WO2020177010A1 - Système de dissipation de chaleur et son procédé de commande, et dispositif électronique - Google Patents

Système de dissipation de chaleur et son procédé de commande, et dispositif électronique Download PDF

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Publication number
WO2020177010A1
WO2020177010A1 PCT/CN2019/076690 CN2019076690W WO2020177010A1 WO 2020177010 A1 WO2020177010 A1 WO 2020177010A1 CN 2019076690 W CN2019076690 W CN 2019076690W WO 2020177010 A1 WO2020177010 A1 WO 2020177010A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
air
cabinet
cooling device
air duct
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PCT/CN2019/076690
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English (en)
Chinese (zh)
Inventor
肖聪
Original Assignee
深圳市建恒测控股份有限公司
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Priority to PCT/CN2019/076690 priority Critical patent/WO2020177010A1/fr
Publication of WO2020177010A1 publication Critical patent/WO2020177010A1/fr

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • This application relates to the field of electronic technology, in particular to a heat dissipation system and its control method, and electronic equipment.
  • the purpose of the present application is to provide a heat dissipation system, a control method thereof, and an electronic device to improve heat dissipation efficiency, thereby improving the energy efficiency of the corresponding electronic device, and achieving the thermal/power balance of the electronic device as much as possible.
  • the first aspect of the present application provides a heat dissipation system for dissipating heat to a cabinet, the cabinet including a cabinet body and a device accommodating cavity provided in the cabinet; the heat dissipation system includes an air cooling device and a water cooling device And thermal management module;
  • the air-cooling device is arranged between the cavity wall of the device accommodating cavity and the outer shell of the cabinet, and includes a first air duct, a third air duct, and a second air duct that are connected to each other in sequence.
  • the accommodating cavities jointly form a circulating air duct;
  • the water-cooling device includes a heat exchanger, a circulation pipe, a heat dissipation detection module, and a flow adjustment module.
  • the heat exchanger is arranged in the third air duct; the heat dissipation detection module, the flow adjustment module, and the The heat exchanger components are all arranged on the circulation pipe; the heat dissipation detection module is used to detect the actual heat dissipation of the water cooling device;
  • the thermal management module is signally connected to the heat dissipation detection module and the flow adjustment module to control the operation and operation of the flow adjustment module according to the total energy consumption of the devices in the cabinet and the information of the heat dissipation detection module / Or control the operation of the air cooling device.
  • the heat dissipation detection module includes a flow meter, a first temperature detection unit, and a second temperature detection unit.
  • the flow meter is arranged on the circulation pipe, the first temperature detection unit and the second temperature detection unit.
  • the detection units are respectively arranged on the inlet side and the outlet side of the heat exchanger; the first temperature detection unit, the second temperature detection unit and the flow meter are all signally connected to the thermal management module.
  • the flow meter is arranged on the outlet side; the flow adjustment module is arranged on the inlet side.
  • the flow meter is an ultrasonic flow meter.
  • the flow adjustment module includes a speed-regulating pump; or, the flow adjustment module includes a regulating valve.
  • the inlet end and the outlet end of the circulation pipe are respectively provided with on-off valves.
  • the inlet end and the outlet end of the circulation pipeline are in communication with the secondary chilled water pipeline or the primary chilled water pipeline.
  • the heat exchanger includes a coil structure.
  • the coil structures Preferably, along the gas flow direction of the third air channel, there are a plurality of the coil structures.
  • At least one of the first air duct, the second air duct and the third air duct is provided with an airflow generating device; the thermal management module is also signally connected to the airflow generating device.
  • the first air duct and the second air duct are respectively provided with a plurality of the airflow generating devices forming an array.
  • the airflow generating device arranged in the first air duct is a first airflow generating device group; the airflow generating device arranged in the second air duct is a second airflow generating device group; the airflow is arranged in the third air duct
  • the generating device is defined as a third airflow generating device group; the first airflow generating device group, the second airflow generating device group, and the third airflow generating device group are individually controlled by the thermal management module.
  • the air flow generating device is provided on opposite sides of the heat exchanger element along the gas flow direction.
  • the air-cooling device further includes a fourth air duct, and the first air duct and the second air duct are arranged on opposite sides of the device accommodating cavity; the first air duct, the The fourth air duct, the second air duct and the third air duct are connected end to end in sequence to form a circulating air duct.
  • the device accommodating cavity has a plurality of subspaces, and the second subspace is formed between two adjacent subspaces and between the subspace and the cavity wall of the device accommodating cavity. Four winds.
  • each of the fourth air channels along the gas flow direction is respectively provided with air flow generating devices.
  • each of the fourth air ducts is provided with a fourth temperature detecting unit, the fourth temperature detecting unit is signally connected to the thermal management module, and the airflow generating device corresponding to each of the fourth air ducts Individually controlled.
  • two side walls adjacent to the first air duct and the second air duct on the device accommodating cavity have a grid structure, and the first air duct and the second air duct are respectively It is connected to the fourth air duct through the adjacent grid structure.
  • it further includes a plurality of third temperature detection units arranged in the cabinet for detecting the air temperature in the cabinet, and the third temperature detection unit is signally connected to the thermal management module.
  • the enclosure of the cabinet includes a heat insulation structure to isolate heat transfer between the outside and the inside of the cabinet.
  • a second aspect of the present application provides an electronic device having a cabinet and further comprising the heat dissipation system described in any one of the above, and the heat dissipation system is provided in the cabinet.
  • the electronic equipment is computer cabinet equipment or data center equipment.
  • the third aspect of the present application provides a method for controlling the heat dissipation system according to any one of the above, which is characterized in that it comprises the steps:
  • the process of obtaining the actual heat dissipation capacity of the water cooling device specifically includes:
  • the actual heat dissipation Q1 current medium flow*temperature difference*specific heat capacity of the medium.
  • the process of controlling the medium flow of the water cooling device/or controlling the circulating air volume of the air cooling device according to the actual heat dissipation and the total energy consumption specifically includes:
  • W is the total energy consumption
  • A is the heat dissipation coefficient
  • B is a constant.
  • A when the air temperature in the cabinet is greater than the target temperature, A is greater than 1; when the air temperature in the cabinet is less than or equal to the target temperature, A is less than 1.
  • the heat dissipation system further includes a plurality of third temperature detection units, each of the third temperature detection units is distributed in different positions in the cabinet, and the control method further includes:
  • the first air duct, the second air duct and the third air duct are respectively provided with a first airflow generating device group, a second airflow generating device group and a third airflow generating device group;
  • the actual heat dissipation and the total energy consumption of the device are controlled to control the air volume of the air cooling device, specifically:
  • the rotation speeds of the first airflow generating device group, the second airflow generating device group, and the third airflow generating device group are respectively controlled according to the actual heat dissipation amount and the total energy consumption of the devices.
  • the device accommodating cavity has a plurality of subspaces, and a fourth air channel is formed between two adjacent subspaces and between the subspace and the cavity wall of the device accommodating cavity, and the first air channel is ,
  • the fourth air duct, the second air duct, and the third air duct are sequentially connected from end to end to form a circulating air duct; each fourth air duct is provided with a fourth temperature detection unit;
  • An airflow generating device group and the second airflow generating device group each include a plurality of airflow generating devices;
  • the rotation speed of each airflow generating device in the first airflow generating device group and the second airflow generating device group is controlled according to the detection result of the corresponding fourth temperature detection unit.
  • the fourth aspect of the present application provides a heat dissipation system for dissipating heat from a closed cabinet.
  • the cabinet includes a cabinet body and a device accommodating cavity provided in the cabinet; the heat dissipation system includes an air cooling device, Water cooling device and thermal management module; among them,
  • the water cooling device includes a heat exchanger for introducing chilled water into the cabinet;
  • the air-cooling device includes an air flow generating device for circulating air in the cabinet through the heat exchanger element and the device accommodating cavity for heat exchange respectively;
  • the air-cooling device and the water-cooling device are both signal-connected to the thermal management module, and the thermal management module is used to obtain the total energy consumption of the devices in the cabinet and the actual heat dissipation of the water-cooling device, and according to The total energy consumption and the actual heat dissipation volume dynamically control the medium flow rate and/or the circulating air volume of the water cooling device.
  • the water cooling device further includes a heat dissipation detection module for detecting actual heat dissipation.
  • the heat dissipation detection module includes a flow meter, a first temperature detection unit, and a second temperature detection unit.
  • the first temperature detection unit and the second temperature detection unit are respectively arranged on the inlet side and the outlet side of the heat exchanger; the first temperature detection unit and the second temperature detection unit Both the flow meter and the flow meter are signally connected with the thermal management module.
  • the flow meter is an ultrasonic flow meter.
  • the water cooling device further includes a flow adjustment module for adjusting the flow of the medium, the flow adjustment module includes a speed-regulating pump; or, the flow adjustment module includes a regulating valve.
  • the air-cooling device includes a first air channel, a fourth air channel, a second air channel, and a third air channel that are sequentially connected end to end, and the first air channel and the second air channel are arranged at the The two opposite sides of the device accommodating cavity.
  • the device accommodating cavity has a plurality of subspaces, and the second subspace is formed between two adjacent subspaces and between the subspace and the cavity wall of the device accommodating cavity. Four winds.
  • each of the fourth air channels along the gas flow direction is respectively provided with air flow generating devices.
  • the heat dissipation system provided by this application is provided with an air cooling device and a water cooling device, and a heat dissipation detection module and a flow adjustment module are provided in the water cooling device.
  • the air cooling device and the water cooling device exchange heat, and then the heat dissipation of the water cooling device is
  • the total energy consumption of the electronic equipment controls the flow adjustment module to adjust the medium flow of the water cooling device, so that the heat dissipation of the water cooling device is as equal to the total energy consumption of the device as possible, thereby improving the energy efficiency of the electronic equipment.
  • Figure 1 shows a schematic front view of a preferred embodiment of the heat dissipation system provided by the present application
  • Fig. 2 shows a schematic side view of a preferred embodiment of the heat dissipation system provided by the present application
  • FIG. 3 shows a system diagram of a preferred embodiment of the heat dissipation system provided by the present application
  • FIG. 4 shows a system diagram of another preferred embodiment of the heat dissipation system provided by the present application.
  • Fig. 5 shows a flowchart of a preferred embodiment of a method for controlling a heat dissipation system provided by the present application.
  • Cabinet 11. Cabinet; 111, bottom plate; 112, top plate; 113, side plate; 12, device housing cavity; 121, subspace; 122, grid structure;
  • Air-cooled device 31. The first air duct; 32. The second air duct; 33. The third air duct; 34. Air flow generating device; 35. The fourth air duct;
  • Thermal management module 51, display screen; 52, controller;
  • orientation words such as “front” and “rear” mentioned in this application refer to the orientation of the display screen when it faces the display screen in a normal working state.
  • the electronic equipment includes a cabinet 1 and a heat dissipation system.
  • the heat dissipation system is used to dissipate heat from the cabinet 1.
  • the cabinet 1 includes a cabinet body 11 and is arranged on the cabinet body 11.
  • the electronic device may also include an electronic device 6 such as a server.
  • the electronic device 6 is disposed in the device accommodating cavity 12.
  • the heat dissipation system includes an air-cooling device 3, a water-cooling device 4, and a thermal management module 5.
  • the water-cooling device includes a heat exchanger 41 for introducing chilled water into the cabinet 1; the air-cooling device 3 includes an airflow generating device 34 for making the cabinet
  • the air in 1 circulates through the heat exchanger 41 and the device accommodating cavity 12 for heat exchange respectively.
  • the airflow of the air-cooling device 3 flows through the device accommodating cavity 12, it can communicate with the device accommodating cavity 12 (specifically, it can It exchanges heat with the electronic device 6) in the accommodating cavity 12, and exchanges heat with the heat exchanger 41 when passing through the heat exchanger 41.
  • the air cooling device 3 and the water cooling device 4 are all signal-connected to the thermal management module 5.
  • the thermal management module 5 is used to obtain the total energy consumption W of the devices in the cabinet 1 and the actual heat dissipation Q1 of the water cooling device 4, and according to the total energy consumption W of the devices And the actual heat dissipation Q1 dynamically controls the medium flow rate and/or circulating air volume of the water cooling device 4.
  • the air cooling device 3 is disposed between the cavity wall of the device accommodating cavity 12 and the shell of the cabinet 11, and includes a first air duct 31, a third air duct 33, and The second air ducts 32 and the device containing cavity 12 together form a circulating air duct.
  • the water cooling device 4 is at least partially disposed in one of the first air passage 31, the second air passage 32 and the third air passage 33 to realize the heat exchange between the water cooling device 4 and the air cooling device 3.
  • the water cooling device 4 includes a heat exchanger 41, a circulation pipe 42, a heat dissipation detection module 43, and a flow adjustment module 44.
  • the heat exchanger 41 is arranged in the third air duct 33; the heat dissipation detection module 43, the flow adjustment module 44 and the heat exchange
  • the devices 41 are all arranged on the circulation pipe 42; the heat dissipation detection module 43 is used to detect the actual heat dissipation of the water cooling device 4; the flow adjustment module 44 is arranged on the circulation pipe 42. It is understandable that the total energy consumption W of the above-mentioned devices can be obtained through the electric energy meter 2 and other devices.
  • the thermal management module 5 is signally connected to the electric energy meter 2, the heat dissipation detection module 43, and the flow adjustment module 44, so as to determine the total energy consumption of the device.
  • the information of the consumption and heat dissipation detection module 43 controls the operation of the flow adjustment module 44 and the air cooling device 3.
  • S200 Control the medium flow of the water cooling device and/or control the air flow of the air-cooling device 3 according to the actual heat dissipation Q1 and the total energy consumption W of the device, that is, only the medium flow can be controlled according to the actual heat dissipation Q1 and the total energy consumption W of the device It is also possible to control only the circulating air volume of the air-cooling device 3, or control the medium flow rate and the circulating air volume at the same time, wherein the circulating air volume can be achieved by controlling the rotation speed of the gas generating device 34.
  • the external power supply directly supplies power to the electronic equipment through the power supply circuit 7.
  • the electric energy meter 2 is connected in series with the power supply circuit 7, and can detect the total input power of the electronic equipment, and then obtain the total energy consumption W of the device; at the same time, the air cooling device 3 Perform heat exchange with the water-cooling device 4 to bring the heat emitted by the electronic device 6 to the water-cooling device 4.
  • the heat dissipation detection module 43 detects the actual heat dissipation Q1 of the water-cooling device 4; in order to avoid energy waste, adjust according to the above control method
  • the medium flow rate of the water cooling device 4 is such that the actual heat dissipation Q1 is as equal as possible to the total energy consumption W of the device, so that the heat/power of the electronic equipment can be dynamically matched and balanced, and the temperature fluctuation in the cabinet 1 is minimized as much as possible, and the electronic
  • the thermal fatigue of the equipment improves the life of electronic devices and the reliability of the entire electronic equipment; at the same time, this method reduces manual intervention and reduces the difficulty of using electronic equipment.
  • the heat dissipation system adjusts the rotation speed of the airflow generating device of the heat dissipation system according to the temperature change in the cabinet 1 to accelerate air flow and heat dissipation; or adjust the medium flow of the water cooling device through the temperature change in the cabinet 1.
  • the control system determines whether it is through the temperature adjustment of the cabinet 1 to adjust the speed of the airflow generating device or the medium flow of the water cooling device, only after the actual temperature in the cabinet 1 is greater than or less than the preset temperature.
  • the airflow generates the device speed or medium flow.
  • this method of adjusting heat dissipation according to temperature changes is a passive adjustment method, which has hysteresis, resulting in insufficient heat dissipation adjustment and following problems, and will also cause partial waste of the total energy consumption of the device.
  • the temperature in the cabinet 1 can be basically stable It is thought of using the above heat dissipation system and control method to directly adjust the medium flow of the water cooling device 4 and the circulating air volume of the air cooling device 3 according to the actual heat dissipation Q1 and the total energy consumption W of the device, so that the actual heat dissipation Q1 and the device The total energy consumption W is as balanced as possible. In this way, the air temperature in the cabinet 1 will naturally not change.
  • this adjustment method is an active adjustment method, and it is a closed-loop control, and there is no hysteresis, which can avoid the aforementioned heat dissipation. Adjust the problem of insufficient follow; at the same time, it can improve the power density of electronic equipment and the construction cost of data centers.
  • the cabinet 11 may be a rectangular parallelepiped structure, including an outer shell.
  • the outer shell includes an insulating structure.
  • the insulating structure may be an insulating foam or an insulating glue layer, specifically
  • the shell includes a bottom plate 111 and a top plate 112 oppositely arranged, and a side plate 113 connecting the top plate 112 and the bottom plate 111.
  • the bottom plate 111, the side plate 113 and the top plate 112 form a closed cavity, the water cooling device 4, the air cooling device 3, and the electric power Table 2 and the thermal management module 5 are both arranged in the cavity, and the device accommodating cavity 12 is arranged in the cavity.
  • the top plate 112 and the side plate 113 can be equipped with heat insulation structures. Further, in the first When the air duct 31 and the second air duct 32 are arranged along the height direction of the cabinet 1 (which will be described in detail below), heat insulation is provided between the bottom plate 111 and the first air duct 31, and between the bottom plate 111 and the second air duct 32. structure. Considering that the circulation pipe 42 of the water cooling device 4 and the power supply circuit 7 of the electronic equipment need to be led out of the cabinet 11, a space can be set between the bottom plate 111 and the ground, that is, the bottom plate 111 is spaced apart.
  • the device accommodating cavity 12 has multiple sub-spaces 121 so as to The electronic devices 6 are placed in the spaces 121 respectively.
  • the height direction is based on the use state of the cabinet 1 as a reference.
  • the heat exchanger element 41 may be arranged in the third air duct 33, and the circulation pipe 42 and the like may be arranged in the first air duct 31 or the second air duct 32; or all of them may be arranged in the third air duct 33.
  • the medium in the water cooling device 4 may be primary chilled water or secondary chilled water, or other cold media.
  • the inlet end and the outlet end of the circulation pipe 42 are respectively connected with the primary chilled water pipeline, so that the entire water cooling device 4 and the chilled water pipeline form a communication pipeline; when the medium is secondary chilled water, the flow Both the inlet end and the outlet end of the pipe 42 communicate with the secondary chilled water pipeline.
  • the primary chilled water refers to the chilled water in the building where the electronic equipment is located
  • the secondary chilled water refers to the independent chilled water passing through the secondary heat exchanger.
  • the heat dissipation detection module 43 includes a flow meter 431, a first temperature detection unit 432, and a second temperature detection unit 433.
  • the flow meter 431 is disposed on the circulation pipe 42 for detecting the flow of the medium on the circulation pipe 42.
  • the temperature detection unit 432 and the second temperature detection unit 433 may both be thermometers or other temperature sensor devices, etc., which are respectively arranged on the inlet side and the outlet side of the heat exchanger element 41, as shown in FIG. 3 and FIG.
  • a first temperature detection unit 432 is provided on the inlet side of the heat exchanger, and a second temperature detection unit 433 is provided on the outlet side to detect the inlet temperature T1 on the inlet side and the outlet temperature T2 on the outlet side of the heat exchanger 41; the first temperature detection unit 432, Both the temperature detection unit 433 and the flow meter 431 are signally connected to the thermal management module 5 so as to transmit the detected medium flow rate, the inlet temperature T1 and the outlet temperature T2 to the thermal management module 5.
  • the detection of the actual heat dissipation Q1 of the water cooling device 4 in the foregoing step S100 is specifically:
  • the heat dissipation detection module 43 may also be a heat detector or the like.
  • the flow meter 431 may be arranged on the outlet side; the flow adjustment module 44 may be arranged on the inlet side to facilitate the structural arrangement of the entire water cooling device 4.
  • the flow meter 431 may be an ordinary flow meter or an ultrasonic flow meter, preferably an ultrasonic flow meter, so as to reduce the influence of the flow meter 431 on the flow rate of the medium.
  • the flow adjustment module 44 includes a speed-regulating pump 441, and the speed-regulating pump 441 is signally connected to the thermal management module 5, as shown in FIG. 4, especially when the medium of the water-cooling device 4 is secondary chilled water, through the adjustment
  • the speed pump 441 adjusts the flow of the medium.
  • the flow adjustment module 44 requires only one component to adjust the flow. The structure is simple, and the arrangement of the components of the water cooling device 4 is easy.
  • the flow regulating module 44 includes a regulating valve 442.
  • the regulating valve 442 is used to regulate the flow of the medium in the water cooling device 4, and is connected to the thermal management module 5 in signal, especially when the medium of the water cooling device 4 is primary chilled water. , To adjust the medium flow through the opening of the regulating valve 442.
  • the flow regulating module 44 may also include a speed regulating pump 441 and a regulating valve 442 at the same time, so as to jointly regulate the medium flow through the regulating valve 442 and the regulating pump 441.
  • the inlet end and the outlet end of the circulation pipe 42 are respectively provided with on-off valves 45, such as solenoid valves, that is, the water-cooling device 4 also includes an on-off valve 45 to open or disconnect the water-cooling device 4 and The channel of the external medium source.
  • on-off valves 45 such as solenoid valves
  • the above-mentioned heat exchanger element 41 includes a coil structure, as shown in Figures 3 and 4. This structure can increase the heat dissipation area of the heat exchanger element 41 in a smaller space, and increase the heat of the air-cooling device 3 and the heat exchanger element 41. Exchange efficiency.
  • a plurality of coil structures are provided along the gas flow direction of the third air channel 33.
  • the heat exchanger element 41 further includes heat dissipation fins, and the heat dissipation fins are connected to the coil structure.
  • the heat exchanger element 41 may also include only the heat dissipation fins or the coil structure.
  • the airflow generating device 34 may be a fan, and the thermal management module 5 is signally connected to the airflow generating device 34 so as to be controlled by the thermal management module 5 in the first air duct 31, the second air duct 32, and the third air duct.
  • a gas flow is formed in the channel 33.
  • the first air channel 31, the second air channel 32, and the third air channel 33 is provided with an air flow generating device 34, such as only the first air channel 31, the second air channel 32, or the third air channel.
  • the channel 33 is provided with an airflow generating device 34, or two of the three are provided with an airflow generating device 34; preferably, the first air channel 31, the second air channel 32, and the third air channel 33 are all provided with airflow generating devices.
  • the device 34 can use the airflow generating device 34 in the third air duct 33 as the main airflow generating device, and the airflow generating device 34 in the first air duct 31 and the second air duct 32 as the auxiliary airflow generating device to better increase
  • the fluidity of the gas improves the heat exchange efficiency between the air cooling device 3 and the water cooling device 4.
  • first air duct 31 and the second air duct 32 are provided with airflow generating devices 34
  • one or a row of airflow generating devices 34 may be respectively provided; or a plurality of airflow generating devices 34 may be respectively provided for the first air channel 31 and the second air duct 32 are respectively provided with airflow generating devices 34 forming an array, and a plurality of airflow generating devices 34 arranged in the first air channel 31 can be defined as a first airflow generating device group; arranged in the second air channel 32
  • the multiple airflow generating devices 34 in the second airflow generating device group referring to FIG. 1 and FIG. 2, this can further accelerate the gas flow.
  • the air flow generating device 34 is provided in the third air duct 33, in order to better exchange heat between the air cooling device 3 and the heat exchanger element 41, the air flow generating device 34 is provided on the opposite sides of the heat exchanger element 41 along the gas flow direction.
  • the third air duct 33 may be provided with a plurality of airflow generating devices 34 to form a third airflow generating device group.
  • a plurality of airflow generating devices 34 may be respectively provided on opposite sides of the heat exchanger element 41, and they may be arranged in an array respectively, that is, the airflow generating devices 34 of the third airflow generating device group are arranged in an array, as shown in FIG. 3 4. As shown in FIG.
  • airflow generating devices 34 are arranged on either side of the heat exchanger element 41 along the gas flow direction and arranged in an array.
  • the air output volume of the airflow generating device 34 in the third air duct 33 may be set to be greater than the air output volume of the airflow generating device 34 in the first air channel 31 and the second air channel 32 to further increase the air cooling device 3 The efficiency of heat exchange with the heat exchanger element 41.
  • the airflow generating device 34 may be arranged only on one side of the heat exchanger element 41 along the gas flow direction, or the airflow generating device 34 may be arranged on the side of the heat exchanger element 41 relative to the gas flow direction.
  • the first air duct 31 and the second air duct 32 are arranged on opposite sides of the device accommodating cavity 12. As shown in FIG. 2, two opposite side plates 113 and the device accommodating cavity 12 are formed respectively The first air channel 31 and the second air channel 32, that is, the first air channel 31 and the second air channel 32 are formed between the side plate 113 and the device accommodating cavity 12. At this time, the bottom plate 111 and the device accommodating cavity 12 form a second air channel. Three wind road 33. On the side where the bottom plate 111 of the cabinet 1 is located, the first air duct 31 communicates with the second air duct 32 through the third air duct 33.
  • the first air duct 31 can communicate with each other through the device accommodating cavity 12
  • the second air duct 32 is connected.
  • the air-cooling device 3 further includes a fourth air duct 35, which is arranged in the device accommodating cavity 12, so that the first air duct 31, the fourth air duct 35, and the The second air duct 32 and the third air duct 33 are sequentially connected end to end to form a circulating air duct, which is beneficial to the heat dissipation of the electronic device 6.
  • the gas flow directions of the first air duct 31 and the second air duct 32 are substantially parallel to the height direction of the cabinet 1.
  • the fourth air duct 35 that is, the fourth air duct 35, is formed between two adjacent sub-spaces 121 and between the sub-space 121 and the cavity wall of the device accommodating cavity 12
  • a fourth air duct 35 is formed between two adjacent layers of electronic devices 6.
  • the contact between the gas and the electronic device 6 can be increased Area, so that the total energy consumption W of the device can be converted into the actual heat dissipation Q1 of the water cooling device as much as possible, thereby maintaining the stability of the air temperature in the cabinet 1.
  • each fourth air channel 35 is provided with air flow generating devices 34 on both sides along the gas flow direction to ensure the controllability of the gas flow.
  • the first air channel 31 and the second air channel 32 are respectively provided with air flow generating devices.
  • the behavior of the array can be set perpendicular to the direction of the gas flow of the fourth air channel 35 and perpendicular to the gas flow direction of the first air channel 31; the column of the array in the airflow generating device array is the gas flow direction of the air channel where it is located .
  • the two side walls of the device accommodating cavity 12 adjacent to the first air duct 31 and the second air duct 32 have a grid structure 122.
  • the first air duct 31 and the second air duct 32 respectively communicate with the fourth air duct 35 through the grid structure 122 adjacent to it, so as to facilitate the guidance of the gas flow and increase the strength of the cabinet 1.
  • the first air duct 31 and the second air duct 32 may directly communicate with the fourth air duct 35.
  • the fourth air duct 35 can also be directly arranged outside the device accommodating cavity 12.
  • a fourth air duct is formed between the top plate 112 and the device accommodating cavity 12, that is, the entire air-cooling device surrounds the device accommodating cavity 12. The outer circumference of the cavity 12 is provided.
  • the first airflow generating device group, the second airflow generating device group, and the third airflow generating device group can be controlled separately, that is, in the foregoing step S200, the control of the air cooling device is controlled according to the actual heat dissipation Q1 and the total energy consumption W of the devices.
  • the circulating air volume specifically:
  • the rotation speeds of the first airflow generating device group, the second airflow generating device group and the third airflow generating device group are respectively controlled to further improve the dynamic heat/power balance of the electronic device.
  • the arrangement of the air flow generating devices 34 in the various manners described above is not only conducive to the fluidity of the air in the entire air cooling device 3, but also makes the temperature in the entire cabinet 1 more uniform.
  • each fourth air duct 35 is provided with a fourth temperature detection unit (not shown in the figure), such as a thermometer or a temperature sensor, and the fourth temperature detection unit is connected to The thermal management module 5 is signal connected, and the fourth temperature detection unit in each fourth air channel 35 corresponds to the air flow generating device 34 on both sides of the fourth air channel 35. At this time, the air flow generating device corresponding to each fourth air channel 35 34 can be individually controlled.
  • a fourth temperature detection unit such as a thermometer or a temperature sensor
  • each airflow generating device 34 in the first airflow generating device group and the second airflow generating device group can be controlled according to the detection result of the corresponding fourth temperature detection unit to control
  • Each air flow generating device 34 performs precise control, so as to better control the circulating air volume of the air cooling device 3.
  • step S200 is specifically:
  • W is the total energy consumption of the device
  • A is the heat dissipation coefficient, which is greater than zero
  • B is a constant, which can be determined based on experience.
  • A is greater than 1.
  • the target temperature can be the best working environment temperature of the electronic device, or it can be the most reliable and energy-saving temperature.
  • the target temperature can be set by the operator, or the thermal management module 5 can be set automatically according to preset rules. set.
  • the heat dissipation system further includes a third temperature detection unit 8 arranged in the cabinet, such as a thermometer or a temperature sensor device.
  • the third temperature detection unit 8 is signal-connected to the thermal management module 5 to grasp the cabinet in real time.
  • the third temperature detection unit 8 may be provided with multiple, and each third temperature detection unit is provided in a different position in the cabinet 1, such as in the device housing cavity 12, the first air duct 31, the second air duct 32, and the heat Exchange device 41, etc., to monitor the air temperature everywhere in the cabinet 1. Considering that the air temperature at the heat exchanger 41 may be relatively low, the temperature in the device accommodating cavity 12 is relatively high.
  • At least A third temperature detection unit 8 is provided at the heat exchanger 41 and in the device accommodating cavity 12.
  • the third temperature detection unit 8 and the fourth temperature detection unit in the device accommodating cavity 12 can share the same thermometer or temperature sensor device. , In order to be able to obtain the highest air temperature and the lowest air temperature in the cabinet 1.
  • the aforementioned heat dissipation coefficient A can be adjusted in real time according to the air temperature, that is, the aforementioned control method further includes:
  • the values of A and B can be set in advance, and then during the entire control process, real-time adjustments are made according to the temperature value of the third temperature detection unit 8, such as the third temperature detection unit 8 and thermal management
  • the module 5 is connected with signals, and the thermal management module 5 can adjust the value of A in real time according to the temperature of the third temperature detection unit 8. Of course, it can also be adjusted by the operator according to the temperature of the third temperature detection unit 8.
  • the thermal management module 5 may include a display screen 51 and a controller 52 connected to each other.
  • the display screen 51 is used to display various information of electronic equipment, such as the air temperature in the cabinet 1, the total energy consumption W of the components, the actual heat dissipation Q1, and the medium. Flow rate, etc.; electric energy meter 2, air flow generating device 34, first temperature detection unit 432, second temperature detection unit 433, flow meter 431, flow adjustment module 44 connected to controller 52, and third temperature detection unit 8, fourth
  • the temperature detection unit may also be connected to the display screen 51 and/or the controller 52.
  • Electronic equipment can often be provided with multiple heat dissipation systems, that is, the electronic equipment includes multiple cabinets 1, and each cabinet 1 is equipped with the above-mentioned water cooling device 4, air cooling device 3, electric energy meter 2, and thermal management module 5, each thermal management module 5 Can be connected to each other, such as through the upper computer connection for unified control. Using this decentralized method of controlling heat makes the use of electronic equipment easier.
  • the device accommodating cavity 12 may only be provided with energy-consuming electronic devices 6.
  • the total energy consumption W of the devices is equal to the total input electric energy measured by the electric energy meter 2; some electronic devices also It may include an energy storage device (not shown in the figure), such as a battery.
  • the energy storage device is also arranged in the device accommodating cavity 12.
  • the total input electrical energy of the input electronic device is used for the operation of the electronic device 6.
  • the energy storage device can also be charged. Therefore, the total energy consumption W of the device is equal to the difference between the total input electric energy measured by the electric energy meter 2 and the energy stored by the energy storage device.
  • the energy storage device can be used as a power source to provide electrical energy for the electronic device 6 and the thermal management module 5, the air cooling device 3, and the water cooling device 4.
  • the energy storage device can be used as a power source alone to provide electrical energy for the electronic device 6, the thermal management module 5, the air cooling device 3, and the water cooling device 4. It can also be used together with the power supply circuit 7 for the electronic device 6, the thermal management module 5, and the air cooling device 3. ,
  • the water cooling device 4 provides electrical energy. When the energy storage device is powered by itself, the total output electrical energy of the energy storage device can be detected by an electric energy meter.
  • the total output electrical energy is the total energy consumption W of the device; when the energy storage device and the power supply circuit 7 are shared When power is supplied, the total energy consumption W of the device is equal to the sum of the total output electric energy of the energy storage device and the total input electric energy of the power supply circuit 7.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un système de dissipation de chaleur et son procédé de commande, et un dispositif électronique. Le système de dissipation de chaleur comprend un appareil de refroidissement d'air, un appareil de refroidissement d'eau et un module de gestion de chaleur. L'appareil de refroidissement d'air est disposé entre une paroi de cavité d'une cavité de réception de dispositif et un boîtier d'un corps d'armoire, et comprend un premier canal d'air, un troisième canal d'air et un second canal d'air qui sont séquentiellement mis en communication l'un avec l'autre. L'appareil de refroidissement d'eau comprend un dispositif d'échange de chaleur, un tuyau d'écoulement, un module de mesure de quantité de dissipation de chaleur, et un module de régulation de quantité d'écoulement, le dispositif d'échange de chaleur étant disposé à l'intérieur du troisième canal d'air. Le module de mesure de quantité de dissipation de chaleur, le module de régulation de quantité d'écoulement et le dispositif d'échange de chaleur sont tous disposés sur le tuyau d'écoulement. Le module de gestion de chaleur est signalé à la fois au module de mesure de quantité de dissipation de chaleur et au module de régulation de quantité d'écoulement, de façon à commander le module de régulation de quantité d'écoulement pour faire fonctionner et/ou commander l'appareil de refroidissement d'air pour fonctionner selon la consommation d'énergie de dispositif totale et des informations du module de mesure de quantité de dissipation de chaleur. La présente invention peut améliorer l'efficacité de dissipation de chaleur d'armoires, ce qui permet d'améliorer l'efficacité énergétique de dispositifs électroniques et de mettre en oeuvre un équilibre de chaleur/puissance des dispositifs électroniques autant que possible.
PCT/CN2019/076690 2019-03-01 2019-03-01 Système de dissipation de chaleur et son procédé de commande, et dispositif électronique WO2020177010A1 (fr)

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CN103014329A (zh) * 2012-12-27 2013-04-03 中冶长天国际工程有限责任公司 一种环冷鼓风机控制方法
CN103849758A (zh) * 2014-03-07 2014-06-11 刘小阳 淬火冷却监控系统
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CN102364406A (zh) * 2011-09-19 2012-02-29 浪潮电子信息产业股份有限公司 一种机柜动态制冷散热控制方法
CN103014329A (zh) * 2012-12-27 2013-04-03 中冶长天国际工程有限责任公司 一种环冷鼓风机控制方法
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CN113448183A (zh) * 2021-07-02 2021-09-28 宁波润华全芯微电子设备有限公司 一种用于匀胶显影机热处理模块的冷却装置

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