WO2020181747A1

WO2020181747A1 - Anisotropic conductive adhesive structure and production method therefor

Info

Publication number: WO2020181747A1
Application number: PCT/CN2019/104684
Authority: WO
Inventors: 张炳忠; 罗玉皆
Original assignee: 深圳市润沃自动化工程有限公司
Priority date: 2019-03-08
Filing date: 2019-09-06
Publication date: 2020-09-17
Also published as: CN109796903A

Abstract

The present application relates to an anisotropic conductive adhesive structure and a production method therefor. The anisotropic conductive adhesive structure comprises several conductive wires distributed evenly, and a binding layer for fixing the several conductive wires; and two ends of the conductive wire penetrate through the binding layer and the two ends of the conductive wire are used for conduction. Since the conductive wires are used to replace conductive beads in the prior art, the anisotropic conductive adhesive is simpler in structure and higher in plasticity, and has higher resolution for use; moreover, the production procedures are simple, the production efficiency is high, and the cost is low.

Description

Anisotropic conductive adhesive structure and production method thereof

This application is based on a Chinese patent application with an application number of 201910176391.5 and an application date of March 8, 2019, and claims its priority. The entire content of this application is hereby incorporated into this application as a whole.

Technical field

This application relates to electronic connectors, and more specifically to an anisotropic conductive adhesive structure and its production method.

Background technique

Anisotropic conductive adhesive is usually used as an electronic connector in electronic products, especially in the connection between the display screen and the circuit. As shown in Figure 1, the existing anisotropic conductive adhesive usually uses a metal conductive ball with an insulating layer to be placed in the adhesive, and it needs to be squeezed forcefully to break the military support layer outside the metal conductive ball. Then it can be turned on, which is very inconvenient for practical use. In addition, the existing anisotropic conductive adhesive is very complicated in the production process and the cost is relatively high. For example, the production of metal conductive balls requires more processes. It is necessary to ensure that the diameter of each metal conductive ball is the same, otherwise it will affect the extrusion. Use effect; and the volume is small, and an insulating layer is wrapped on the outside, which is technically difficult.

Application content

The purpose of this application is to overcome the defects of the prior art and provide an anisotropic conductive adhesive structure and a production method thereof.

In order to achieve the above objectives, this application adopts the following technical solutions:

An anisotropic conductive adhesive structure, comprising a plurality of uniformly distributed conductive wires and an adhesive layer for fixing the plurality of conductive wires; the two ends of the conductive wire penetrate the adhesive layer, and the two ends of the conductive wire are used for guiding through.

The further technical solution is: the conductive wire includes a conductive body and an insulating layer wrapped on the outside of the conductive body; the insulating layer is connected and fixed with the adhesive layer.

A further technical solution is that the conductive filaments are arranged on the adhesive layer extending outward to form a block structure or a sheet structure.

The further technical solution is that the conductive wires are arranged parallel to each other.

The further technical solution is: the thickness of the block structure is 0.01-0.15 mm.

The further technical solution is that the conductor is a conductive metal and has a diameter of 0.005-0.01 mm.

The further technical solution is that: two ends of the conductive wire are provided with nail heads for increasing the contact area.

The further technical solution is: a connecting layer is provided on the outer side of the insulating layer; and recesses or protrusions are uniformly distributed on the outer side of the connecting layer.

A production method of anisotropic conductive adhesive includes the following steps:

Step 1: Pull the conductive metal strip into a metal wire with a set diameter;

Step 2: Wrap an insulating layer on the outside of the metal wire;

Step 4. Distribute the insulating layer evenly in the mold according to the set arrangement sequence, and pour the bonding glue; then vibrate, press and heat the mold to ensure that the bonding glue is solidified, and the conductive wire and the bonding glue form a block状结构;

Step 5: Take out the block structure and cross-cut the block structure according to the set thickness to obtain a sheet or block anisotropic conductive adhesive structure.

The further technical solution is: the cross cutting in step 5 is cold cutting or laser cutting.

The further technical proposal is that it also includes step six. The two ends of the sheet-shaped or block-shaped anisotropic conductive adhesive structure are formed with nail heads through electroplating, electroforming or sputtering.

An anisotropic conductive adhesive structure for convenient connection, comprising a conductive adhesive body; the conductive adhesive body is uniformly distributed with conductive wires, and both ends of the conductive wire extend to both sides of the conductive adhesive body; one end of the conductive wire or Both ends are provided with nail heads for convenient connection.

The further technical solution is that the nail head is an arc-shaped bulge.

The further technical solution is that the nail head is provided with a groove.

The further technical solution is: the nail head is provided with a deformed part; the deformed part includes a connecting part connected with the nail head, and a top crown part arranged at the end of the connecting part; the cross-sectional area of the top crown is larger than the connecting part. Sectional area of the section.

The further technical solution is: a concave hole is provided in the center of the nail head; the concave hole is a stepped hole.

The further technical solution is that the nail head includes a buffer part connected with the conductive wire and a contact part provided at the end of the buffer part; the cross-sectional area of the contact part is larger than the cross-sectional area of the buffer part.

The further technical solution is that the nail head has a needle-shaped structure.

Compared with the prior art, the present application has the following beneficial effects: the conductive adhesive replaces the prior art conductive beads with conductive filaments, which is simpler in structure, more plastic, and has higher resolution in use; production process Simple, high production efficiency and low cost.

The application will be further described below in conjunction with the drawings and specific embodiments.

Description of the drawings

Figure 1 is a schematic structural diagram of the prior art;

FIG. 2 is a top view of an anisotropic conductive adhesive structure of this application;

Figure 3 is a front view of an anisotropic conductive adhesive structure of this application;

4 is a cross-sectional view of a conductive wire with an anisotropic conductive adhesive structure in this application;

5 is a structural diagram and partial cross-sectional view of a connection layer of an anisotropic conductive adhesive structure of the present application;

FIG. 6 is a cut view of an anisotropic conductive adhesive structure of this application;

FIG. 7 is a structural diagram of a nailed head with an anisotropic conductive adhesive structure of the present application;

FIG. 8 is a structural diagram of a grooved nail head of an anisotropic conductive adhesive structure of the present application;

FIG. 9 is a structural diagram of a nail head with a deformable portion of an anisotropic conductive adhesive structure of the present application;

FIG. 10 is a structural diagram of a nail head provided with a recessed hole of an anisotropic conductive adhesive structure of the present application;

11 is a structural diagram of a nail head provided with a contact portion of an anisotropic conductive adhesive structure of the present application;

Fig. 12 is a view of a pin-shaped nail head of an anisotropic conductive adhesive structure of this application.

detailed description

In order to fully understand the technical content of the present application, the technical solution of the present application will be further introduced and illustrated below in conjunction with specific embodiments, but it is not limited thereto.

Figures 2 to 12 are drawings of embodiments of the application.

An anisotropic conductive adhesive structure 10, as shown in FIGS. 2 to 3, includes a plurality of uniformly distributed conductive wires 11 and an adhesive layer 12 for fixing the plurality of conductive wires 11. Both ends of the conductive wire 11 penetrate the adhesive layer 12, and both ends of the conductive wire 11 are used for conduction. The conductive wire 11 is used as a signal transmission channel and is usually used to electrically connect the display screen and the control circuit. Since the number of conductive wires 11 can be designed according to the designer's wishes, the resolution of the display screen can be improved.

As shown in FIG. 4, the conductive wire 11 includes a conductive body 111 and an insulating layer 112 wrapped around the outer side of the conductive body 111. The insulating layer 112 is connected and fixed to the adhesive layer 12. Each conductor 111 can only be conducted at both ends, and cannot be conducted with the adjacent conductor 111, so the outer insulating layer and the adhesive layer 12 can both play a role of isolation.

The conductive filaments 11 extend outwardly and are arranged on the adhesive layer 12 to form a block structure or a sheet structure. The conductive wires 11 are vertically arranged in the adhesive layer 12, and can be centered on one wire and continuously extend outward to form a sheet-like or block-like structure. The conductive wires 11 in the adhesive layer 12 can all be used as conductive wires.

Preferably, the conductive wires 11 are arranged parallel to each other, which is convenient to cut into pieces during production, and can also save materials.

Preferably, the thickness of the block structure is 0.01-0.15 mm.

Preferably, the conductor 111 is a conductive metal and has a diameter of 0.005-0.01 mm. Generally, the conductor 111 is a conductive metal such as gold, silver, and copper.

Wherein, as shown in Fig. 7, two ends of the conductive wire 11 are provided with nail heads 13 for increasing the contact area. The nail heads 13 of each conductive wire 11 are not related to each other, and when in contact with electrical components, the contact area can be increased and the conduction rate can be increased.

As shown in FIG. 5, in order to connect the insulating layer 112 and the adhesive layer 12 more firmly, a connecting layer 14 is provided outside the insulating layer 112. Depressions or protrusions 141 are uniformly distributed on the outside of the connecting layer 14, and the depressions or protrusions 141 cooperate with the adhesive layer 12 so that the conductive wires 11 are not easily displaced or fall off when they are cut into sheets or blocks.

Step 1. The conductive metal strip is drawn into a metal wire with a set diameter, and the diameter is 0.005-0.01mm as required.

Step 2: Wrap the insulating layer 112 on the outside of the metal wire.

Step 4: Distribute the insulating layer 112 evenly in the mold according to the set arrangement sequence, and pour the bonding glue; then vibrate, pressurize, and heat the mold to ensure that the bonding glue is solidified, and the conductive wire 11 and the bonding glue Form a block structure.

Step 5. Take out the block structure and cross-cut the block structure according to the set thickness to obtain a sheet or block anisotropic conductive adhesive structure (as shown in Figure 6).

Wherein, the transverse cutting in the step 5 is cold cutting, laser cutting or hot cutting.

Wherein, it also includes step six. The two ends of the sheet-shaped or block-shaped anisotropic conductive adhesive structure are formed with nail heads 13 by plating, electroforming or sputtering.

Preferably, the second step further includes wrapping the upper connecting layer 14 outside the insulating layer 112.

With the anisotropic conductive adhesive structure produced by this method, the process is greatly simplified, the production efficiency is significantly improved, the existing metal ball processing procedures of the conductive adhesive are reduced, the cost can be greatly reduced, and in the lead-through process, the display The screen resolution can be greatly improved.

The anisotropic conductive adhesive structure for convenient connection, as shown in Figure 7, includes a conductive adhesive body. The conductive glue body is uniformly distributed with conductive wires 11, and the two ends of the conductive wires 11 extend to both sides of the conductive glue body. One end or both ends of the conductive wire 11 is provided with a nail head 13 for convenient connection.

Among them, the nail head 13 is an arc-shaped bulge, which may be a hemispherical structure, and the arc-shaped bulge has sufficient deformation margin during coupling and extrusion.

In other embodiments, as shown in FIG. 8, the nail head 13 is provided with a groove 131, and also in order to leave enough space for deformation during the extrusion deformation, avoid contact with the adjacent nail head 13, resulting in Short circuit phenomenon.

In other embodiments, as shown in FIG. 9, the nail head 13 is provided with a deformed portion 132. The deforming portion 132 includes a connecting portion 133 connected with the nail head 13 and a crown portion 134 provided at the end of the connecting portion 133. The cross-sectional area of the top crown portion 134 is larger than the cross-sectional area of the connecting portion. During the press installation, the deformed portion 132 is first deformed, and the connecting portion 133 is pressed, so that the deformed portion 132 is pressed against the surface of the nail head 13. Preferably, the surface of the nail head 13 is provided with an annular groove 135. When the deformed portion 132 is pressed against the surface of the nail head 13, the deformed structure of the deformed portion 132 is folded on the annular groove 135.

As shown in Figure 10, the center of the nail head 13 is provided with a concave hole 136, and the concave hole 136 is a stepped hole, so that when contacting other electronic components, it can cooperate with the protrusions on other electronic components to increase the stability of the connection. .

In other embodiments, as shown in FIG. 11, the nail head 13 includes a buffer portion 137 connected with the conductive wire 11, and a contact portion 138 provided at the end of the buffer portion 137. The cross-sectional area of the contact portion 138 is larger than the cross-sectional area of the buffer portion 137.

The above embodiments can be freely combined, and the technical features can be complementary.

In other embodiments, as shown in FIG. 12, the nail head 13 is a needle-shaped structure 139, which is connected to holes of other electronic components.

The nail head 13 is provided on the conductive adhesive body, which can leave enough space to offset the deformation, and can also increase the contact area, improve the conductivity, and make the conductive adhesive body more firmly connected.

To sum up, the conductive adhesive replaces the conductive beads of the prior art with conductive threads, which is simpler in structure, more plastic, and has higher resolution in use; simple production process, high production efficiency, and low cost .

The above only uses examples to further illustrate the technical content of this application for easier understanding of readers, but it does not mean that the implementation of this application is limited to this. Any technical extension or re-creation made according to this application shall be subject to this application. protection of. The scope of protection of this application is subject to the claims.

Summary of the invention

technical problem

The solution to the problem

The beneficial effects of the invention

Claims

An anisotropic conductive adhesive structure, which is characterized in that it includes a plurality of uniformly distributed conductive wires and an adhesive layer for fixing the plurality of conductive wires; the two ends of the conductive wire penetrate the adhesive layer, and the conductive wires The terminal is used for conduction.
The anisotropic conductive adhesive structure according to claim 1, wherein the conductive wire comprises a conductive body and an insulating layer wrapped around the conductive body; the insulating layer is connected and fixed with the adhesive layer.
The anisotropic conductive adhesive structure according to claim 1, wherein the conductive filaments are arranged on the adhesive layer to form a block structure or a sheet structure.
The anisotropic conductive adhesive structure according to claim 1, wherein the conductive wires are arranged parallel to each other.
The anisotropic conductive adhesive structure according to claim 3, wherein the thickness of the block structure is 0.01-0.15 mm.
The anisotropic conductive adhesive structure according to claim 2, wherein the conductor is a conductive metal and has a diameter of 0.005-0.01 mm.
The anisotropic conductive adhesive structure according to claim 1, wherein the two ends of the conductive wire are provided with nail heads for increasing the contact area.
The anisotropic conductive adhesive structure according to claim 2, wherein a connection layer is provided on the outer side of the insulating layer; and recesses or protrusions are uniformly distributed on the outer side of the connection layer.
A production method of anisotropic conductive adhesive is characterized in that it comprises the following steps:

Step 1: Pull the conductive metal strip into a metal wire with a set diameter;

Step 2: Wrap an insulating layer on the outside of the metal wire;

Step 4. Distribute the insulating layer evenly in the mold according to the set arrangement sequence, and pour the bonding glue; then vibrate, press and heat the mold to ensure that the bonding glue is solidified, and the conductive wire and the bonding glue form a block状结构;

Step 5: Take out the block structure, and cross-cut the block structure according to the set thickness to obtain a sheet or block anisotropic conductive adhesive structure.
The anisotropic conductive adhesive structure according to claim 9, characterized in that it further comprises step six. The two ends of the sheet or block anisotropic conductive adhesive structure are formed with nails by plating, electroforming or sputtering. head.