CN209607739U - Display module and electronic equipment - Google Patents
Display module and electronic equipment Download PDFInfo
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- CN209607739U CN209607739U CN201920694473.4U CN201920694473U CN209607739U CN 209607739 U CN209607739 U CN 209607739U CN 201920694473 U CN201920694473 U CN 201920694473U CN 209607739 U CN209607739 U CN 209607739U
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Abstract
The utility model discloses a kind of display module and electronic equipments.Display module includes: display panel, multiple pixels including array arrangement, is spaced apart from each other between multiple pixels；Cover board is located on display panel；And stress-buffer layer, between display panel and cover board, stress-buffer layer includes multiple micro-structures of array setting, at least partly micro-structure is correspondingly arranged with multiple pixels, each micro-structure includes central part and peripheral portion, central part is corresponding with the position of pixel, and peripheral portion is arranged around at least partly periphery of central part, and wherein the elasticity modulus of peripheral portion and the elasticity modulus of central part are different.When by foreign impacts, the micro-structure with elastic modulus difference can buffer extraneous stress the display module of the utility model embodiment, improve the shock resistance of display module.The setting of multiple micro structure arrays, can the effective foreign impacts stress that is subject to of scatter display mould group, to improve the intensity of display module.
Description
Technical field
The utility model relates to display fields, and in particular to a kind of display module and electronic equipment.
Background technique
Display module includes the cover board of display panel and setting on a display panel, and cover board usually can undertake from aobvious
Show the positive a part impact of mould group, protects display panel.
In display module, including some mould groups that can be realized various functions, such as segmental mold group.Segmental mold group is real
Its existing folder function, mould group material used is more frivolous, more resistant to bending, however consequent be material in terms of intensity not
Mould group can be protected completely, and when being acted on by external impacts, the appearance of display module or display will appear exception.
Utility model content
The utility model provides a kind of display module and electronic equipment, improves the impact resistance of display module.
On the one hand, the utility model embodiment provides a kind of display module comprising: display panel, including array arrangement
Multiple pixels, be spaced apart from each other between multiple pixels；Cover board is located on display panel；And stress-buffer layer, it is located at display surface
Between plate and cover board, stress-buffer layer includes multiple micro-structures of array setting, and at least partly micro-structure is corresponding with multiple pixels
Setting, each micro-structure includes central part and peripheral portion, and central part is corresponding with the position of pixel, and peripheral portion surrounds central part extremely
The setting of small part periphery, wherein the elasticity modulus of peripheral portion and the elasticity modulus of central part are different.
According to the one aspect of the utility model embodiment, the elasticity modulus of peripheral portion is greater than the elasticity modulus of central part.
According to the one aspect of the utility model embodiment, the central part of micro-structure is to be provided with engraving on stress-buffer layer
Hollow structure.
According to the one aspect of the utility model embodiment, stress-buffer layer light transmission, the thickness of peripheral portion and central part
Thickness is different.
According to the one aspect of the utility model embodiment, the central part of each micro-structure is arranged corresponding to single pixel.
According to the one aspect of the utility model embodiment, the shape of central part is matched with the shape of respective pixel, center
The size in portion is more than or equal to the size of pixel.
According to the one aspect of the utility model embodiment, the central part of each micro-structure corresponds to more than two pixels and sets
It sets.
According to the one aspect of the utility model embodiment, peripheral portion is arranged around the entire periphery of central part, Huo Zhezhou
Edge is set to central part on the outside of the both ends of first direction.
According to the one aspect of the utility model embodiment, stress-buffer layer is Nian Jie with display panel by cover board.
On the other hand, the utility model embodiment provides a kind of electronic equipment comprising any of the above-described embodiment is shown
Show mould group.
According to the display module of the utility model embodiment, stress-buffer layer is provided between display panel and cover board,
The stress-buffer layer includes multiple micro-structures of array setting, wherein the position of the pixel of the central part and display panel of micro-structure
Corresponding, the peripheral portion of micro-structure is arranged around at least partly periphery of central part, the elasticity modulus of peripheral portion and the bullet of central part
Property modulus it is different so that micro-structure forms elastic modulus difference in the region of respective pixel position and the region of pixel peripheral position
It is different.When by foreign impacts, the micro-structure with elastic modulus difference can buffer extraneous stress, improve display mould
The shock resistance of group.The setting of multiple micro structure arrays, can the effective foreign impacts stress that is subject to of scatter display mould group, thus
Improve the intensity of display module.
In some alternative embodiments, the elasticity modulus of the peripheral portion of micro-structure is greater than the elasticity modulus of central part, from
And stronger support is provided in at least partly periphery of pixel, the shock resistance of micro-structure is improved, and then improve display module
Shock resistance.
In some alternative embodiments, the central part of micro-structure is the engraved structure being provided on stress-buffer layer, is made
The peripheral portion of micro-structure while be capable of providing stronger support performance, reduce the central part of micro-structure to pixel institute isolychn
Influence, guarantee the original optical effect of display module.
Detailed description of the invention
By reading detailed description of non-limiting embodiments referring to the drawings, other spies of the utility model
Sign, objects and advantages will become more apparent upon, wherein the same or similar appended drawing reference indicates the same or similar feature, attached
Figure is not drawn according to actual ratio.
Fig. 1 shows the structural schematic diagram of the display module according to the utility model first embodiment；
Fig. 2 shows AA in Fig. 1 to schematic cross-section；
Fig. 3 shows the structural schematic diagram of the display module according to the utility model second embodiment；
Fig. 4 shows the structural schematic diagram of the display module according to the utility model 3rd embodiment；
Fig. 5 shows the structural schematic diagram of the display module according to the utility model fourth embodiment.
In figure:
1000- display module；
100- display panel；PX- pixel；110- substrate；120- device layer；130- light emitting element layer；140- encapsulated layer；
200- cover board；
300- stress-buffer layer；310- micro-structure；311- central part；312- peripheral portion；
X- first direction.
Specific embodiment
The feature and exemplary embodiment of the various aspects of the utility model is described more fully below, in order to keep this practical new
The objects, technical solutions and advantages of type are more clearly understood, and below in conjunction with drawings and the specific embodiments, carry out to the utility model
It is described in further detail.It should be understood that specific embodiment described herein is only configured to explain the utility model, do not matched
It is set to restriction the utility model.To those skilled in the art, the utility model can not need these details
In some details in the case where implement.Below the description of embodiment is used for the purpose of passing through the example for showing the utility model
The utility model is better understood to provide.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence " including ... ", it is not excluded that including
There is also other identical elements in the process, method, article or equipment of the element.
It should be appreciated that being known as being located at another floor, another area when by a floor, a region when describing the structure of component
When domain " above " or " top ", can refer to above another layer, another region, or its with another layer, it is another
Also comprising other layers or region between a region.Also, if by part turnover, this layer, a region will be located at it is another
Layer, another region " following " or " lower section ".
The utility model embodiment provides a kind of display module, and display module includes display panel and is located at display panel
On cover board, display panel can be including Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED)
Display panel.In some embodiments, display panel can be flexible display panels, e.g. flexible OLED display panel, In
In some embodiments, cover board is also possible to flexible cover plate, so that the display module formed is Flexible Displays mould group, and some
In embodiment, display module is bent.Herein, term " display module " can refer to that the finished product for completing whole module set section processing procedures is aobvious
Show mould group, can also refer to the semi-finished product display module in any process stage of module set section.
Fig. 1 shows the structural schematic diagram of the display module according to the utility model first embodiment, and Fig. 2 shows AA in Fig. 1
To schematic cross-section.The display module 1000 of the present embodiment includes display panel 100, cover board 200 and stress-buffer layer
300.Its cover plate 200 is located on display panel 100, and stress-buffer layer 300 is between display panel 100 and cover board 200.For
The detailed construction of stress-buffer layer 300 is clearly shown, is painted 200 transparence of cover board in Fig. 1.
Display panel 100 includes multiple pixel PX of array arrangement, is spaced apart from each other between multiple pixel PX.Such as Fig. 2, one
In a little embodiments, display panel 100 includes substrate 110 and the multiple functional layers being arranged on substrate 110.
In some EXAMPLE Examples, above-mentioned multiple functional layers include device layer 120, light emitting element layer 130 and
Encapsulated layer 140.Device layer 120 is located on substrate 110, and light emitting element layer 130 is located on device layer 120, and encapsulated layer 140 is located at hair
On element layer 130.
In light emitting element layer 130, it is formed with multiple pixel PX of array arrangement.Herein, term " pixel " can refer to
The light-emitting component being formed in light emitting element layer 130, the light-emitting component are, for example, OLED light-emitting component.
The devices such as conducting wire and transistor, capacitor can be formed in device layer 120, a variety of devices pass through interconnection and group
It closes, forms corresponding with each pixel PX pixel circuit, wherein pixel circuit is by the signal of each pixel PX and display panel 100
Line electrical connection, and pixel PX is driven to shine.
Encapsulated layer 140 can be thin-film packing structure, organic layer, inorganic layer including lamination setting.In some embodiments
In, multiple pixel PX of 140 covering luminous element layer 130 of encapsulated layer, to protect pixel PX to lose from outside water gas cut.
Cover board 200 can be light transmission, it is transparent cover plate in the present embodiment.In some embodiments, cover board 200 is
Flexible cover plate, and can bend.
Such as Fig. 1 and Fig. 2, stress-buffer layer 300 includes multiple micro-structures 310 of array setting, in Fig. 1 and Fig. 2, Mei Gexu
The region that wire frame encloses corresponds to a micro-structure 310, and Fig. 1 and Fig. 2 only symbolically show several micro-structures with dotted line frame
310.Wherein, at least partly micro-structure 310 in multiple micro-structures 310 is correspondingly arranged with multiple pixel PX.
Each micro-structure 310 includes central part 311 and peripheral portion 312, and central part 311 is corresponding with the position of pixel PX, week
Edge 312 is arranged around at least partly periphery of central part 311, wherein the bullet of the elasticity modulus of peripheral portion 312 and central part 311
Property modulus it is different.
According to the display module 1000 of the utility model embodiment, it is provided with and answers between display panel 100 and cover board 200
Power buffer layer 300, stress-buffer layer 300 includes micro-structure 310, in micro-structure 310, the elasticity modulus of peripheral portion 312 and center
The elasticity modulus in portion 311 is different, so that micro-structure 310 was the region (central part 311) of the position respective pixel PX and pixel PX weeks
The region (peripheral portion 312) of side position forms elastic modulus difference, forms the micro-structure 310 with stress buffer performance.
When by foreign impacts, for example, display module 1000 200 surface of cover board by falling sphere, start to write etc. impact when,
Micro-structure 310 with elastic modulus difference can buffer extraneous stress, improve the impact resistance of display module 1000
Energy.In addition, the setting of multiple 310 arrays of micro-structure, can the effective foreign impacts stress that is subject to of scatter display mould group 1000, thus
Improve the intensity of display module 1000.
In some embodiments, in each micro-structure 310, the elasticity modulus of peripheral portion 312 is greater than the elasticity of central part 311
Modulus, so that micro-structure 310 is in the region (central part 311) of the position respective pixel PX and the region (week of pixel PX peripheral position
Edge 312) elastic modulus difference is formed, and the elasticity modulus of peripheral portion 312 is bigger, thus in at least partly outer of pixel PX
Week provides stronger support, improves the impact resistance of micro-structure 310, and then improve the impact resistance of display module 1000.
It should be noted that the elasticity modulus that can be not limited to peripheral portion 312 is greater than center in each micro-structure 310
The elasticity modulus in portion 311.In some other embodiment, in each micro-structure 310, it is also possible to the springform of peripheral portion 312
The elasticity modulus that amount is less than central part 311 still can so that the micro-structure 310 with elastic modulus difference still can be formed
It is enough that extraneous stress is buffered, improve the shock resistance of display module 1000.
In some embodiments, polarizing layer can also be set between display panel 100 and cover board 200；In some embodiments
In, touch control layer can also be set between display panel 100 and cover board 200.Stress-buffer layer 300 and polarizing layer and/or touch control layer
Structural relation can need to be arranged according to actual design, by taking the relationship of stress-buffer layer 300 and polarizing layer as an example, in some realities
It applies in example, the side towards display panel 100 that stress-buffer layer 300 can be located at polarizing layer is answered in further embodiments
Power buffer layer 300 can also be located at the side towards cover board 200 of polarizing layer.
In the present embodiment, stress-buffer layer 300 is patterned layer structure.Stress-buffer layer 300 can be optical cement
(Optically Clear Adhesive, OCA), thermosetting material etc. are made.In some embodiments, stress-buffer layer 300
It can be glue line material to be made, so that adhesive property is had both, so that stress-buffer layer 300 glues cover board 200 and display panel 100
It connects.Since stress-buffer layer 300 also serves as glue-line, while realizing enhancing 1000 intensity of display module, also realizes cover board 200 and show
The bonding fitting for showing panel 100, so that modular structure is more lightening.
It is formation stress-buffer layer for ultraviolet radioactive (Ultraviolet, UV) type optical cement with stress-buffer layer 300
300 process may is that the formation UV type optical adhesive layer on display panel 100, later to UV type under the light shield of specific pattern
Optical adhesive layer carries out UV solidification, so that a part of structure modulus of elasticity of UV type optical adhesive layer increases, while removing UV type optics
Part-structure in glue-line realizes its patterning, obtains multiple micro-structures 310 of array arrangement.
In the present embodiment, the central part 311 of micro-structure 310 is the engraved structure being provided on stress-buffer layer 300, is made
The peripheral portion 312 of micro-structure 310 while be capable of providing stronger support performance, the central part 311 for reducing micro-structure 310 is right
The influence of pixel PX institute isolychn guarantees the original optical effect of display module 1000.
In some other embodiment, the central part 311 of micro-structure 310 can be not limited to engraved structure.For example, stress
Buffer layer 300 can be photic zone, and stress-buffer layer 300 is hyaline layer in some embodiments.The thickness of peripheral portion 312 is in
The thickness of center portion 311 is different, such as the thickness of peripheral portion 312 is greater than the thickness of central part 311 in some embodiments, so that all
Edge 312 generates elastic modulus difference since material thickness is different from central part 311, forms above-mentioned micro-structure 310.
In some embodiments, the central part 311 of each micro-structure 310 is arranged corresponding to single pixel PX, i.e., respectively will
The central part 311 of each micro-structure 310 and corresponding single pixel PX are projected in the plane perpendicular to display module 1000, wherein
The projection of single pixel PX is located inside the projection of the central part 311 of corresponding micro-structure 310.In some other embodiment, often
The central part 311 of a micro-structure 310 is arranged corresponding to two or more pixel PX, i.e., respectively by the central part of each micro-structure 310
311 and corresponding two or more pixel PX is projected in the plane perpendicular to display module 1000, the above pixel PX's of two of them
Inside the projection for projecting the central part 311 for being respectively positioned on corresponding micro-structure 310.
In Fig. 1, embodiment shown in Fig. 2, single pixel PX is corresponded to the central part 311 of each micro-structure 310 and is set
Example is set to be illustrated.Each pixel PX is substantially rectangular in the present embodiment, and multiple pixel PX are arranged as multirow or multiple row, every row
Or each column includes multiple pixel PX.
In some embodiments, the shape of the central part 311 of micro-structure 310 is matched with the shape of respective pixel PX, i.e., originally
In embodiment, the shape of central part 311 is also rough rectangle.The size of central part 311 is more than or equal to the size of pixel PX.In
In some embodiments, the central part 311 of micro-structure 310 can be with corresponding pixel PX arranged concentric, so that micro-structure 310 allows
The light that pixel PX is issued penetrates, and reduces the influence to its illumination effect.
It is understood that the shape of each pixel PX is not limited to rectangle in some other embodiment, it is also possible to
Other shapes.The shape of the central part 311 of micro-structure 310 is also not necessarily limited to be rectangle, can be other shapes.Multiple pixel PX rows
The mode of column is not limited to the exemplary mode of above-described embodiment, is also possible to other arrangement modes.The arrangement of multiple micro-structures 310
Mode can be corresponding with the arrangement mode of multiple pixel PX, can also carry out other adaptively adjusting.
In some embodiments, in micro-structure 310, peripheral portion 312 can be arranged around the entire periphery of central part 311.
In Fig. 1, embodiment illustrated in fig. 2, said so that the elasticity modulus of peripheral portion 312 is greater than the elasticity modulus of central part 311 as an example
It is bright.Peripheral portion 312 be rectangular ring, around central part 311 entire periphery be arranged so that micro-structure 310 in any direction on,
Be high elastic modulus-low elastic modulus-high elastic modulus structure, i.e., in any direction on, be all low elasticity mould for middle part
The central part 311 of amount, both ends are the structures of the peripheral portion 312 of high elastic modulus, improve display module 1000 in a plurality of directions
Impact resistance.
In above-mentioned the utility model first embodiment, pixel PX is rectangle, the shape of the central part 311 of micro-structure 310
For with the matched polygon of pixel PX shape, in some other embodiment, the central part 311 of micro-structure 310 can be other
Shape.
Fig. 3 shows the structural schematic diagram of the display module according to the utility model second embodiment, and second embodiment is shown
The most of structure for showing mould group 1000 is similar with the display module 1000 of first embodiment, and this will not be detailed here, below will be to
The difference of two embodiments and first embodiment is illustrated.It is the detailed knot for clearly showing stress-buffer layer 300 in Fig. 3
200 transparence of cover board is painted by structure.
Stress-buffer layer 300 includes multiple micro-structures 310 of array setting, in Fig. 3, region pair that each dotted line frame encloses
It should be a micro-structure 310, Fig. 3 only symbolically shows several micro-structures 310 with dotted line frame.The central part 311 of micro-structure 310
Corresponding with the position of pixel PX of display panel 100, the peripheral portion 312 of micro-structure 310 is around at least partly outer of central part 311
Week setting, and the elasticity modulus of peripheral portion 312 is different from the elasticity modulus of central part 311.When by foreign impacts, have
The micro-structure 310 of elastic modulus difference can buffer extraneous stress, improve the shock resistance of display module 1000.It is more
The setting of a 310 array of micro-structure, can the effective foreign impacts stress that is subject to of scatter display mould group 1000, to improve display mould
The intensity of group 1000.
In a second embodiment, it is still illustrated so that pixel PX is rectangle as an example.Wherein, central part 311 can be not
Central part 311 with the matched shape of pixel PX shape, such as the present embodiment is parallelogram.In addition, multiple micro-structures 310
In, micro-structure 310 and the shape of another micro-structure 310 may be the same or different.Such as in the present embodiment, each micro- knot
The central part 311 of structure 310 is parallelogram, and peripheral portion 312 can be arranged around the entire periphery of central part 311, periphery
Portion 312 is the cyclic structure that parallelogram extends.Wherein the central part 311 per adjacent micro-structure 310 is respectively not
The parallelogram of similar shape, the peripheral portion 312 per adjacent micro-structure 310 are also cyclic structure of different shapes.
According to the display module 1000 of above-mentioned second embodiment, in multiple micro-structures 310, the center of adjacent microstructures 310
The shape of portion 311 and peripheral portion 312 is different, so that the structural diversification of micro-structure 310, improves display module 1000 a variety of
Impact resistance in angle.
Fig. 4 shows the structural schematic diagram of the display module according to the utility model 3rd embodiment, and 3rd embodiment is shown
The most of structure for showing mould group 1000 is similar with the display module 1000 of first embodiment, and this will not be detailed here, below will be to
The difference of three embodiments and first embodiment is illustrated.It is the detailed knot for clearly showing stress-buffer layer 300 in Fig. 4
200 transparence of cover board is painted by structure.
Stress-buffer layer 300 includes multiple micro-structures 310 of array setting, in Fig. 4, region pair that each dotted line frame encloses
It should be a micro-structure 310, Fig. 4 only symbolically shows several micro-structures 310 with dotted line frame.The central part 311 of micro-structure 310
Corresponding with the position of pixel PX of display panel 100, the peripheral portion 312 of micro-structure 310 is around at least partly outer of central part 311
Week setting, and the elasticity modulus of peripheral portion 312 is different from the elasticity modulus of central part 311.When by foreign impacts, have
The micro-structure 310 of elastic modulus difference can buffer extraneous stress, improve the shock resistance of display module 1000.It is more
The setting of a 310 array of micro-structure, can the effective foreign impacts stress that is subject to of scatter display mould group 1000, to improve display mould
The intensity of group 1000.
In the third embodiment, it is still illustrated so that pixel PX is rectangle as an example.Wherein, central part 311 be include curved
The profiled shape of curl, the profiled shape generally comprise four edges interconnected, wherein each side is curved edges.Peripheral portion
312 can be arranged around the entire periphery of central part 311, the corresponding ring of 311 shapes centered on the peripheral portion 312 of the present embodiment
Shape structure.By the central part 311 and peripheral portion 312 of the more complicated profiled shape of setting shape, enable micro-structure 310
The stress of extraneous more kinds of forms is buffered, the impact resistance of display module 1000 is further increased.
In the above-described embodiments, in micro-structure 310, peripheral portion 312 is arranged around the entire periphery of central part 311, however
It in some embodiments, can be without being limited thereto.
Fig. 5 shows the structural schematic diagram of the display module according to the utility model fourth embodiment, and fourth embodiment is shown
The most of structure for showing mould group 1000 is similar with the display module 1000 of first embodiment, and this will not be detailed here, below will be to
The difference of four embodiments and first embodiment is illustrated.It is the detailed knot for clearly showing stress-buffer layer 300 in Fig. 5
200 transparence of cover board is painted by structure.
Stress-buffer layer 300 includes multiple micro-structures 310 of array setting, in Fig. 5, region pair that each dotted line frame encloses
It should be a micro-structure 310, Fig. 5 only symbolically shows several micro-structures 310 with dotted line frame.The central part 311 of micro-structure 310
Corresponding with the position of pixel PX of display panel 100, the peripheral portion 312 of micro-structure 310 is around at least partly outer of central part 311
Week setting, and the elasticity modulus of peripheral portion 312 is different from the elasticity modulus of central part 311.When by foreign impacts, have
The micro-structure 310 of elastic modulus difference can buffer extraneous stress, improve the shock resistance of display module 1000.It is more
The setting of a 310 array of micro-structure, can the effective foreign impacts stress that is subject to of scatter display mould group 1000, to improve display mould
The intensity of group 1000.
In the fourth embodiment, peripheral portion 312 is set to central part 311 on the outside of the both ends of first direction X.Wherein, as
Plain PX can be arranged as multirow, and every row includes multiple pixel PX, and first direction X can be parallel to the extension side of every row pixel PX
To.In some other embodiment, first direction X is also possible to other any directions, is also possible to according to actual design needs
To configure the direction.
It is illustrated so that the elasticity modulus of peripheral portion 312 is greater than the elasticity modulus of central part 311 as an example, micro-structure 310 exists
On first direction X, formed middle part be the central part 311 of low elastic modulus, both ends be high elastic modulus peripheral portion 312 knot
Structure, so that micro-structure 310 is the structure on first direction X with elastic modulus difference, so as to delay to extraneous stress
Punching improves the impact resistance of display module 1000.
The central part 311 of micro-structure 310 can be the engraved structure being provided on stress-buffer layer 300, in central part 311
Peripheral portion 312 is set on the outside of the both ends of first direction X, while forming micro-structure 310 with stress buffer performance, section
The material of stress-buffer layer 300 is saved, realizes the more lightweight of display module 1000.
The central part 311 of the present embodiment is the profiled shape for including curved edges, which generally comprises interconnection
Four edges, wherein two opposite sides be straight line, opposite two other side be curved edges.Peripheral portion 312 is arranged upper
The outside of two opposite curved edges is stated, and peripheral portion 312 also extends curved.
It should be noted that the shape of central part 311 can be not limited to the above embodiments exemplary in micro-structure 310
Shape can also be other polygons, circle or the profiled shape including curved edges, correspondingly, the shape of peripheral portion 312
Can also correspondingly it be changed.
The utility model embodiment also provides a kind of electronic equipment, which is, for example, the tool such as mobile phone, tablet computer
There is the equipment of image display function, wherein the electronic equipment may include the display module 1000 of any of the above-described embodiment.This is aobvious
Show that mould group 1000 includes display panel 100, cover board 200 and stress-buffer layer 300.Its cover plate 200 is located at display panel 100
On, stress-buffer layer 300 is between display panel 100 and cover board 200.
Stress-buffer layer 300 includes multiple micro-structures 310 of array setting, at least partly micro- in multiple micro-structures 310
Structure 310 is correspondingly arranged with multiple pixel PX.Each micro-structure 310 include central part 311 and peripheral portion 312, central part 311 with
The position of pixel PX is corresponding, and peripheral portion 312 is arranged around at least partly periphery of central part 311, wherein the elasticity of peripheral portion 312
Modulus is different from the elasticity modulus of central part 311.
According to the electronic equipment of the utility model embodiment, display module 1000 include setting display panel 100 with
Stress-buffer layer 300 between cover board 200, in the micro-structure 310 that stress-buffer layer 300 includes, the elasticity modulus of peripheral portion 312
It is different from the elasticity modulus of central part 311, so that micro-structure 310 is in the region (central part 311) of the position respective pixel PX and picture
The region (peripheral portion 312) of plain PX peripheral position forms elastic modulus difference, forms the micro-structure with stress buffer performance
310。
When the display module 1000 of electronic equipment is by foreign impacts, 310 energy of micro-structure with elastic modulus difference
It is enough that extraneous stress is buffered, improve the shock resistance of display module 1000 and electronic equipment.In addition, multiple micro-structures
The setting of 310 arrays, can the effective foreign impacts stress that is subject to of scatter display mould group 1000, thus improve display module 1000 with
And the intensity of electronic equipment.
According to the utility model embodiment as described above, these embodiments details all there is no detailed descriptionthe,
Also not limiting the utility model is only the specific embodiment.Obviously, as described above, many modification and change can be made
Change.These embodiments are chosen and specifically described to this specification, is in order to preferably explain the principles of the present invention and actually to answer
With so that skilled artisan be enable to utilize the utility model and repairing on the basis of the utility model well
Change use.The utility model is limited only by the claims and their full scope and equivalents.
Claims (10)
1. a kind of display module characterized by comprising
Display panel, multiple pixels including array arrangement are spaced apart from each other between multiple pixels；
Cover board is located on the display panel；And
Stress-buffer layer, between the display panel and the cover board, the stress-buffer layer includes the more of array setting
A micro-structure, at least partly described micro-structure are correspondingly arranged with multiple pixels, each micro-structure include central part and
Peripheral portion, the central part is corresponding with the position of the pixel, and the peripheral portion surrounds at least partly periphery of the central part
Setting, wherein the elasticity modulus of the peripheral portion is different from the elasticity modulus of the central part.
2. display module according to claim 1, which is characterized in that the elasticity modulus of the peripheral portion is greater than the center
The elasticity modulus in portion.
3. display module according to claim 1, which is characterized in that the central part of the micro-structure is to be provided with stress to delay
Rush the engraved structure on layer.
4. display module according to claim 1, which is characterized in that the stress-buffer layer light transmission, the peripheral portion
Thickness is different from the thickness of the central part.
5. display module according to claim 1, which is characterized in that the central part of each micro-structure corresponds to single
The pixel setting.
6. display module according to claim 5, which is characterized in that the shape of the central part and the corresponding pixel
Shape matching, the size of the central part are more than or equal to the size of the pixel.
7. display module according to claim 1, which is characterized in that the central part of each micro-structure corresponds to two
Pixel setting described above.
8. display module according to claim 1, which is characterized in that the peripheral portion is around the entire outer of the central part
Week setting or the peripheral portion are set to the central part on the outside of the both ends of first direction.
9. display module according to claim 1, which is characterized in that the stress-buffer layer shows the cover board with described
Show that panel is bonded.
10. a kind of electronic equipment, which is characterized in that including display module described in claim 1 to 9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920694473.4U CN209607739U (en) | 2019-05-15 | 2019-05-15 | Display module and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920694473.4U CN209607739U (en) | 2019-05-15 | 2019-05-15 | Display module and electronic equipment |
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| CN209607739U true CN209607739U (en) | 2019-11-08 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111933664A (en) * | 2020-08-05 | 2020-11-13 | 云谷（固安）科技有限公司 | Flexible display panel |
| WO2023197348A1 (en) * | 2022-04-12 | 2023-10-19 | 武汉华星光电半导体显示技术有限公司 | Display panel |
-
2019
- 2019-05-15 CN CN201920694473.4U patent/CN209607739U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111933664A (en) * | 2020-08-05 | 2020-11-13 | 云谷（固安）科技有限公司 | Flexible display panel |
| WO2023197348A1 (en) * | 2022-04-12 | 2023-10-19 | 武汉华星光电半导体显示技术有限公司 | Display panel |
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| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Yungu (Gu'an) Technology Co., Ltd.|Bazhou Yungu Electronic Technology Co., Ltd.|Kunshan Institute of technology new flat panel display technology center Co., Ltd Assignor: Kunshan Guo Xian Photoelectric Co., Ltd. Contract record no.: X2019990000156 Denomination of utility model: Curved-surface display module and electronic equipment Granted publication date: 20191108 License type: Common License Record date: 20191030 |
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