WO2020177295A1 - 一种用于批量化抛光工件的设备 - Google Patents

一种用于批量化抛光工件的设备 Download PDF

Info

Publication number
WO2020177295A1
WO2020177295A1 PCT/CN2019/106047 CN2019106047W WO2020177295A1 WO 2020177295 A1 WO2020177295 A1 WO 2020177295A1 CN 2019106047 W CN2019106047 W CN 2019106047W WO 2020177295 A1 WO2020177295 A1 WO 2020177295A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
annular cavity
workpieces
magnetic
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/106047
Other languages
English (en)
French (fr)
Inventor
王春锦
张志辉
何丽婷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hong Kong Polytechnic University HKPU
Original Assignee
Hong Kong Polytechnic University HKPU
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hong Kong Polytechnic University HKPU filed Critical Hong Kong Polytechnic University HKPU
Priority to US17/435,064 priority Critical patent/US20220161383A1/en
Publication of WO2020177295A1 publication Critical patent/WO2020177295A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/005—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes using a magnetic polishing agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies

Definitions

  • the invention relates to the technical field of magnetic field assisted polishing, in particular to a device for batch polishing of workpieces.
  • Magnetic buoyancy removes material; applying a magnetic field on the magnetic fluid generates hydrostatic pressure to polish planes and curved surfaces; applying a magnetic field to the magnetorheological fluid creates a polishing zone where the fluid contacts the workpiece to achieve high precision of optical free-form surfaces Deterministic finishing.
  • polishing techniques focus on the application of high-precision polishing of one free-form surface at a time, and it is difficult to use for mass finishing of complex surfaces. Therefore, this is not in accordance with the cost-effective actual mass production, so that it cannot meet the needs of the market.
  • the purpose of the present invention is to provide a device for batch polishing of workpieces, which can not only ensure the high-precision polishing characteristics of magnetic field-assisted polishing, but also can realize the function of high-precision polishing of large-scale workpieces.
  • the device can be used for manual polishing. Polishing of free-form surfaces such as implants, turbine blades, and optical mold inserts.
  • the present invention provides an equipment for polishing workpieces in batches, including an annular cavity for mounting several workpieces and a magnetic abrasive arranged inside the annular cavity for polishing the workpieces , It also includes a plurality of magnetic groups for generating magnetic fields for the magnetic abrasive to remove material on the surface of the workpiece, the magnetic groups including being arranged on the inner and outer sides of the annular cavity for surrounding the annular cavity The axis of the magnet rotates.
  • it further includes a cavity cover connected with the annular cavity cover for fixing and installing the workpiece.
  • the cavity cover is fixedly connected to the workpiece by a workpiece fixture, so that the workpiece is suspended in the annular cavity.
  • it also includes a rotating plate for fixing all the magnets and driving all the magnets to rotate.
  • a first driving part fixedly connected to the rotating plate and used for driving the rotating plate to rotate around the axis of the rotating plate is provided under the rotating plate.
  • the first driving part is connected to the rotating plate through a coupling.
  • it further includes a mounting seat for fixedly mounting the first driving part.
  • the mounting seat is provided with a worktable for fixedly installing the annular cavity, and the center of the worktable is provided with a through hole opening in the thickness direction for the annular cavity to penetrate. hole.
  • the magnetic abrasive is specifically a combination of magnetic particles and a polishing abrasive that are consolidated and mixed with a lubricant, or the magnetic particles and the polishing abrasive are free from a base carrier liquid.
  • it further comprises a plurality of second driving parts arranged above the annular cavity for driving the workpiece to rotate and a third driving part for driving the workpiece to move up and down.
  • the present invention designs a device for batch polishing of workpieces according to the different requirements of polishing free-form surfaces of workpieces. Because traditional magnetic field-assisted polishing technologies mostly focus on the application of high-precision polishing of one free-form surface at a time, It is difficult to use for mass finishing of complex surfaces. Therefore, it is necessary to use a device that can achieve high-precision polishing of mass workpieces to meet market needs.
  • the above-mentioned equipment for polishing workpieces in batches includes an annular cavity, a magnetic abrasive, and a magnetic assembly.
  • the annular cavity is used to install the workpiece to be polished, and multiple workpieces can be fixedly installed in the annular cavity at a time.
  • the magnetic abrasive is set inside the annular cavity, and the magnetic group is used to generate a rotating magnetic field.
  • the magnetic assembly includes magnets arranged on both sides of the annular cavity inside and outside, and the magnets can rotate around the axis of the annular cavity, thereby providing a rotating magnetic field.
  • the above setting method can not only ensure the high-precision polishing characteristics assisted by the magnetic field, but also realize the high-precision polishing function of large quantities of workpieces;
  • the equipment can be used for alloys, ceramics, glass and various Surface treatment of non-ferrous metal materials.
  • the equipment can be used for finishing of complex porous surfaces.
  • the equipment can be used for polishing free-form surfaces such as artificial implants, turbine blades, and optical mold inserts.
  • FIG. 1 is a schematic diagram of the overall structure of a device for batch polishing workpieces according to an embodiment of the present invention
  • Figure 2 is a front view of Figure 1;
  • FIG. 3 is a schematic diagram of the longitudinal cross-sectional structure of FIG. 1;
  • FIG. 4 is a schematic diagram of the transverse cross-sectional structure of FIG. 1;
  • FIG. 5 is a schematic diagram of the distribution of different numbers of magnetic groups in a device for batch polishing workpieces according to an embodiment of the present invention
  • Figure 6 is a schematic diagram of the magnetic brushes generated by the six sets of magnetic groups in Figure 1;
  • Fig. 7 is a schematic diagram of the distribution of the magnetic abrasive in Fig. 1 under the action of a magnetic field.
  • the core of the present invention is to provide a device for batch polishing of workpieces, which can not only ensure the high-precision polishing characteristics of magnetic field-assisted polishing, but also can realize the function of high-precision polishing of large-scale workpieces.
  • the device can be used for manual polishing. Polishing of free-form surfaces such as implants, turbine blades, and optical mold inserts.
  • FIG. 1 is a schematic diagram of the overall structure of an apparatus for batch polishing workpieces according to an embodiment of the present invention
  • FIG. 2 is a front view of FIG. 1
  • FIG. 3 is a longitudinal cross-sectional structure of FIG.
  • Figure 4 is a schematic diagram of the transverse cross-sectional structure of Figure 1
  • Figure 5 is a schematic diagram of the distribution of different numbers of magnetic groups in a device for batch polishing workpieces provided by an embodiment of the present invention
  • Figure 6 is the six magnetic groups in Figure 1
  • Figure 7 is the schematic diagram of the distribution of the magnetic abrasive in Figure 1 under the action of a magnetic field.
  • the equipment for polishing workpieces in batches provided by the embodiment of the present invention includes an annular cavity 7, a magnetic abrasive 12, and a magnetic assembly.
  • the annular cavity 7 is used to install the workpiece to be polished, and multiple workpieces can be Once fixedly installed in the annular cavity 7; the magnetic abrasive 12 is arranged inside the annular cavity 7, and the magnetic group is used to generate a rotating magnetic field. In this way, under the action of the rotating magnetic field, the magnetic abrasive 12 can impact the surface of the workpiece Therefore, the material on the surface of the workpiece can be removed to realize high-precision polishing of the entire surface of the workpiece.
  • the magnetic assembly includes magnets 6 arranged on both sides of the annular cavity 7, and the magnets 6 can rotate around the axis of the annular cavity 7, so as to provide a rotating magnetic field required for polishing the workpiece.
  • the magnet 6 can be set as a permanent A magnet or an electromagnet, and the magnetic field strength of the magnet 6 can vary between 0.01 and 5 Tesla.
  • a group of magnetic groups can be provided with two magnets 6 respectively arranged on the inner and outer sides of the annular cavity 7, and all the magnetic groups are evenly distributed along the circumferential direction of the annular cavity 7.
  • there should be a preset gap between the magnets 6 and the annular cavity 7 in the same group of magnetic groups, and the distance between the magnets 6 located inside the annular cavity 7 and the annular cavity 7 in the same group of magnetic groups The preset gap of the inner side wall and the preset gap between the magnet 6 located outside the annular cavity 7 and the outer side wall of the annular cavity 7 in the same set of magnetic sets should be set to be equal, as shown in FIG. 4.
  • the above-mentioned magnetic abrasive 12 can be arranged in different ways.
  • the magnetic abrasive 12 can be formed by using magnetic particles and polishing abrasives as raw materials, consolidating magnetic particles and polishing abrasives and mixing with lubricants.
  • Magnetic abrasive 12 The magnetic particles and polishing abrasive may also be unconsolidated, and the magnetic particles and polishing abrasive are freed in the base carrier liquid, thereby forming an abrasive with polishing performance. In this way, the magnetic abrasive 12 becomes a polishing belt under the action of the rotating magnetic field. When all the magnets 6 start to rotate, the magnetic abrasive 12 produces material removal at the scratches on the target surface. The combination of these movements makes the removal of the material happen randomly. Achieve polishing performance, as shown in Figure 6 and Figure 7.
  • the polishing abrasive of the magnetic abrasive 12 may specifically be diamond, silicon carbide, aluminum oxide, silicon oxide, cerium oxide and other materials, and the size of the magnetic abrasive 12 may be several micrometers to hundreds of micrometers to be used for fineness. And rough polishing.
  • the above setting method provides a more cost-effective method for mass finishing of free-form surfaces.
  • This equipment not only guarantees the high-precision polishing characteristics of magnetic field-assisted polishing, but also realizes mass production
  • the function of high-precision polishing of the workpiece can be used for the surface treatment of alloys, ceramics, glass and various non-ferrous metal materials.
  • the equipment can be used for the finishing of complex porous surfaces.
  • the equipment can be used for artificial Polishing of free-form surfaces such as implants, turbine blades, and optical mold inserts.
  • all the workpieces in the annular cavity 7 should be set at the same height, and the height of the workpieces should be less than or equal to the height of the magnet 6, that is, on the one hand, the height of the bottom surface of the workpiece can be set higher than that of the magnet 6. 6
  • the height of the bottom surface, on the other hand, the height of the top of the workpiece can be set not to exceed the height of the top of the magnet 6, so that the entire surface of all the workpieces are set in the magnetic field, so as to achieve high-precision polishing of the entire surface of the workpiece.
  • the number of workpieces can be adjusted according to the size of the annular cavity 7 and the workpiece to be polished.
  • the number of workpieces to be polished in the equipment can be set to 6, of course, more can be set; in addition, the magnetic assembly
  • the number of can also be set to 6 groups. It should be noted that the number of workpieces can be set to be greater than the number of magnetic groups.
  • the above-mentioned equipment further includes a cavity cover 10.
  • the cavity cover 10 is arranged at the upper end of the annular cavity 7 and is connected to the annular cavity 7 through a lid.
  • the function of the cavity cover 10 is It is possible to fix a plurality of workpieces so that all the workpieces can be installed inside the annular cavity 7.
  • all the workpieces can be fixedly installed on the cavity cover 10 by the preset workpiece fixture 8, so that all the workpieces can be suspended in the inside of the annular cavity 7; in addition, according to the shape and structure of the annular cavity 7
  • the cavity cover 10 can be specifically configured as a circular cavity cover, so that all the workpieces can be evenly arranged at the lower end of the cavity cover 10 at a preset circumferential position.
  • the above equipment further includes a rotating plate 5, wherein all the magnetic assemblies are fixedly installed on the rotating plate 5, the rotating plate 5 should be arranged under the annular cavity 7, and the rotating plate 5 is used to drive all the magnets 6. It rotates around the axis of the rotating plate 5, and the rotating plate 5 is arranged coaxially with the annular cavity 7.
  • the rotating plate 5 can A ring groove is set at a preset position, the bottom of the ring cavity 7 can be set in the ring groove, and the size of the ring groove can be adjusted according to the size of the ring cavity 7.
  • a first driving part 2 is provided under the rotating plate 5, and the first driving part 2 is fixedly connected to the rotating plate 5.
  • the first driving part 2 can provide power to drive the rotating plate 5 to rotate around the axis of the rotating plate 5, for example ,
  • the first driving part 2 can be specifically set as a motor, and the rotation speed of the motor can be set between 50rpm-5000rpm; in addition, the motor can be fixedly connected to the rotating plate 5 through the coupling 4, and the installation of the motor and the coupling 4
  • the connection can refer to the relevant technical requirements of the existing part, which will not be expanded here.
  • a mounting base 1 can also be provided.
  • the first driving part 2 can be fixedly installed on the mounting base 1, and the first driving part 2 can pass through
  • the motor clamp 3 is fixed on the mounting base 1;
  • a worktable 9 can be fixedly installed on the upper end of the mounting base 1, and the worktable 9 is detachably connected to the mounting base 1.
  • the center of the worktable 9 is provided with a through hole for the annular cavity 7 to penetrate. Obviously, the through hole is opened along the thickness direction of the worktable 9, so that The annular cavity 7 is assembled in the through hole of the workbench 9.
  • the diameter of the through hole can be set to be slightly greater than or equal to the outer diameter of the annular cavity 7.
  • the diameter of the through hole should be smaller than the diameter of the cavity cover 10, so that the cavity cover 10 can pass through
  • the bolt connection is connected with the outer circumference of the through hole.
  • the above-mentioned equipment may also be provided with several second driving parts 11, all of the second driving parts 11 may be arranged above the annular cavity 7 and pass through the cavity cover 10 and are located inside the annular cavity 7.
  • the second driving part 11 is used to drive the workpiece to be polished to rotate; in addition, the above equipment can also be provided with a third driving part 13 above the annular cavity 7, and the third driving part 13 is used to drive the workpiece Perform up and down movements.
  • the second drive The part 11 and the third driving part 13 can be arranged in other different ways, provided that the entire surface of the workpiece can be uniformly polished, and the connection of the second driving part 11 and the third driving part 13 can refer to the relevant technical requirements of the existing part. This article does not make specific restrictions.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

一种用于批量化抛光工件的设备，包括用以安装若干个工件的环状腔体（7）以及设于环状腔体（7）的内部、用以抛光工件的磁性磨料（12），还包括若干组用以产生磁场以供磁性磨料（12）去除工件表面材料的磁组，磁组包括设于环状腔体（7）内外两侧、用以绕着环状腔体（7）的轴线旋转的磁体（6）。该设备可以保证磁场辅助抛光的高精度抛光特性，实现大批量工件高精度抛光的功能，可用于合金、陶瓷、玻璃以及各种有色金属材料的表面处理，还可用于复杂多孔表面的光整加工。

Description

一种用于批量化抛光工件的设备
本申请要求于2019年03月06日提交中国专利局、申请号为201910168056.0、发明名称为“一种用于批量化抛光工件的设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及磁场辅助抛光技术领域，特别涉及一种用于批量化抛光工件的设备。
背景技术
近几十年来，磁场辅助抛光/精整工艺在表面、边缘精整和去毛刺等工业应用中得到了广泛应用。
目前，自由曲面的快速精加工有多种质量精加工技术，包括筒式质量精加工、振动精加工、离心精加工和拖动精加工，与磁场辅助表面处理相比，上述加工处理方法在很大程度上降低了初始表面形状的精度，难以获得纳米级的表面粗糙度。现有技术中，在磁场的辅助下，发展了多种抛光工艺，例如，利用磁流体对平面的表面进行高效精细抛光的工艺，该工艺通过将磁场加载到研磨剂和磁流体混合物中产生的磁浮力去除材料；在磁流体上施加磁场产生静液压力，对平面和曲面进行抛光；将磁场应用到磁流变液中，在流体与工件接触处产生抛光区，实现光学自由曲面的高精度确定性精加工。然而，上述抛光技术大多集中在一次高精度抛光一个自由曲面的应用，很难用于复杂表面的大批量精加工，因此，这不符合成本效益的实际批量生产，以致不能满足市场的需求。
因此，如何避免磁场辅助抛光技术不能满足大批量加工，是本领域技术人员目前需要解决的技术问题。
发明内容
本发明的目的是提供一种用于批量化抛光工件的设备，该设备不仅可以保证磁场辅助抛光的高精度抛光特性，而且可以实现大批量工件高精度 抛光的功能，同时，该设备可用于人工植入物、涡轮叶片、光学模具嵌件等自由曲面的抛光。
为实现上述目的，本发明提供一种用于批量化抛光工件的设备，包括用以安装若干个工件的环状腔体以及设于所述环状腔体的内部、用以抛光工件的磁性磨料，还包括若干组用以产生磁场以供所述磁性磨料去除工件表面材料的磁组，所述磁组包括设于所述环状腔体内外两侧、用以绕着所述环状腔体的轴线旋转的磁体。
优选地，还包括与所述环状腔体盖合连接、用以固定安装工件的腔体盖。
优选地，所述腔体盖通过工件夹具固定连接工件，以供工件悬空于所述环状腔体的内部。
优选地，还包括用以固定安装全部所述磁体并带动全部所述磁体转动的旋转板。
优选地，位于所述旋转板的下方设有与所述旋转板固接、用以驱动所述旋转板绕所述旋转板的轴线转动的第一驱动部。
优选地，所述第一驱动部通过联轴器与所述旋转板连接。
优选地，还包括用以固定安装所述第一驱动部的安装座。
优选地，所述安装座上设有用以固定安装所述环状腔体的工作台，且所述工作台的中心设有沿厚度方向开设、用以供所述环状腔体穿设的通孔。
优选地，所述磁性磨料具体为磁性颗粒与抛光磨料固结并与润滑剂混合，或者磁性颗粒与抛光磨料游离于基载液。
优选地，还包括若干个设于所述环状腔体的上方、用以驱动工件旋转运动的第二驱动部以及用以驱动工件上下运动的第三驱动部。
相对于上述背景技术，本发明针对工件自由曲面抛光的不同要求，设计了一种用于批量化抛光工件的设备，由于传统的磁场辅助抛光技术大多集中在一次高精度抛光一个自由曲面的应用，很难用于复杂表面的大批量精加工，因此，使用一种能够实现大批量工件高精度抛光以满足市场需求的设备很有必要。
具体来说，上述用于批量化抛光工件的设备包括环状腔体、磁性磨料 以及磁组，其中，环状腔体用来安装待抛光工件，且多个工件可以一次固定安装于环状腔体内；磁性磨料设于环状腔体的内部，磁组用来产生旋转磁场，这样一来，在旋转磁场的作用下，磁性磨料能够冲击工件表面，进而能够对工件表面的材料进行去除以实现工件整个表面的高精度抛光；该磁组包括设于环状腔体内外两侧的磁体，该磁体能够绕着环状腔体的轴线旋转，从而可以提供旋转磁场。与传统的精整设备相比，上述设置方式不仅可以保证磁场辅助的高精度抛光特性，而且可以实现大批量工件高精度抛光的功能；进一步的，该设备可用于合金、陶瓷、玻璃以及各种有色金属材料的表面处理，同时，该设备可用于复杂多孔表面的光整加工，例如，该设备可用于人工植入物、涡轮叶片、光学模具嵌件等自由曲面的抛光。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据提供的附图获得其他的附图。
图1为本发明实施例提供的一种用于批量化抛光工件的设备的整体结构示意图；
图2为图1的主视图；
图3为图1的纵向剖面结构示意图；
图4为图1的横向剖面结构示意图；
图5为本发明实施例提供的一种用于批量化抛光工件的设备中不同数量的磁组分配示意图；
图6为图1中六组磁组产生的磁刷示意图；
图7为图1中的磁性磨料在磁场作用下的分布示意图。
其中：
1-安装座、2-第一驱动部、3-电机夹具、4-联轴器、5-旋转板、6-磁体、7-环状腔体、8-工件夹具、9-工作台、10-腔体盖、11-第二驱动部、12-磁性磨料、13-第三驱动部。
具体实施方式
本发明的核心是提供一种用于批量化抛光工件的设备，该设备不仅可以保证磁场辅助抛光的高精度抛光特性，而且可以实现大批量工件高精度抛光的功能，同时，该设备可用于人工植入物、涡轮叶片、光学模具嵌件等自由曲面的抛光。
为了使本技术领域的技术人员更好地理解本发明方案，下面结合附图和具体实施方式对本发明作进一步的详细说明。
需要说明的是，下文所述的“上端、下端、左侧、右侧”等方位词都是基于说明书附图所定义的。
请参考图1至图7，图1为本发明实施例提供的一种用于批量化抛光工件的设备的整体结构示意图；图2为图1的主视图；图3为图1的纵向剖面结构示意图；图4为图1的横向剖面结构示意图；图5为本发明实施例提供的一种用于批量化抛光工件的设备中不同数量的磁组分配示意图；图6为图1中六组磁组产生的磁刷示意图；图7为图1中的磁性磨料在磁场作用下的分布示意图。
本发明实施例所提供的用于批量化抛光工件的设备，包括环状腔体7、磁性磨料12以及磁组，其中，环状腔体7用来安装待抛光的工件，且多个工件可以一次固定安装于环状腔体7内；磁性磨料12设于环状腔体7的内部，磁组用来产生旋转磁场，这样一来，在旋转磁场的作用下，磁性磨料12能够冲击工件表面，进而能够对工件表面的材料进行去除以实现工件整个表面的高精度抛光。
该磁组包括设于环状腔体7内外两侧的磁体6，该磁体6能够绕着环状腔体7的轴线旋转，从而可以提供工件抛光所需的旋转磁场，磁体6可以设置为永磁体或者电磁体，且磁体6的磁场强度可在0.01-5特斯拉之间变化。
具体地说，一组磁组可以设有两个分别设于环状腔体7内、外两侧的磁体6，且全部的磁组沿着环状腔体7的周向均匀分布，当然，根据实际加工需求，同组磁组的磁体6与环状腔体7之间应当留有预设间隙，且同 组磁组中位于环状腔体7内侧的磁体6至环状腔体7的内侧壁的预设间隙与同组磁组中位于环状腔体7外侧的磁体6至环状腔体7的外侧壁的预设间隙应当设置为相等间隙，如图4所示。
此外，根据不同材料的目标工件，上述磁性磨料12可以有不同的设置方式，例如，磁性磨料12具体可以以磁性颗粒与抛光磨料为原料，通过磁性颗粒与抛光磨料固结并与润滑剂混合形成磁性磨料12；磁性颗粒与抛光磨料也可以不固结，将磁性颗粒与抛光磨料游离于基载液中，从而形成具有抛光性能的研磨剂。这样一来，磁性磨料12在旋转磁场的作用下成为抛光带，当全部磁体6开始旋转，磁性磨料12在目标表面的刮伤处产生材料去除，这些运动的组合使得材料的去除随机进行，从而实现抛光性能，如图6和图7所示。
当然，根据实际需要，磁性磨料12的抛光磨料具体可以是金刚石、碳化硅、氧化铝、氧化硅、氧化铈等材料，磁性磨料12的尺寸可以是几微米到几百微米，以分别用于精细和粗抛光。
与传统的精整设备相比，上述设置方式为自由曲面的大批量精加工提供了一种更具成本效益的方法，该设备不仅可以保证磁场辅助抛光的高精度抛光特性，而且可以实现大批量工件高精度抛光的功能；进一步的，该设备可用于合金、陶瓷、玻璃以及各种有色金属材料的表面处理，同时，该设备可用于复杂多孔表面的光整加工，例如，该设备可用于人工植入物、涡轮叶片、光学模具嵌件等自由曲面的抛光。
需要注意的是，环状腔体7内所有工件应当设置在同一高度处，且工件的高度应当小于或者等于磁体6的高度，也就是说，一方面，工件底面的高度可以设置为高于磁体6底面的高度，另一方面，工件顶部的高度可以设置为不超过磁体6顶部的高度，这样一来，全部工件的整个表面均设置于磁场内，以便于实现工件整个表面的高精度抛光。
此外，根据环状腔体7与待抛光工件的尺寸，工件的数量可以进行调整，例如，该设备中待抛光工件的数量可以设置为6个，当然，也可以设置更多；此外，磁组的数量也可以设置为6组，需要说明的是，工件的数量可以设置为大于磁组的数量。
在本发明实施例中，上述设备还包括腔体盖10，显然，该腔体盖10设置于环状腔体7的上端并与环状腔体7通过盖合连接，腔体盖10的作用是能够固定安装多个工件，以供全部工件设置于环状腔体7内部。
当然，全部的工件可以通过预设的工件夹具8固定安装于腔体盖10上，这样即可使全部的工件悬空于环状腔体7的内部；此外，根据环状腔体7的形状结构，腔体盖10具体可以设置为圆形腔体盖，这样一来，全部的工件可以以预设的圆周位置均匀排列在腔体盖10的下端。
具体地说，上述设备还包括旋转板5，其中，全部磁组均固定安装于旋转板5上，旋转板5应当设置于环状腔体7的下方，旋转板5用于带动全部的磁体6绕着旋转板5的轴线进行转动，且旋转板5与环状腔体7同轴设置，为了保证旋转板5带动磁体6转动时不与环状腔体7形成干涉，可以在旋转板5的预设位置设置一个环槽，环状腔体7的底部可以设于环槽内，且该环槽的尺寸可以根据环状腔体7的尺寸进行调整。
位于旋转板5的下方设有第一驱动部2，第一驱动部2与旋转板5固定连接，第一驱动部2能够提供动力，从而可以驱动旋转板5绕旋转板5的轴线转动，例如，该第一驱动部2具体可以设置为电机，电机的转速可以设置在50rpm-5000rpm之间；此外，该电机可以通过联轴器4与旋转板5固接，电机与联轴器4的安装连接可以参照现有部分的相关技术要求，此处将不再展开。
更加具体地说，为了保证设备运行的稳定性与安全性，还可以设置安装座1，这样一来，上述第一驱动部2可以固定安装于安装座1上，且第一驱动部2可以通过电机夹具3固定在安装座1上；此外，为了实现环状腔体7的定位连接，还可以在安装座1的上端固定安装工作台9，该工作台9可拆卸地连接于安装座1上，以便更换不同尺寸的环状腔体7，且工作台9的中心设有用于供环状腔体7穿设的通孔，显然，该通孔沿工作台9的厚度方向开设，这样即可使环状腔体7组装于工作台9的通孔内。
需要说明的是，通孔的直径可以设置为稍大于或者等于环状腔体7的外径，然而，通孔的直径应当小于腔体盖10的直径，这样一来，腔体盖10可以通过螺栓连接与通孔的外周部进行连接。
为了优化上述实施例，上述设备还可以设置若干个第二驱动部11，全部第二驱动部11可以设置于环状腔体7的上方并穿过腔体盖10与位于环状腔体7内部的待抛光工件连接，第二驱动部11用来驱动待抛光工件旋转运动；此外，上述设备还可以设置位于环状腔体7上方的第三驱动部13，第三驱动部13用来驱动工件进行上下运动。
这样一来，结合待抛光工件的旋转运动与上下运动以及磁体6的旋转运动，从而可以保证对环状腔体7内待抛光工件的整个表面进行均匀抛光；当然，根据实际需要，第二驱动部11与第三驱动部13可以有其他不同的设置方式，前提是能够实现工件整个表面的均匀抛光，第二驱动部11与第三驱动部13的连接可以参照现有部分的相关技术要求，本文并不作具体限制。
需要说明的是，在本说明书中，诸如第一和第二之类的关系术语仅仅用来将一个实体与另外几个实体区分开来，而不一定要求或者暗示这些实体之间存在任何这种实际的关系或者顺序。
以上对本发明所提供的用于批量化抛光工件的设备进行了详细介绍。本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想。应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以对本发明进行若干改进和修饰，这些改进和修饰也落入本发明权利要求的保护范围内。

Claims (10)

  1. 一种用于批量化抛光工件的设备，其特征在于，包括用以安装若干个工件的环状腔体(7)以及设于所述环状腔体(7)的内部、用以抛光工件的磁性磨料(12)，还包括若干组用以产生磁场以供所述磁性磨料(12)去除工件表面材料的磁组，所述磁组包括设于所述环状腔体(7)内外两侧、用以绕着所述环状腔体(7)的轴线旋转的磁体(6)。
  2. 根据权利要求1所述的用于批量化抛光工件的设备，其特征在于，还包括与所述环状腔体(7)盖合连接、用以固定安装工件的腔体盖(10)。
  3. 根据权利要求2所述的用于批量化抛光工件的设备，其特征在于，所述腔体盖(10)通过工件夹具(8)固定连接工件、以供工件悬空于所述环状腔体(7)的内部。
  4. 根据权利要求3所述的用于批量化抛光工件的设备，其特征在于，还包括用以固定安装全部所述磁体(6)并带动全部所述磁体(6)转动的旋转板(5)。
  5. 根据权利要求4所述的用于批量化抛光工件的设备，其特征在于，位于所述旋转板(5)的下方设有与所述旋转板(5)固接、用以驱动所述旋转板(5)绕所述旋转板(5)的轴线转动的第一驱动部(2)。
  6. 根据权利要求5所述的用于批量化抛光工件的设备，其特征在于，所述第一驱动部(2)通过联轴器(4)与所述旋转板(5)连接。
  7. 根据权利要求6所述的用于批量化抛光工件的设备，其特征在于，还包括用以固定安装所述第一驱动部(2)的安装座(1)。
  8. 根据权利要求7所述的用于批量化抛光工件的设备，其特征在于，所述安装座(1)上设有用以固定安装所述环状腔体(7)的工作台(9)，且所述工作台(9)的中心设有沿厚度方向开设、用以供所述环状腔体(7)穿设的通孔。
  9. 根据权利要求8所述的用于批量化抛光工件的设备，其特征在于，所述磁性磨料(12)具体为磁性颗粒与抛光磨料固结并与润滑剂混合，或者磁性颗粒与抛光磨料游离于基载液。
  10. 根据权利要求1至9任一项所述的用于批量化抛光工件的设备， 其特征在于，还包括若干个设于所述环状腔体(7)的上方、用以驱动工件旋转运动的第二驱动部(11)以及用以驱动工件上下运动的第三驱动部(13)。
PCT/CN2019/106047 2019-03-06 2019-09-17 一种用于批量化抛光工件的设备 Ceased WO2020177295A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US17/435,064 US20220161383A1 (en) 2019-03-06 2019-09-17 Apparatus for batch polishing of workpieces

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910168056.0A CN109693148B (zh) 2019-03-06 2019-03-06 一种用于批量化抛光工件的设备
CN201910168056.0 2019-03-06

Publications (1)

Publication Number Publication Date
WO2020177295A1 true WO2020177295A1 (zh) 2020-09-10

Family

ID=66233885

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/106047 Ceased WO2020177295A1 (zh) 2019-03-06 2019-09-17 一种用于批量化抛光工件的设备

Country Status (3)

Country Link
US (1) US20220161383A1 (zh)
CN (1) CN109693148B (zh)
WO (1) WO2020177295A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109693148B (zh) * 2019-03-06 2021-08-31 香港理工大学 一种用于批量化抛光工件的设备
CN110640615B (zh) * 2019-10-16 2024-04-09 浙江工业大学 一种盲孔抛光用液态金属磁力抛光装置及其方法
CN111823064B (zh) * 2020-07-30 2022-04-29 吉林大学 一种针对复杂曲面内腔的磁场遥操纵涡旋抛光装置与方法
CN112276780A (zh) * 2020-10-12 2021-01-29 袁晓四 一种可对磨料循环利用的汽车车桥工件加工用抛光装置
CN114346890A (zh) * 2022-02-11 2022-04-15 南京伶机宜动驱动技术有限公司 空间磁控和/或非磁控光整装置及方法
CN114770330B (zh) * 2022-05-24 2024-03-08 海安县石油科研仪器有限公司 一种石油钻杆表面除锈装置
CN115056128B (zh) * 2022-05-31 2024-03-22 深圳市施乐电气技术有限公司 一种电力变压器出线接线套管加工成型装置及工艺
CN115179175B (zh) * 2022-07-27 2023-04-11 广东迪生力汽配股份有限公司 一种轮毂打磨装置
TWI889142B (zh) * 2024-01-15 2025-07-01 豪昱電子有限公司 磁力研磨拋光機

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4170849A (en) * 1977-07-26 1979-10-16 Kosobutsky Alexandr A Rotary machine for three-dimensional polishing of workpieces shaped as solids of revolution in a magnetic field using ferromagnetic abrasive powders
CN1063068A (zh) * 1992-01-14 1992-07-29 太原工业大学 旋流式高精抛磨加工设备及工艺
JPH07227747A (ja) * 1994-02-17 1995-08-29 Kyoei Denko Kk 磁力による表面処理装置
CN102079066A (zh) * 2010-11-11 2011-06-01 广东工业大学 一种电化学与磁性研磨复合的复合加工系统
CN103612195A (zh) * 2013-12-09 2014-03-05 湖南大学 一种环形磁场励磁的磁力研磨加工方法及装置
CN108161599A (zh) * 2018-01-11 2018-06-15 辽宁科技大学 一种自导向弯管内表面磁力研磨装置及方法
CN109693148A (zh) * 2019-03-06 2019-04-30 香港理工大学 一种用于批量化抛光工件的设备

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU403537A1 (ru) * 1971-06-03 1973-10-26 Физико технический институт Белорусской ССР УСТРОЙСТВО ДЛЯ ОБЪЕМНОЙ ПОЛИРОВКИrhflU'^ ^1'^;';':-"^ ••'^!? ФиП.и d-tO-v -.^' nib
SU488692A1 (ru) * 1973-07-09 1975-10-25 Физико-технический институт АН Белорусской ССР Устройтсво дл чистовой магнитноабразивной обработки заготовок
US4175930A (en) * 1978-04-27 1979-11-27 Baubel Alexandr A Method for finishing surfaces of non-magnetic articles by means of ferromagnetic abrasive powder in magnetic field
KR0169241B1 (ko) * 1996-04-12 1999-02-01 구자홍 디버링 장치
JP2003062747A (ja) * 2001-08-23 2003-03-05 Japan Science & Technology Corp 磁性流体利用の加工方法およびその装置
JP2007301710A (ja) * 2006-05-11 2007-11-22 Kazumori Otogao 磁気式バレル研磨装置及び混合・攪拌装置
CN100486765C (zh) * 2006-12-31 2009-05-13 广东工业大学 基于磁流变效应的研磨抛光方法及其抛光装置
CN201249403Y (zh) * 2008-07-28 2009-06-03 王启彬 一种纳米磁性液体清理抛光装置
CN202137644U (zh) * 2011-05-04 2012-02-08 辽宁科技大学 交变旋转磁场精密抛光机
CN102990481A (zh) * 2013-01-05 2013-03-27 长沙纳美特超精密制造技术有限公司 一种双面磁流变抛光装置及方法
CN104191318B (zh) * 2014-09-01 2017-05-10 浙江师范大学 一种磁流变抛光方法及抛光工具
CN106425699B (zh) * 2016-09-22 2018-06-19 浙江师范大学 小型零件磁流变抛光机
CN208276656U (zh) * 2018-06-06 2018-12-25 广东工业大学 一种柱面镜圆弧面的抛光装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4170849A (en) * 1977-07-26 1979-10-16 Kosobutsky Alexandr A Rotary machine for three-dimensional polishing of workpieces shaped as solids of revolution in a magnetic field using ferromagnetic abrasive powders
CN1063068A (zh) * 1992-01-14 1992-07-29 太原工业大学 旋流式高精抛磨加工设备及工艺
JPH07227747A (ja) * 1994-02-17 1995-08-29 Kyoei Denko Kk 磁力による表面処理装置
CN102079066A (zh) * 2010-11-11 2011-06-01 广东工业大学 一种电化学与磁性研磨复合的复合加工系统
CN103612195A (zh) * 2013-12-09 2014-03-05 湖南大学 一种环形磁场励磁的磁力研磨加工方法及装置
CN108161599A (zh) * 2018-01-11 2018-06-15 辽宁科技大学 一种自导向弯管内表面磁力研磨装置及方法
CN109693148A (zh) * 2019-03-06 2019-04-30 香港理工大学 一种用于批量化抛光工件的设备

Also Published As

Publication number Publication date
US20220161383A1 (en) 2022-05-26
CN109693148A (zh) 2019-04-30
CN109693148B (zh) 2021-08-31

Similar Documents

Publication Publication Date Title
WO2020177295A1 (zh) 一种用于批量化抛光工件的设备
CN201120584Y (zh) 磁石回转式抛光机
CN101559571A (zh) 用于光学元件的磁场辅助柔性旋转刷抛光方法及装置
CN103769959A (zh) 一种超声微磨削加工设备及工艺
US20250214191A1 (en) Conformal flexible polishing method for micro lens array mold
CN108857604A (zh) 一种多角度锥面工件内外环槽的磁力研磨装置及加工方法
CN114131431B (zh) 基于柔性磨粒和磁性复合流体的微型刀具钝化方法及装置
CN111215970B (zh) 一种微结构模具超声空化辅助超声磁力抛光方法
CN110370099A (zh) 旋转超声加工结合磁力研磨加工微半球凹模阵列的方法
CN110449997A (zh) 一种高效磁阵列磁场辅助光整加工方法与装置
CN113752105B (zh) 一种外圆柱面研抛装置及使用方法
CN110340748A (zh) 一种旋转超声法加工微半球凹模阵列的方法及装置
KR101211826B1 (ko) 자기유변유체를 이용한 피가공물의 연마장치 및 그 연마방법
CN109202602B (zh) 用于抛光非球面模仁的方法
CN207840993U (zh) 手机3d陶瓷后盖专用立式磨床
US4870743A (en) Quick change tool assembly for ultrasonic machine tool
Feng et al. Investigation on polishing of zirconia ceramics using magnetic compound fluid: Relationship between material removal and surface roughness
CN105437052B (zh) 一种连续加工自修复式研抛装置
Zheng et al. The three-point eccentric magnetorheological polishing technology for hard brittle alumina ceramics
CN207464836U (zh) 一种动态磁场磁流变抛光装置
KR102068538B1 (ko) 자기유변유체를 이용한 연마장치 및 그것을 이용한 연마방법
JPH05329766A (ja) 容器内面を磁気研磨する方法及び装置
JP2017177254A (ja) 焼結体の形状加工方法および加工装置
CN104786128B (zh) 基于三相磨粒流的超光滑表面精密流体圆盘抛光装置
US20070238397A1 (en) Finishing process

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19918450

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19918450

Country of ref document: EP

Kind code of ref document: A1