WO2020175814A1

WO2020175814A1 - Transfer device

Info

Publication number: WO2020175814A1
Application number: PCT/KR2020/001706
Authority: WO
Inventors: 김도년; 이윤석
Original assignee: 서울대학교산학협력단
Priority date: 2019-02-27
Filing date: 2020-02-06
Publication date: 2020-09-03
Also published as: KR102156263B9; KR20200104966A; KR102156263B1

Abstract

A transfer device comprises a base and a plurality of stamping units arranged on the base, wherein the base has an auxetic structure having a negative Poisson's ratio. Micro devices can be mass-transferred by means of a transfer device having an auxetic structure. In addition, a transfer process can be easily performed even when the shape and the size of a target substrate vary.

Description

WO 2020/175814 PCT/KR2020/001706 Specification

Name of invention: transfer device

Technical field

[1] The present invention relates to a transfer device, and in detail, mass transfer is possible.

It is about the transfer device.

Background

[2] Microdevices, which can be exemplified as semiconductors, continue to develop at a high speed and are positioned as indispensable devices in the modern industry.

[3] Micro light-emitting diode (pLED) is a high-density display technology that uses high-efficiency devices, as an example of micro-devices, and makes it possible to realize ultra-miniature, light-weight, high-efficiency, and high-durability devices.

[4] Shorter than 5 cm of virtual reality (VR) devices, especially for surreal implementation

For viewing distance, a much clearer (more than 1000 ppi) and fast (nanosecond) HLED device is essential.

[5] For the production of high resolution ^iLED displays, more than 100 million red, green and blue

Ultra-compact ^iLED devices must be precisely and quickly aligned and transferred to the driving circuit board.

[6] Various transfer process technologies have been studied for this, but production cost is very high because it is based on a slow process of individually arranging and transferring a very small number of devices.

[7] Therefore, a large amount of ^iLED devices on the manufacturing board are used for the target board, the device.

The development of innovative large-scale parallel process technology that aligns and transfers precisely to the substrate at once is very important.

Detailed description of the invention

Technical task

[8] One aspect of the present invention provides a transfer device capable of mass transfer.

[9] One aspect of the present invention provides a transfer device capable of running the transfer interval.

Problem solving means

[1] The transfer device according to the idea of the present invention includes a base; a plurality of stamping portions provided on the base, wherein the base has a negative Poisson's ratio.

Includes an auxetic structure.

[11] The base may operate in a first state and a second state extended from the first state so that the plurality of stamping portions are spaced apart from each other.

[12] The plurality of stamping parts, when the base is in the first state,

It may be configured to be spaced apart by one interval, and to be spaced apart from each other by a second interval larger than the first interval when the base is in the second state.

[13] The plurality of stamping parts, when the base is in the first state, the first 2020/175814 1» (：1^1{2020/001706) The microdevices of the target substrate arranged at intervals of 2020/001706 are adhered and separated, and when the base is in the second state, the adhered to the target substrate at the second interval It can be configured to place microdevices.

[14] The above micro device may include micro first high school 1).

[15] The second interval includes a horizontal direction and a second horizontal interval, and a second vertical interval in the vertical direction, and the plurality of stamping portions, when the base is in the second state, the second horizontal interval and the It can be configured to be spaced at a second vertical interval different from the second horizontal interval.

[16] The base includes a first section, and a second section adjacent to the first section, wherein the plurality of stamping parts, a first plurality of stamping parts disposed in the first section of the base, and the Including a second plurality of stamping portions disposed in the second section of the base adjacent to the first section, wherein the first plurality of stamping portions are spaced apart from the second plurality of stamping portions when the base is in the second state It can be configured so that the spacing is small.

[17] The base may be configured to include at least a portion of the curved surface in the second state.

[18] The base may be configured to be bendable.

[19] The plurality of stamping portions may include an adhesive material.

[2] The base and the plurality of stamping portions may be integrally formed.

Effects of the Invention

[21] According to one aspect of the present invention, mass transfer of micro-devices is possible by using an augitive (noh) structure.

[22] According to one aspect of the present invention, the transfer process can be easily carried out even if the shape and size of the target substrate are different.

[23] According to one aspect of the present invention, it is possible to transfer through the transfer device even if the spacing of the microdevices manufactured on the manufacturing substrate and the spacing of the microdevices required on the target substrate are different.

[24] According to one aspect of the present invention, at least a portion of the target substrate includes a curved surface.

Even in the case, it is possible to transfer the transfer object.

Brief description of the drawing

1 is a perspective view of a transfer device and a manufacturing substrate according to an embodiment of the present invention.

[26] Figure 2 ¾ is a front view of the transfer device according to an embodiment of the present invention.

[27] Fig. 3 31), 30, 3 (1 is a conceptual diagram of a transfer device according to an embodiment of the present invention.

[28] Figure 4a is a transfer device according to an embodiment of the present invention from the manufacturing substrate

Drawings on the operation of removing microdevices.

5 is a view of the first and second states of the transfer device according to an embodiment of the present invention.

[3] Figure 6 shows that the transfer device according to an embodiment of the present invention uses microdevices. Drawings on the operation to be placed on the target substrate.

7 is a diagram illustrating a microdevice transfer process according to an embodiment of the present invention.

Schematic drawing.

8 is a view showing microdevices arranged on a target substrate through a transfer device according to an embodiment of the present invention.

9A to 9D are views showing first to fourth states of the transfer device according to an embodiment of the present invention.

10 and 11 are front views of a transfer device according to another embodiment of the present invention.

12 and 13 are front views of a transfer device according to another embodiment of the present invention.

Best mode for carrying out the invention

[36] The configuration shown in the embodiments and drawings in this specification is only a preferred example of the disclosed invention, and there may be various modifications that can replace the embodiments and drawings in this specification at the time of filing of this application.

[37] In addition, the same reference number or code presented in each drawing of this specification

It represents a part or component that performs substantially the same function.

[38] In addition, the terms used in this specification are used to describe the embodiments and are not intended to limit and/or limit the disclosed invention. A singular expression refers to a plural expression unless the context clearly indicates otherwise. In this specification, terms such as "include" or "have" are intended to designate the existence of a feature, number, step, action, component, part, or combination of those listed in the specification. It does not preclude the presence or addition of other features, numbers, steps, actions, components, parts, or combinations thereof.

[39] In addition, terms including ordinal numbers such as “first” and “second” used in this specification may be used to describe various elements, but the above elements are not limited by the above terms. The terms are only used for the purpose of distinguishing one component from other components; for example, without departing from the scope of the rights of the present invention, the first component may be named the second component, similarly the second component Apprenticeship 1 component may be named. The term "and/or" includes any combination of a plurality of related items or any of a plurality of related items.

[4] Also, terms such as "part","~group", block", member", module" are at least one

It can refer to a unit that processes a function or operation; for example, the terms above are at least one hardware, such as field-programmable gate array (FPGA)/application specific integrated circuit (ASIC), or at least one software or processor stored in memory. It can mean at least one process processed by.

[41] In the following, an embodiment according to the present invention is described in detail with reference to the attached drawings.

Explain. 1 is a perspective view of a transfer device and a manufacturing substrate according to an embodiment of the present invention, and FIGS. 2A and 2B are front views of a transfer device according to an embodiment of the present invention.

[43] A transferring apparatus 40 is used to move and place transfer objects.

The transfer object may include a micro device 10aa. Specifically, the transfer object may include a micro LED. In the present embodiment, the transfer object is a micro LED, but the object is not limited.

[44] The transfer device 40 may include a base 50 and a plurality of stamping portions 70.

[45] The base 50 can be formed in an auxetic structure. The augmented structure can be made up of a negative Poisson's ratio (V). The Poisson's ratio is horizontally caused by the vertical stress created in the material. As a ratio of deformation to vertical deformation, the following can be satisfied.

[46] = -Vertical Deformation/Horizontal Deformation

[47] A negative Poisson's ratio means that when a positive (or negative) deformation displacement occurs in one of the horizontal and vertical directions, a positive (or negative) deformation displacement occurs in the other direction. do.

[48] The base 50 may comprise a material having elasticity.

The structure is made of a material having elasticity, and can be constructed to be bent by an external force or to be restored to its original state when deformed.

[49] A plurality of stamping portions 70 may be arranged to remove or place the transfer object. The stamping portion 70 may be configured to have an adhesive force. A plurality of stamping portions 70 may be adhered to the microdevice 10aa to be removed from the manufacturing substrate 10a and placed at a target position on the target substrate 20. The plurality of stamping portions 70 and the base 50 may be integrally formed. The type of the manufacturing board 10a and the target board 20 is not limited. The manufacturing board 10a and the target board 20 May include a device board or interposer.

[5] The plurality of stamping portions 70 may include an elastomer material having adhesive force. However, it is not limited thereto, and any material having adhesive force is satisfied. For example, the base 50 and the plurality of stamping portions 70 may be made of the same material.

[51] The transfer device 40 may be made of a bendable material. That is, as will be described later, the transfer device 40 can transfer the microdevice 10aa even if at least a portion of the target substrate 20 includes a curved surface. It can be configured to be bendable so that it can be used. The specific material of the transfer device 40 is not limited.

[52] The base 50 can operate in a first state (50a, see Fig. 2a) and a second state (see 50b, Fig. 2b) unfolded from the first state 50a. The base 50 is in a second state ( In 50b), it can be configured to extend beyond the first state 50a.

[53] When the base 50 is in the first state (50a), the plurality of stamping portions 70 can be spaced apart at the first interval (II) as shown in Fig. 2A. When the base 50 is in the second state (50b) ,The plurality of stamping portions 70 may be spaced apart by a second interval 12 that is larger than the first interval (II) as shown in FIG. 2B. The standard of the interval is the center of the plurality of stamping portions 70 as shown in FIGS. 2A and 2B. Distance between days 2020/175814 1»（：1^1{2020/001706 There is, however, it is not limited to this, and the criterion of the spacing may be the distance between the plurality of stamping parts (70).

[54] Even through this configuration, the transfer device 40 is the first

Microdevices (1 幻) arranged at intervals (II) can be adhered to the target points arranged at the first interval (II) and the larger second interval (12) on the target substrate 20 as shown in the figure.

[55] The base (50) connects multiple base bodies (54) and multiple base bodies (54).

It may contain a plurality of legs (56).

[56] A plurality of base bodies 54 and a plurality of legs 56 may be configured to be interconnected as shown in Fig. 2 ¾.

[57] A stamping portion 70 may be provided on one surface of the plurality of base bodies 54.

The stamping portion 70 may be formed in a protruding structure from one surface of the plurality of base bodies 54, and may form an adhesive surface integrally with one surface of the base body 54. The plurality of stamping portions 70 may be formed of a base body 54. It is described as being located on the body 54, but is not limited thereto. A plurality of stamping portions 70 may be formed on a plurality of legs 56.

[58] The plurality of legs 56 may be configured to extend from the plurality of base bodies 54. The plurality of legs 56 may be formed integrally with the plurality of base bodies 54.

In the embodiment, the base body 54 is provided so that four legs 56 arranged along its periphery are connected. However, the shape of the base body 54 and the leg 56 is not limited, and the base 50 is an augitive structure. It is satisfied when it is formed as.

[59] As shown in the figure, when the base 50 is in the first state (when it is in the 50 幻, the plurality of legs 56 and the plurality of base bodies 54 are arranged with a division line, and the base 50 is the second

State (when in the 50 ratio, the division line may be configured to open. However, it is not limited thereto, and a bendable guide portion (not shown) may be provided in the division line portion. It can be connected with the leg 56. The guide part can be configured to be in a folded state when the base 50 is in the first state (50幻, and unfold when in the second state (50 ratio). The base 50 through the guide part ) Can be prevented from spreading beyond a certain state.

[6] As an example, the augitive structure in this embodiment is a shape as shown in Fig. 2 ¾ as an example. However, the present invention is not limited to this, and various shapes of augmentative structure may be applied. In addition, in the present embodiment, the structure of the base 50 structurally implementing a negative Poisson's ratio has been described, but the present invention is not limited thereto. For example, the base 50 may have a negative Poisson's ratio depending on the characteristics of the material.

31), 30, and 3 (1) are conceptual diagrams of a transfer device according to an embodiment of the present invention.

[62] In Fig. 2 ¾, for convenience of explanation, an example of an augetics structure is given.

However, as shown in Figs. 31), 30, and 3 (1), this is satisfied if the horizontal strain rate and the vertical strain rate are a structure in which the horizontal strain rate, the vertical strain rate, and the height strain rate increase or decrease together. 2020/175814 1»（：1^1{2020/001706

[63] Figure 3 shows that the horizontal strain rate and the vertical strain rate increase or decrease together.

It is a conceptual diagram of an augetics structure. The base 150 of the transfer device 140 can be extended from a first state (150幻) as shown in Fig. and a second state (150 ratio) as shown in Fig.

[64] also relates to a multi-layered augetics structure. The examples described above take a two-dimensional augetics structure as an example, but as in Fig.

The height strain rate may also be deformed to increase or decrease. That is, the base 250 of the transfer device 240 may be an augetic structure in which the horizontal strain rate, the vertical strain rate, and the height strain rate increase or decrease together.

[65] Fig. 3 ₍ 1 shows a hierarchical augetics structure. In the case of Fig., a plurality of each layer is composed of the same augetics structure, but in Fig. 3 (1, each layer can be composed of a different augetics structure) have.

[66] The transfer device 340 may include bases 351, 352, 353 having different structures from each other. Different bases (351, 352, 353) can be configured with an augitive structure that increases or decreases together; however, different bases (351, 352, 353) have the size of the lateral strain, vertical strain, and height strain. Can run.

[67] The following describes the operation of the transfer device of the present invention.

[68] Figure 4a, is a transfer device according to an embodiment of the present invention from the manufacturing substrate

A drawing on the operation of removing the microdevices, Fig. 5 ¾ is a drawing on the first and second states of the transfer device according to an embodiment of the present invention _, and Fig. 6 _&, the transfer device according to an embodiment of the present invention is It is a drawing on the operation of arranging microdevices on a target board.

[69] The transfer device 40 is in contact with the manufacturing substrate () when the base 50 is operated in the first state (50 幻_), and through a plurality of stamping portions ₇₀ , a plurality of microcircuits of the manufacturing substrate (1 (切) It is possible to adhere to the device 1(^). As shown in the figure, the microdevice 1( placed on the manufacturing substrate 10 can be entirely adhered, and as shown in the figure, the microdevice 1( After this, the base 50 can be operated in the first state (from 50 to the second state 501) as shown in Fig. 5. In this process, each of the plurality of stamping portions 70 is adhered to each other. The plurality of microdevices 1 can be spaced apart at a distance required for each other, i.e., the plurality of stamping portions 70 are spaced from the first interval (II) to the second interval (12), and the plurality of microdevices 1 (It can be spaced from the first interval (II) to the second interval (12) with a plurality of stamping portions (70).

[71] For convenience of explanation, when the base (50) is in the first state (50幻, micro

It has been described that the device 1 (切幻 is adhered and the base 50 is placed in the second state (when the base 50 is in the second state (50 ratio), the micro device 1 is placed as the target substrate, but is not limited thereto, and the base 50 is in the second state) In the case of 501), the micro device 1 may be adhered to, and when the base 50 is in the first state 50, the micro device 1 may be arranged as a target substrate. 2020/175814 1»（：1^1{2020/001706

[72] The transfer device 40 transforms the base 50 into a first state (50幻 to a second state 501), moves to the target substrate 20, and adheres to the target substrate 20 as well. Micro device 1 (切幻 can be placed. In this embodiment, micro

Device (1(山1 Ah, 1此山10(Urine) is 1 micro)), and 1 micro 1 of blue, green, red, white, respectively, can be applied, but is not limited thereto. , Microdevices (1(1A, 1此山10(Urine)) may include 10, sensors, etc.

This transfer device 40 is capable of innovative large-scale parallel transfer by aligning and accurately transferring a large number of devices on the manufacturing board to the target board, the device board.

3] Figure 7 shows the microdevice transfer process according to an embodiment of the present invention.

A schematic diagram, FIG. 8 is a diagram showing microdevices arranged on a target substrate through a transfer device according to an embodiment of the present invention.

4] Figure 7 is a schematic diagram showing the transfer process. Micro 1 high school 1) may include multiple first to 4 micro 1 high school 1) (1 (^, 1 ah, 10. 10 (urine)) .The 1st to 4th micro 1st high school 1) can be configured to generate red, green, blue, and white light, respectively. 5) Manufacturing substrates (multiple 1st to 4th micros arranged at the first interval (II) in 10幻) 1止1)(1(1A, 10。山 10(Urine)) can be separated by the second interval (12) while the base (50) operates in the first state (50幻 to the second state (501)) Multiple agendas separated by the second interval (12) 1 to 4 micro 1 high school 1) (1 (1 ah, 10. 山 10 (urine))

It can be placed on the target substrate 20.

6] Through this process, the transfer device 40 can be applied to the target substrate 20 of the same type.

Micro 1 high school 1) can be arranged at once, and the spacing between 1) within a plurality of micros that are adhered can be arbitrarily adjusted, i.e., the transfer device 40 is a target board for a large number of B 1) devices. Can be transferred in large-scale parallel to the container plate.

刀 Multiple micro 1 high school 1) to the target board (20) at the desired distance

Since it can be arranged, it is possible to transfer a large amount of micro 1 high school 1). In addition, even when the target substrate 20 is formed in a curved surface as shown in Fig. 8, the curvature of the base 50 is changed and the separation distance is adjusted. Mass transcription becomes possible.

8] Figures to 9 (1 is a view showing the first to fourth states of the transfer device according to an embodiment of the present invention.

9] The transfer device 40 can be arranged to be bendable. The transfer device 40 is bendable.

Material may include. The specific material of the transfer device 40 is not limited.

[8 This transfer device 40 can be used even if at least a portion of the target substrate 20 contains curved surfaces.

Microdevices (can be configured to be bendable to enable transfer of 1 round.

[81] The transfer device 40 may be formed in the first state (50幻 in a flat shape) as shown in Fig., and may be unfolded in the second state (5 (¾)) as in Fig. %.

[82] In addition, the transfer device 40 is a third

State (can be bent into 50, and the fourth state of a spherical shape as shown in Fig. 9 (1) () 2020/175814 1»(：1/10公020/001706 It may be possible. For convenience of explanation, the 3rd state (50 and the 4th state (50(¾), but the 3rd state (50 and The fourth state (50(1) can be an example of the second state (50 ratio).

Since the transfer device 40 is bendable, it is possible to precisely transfer a micro device (1 or micro 1 high 1) onto a substrate having a three-dimensional structure such as a flexible substrate and a stretchable substrate. Precise transfer is possible even on substrates for body-attached devices that can be applied to the body.

[84] Hereinafter, a transfer device according to another embodiment of the present invention will be described.

[85] In the description, a detailed description is omitted for the same configuration as the previously described configuration.

The transfer device 140 may include a plurality of stamping portions 70 arranged in a first state (150 to a first interval (II) and arranged in a second state (150 to a second interval 12). Intervals 1 and 2 may include the first and second horizontal intervals (11) and the first and second vertical intervals (11江 and 12 ratios).

88] The plurality of stamping portions 70 may be configured to be larger than the second horizontal interval (12 幻 now the second vertical interval 121). That is, the base 150 is in the second state (the degree of deformation in the horizontal direction from the 150 ratio) It can be configured to be different from the deformation degree in the vertical direction. Through this configuration, it is possible to change the density or orientation of the microdevice (1) to be mounted. In addition, the target substrate 20 of various designs can be designed through such a transfer device (140). have.

The transfer device 140 is shown in Fig. 10 in the first state (150 幻 to the first horizontal interval (11 幻 and the first vertical interval (11 non-moving), but is not limited thereto, and the first

State (even at 150幻, the first horizontal interval (11幻as the first vertical interval) (11 ratio can be configured to be different.

7 9 3611

[9 998888 3 Also, the transfer device 140 in FIG. 11 is shown as an example that is configured to be larger than the second state (150 ratio to the second horizontal interval (12幻 is the second vertical interval 121)). It is not limited and may be configured to be smaller than the second horizontal interval (12幻 now the second vertical interval 121).

For convenience of explanation, the explanation is given as a horizontal interval in a horizontal direction and a vertical interval in a vertical direction, but is not limited thereto, i.e., a first direction interval in one direction and a second direction interval in one direction and the other direction. It may be configured to be different.

The transfer device 240 may include a plurality of stamping portions 70 arranged in a first state (250 to a first interval (11 1115) and a second state (250 to a second interval (12 to 12 ratios). have.

The transfer device 240 may include a first plurality of stamping portions 70 of the first section 51 and a second plurality of stamping portions 70 of the second section 52. 2020/175814 1»（：1^1{2020/001706

[95] The first and second plurality of stamping portions 70 can have different spaced intervals between them. That is, the first plurality of stamping portions 70 have the base 250 being the second phase.

Are spaced apart, and the second plurality of stamping parts 70

The spacing (can be separated by 12 ratios. The second ¾ spacing may be configured to be different. That is, the base 250 may be arranged so that some sections are different from the spacing of the stamping section 70 with the other section.

In the present embodiment, the first plurality of stamping portions 70 of the first section 51 are arranged to have a narrower spacing than the second plurality of stamping portions 70 of the second section 52. However, limited to this. In addition, if the plurality of stamping portions 70 are arranged to have different spacing in at least some areas, this is satisfied. In addition, the first plurality of stamping portions 70 are only in the horizontal direction compared to the second plurality of stamping portions 70. Although shown and described to have different intervals, it is not limited thereto and may be configured to be different in different directions.

[97] Through this configuration, the transfer device 240 can be applied to each area of the target substrate 20.

The device (1 (^) density can be varied. In addition, it is possible to design the target substrate 20 of various designs through the transfer device 240).

[98] In the above, specific embodiments have been illustrated and described. However, the technical idea of the invention described in the following claims is not limited to the above-described embodiments, and those with ordinary knowledge in the technical field to which the invention belongs It will be possible to implement various changes as much as possible without deviating from the point of view.

[99] Maker

Micro device

[100] 20: target substrate 40: transfer device

[101] 50: base 5 (: first state

[102] 5A): Second state 54: Base body

[103] 56: leg 70: stamping part

[104] II: The first interval 12: The second interval

Claims

() 2020/175814 1»(：1/10公020/001706 Claims

[Claim 1] Base;

Including; a plurality of stamping portions provided on the base,

The base is a transfer device that includes an augitive (no) structure having a negative Poisson's ratio.

[Claim 2] The method of claim 1,

The base,

A transfer device operating a first state and a second state extended from the first state so that the plurality of stamping parts are spaced apart from each other.

[Claim 3] In paragraph 2,

The plurality of stamping portions,

When the base is in the first state, a first interval is spaced between each other, and when the base is in the second state, a transfer device configured to be spaced apart from each other with a second interval greater than the first interval.

[Claim 4] In paragraph 3,

The plurality of stamping portions,

When the base is in the first state, the microdevices of the target substrate arranged at the first interval are adhered and separated, and when the base is in the second state, the adhered microdevices are placed on the target substrate at the second interval A transfer device configured to allow.

[Claim 5] The method of claim 4,

The micro device is a transfer device including a micro device 1).

[Claim 6] In paragraph 3,

The second interval includes the second horizontal interval in the horizontal direction and the second vertical interval in the vertical direction,

The plurality of stamping portions,

When the base is in the second state, the transfer device is configured to be spaced apart by the second horizontal interval and a second vertical interval different from the second horizontal interval.

[Claim 7] In paragraph 3,

The base,

Including a first section and a second section adjacent to the first section,

The plurality of stamping portions,

Including; a first plurality of stamping portions disposed in the first section of the base, and a second plurality of stamping portions disposed in the second section of the base adjacent to the first section,

The first plurality of stamping units, when the base is in the second state, the transfer device is configured to be disposed to be smaller than the second plurality of stamping units. 2020/175814 1»（：1^1{2020/001706

[Claim 8] In paragraph 2,

The base,

A transfer device configured to include at least a portion of a curved surface in the second state.

[Claim 9] In paragraph 1,

The base is a transfer device configured to be bent.

[In paragraph 1 of claim 1,

A transfer device comprising the plurality of stamping parts adhesive material.

[Claim 11] In paragraph 1,

A transfer device in which the base and the plurality of stamping parts are integrally formed.