WO2020179980A1 - Gabarit d'apprentissage de tranche - Google Patents

Gabarit d'apprentissage de tranche Download PDF

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Publication number
WO2020179980A1
WO2020179980A1 PCT/KR2019/011814 KR2019011814W WO2020179980A1 WO 2020179980 A1 WO2020179980 A1 WO 2020179980A1 KR 2019011814 W KR2019011814 W KR 2019011814W WO 2020179980 A1 WO2020179980 A1 WO 2020179980A1
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
robot arm
unit
sensor
detection
Prior art date
Application number
PCT/KR2019/011814
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English (en)
Korean (ko)
Inventor
오세덕
Original Assignee
오세덕
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오세덕 filed Critical 오세덕
Priority to CN201980093601.2A priority Critical patent/CN113519042B/zh
Publication of WO2020179980A1 publication Critical patent/WO2020179980A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Definitions

  • the present invention relates to a wafer teaching jig, and more particularly, to a wafer teaching jig capable of measuring a horizontal state of a wafer transfer robot arm and a wafer.
  • a photolithography process forms a desired resist pattern by applying a resist solution to a wafer substrate and exposing and developing it using a photo mask.
  • a plurality of wafer transfer robots and a plurality of processing units are arranged in a line and/or stacked structure, and a resist solution is applied, exposed and exposed using a wafer transfer robot. Wafers are loaded and unloaded into each processing unit that processes development.
  • semiconductor manufacturing facilities need to set the position of the wafer transfer robot in order to accurately supply wafers to each processing unit.
  • the wafer is transferred while being supported by the arm of the robot for transfer.
  • the equipment state of the robot arm that is, the transfer stroke and the vertical state to the working surface, are very important for accurate wafer transfer. It acts as an element.
  • the mounting height of the robot arm is related to the working distance of the arm, and when the mounting height is different from the initial set height, an impact is applied to the wafer.
  • the robot arm's transfer stroke (height between the working surface and the arm) is larger than the set value, the wafer is transferred to the working surface while the robot arm is supporting the wafer.
  • the wafer is in contact and the wafer is loaded, scratches or breaks on the wafer surface may occur.
  • the present invention was created to improve the problems of the prior art as described above, it is possible to measure the horizontal state of the wafer transfer robot arm and the wafer, and by measuring the gap between the upper and lower facing wafers, the robot arm is loaded and The purpose of this is to provide a wafer teaching jig that can prevent collisions with the wafer during the unloading operation.
  • the present invention provides a wafer teaching jig capable of estimating an elevation position for loading/unloading a wafer through the position of the robot arm, and measuring and correcting the horizontality of the robot arm by comparing it with the actual elevation position of the wafer. It has its purpose to provide.
  • a wafer teaching jig for achieving the above object has a plurality of slots so that a plurality of wafers can be stacked in a stack manner while achieving a set interval, and at least one of the two sides of the slot
  • a wafer cassette having an opening formed on one side thereof to allow loading or unloading of the wafer through the opening;
  • a robot arm for loading or unloading the wafer into the slot of the wafer cassette;
  • a sensor unit that is detachably disposed in a slot at a lower end of the slots of the wafer cassette and measures the height or position of the wafer and the robot arm positioned above;
  • a control unit that calculates the height level of the wafer and the level of the robot arm based on the measured value by the sensor unit, and provides the calculated data in a digital manner.
  • the sensor unit may include a plate-shaped sensor base fitted into a slot of the wafer cassette; A plurality of wafer detection sensors formed along the periphery of the sensor base to sense a distance from the wafer positioned above the sensor base and apply to the control unit; And installed on the sensor base to detect the distance to the wafer together with the wafer detection sensor and apply it to the horizontality calculation unit, and are disposed at a position corresponding to the opening of the wafer cassette to load and unload the wafer. It may include a robot arm detection sensor applied to the control unit while sensing the distance to the robot arm.
  • the robot arm is formed in a fork shape so that detection by the wafer detection sensor and the robot arm detection sensor is prevented while being put into the lower portion of the wafer by the operation of the robot, and the wafer is removed by the robot.
  • a fork portion having a locking protrusion formed at a tip portion thereof so as to pull the wafer in a lifted state;
  • a sensor sensing part formed in the same body at the rear end of the fork part to form a connection part with the robot, and formed in a plate shape to be sensed by the robot arm sensing sensor.
  • control unit may include a zero point calculator configured to calculate a zero point while calculating a height level of the wafer by measuring a distance to the wafer based on the detection signal of the wafer detection sensor and the robot arm detection sensor;
  • a robot arm position detection unit configured to calculate a height level of the robot arm by measuring a distance to the robot arm moving to the lower portion of the wafer through a detection signal from the robot arm detection sensor;
  • a horizontality calculator for estimating and detecting the raised position of the wafer and calculating the horizontal degree of the robot arm based on the estimated data and detection data.
  • the horizontal degree calculation unit may include a position estimation unit that estimates and calculates a rising position of the wafer based on data of the zero point calculation unit and the robot arm position detection unit; When the robot arm raises the wafer, a position measuring unit for measuring the raised position of the wafer and the robot arm through the wafer detection sensor and the robot arm detection sensor; And a comparison unit for calculating a horizontal degree of the robot arm by comparing data of the position estimating unit and the position measuring unit.
  • control unit may further include a correction unit for correcting the horizontality of the robot arm based on data of the horizontality calculation unit.
  • the wafer teaching jig can measure the horizontal state of the wafer transfer robot arm and the wafer, and the loading/unloading unit loads/unloads by measuring the gap between the upper and lower facing wafers. There is an effect of preventing the phenomenon of colliding with the wafer in advance.
  • the wafer teaching jig according to the present invention can calculate the horizontality of the robot arm with the sensor unit disposed on the wafer cassette, it can be conveniently applied to existing equipment and used.
  • the wafer teaching jig specifically, the present invention estimates an elevation position for loading/unloading a wafer through the position of the robot arm, and compares the elevation position of the actual wafer with the horizontal position of the robot arm. Since the degree is measured, the horizontality of the robot arm can be calculated more accurately.
  • FIG. 1 is a perspective view showing a wafer teaching jig according to an embodiment of the present invention.
  • FIG. 2 is a perspective view showing a state of use of a wafer teaching jig according to an embodiment of the present invention.
  • FIG 3 is a front view showing a wafer teaching jig according to an embodiment of the present invention.
  • FIG. 4 is a block diagram showing a control unit of the present invention.
  • FIG. 1 is a perspective view showing a wafer teaching jig according to an embodiment of the present invention
  • Figure 2 is a perspective view showing a state of use of the wafer teaching jig according to an embodiment of the present invention
  • Figure 3 is an embodiment of the present invention It is a front view showing the wafer teaching jig according to.
  • Figure 4 is a block diagram showing a control unit of the present invention.
  • the wafer teaching apparatus 10 measures and corrects the horizontality of the robot arm 200 for transferring the wafer 1 when transferring the wafer 1 in the semiconductor manufacturing process. It is a device for preventing damage to the wafer 1 by 200.
  • the wafer teaching apparatus 10 may be configured to include a wafer cassette 100, a robot arm 200, a sensor unit 300, and a control unit 400, as shown in FIG. 1. have.
  • the wafer cassette 100 is a component that allows a plurality of wafers 1 to be stacked in a stack manner while achieving a set interval.
  • a plurality of slots 110 into which the wafers 1 are inserted are formed in a vertical direction while forming a predetermined interval, so that a plurality of wafers 1 are loaded into each slot 110, Can be stacked at intervals of.
  • the wafer cassette 100 may have an opening formed on one side of the slot 110, so that the wafer 1 may be loaded into the slot 110 or unloaded from the slot 110 through the opening.
  • a plurality of wafers 1 may be stacked while the wafer 1 transferred by the robot arm 200, which will be described later, is inserted into the slot 110 through the opening.
  • the robot arm 200 is a component that transfers and loads the wafer 1 into the slot 110 of the wafer cassette 100 or unloads the wafer 1 from the wafer cassette 100.
  • the robot arm 200 may be connected to a robot (not shown) to transfer the wafer 1 while horizontally moving and vertically moving by the operation of the robot.
  • the robot arm 200 may include a fork portion 210 and a sensor sensing portion 220 as shown in FIGS. 1 and 2.
  • the fork portion 210 is a component that moves to the lower portion of the wafer 1 through the operation of a robot (not shown) and lifts the wafer 1 while pulling.
  • This fork part 210 is moved by a robot while supporting the bottom of the wafer 1, inserting the wafer 1 into the slot 110, and then descending to load the wafer 1 into the slot 110. It is possible to unload the wafer 1 from the slot 110 while moving between the wafers 1 and moving by the robot while lifting the bottom of the wafer 1.
  • the fork part 210 moves to the lower part of the wafer 1, it is possible to prevent detection by the wafer detection sensor 320 and the robot arm detection sensor 330 constituting the sensor unit 300 to be described later. It may be formed in the form of a fork divided into a plurality.
  • the fork portion 210 faces the robot arm detection sensor 330 through the divided space as shown in FIG. 1 and enters the opening, thereby preventing the wafer 1 from being detected by the robot arm detection sensor 330. You can move to the bottom of ).
  • the fork portion 210 has a locking protrusion 211 formed at the front end thereof, and the locking protrusion 211 is caught by the wafer 1 in a state in which the wafer 1 is lifted. Can tow.
  • the sensor detection unit 220 is a component detected by the robot arm detection sensor 330 to be described later.
  • the sensor sensing unit 220 is formed in the same body at the rear end of the fork unit 210 to form a connection portion with a robot, not shown, and is formed in a plate shape to be detected by the robot arm sensing sensor 330 described later. Can be.
  • the robot arm 200 enters through the opening of the wafer cassette 100, it is not detected by the robot arm detection sensor 330 by the fork part 210, and after the entry is completed, the sensor detection unit 220 ) Can be detected by the robot arm detection sensor 330 by facing the robot arm detection sensor 330.
  • the sensor unit 300 is a component for measuring the position or height of the wafer 1 and the robot arm 200 disposed on the wafer cassette 100.
  • the sensor unit 300 is detachably disposed in the slot 110 at the lower end of the slots 110 of the wafer cassette 100 as shown in FIGS.
  • the robot arm 200 can be detected.
  • the sensor unit 300 may include a sensor base 310, a wafer detection sensor 320, and a robot arm detection sensor 330 as shown in FIG. 1.
  • the sensor base 310 may be formed in a plate shape so as to be inserted into the slot 110 of the wafer cassette 100 and may be inserted into the slot 110 at the lower end of the slots 110.
  • the wafer detection sensor 320 may sense a distance to the wafer 1 positioned above the sensor base 310 and apply it to the controller 400 to be described later.
  • the wafer detection sensor 320 may be disposed along the circumference of the sensor base 310 while forming a plurality.
  • the wafer detection sensor 320 detects the wafer 1 while irradiating an infrared ray, ultrasonic wave, or laser upward, and senses a distance to the wafer 1 to provide a height level of the wafer 1.
  • the robot arm detection sensor 330 is installed on the sensor base 310 to detect the distance to the wafer 1 together with the wafer detection sensor 320, or loading and unloading the wafer 1 by the robot arm 200 It is a component that senses the distance to the robot arm 200 and provides it to the controller 400 to be described later.
  • the robot arm detection sensor 330 is disposed at a position corresponding to the opening of the wafer cassette 100 to detect the distance from the sensor detection unit 220 of the robot arm 200 to detect the height level of the robot arm 200. May be provided to the control unit 400.
  • the control unit 400 calculates the height level of the wafer 1 and the horizontality level of the robot arm 1 based on the measured value by the sensor unit 300 described above, and provides the calculated data in a digital manner. It is a component for.
  • the control unit 400 may be mounted on a microprocessor installed in the sensor base 310, and may be mounted on a separate server to receive data from the sensor unit 300.
  • control unit 400 may include a zero point calculation unit 410, a robot arm position calculation unit 420, and a horizontal degree calculation unit 430.
  • the zero point calculation unit 410 is a wafer (1) disposed in the slot 110 located above the sensor base 310 based on the detection signals of the wafer detection sensor 320 and the robot arm detection sensor 330 described above. ) Can be set to zero by calculating the height level.
  • the robot arm position detection unit 420 measures the distance to the robot arm 200 moving to the lower portion of the wafer 1 through a detection signal of the robot arm detection sensor 330 to measure the height of the robot arm 200. Level can be calculated.
  • the robot arm position detecting unit 420 may calculate the height level of the robot arm 200 through the position of the sensor detecting unit 220 by the robot arm detecting sensor 330 of the robot arm 200.
  • the horizontal degree calculation unit 430 is a component for calculating the horizontal degree of the robot arm 200.
  • the horizontal degree calculation unit 430 estimates and detects the rising position of the wafer 1 and calculates the estimated data and detection data. Based on this, the horizontal degree of the robot arm 200 may be calculated.
  • the wafer 1 remains horizontal when seated in the slot 110, but when the wafer 1 is raised by the robot arm 200 that is not horizontally maintained, the horizontal degree is distorted by the robot arm 200. Can be.
  • the horizontality calculating unit 430 may calculate the horizontality of the robot arm 200 through the raised position of the wafer 1 with the zero point set.
  • the horizontality calculating unit 430 may include a position estimating unit 431, a position measuring unit 432, and a comparison unit 433 as shown in FIG. 4.
  • the position estimation unit 431 is based on the height level of the wafer 1 calculated by the zero point calculation unit 410 and the height level of the robot arm 200 calculated by the robot arm position detection unit 420 described above. It can be calculated by estimating the rising position of the wafer 1 by the robot arm 200.
  • the position estimating unit 431 may calculate the rising position of the wafer 1 by calculating the rising distance of the robot arm 200 at the height level of the wafer 1 set to zero.
  • the position measurement unit 432 is configured to detect the wafer 1 and the robot arm 200 through the wafer detection sensor 320 and the robot arm detection sensor 330. Actual ascent position can be measured.
  • the comparison unit 433 may calculate a horizontal degree of the robot arm 200 by comparing the data calculated by the position estimation unit 431 and the position measurement unit 432 described above.
  • the comparison unit 433 compares the rising position of the wafer 1 estimated by the position estimating unit 431 with the rising position of the wafer 1 actually measured by the position measuring unit 432, so that the robot arm 200 The horizontal degree of can be calculated.
  • the rising position of the wafer 1 estimated by the position estimation unit 431 and the rising position of the wafer 1 actually measured by the position measuring unit 432 can be compared equally, and if the robot arm 200 has an uneven horizontality, the rising position of the wafer 1 estimated by the position estimating unit 431 and the actual measured by the position measuring unit 432 The rising positions of the wafer 1 can be compared to be unequal.
  • the control unit 400 may provide the data calculated by the horizontality calculation unit 430 as digital data on the display of the manager, and the horizontality of the robot arm 200 is adjusted based on the calculated configuration of the correction unit 440 It can be corrected through
  • the wafer teaching apparatus 10 can calculate the horizontal degree of the robot arm 200 in a state in which the sensor unit 300 is disposed on the wafer cassette 100. It can be applied and used.
  • the elevation position for loading/unloading of the wafer 1 is estimated through the position of the robot arm 200, and the horizontal position of the robot arm 200 is compared with the actual raised position of the wafer 1. Since the degree is measured, damage to the wafer 1 by the robot arm 200 can be prevented by more accurately calculating and correcting the horizontal degree of the robot arm 200.
  • wafer teaching jig 100 wafer cassette
  • sensor detection unit 300 sensor unit
  • sensor base 320 wafer detection sensor
  • robot arm detection sensor 400 control unit
  • correction unit 1 wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

La présente invention concerne un gabarit d'apprentissage de tranche par lequel un état horizontal d'un bras de robot de transfert de tranche et d'une tranche peut être mesuré, le gabarit d'apprentissage de tranche comprenant : une cassette de tranche qui a une pluralité de fentes pour permettre à une pluralité de tranches d'être stratifiées dans un type d'empilement à des intervalles définis, et a une ouverture formée à travers au moins l'un des deux côtés opposés de chacune des fentes pour permettre à chacune des tranches d'être chargée ou déchargée à travers l'ouverture ; un bras de robot qui charge ou décharge les tranches vers ou à partir des fentes de la cassette de tranche ; une unité de capteur qui est disposée de façon séparable au niveau d'une fente d'extrémité inférieure parmi les fentes de la cassette de tranche, et mesure les hauteurs ou les positions du bras de robot et chacune des plaquettes positionnées au niveau d'un côté supérieur ; et une unité de commande qui calcule un niveau de hauteur de chacune des tranches et un niveau d'horizontalité du bras de robot sur la base d'une valeur mesurée par l'unité de capteur, et fournit des données calculées dans un type numérique.
PCT/KR2019/011814 2019-03-04 2019-09-11 Gabarit d'apprentissage de tranche WO2020179980A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201980093601.2A CN113519042B (zh) 2019-03-04 2019-09-11 晶圆示教夹具

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2019-0024868 2019-03-04
KR20190024868 2019-03-04
KR1020190108829A KR102063654B1 (ko) 2019-03-04 2019-09-03 웨이퍼 티칭 지그
KR10-2019-0108829 2019-09-03

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WO2020179980A1 true WO2020179980A1 (fr) 2020-09-10

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KR (1) KR102063654B1 (fr)
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Cited By (1)

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CN116613094A (zh) * 2023-07-20 2023-08-18 合肥晶合集成电路股份有限公司 一种晶圆搬运的控制系统及其控制方法

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KR102584512B1 (ko) * 2020-12-31 2023-10-05 세메스 주식회사 버퍼 유닛 및 온도 변화가 수반되는 기판 지지 부재의 수평 측정용 기판형 센서의 보관 방법
KR102394037B1 (ko) * 2021-04-01 2022-05-06 주식회사 써치앤델브 테스팅 웨이퍼를 이용하여 웨이퍼 카세트로 진입하는 공정 웨이퍼의 위치 판단 방법

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EP2304769B1 (fr) * 2009-04-09 2013-11-27 Aes Motomation GmbH Procédé de mesure automatique et d'apprentissage de positions de localisation d'objets dans un système de traitement de substrat au moyen de supports de capteurs et d'un support de capteur associé
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KR20090064650A (ko) * 2007-12-17 2009-06-22 주식회사 동부하이텍 웨이퍼 이송로봇의 티칭용 지그
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JP2004241730A (ja) * 2003-02-07 2004-08-26 Yaskawa Electric Corp ロボットの自動教示装置および方法
JP2008084938A (ja) * 2006-09-26 2008-04-10 Nec Electronics Corp 基板処理装置に対する各種設定値の教示方法、教示用装置及びその校正治具
EP2304769B1 (fr) * 2009-04-09 2013-11-27 Aes Motomation GmbH Procédé de mesure automatique et d'apprentissage de positions de localisation d'objets dans un système de traitement de substrat au moyen de supports de capteurs et d'un support de capteur associé
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116613094A (zh) * 2023-07-20 2023-08-18 合肥晶合集成电路股份有限公司 一种晶圆搬运的控制系统及其控制方法
CN116613094B (zh) * 2023-07-20 2023-10-13 合肥晶合集成电路股份有限公司 一种晶圆搬运的控制系统及其控制方法

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KR102063654B1 (ko) 2020-01-09
CN113519042A (zh) 2021-10-19
CN113519042B (zh) 2024-03-15

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