CN209778731U

CN209778731U - Anisotropic conductive adhesive structure

Info

Publication number: CN209778731U
Application number: CN201920299108.3U
Authority: CN
Inventors: 张炳忠; 刘新
Original assignee: Shenzhen Runwo Automation Engineering Co Ltd
Current assignee: Shenzhen Runwo Automation Engineering Co Ltd
Priority date: 2019-03-08
Filing date: 2019-03-08
Publication date: 2019-12-13
Anticipated expiration: 2029-03-08

Abstract

The utility model relates to an anisotropic conductive adhesive structure, which comprises a plurality of uniformly distributed conductive wires and a bonding layer for fixing the conductive wires; and two ends of the conductive wire penetrate through the bonding layer, and are used for conduction. The conductive adhesive replaces the conductive beads in the prior art with the conductive wires, so that the conductive adhesive is simpler in structure and stronger in plasticity, and the resolution is higher in use; the production process is simple, the production efficiency is high, and the cost is low.

Description

Anisotropic conductive adhesive structure

Technical Field

The utility model relates to an electronic connection spare, more specifically say and indicate an anisotropic conducting resin structure.

Background

Anisotropic conductive adhesives are commonly used as an electronic connector in electronic products, especially in the connection of display panels and circuits. As shown in fig. 1, in the conventional anisotropic conductive adhesive, a metal conductive ball with an insulating layer is usually disposed in an adhesive, and when the adhesive is used, the metal conductive ball needs to be pressed hard to break a military support layer outside the metal conductive ball, and then the conductive layer can be turned on, which is very inconvenient to use. In addition, the existing anisotropic conductive adhesive is very complicated in the manufacturing process and high in cost, for example, the production of the metal conductive balls needs more processes, the diameter of each metal conductive ball needs to be the same, otherwise, the use effect is influenced during extrusion; and the volume is less, wraps up a layer of insulating layer in the outside, and the technical difficulty is big.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's defect, provide an anisotropic conducting resin structure and production method thereof.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

An anisotropic conductive adhesive structure comprises a plurality of uniformly distributed conductive wires and a bonding layer for fixing the conductive wires; and two ends of the conductive wire penetrate through the bonding layer, and are used for conduction.

The further technical scheme is as follows: the conductive wire comprises a conductor and an insulating layer wrapped on the outer side of the conductor; the insulating layer is fixedly connected with the bonding layer.

The further technical scheme is as follows: the conductive wires extend outwards and are arranged on the bonding layer to form a block structure or a sheet structure.

The further technical scheme is as follows: the conductive wires are arranged in parallel.

The further technical scheme is as follows: the thickness of the block structure is 0.01-015 mm.

the further technical scheme is as follows: the electric conductor is made of conductive metal and has a diameter of 0.005-0.01 mm.

The further technical scheme is as follows: nail heads used for increasing the contact area are arranged at two ends of the conductive wire.

The further technical scheme is as follows: a connecting layer is arranged on the outer side of the insulating layer; and concave parts or convex parts are uniformly distributed on the outer side of the connecting layer.

a production method of anisotropic conductive adhesive comprises the following steps:

step one, drawing a conductive metal strip into a metal wire with a set diameter;

Secondly, wrapping an insulating layer on the outer side of the metal wire;

step four, uniformly distributing the insulating layers in the mold according to a set arrangement sequence, and pouring bonding glue; then, carrying out vibration, pressurization and heating treatment on the die to ensure that the bonding glue is solidified, and the conductive wires and the bonding glue form a blocky structure;

And fifthly, taking out the block structure, and transversely cutting the block structure according to a set thickness to obtain a sheet or block anisotropic conductive adhesive structure.

The further technical scheme is as follows: and the transverse cutting of the step five is cold cutting and laser cutting.

The further technical scheme is as follows: and sixthly, forming nail heads at two ends of the sheet or block anisotropic conductive adhesive structure through electroplating, electroforming or sputtering.

An anisotropic conductive adhesive structure convenient for connection comprises a conductive adhesive body; the conductive adhesive body is uniformly provided with conductive wires, and two ends of each conductive wire extend to two sides of the conductive adhesive body; one end or two ends of the conductive wire are provided with nail heads which are convenient to connect.

The further technical scheme is as follows: the nail head part is an arc-shaped bulge.

The further technical scheme is as follows: the nail head part is provided with a groove.

The further technical scheme is as follows: the nail head part is provided with a deformation part; the deformation part comprises a connecting part connected with the nail head part and a crown part arranged at the tail end of the connecting part; the cross-sectional area of the crown portion is larger than that of the connecting portion.

the further technical scheme is as follows: a concave hole is formed in the center of the nail head part; the concave hole is a stepped hole.

the further technical scheme is as follows: the nail head part comprises a buffer part connected with the conductive wire and a contact part arranged at the tail end of the buffer part; the cross-sectional area of the contact portion is larger than that of the buffer portion.

The further technical scheme is as follows: the nail head part is in a needle-shaped structure.

Compared with the prior art, the utility model beneficial effect be: the conductive adhesive replaces the conductive beads in the prior art with the conductive wires, so that the conductive adhesive is simpler in structure and stronger in plasticity, and the resolution is higher in use; the production process is simple, the production efficiency is high, and the cost is low.

The invention is further described with reference to the accompanying drawings and specific embodiments.

Drawings

FIG. 1 is a schematic diagram of a prior art structure;

Fig. 2 is a top view of an anisotropic conductive adhesive structure according to the present invention;

Fig. 3 is a front view of an anisotropic conductive adhesive structure of the present invention;

Fig. 4 is a cross-sectional view of a conductive wire of an anisotropic conductive adhesive structure according to the present invention;

Fig. 5 is a structural view and a partial cross-sectional view of a connection layer of an anisotropic conductive adhesive structure of the present invention;

Fig. 6 is a cutting diagram of an anisotropic conductive adhesive structure according to the present invention;

Fig. 7 is a structure view of the structure of the nailed head of the anisotropic conductive adhesive structure of the present invention;

fig. 8 is a structural view of the anisotropic conductive adhesive structure of the present invention with a groove and a nail head;

Fig. 9 is a structural view of the deformed nail head of the anisotropic conductive adhesive structure of the present invention;

fig. 10 is a structural view of the head of the anisotropic conductive adhesive structure with a concave hole;

fig. 11 is a structural view of the anisotropic conductive adhesive structure with a contact portion and a nail head portion;

Fig. 12 is a pin-type structure diagram of the nail head of an anisotropic conductive adhesive structure of the present invention.

Detailed Description

In order to more fully understand the technical content of the present invention, the technical solution of the present invention will be further described and illustrated with reference to the following specific embodiments, but not limited thereto.

Fig. 2 to 12 show drawings according to embodiments of the present invention.

An anisotropic conductive adhesive structure 10, as shown in fig. 2 to 3, includes a plurality of conductive wires 11 uniformly distributed, and an adhesive layer 12 for fixing the plurality of conductive wires 11. Two ends of the conductive wire 11 penetrate through the adhesive layer 12, and two ends of the conductive wire 11 are used for conduction. The conductive wires 11 are used as a signal transmission path, and are usually used for electrically connecting the display screen and the control circuit. Since the number of the conductive wires 11 can be designed as desired by the designer, the resolution of the display screen can be improved.

as shown in fig. 4, the conductive filament 11 includes a conductive body 111 and an insulating layer 112 wrapping the conductive body 111. The insulating layer 112 is coupled and fixed to the adhesive layer 12. Each conductor 111 can only be conducted at two ends and can not be conducted with the adjacent conductor 111, so that the insulating layer on the outer side and the bonding layer 12 can play a role of isolation.

the conductive filaments 11 are arranged on the adhesive layer 12 to extend outwards to form a block structure or a sheet structure. The conductive wires 11 are vertically arranged in the adhesive layer 12, and can continuously extend outwards by taking one as a center, so that a sheet-shaped or block-shaped structure can be formed. The conductive lines 11 in the adhesive layer 12 can be used as the conductive lines.

Preferably, the conductive filaments 11 are arranged parallel to each other, which facilitates cutting during production and also saves material.

Preferably, the thickness of the block structure is 0.01 to 015 mm.

Preferably, the conductive body 111 is a conductive metal and has a diameter of 0.005 to 0.01 mm. Generally, the conductor 111 is a conductive metal such as gold, silver, or copper.

as shown in fig. 7, nail heads 13 for increasing contact area are provided at both ends of the conductive wire 11. The nail head 13 of each conductive wire 11 is not associated with each other, and when in contact with an electrical component, the contact area can be increased, and the conduction rate can be increased.

As shown in fig. 5, in order to make the insulating layer 112 and the adhesive layer 12 be coupled more firmly, the connecting layer 14 is provided outside the insulating layer 112. The connection layer 14 is uniformly provided with a plurality of concave or convex portions 141 on the outer side, and the concave or convex portions 141 are matched with the bonding layer 12, so that the conductive wire 11 is not easy to shift or fall off when being cut into a sheet or a block.

Step one, drawing the conductive metal strip into a metal wire with a set diameter, and drawing the metal wire into a metal wire with a diameter of 0.005-0.01mm according to requirements.

And step two, wrapping the insulating layer 112 outside the metal wire.

Step four, uniformly distributing the insulating layers 112 in the mold according to a set arrangement sequence, and pouring bonding glue; and then, carrying out vibration, pressurization and heating treatment on the die to ensure that the bonding glue is solidified, so that the conductive wires 11 and the bonding glue form a blocky structure.

And step five, taking out the block structure, and transversely cutting the block structure according to a set thickness to obtain a sheet or block anisotropic conductive adhesive structure (as shown in fig. 6).

And the transverse cutting of the step five is cold cutting, laser cutting or hot cutting.

And sixthly, forming nail heads 13 at two ends of the sheet or block anisotropic conductive adhesive structure through electroplating, electroforming or sputtering.

Preferably, step two further includes wrapping the tie layer 14 around the outside of the insulation layer 112.

The anisotropic conductive adhesive structure produced by the method has the advantages that the process is greatly simplified, the production efficiency is obviously improved, the existing processing procedures of metal balls of the conductive adhesive are reduced, the cost can be greatly reduced, and the resolution of a display screen can be greatly improved in the conduction process.

The anisotropic conductive adhesive structure for facilitating connection, as shown in fig. 7, includes a conductive adhesive body. The conducting resin body is evenly distributed with conducting wires 11, and two ends of the conducting wires 11 extend to two sides of the conducting resin body. One or both ends of the conductive wire 11 are provided with nail heads 13 for easy connection.

The nail head 13 is an arc-shaped bulge, which may be a hemisphere structure, and the arc-shaped bulge has enough deformation allowance during connection and extrusion.

In other embodiments, as shown in fig. 8, the nail head 13 is provided with a groove 131, so as to leave enough space for deformation during the pressing deformation, and avoid the short circuit phenomenon caused by the contact with the adjacent nail head 13.

In other embodiments, as shown in fig. 9, the nail head 13 is provided with a deformation portion 132. The deformation portion 132 includes a connecting portion 133 coupled to the nail head 13, and a crown portion 134 provided at a distal end of the connecting portion 133. The cross-sectional area of the top crown portion 134 is greater than the cross-sectional area of the web portion. In the press-fitting, the deformation portion 132 is first deformed to press the connection portion 133, so that the deformation portion 132 is press-fitted on the surface of the nail head 13. Preferably, the surface of the nail head 13 is provided with an annular groove 135, and when the deformation portion 132 is pressed on the surface of the nail head 13, the deformed structure of the deformation portion 132 is folded on the annular groove 135.

as shown in fig. 10, the center of the nail head 13 is provided with a concave hole 136, and the concave hole 136 is a stepped hole, so that when contacting with other electronic components, it can match with the protrusion on the other electronic components, increasing the connection stability.

In another embodiment, as shown in fig. 11, the nail head 13 includes a buffer portion 137 coupled to the conductive wire 11, and a contact portion 138 disposed at an end of the buffer portion 137. The contact portion 138 has a cross-sectional area larger than that of the buffer portion 137.

The above embodiments can be freely combined, and the technical features can be complemented.

In other embodiments, as shown in FIG. 12, the pin head 13 is a pin-shaped structure 139, which is connected to the holes of other electronic devices.

set up pin head 13 at the conducting resin body, can leave enough space and offset the deformation, can also increase area of contact, improve the conduction rate for this body coupling of conducting resin is more firm.

In conclusion, the conductive adhesive replaces the conductive beads in the prior art with the conductive wires, so that the conductive adhesive is simpler in structure and stronger in plasticity, and the resolution is higher in use; the production process is simple, the production efficiency is high, and the cost is low.

The technical content of the present invention is further described by the embodiments only, so that the reader can understand it more easily, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation according to the present invention is protected by the present invention. The protection scope of the present invention is subject to the claims.

Claims

1. an anisotropic conductive adhesive structure is characterized by comprising a plurality of uniformly distributed conductive wires and a bonding layer for fixing the conductive wires; and two ends of the conductive wire penetrate through the bonding layer, and are used for conduction.

2. The anisotropic conductive adhesive structure of claim 1, wherein the conductive filaments comprise a conductive body and an insulating layer covering the conductive body; the insulating layer is fixedly connected with the bonding layer.

3. An anisotropic conductive adhesive structure according to claim 1, wherein the conductive filaments are outwardly extended and disposed on the adhesive layer to form a block structure or a sheet structure.

4. An anisotropic conductive adhesive structure according to claim 1, wherein said conductive filaments are arranged in parallel with each other.

5. an anisotropic conductive paste structure according to claim 3, wherein the thickness of the bulk structure is 0.01-015 mm.

6. An anisotropic conductive adhesive structure according to claim 2, wherein the conductive body is a conductive metal and has a diameter of 0.005-0.01 mm.

7. An anisotropic conductive adhesive structure according to claim 1, wherein the conductive filaments are provided at both ends thereof with nail heads for increasing contact area.

8. The anisotropic conductive adhesive structure of claim 2, wherein a connecting layer is disposed outside the insulating layer; and concave parts or convex parts are uniformly distributed on the outer side of the connecting layer.

9. An anisotropic conductive paste structure according to claim 7, wherein said nail head is an arcuate ridge.

10. An anisotropic conductive adhesive structure according to claim 7, wherein said nail head portion is provided with a deformed portion; the deformation part comprises a connecting part connected with the nail head part and a crown part arranged at the tail end of the connecting part; the cross-sectional area of the crown portion is larger than that of the connecting portion.