CN106206604B - A kind of array substrate and preparation method thereof, display device - Google Patents
A kind of array substrate and preparation method thereof, display device Download PDFInfo
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- CN106206604B CN106206604B CN201610619438.7A CN201610619438A CN106206604B CN 106206604 B CN106206604 B CN 106206604B CN 201610619438 A CN201610619438 A CN 201610619438A CN 106206604 B CN106206604 B CN 106206604B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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Abstract
The present invention provides a kind of array substrate and preparation method thereof, display device, is related to field of display technology, and the array substrate is it is possible to prevente effectively from pixel defining layer surface is intended to become super-hydrophobic interface.A kind of array substrate, comprising: substrate and the pixel defining layer positioned at the substrate；In the display area of the array substrate, the array substrate further include: the supporting layer for being arranged on the pixel defining layer and contacting with the pixel defining layer, the projection of the supporting layer over the substrate are located in the range of the projection of the pixel defining layer over the substrate.The present invention is suitable for the production of array substrate.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of array substrate and preparation method thereof, display device.
Background technique
OLED (Organic Light Emitting Diode, Organic Light Emitting Diode) device is considered as most having development
The flat-panel display device of potentiality, and be easy to be fabricated to flexible display device.But luminescent material is non-for water oxygen in OLED device
It is often sensitive, easily reduce service life.
It, can be using frit technique (laser sintered glass powder envelope for the OLED device using glass as package substrate
Dress technique) the sintered glass powder on package substrate, package substrate and array substrate seal box, to meet wanting for barrier water oxygen
It asks.But for flexible OLED devices and WOLED (white light OLED) device including color film layer, frit process warm is spent
Height is not suitable for above two type.
Thin-film package (Thin Film Encapsulation, TFE) is mostly used to improve the above problem at present.Specifically,
Pixel defining layer (also known as pixel defining layer) is first produced, then separates luminous organic material vacuum evaporation to pixel defining layer
In pixel region out, then, thin-film package is carried out to above structure.Specifically, first depositing one layer of inorganic layer, one is then made
Layer organic layer, one layer of inorganic layer of last redeposition.Protected using inorganic, organic and inorganic multilayer lamination structure, wherein
Inorganic layer plays a part of to obstruct water oxygen, and organic layer plays a part of to coat and planarize.
But the demand that nowadays high-resolution is shown, so that the density for the subpixel area that pixel defining layer is separated out is got over
Come bigger, while the gap between adjacent subpixels region is smaller and smaller, i.e. pixel defining layer between adjacent subpixels region
Increasingly it is intended to become slim-lined construction.It can be obtained according to Wenzel (Peter Wenzel) model and Cassie (Irving Baxter) model
To: slim-lined construction will form super-hydrophobic interface.That is, pixel defining layer surface is intended to become super-hydrophobic interface.In subsequent thin film
In encapsulation process, after depositing inorganic layer in pixel defining layer, the surface of inorganic layer also tends to become super-hydrophobic interface.And surpass
Hydrophobic interfaces are unfavorable for sprawling for organic layer, then, formation organic layer is more difficult on inorganic layer, to affect organic layer
Production.
Summary of the invention
The embodiment of the present invention provides a kind of array substrate and preparation method thereof, display device, which can have
Effect avoids pixel defining layer surface from being intended to become super-hydrophobic interface.
In order to achieve the above objectives, the embodiment of the present invention adopts the following technical scheme that
On the one hand, a kind of array substrate is provided, comprising: substrate and the pixel defining layer positioned at the substrate；
In the display area of the array substrate, the array substrate further include: be arranged on the pixel defining layer and with institute
The supporting layer of pixel defining layer contact is stated, the projection of the supporting layer over the substrate is located at the pixel defining layer described
In the range of projection on substrate.
Optionally, the supporting layer includes: multiple dotted support units.
Optionally, the support unit is located at the site position of the pixel defining layer.
Optionally, the support unit is cylindrical body, trapezoid body, cuboid, hemisphere or semiellipsoid.
Optionally, the pixel defining layer includes: the first pixel spacer body and the second pixel spacer body that transverse and longitudinal is intersected；
The distance of the two neighboring second pixel spacer body is a；The width of the second pixel spacer body is b；Along institute
The extending direction of the first pixel spacer body is stated, the distance of the two neighboring support unit is c, wherein c=n*2* (a+b), n
For natural number.
Optionally, the supporting layer includes: the support unit of multiple strips；The pixel defining layer includes: that transverse and longitudinal is intersected
The first pixel spacer body and the second pixel spacer body；The extending direction of the support unit and the first pixel spacer body or
The extending direction of the second pixel spacer body is identical.
Optionally, the support unit is semicircle, trapezoid or rectangle along the section of its width direction.
Optionally, all support units are parallel to each other.
Optionally, the extending direction of the support unit is identical as the extending direction of the second pixel spacer body；
The distance of the two neighboring second pixel spacer body is a；The width of the second pixel spacer body is b；Along institute
The extending direction of the first pixel spacer body is stated, the distance of the two neighboring support unit is c, wherein c=n*2* (a+b), n
For natural number.
Optionally, the supporting layer is structure as a whole with the pixel defining layer.
Optionally, the material of the supporting layer is positive photoresist or negative photoresist.
Optionally, the array substrate further include: cover the pixel defining layer and the supporting layer the first inorganic layer,
And it is sequentially located at organic layer and the second inorganic layer on first inorganic layer.
On the other hand, a kind of display device is provided, comprising: array substrate described in any of the above embodiments.
In another aspect, providing a kind of production method of array substrate, which comprises
Pixel defining layer is formed on the substrate and is connect on the pixel defining layer and with the pixel defining layer
The supporting layer of touching, wherein the supporting layer is located in the display area of the array substrate, and the supporting layer is over the substrate
Projection be located at the projection of the pixel defining layer over the substrate in the range of.
The embodiment provides a kind of array substrate and preparation method thereof, display device, which includes:
Substrate and pixel defining layer positioned at substrate；In the display area of array substrate, array substrate further include: setting exists
The supporting layer contacted on pixel defining layer and with pixel defining layer, the projection of supporting layer on substrate are located at pixel defining layer and exist
In the range of projection on substrate.In this way, can change the shape on pixel defining layer surface by the way that supporting layer is arranged, pixel is destroyed
The surface characteristic of layer is defined, so that pixel defining layer surface effectively be avoided to be intended to become super-hydrophobic interface.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram one of array substrate provided in an embodiment of the present invention；
Fig. 2 is a kind of structural schematic diagram two of array substrate provided in an embodiment of the present invention；
Fig. 3 is a kind of structural schematic diagram three of array substrate provided in an embodiment of the present invention；
Fig. 4 is a kind of structural schematic diagram four of array substrate provided in an embodiment of the present invention；
Fig. 5 is a kind of structural schematic diagram five of array substrate provided in an embodiment of the present invention；
Fig. 6 is a kind of structural schematic diagram six of array substrate provided in an embodiment of the present invention；
Fig. 7 is a kind of structural schematic diagram seven of array substrate provided in an embodiment of the present invention；
Fig. 8 is a kind of structural schematic diagram eight of array substrate provided in an embodiment of the present invention.
Appended drawing reference:
2- pixel defining layer；3- support unit；4- the first pixel spacer body；5- the second pixel spacer body.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that, the orientation or positional relationship of the instructions such as term " on " is based on attached
Orientation or positional relationship shown in figure, is merely for convenience of description of the present invention and simplification of the description, rather than indication or suggestion is signified
Device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to the present invention
Limitation.
Embodiment one
The embodiment of the invention provides a kind of array substrates, comprising: substrate and the pixel defining layer positioned at substrate,
In the display area of array substrate, array substrate further include: be arranged on pixel defining layer and contacted with pixel defining layer
Supporting layer, supporting layer on substrate projection be located at the projection of pixel defining layer on substrate in the range of.
Above-mentioned supporting layer on substrate projection be located at the projection of pixel defining layer on substrate in the range of may include
Two kinds of situations: one is the sides that the boundary of the projection of supporting layer on substrate is entirely located in the projection of pixel defining layer on substrate
Within boundary, i.e., the boundary on the boundary of the projection of supporting layer on substrate and the projection of pixel defining layer on substrate is absolutely not heavy
It is folded；Another kind is that the boundary of the projection of supporting layer on substrate and the boundary of the projection of pixel defining layer on substrate have part weight
It is folded.Here this is not construed as limiting, the boundary whole position of the projection of the embodiment of the present invention and attached drawing with supporting layer on substrate
It is illustrated within the boundary of the projection of pixel defining layer on substrate.
Pixel defining layer generally includes the reticular structure of multiple openings, and each opening can fill shining for different colours
Material, such as red illuminating material, blue emitting material, green luminescent material etc. are to form different luminescence units.
Above-mentioned array substrate may include display area and the non-display area positioned at display area surrounding, wherein be used for
The region for realizing display is the area display area, that is, AA (Active Area), and non-display area can be used for being arranged sealant, driving electricity
Road etc..Above-mentioned pixel defining layer, which can be, to be only located in display area, be can also be while being located at display area and non-display area
In domain, it is not construed as limiting here.
Above-mentioned array substrate needs and package substrate could form OLED display to box.If the array substrate is flexibility
Substrate, then it can form flexible OLED display；If the array substrate is COA (Color Filter on Array) base
Plate (COA substrate refers to the substrate color film layer being made in array substrate), then it can form WOLED display device.By above-mentioned battle array
Column substrate is applied in high-resolution flexible OLED display and in the WOLED display device including color film layer, is had more preferable
Effect.
Certainly, above-mentioned array substrate can also include thin film transistor (TFT), OLED etc., only be discussed in detail in array substrate here
Structure relevant to inventive point, other structures can refer to the prior art.
Above-mentioned supporting layer can change the shape on pixel defining layer surface, destroy the surface characteristic of pixel defining layer, thus
Pixel defining layer surface is effectively avoided to be intended to become super-hydrophobic interface.
The specific structure that the embodiment of the present invention includes for above-mentioned supporting layer is not construed as limiting, specific the following detailed description of two kinds
Structure.
The first, with reference to shown in Fig. 1-3, supporting layer includes: multiple dotted support units 3.Here for support unit
Distribution density, shape and position be not construed as limiting.Multiple dotted support units can be it is as shown in Figure 3 be uniformly distributed,
It is also possible to uneven distribution as shown in Figs. 1-2；In view of reducing manufacture difficulty, the former can choose；In view of more preferably changing
The shape on kind pixel defining layer surface, can choose the latter.
Optionally, in order to more preferably improve the shape on pixel defining layer surface, support unit is located at the node of pixel defining layer
At position.Pixel defining layer is illustrated in figure 2 reticular structure, site position, that is, dot location shown in Fig. 2 A.
Optionally, support unit is cylindrical body, trapezoid body, cuboid, hemisphere or semiellipsoid.In view of reducing
Manufacture difficulty mostly uses trapezoid body in practice.The side view that Fig. 4 was painted is support unit when being semiellipsoid, Fig. 5 is painted
Be support unit be cuboid when side view, what Fig. 6 was painted be support unit be positive prismatoid when side view.
Optionally, refering to what is shown in Fig. 7, pixel defining layer 2 includes: the first pixel spacer body 4 and the second picture that transverse and longitudinal is intersected
Plain spacer body 5；The distance of two neighboring second pixel spacer body 5 is a；The width of second pixel spacer body 5 is b；Along the first picture
The extending direction OB of plain spacer body 4, the distance of two neighboring support unit are c, wherein c=n*2* (a+b), n are natural number.
Herein, n=1,2,3 ....It is exemplary, if n=1, a=50um, b=20um, then the distance c=of two neighboring support unit
140um.Certainly, a kind of specific Density Distribution algorithm is only described here, can also be other algorithms certainly, it specifically can root
Factually border it needs to be determined that.In addition, the extending direction of the first pixel spacer body can also be the direction OA as shown in Figure 7, the second picture
The extending direction of plain spacer body can also be the direction OB as shown in Figure 7, here only with the extending direction of the first pixel spacer body
Extending direction for the direction OB shown in Fig. 7, the second pixel spacer body is to be illustrated for the direction OA shown in Fig. 7.
Second, refering to what is shown in Fig. 8, supporting layer includes: the support unit 3 of multiple strips；Pixel defining layer 2 includes: cross
Vertical the first pixel spacer body 4 and the second pixel spacer body 5 intersected；The extending direction of support unit 3 and the first pixel spacer body 4
Or second pixel spacer body 5 extending direction it is identical (be with the extending direction of support unit 3 and the second pixel spacer body 5 in Fig. 8
Extending direction it is identical for illustrate).It should be noted that the extending direction of the first pixel spacer body can be such as Fig. 8 institute
The extending direction in the direction OB, the second pixel spacer body that show can be the direction OA as shown in Figure 8；Certainly, the first pixel separates
The extending direction of body is also possible to the direction OA as shown in Figure 8, the extending direction of the second pixel spacer body is also possible to such as Fig. 8 institute
The direction OB shown；The embodiment of the present invention and attached drawing with the extending direction of the first pixel spacer body be the direction OB shown in Fig. 8,
The extending direction of second pixel spacer body be the direction OA shown in Fig. 8 for be illustrated.
Optionally, support unit is semicircle, trapezoid or rectangle along the section of its width direction.It is made in view of reducing
Make difficulty, mostly uses trapezoid in practice.
Optionally, for the ease of production, refering to what is shown in Fig. 8, all support units 3 are parallel to each other.
It is further alternative, refering to what is shown in Fig. 8, the extension side of the extending direction of support unit 3 and the second pixel spacer body 5
To identical；The distance of two neighboring second pixel spacer body 5 is a；The width of second pixel spacer body 5 is b；Along the first pixel point
The extending direction of the spacer 4, that is, direction OB, the distance of two neighboring support unit 3 are c, wherein c=n*2* (a+b), n are nature
Number.Herein, n=1,2,3 ....It is exemplary, if n=1, a=50um, b=20um, then the distance c of two neighboring support unit
=140um.Certainly, a kind of specific Density Distribution algorithm is only described here, can also be other algorithms certainly, it specifically can be with
Determine according to actual needs.
Optionally, in order to simplify production process, reduce cost, above-mentioned supporting layer is structure as a whole with pixel defining layer；This
Sample can form supporting layer and pixel defining layer by a patterning processes.Patterning processes refer to includes by film formation
The techniques such as the technique of the layer of at least one pattern, including exposure mask, exposure, development, etching and removing.
Optionally, the material of supporting layer is positive photoresist or negative photoresist.Branch is made according to positive photoresist
Layer is supportted, can be the phenolic aldehyde quasi polymer containing unsaturated functional group；Supporting layer is made according to negative photoresist, it can be with
It is the polymer of the unsaturated group containing Photocrosslinkables such as acrylic acid ester bond, epoxy glues.It should be noted that the supporting layer
Material can be identical as the material of pixel defining layer, can also be different, and can specifically select according to the actual situation.
Optionally, above-mentioned array substrate further include: the first inorganic layer and successively of covering pixel defining layer and supporting layer
Organic layer and the second inorganic layer on the first inorganic layer.Since supporting layer changes the shape on pixel defining layer surface,
The surface characteristic of pixel defining layer is destroyed, so that pixel defining layer surface is more difficult to form super-hydrophobic interface；So, in pixel circle
After depositing the first inorganic layer in given layer and supporting layer, the surface of the first inorganic layer is also more difficult to form super-hydrophobic interface；In this way at this
Organic layer is sprawled on first inorganic layer just seem and be relatively easy to, to ensure that the preparation of organic layer, while also ensuring thin
The quality and reliability of film encapsulation.
Embodiment two
The embodiment of the invention provides a kind of display devices, comprising: the array substrate for any one that embodiment one provides.It should
Display device has the characteristics that packaging effect is good, long service life.The display device can be the display devices such as OLED display
And any product having a display function such as TV, digital camera, mobile phone, tablet computer including these display devices or
Component.
Embodiment three
The embodiment of the invention provides a kind of production method of the array substrate of any one provided such as embodiment one, the party
Method includes:
The support that pixel defining layer is formed on the substrate and is contacted on pixel defining layer and with pixel defining layer
Layer, wherein supporting layer is located in the display area of array substrate, and the projection of supporting layer on substrate is located at pixel defining layer and is serving as a contrast
In the range of projection on bottom.
The array substrate formed by the above method, supporting layer can change the shape on pixel defining layer surface, destroy
The surface characteristic of pixel defining layer, so that pixel defining layer surface effectively be avoided to be intended to become super-hydrophobic interface.
Optionally, in order to simplify production process, above-mentioned pixel defining layer and support can be formed using a patterning processes
Layer.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (10)
1. a kind of array substrate, comprising: substrate and the pixel defining layer positioned at the substrate, which is characterized in that in institute
State in the display area of array substrate, the array substrate further include: be arranged on the pixel defining layer and with the picture
Element defines the supporting layer of layer contact, and the projection of the supporting layer over the substrate is located at the pixel defining layer in the substrate
On projection in the range of；
The supporting layer includes: multiple dotted support units；
The pixel defining layer includes: the first pixel spacer body and the second pixel spacer body that transverse and longitudinal is intersected；
The distance of the two neighboring second pixel spacer body is a；The width of the second pixel spacer body is b；Along described
The extending direction of one pixel spacer body, the distance of the two neighboring support unit are c, wherein c=n*2* (a+b), n are certainly
So number；
Alternatively, the supporting layer includes: the support unit of multiple strips；The pixel defining layer includes: first that transverse and longitudinal is intersected
Pixel spacer body and the second pixel spacer body；The extending direction of the support unit and the first pixel spacer body or described the
The extending direction of two pixel spacer bodies is identical.
2. array substrate according to claim 1, which is characterized in that the support unit is located at the pixel defining layer
At site position.
3. array substrate according to claim 1, which is characterized in that the support unit is cylindrical body, trapezoid body, length
Cube, hemisphere or semiellipsoid.
4. array substrate according to claim 1, which is characterized in that the support unit is along the section of its width direction
Semicircle, trapezoid or rectangle.
5. array substrate according to claim 1 or 4, which is characterized in that all support units are parallel to each other.
6. array substrate according to claim 1, which is characterized in that the supporting layer is integrated with the pixel defining layer
Structure.
7. array substrate according to claim 1, which is characterized in that the material of the supporting layer be positive photoresist or
Negative photoresist.
8. array substrate according to claim 1, which is characterized in that the array substrate further include: cover the pixel
Define the first inorganic layer of layer and the supporting layer and the organic layer being sequentially located on first inorganic layer and the second nothing
Machine layer.
9. a kind of display device characterized by comprising the described in any item array substrates of claim 1-8.
10. a kind of production method of such as described in any item array substrates of claim 1-8, which is characterized in that the method packet
It includes:
Pixel defining layer is formed on the substrate and contacts on the pixel defining layer and with the pixel defining layer
Supporting layer, wherein the supporting layer is located in the display area of the array substrate, the throwing of the supporting layer over the substrate
Shadow is located in the range of the projection of the pixel defining layer over the substrate；
Forming the supporting layer includes: multiple dotted support units；
Forming the pixel defining layer includes: the first pixel spacer body and the second pixel spacer body that transverse and longitudinal is intersected；
The distance of the two neighboring second pixel spacer body is a；The width of the second pixel spacer body is b；Along described
The extending direction of one pixel spacer body, the distance of the two neighboring support unit are c, wherein c=n*2* (a+b), n are certainly
So number；
Alternatively, forming the support unit that the supporting layer includes: multiple strips；The pixel defining layer includes: what transverse and longitudinal was intersected
First pixel spacer body and the second pixel spacer body；The extending direction of the support unit and the first pixel spacer body or institute
The extending direction for stating the second pixel spacer body is identical.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108231824B (en) * | 2016-12-16 | 2024-04-23 | 京东方科技集团股份有限公司 | OLED display panel and preparation method thereof |
| CN106910841B (en) * | 2017-03-31 | 2019-08-23 | 昆山国显光电有限公司 | Array substrate and its manufacturing method and organic light emitting display |
| CN110581145B (en) * | 2018-06-11 | 2022-08-16 | 云谷（固安）科技有限公司 | Display screen and display device |
| CN109950285B (en) * | 2019-03-28 | 2021-05-25 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method thereof and display device |
| CN113383439A (en) * | 2019-07-11 | 2021-09-10 | 深圳市柔宇科技股份有限公司 | OLED display panel and display device |
| WO2023206015A1 (en) * | 2022-04-25 | 2023-11-02 | 京东方科技集团股份有限公司 | Display substrate and display device |
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| CN104091785A (en) * | 2014-07-22 | 2014-10-08 | 深圳市华星光电技术有限公司 | Manufacturing method for TFT backboard and TFT backboard structure |
| CN104409473A (en) * | 2014-11-25 | 2015-03-11 | 昆山国显光电有限公司 | Piezoelectric touch organic light emitting display panel, manufacturing method and organic light emitting display |
| CN104733505A (en) * | 2015-03-19 | 2015-06-24 | 京东方科技集团股份有限公司 | Pixel defining layer of light emitting display and manufacturing method thereof |
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