does not reach E4.
  • the thickness of the first magnetic sheet 51 after hot pressing is set so that the shape having the raised portion 25 and the flat portion 26 described above is secured.
  • the ratio of the thickness of the first magnetic sheet 51 at the second top 27 to the radius R of the wiring 2 is, for example, 0.01 or more, preferably 0.03 or more, and for example, 8. Hereinafter, it is preferably 2 or less.
  • the ratio of the thickness of the flat portion 26 to the radius R of the wiring 2 is, for example, 0.05 or more, preferably 0.2 or more, and, for example, less than 5, preferably 1.5 or less.
  • the thickness of the first magnetic sheet 51 at the second top 27 is, for example, 1 ⁇ m or more, preferably 5 ⁇ m or more, and for example, 200 ⁇ m or less, preferably 100 ⁇ m or less.
  • the thickness of the flat portion 26 is, for example, 25 ⁇ m or more, preferably 50 ⁇ m or more, and for example, 200 ⁇ m or less, preferably 150 ⁇ m or less.
  • the first release sheet 41 is peeled off from the other surface of the first magnetic sheet 51 and the other end edge E4 of the wiring 2 in the thickness direction.
  • the second release sheet 45 and the release cushion sheet 46 are peeled off from one surface of the first magnetic sheet 51.
  • the second magnetic sheet 52 covers one surface of the first magnetic sheet 51 in the thickness direction.
  • the third magnetic sheet 53 covers the other surface of the first magnetic sheet 51 in the thickness direction.
  • the thermosetting components of the first binder 91 (see FIG. 2A), the second binder 92 (see FIG. 3D) and the third binder 93 (see FIG. 3D) are C-staged.
  • the second magnetic sheet 52 and the third magnetic sheet 53 are prepared.
  • Each of the second magnetic sheet 52 and the third magnetic sheet 53 can have the same configuration as the first magnetic sheet 51.
  • the second magnetic sheet 52 contains the second anisotropic magnetic particles 82 and the second binder 92, and in the second binder 92, for example, the second anisotropic magnetic particles 82 are contained. It is oriented in the plane direction. Since the thermosetting component contained in the second binder 92 is the B stage, the second magnetic sheet 52 is the B stage. Further, if the second magnetic sheet 52 is a laminated body (laminated sheet), the abundance ratio of the second anisotropic magnetic particles 82 is the same or different in each sheet, and preferably the same. Further, the abundance ratio of the second anisotropic magnetic particles 82 in the second magnetic sheet 52 may be the same as or different from the abundance ratio in the first anisotropic magnetic particles 81.
  • the abundance ratio of the second anisotropic magnetic particles 82 is different from the abundance ratio of the first anisotropic magnetic particles 81, and the abundance ratio of the first anisotropic magnetic particles 81 is 40% by volume or less.
  • the abundance ratio of the second anisotropic magnetic particles 82 can be set higher than the abundance ratio of the first anisotropic magnetic particles 81. Specifically, the ratio of the abundance ratio of the second anisotropic magnetic particles 82 in the second magnetic sheet 52 to the abundance ratio of the first anisotropic magnetic particles 81 in the first magnetic sheet 51 (second difference).
  • the abundance ratio of the square magnetic particles 82 in the second magnetic sheet 52 / the abundance ratio of the first anisotropic magnetic particles 81 in the first magnetic sheet 51) is, for example, 1.1 or more, preferably 1.2 or more. , More preferably 1.5 or more, and for example, 3 or less, preferably 2.5 or less.
  • the abundance ratio of the second anisotropic magnetic particles 82 in the second magnetic sheet 52 is, for example, 45% by volume or more, preferably 50% by volume or more, more preferably 55.
  • volume or more more preferably 60% by volume or more, and for example, 95% by volume or less, preferably 90% by volume or less.
  • the above-mentioned ratio and / or abundance ratio of the second anisotropic magnetic particle 82 is within the above-mentioned range, the presence of voids between the second magnetic sheet 52 and the first magnetic sheet 51 is suppressed as much as possible. Therefore, the first anisotropic magnetic particles 81 and the second anisotropic magnetic particles 82 can be densely arranged in the peripheral region 4. As a result, an inductor 1 having excellent inductance can be obtained.
  • the thickness of the second magnetic sheet 52 (total thickness in the case of a laminated sheet) is, for example, 0.5 times or more, preferably 1 time or more, more preferably 1.5 times or more the radius R of the wiring 2. For example, it is 5 times or less, preferably 3 times or less.
  • the third magnetic sheet 53 contains a third anisotropic magnetic particle 83 and a third binder 93 as an example of the third magnetic particle.
  • the third magnetic sheet 53 contains the third anisotropic magnetic particle 83.
  • the anisotropic magnetic particles 83 are oriented in the plane direction. Since the thermosetting component contained in the third binder 93 is the B stage, the third magnetic sheet 53 is the B stage. Further, if the third magnetic sheet 53 is a laminated body (laminated sheet), the abundance ratio of the third anisotropic magnetic particles 83 is the same or different in each sheet, and preferably the same. Further, the abundance ratio of the third anisotropic magnetic particles 83 in the third magnetic sheet 53 may be the same as or different from the abundance ratio in the first anisotropic magnetic particles 81.
  • the abundance ratio of the third anisotropic magnetic particles 83 is different from the abundance ratio of the first anisotropic magnetic particles 81, and the abundance ratio of the first anisotropic magnetic particles 81 is 40% by volume or less.
  • the abundance ratio of the third anisotropic magnetic particles 83 is set higher than the abundance ratio of the first anisotropic magnetic particles 81. Specifically, the ratio of the abundance ratio of the third anisotropic magnetic particles 83 in the third magnetic sheet 53 to the abundance ratio of the first anisotropic magnetic particles 81 in the first magnetic sheet 51 (third difference).
  • the abundance ratio of the square magnetic particles 83 in the third magnetic sheet 53 / the abundance ratio of the first anisotropic magnetic particles 81 in the first magnetic sheet 51) is, for example, 1.1 or more, preferably 1.2 or more. , More preferably 1.5 or more, and for example, 2.5 or less, preferably 2 or less.
  • the abundance ratio of the third anisotropic magnetic particles 83 in the third magnetic sheet 53 is, for example, 40% by volume or more, preferably 45% by volume or more, more preferably 50.
  • volume or more more preferably 55% by volume or more, particularly preferably 60% by volume or more, and for example, 95% by volume or less, preferably 90% by volume or less.
  • the inductor 1 having excellent inductance can be obtained.
  • the thickness of the third magnetic sheet 53 (total thickness in the case of a laminated sheet) is, for example, 0.5 times or more, preferably 1 time or more, and 5 times or less of the radius R of the wiring 2. , Preferably 3 times or less.
  • the second magnetic sheet 52 and the third magnetic sheet 53 are placed on the flat plate press 42. Specifically, between the first plate 43 and the second plate 44, the first release sheet 41, the third magnetic sheet 53, the wiring 2, the first magnetic sheet 51, the second magnetic sheet 52, and the like.
  • the second release sheet 45 and the second release sheet 45 are arranged in order toward one side in the thickness direction.
  • first release sheet 41 and / or the second release sheet 45 As the first release sheet 41 and / or the second release sheet 45, the first release sheet 41 and / or the second release sheet 45 removed in the third step described above may be reused. Alternatively, another first release sheet 41 and / or a second release sheet 45 may be prepared and arranged.
  • the release cushion sheet 46 as used in the 2nd step is not arranged on the flat plate press 42.
  • the third magnetic sheet 53, the wiring 2, the first magnetic sheet 51, and the second magnetic sheet 52 are hot-pressed by the flat plate press 42.
  • the conditions of the hot press are the same as those in the second step.
  • the other surface of the second magnetic sheet 52 follows the shape of the raised portion 25 of the first magnetic sheet 51. However, the flat shape of one surface of the second magnetic sheet 52 is maintained.
  • the second magnetic sheet 52 covers the superior arc of the circumferential surface of the wiring 2 and one surface of the first magnetic sheet 51 that covers one surface of the first release sheet 41 in the thickness direction (fourth step). Implementation).
  • the facing portion 28 facing the other end edge E4 in the thickness direction of the wiring 2 moves slightly to the other side in the thickness direction (backward, lowered, sunk). That is, on one surface of the third magnetic sheet 53, the opposing portion 28 moves outward in the first direction thereof, and is one in the thickness direction with respect to the second flat portion 29 parallel to one surface of the first release sheet 41. Slightly dented to the side.
  • the other surface of the first magnetic sheet 51 is in close contact with the second flat portion 29 on one surface of the third magnetic sheet 53, and slightly moves to one side in the thickness direction with respect to the other end edge E4 in the thickness direction of the wiring 2. To do.
  • the first magnetic sheet 53 covers the circumferential surface (arc surface including the other end edge E4 in the thickness direction) of the wiring 2 exposed from the other surface in the thickness direction of the first magnetic sheet 51. It is arranged on the other surface in the thickness direction of 51 (implementation of the fifth step).
  • the third magnetic sheet 53, the wiring 2, the first magnetic sheet 51, and the second magnetic sheet 52 are sequentially directed to one side in the thickness direction at the portion overlapping with the wiring 2. Arranged in order. Further, in the portion that does not overlap with the wiring 2 when projected in the thickness direction, the third magnetic sheet 53, the first magnetic sheet 51, and the second magnetic sheet 52 are arranged in order toward one side in the thickness direction. ..
  • the sixth step is carried out at the same time as the fourth step and the fifth step.
  • the conditions for the hot press are selected so that the thermosetting components of the first binder 91, the second binder 92, and the third binder 93 can be C-staged.
  • the first binder 91 in the first magnetic sheet 51, the second binder 92 in the second magnetic sheet 52, and the third binder 93 in the third magnetic sheet 53 are formed by the above-mentioned heat press.
  • the C stage is set.
  • the binder 9 contains a cured product (C stage-like product) of a thermosetting component of the B stage.
  • the boundary between the first magnetic sheet 51 and the second magnetic sheet 52 and the first magnetic sheet 51 and the third magnetic sheet 53 are formed.
  • the boundaries of 53 are extinguished, respectively, to form one magnetic layer 3 (see FIG. 1A) composed of a first magnetic sheet 51, a second magnetic sheet 52, and a third magnetic sheet 53.
  • FIG. 3F the above-mentioned boundaries are shown in order to clearly show the arrangement of the first magnetic sheet 51, the second magnetic sheet 52, and the third magnetic sheet 53.
  • the inductor 1 is a component of an electronic device, that is, a component for manufacturing an electronic device, and is distributed as a single component without including an electronic element (chip, capacitor, etc.) or a mounting substrate on which the electronic element is mounted. , An industrially usable device.
  • the inductor 1 is mounted (embedded) in, for example, an electronic device.
  • the electronic device includes a mounting board and electronic elements (chips, capacitors, etc.) mounted on the mounting board. Then, the inductor 1 is mounted on a mounting substrate via a connecting member such as solder, is electrically connected to other electronic devices, and acts as a passive element such as a coil.
  • the first magnetic sheet 51 is arranged on one surface in the thickness direction of the first release sheet 41 so as to cover the superior arc of the wiring 2. Therefore, in the first magnetic sheet 51 that covers the region corresponding to the superior arc of the wiring 2, the anisotropic magnetic particles 8 can be oriented along the circumferential direction of the wiring 2. Therefore, the obtained inductor 1 has excellent inductance.
  • the first anisotropic magnetic particles 81 are first released from the first magnetic sheet 51.
  • the sheet 41 is oriented along one surface in the thickness direction. Therefore, the first anisotropic magnetic particles face the one surface in the thickness direction of the first release sheet 41, and both ends in the circumferential direction in the region corresponding to the superior arc of the wiring 2, that is, in the second region 12. It is possible to prevent the 81 from being oriented along the circumferential direction of the wiring 2, and therefore the inductor 1 is excellent in DC superimposition characteristics.
  • the first magnetic sheet 51 covers the dominant arc on the circumferential surface of the wiring 2
  • one of the first release sheets 41 is formed from the circumferential direction of the wiring 2 at both edges in the circumferential direction of the dominant arc.
  • the first anisotropic magnetic particles 81 can be densely arranged while changing the orientation direction of the first anisotropic magnetic particles 81 in the direction along the direction. As a result, the inductor 1 having excellent inductance can be manufactured.
  • the second magnetic sheet 52 covers one surface of the first magnetic sheet 51 in the thickness direction, so that the first anisotropic magnetism in the peripheral region 4 of the wiring 2
  • the arrangement of the anisotropic magnetic particles 8 including the particles 81 and the second anisotropic magnetic particles 82 can be made dense. Therefore, an inductor 1 having a higher inductance can be manufactured.
  • the anisotropic magnetic particles 8 can be densely arranged in the peripheral region 4, so that the inductor 1 having excellent inductance and excellent DC superimposition characteristics can be manufactured. it can.
  • the third magnetic sheet 53 is further arranged on the other surface in the thickness direction of the first magnetic sheet 51, so that the first anisotropic magnetism in the peripheral region 4 of the wiring 2 is provided.
  • the arrangement of the anisotropic magnetic particles 8 including the particles 81, the second anisotropic magnetic particles, and the third anisotropic magnetic particles 83 can be made dense. Therefore, an inductor 1 having a higher inductance can be manufactured.
  • the third magnetic sheet 53 covers the circumferential surface exposed from the other surface in the thickness direction of the first magnetic sheet 51, in the region corresponding to the circumferential surface of the wiring 2 exposed from the first magnetic sheet 51.
  • the third anisotropic magnetic particle 83 can be densely arranged. As a result, the inductor 1 having excellent inductance can be manufactured.
  • the manufacturing time can be shortened as compared with the method in which the fourth step and the fifth step are carried out in order (see a modification described later). .. Therefore, the inductor 1 can be efficiently manufactured.
  • thermosetting components of the B stage of the first binder 91 and the third binder 93 are simultaneously C-staged, so that the B stage of the first binder 91 and the third binder 93 is formed.
  • the production time can be shortened as compared with the method in which the thermosetting components of the above are sequentially carried out (see a modification described later). Therefore, the inductor can be manufactured efficiently.
  • the fourth and fifth steps and the sixth step are carried out at the same time. However, the fourth and fifth steps can be carried out, and then the sixth step can be carried out.
  • the fourth step and the fifth step are carried out at the same time.
  • the fourth step and the fifth step can be carried out in order.
  • the first step, the second step, the fourth step, the third step, the fifth step, and the sixth step are carried out in order.
  • the wiring 2 is arranged on one side in the thickness direction of the first release sheet 41.
  • the first release sheet 41, the wiring 2, the first magnetic sheet 51, the second release sheet 45 and the release cushion sheet 46 are sandwiched by the flat plate press 42.
  • the wiring 2 and the first magnetic sheet 51 are hot-pressed by the flat plate press 42 via the first release sheet 41, the second release sheet 45, and the release cushion sheet 46.
  • the first magnetic sheet 51 is arranged on one surface in the thickness direction of the first release sheet 41 so as to cover the superior arc of the circumferential surface of the wiring 2.
  • the fourth step is carried out. Specifically, first, the press of the flat plate press 42 shown in FIG. 4B is released, and then, as shown in FIG. 4C, the first release sheet 41, the wiring 2 and the first magnetic sheet 51 are transferred to the flat plate press 42. With the arrangement, the second release sheet 45 and the release cushion sheet 46 are taken out from the flat plate press 42.
  • the second magnetic sheet 52 and the second release sheet 45 are separately arranged on one side in the thickness direction of the first magnetic sheet 51.
  • the second magnetic sheet 52 is hot-pressed using the flat plate press 42. As a result, the second magnetic sheet 52 covers one surface of the first magnetic sheet 51.
  • the third step is carried out. Specifically, first, the press of the flat plate press 42 shown in FIG. 5D is released, and the first release sheet 41, the wiring 2, the first magnetic sheet 51, the second magnetic sheet 52, and the second release sheet 45 are released. Take out from the flat plate press 42.
  • the first release sheet 41 is peeled off from the other surface of the first magnetic sheet 51 and the other end edge E4 of the wiring 2 in the thickness direction.
  • the fifth step is then carried out.
  • the first release sheet 41, the third magnetic sheet 53, the wiring 2, the first magnetic sheet 51, the second magnetic sheet 52, and the second release sheet 45 are put into the flat plate press 42. Deploy.
  • the third magnetic sheet 53 is hot-pressed by the flat plate press 42.
  • the third magnetic sheet 53 is arranged on the other surface of the first magnetic sheet 51 of the B stage so as to cover the other end edge E4 in the thickness direction of the wiring 2.
  • the other end edge E4 of the wiring 2 in the thickness direction is recessed into the facing portion 28.
  • the 6th step is carried out after the 5th step or at the same time as the 5th step. Specifically, the first magnetic sheet 51, the second magnetic sheet 52, and the third magnetic sheet 53 are C-staged to form the C-stage magnetic layer 3. As a result, the inductor 1 including the wiring 2 and the magnetic layer 3 covering the wiring 2 can be obtained.
  • the inductor 1 is then taken out from the flat plate press 42.
  • the first embodiment is preferable.
  • the manufacturing man-hours can be reduced and the inductor 1 can be easily manufactured.
  • the second release sheet 45 is arranged on the flat plate press 42, but the second release sheet 45 is not arranged and the heat press is performed. be able to.
  • the second anisotropic magnetic particles 82 are oriented in the plane direction, but the second anisotropic magnetic particles 82 may not be oriented in the plane direction.
  • the intersection 20 when projected in the thickness direction, the intersection 20 is arranged on one side of the other end edge E4 in the thickness direction of the wiring 2 at intervals in the thickness direction. For example, as shown in FIGS. 7A to 7B, it can overlap with the other end edge E4 in the thickness direction of the wiring 2.
  • the fourth region 14 of the inductor 1 of the second embodiment is narrower than the fourth region 14 of the inductor 1 of the first embodiment.
  • the angle ⁇ 2 of the central angle C2 of the fourth region 14 is less than 15 ° and exceeds 0 °.
  • the method for manufacturing the inductor 1 includes steps 1 to 6.
  • the first step, the second step, and the third step are carried out in order, and then the fourth step and the fifth step are carried out at the same time.
  • the sixth step is divided and carried out, and specifically, the sixth step is divided into a hot press in the second step and a hot press in the fourth and fifth steps.
  • the flat plate press 42 then sandwiches the first release sheet 41, the wiring 2, the first magnetic sheet 51, the second release sheet 45, and the release cushion sheet 46 in this order. Subsequently, the first magnetic sheet 51 is hot-pressed by the flat plate press 42. As a result, the first magnetic sheet 51 is arranged on one surface in the thickness direction of the first release sheet 41 so as to cover the superior arc of the circumferential surface of the wiring 2.
  • the first magnetic sheet 51 is heated by the heat source of the flat plate press 42 to make the first magnetic sheet 51 into a C stage (a part of the sixth step is carried out). ).
  • the first release sheet 41 is peeled off from the other surface of the first magnetic sheet 51 and the other end edge E4 of the wiring 2 in the thickness direction.
  • the second release sheet 45 and the release cushion sheet 46 are peeled off from one surface of the first magnetic sheet 51.
  • first, the first release sheet 41, the third magnetic sheet 53, the wiring 2, the first magnetic sheet 51, and the second magnetic sheet 52 are applied to the flat plate press 42.
  • the second release sheet 45 is arranged.
  • the first magnetic sheet 51 and the third magnetic sheet 53 are both B stages.
  • the first magnetic sheet 51 and the third magnetic sheet 53 are then pressed by the flat plate press 42.
  • the second magnetic sheet 52 covers one surface of the first magnetic sheet 51 in the thickness direction.
  • the third magnetic sheet 53 is arranged on the other surface in the thickness direction of the first magnetic sheet 51 so as to cover the other end edge E4 in the thickness direction of the wiring 2. At this time, the movement of the other surface of the relatively hard first magnetic sheet 51 is suppressed in the C stage, and the sinking of the other end edge E4 in the thickness direction of the wiring 2 into the facing portion 28 of the third magnetic sheet 53 is suppressed. Ru. That is, one surface of the third magnetic sheet 53 can be maintained flat.
  • the second magnetic sheet 52 and the third magnetic sheet 53 are heated by the heat source of the flat plate press 42 to make the second magnetic sheet 52 and the third magnetic sheet 53 into a C stage (implementation of the rest of the sixth step). ..
  • the inductor 1 provided with the wiring 2 and the magnetic layer 3 can be obtained.
  • the inductor 1 is taken out from the flat plate press 42.
  • the first embodiment is preferable.
  • the thermosetting components of the B stage of the first binder 91 and the third binder 93 are simultaneously C-staged, so that the first binder 91 and the third binder are formed.
  • the production time can be shortened as compared with the second embodiment in which the thermosetting components of the B stage of 93 are sequentially carried out. Therefore, the inductor 1 can be easily manufactured.
  • the fourth and fifth steps and the rest of the sixth step are carried out at the same time.
  • the fourth and fifth steps can be performed, followed by the rest of the sixth step.
  • the fourth step and the fifth step are carried out at the same time.
  • the fourth step and the fifth step can be carried out in order.
  • the first step, the second step, the fourth step, the third step, and the fifth step are carried out in order.
  • the sixth step is divided and carried out.
  • the wiring 2 is arranged on one surface in the thickness direction of the first release sheet 41.
  • the second step is then carried out, and the first magnetic sheet 51 is made into a C stage. That is, a part of the sixth step is carried out.
  • the first release sheet 41, the wiring 2, the first magnetic sheet 51, the second release sheet 45 and the release cushion sheet 46 are sandwiched in this order by the flat plate press 42, and then the wiring 2 and the second 1
  • the magnetic sheet 51 is hot-pressed by a flat plate press 42 via a first release sheet 41, a second release sheet 45, and a release cushion sheet 46.
  • the flat plate press 42 is used as a heat source to make the first magnetic sheet 51 into a C stage (a part of the sixth step is carried out).
  • the fourth step is carried out. Specifically, first, the press of the flat plate press 42 shown in FIG. 10B is released, and then, as shown in FIG. 10C, the first release sheet 41, the wiring 2 and the first magnetic sheet 51 are transferred to the flat plate press 42. With the arrangement, the second release sheet 45 and the release cushion sheet 46 are taken out from the flat plate press 42.
  • the second magnetic sheet 52 and the second release sheet 45 are separately arranged on one side in the thickness direction of the first magnetic sheet 51.
  • the second magnetic sheet 52 is hot-pressed using the flat plate press 42. As a result, the second magnetic sheet 52 covers one surface of the first magnetic sheet 51.
  • the press of the flat plate press 42 shown in FIG. 11D is released, and the first release sheet 41, the wiring 2, the first magnetic sheet 51, the second magnetic sheet 52, and the second.
  • the release sheet 45 is taken out from the flat plate press 42.
  • the first release sheet 41 is peeled off from the other surface of the first magnetic sheet 51 and the other end edge E4 of the wiring 2 in the thickness direction.
  • the fifth step first, specifically, the first release sheet 41, the third magnetic sheet 53, the wiring 2, the first magnetic sheet 51, the second magnetic sheet 52 and the second release sheet 52.
  • the mold sheet 45 is placed on the flat plate press 42.
  • the third magnetic sheet 53 is hot-pressed by the flat plate press 42.
  • the third magnetic sheet 53 is arranged on the other surface of the first magnetic sheet 51 of the C stage so as to cover the other end edge E4 in the thickness direction of the wiring 2.
  • the rest of the 6th step is carried out after the 5th step or at the same time as the 5th step.
  • the second magnetic sheet 52 and the third magnetic sheet 53 are C-staged by the heat source of the flat plate press 42, and a magnetic layer composed of the third magnetic sheet 53, the first magnetic sheet 51, and the second magnetic sheet 52.
  • Form 3 As a result, the inductor 1 including the wiring 2 and the magnetic layer 3 covering the wiring 2 can be obtained.
  • the inductor 1 is then taken out from the flat plate press 42.
  • the first magnetic sheet 51 is C-staged together with the second step of arranging the first magnetic sheet 51 on the wiring 2 shown in FIG. 10B, but the first magnetic sheet 51 is C.
  • the time for staging is not particularly limited as long as it is before the fifth step (see FIG. 5G) in which the other surface of the first magnetic sheet 51 is arranged on the third magnetic sheet 53, and for example, the second stage shown in FIG. 11D. It can also be carried out together with the fourth step of arranging the magnetic sheet 52.
  • first magnetic sheet 51 and the second magnetic sheet 52 can be simultaneously C-staged.
  • the second magnetic sheet 52 is arranged on one surface of the first magnetic sheet 51 of the B stage, and then the first magnetic sheet 51 and the second magnetic sheet 52 are simultaneously made into the C stage. Further, the second magnetic sheet 52 can be C-staged, then the third magnetic sheet 53 can be arranged on the other surface of the first magnetic sheet 51, and then C-staged.
  • the third magnetic sheet 53 can be arranged on the other surface of the first magnetic sheet 51, and then the second magnetic sheet 52 can be arranged on one surface of the first magnetic sheet 51.
  • the third magnetic sheet 53 and the second magnetic sheet 52 can be C-staged at the same time, the third magnetic sheet 53 is C-staged, and then the second magnetic sheet 52 is C-staged. You can also do it.
  • the wiring 2 is arranged not on the first release sheet 41 but on one surface in the thickness direction of the third magnetic sheet 53 (an example of the substrate) of the C stage. You can also.
  • the third magnetic sheet 53 of the C stage is prepared and arranged on one surface in the thickness direction of the first release sheet 41.
  • the third binder 93 in the third magnetic sheet 53 contains a cured product of the thermosetting component of the B stage.
  • the first release sheet 41, the third magnetic sheet 53 of the C stage, the wiring 2, the first magnetic sheet 51, the second release sheet 45, and the release cushion sheet 46 are sandwiched by the flat plate press 42.
  • the second step is carried out.
  • the first release sheet 41, the third magnetic sheet 53, the wiring 2, the first magnetic sheet 51, the second release sheet 45, and the release cushion sheet 46 are sandwiched in this order by the flat plate press 42. ..
  • the third magnetic sheet 53, the wiring 2, and the first magnetic sheet 51 are heat-pressed by the flat plate press 42 via the first release sheet 41, the second release sheet 45, and the release cushion sheet 46.
  • the first magnetic sheet 51 is arranged on one surface in the thickness direction of the third magnetic sheet 53 of the C stage so as to cover the superior arc of the circumferential surface of the wiring 2.
  • the press of the flat plate press 42 shown in FIG. 13B is released, and then, as shown in FIG. 13C, the first release sheet 41, the third magnetic sheet 53, the wiring 2 and the first With the magnetic sheet 51 placed on the flat plate press 42, the second release sheet 45 and the release cushion sheet 46 are taken out from the flat plate press 42.
  • the second magnetic sheet 52 and the second release sheet 45 are separately arranged on one side of the first magnetic sheet 51 in the thickness direction.
  • the first release sheet 41, the third magnetic sheet 53, the wiring 2, the first magnetic sheet 51, the second magnetic sheet 52, and the second release sheet 45 are sandwiched by the flat plate press 42.
  • the second magnetic sheet 52 is then pressed by the flat plate press 42.
  • the second magnetic sheet 52 and the first magnetic sheet 51 are C-staged.
  • the magnetic layer 3 composed of the third magnetic sheet 53, the first magnetic sheet 51, and the second magnetic sheet 52 is formed.
  • the first magnetic sheet 51 and the second magnetic sheet 52 are simultaneously C-staged.
  • the second magnetic sheet 52 is C-staged. You can also do it.
  • the wiring 2 can be arranged on one surface of the first release sheet 41 via the pressure-sensitive adhesive layer 61.
  • the pressure-sensitive adhesive layer 61 extends in the second direction and forms a thin piece.
  • the ratio of the length of the pressure-sensitive adhesive layer 61 in the first direction to the radius R of the wiring 2 is, for example, 0.5 or less and 0.25 or less.
  • the dominant arc on the circumferential surface of the wiring 2 is covered so that the first magnetic sheet 51 is filled on both sides of the pressure-sensitive adhesive layer 61 in the first direction.
  • the pressure-sensitive adhesive layer 61 may remain between the third magnetic sheet 53 and the other end edge E4 in the thickness direction, or, although not shown, after the second step, It can also be removed.
  • the wiring 2 in the first step, can be arranged on one side of the first release sheet 41 with a gap 62.
  • a spacer (not shown) between both ends of the wiring 2 in the second direction and the first release sheet 41, the other end of the wiring 2 in the thickness direction is tensioned on both sides in the second direction.
  • a gap 62 is secured to separate the edge E4 from one surface of the wiring 2.
  • the first magnetic sheet 51 is filled in the gap 62 to cover the entire circumferential surface of the wiring 2.
  • one surface of the first magnetic sheet 51 is covered with the second magnetic sheet 52.
  • heating and pressurization are simultaneously performed to make the first binder 91 of the first magnetic sheet 51 and the second binder 92 of the second magnetic sheet 52 into a C stage.
  • the magnetic layer 3 composed of the first magnetic sheet 51 and the second magnetic sheet 52 is formed.
  • the other end edge E4 in the thickness direction of the wiring 2 can be covered with the magnetic layer 3 without arranging the third magnetic sheet 53. Therefore, the man-hours can be reduced.
  • the third magnetic sheet 53 can be further arranged on the other surface of the second magnetic sheet 52, if necessary.
  • the wiring 2 is brought into contact with one surface of the first release sheet 41, and as shown by the virtual line arrow in FIG. 6B, then the press conditions in the second step and the like Can be adjusted so that the first magnetic composition forming the first magnetic sheet 51 slips into the other side of the wiring 2 in the thickness direction so as to cover the other end edge E4 of the wiring 2 in the thickness direction.
  • the spacer described above becomes unnecessary, and therefore the inductor 1 can be easily manufactured.
  • the first anisotropic magnetic particle 81 is mentioned as an example of the first magnetic particle, but for example, the first magnetic particle does not have anisotropy. , For example, it can also have isotropic properties.
  • the shape of such a first isotropic magnetic particle include a substantially spherical shape.
  • the substantially spherical first isotropic magnetic particles include substantially spherical iron particles.
  • the average particle size of the first isotropic magnetic particles is, for example, 0.1 ⁇ m or more, preferably 0.5 ⁇ m or more, and for example, 200 ⁇ m or less, preferably 150 ⁇ m or less.
  • the first anisotropic magnetic particle 81 Is oriented in the plane direction on the first magnetic sheet 51, but is not limited to this, and may not be oriented along the plane direction on the first magnetic sheet 51.
  • the third anisotropic magnetic particle 83 is mentioned as an example of the third magnetic particle, but for example, the third magnetic particle does not have anisotropy. , For example, it can also have isotropic properties.
  • the shape of such a third isotropic magnetic particle include a substantially spherical shape.
  • the substantially spherical third isotropic magnetic particle include substantially spherical iron particles.
  • the average particle size of the third isotropic magnetic particle is, for example, 0.1 ⁇ m or more, preferably 0.5 ⁇ m or more, and for example, 200 ⁇ m or less, preferably 150 ⁇ m or less.
  • the third anisotropic magnetic particle 83 is The third magnetic sheet 53 is oriented in the plane direction, but the present invention is not limited to this, and the third magnetic sheet 53 may not be oriented in the plane direction.
  • the anisotropic magnetic particles 8 are oriented along the circumferential direction of the wiring 2 at least in the first region 11.
  • the present invention is not limited to this, and the wiring 2 may not be oriented along the circumferential direction.
  • the ratio (filling rate) of the magnetic particles (first magnetic particles, second anisotropic magnetic particles 82, and third magnetic particles) in the magnetic layer 3 is not limited to the above, and is not limited to the above, for example, wiring. It may be higher or lower as the distance from 2 is increased.
  • the abundance ratio of the second anisotropic magnetic particles 82 in the second magnetic sheet 52 is set to first. It is set higher than the abundance ratio of magnetic particles in the magnetic sheet 51.
  • the magnetic layer 3 may be a plurality of layers.
  • the wiring 2 may be pressed with one magnetic sheet for covering the outer peripheral surface of the wiring 2 among the plurality of magnetic sheets, and then the remaining magnetic sheets may be pressed against them.
  • a plurality of magnetic sheets can be pressed against the wiring 2 at one time (collectively).
  • the first magnetic sheet 51, the second magnetic sheet 52, and the third magnetic sheet 53 of one embodiment can be pressed against the wiring 2 at once.
  • the first step shown in FIG. 13A, the second step shown in FIG. 13B, and the fourth step shown in FIG. 13C can be carried out at the same time.
  • Examples and comparative examples are shown below, and the present invention will be described in more detail.
  • the present invention is not limited to Examples and Comparative Examples.
  • specific numerical values such as the compounding ratio (content ratio), physical property values, and parameters used in the following description are the compounding ratios corresponding to those described in the above-mentioned "Form for carrying out the invention".
  • Content ratio can be replaced with the upper limit (numerical value defined as “less than or equal to” or “less than”) or lower limit (numerical value defined as "greater than or equal to” or “excess”). it can.
  • Example 1 Provide example of inductor based on the first embodiment>
  • the inductor 1 was manufactured based on the first embodiment. Specifically, as shown in FIGS. 2A to 3F, the first step, the second step, and the third step were carried out in order, and then the fourth step, the fifth step, and the sixth step were carried out at the same time. ..
  • wiring 2 having a radius R of 110 ⁇ m was prepared.
  • the radius R1 of the lead wire 6 is 100 ⁇ m, and the thickness R2 of the insulating layer 7 is 10 ⁇ m.
  • a first release sheet 41 made of PET having a thickness of 50 ⁇ m was prepared.
  • the wiring 2 was subsequently arranged on one side of the first release sheet 41 in the thickness direction.
  • the first magnetism is composed of a laminated sheet consisting of an inner sheet 54 in which the proportion of the anisotropic magnetic particles 8 is 50% by volume and an outer sheet 55 in which the proportion of the anisotropic magnetic particles 8 is 60% by volume.
  • the sheet 51 was prepared as a B stage sheet.
  • the formulations of the inner sheet 54 and the outer sheet 55 are as set forth in Table 1.
  • a release film manufactured by Mitsui Chemicals Tohcello Co., Ltd. made of TPX (registered trademark) was prepared.
  • a release cushion sheet 46 in which two release films OT-A110 (manufactured by Sekisui Chemical Co., Ltd.) were laminated was prepared.
  • the thickness of the release cushion sheet 46 (total thickness of the release film OT-A110) is 110 ⁇ m, that is, the first layer 47 having a thickness of 15 ⁇ m, the second layer 48 having a thickness T2 of 80 ⁇ m, and the thickness of 15 ⁇ m. It is provided with a third layer 49.
  • the first layer 47 and the third layer 49 have a tensile storage elastic modulus E'at 110 ° C. of 190 MPa, and the material thereof contains polybutylene terephthalate as a main component.
  • the second layer 48 has a tensile storage elastic modulus E'at 110 ° C. of 5.6 MPa, and the material thereof contains an ethylene-methyl methacrylate copolymer as a main component.
  • the first release sheet 41, the wiring 2, the first magnetic sheet 51, the second release sheet 45, and the release cushion sheet 46 were sandwiched in this order by the flat plate press 42.
  • the wiring 2 and the first magnetic sheet 51 were subsequently hot-pressed by the flat plate press 42 at a press pressure of 2 MPa and 110 ° C. under press conditions for 60 seconds.
  • FIG. 17A shows an SEM photograph of the cross section of the wiring 2 and the first magnetic sheet 51 after the second step.
  • the third step In the third step, first, the press of the flat plate press 42 shown in FIG. 2B is released, and then, as shown in FIG. 2C, the first release sheet 41, the wiring 2, the first magnetic sheet 51, and the second release mold are released. The sheet 45 and the release cushion sheet 46 were taken out from the flat plate press 42. Subsequently, the first release sheet 41 was peeled off from the other surface of the first magnetic sheet 51 and the other end edge E4 in the thickness direction of the wiring 2. Further, the second release sheet 45 and the release cushion sheet 46 were peeled off from one surface of the first magnetic sheet 51.
  • the first release sheet 41 As shown in FIG. 3D, then, between the first plate 43 and the second plate 44, the first release sheet 41, the third magnetic sheet 53, the wiring 2, the first magnetic sheet 51, and the second magnetic The sheet 52 and the second release sheet 45 (PET film) were arranged in order toward one side in the thickness direction.
  • the third magnetic sheet 53, the wiring 2, the first magnetic sheet 51 and the second magnetic sheet 52 were subsequently pressed into a flat plate press 42 at a press pressure of 2 MPa and 170 ° C. under press conditions for 900 seconds. Heat pressed by.
  • the thermosetting components in the first binder 91, the second binder 92, and the third binder 93 were C-staged.
  • the circumferential surface of the wiring 2 is covered with the magnetic layer 3 composed of the first magnetic sheet 51, the second magnetic sheet 52, and the third magnetic sheet 53 of the C stage, and the inductor 1 shown in FIGS. 1A to 1B is formed. Manufactured.
  • the inductor 1 was then taken out from the flat plate press 42.
  • FIG. 17B An SEM photograph of a cross section of the inductor 1 is shown in FIG. 17B.
  • Example 2 Example of manufacturing an inductor based on a modified example of the first embodiment>
  • the inductor 1 was manufactured based on the modified examples of the first embodiment shown in FIGS. 4A to 6H. Specifically, the same treatment as in Example 1 was carried out except that the first step, the second step, the fourth step, the third step, the fifth step and the sixth step were carried out in order.
  • This inductor 1 is as shown in FIGS. 7A to 7B, and an SEM photograph of its cross section is shown in FIG.
  • Example 3 to Example 5 The inductor 1 was manufactured in the same manner as in Example 1 except that the formulation of the first magnetic sheet 51 was changed according to Table 1.
  • Comparative Example 1 On one side of the first plate 43 in the thickness direction, in order, a first release sheet 41 made of PET having a thickness of 50 ⁇ m, a third magnetic sheet 53 of the C stage, a first adhesive layer of the B stage, and wiring similar to that of the first embodiment. 2. Release of the second adhesive layer of the B stage, the second magnetic sheet 52 of the C stage, the second release sheet 45 made of TPX, and two release films OT-A110 (manufactured by Sekisui Chemical Industry Co., Ltd.). A mold release sheet 46 was arranged, and a laminate made of these was sandwiched between the first plate 43 and the second plate 44.
  • Both the first adhesive layer and the second adhesive layer are B stage sheets that do not contain anisotropic magnetic particles 8 and are made of a thermosetting resin.
  • the thickness of the first adhesive layer and the second adhesive layer was 2 ⁇ m, respectively.
  • the formulations of the C-stage second magnetic sheet 52 and the C-stage third magnetic sheet 53 are as shown in Table 1, and both were completely cured cured products.
  • the above-mentioned laminate was hot-pressed by the flat plate press 42 at a pressing pressure of 2 MPa and 170 ° C. for 900 seconds with the flat plate press 42 to manufacture the inductor 1.
  • FIG. 19 shows an SEM photograph of a cross section of the inductor 1 of Comparative Example 1.
  • voids were formed between the second arcuate surface 24 of the wiring 2 and the edges E2 and E3 at both ends in the first direction and the first magnetic sheet 51 (magnetic layer 3).
  • Comparative Example 2 On one side of the first plate 43 in the thickness direction, in order, a first release sheet 41 made of PET having a thickness of 50 ⁇ m, a third magnetic sheet 53 of the C stage, a first pressure-sensitive adhesive layer, and wiring 2 similar to Example 1. , The second pressure-sensitive adhesive layer, the second magnetic sheet 52 of the C stage, the second release sheet 45 made of TPX, and the release film OT-A110 (manufactured by Sekisui Chemical Co., Ltd.) are laminated together. The sheet 46 was arranged, and the laminated body made of these was sandwiched between the first plate 43 and the second plate 44.
  • the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer do not contain anisotropic magnetic particles 8 and are made of an acrylic pressure-sensitive adhesive (adhesive). Is.
  • the thickness of the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer was 5 ⁇ m, respectively.
  • the formulations of the C-stage second magnetic sheet 52 and the C-stage third magnetic sheet 53 are as shown in Table 1, and both were completely cured cured products.
  • the above-mentioned laminate was hot-pressed by the flat plate press 42 at a pressing pressure of 2 MPa and 110 ° C. for 60 seconds with the flat plate press 42 to manufacture the inductor 1.
  • a void was formed between the second arc surface 24 of the wiring 2 and the both end edges E2 and E3 in the first direction and the first magnetic sheet 51 (magnetic layer 3).
  • the filling rate of the anisotropic magnetic particles 8 in the peripheral region 4 of the inductor 1 was calculated according to the binarization of the cross-sectional view of the SEM photograph. Specifically, in the SEM photograph, white is identified as anisotropic magnetic particles 8, black is identified as binder 9, and the anisotropic magnetic particles 8 are identified from the ratio of the cross-sectional area of white in the first region 11.
  • the inductor is mounted on, for example, an electronic device.
  • Binder 41 1st release sheet 51 1st magnetic sheet 52 2nd magnetic sheet 52 53 Third magnetic sheet 81 First anisotropic magnetic particles (an example of the first magnetic particles) 82 Second anisotropic magnetic particle (an example of the second magnetic particle) 83 Third anisotropic magnetic particle (an example of the third magnetic particle) 91 1st binder 92 2nd binder 93 3rd binder

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)

Abstract

Procédé de fabrication d'un inducteur 1 comprenant : une première étape dans laquelle un fil 2 est positionné sur une première surface d'un substrat dans la direction d'épaisseur, le fil 2 présentant une section transversale de forme sensiblement circulaire et comprenant un conducteur 6 et une couche isolante 7 qui recouvre le conducteur 6; une deuxième étape dans laquelle une première feuille magnétique 51, contenant des premières particules magnétiques et un premier liant 91 dans lequel les premières particules magnétiques sont dispersées, est positionnée sur une première surface d'une première feuille anti-adhésive 41 dans la direction d'épaisseur de façon à recouvrir un arc principal de la surface circonférentielle du fil 2; et une quatrième étape dans laquelle une seconde feuille magnétique 52, contenant des secondes particules magnétiques et un second liant 92 dans lequel les secondes particules magnétiques sont dispersées, est utilisée pour recouvrir une première surface, dans la direction d'épaisseur, de la première feuille magnétique 51 qui recouvre l'arc principal de la surface circonférentielle du fil 2 et la première surface de la première feuille anti-adhésive 41.
PCT/JP2020/004236 2019-03-12 2020-02-05 Procédé de fabrication d'inducteur WO2020183996A1 (fr)

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WO2022102712A1 (fr) * 2020-11-12 2022-05-19 日東電工株式会社 Feuille magnétique et bobine d'induction

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JPS4888475U (fr) * 1972-01-28 1973-10-25
JPH1140979A (ja) * 1997-07-22 1999-02-12 Tokin Corp ノイズ対策部品
JP2009009985A (ja) * 2007-06-26 2009-01-15 Sumida Corporation コイル部品
JP2014165363A (ja) * 2013-02-26 2014-09-08 Nitto Denko Corp 軟磁性熱硬化性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置
JP2014183193A (ja) * 2013-03-19 2014-09-29 Dexerials Corp アンテナ装置及び電子機器
JP2019220618A (ja) * 2018-06-21 2019-12-26 日東電工株式会社 インダクタ

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JPWO2009075110A1 (ja) 2007-12-12 2011-04-28 パナソニック株式会社 インダクタンス部品およびその製造方法
JP5880805B2 (ja) 2014-02-07 2016-03-09 株式会社村田製作所 高周波信号伝送線路及びその製造方法

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Publication number Priority date Publication date Assignee Title
JPS4888475U (fr) * 1972-01-28 1973-10-25
JPH1140979A (ja) * 1997-07-22 1999-02-12 Tokin Corp ノイズ対策部品
JP2009009985A (ja) * 2007-06-26 2009-01-15 Sumida Corporation コイル部品
JP2014165363A (ja) * 2013-02-26 2014-09-08 Nitto Denko Corp 軟磁性熱硬化性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置
JP2014183193A (ja) * 2013-03-19 2014-09-29 Dexerials Corp アンテナ装置及び電子機器
JP2019220618A (ja) * 2018-06-21 2019-12-26 日東電工株式会社 インダクタ

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022102712A1 (fr) * 2020-11-12 2022-05-19 日東電工株式会社 Feuille magnétique et bobine d'induction

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TW202036614A (zh) 2020-10-01
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JP7398197B2 (ja) 2023-12-14
JP2020150063A (ja) 2020-09-17

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