CN210120753U - Heat dissipation system and electronic equipment - Google Patents
Heat dissipation system and electronic equipment Download PDFInfo
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- CN210120753U CN210120753U CN201920262551.3U CN201920262551U CN210120753U CN 210120753 U CN210120753 U CN 210120753U CN 201920262551 U CN201920262551 U CN 201920262551U CN 210120753 U CN210120753 U CN 210120753U
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Abstract
The application discloses cooling system and electronic equipment. The heat dissipation system comprises an air cooling device, a water cooling device and a heat management module; the air cooling device is arranged between the cavity wall of the device accommodating cavity and the shell of the cabinet body and comprises a first air channel, a third air channel and a second air channel which are sequentially communicated; the water cooling device comprises a heat exchange device, a circulating pipeline, a heat dissipation amount detection module and a flow regulation module, wherein the heat exchange device is arranged in the third air channel; the heat dissipation amount detection module, the flow regulation module and the heat exchange device are all arranged on the circulation pipeline; the heat management module is in signal connection with the heat dissipation capacity detection module and the flow regulation module so as to control the flow regulation module to work and/or control the air cooling device to work according to the total energy consumption of the device and the information of the heat dissipation capacity detection module. The heat dissipation efficiency of the cabinet can be improved, so that the energy efficiency of the electronic equipment is improved, and the heat/power balance of the electronic equipment is realized as far as possible.
Description
Technical Field
The present application relates to the field of electronic technologies, and in particular, to a heat dissipation system and an electronic device.
Background
With the development of science and technology, data centers are developing exponentially and rapidly, and the energy consumption thereof has attracted attention of equipment. Energy efficiency and dynamic heat dissipation in data centers have become one of the first challenges in data centers. The existing heat dissipation mode is similar to that of a central air conditioner of a building, so that a large amount of energy consumption is wasted in invalid indoor air, and the energy efficiency is not improved; and the existing mode causes heat dissipation averaging and temperature control delay, so that serious heat/power imbalance is caused.
SUMMERY OF THE UTILITY MODEL
In view of the above, an object of the present invention is to provide a heat dissipation system and an electronic device, so as to improve heat dissipation efficiency, thereby improving energy efficiency of the electronic device and achieving heat/power balance of the electronic device as much as possible.
In order to achieve the purpose, the technical scheme is as follows:
a first aspect of the present application provides a heat dissipation system for dissipating heat from a cabinet, where the cabinet includes a cabinet body and a device accommodating cavity disposed in the cabinet body; the heat dissipation system comprises an air cooling device, a water cooling device and a heat management module;
the air cooling device is arranged between the cavity wall of the device accommodating cavity and the shell of the cabinet body, and comprises a first air duct, a third air duct and a second air duct which are sequentially communicated, and the first air duct, the third air duct and the second air duct and the device accommodating cavity form a circulating air duct together;
the water cooling device comprises a heat exchange device, a circulating pipeline, a heat dissipation amount detection module and a flow regulation module, wherein the heat exchange device is arranged in the third air channel; the heat dissipation amount detection module, the flow regulation module and the heat exchange device are all arranged on the circulation pipeline; the heat dissipation capacity detection module is used for detecting the actual heat dissipation capacity of the water cooling device;
the heat management module is in signal connection with the heat dissipation capacity detection module and the flow regulation module, so that the flow regulation module is controlled to work and/or the air cooling device is controlled to work according to the total energy consumption of devices in the cabinet and the information of the heat dissipation capacity detection module.
Preferably, the heat dissipation amount detection module includes a flow meter, a first temperature detection unit, and a second temperature detection unit, the flow meter is disposed on the flow pipe, and the first temperature detection unit and the second temperature detection unit are respectively disposed on an inlet side and an outlet side of the heat exchange device; the first temperature detection unit, the second temperature detection unit and the flowmeter are in signal connection with the thermal management module.
Preferably, the flow meter is disposed at the outlet side; the flow regulating module is arranged on the inlet side.
Preferably, the flow meter is an ultrasonic flow meter.
Preferably, the flow regulating module comprises a speed regulating pump; alternatively, the flow regulation module comprises a regulating valve.
Preferably, the inlet end and the outlet end of the flow pipe are respectively provided with an on-off valve.
Preferably, the inlet end and the outlet end of the circulation pipeline are communicated with a secondary chilled water pipeline or a primary chilled water pipeline.
Preferably, the heat exchanger comprises a coil arrangement.
Preferably, the coil structure is provided in plurality along the gas flow direction of the third air duct.
Preferably, at least one of the first air duct, the second air duct and the third air duct is provided with an air flow generating means; the thermal management module is also in signal connection with the airflow generating device.
Preferably, the first air duct and the second air duct are respectively provided with a plurality of the airflow generating devices forming an array.
Preferably, the airflow generating device arranged in the first air duct is a first airflow generating device group; the airflow generating device arranged in the second air duct is a second airflow generating device group; the third air duct is internally provided with the airflow generating device and is defined as a third airflow generating device group; the first, second and third gas flow generator sets are individually controlled by the thermal management module.
Preferably, the third air duct is provided with the airflow generating device on two opposite sides of the heat exchanging device along the air flow direction.
Preferably, the air cooling device further comprises a fourth air duct, and the first air duct and the second air duct are arranged on two opposite sides of the device accommodating cavity; the first air duct, the fourth air duct, the second air duct and the third air duct are sequentially communicated end to form a circulating air duct.
Preferably, along the height direction of the cabinet, the device accommodating chamber has a plurality of subspaces, and the fourth air ducts are formed between two adjacent subspaces and between the subspaces and the chamber wall of the device accommodating chamber.
Preferably, airflow generating devices are respectively arranged on two sides of each fourth air duct along the airflow direction.
Preferably, each of the fourth air ducts is provided with a fourth temperature detection unit, the fourth temperature detection unit is in signal connection with the thermal management module, and the airflow generation devices corresponding to the fourth air ducts are controlled separately.
Preferably, two side walls of the device accommodating cavity adjacent to the first air duct and the second air duct are of grid structures, and the first air duct and the second air duct are respectively communicated with the fourth air duct through the grid structures adjacent to the first air duct and the second air duct.
Preferably, the heat management system further comprises a plurality of third temperature detection units arranged in the cabinet and used for detecting the temperature of air in the cabinet, and the third temperature detection units are in signal connection with the heat management module.
Preferably, the enclosure of the cabinet comprises a thermal insulation structure to isolate the outside from heat transfer with the interior of the cabinet.
A second aspect of the present application provides an electronic device having a cabinet, and further comprising the heat dissipation system of any one of the above, wherein the heat dissipation system is disposed in the cabinet.
Preferably, the electronic equipment is computer cabinet equipment or data center equipment.
A third aspect of the present application provides a heat dissipation system for dissipating heat from a closed cabinet, where the cabinet includes a cabinet body and a device accommodating cavity disposed in the cabinet body; the heat dissipation system comprises an air cooling device, a water cooling device and a heat management module; wherein the content of the first and second substances,
the water cooling device comprises a heat exchange device for introducing chilled water into the cabinet;
the air cooling device comprises an airflow generating device, a heat exchange device and a device accommodating cavity, wherein the airflow generating device is used for enabling air in the cabinet to circularly flow through the heat exchange device and the device accommodating cavity so as to respectively exchange heat;
the air cooling device and the water cooling device are in signal connection with the heat management module, and the heat management module is used for obtaining total energy consumption of devices in the cabinet and actual heat dissipation capacity of the water cooling device and dynamically controlling medium flow and/or circulating air volume of the water cooling device according to the total energy consumption and the actual heat dissipation capacity.
Preferably, the water cooling device further comprises a circulation pipeline and a heat dissipation amount detection module for detecting actual heat dissipation amount, the heat dissipation amount detection module comprises a flow meter, a first temperature detection unit and a second temperature detection unit, the flow meter is arranged on the circulation pipeline, and the first temperature detection unit and the second temperature detection unit are respectively arranged on the inlet side and the outlet side of the heat exchange device; the first temperature detection unit, the second temperature detection unit and the flowmeter are in signal connection with the thermal management module.
Preferably, the flow meter is an ultrasonic flow meter.
Preferably, the water cooling device further comprises a flow regulating module for regulating the flow of the medium, wherein the flow regulating module comprises a speed regulating pump; alternatively, the flow regulation module comprises a regulating valve.
Preferably, the air cooling device comprises a first air duct, a fourth air duct, a second air duct and a third air duct which are sequentially communicated end to end, and the first air duct and the second air duct are arranged on two opposite sides of the device accommodating cavity.
Preferably, along the height direction of the cabinet, the device accommodating chamber has a plurality of subspaces, and the fourth air ducts are formed between two adjacent subspaces and between the subspaces and the chamber wall of the device accommodating chamber.
Preferably, airflow generating devices are respectively arranged on two sides of each fourth air duct along the airflow direction.
The application provides a cooling system is provided with air cooling device and water cooling device, and is provided with heat dissipation capacity detection module and flow control module in the water cooling device, and the air cooling device carries out the heat exchange with the water cooling device, then according to the heat dissipation capacity of water cooling device and electronic equipment's device total energy consumption control flow control module to the medium flow of adjusting the water cooling device, and then realize that the heat dissipation capacity of water cooling device equals with device total energy consumption as far as possible, thereby improve electronic equipment's efficiency.
Drawings
The above and other objects, features and advantages of the present application will become more apparent from the following description of embodiments thereof with reference to the accompanying drawings, in which:
fig. 1 is a schematic front view illustrating a preferred embodiment of a heat dissipation system provided in the present application;
FIG. 2 is a schematic side view of a preferred embodiment of the heat dissipation system provided herein;
FIG. 3 illustrates a system diagram of a preferred embodiment of a heat dissipation system provided herein;
FIG. 4 illustrates a system diagram of another preferred embodiment of the heat dissipation system provided herein;
fig. 5 is a flowchart illustrating a control method of the heat dissipation system according to a preferred embodiment of the present application.
In the figure, the position of the upper end of the main shaft,
1. a cabinet; 11. a cabinet body; 111. a base plate; 112. a top plate; 113. a side plate; 12. a device accommodating chamber; 121. a subspace; 122. a grid structure;
2. an electric energy meter;
3. an air cooling device; 31. a first air duct; 32. a second air duct; 33. a third air duct; 34. an air flow generating device; 35. a fourth air duct;
4. a water cooling device; 41. a heat exchange device; 42. a flow conduit; 43. a heat dissipation amount detection module; 431. a flow meter; 432. a first temperature detection unit; 433. a second temperature detection unit; 44. A flow regulation module; 441. a speed regulating pump; 442. adjusting a valve; 45. an on-off valve;
5. a thermal management module; 51. a display screen; 52. a controller;
6. an electronic device;
7. a power supply circuit;
8. and a third temperature detection unit.
Detailed Description
The present application is described below based on examples, but the present application is not limited to only these examples. In the following detailed description of the present application, certain specific details are set forth in order to avoid obscuring the nature of the present application, well-known methods, procedures, and components have not been described in detail.
Further, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.
Unless the context clearly requires otherwise, throughout the description and the claims, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, what is meant is "including, but not limited to".
In the description of the present application, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present application, "a plurality" means two or more unless otherwise specified.
It should be understood that the terms "front" and "back" as used herein refer to the orientation of the display screen when the display screen is facing the display screen under normal operation.
The application provides an electronic equipment, like computer cabinet equipment, data center equipment etc. electronic equipment includes rack 1 and cooling system, and cooling system is used for dispelling the heat to rack 1, and rack 1 includes the cabinet body 11 and sets up in device holding chamber 12 of the internal 11 of cabinet. The electronic device may further comprise an electronic component 6, such as a server or the like, the electronic component 6 being arranged in the component receiving cavity 12.
The heat dissipation system comprises an air cooling device 3, a water cooling device 4 and a heat management module 5; wherein, the water cooling device comprises a heat exchange device 41 for introducing chilled water into the cabinet 1; the air cooling device 3 includes an airflow generating device 34 for circulating the air in the cabinet 1 through the heat exchanging device 41 and the device accommodating chamber 12 for heat exchange respectively, and the airflow of the air cooling device 3 can exchange heat with the device accommodating chamber 12 (specifically, with the electronic device 6 in the accommodating chamber 12) when flowing through the device accommodating chamber 12, and exchange heat with the heat exchanging device 41 when flowing through the heat exchanging device 41. The air cooling device 3 and the water cooling device 4 are in signal connection with the thermal management module 5, and the thermal management module 5 is used for obtaining the total device energy consumption W in the cabinet 1 and the actual heat dissipation amount Q1 of the water cooling device 4, and dynamically controlling the medium flow and/or the circulating air volume of the water cooling device 4 according to the total device energy consumption W and the actual heat dissipation amount Q1.
Specifically, as shown in fig. 1 to 4, the air cooling device 3 is disposed between the cavity wall of the device accommodating cavity 12 and the outer shell of the cabinet 11, and includes a first air duct 31, a third air duct 33, and a second air duct 32, which are sequentially communicated with each other, and together with the device accommodating cavity 12, form a circulating air duct. The water cooling device 4 is at least partially disposed in one of the first air duct 31, the second air duct 32 and the third air duct 33 to realize heat exchange between the water cooling device 4 and the air cooling device 3. The water cooling device 4 includes a heat exchanging device 41, a circulation duct 42, a heat dissipation amount detecting module 43, and a flow rate adjusting module 44, the heat exchanging device 41 being disposed in the third air duct 33; the heat dissipation amount detection module 43, the flow rate adjustment module 44 and the heat exchange device 41 are all disposed on the circulation pipe 42; the heat dissipation capacity detection module 43 is used for detecting the actual heat dissipation capacity of the water cooling device 4; a flow regulation module 44 is provided on the flow conduit 42. It can be understood that the total energy consumption W of the above devices can be obtained by the electric energy meter 2 and other devices, and at this time, the thermal management module 5 is in signal connection with the electric energy meter 2, the heat dissipation amount detection module 43 and the flow regulation module 44 to control the flow regulation module 44 and the air cooling device 3 to operate according to the information of the total energy consumption and heat dissipation amount detection module 43 of the devices.
As shown in fig. 5, the method for controlling the heat dissipation system includes:
s100: obtaining the actual heat dissipating capacity Q1 of the water cooling device and the total energy consumption W of the devices in the cabinet 1, wherein the heat dissipating capacity of the water cooling device mainly comes from the heat exchanging device 41, and therefore, the actual heat dissipating capacity Q1 can be simplified into the heat dissipating capacity of the heat exchanging device 41;
s200: the medium flow of the water cooling device and/or the air volume of the air cooling device 3 are/is controlled according to the actual heat dissipating capacity Q1 and the total energy consumption W of the device, that is, only the medium flow can be controlled according to the actual heat dissipating capacity Q1 and the total energy consumption W of the device, only the circulating air volume of the air cooling device 3 can be controlled, or both the medium flow and the circulating air volume can be controlled, wherein the circulating air volume can be realized by controlling the rotating speed of the gas generating device 34.
When the electronic equipment actually works, an external power supply directly supplies power to the electronic equipment through the power supply circuit 7, and the electric energy meter 2 is connected in series with the power supply circuit 7 and can detect the total input electric energy of the electronic equipment so as to obtain the total energy consumption W of the device; meanwhile, the air cooling device 3 exchanges heat with the water cooling device 4 to bring the heat emitted by the electronic device 6 to the water cooling device 4, and the actual heat dissipation amount Q1 of the water cooling device 4 is detected by the heat dissipation amount detection module 43; in order to avoid energy waste, the actual heat dissipation quantity Q1 is equal to the total energy consumption W of the device as far as possible by adjusting the medium flow of the water cooling device 4 according to the control method, so that the heat/function of the electronic equipment can realize dynamic matching and balance, the temperature fluctuation in the cabinet 1 is minimized as far as possible, the thermal fatigue of the electronic equipment is reduced, the service life of the electronic device is prolonged, and the reliability of the whole electronic equipment is improved; meanwhile, the mode reduces manual intervention and reduces the use difficulty of the electronic equipment.
In one embodiment, the cooling system adjusts the rotation speed of the airflow generating device of the cooling system according to the temperature change in the cabinet 1 to accelerate the air flow for cooling; or the medium flow of the water cooling device is adjusted through the temperature change in the cabinet 1. However, in these embodiments, no matter the rotational speed of the device generated by adjusting the temperature of the cabinet 1 or the medium flow rate of the water cooling device, the rotational speed of the device generated by the airflow or the medium flow rate is controlled by the control system only after the actual temperature in the cabinet 1 is greater than or less than the preset temperature, obviously, the method of adjusting the heat dissipation amount according to the temperature change belongs to a passive adjustment method, and has hysteresis, which causes a problem of insufficient heat dissipation adjustment, and also causes a part of waste of total energy consumption of the device.
In an embodiment of the present application, considering that the total device energy consumption 4 of the electronic device is mainly converted into heat dissipation capacity, as long as the actual heat dissipation capacity Q1 is equal to the total device energy consumption W as much as possible, the temperature in the cabinet 1 can be substantially stabilized, it is thought that the heat dissipation system and the control method are adopted, the medium flow of the water cooling device 4 and the circulating air volume of the air cooling device 3 are adjusted directly according to the actual heat dissipation capacity Q1 and the total device energy consumption W, so that the actual heat dissipation capacity Q1 and the total device energy consumption W are balanced as much as possible, and thus, the air temperature in the cabinet 1 does not change naturally and substantially, obviously, the adjustment method belongs to an active adjustment method, and is closed-loop control, and has no hysteresis, and the problem that the heat dissipation adjustment follows up insufficiently can be avoided; and meanwhile, the power density of the electronic equipment and the construction cost of the data center can be improved.
The cabinet 11 may be a rectangular parallelepiped structure, and includes an outer shell, in order to prevent the external heat from affecting the temperature inside the cabinet 1, the outer shell includes a heat insulation structure, specifically, the heat insulation structure may be a heat insulation foam or a heat insulation glue layer, specifically, the outer shell includes a bottom plate 111 and a top plate 112 disposed oppositely, and a side plate 113 connecting the top plate 112 and the bottom plate 111, the side plate 113 and the top plate 112 enclose a closed cavity, the water cooling device 4, the air cooling device 3, the electric energy meter 2 and the thermal management module 5 are all arranged in the cavity, and the device accommodating cavity 12 is arranged in the cavity, at this time, the top plate 112 and the side plate 113 can be provided with heat insulation structures, and further, when the first air duct 31 and the second air duct 32 are provided in the height direction of the cabinet 1 (to be described later in detail), heat insulation structures are arranged between the bottom plate 111 and the first air duct 31 and between the bottom plate 111 and the second air duct 32. Considering that the circulation pipeline 42 of the water cooling device 4 and the power supply circuit 7 of the electronic device need to be led out of the cabinet 11, a gap may be left between the bottom plate 111 and the ground, that is, the bottom plate 111 is arranged in a spaced manner.
The electronic devices 6 in the cabinet 1 are often provided in plural numbers, and in order to facilitate easy taking, placing, managing and maintaining of the electronic devices 6, the device accommodating chamber 12 has a plurality of subspaces 121 along the height direction of the cabinet 1, so as to place the electronic devices 6 in the respective subspaces 121. Wherein, the height direction takes the use state of the cabinet 1 as reference.
The water cooling device 4 may be provided with only the heat exchanging device 41 in the third air passage 33, and the flow duct 42 or the like in the first air passage 31 or the second air passage 32; or may be entirely disposed within the third air path 33.
The medium in the water cooling device 4 can be primary chilled water or secondary chilled water, and can also be other refrigerant media. When the medium is primary chilled water, the inlet end and the outlet end of the circulating pipeline 42 are respectively communicated with the primary chilled water pipeline, so that the whole water cooling device 4 and the chilled water pipeline form a communicating pipeline; when the medium is secondary chilled water, the inlet end and the outlet end of the circulation pipeline 42 are both communicated with the secondary chilled water pipeline. Wherein, the primary chilled water refers to chilled water in a building where the electronic equipment is located, and the secondary chilled water refers to independent chilled water passing through the secondary heat exchanger.
Specifically, the heat dissipation amount detection module 43 includes a flow meter 431, a first temperature detection unit 432, and a second temperature detection unit 433, the flow meter 431 is disposed on the flow pipe 42 for detecting the medium flow rate on the flow pipe 42, the first temperature detection unit 432 and the second temperature detection unit 433 may be both thermometers or other temperature sensing devices, and are respectively disposed on the inlet side and the outlet side of the heat exchange device 41, as shown in fig. 3 and 4, the first temperature detection unit 432 is disposed on the inlet side of the heat exchange device 41, and the second temperature detection unit 433 is disposed on the outlet side for detecting the inlet temperature T1 and the outlet temperature T2 on the inlet side and the outlet side of the heat exchange device 41, respectively; the first temperature sensing unit 432, the second temperature sensing unit 433, and the flow meter 431 are all in signal connection with the thermal management module 5 to transmit the sensed media flow, the inlet temperature T1, and the outlet temperature T2 to the thermal management module 5.
Accordingly, the actual heat dissipation Q1 of the water cooling device 4 detected in step S100 is specifically:
s110: detecting temperature differences of the inlet side and the outlet side of the heat exchange device 41, specifically, detecting an inlet temperature T1 of the inlet side and an outlet temperature T2 of the outlet side, respectively, and obtaining a current medium flow of the heat exchange device 41;
s120: the actual heat removal Q1 is the current medium flow rate temperature difference | T1-T2| the specific heat capacity of the medium.
With this structure, various parts are easily obtained, the cost is low, the structure of the water cooling device 4 can be made simpler, and the actual heat dissipation amount Q1 of the water cooling device 4 can be accurately obtained. Of course, the heat dissipation amount detection module 43 may also be a heat detector or the like.
Specifically, the flow meter 431 may be provided on the outlet side; the flow regulating module 44 is provided at the inlet side to facilitate the structural arrangement of the entire water cooling device 4.
The flow meter 431 may be a general flow meter or an ultrasonic flow meter, preferably an ultrasonic flow meter, to reduce the influence of the flow meter 431 on the flow rate of the medium.
In one embodiment, the flow rate adjusting module 44 includes a speed regulating pump 441, the speed regulating pump 441 is in signal connection with the thermal management module 5, as shown in fig. 4, especially when the medium of the water cooling device 4 is secondary chilled water, the flow rate of the medium is adjusted by the speed regulating pump 441, the flow rate adjusting module 44 only needs one component to adjust the flow rate, the structure is simple, and the arrangement of the components of the water cooling device 4 is easy. In another embodiment, the flow regulating module 44 includes a regulating valve 442, and the regulating valve 442 is used for regulating the medium flow in the water cooling device 4 and is in signal connection with the thermal management module 5, especially when the medium of the water cooling device 4 is primary chilled water, so as to regulate the medium flow through the opening degree of the regulating valve 442. Of course, the flow regulating module 44 may also include both the governor pump 441 and the governor valve 442 to regulate the medium flow through both the governor valve 442 and the governor pump 441.
For better control of the water cooling device 4, the inlet end and the outlet end of the flow conduit 42 are respectively provided with a switching valve 45, such as a solenoid valve, i.e. the water cooling device 4 further comprises a switching valve 45 for opening or disconnecting the passage of the water cooling device 4 to an external medium source.
The heat exchanging device 41 includes a coil structure, as shown in fig. 3 and 4, the heat dissipating area of the heat exchanging device 41 can be increased in a smaller space, and the heat exchanging efficiency between the air cooling device 3 and the heat exchanging device 41 can be improved.
Referring to fig. 2, in order to further increase the heat exchange efficiency between the air-cooling device 3 and the heat exchange device 41, a plurality of coil structures are arranged along the air flow direction of the third air duct 33.
In another embodiment, the heat exchanging device 41 further includes heat dissipating fins connected to the coil structure, but the heat exchanging device 41 may also include only heat dissipating fins or only the coil structure.
In the above embodiments, the airflow generating device 34 may be a fan, and the thermal management module 5 is in signal connection with the airflow generating device 34 to form airflow in the first air duct 31, the second air duct 32 and the third air duct 33 under the control of the thermal management module 5.
Specifically, at least one of the first air duct 31, the second air duct 32, and the third air duct 33 is provided with an airflow generating device 34 therein, such as only the first air duct 31, the second air duct 32, or the third air duct 33 is provided with the airflow generating device 34, or two of the three are provided with the airflow generating device 34; preferably, the first air duct 31, the second air duct 32 and the third air duct 33 are all provided with airflow generating devices 34, the airflow generating devices 34 in the third air duct 33 can be used as main airflow generating devices, and the airflow generating devices 34 in the first air duct 31 and the second air duct 32 can be used as auxiliary airflow generating devices, so as to better increase the fluidity of the air and improve the heat exchange efficiency between the air cooling device 3 and the water cooling device 4.
When the first air duct 31 and the second air duct 32 are provided with the airflow generating devices 34, one or one row of the airflow generating devices 34 may be provided, respectively; a plurality of airflow generating devices 34 may be respectively disposed, so that airflow generating devices 34 forming an array are respectively disposed in the first air duct 31 and the second air duct 32, and the plurality of airflow generating devices 34 disposed in the first air duct 31 may be defined as a first airflow generating device group; the plurality of airflow generating devices 34 disposed in the second air duct 32 are a second airflow generating device set; referring to fig. 1 and 2, this can further accelerate the fluidity of the gas.
When the airflow generating device 34 is disposed in the third air duct 33, in order to better enable the air cooling device 3 to exchange heat with the heat exchanging device 41, the airflow generating devices 34 are disposed on two opposite sides of the heat exchanging device 41 along the air flow direction, and the third air duct 33 may be provided with a plurality of airflow generating devices 34 to form a third airflow generating device group. Further, a plurality of gas flow generating devices 34 may be respectively disposed on two opposite sides of the heat exchanging device 41, and may be respectively arranged in an array, that is, each gas flow generating device 34 of the third gas flow generating device group is arranged in an array, as shown in fig. 3 and 4, four gas flow generating devices 34 are disposed on either side of the heat exchanging device 41 along the gas flow direction, and are arranged in an array. In one embodiment, the air output of the airflow generating device 34 in the third air duct 33 may be set to be greater than the air output of the airflow generating device 34 in the first air duct 31 and the second air duct 32, so as to further increase the heat exchange efficiency between the air cooling device 3 and the heat exchanging device 41. In the third air duct 33, the airflow generation device 34 may be provided only on one side of the heat exchange device 41 in the gas flow direction, or the airflow generation device 34 may be provided on the side of the heat exchange device 41 opposite to the gas flow direction.
In one embodiment, the first air duct 31 and the second air duct 32 are disposed on two opposite sides of the device accommodating chamber 12, as shown in fig. 2, the two opposite side plates 113 and the device accommodating chamber 12 respectively form the first air duct 31 and the second air duct 32, that is, the first air duct 31 and the second air duct 32 are formed between the side plates 113 and the device accommodating chamber 12, and at this time, the bottom plate 111 and the device accommodating chamber 12 form the third air duct 33. At the bottom plate 111 place side of rack 1, first wind channel 31 communicates with second wind channel 32 through third wind channel 33, at the roof 112 place side of rack 1, first wind channel 31 can communicate with second wind channel 32 through device holding chamber 12, specifically, air cooling device 3 still includes fourth wind channel 35, fourth wind channel 35 sets up in device holding chamber 12, so, first wind channel 31, fourth wind channel 35, second wind channel 32 and third wind channel 33 communicate end to end in order, form the circulation wind channel, be favorable to the heat dissipation of electron device 6. In this embodiment, the air flow directions of the first air duct 31 and the second air duct 32 are substantially parallel to the height direction of the cabinet 1.
When the device accommodating chamber 12 has a plurality of subspaces 121, the fourth air ducts 35 are formed between two adjacent subspaces 121 and between the subspaces 121 and the chamber wall of the device accommodating chamber 12, that is, a plurality of fourth air ducts 35 are provided, as shown in fig. 2, after the electronic devices 6 are placed in the cabinet 1, the fourth air ducts 35 are formed between two adjacent layers of electronic devices 6, so that the contact area between the air and the electronic devices 6 can be increased, and therefore, the total device energy consumption W can be converted into the actual heat dissipation Q1 of the water cooling device as much as possible, and the stability of the air temperature in the cabinet 1 is maintained.
The arrangement of the airflow generating devices 34 in the above-mentioned various manners is not only beneficial to the fluidity of the air in the whole air cooling device 3, but also can make the temperature in the whole cabinet 1 more uniform.
Further, the airflow generating devices 34 are respectively disposed on two sides of each fourth air duct 35 along the air flow direction to ensure the controllability of the air flow, and when the first air duct 31 and the second air duct 32 are respectively provided with the airflow generating device arrays, the array behavior can be set to be perpendicular to the direction of the air flow direction of the fourth air duct 35 and perpendicular to the air flow direction of the first air duct 31; the columns of the array in the airflow generating device array are the airflow direction of the air channel in which the columns are arranged.
Correspondingly, two side walls of the device accommodating chamber 12 adjacent to the first air duct 31 and the second air duct 32 are grid structures 122, as shown in fig. 1, the first air duct 31 and the second air duct 32 are respectively communicated with the fourth air duct 35 through the grid structures 122 adjacent to the first air duct 31 and the second air duct 32, so that the guiding of the air flow is facilitated, and the strength of the cabinet 1 can be increased. Of course, the first air duct 31 and the second air duct 32 may directly communicate with the fourth air duct 35.
It should be noted that the fourth air duct 35 may also be directly disposed outside the device accommodating chamber 12, and a fourth air duct is formed between the top plate 112 and the device accommodating chamber 12, that is, the whole air cooling device is disposed around the periphery of the device accommodating chamber 12.
The first airflow generation device group, the second airflow generation device group, and the third airflow generation device group may be controlled separately, that is, in the step S200, the circulating air volume of the air cooling device is controlled according to the actual heat dissipation Q1 and the total device energy consumption W, specifically:
and respectively controlling the rotating speeds of the first airflow generation device group, the second airflow generation device group and the third airflow generation device group according to the actual heat dissipation quantity Q1 and the total energy consumption W of the device so as to further improve the dynamic heat/power balance of the electronic equipment.
Further, when a plurality of fourth air ducts 35 are provided, each fourth air duct 35 is provided with a fourth temperature detecting unit (not shown in the figure), such as a thermometer or a temperature sensing device, the fourth temperature detecting unit is in signal connection with the thermal management module 5, the fourth temperature detecting unit in each fourth air duct 35 corresponds to the airflow generating devices 34 on both sides of the fourth air duct 35, at this time, the airflow generating devices 34 corresponding to each fourth air duct 35 can be controlled individually, in this embodiment, the rotating speed of each airflow generating device 34 in the first airflow generating device group and the second airflow generating device group can be controlled according to the detection result of the corresponding fourth temperature detecting unit, so as to accurately control each airflow generating device 34, and thus better control the circulating air volume of the air cooling device 3.
In addition, considering that in practical application, the actual heat dissipation Q1 and the total device energy consumption W are difficult to approach due to various external factors, such as the ambient temperature, and the like, which is not beneficial to the implementation of the whole control system, in order to solve the problem, the above step S200 of the present application is specifically:
calculating Q2 ═ a × W + B;
controlling the medium flow according to the sizes of Q1 and Q2 and a PID control method, so that the absolute value of the difference value between Q1 and Q2 is smaller than a preset value;
wherein W is the total energy consumption of the device, A is a heat dissipation coefficient larger than zero, and B is a constant, which can be determined empirically. When the air temperature in the cabinet 1 is higher than the target temperature, A is higher than 1; when the air temperature inside the cabinet 1 is less than or equal to the target temperature, a is less than 1. The target temperature may be an optimal operating environment temperature of the electronic device, or a temperature that is most reliable and energy-saving in combination, and specifically, the target temperature may be set by an operator, or may be automatically set by the thermal management module 5 according to a preset rule.
In one embodiment, the heat dissipation system further includes a third temperature detection unit 8, such as a thermometer or a temperature sensing device, disposed in the cabinet, and preferably, the third temperature detection unit 8 is in signal connection with the thermal management module 5 to obtain the temperature of the air in the cabinet 1 in real time. Further, a plurality of third temperature detecting units 8 may be provided, each of the third temperature detecting units may be provided at different positions in the cabinet 1, such as the device accommodating chamber 12, the first air duct 31, the second air duct 32, the heat exchanging device 41, and the like, to monitor the air temperature at various positions in the cabinet 1, and in consideration of the fact that the air temperature at the heat exchanging device 41 is relatively low, the temperature in the device accommodating chamber 12 is relatively high, therefore, it is preferable that the third temperature detecting units 8 are provided at least at the heat exchanging device 41 and in the device accommodating chamber 12, wherein the third temperature detecting unit 8 and the fourth temperature detecting unit located in the device accommodating chamber 12 may share the same thermometer or a temperature sensing device, so as to be able to obtain the highest air temperature and the lowest air temperature in the cabinet 1.
Based on this embodiment, in order to control the medium flow and/or the rotation speed more accurately, the heat dissipation coefficient a may be adjusted in real time according to the air temperature, that is, the control method further includes:
s300: detecting the air temperature of each third temperature detection unit 8;
s400: if the temperature of any air exceeds the preset temperature range, the heat dissipation coefficient A is adjusted, and the specific adjustment method can be adjusted according to the value of the A. Wherein, the target temperature is within a preset temperature range.
When the electronic device is actually used, a value of A, B may be preset, and then in the whole control process, real-time adjustment is performed according to the temperature value of the third temperature detection unit 8, for example, the third temperature detection unit 8 is in signal connection with the thermal management module 5, the thermal management module 5 may adjust the value of a in real time according to the temperature of the third temperature detection unit 8, and of course, an operator may also adjust the value of a according to the temperature of the third temperature detection unit 8.
The thermal management module 5 may include a display screen 51 and a controller 52 connected to each other, where the display screen 51 is used to display various information of the electronic equipment, such as air temperature in the cabinet 1, total device energy consumption W, actual heat dissipation Q1, medium flow rate, and the like; the electric energy meter 2, the air flow generating device 34, the first temperature detecting unit 432, the second temperature detecting unit 433, the flow meter 431, and the flow regulating module 44 are connected to the controller 52, and the third temperature detecting unit 8 and the fourth temperature detecting unit may also be connected to the display screen 51 and/or the controller 52.
Electronic equipment often can be provided with a plurality of cooling system, and electronic equipment includes a plurality of cabinets 1 promptly, and each cabinet 1 all is provided with above-mentioned water cooling plant 4, air cooling plant 3, electric energy meter 2 and thermal management module 5, and each thermal management module 5 can interconnect, if connect through the host computer, carries out unified control. The method for dispersedly controlling heat makes the use of the electronic equipment simpler.
It should be noted that, in the above embodiments, the device accommodating cavity 12 may be provided with only the energy-consuming electronic device 6, and at this time, the total device energy consumption W is equal to the total input electric energy measured by the electric energy meter 2; some electronic devices may further include an energy storage device (not shown), such as a battery, which is also disposed in the device accommodating cavity 12, in this embodiment, the total input power of the electronic device may be used for charging the energy storage device in addition to the operation of the electronic device 6, so that the total device power consumption W is equal to the difference between the total input power measured by the electric energy meter 2 and the energy stored in the energy storage device.
In addition, in the embodiment that the device accommodating cavity 12 is provided with an energy storage device, the energy storage device may serve as a power source to provide electric energy for the electronic device 6, the thermal management module 5, the air cooling device 3 and the water cooling device 4, specifically, the energy storage device may serve as a power source alone to provide electric energy for the electronic device 6, the thermal management module 5, the air cooling device 3 and the water cooling device 4, or may serve as a power source together with the power supply circuit 7 to provide electric energy for the electronic device 6, the thermal management module 5, the air cooling device 3 and the water cooling device 4, when the energy storage device supplies power alone, the total output electric energy of the energy storage device may be detected through an electric energy meter and the like; when the energy storage device and the power supply circuit 7 supply power together, the total energy consumption W of the device is equal to the sum of the total output power of the energy storage device and the total input power of the power supply circuit 7.
In a word, by adding the energy storage device, the normal operation of the electronic equipment can still be ensured under special conditions, such as sudden power failure from the outside.
Those skilled in the art will readily appreciate that the above-described preferred embodiments may be freely combined, superimposed, without conflict.
It will be understood that the embodiments described above are illustrative only and not restrictive, and that various obvious or equivalent modifications and substitutions for details described herein may be made by those skilled in the art without departing from the basic principles of the present application.
Claims (29)
1. A heat dissipation system is used for dissipating heat of a cabinet, and the cabinet comprises a cabinet body and a device accommodating cavity arranged in the cabinet body; the heat dissipation system is characterized by comprising an air cooling device, a water cooling device and a heat management module;
the air cooling device is arranged between the cavity wall of the device accommodating cavity and the shell of the cabinet body, and comprises a first air duct, a third air duct and a second air duct which are sequentially communicated, and the first air duct, the third air duct and the second air duct and the device accommodating cavity form a circulating air duct together;
the water cooling device comprises a heat exchange device, a circulating pipeline, a heat dissipation amount detection module and a flow regulation module, wherein the heat exchange device is arranged in the third air channel; the heat dissipation amount detection module, the flow regulation module and the heat exchange device are all arranged on the circulation pipeline; the heat dissipation capacity detection module is used for detecting the actual heat dissipation capacity of the water cooling device;
the heat management module is in signal connection with the heat dissipation capacity detection module and the flow regulation module, so that the flow regulation module is controlled to work and/or the air cooling device is controlled to work according to the total energy consumption of devices in the cabinet and the information of the heat dissipation capacity detection module.
2. The heat dissipation system of claim 1, wherein the heat dissipation amount detection module includes a flow meter, a first temperature detection unit, and a second temperature detection unit, the flow meter being disposed on the flow pipe, the first temperature detection unit and the second temperature detection unit being disposed on an inlet side and an outlet side of the heat exchange device, respectively; the first temperature detection unit, the second temperature detection unit and the flowmeter are in signal connection with the thermal management module.
3. The heat dissipating system of claim 2, wherein the flow meter is disposed at the outlet side; the flow regulating module is arranged on the inlet side.
4. The heat dissipating system of claim 2, wherein the flow meter is an ultrasonic flow meter.
5. The heat dissipating system of claim 1, wherein the flow regulating module comprises a speed regulating pump; alternatively, the flow regulation module comprises a regulating valve.
6. The heat dissipation system of claim 1, wherein the inlet and outlet ends of the flow conduit are provided with on-off valves, respectively.
7. The heat dissipation system of claim 1, wherein the inlet and outlet ends of the flow conduit are in communication with a secondary chilled water line or a primary chilled water line.
8. The heat dissipating system of claim 1, wherein the heat exchanger comprises a coil structure.
9. The heat dissipating system of claim 8, wherein a plurality of the coil structures are provided along the air flow direction of the third air duct.
10. The heat dissipating system of claim 1, wherein at least one of the first air duct, the second air duct, and the third air duct is provided with an air flow generating device; the thermal management module is also in signal connection with the airflow generating device.
11. The heat dissipating system of claim 10, wherein the first air duct and the second air duct are respectively provided with a plurality of the airflow generating devices forming an array.
12. The heat dissipation system of claim 11, wherein the airflow generating device disposed in the first air duct is a first airflow generating device set; the airflow generating device arranged in the second air duct is a second airflow generating device group; the third air duct is internally provided with the airflow generating device and is defined as a third airflow generating device group; the first, second and third gas flow generator sets are individually controlled by the thermal management module.
13. The heat dissipating system of claim 10, wherein the airflow generating devices are disposed on opposite sides of the heat exchanging device in a direction of airflow within the third air duct.
14. The heat dissipation system of claim 11, wherein the air cooling device further comprises a fourth air duct, and the first air duct and the second air duct are disposed on two opposite sides of the device accommodating cavity; the first air duct, the fourth air duct, the second air duct and the third air duct are sequentially communicated end to form a circulating air duct.
15. The heat dissipation system of claim 14, wherein the device accommodating chamber has a plurality of subspaces along a height direction of the cabinet, and the fourth air duct is formed between two adjacent subspaces and between the subspaces and a wall of the device accommodating chamber.
16. The heat dissipation system of claim 15, wherein each of the fourth air ducts is provided with airflow generating devices on two sides in the airflow direction.
17. The heat dissipation system of claim 15, wherein each of the fourth air channels is provided with a fourth temperature detection unit, the fourth temperature detection unit is in signal connection with the thermal management module, and the airflow generation device corresponding to each of the fourth air channels is controlled independently.
18. The heat dissipation system of claim 14, wherein two sidewalls of the device accommodating cavity adjacent to the first air duct and the second air duct are in a grid structure, and the first air duct and the second air duct are respectively communicated with the fourth air duct through the grid structures adjacent to the first air duct and the second air duct.
19. The heat dissipating system of any of claims 1-14, further comprising a plurality of third temperature sensing units disposed within the cabinet for sensing the temperature of air within the cabinet, the third temperature sensing units being in signal communication with the thermal management module.
20. The heat dissipating system of any of claims 1-14, wherein the enclosure of the cabinet comprises a thermal insulation structure to isolate an ambient from heat transfer with the interior of the cabinet.
21. An electronic device having a cabinet, further comprising the heat dissipation system of any of claims 1-20, the heat dissipation system disposed within the cabinet.
22. The electronic device of claim 21, wherein the electronic device is a computer rack device or a data center device.
23. A heat dissipation system is used for dissipating heat of a closed cabinet, and the cabinet comprises a cabinet body and a device accommodating cavity arranged in the cabinet body; the heat dissipation system is characterized by comprising an air cooling device, a water cooling device and a heat management module; wherein the content of the first and second substances,
the water cooling device comprises a heat exchange device for introducing chilled water into the cabinet;
the air cooling device comprises an airflow generating device, a heat exchange device and a device accommodating cavity, wherein the airflow generating device is used for enabling air in the cabinet to circularly flow through the heat exchange device and the device accommodating cavity so as to respectively exchange heat;
the air cooling device and the water cooling device are in signal connection with the heat management module, and the heat management module is used for obtaining total energy consumption of devices in the cabinet and actual heat dissipation capacity of the water cooling device and dynamically controlling medium flow of the water cooling device and/or circulating air volume of the air cooling device according to the total energy consumption and the actual heat dissipation capacity.
24. The heat dissipation system of claim 23, wherein the water cooling device further comprises a flow pipe and a heat dissipation amount detection module for detecting an actual amount of heat dissipation, the heat dissipation amount detection module comprises a flow meter, a first temperature detection unit, and a second temperature detection unit, the flow meter is disposed on the flow pipe, and the first temperature detection unit and the second temperature detection unit are disposed on an inlet side and an outlet side of the heat exchange device, respectively; the first temperature detection unit, the second temperature detection unit and the flowmeter are in signal connection with the thermal management module.
25. The heat dissipating system of claim 24, wherein the flow meter is an ultrasonic flow meter.
26. The heat dissipation system of claim 23, wherein the water cooling device further comprises a flow regulation module for regulating the flow of the medium, the flow regulation module comprising a speed regulating pump; alternatively, the flow regulation module comprises a regulating valve.
27. The heat dissipation system of any one of claims 23-26, wherein the air cooling device comprises a first air duct, a fourth air duct, a second air duct, and a third air duct sequentially connected end to end, and the first air duct and the second air duct are disposed on opposite sides of the device accommodating cavity.
28. The heat dissipation system of claim 27, wherein the device accommodating chamber has a plurality of subspaces along a height direction of the cabinet, and the fourth air duct is formed between two adjacent subspaces and between the subspaces and a wall of the device accommodating chamber.
29. The heat dissipating system of claim 27, wherein each of the fourth air ducts is provided with airflow generating devices on both sides in the airflow direction.
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| CN201920262551.3U CN210120753U (en) | 2019-03-01 | 2019-03-01 | Heat dissipation system and electronic equipment |
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| CN201920262551.3U CN210120753U (en) | 2019-03-01 | 2019-03-01 | Heat dissipation system and electronic equipment |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109769381A (en) * | 2019-03-01 | 2019-05-17 | 深圳市建恒测控股份有限公司 | Cooling system and its control method, electronic equipment |
| CN113784592A (en) * | 2021-09-13 | 2021-12-10 | 珠海格力电器股份有限公司 | Combined heat dissipation system, electrical equipment, air conditioner and heat dissipation method |
| CN117369558A (en) * | 2023-12-06 | 2024-01-09 | 广州蚁窝智能科技有限公司 | Temperature control heat preservation meal stove control system based on artificial intelligence |
| CN109769381B (en) * | 2019-03-01 | 2024-05-07 | 深圳市建恒测控股份有限公司 | Heat dissipation system, control method thereof and electronic equipment |
-
2019
- 2019-03-01 CN CN201920262551.3U patent/CN210120753U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109769381A (en) * | 2019-03-01 | 2019-05-17 | 深圳市建恒测控股份有限公司 | Cooling system and its control method, electronic equipment |
| CN109769381B (en) * | 2019-03-01 | 2024-05-07 | 深圳市建恒测控股份有限公司 | Heat dissipation system, control method thereof and electronic equipment |
| CN113784592A (en) * | 2021-09-13 | 2021-12-10 | 珠海格力电器股份有限公司 | Combined heat dissipation system, electrical equipment, air conditioner and heat dissipation method |
| CN117369558A (en) * | 2023-12-06 | 2024-01-09 | 广州蚁窝智能科技有限公司 | Temperature control heat preservation meal stove control system based on artificial intelligence |
| CN117369558B (en) * | 2023-12-06 | 2024-02-06 | 广州蚁窝智能科技有限公司 | Temperature control heat preservation meal stove control system based on artificial intelligence |
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