WO2020177010A1

WO2020177010A1 - Heat-dissipation system and control method therefor, and electronic device

Info

Publication number: WO2020177010A1
Application number: PCT/CN2019/076690
Authority: WO
Inventors: 肖聪
Original assignee: 深圳市建恒测控股份有限公司
Priority date: 2019-03-01
Filing date: 2019-03-01
Publication date: 2020-09-10

Abstract

Disclosed are a heat-dissipation system and control method therefor, and an electronic device. The heat-dissipation system comprises an air cooling apparatus, a water cooling apparatus, and a heat management module. The air cooling apparatus is provided between a cavity wall of a device accommodating cavity and a housing of a cabinet body, and comprises a first air channel, a third air channel, and a second air channel which are sequentially communicated with each other. The water cooling apparatus comprises a heat exchange device, a flow pipe, a heat-dissipation amount measurement module, and a flow amount regulating module, the heat exchange device being provided within the third air channel. The heat-dissipation amount measurement module, the flow amount regulating module, and the heat exchange device are all provided on the flow pipe. The heat management module is signaled to both the heat-dissipation amount measurement module and the flow amount regulating module, so as to control the flow amount regulating module to operation and/or control the air cooling apparatus to operate according to total device energy consumption and information of the heat-dissipation amount measurement module. The present application can improve the heat-dissipation efficiency of cabinets, thereby improving energy efficiency of electronic devices and implementing heat/power balance of the electronic devices as much as possible.

Description

Heat dissipation system and control method thereof, and electronic equipment

Technical field

This application relates to the field of electronic technology, in particular to a heat dissipation system and its control method, and electronic equipment.

Background technique

With the development of technology, data centers are developing exponentially at a high speed, and their energy consumption has attracted the attention of equipment. The energy efficiency and dynamic cooling of data centers have become one of the number one challenges for data centers. The current heat dissipation method is similar to the building's central air-conditioning, which causes a large amount of energy consumption to be wasted in ineffective indoor air, which is not conducive to improving energy efficiency; and the existing method causes uniform heat dissipation and temperature control lag, which brings serious heat/ Unbalanced work.

Summary of the invention

In view of this, the purpose of the present application is to provide a heat dissipation system, a control method thereof, and an electronic device to improve heat dissipation efficiency, thereby improving the energy efficiency of the corresponding electronic device, and achieving the thermal/power balance of the electronic device as much as possible.

In order to achieve the above objectives, this application adopts the following technical solutions:

The first aspect of the present application provides a heat dissipation system for dissipating heat to a cabinet, the cabinet including a cabinet body and a device accommodating cavity provided in the cabinet; the heat dissipation system includes an air cooling device and a water cooling device And thermal management module;

The air-cooling device is arranged between the cavity wall of the device accommodating cavity and the outer shell of the cabinet, and includes a first air duct, a third air duct, and a second air duct that are connected to each other in sequence. The accommodating cavities jointly form a circulating air duct;

The water-cooling device includes a heat exchanger, a circulation pipe, a heat dissipation detection module, and a flow adjustment module. The heat exchanger is arranged in the third air duct; the heat dissipation detection module, the flow adjustment module, and the The heat exchanger components are all arranged on the circulation pipe; the heat dissipation detection module is used to detect the actual heat dissipation of the water cooling device;

The thermal management module is signally connected to the heat dissipation detection module and the flow adjustment module to control the operation and operation of the flow adjustment module according to the total energy consumption of the devices in the cabinet and the information of the heat dissipation detection module / Or control the operation of the air cooling device.

Preferably, the heat dissipation detection module includes a flow meter, a first temperature detection unit, and a second temperature detection unit. The flow meter is arranged on the circulation pipe, the first temperature detection unit and the second temperature detection unit. The detection units are respectively arranged on the inlet side and the outlet side of the heat exchanger; the first temperature detection unit, the second temperature detection unit and the flow meter are all signally connected to the thermal management module.

Preferably, the flow meter is arranged on the outlet side; the flow adjustment module is arranged on the inlet side.

Preferably, the flow meter is an ultrasonic flow meter.

Preferably, the flow adjustment module includes a speed-regulating pump; or, the flow adjustment module includes a regulating valve.

Preferably, the inlet end and the outlet end of the circulation pipe are respectively provided with on-off valves.

Preferably, the inlet end and the outlet end of the circulation pipeline are in communication with the secondary chilled water pipeline or the primary chilled water pipeline.

Preferably, the heat exchanger includes a coil structure.

Preferably, along the gas flow direction of the third air channel, there are a plurality of the coil structures.

Preferably, at least one of the first air duct, the second air duct and the third air duct is provided with an airflow generating device; the thermal management module is also signally connected to the airflow generating device.

Preferably, the first air duct and the second air duct are respectively provided with a plurality of the airflow generating devices forming an array.

Preferably, the airflow generating device arranged in the first air duct is a first airflow generating device group; the airflow generating device arranged in the second air duct is a second airflow generating device group; the airflow is arranged in the third air duct The generating device is defined as a third airflow generating device group; the first airflow generating device group, the second airflow generating device group, and the third airflow generating device group are individually controlled by the thermal management module.

Preferably, in the third air duct, the air flow generating device is provided on opposite sides of the heat exchanger element along the gas flow direction.

Preferably, the air-cooling device further includes a fourth air duct, and the first air duct and the second air duct are arranged on opposite sides of the device accommodating cavity; the first air duct, the The fourth air duct, the second air duct and the third air duct are connected end to end in sequence to form a circulating air duct.

Preferably, along the height direction of the cabinet, the device accommodating cavity has a plurality of subspaces, and the second subspace is formed between two adjacent subspaces and between the subspace and the cavity wall of the device accommodating cavity. Four winds.

Preferably, two sides of each of the fourth air channels along the gas flow direction are respectively provided with air flow generating devices.

Preferably, each of the fourth air ducts is provided with a fourth temperature detecting unit, the fourth temperature detecting unit is signally connected to the thermal management module, and the airflow generating device corresponding to each of the fourth air ducts Individually controlled.

Preferably, two side walls adjacent to the first air duct and the second air duct on the device accommodating cavity have a grid structure, and the first air duct and the second air duct are respectively It is connected to the fourth air duct through the adjacent grid structure.

Preferably, it further includes a plurality of third temperature detection units arranged in the cabinet for detecting the air temperature in the cabinet, and the third temperature detection unit is signally connected to the thermal management module.

Preferably, the enclosure of the cabinet includes a heat insulation structure to isolate heat transfer between the outside and the inside of the cabinet.

A second aspect of the present application provides an electronic device having a cabinet and further comprising the heat dissipation system described in any one of the above, and the heat dissipation system is provided in the cabinet.

Preferably, the electronic equipment is computer cabinet equipment or data center equipment.

The third aspect of the present application provides a method for controlling the heat dissipation system according to any one of the above, which is characterized in that it comprises the steps:

Obtaining the actual heat dissipation of the water cooling device and the total energy consumption of the components in the cabinet;

Control the medium flow rate of the water cooling device and/or control the circulating air volume of the air cooling device according to the actual heat dissipation and the total energy consumption of the device.

Preferably, the process of obtaining the actual heat dissipation capacity of the water cooling device specifically includes:

Detecting the temperature difference between the inlet side and the outlet side of the heat exchanger element, and acquiring the current medium flow rate of the heat exchanger element;

The actual heat dissipation Q1=current medium flow*temperature difference*specific heat capacity of the medium.

Preferably, the process of controlling the medium flow of the water cooling device/or controlling the circulating air volume of the air cooling device according to the actual heat dissipation and the total energy consumption specifically includes:

Calculate Q2=A*W+B;

Controlling the medium flow/or controlling the circulating air volume of the air-cooling device according to the actual heat dissipation amounts Q1 and Q2 according to the PID control method, so that the absolute value of the difference between Q1 and Q2 is less than a preset value;

Wherein, W is the total energy consumption, A is the heat dissipation coefficient, and B is a constant.

Preferably, when the air temperature in the cabinet is greater than the target temperature, A is greater than 1; when the air temperature in the cabinet is less than or equal to the target temperature, A is less than 1.

Preferably, the heat dissipation system further includes a plurality of third temperature detection units, each of the third temperature detection units is distributed in different positions in the cabinet, and the control method further includes:

Detecting the air temperature of each of the third temperature detecting units;

If any of the air temperature exceeds the preset temperature range, adjust the heat dissipation coefficient A.

Preferably, the first air duct, the second air duct and the third air duct are respectively provided with a first airflow generating device group, a second airflow generating device group and a third airflow generating device group; The actual heat dissipation and the total energy consumption of the device are controlled to control the air volume of the air cooling device, specifically:

The rotation speeds of the first airflow generating device group, the second airflow generating device group, and the third airflow generating device group are respectively controlled according to the actual heat dissipation amount and the total energy consumption of the devices.

Preferably, the device accommodating cavity has a plurality of subspaces, and a fourth air channel is formed between two adjacent subspaces and between the subspace and the cavity wall of the device accommodating cavity, and the first air channel is , The fourth air duct, the second air duct, and the third air duct are sequentially connected from end to end to form a circulating air duct; each fourth air duct is provided with a fourth temperature detection unit; An airflow generating device group and the second airflow generating device group each include a plurality of airflow generating devices;

The rotation speed of each airflow generating device in the first airflow generating device group and the second airflow generating device group is controlled according to the detection result of the corresponding fourth temperature detection unit.

The fourth aspect of the present application provides a heat dissipation system for dissipating heat from a closed cabinet. The cabinet includes a cabinet body and a device accommodating cavity provided in the cabinet; the heat dissipation system includes an air cooling device, Water cooling device and thermal management module; among them,

The water cooling device includes a heat exchanger for introducing chilled water into the cabinet;

The air-cooling device includes an air flow generating device for circulating air in the cabinet through the heat exchanger element and the device accommodating cavity for heat exchange respectively;

The air-cooling device and the water-cooling device are both signal-connected to the thermal management module, and the thermal management module is used to obtain the total energy consumption of the devices in the cabinet and the actual heat dissipation of the water-cooling device, and according to The total energy consumption and the actual heat dissipation volume dynamically control the medium flow rate and/or the circulating air volume of the water cooling device.

Preferably, the water cooling device further includes a heat dissipation detection module for detecting actual heat dissipation. The heat dissipation detection module includes a flow meter, a first temperature detection unit, and a second temperature detection unit. On the circulation pipeline, the first temperature detection unit and the second temperature detection unit are respectively arranged on the inlet side and the outlet side of the heat exchanger; the first temperature detection unit and the second temperature detection unit Both the flow meter and the flow meter are signally connected with the thermal management module.

Preferably, the flow meter is an ultrasonic flow meter.

Preferably, the water cooling device further includes a flow adjustment module for adjusting the flow of the medium, the flow adjustment module includes a speed-regulating pump; or, the flow adjustment module includes a regulating valve.

Preferably, the air-cooling device includes a first air channel, a fourth air channel, a second air channel, and a third air channel that are sequentially connected end to end, and the first air channel and the second air channel are arranged at the The two opposite sides of the device accommodating cavity.

The heat dissipation system provided by this application is provided with an air cooling device and a water cooling device, and a heat dissipation detection module and a flow adjustment module are provided in the water cooling device. The air cooling device and the water cooling device exchange heat, and then the heat dissipation of the water cooling device is The total energy consumption of the electronic equipment controls the flow adjustment module to adjust the medium flow of the water cooling device, so that the heat dissipation of the water cooling device is as equal to the total energy consumption of the device as possible, thereby improving the energy efficiency of the electronic equipment.

Description of the drawings

Through the following description of the embodiments of the present application with reference to the accompanying drawings, the above-mentioned and other objectives, features and advantages of the present application will be clearer. In the accompanying drawings:

Figure 1 shows a schematic front view of a preferred embodiment of the heat dissipation system provided by the present application;

Fig. 2 shows a schematic side view of a preferred embodiment of the heat dissipation system provided by the present application;

FIG. 3 shows a system diagram of a preferred embodiment of the heat dissipation system provided by the present application;

Figure 4 shows a system diagram of another preferred embodiment of the heat dissipation system provided by the present application;

Fig. 5 shows a flowchart of a preferred embodiment of a method for controlling a heat dissipation system provided by the present application.

In the figure,

1. Cabinet; 11. Cabinet; 111, bottom plate; 112, top plate; 113, side plate; 12, device housing cavity; 121, subspace; 122, grid structure;

2. Electric energy meter;

3. Air-cooled device; 31. The first air duct; 32. The second air duct; 33. The third air duct; 34. Air flow generating device; 35. The fourth air duct;

4. Water cooling device; 41, heat exchanger; 42, circulation pipe; 43, heat dissipation detection module; 431, flow meter; 432, first temperature detection unit; 433, second temperature detection unit; 44, flow adjustment module; 441. Speed regulating pump; 442. Regulating valve; 45. On-off valve;

5. Thermal management module; 51, display screen; 52, controller;

6. Electronic devices;

7. Power supply circuit;

8. The third temperature detection unit.

detailed description

The following describes the present application based on embodiments, but the present application is not limited to these embodiments. In the following detailed description of the application, some specific details are described in detail. In order to avoid obscuring the essence of the application, the well-known methods, processes, procedures, and components are not described in detail.

In addition, those of ordinary skill in the art should understand that the drawings provided herein are for illustrative purposes, and the drawings are not necessarily drawn to scale.

Unless the context clearly requires, the words "including", "including" and other similar words in the entire specification and claims should be interpreted as inclusive rather than exclusive or exhaustive meanings; in other words, "including but not limited to" Meaning.

In the description of this application, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance. In addition, in the description of the present application, unless otherwise specified, "plurality" means two or more.

It is understandable that the orientation words such as “front” and “rear” mentioned in this application refer to the orientation of the display screen when it faces the display screen in a normal working state.

This application provides electronic equipment, such as computer cabinet equipment, data center equipment, etc. The electronic equipment includes a cabinet 1 and a heat dissipation system. The heat dissipation system is used to dissipate heat from the cabinet 1. The cabinet 1 includes a cabinet body 11 and is arranged on the cabinet body 11. The device accommodating cavity 12 within. The electronic device may also include an electronic device 6 such as a server. The electronic device 6 is disposed in the device accommodating cavity 12.

The heat dissipation system includes an air-cooling device 3, a water-cooling device 4, and a thermal management module 5. The water-cooling device includes a heat exchanger 41 for introducing chilled water into the cabinet 1; the air-cooling device 3 includes an airflow generating device 34 for making the cabinet The air in 1 circulates through the heat exchanger 41 and the device accommodating cavity 12 for heat exchange respectively. When the airflow of the air-cooling device 3 flows through the device accommodating cavity 12, it can communicate with the device accommodating cavity 12 (specifically, it can It exchanges heat with the electronic device 6) in the accommodating cavity 12, and exchanges heat with the heat exchanger 41 when passing through the heat exchanger 41. The air cooling device 3 and the water cooling device 4 are all signal-connected to the thermal management module 5. The thermal management module 5 is used to obtain the total energy consumption W of the devices in the cabinet 1 and the actual heat dissipation Q1 of the water cooling device 4, and according to the total energy consumption W of the devices And the actual heat dissipation Q1 dynamically controls the medium flow rate and/or circulating air volume of the water cooling device 4.

Specifically, as shown in FIGS. 1-4, the air cooling device 3 is disposed between the cavity wall of the device accommodating cavity 12 and the shell of the cabinet 11, and includes a first air duct 31, a third air duct 33, and The second air ducts 32 and the device containing cavity 12 together form a circulating air duct. The water cooling device 4 is at least partially disposed in one of the first air passage 31, the second air passage 32 and the third air passage 33 to realize the heat exchange between the water cooling device 4 and the air cooling device 3. The water cooling device 4 includes a heat exchanger 41, a circulation pipe 42, a heat dissipation detection module 43, and a flow adjustment module 44. The heat exchanger 41 is arranged in the third air duct 33; the heat dissipation detection module 43, the flow adjustment module 44 and the heat exchange The devices 41 are all arranged on the circulation pipe 42; the heat dissipation detection module 43 is used to detect the actual heat dissipation of the water cooling device 4; the flow adjustment module 44 is arranged on the circulation pipe 42. It is understandable that the total energy consumption W of the above-mentioned devices can be obtained through the electric energy meter 2 and other devices. At this time, the thermal management module 5 is signally connected to the electric energy meter 2, the heat dissipation detection module 43, and the flow adjustment module 44, so as to determine the total energy consumption of the device. The information of the consumption and heat dissipation detection module 43 controls the operation of the flow adjustment module 44 and the air cooling device 3.

The control method of the above heat dissipation system is shown in Figure 5, including:

S100: Obtain the actual heat dissipation Q1 of the water-cooling device and the total energy consumption W of the devices in the cabinet 1. The heat dissipation of the water-cooling device mainly comes from the heat exchanger 41. Therefore, the actual heat dissipation Q1 mentioned above can be simplified as the heat exchanger 41 Heat dissipation;

S200: Control the medium flow of the water cooling device and/or control the air flow of the air-cooling device 3 according to the actual heat dissipation Q1 and the total energy consumption W of the device, that is, only the medium flow can be controlled according to the actual heat dissipation Q1 and the total energy consumption W of the device It is also possible to control only the circulating air volume of the air-cooling device 3, or control the medium flow rate and the circulating air volume at the same time, wherein the circulating air volume can be achieved by controlling the rotation speed of the gas generating device 34.

When the electronic equipment is actually working, the external power supply directly supplies power to the electronic equipment through the power supply circuit 7. The electric energy meter 2 is connected in series with the power supply circuit 7, and can detect the total input power of the electronic equipment, and then obtain the total energy consumption W of the device; at the same time, the air cooling device 3 Perform heat exchange with the water-cooling device 4 to bring the heat emitted by the electronic device 6 to the water-cooling device 4. The heat dissipation detection module 43 detects the actual heat dissipation Q1 of the water-cooling device 4; in order to avoid energy waste, adjust according to the above control method The medium flow rate of the water cooling device 4 is such that the actual heat dissipation Q1 is as equal as possible to the total energy consumption W of the device, so that the heat/power of the electronic equipment can be dynamically matched and balanced, and the temperature fluctuation in the cabinet 1 is minimized as much as possible, and the electronic The thermal fatigue of the equipment improves the life of electronic devices and the reliability of the entire electronic equipment; at the same time, this method reduces manual intervention and reduces the difficulty of using electronic equipment.

In an embodiment, the heat dissipation system adjusts the rotation speed of the airflow generating device of the heat dissipation system according to the temperature change in the cabinet 1 to accelerate air flow and heat dissipation; or adjust the medium flow of the water cooling device through the temperature change in the cabinet 1. However, in these several embodiments, whether it is through the temperature adjustment of the cabinet 1 to adjust the speed of the airflow generating device or the medium flow of the water cooling device, only after the actual temperature in the cabinet 1 is greater than or less than the preset temperature, it is controlled by the control system. The airflow generates the device speed or medium flow. Obviously, this method of adjusting heat dissipation according to temperature changes is a passive adjustment method, which has hysteresis, resulting in insufficient heat dissipation adjustment and following problems, and will also cause partial waste of the total energy consumption of the device.

In an embodiment of this application, considering that the total energy consumption W of the electronic equipment is mainly converted into heat dissipation, as long as the actual heat dissipation Q1 and the total energy consumption W of the devices are as equal as possible, the temperature in the cabinet 1 can be basically stable It is thought of using the above heat dissipation system and control method to directly adjust the medium flow of the water cooling device 4 and the circulating air volume of the air cooling device 3 according to the actual heat dissipation Q1 and the total energy consumption W of the device, so that the actual heat dissipation Q1 and the device The total energy consumption W is as balanced as possible. In this way, the air temperature in the cabinet 1 will naturally not change. Obviously, this adjustment method is an active adjustment method, and it is a closed-loop control, and there is no hysteresis, which can avoid the aforementioned heat dissipation. Adjust the problem of insufficient follow; at the same time, it can improve the power density of electronic equipment and the construction cost of data centers.

The cabinet 11 may be a rectangular parallelepiped structure, including an outer shell. In order to prevent external heat from affecting the temperature in the cabinet 1, the outer shell includes an insulating structure. Specifically, the insulating structure may be an insulating foam or an insulating glue layer, specifically The shell includes a bottom plate 111 and a top plate 112 oppositely arranged, and a side plate 113 connecting the top plate 112 and the bottom plate 111. The bottom plate 111, the side plate 113 and the top plate 112 form a closed cavity, the water cooling device 4, the air cooling device 3, and the electric power Table 2 and the thermal management module 5 are both arranged in the cavity, and the device accommodating cavity 12 is arranged in the cavity. At this time, the top plate 112 and the side plate 113 can be equipped with heat insulation structures. Further, in the first When the air duct 31 and the second air duct 32 are arranged along the height direction of the cabinet 1 (which will be described in detail below), heat insulation is provided between the bottom plate 111 and the first air duct 31, and between the bottom plate 111 and the second air duct 32. structure. Considering that the circulation pipe 42 of the water cooling device 4 and the power supply circuit 7 of the electronic equipment need to be led out of the cabinet 11, a space can be set between the bottom plate 111 and the ground, that is, the bottom plate 111 is spaced apart.

There are often multiple electronic devices 6 in the cabinet 1. In order to facilitate the access, management and maintenance of each electronic device 6, along the height direction of the cabinet 1, the device accommodating cavity 12 has multiple sub-spaces 121 so as to The electronic devices 6 are placed in the spaces 121 respectively. Among them, the height direction is based on the use state of the cabinet 1 as a reference.

In the water cooling device 4, only the heat exchanger element 41 may be arranged in the third air duct 33, and the circulation pipe 42 and the like may be arranged in the first air duct 31 or the second air duct 32; or all of them may be arranged in the third air duct 33.

The medium in the water cooling device 4 may be primary chilled water or secondary chilled water, or other cold media. When the medium is primary chilled water, the inlet end and the outlet end of the circulation pipe 42 are respectively connected with the primary chilled water pipeline, so that the entire water cooling device 4 and the chilled water pipeline form a communication pipeline; when the medium is secondary chilled water, the flow Both the inlet end and the outlet end of the pipe 42 communicate with the secondary chilled water pipeline. Among them, the primary chilled water refers to the chilled water in the building where the electronic equipment is located, and the secondary chilled water refers to the independent chilled water passing through the secondary heat exchanger.

Specifically, the heat dissipation detection module 43 includes a flow meter 431, a first temperature detection unit 432, and a second temperature detection unit 433. The flow meter 431 is disposed on the circulation pipe 42 for detecting the flow of the medium on the circulation pipe 42. The temperature detection unit 432 and the second temperature detection unit 433 may both be thermometers or other temperature sensor devices, etc., which are respectively arranged on the inlet side and the outlet side of the heat exchanger element 41, as shown in FIG. 3 and FIG. A first temperature detection unit 432 is provided on the inlet side of the heat exchanger, and a second temperature detection unit 433 is provided on the outlet side to detect the inlet temperature T1 on the inlet side and the outlet temperature T2 on the outlet side of the heat exchanger 41; the first temperature detection unit 432, Both the temperature detection unit 433 and the flow meter 431 are signally connected to the thermal management module 5 so as to transmit the detected medium flow rate, the inlet temperature T1 and the outlet temperature T2 to the thermal management module 5.

Correspondingly, the detection of the actual heat dissipation Q1 of the water cooling device 4 in the foregoing step S100 is specifically:

S110: Detect the temperature difference between the inlet side and the outlet side of the heat exchanger element 41. Specifically, the inlet temperature T1 on the inlet side and the outlet temperature T2 on the outlet side can be detected respectively, and the current medium flow rate of the heat exchanger element 41 can be obtained;

S120: Actual heat dissipation Q1=current medium flow*temperature difference|T1-T2|*specific heat capacity of the medium.

With this structure, various components are easy to obtain, and the cost is relatively low, which can make the structure of the water cooling device 4 simpler, and can accurately obtain the actual heat dissipation Q1 of the water cooling device 4. Of course, the heat dissipation detection module 43 may also be a heat detector or the like.

Specifically, the flow meter 431 may be arranged on the outlet side; the flow adjustment module 44 may be arranged on the inlet side to facilitate the structural arrangement of the entire water cooling device 4.

The flow meter 431 may be an ordinary flow meter or an ultrasonic flow meter, preferably an ultrasonic flow meter, so as to reduce the influence of the flow meter 431 on the flow rate of the medium.

In one embodiment, the flow adjustment module 44 includes a speed-regulating pump 441, and the speed-regulating pump 441 is signally connected to the thermal management module 5, as shown in FIG. 4, especially when the medium of the water-cooling device 4 is secondary chilled water, through the adjustment The speed pump 441 adjusts the flow of the medium. The flow adjustment module 44 requires only one component to adjust the flow. The structure is simple, and the arrangement of the components of the water cooling device 4 is easy. In another embodiment, the flow regulating module 44 includes a regulating valve 442. The regulating valve 442 is used to regulate the flow of the medium in the water cooling device 4, and is connected to the thermal management module 5 in signal, especially when the medium of the water cooling device 4 is primary chilled water. , To adjust the medium flow through the opening of the regulating valve 442. Of course, the flow regulating module 44 may also include a speed regulating pump 441 and a regulating valve 442 at the same time, so as to jointly regulate the medium flow through the regulating valve 442 and the regulating pump 441.

In order to better control the water cooling device 4, the inlet end and the outlet end of the circulation pipe 42 are respectively provided with on-off valves 45, such as solenoid valves, that is, the water-cooling device 4 also includes an on-off valve 45 to open or disconnect the water-cooling device 4 and The channel of the external medium source.

The above-mentioned heat exchanger element 41 includes a coil structure, as shown in Figures 3 and 4. This structure can increase the heat dissipation area of the heat exchanger element 41 in a smaller space, and increase the heat of the air-cooling device 3 and the heat exchanger element 41. Exchange efficiency.

Referring to FIG. 2, in order to further increase the heat exchange efficiency between the air-cooling device 3 and the heat exchanger element 41, a plurality of coil structures are provided along the gas flow direction of the third air channel 33.

In another embodiment, the heat exchanger element 41 further includes heat dissipation fins, and the heat dissipation fins are connected to the coil structure. Of course, the heat exchanger element 41 may also include only the heat dissipation fins or the coil structure.

In each of the foregoing embodiments, the airflow generating device 34 may be a fan, and the thermal management module 5 is signally connected to the airflow generating device 34 so as to be controlled by the thermal management module 5 in the first air duct 31, the second air duct 32, and the third air duct. A gas flow is formed in the channel 33.

Specifically, at least one of the first air channel 31, the second air channel 32, and the third air channel 33 is provided with an air flow generating device 34, such as only the first air channel 31, the second air channel 32, or the third air channel. The channel 33 is provided with an airflow generating device 34, or two of the three are provided with an airflow generating device 34; preferably, the first air channel 31, the second air channel 32, and the third air channel 33 are all provided with airflow generating devices. The device 34 can use the airflow generating device 34 in the third air duct 33 as the main airflow generating device, and the airflow generating device 34 in the first air duct 31 and the second air duct 32 as the auxiliary airflow generating device to better increase The fluidity of the gas improves the heat exchange efficiency between the air cooling device 3 and the water cooling device 4.

When the first air duct 31 and the second air duct 32 are provided with airflow generating devices 34, one or a row of airflow generating devices 34 may be respectively provided; or a plurality of airflow generating devices 34 may be respectively provided for the first air channel 31 and the second air duct 32 are respectively provided with airflow generating devices 34 forming an array, and a plurality of airflow generating devices 34 arranged in the first air channel 31 can be defined as a first airflow generating device group; arranged in the second air channel 32 The multiple airflow generating devices 34 in the second airflow generating device group; referring to FIG. 1 and FIG. 2, this can further accelerate the gas flow.

When the air flow generating device 34 is provided in the third air duct 33, in order to better exchange heat between the air cooling device 3 and the heat exchanger element 41, the air flow generating device 34 is provided on the opposite sides of the heat exchanger element 41 along the gas flow direction. The third air duct 33 may be provided with a plurality of airflow generating devices 34 to form a third airflow generating device group. Further, a plurality of airflow generating devices 34 may be respectively provided on opposite sides of the heat exchanger element 41, and they may be arranged in an array respectively, that is, the airflow generating devices 34 of the third airflow generating device group are arranged in an array, as shown in FIG. 3 4. As shown in FIG. 4, four airflow generating devices 34 are arranged on either side of the heat exchanger element 41 along the gas flow direction and arranged in an array. In an embodiment, the air output volume of the airflow generating device 34 in the third air duct 33 may be set to be greater than the air output volume of the airflow generating device 34 in the first air channel 31 and the second air channel 32 to further increase the air cooling device 3 The efficiency of heat exchange with the heat exchanger element 41. Wherein, in the third air duct 33, the airflow generating device 34 may be arranged only on one side of the heat exchanger element 41 along the gas flow direction, or the airflow generating device 34 may be arranged on the side of the heat exchanger element 41 relative to the gas flow direction.

In an embodiment, the first air duct 31 and the second air duct 32 are arranged on opposite sides of the device accommodating cavity 12. As shown in FIG. 2, two opposite side plates 113 and the device accommodating cavity 12 are formed respectively The first air channel 31 and the second air channel 32, that is, the first air channel 31 and the second air channel 32 are formed between the side plate 113 and the device accommodating cavity 12. At this time, the bottom plate 111 and the device accommodating cavity 12 form a second air channel. Three wind road 33. On the side where the bottom plate 111 of the cabinet 1 is located, the first air duct 31 communicates with the second air duct 32 through the third air duct 33. On the side where the top plate 112 of the cabinet 1 is located, the first air duct 31 can communicate with each other through the device accommodating cavity 12 The second air duct 32 is connected. Specifically, the air-cooling device 3 further includes a fourth air duct 35, which is arranged in the device accommodating cavity 12, so that the first air duct 31, the fourth air duct 35, and the The second air duct 32 and the third air duct 33 are sequentially connected end to end to form a circulating air duct, which is beneficial to the heat dissipation of the electronic device 6. In this embodiment, the gas flow directions of the first air duct 31 and the second air duct 32 are substantially parallel to the height direction of the cabinet 1.

When the device accommodating cavity 12 has a plurality of sub-spaces 121, the fourth air duct 35, that is, the fourth air duct 35, is formed between two adjacent sub-spaces 121 and between the sub-space 121 and the cavity wall of the device accommodating cavity 12 There are multiple, as shown in Fig. 2, after the electronic device 6 is placed in the cabinet 1, a fourth air duct 35 is formed between two adjacent layers of electronic devices 6. In this way, the contact between the gas and the electronic device 6 can be increased Area, so that the total energy consumption W of the device can be converted into the actual heat dissipation Q1 of the water cooling device as much as possible, thereby maintaining the stability of the air temperature in the cabinet 1.

Further, each fourth air channel 35 is provided with air flow generating devices 34 on both sides along the gas flow direction to ensure the controllability of the gas flow. The first air channel 31 and the second air channel 32 are respectively provided with air flow generating devices. When arraying, the behavior of the array can be set perpendicular to the direction of the gas flow of the fourth air channel 35 and perpendicular to the gas flow direction of the first air channel 31; the column of the array in the airflow generating device array is the gas flow direction of the air channel where it is located .

Correspondingly, the two side walls of the device accommodating cavity 12 adjacent to the first air duct 31 and the second air duct 32 have a grid structure 122. As shown in FIG. 1, the first air duct 31 and the second air duct 32 respectively communicate with the fourth air duct 35 through the grid structure 122 adjacent to it, so as to facilitate the guidance of the gas flow and increase the strength of the cabinet 1. Of course, the first air duct 31 and the second air duct 32 may directly communicate with the fourth air duct 35.

It should be noted that the fourth air duct 35 can also be directly arranged outside the device accommodating cavity 12. A fourth air duct is formed between the top plate 112 and the device accommodating cavity 12, that is, the entire air-cooling device surrounds the device accommodating cavity 12. The outer circumference of the cavity 12 is provided.

Wherein, the first airflow generating device group, the second airflow generating device group, and the third airflow generating device group can be controlled separately, that is, in the foregoing step S200, the control of the air cooling device is controlled according to the actual heat dissipation Q1 and the total energy consumption W of the devices. The circulating air volume, specifically:

According to the actual heat dissipation Q1 and the total energy consumption of the devices W, the rotation speeds of the first airflow generating device group, the second airflow generating device group and the third airflow generating device group are respectively controlled to further improve the dynamic heat/power balance of the electronic device.

The arrangement of the air flow generating devices 34 in the various manners described above is not only conducive to the fluidity of the air in the entire air cooling device 3, but also makes the temperature in the entire cabinet 1 more uniform.

Further, when a plurality of fourth air ducts 35 are provided, each fourth air duct 35 is provided with a fourth temperature detection unit (not shown in the figure), such as a thermometer or a temperature sensor, and the fourth temperature detection unit is connected to The thermal management module 5 is signal connected, and the fourth temperature detection unit in each fourth air channel 35 corresponds to the air flow generating device 34 on both sides of the fourth air channel 35. At this time, the air flow generating device corresponding to each fourth air channel 35 34 can be individually controlled. In this embodiment, the rotation speed of each airflow generating device 34 in the first airflow generating device group and the second airflow generating device group can be controlled according to the detection result of the corresponding fourth temperature detection unit to control Each air flow generating device 34 performs precise control, so as to better control the circulating air volume of the air cooling device 3.

In addition, considering that in practical applications, affected by various external factors, such as ambient temperature, the actual heat dissipation Q1 is difficult to approach the total energy consumption W of the device, which is not conducive to the implementation of the entire control system. In order to solve this problem, this application The above step S200 is specifically:

Calculate Q2=A*W+B;

Control the medium flow according to the PID control method according to the size of Q1 and Q2, so that the absolute value of the difference between Q1 and Q2 is less than the preset value;

Wherein, W is the total energy consumption of the device, A is the heat dissipation coefficient, which is greater than zero, and B is a constant, which can be determined based on experience. When the air temperature in the cabinet 1 is greater than the target temperature, A is greater than 1. When the air temperature in the cabinet 1 is less than or equal to the target temperature, A is less than 1. The above-mentioned target temperature can be the best working environment temperature of the electronic device, or it can be the most reliable and energy-saving temperature. Specifically, the target temperature can be set by the operator, or the thermal management module 5 can be set automatically according to preset rules. set.

In an embodiment, the heat dissipation system further includes a third temperature detection unit 8 arranged in the cabinet, such as a thermometer or a temperature sensor device. Preferably, the third temperature detection unit 8 is signal-connected to the thermal management module 5 to grasp the cabinet in real time. The air temperature within 1. Further, the third temperature detection unit 8 may be provided with multiple, and each third temperature detection unit is provided in a different position in the cabinet 1, such as in the device housing cavity 12, the first air duct 31, the second air duct 32, and the heat Exchange device 41, etc., to monitor the air temperature everywhere in the cabinet 1. Considering that the air temperature at the heat exchanger 41 may be relatively low, the temperature in the device accommodating cavity 12 is relatively high. Therefore, preferably, at least A third temperature detection unit 8 is provided at the heat exchanger 41 and in the device accommodating cavity 12. The third temperature detection unit 8 and the fourth temperature detection unit in the device accommodating cavity 12 can share the same thermometer or temperature sensor device. , In order to be able to obtain the highest air temperature and the lowest air temperature in the cabinet 1.

Based on this embodiment, in order to more accurately control the medium flow rate and/or rotation speed, the aforementioned heat dissipation coefficient A can be adjusted in real time according to the air temperature, that is, the aforementioned control method further includes:

S300: Detect the air temperature of each third temperature detection unit 8;

S400: If any air temperature exceeds the preset temperature range, adjust the heat dissipation coefficient A. The specific adjustment method can be adjusted according to the value of A above. Wherein, the aforementioned target temperature is within a preset temperature range.

When the electronic device is actually used, the values of A and B can be set in advance, and then during the entire control process, real-time adjustments are made according to the temperature value of the third temperature detection unit 8, such as the third temperature detection unit 8 and thermal management The module 5 is connected with signals, and the thermal management module 5 can adjust the value of A in real time according to the temperature of the third temperature detection unit 8. Of course, it can also be adjusted by the operator according to the temperature of the third temperature detection unit 8.

The thermal management module 5 may include a display screen 51 and a controller 52 connected to each other. The display screen 51 is used to display various information of electronic equipment, such as the air temperature in the cabinet 1, the total energy consumption W of the components, the actual heat dissipation Q1, and the medium. Flow rate, etc.; electric energy meter 2, air flow generating device 34, first temperature detection unit 432, second temperature detection unit 433, flow meter 431, flow adjustment module 44 connected to controller 52, and third temperature detection unit 8, fourth The temperature detection unit may also be connected to the display screen 51 and/or the controller 52.

Electronic equipment can often be provided with multiple heat dissipation systems, that is, the electronic equipment includes multiple cabinets 1, and each cabinet 1 is equipped with the above-mentioned water cooling device 4, air cooling device 3, electric energy meter 2, and thermal management module 5, each thermal management module 5 Can be connected to each other, such as through the upper computer connection for unified control. Using this decentralized method of controlling heat makes the use of electronic equipment easier.

It should be noted that, in the foregoing embodiments, the device accommodating cavity 12 may only be provided with energy-consuming electronic devices 6. At this time, the total energy consumption W of the devices is equal to the total input electric energy measured by the electric energy meter 2; some electronic devices also It may include an energy storage device (not shown in the figure), such as a battery. The energy storage device is also arranged in the device accommodating cavity 12. In this embodiment, the total input electrical energy of the input electronic device is used for the operation of the electronic device 6. The energy storage device can also be charged. Therefore, the total energy consumption W of the device is equal to the difference between the total input electric energy measured by the electric energy meter 2 and the energy stored by the energy storage device.

In addition, in an embodiment where the device containing cavity 12 is provided with an energy storage device, the energy storage device can be used as a power source to provide electrical energy for the electronic device 6 and the thermal management module 5, the air cooling device 3, and the water cooling device 4. Specifically, The energy storage device can be used as a power source alone to provide electrical energy for the electronic device 6, the thermal management module 5, the air cooling device 3, and the water cooling device 4. It can also be used together with the power supply circuit 7 for the electronic device 6, the thermal management module 5, and the air cooling device 3. , The water cooling device 4 provides electrical energy. When the energy storage device is powered by itself, the total output electrical energy of the energy storage device can be detected by an electric energy meter. The total output electrical energy is the total energy consumption W of the device; when the energy storage device and the power supply circuit 7 are shared When power is supplied, the total energy consumption W of the device is equal to the sum of the total output electric energy of the energy storage device and the total input electric energy of the power supply circuit 7.

In short, by adding energy storage devices, the normal operation of electronic equipment can still be ensured under special circumstances, such as sudden power failure from the outside world.

It is easily understood by those skilled in the art that the above-mentioned preferred solutions can be freely combined and superimposed on the premise of no conflict.

It should be understood that the above-mentioned implementation manners are only exemplary and not restrictive. Without departing from the basic principles of the present application, those skilled in the art can make various obvious or equivalent details regarding the above-mentioned details. Modifications or replacements will be included in the scope of the claims of this application.

Claims

A heat dissipation system for dissipating heat to a cabinet, the cabinet including a cabinet body and a device accommodating cavity arranged in the cabinet body; characterized in that the heat dissipation system includes an air cooling device, a water cooling device and a heat management module ；

The air-cooling device is arranged between the cavity wall of the device accommodating cavity and the outer shell of the cabinet, and includes a first air duct, a third air duct, and a second air duct that are connected to each other in sequence. The accommodating cavities jointly form a circulating air duct;

The water-cooling device includes a heat exchanger, a circulation pipe, a heat dissipation detection module, and a flow adjustment module. The heat exchanger is arranged in the third air duct; the heat dissipation detection module, the flow adjustment module, and the The heat exchanger components are all arranged on the circulation pipe; the heat dissipation detection module is used to detect the actual heat dissipation of the water cooling device;

The thermal management module is signally connected to the heat dissipation detection module and the flow adjustment module to control the operation and operation of the flow adjustment module according to the total energy consumption of the devices in the cabinet and the information of the heat dissipation detection module / Or control the operation of the air cooling device.
The heat dissipation system according to claim 1, wherein the heat dissipation detection module comprises a flow meter, a first temperature detection unit, and a second temperature detection unit, the flow meter is arranged on the circulation pipe, and the The first temperature detection unit and the second temperature detection unit are respectively arranged on the inlet side and the outlet side of the heat exchanger; the first temperature detection unit, the second temperature detection unit and the flow meter are all connected to The thermal management module is signal connected.
The heat dissipation system according to claim 2, wherein the flow meter is arranged on the outlet side; the flow adjustment module is arranged on the inlet side.
The heat dissipation system according to claim 2, wherein the flowmeter is an ultrasonic flowmeter.
The heat dissipation system according to claim 1, wherein the flow adjustment module includes a speed regulating pump; or, the flow adjustment module includes a regulating valve.
The heat dissipation system according to claim 1, wherein the inlet end and the outlet end of the circulation pipe are respectively provided with on-off valves.
The heat dissipation system according to claim 1, wherein the inlet end and the outlet end of the circulation pipe are in communication with a secondary chilled water pipeline or a primary chilled water pipeline.
The heat dissipation system according to claim 1, wherein the heat exchanger comprises a coil structure.
The heat dissipation system according to claim 8, wherein a plurality of the coil structures are provided along the gas flow direction of the third air duct.
The heat dissipation system according to any one of claims 1-9, wherein at least one of the first air duct, the second air duct, and the third air duct is provided with an airflow generating device; The thermal management module is also signally connected to the air flow generating device.
The heat dissipation system according to claim 10, wherein the first air duct and the second air duct are respectively provided with a plurality of the airflow generating devices forming an array.
The heat dissipation system according to claim 11, wherein the airflow generating device arranged in the first air duct is a first airflow generating device group; the airflow generating device arranged in the second air duct is a second airflow generating device group; The airflow generating device is provided in the third air duct, which is defined as a third airflow generating device group; the first airflow generating device group, the second airflow generating device group, and the third airflow generating device group pass through the The thermal management module is individually controlled.
The heat dissipation system according to claim 10, wherein, in the third air duct, the air flow generating device is provided on opposite sides of the heat exchanger element along the air flow direction.
The heat dissipation system according to any one of claims 11-13, wherein the air cooling device further comprises a fourth air duct, and the first air duct and the second air duct are arranged in the device container. The opposite sides of the cavity; the first air channel, the fourth air channel, the second air channel and the third air channel are connected in sequence from end to end to form a circulating air channel.
The heat dissipation system according to claim 14, characterized in that, along the height direction of the cabinet, the device accommodating cavity has a plurality of sub-spaces, between two adjacent sub-spaces and between the sub-spaces and the device accommodating The fourth air channel is formed between the cavity walls of the cavity.
The heat dissipation system according to claim 15, wherein each of the fourth air channels is provided with air flow generating devices on both sides along the gas flow direction.
The heat dissipation system according to claim 15, wherein each of the fourth air ducts is provided with a fourth temperature detection unit, the fourth temperature detection unit is signally connected to the thermal management module, and each of the The air flow generating devices corresponding to the four air ducts are individually controlled.
The heat dissipation system according to claim 14, wherein the two side walls adjacent to the first air duct and the second air duct on the device accommodating cavity are in a grid structure, and the first An air duct and the second air duct are respectively connected to the fourth air duct through a grid structure adjacent thereto.
The heat dissipation system according to any one of claims 1-14, further comprising a plurality of third temperature detection units arranged in the cabinet, for detecting the air temperature in the cabinet, the third temperature The detection unit is in signal connection with the thermal management module.
The heat dissipation system according to any one of claims 1-14, wherein the housing of the cabinet includes a heat insulation structure to isolate heat transfer between the outside and the inside of the cabinet.
An electronic device having a cabinet, characterized in that it further comprises the heat dissipation system according to any one of claims 1-20, the heat dissipation system being arranged in the cabinet.
The electronic device according to claim 21, wherein the electronic device is a computer cabinet device or a data center device.
A control method of a heat dissipation system according to any one of claims 1-22, characterized by comprising the steps:

Obtaining the actual heat dissipation of the water cooling device and the total energy consumption of the components in the cabinet;

Control the medium flow rate of the water cooling device and/or control the circulating air volume of the air cooling device according to the actual heat dissipation and the total energy consumption of the device.
The control method according to claim 23, wherein the process of obtaining the actual heat dissipation of the water cooling device specifically includes:

Detecting the temperature difference between the inlet side and the outlet side of the heat exchanger element, and acquiring the current medium flow rate of the heat exchanger element;

The actual heat dissipation Q1=current medium flow*temperature difference*specific heat capacity of the medium.
The control method according to claim 23, wherein the process of controlling the medium flow of the water cooling device/or controlling the circulating air volume of the air cooling device according to the actual heat dissipation and the total energy consumption specifically comprises:

Calculate Q2=A*W+B;

Controlling the medium flow/or controlling the circulating air volume of the air-cooling device according to the actual heat dissipation amounts Q1 and Q2 according to the PID control method, so that the absolute value of the difference between Q1 and Q2 is less than a preset value;

Wherein, W is the total energy consumption, A is the heat dissipation coefficient, and B is a constant.
The control method according to claim 25, wherein when the air temperature in the cabinet is greater than the target temperature, A is greater than 1; when the air temperature in the cabinet is less than or equal to the target temperature, A is less than 1.
The control method according to claim 26, wherein the heat dissipation system further comprises a plurality of third temperature detection units, each of the third temperature detection units is distributed in different positions in the cabinet, and the control method further comprises :

Detecting the air temperature of each of the third temperature detecting units;

If any of the air temperature exceeds the preset temperature range, adjust the heat dissipation coefficient A.
The control method according to claim 24, wherein the first air duct, the second air duct and the third air duct are respectively provided with a first airflow generating device group and a second airflow generating device group And a third airflow generating device group; the control and control of the air volume of the air cooling device according to the actual heat dissipation amount and the total energy consumption of the device is specifically:

The rotation speeds of the first airflow generating device group, the second airflow generating device group, and the third airflow generating device group are respectively controlled according to the actual heat dissipation amount and the total energy consumption of the devices.
The control method according to claim 28, wherein the device accommodating cavity has a plurality of sub-spaces, formed between two adjacent sub-spaces and between the sub-spaces and the cavity wall of the device accommodating cavity. A fourth air channel, the first air channel, the fourth air channel, the second air channel and the third air channel are connected in sequence from end to end to form a circulating air channel; each of the fourth air channels is A fourth temperature detection unit is provided; the first airflow generating device group and the second airflow generating device group each include a plurality of airflow generating devices;

The rotation speed of each airflow generating device in the first airflow generating device group and the second airflow generating device group is controlled according to the detection result of the corresponding fourth temperature detection unit.
A heat dissipation system for dissipating heat in a closed cabinet, the cabinet including a cabinet body and a device accommodating cavity arranged in the cabinet; it is characterized in that the heat dissipation system includes an air cooling device, a water cooling device and a heat Management module; among them,

The water cooling device includes a heat exchanger for introducing chilled water into the cabinet;

The air-cooling device includes an air flow generating device for circulating air in the cabinet through the heat exchanger element and the device accommodating cavity for heat exchange respectively;

The air-cooling device and the water-cooling device are both signal-connected to the thermal management module, and the thermal management module is used to obtain the total energy consumption of the devices in the cabinet and the actual heat dissipation of the water-cooling device, and according to the The total energy consumption and the actual heat dissipation volume dynamically control the medium flow rate of the water cooling device and/or the circulating air volume of the air cooling device.
The heat dissipation system according to claim 30, wherein the water cooling device further comprises a heat dissipation detection module for detecting actual heat dissipation, and the heat dissipation detection module includes a flow meter, a first temperature detection unit, and a second A temperature detection unit, the flow meter is arranged on the circulation pipe, the first temperature detection unit and the second temperature detection unit are respectively arranged on the inlet side and the outlet side of the heat exchanger; the first The temperature detection unit, the second temperature detection unit and the flow meter are all signally connected to the thermal management module.
The heat dissipation system according to claim 31, wherein the flow meter is an ultrasonic flow meter.
The heat dissipation system according to claim 30, wherein the water cooling device further comprises a flow adjustment module for adjusting the flow of the medium, the flow adjustment module includes a speed regulating pump; or, the flow adjustment module includes a regulating valve .
The heat dissipation system according to any one of claims 30-33, wherein the air-cooling device comprises a first air channel, a fourth air channel, a second air channel, and a third air channel that are sequentially connected end to end, The first air duct and the second air duct are arranged on opposite sides of the device accommodating cavity.
The heat dissipation system according to claim 34, wherein along the height direction of the cabinet, the device accommodating cavity has a plurality of sub-spaces, between two adjacent sub-spaces and between the sub-spaces and the device accommodating The fourth air channel is formed between the cavity walls of the cavity.
The heat dissipation system according to claim 34, wherein the two sides of each of the fourth air channels along the gas flow direction are respectively provided with air flow generating devices.