WO2020175587A1 - Capteur de température et procédé permettant de fabriquer un capteur de température - Google Patents

Capteur de température et procédé permettant de fabriquer un capteur de température Download PDF

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Publication number
WO2020175587A1
WO2020175587A1 PCT/JP2020/007867 JP2020007867W WO2020175587A1 WO 2020175587 A1 WO2020175587 A1 WO 2020175587A1 JP 2020007867 W JP2020007867 W JP 2020007867W WO 2020175587 A1 WO2020175587 A1 WO 2020175587A1
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WO
WIPO (PCT)
Prior art keywords
case
temperature sensor
temperature
base body
base
Prior art date
Application number
PCT/JP2020/007867
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English (en)
Japanese (ja)
Inventor
宏保 山内
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2020175587A1 publication Critical patent/WO2020175587A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient

Definitions

  • the present invention relates to a temperature sensor, and more particularly to a temperature sensor including a temperature detection element, a lead wire connected to the temperature detection element, and a case in which the temperature detection element is housed.
  • the present invention also relates to a method for manufacturing a temperature sensor.
  • Temperature sensing components including a temperature sensing element are widely used for various purposes.
  • the temperature detecting component may be supplied as a series of electronic components, as disclosed in, for example, Patent Document 1 (Japanese Utility Model Laid-Open No. 2-591168).
  • FIG. 9 (8) shows the electronic component series 1100 disclosed in Patent Document 1.
  • FIG. 9 (Mimi) shows the electronic component series 1 200 disclosed in Patent Document 1.
  • Each of the electronic component stations 1100 and 1200 has a plurality of electronic components 1101 each having a main body portion 1031 and a lead wire 101. 02 is fixed by a long holding tape 10 3 having adhesiveness. More specifically, the lead wire 101 of the electronic component 101 is fixed to the mount 1102 by the holding tape 103.
  • a temperature sensor as disclosed in, for example, Patent Document 2 Japanese Patent Laid-Open No. 7-2181439 can be manufactured using the temperature detecting component.
  • FIG. 10 shows a temperature sensor (warm water sensor) 1300 disclosed in Patent Document 2.
  • the temperature sensor 1300 is equipped with a temperature detection element 3001 formed of a thermistor.
  • a pair of lead wires 302 is connected to the temperature sensing element 301.
  • the lead wire 3002 is soldered to the lead wire 3003 which is a covered wire.
  • the temperature detecting element 301 and the lead wire 302 are covered with the resin coat portion 304.
  • 0 2 are housed inside a bottomed cylindrical case 3 05.
  • a filler (resin) 306 is filled in the remaining inside of the bottomed cylindrical case 305.
  • the leader line 300 is extended to the outside of the case 300.
  • Patent Document 1 Japanese Utility Model Publication No. 2-5 9 1 6 8 (Full text specification)
  • Patent Document 2 JP-A 7-2 1 8 3 4 9
  • the temperature sensor 1300 has a problem that the arrangement position of the temperature detecting element 3101 inside the case 3305 is likely to vary among the individuals. That is, when the temperature detecting element 30 1 and the lead wire 30 2 covered with the resin coat portion 304 are housed inside the case 3 05, the lead wire 30 2 bends or the case 3 0 5 The temperature sensing element 3 01 is pushed by the filler 3 0 6 when the filling material 3 0 6 is filled in the inside of the container, and the position of the temperature sensing element 3 0 1 is apt to shift, and the case There was a problem that the arrangement position of the temperature detection element 3 01 inside the 3 0 5 varied. Further, there is a problem that the detection sensitivity varies among the individuals due to the variation in the arrangement position of the temperature detecting element 301 within the case 300 among the individuals.
  • the temperature sensor 1300 has a structure in which the temperature sensing element 3001 is biased to a specific inner wall surface of the case 3505, and the temperature sensor element 3001 is located on the outer wall surface of the case 3505.
  • the detection sensitivity differs depending on the position. For example, there was a case where the detection sensitivity was high on the other side of Case 305 and low on the other side of Case 305. ⁇ 0 2020/175 587 3 (: 170? 2020 /007867 Means for solving problems
  • a temperature sensor as a means thereof includes a temperature detecting element and a temperature detecting element connected to the temperature detecting element.
  • a plurality of temperature detecting components each having a temperature detecting element and a lead wire connected to the temperature detecting element are formed into a plate shape in the lead wire.
  • a step of producing a plurality of temperature sensing components with a substrate in which lead wires are fixed by a holding tape to a substrate having a first side and a second side extending in parallel from the electronic component series,
  • the temperature sensing component with a substrate is housed inside the case, and the step of bringing the first side and the second side of the substrate into contact with the inner surface of the case, respectively.
  • Temperature sensor of the present invention since the temperature sensing element is accurately positioned at a predetermined position inside the case, without variations between individuals, and a detection sensitivity of the average _.
  • the temperature sensor of the present invention can be easily manufactured.
  • FIG. 1 is a perspective view of a temperature sensor according to the first embodiment.
  • FIG. 1 (Mimi) is a perspective sectional view of the temperature sensor according to the first embodiment.
  • FIG. 1 ( ⁇ ) is an exploded perspective view of the temperature sensor according to the first embodiment.
  • Fig. 2 shows the temperature detection component of the temperature sensor according to the first embodiment. ⁇ 0 2020/175 587 4 ⁇ (: 170? 2020 /007867
  • FIG. Figure 2 (Mimi) is an exploded front view of the temperature sensing component.
  • FIG. 3 (eight) is a perspective view of a temperature detecting component with a substrate included in the temperature sensor according to the first embodiment.
  • FIG. 3 (Mimi) is an exploded perspective view showing the temperature detecting component with the substrate housed in the case.
  • FIGS. 4A and 4B are explanatory views showing steps performed in an example of the method for manufacturing the temperature sensor according to the first embodiment.
  • FIG. 5 ( ⁇ ) is a continuation of FIG. 4 (N), and is an explanatory view showing the steps performed in the example of the method for manufacturing the temperature sensor according to the first embodiment.
  • Fig. 6 Fig. 6 (0) and (M) are continuations of Fig. 5 ( ⁇ ), and are explanatory diagrams showing the steps performed in an example of the method for manufacturing the temperature sensor according to the first embodiment. is there.
  • FIG. 7 (eight) is a perspective view of a temperature sensor according to the second embodiment.
  • FIG. 7 (Mimi) is a perspective sectional view of the temperature sensor according to the second embodiment.
  • FIG. 8 (8) is a front view of a temperature detecting component included in the temperature sensor according to the third embodiment.
  • FIG. 8 (Mimi) is an exploded front view of the temperature detecting component included in the temperature sensor according to the third embodiment.
  • FIG. 8 ( ⁇ is a perspective sectional view of the temperature sensor according to the third embodiment.
  • FIG. 9 (eight) is a front view of a series of electronic components disclosed in Patent Document 1.
  • FIG. 9 (Mimi) is a front view of the electronic component series disclosed in Patent Document 1.
  • FIG. 10 is a cross-sectional view of the temperature sensor disclosed in Patent Document 2.
  • FIG. 1 (8) is a perspective view of the temperature sensor according to the first embodiment.
  • FIG. 1 (Mimi) is a perspective sectional view of the temperature sensor according to the first embodiment.
  • Figure 1 (Min) shows the part of Figure 1 (8) indicated by the dashed-dotted arrow.
  • FIG. 1 ( ⁇ ) is an exploded perspective view of the temperature sensor according to the first embodiment.
  • Figure 1 ( ⁇ ) shows the case where case 8 and filler 9 described later are omitted.
  • FIG. 2 (8) is a front view of the temperature detecting component included in the temperature sensor according to the first embodiment.
  • Figure 2 (Mimi) is an exploded front view of the temperature sensing component.
  • Figure 2 (Min) shows the state where the mold resin 5 described later is omitted.
  • FIG. 1 (Mimi) is a perspective sectional view of the temperature sensor according to the first embodiment.
  • Figure 1 (Min) shows the part of Figure 1 (8) indicated by the dashed-dotted arrow.
  • FIG. 1 ( ⁇ ) is an
  • FIG. 3 () is a perspective view of a temperature detecting component with a substrate included in the temperature sensor according to the first embodiment.
  • FIG. 3 (Mimi) is an exploded perspective view showing the temperature detecting component with the substrate housed in the case.
  • Case 8 to be described later is shown in two.
  • FIG. 3 (Mimi) shows a state before the filling material 9 is filled in the case 8 described later.
  • the temperature sensor 100 is shown in Fig. 1 (eight), (m), and (o). Temperature sensor 1
  • the temperature sensing component 1 will be described with reference to Fig. 2 () and (M).
  • the temperature detecting component 1 includes a temperature detecting element 2.
  • the temperature detecting element 2 may be of any type, but in the present embodiment, a 1 ⁇ 1 unit thermistor (negative characteristic thermistor) is used. 1 ⁇ 1 Thermistor can detect the temperature by measuring the resistance value because the resistance value decreases when the temperature rises and the resistance value rises when the temperature decreases.
  • the temperature sensing element 2 has a plate-like shape, and the electrodes 2 are formed on two surfaces facing each other.
  • Lead wires 3 are connected to electrodes 23 by solders 4, respectively.
  • the lead wire 3 is composed of a core wire 3 3 and an insulating coating 3 13.
  • the temperature sensing element 2 to which the lead wire 3 is connected is ⁇ 0 2020/175 587 6 ⁇ (: 170? 2020 /007867
  • the temperature sensing component 1 is configured as described above.
  • a temperature detecting component 50 with a base is configured in which the temperature detecting component 1 is fixed to a plate-shaped base 6. With reference to FIG. 3 (), the temperature detection component 50 with a substrate will be described.
  • paper is used as the material of the base 6.
  • resin or the like may be used for the base 6.
  • the base 6 has a rectangular shape in plan view, and has first sides 6 parallel to each other.
  • the base body 6 includes a third side 6 3 and a fourth side 6 4 which are parallel to each other and extend in a direction perpendicular to the first side 6 1 and the second side 6 2. ..
  • the base 6 has an opening 63 which is a through hole.
  • the opening 6 3 is provided between the first side 6 1 and the second side 6 2 and between the third side 6 3 and the fourth side 6 4.
  • the shape of the opening 63 is arbitrary, but in the present embodiment, it has a rectangular shape in plan view.
  • the temperature detecting component 1 is fixed to the base body 6 by a holding tape 7 having an adhesive property. Specifically, the temperature sensing element 1 is fixed to the base 6 by fixing the lead wire 3 to the base 6 with the holding tape 7 in a state in which the temperature detecting element 2 is arranged in the opening 63. ..
  • the lead wire 3 extends to the third side 63 side of the base 6.
  • the core wire 33 of the lead wire 3 is fixed to the base body 6 by the holding tape 7, but instead of this, the insulation coating 3 sack, or the core wire 3 3 and the insulation coating 3 sack is used. And may be fixed to the base 6 by the holding tape 7.
  • the temperature detecting component 50 with the base body is configured.
  • the temperature detecting component 50 with a substrate is housed in a bottomed cylindrical case 8. More specifically, the temperature sensing component 1 including the temperature sensing element 2 covered with the mold resin 5 is housed in the case 8 together with the base body 6 and the holding tape 7, and the lead wire 3 is provided in the case 8. Extends to the outside ⁇ 0 2020/175 587 7 ⁇ (: 170? 2020 /007867
  • the material and shape of the case 8 are arbitrary.
  • stainless steel was used as the material for the case 8.
  • other metals or resins may be used as the material of Case 8.
  • the outer shape of the case 8 and the inner shape of the inner tubular portion are cylindrical.
  • a polygonal columnar shape or the like may be used.
  • the first side 6 1 and the second side 6 2 of the base body 6 contact the inner surface (inner wall surface) of the case 8, respectively. doing.
  • the fourth side 64 of the base 6 is in contact with the inner surface (inner bottom surface) of the case 8.
  • Fig. 1 As shown in Fig. 1 (Mimi), a case in which the temperature detection component 50 with a substrate is housed.
  • the inside of 8 is filled with filler 9.
  • the material of the filler 9 is arbitrary, but in the present embodiment, a thermosetting epoxy resin is used as the material of the filler 9. However, a silicone resin or the like may be used instead of the epoxy resin.
  • the temperature sensor 100 has the first side 6 of the base 6 when the base-equipped temperature detecting component 50 is housed in the case 8.
  • the first and second sides 62 are in contact with the inner wall surface of the case 8, and the fourth side 64 is in contact with the inner bottom surface of the case 8. Therefore, in the temperature sensor 100, the horizontal movement of the base body 6 in FIG. 3 (Mimi) is restricted by the first side 61, the second side 6 2 and the inner wall surface of the case 8, and The vertical movement in Fig. 3 (Mimi) is restricted by the fourth side 64 and the inner bottom surface of the case 8.
  • the base body 6 is always accurately arranged at a predetermined position inside the case 8 without being varied among individuals.
  • the first side 6 1 and the second side 62 are in contact with the inner wall surface of the case 8 over substantially the entire length thereof, but the first side 6 1 At least a part of each of the second side 62 and the second side 62 may be in contact with the inner wall surface of the case 8.
  • the fourth side 64 is entirely ⁇ 0 2020/175 587 8 ⁇ (: 170? 2020 /007867
  • the fourth side 64 may be in contact with the inner bottom surface of the case 8.
  • the base 6 is always accurately arranged at a predetermined position inside the case 8 without being dispersed between the individual bodies, so that the temperature detection fixed to the base 6 can be performed.
  • the element 2 is also accurately arranged at a predetermined position inside the case 8 without any variation among the individual elements. As a result, the temperature sensor 100 has a uniform detection sensitivity without variation among individuals.
  • the temperature detecting element 2 since the temperature detecting element 2 is arranged and protected in the opening 63 of the base 6, the temperature detecting component 50 with the base is housed in the case 8. At this time, when the filling material 9 is filled in the case 8, the arrangement position of the temperature detection element 2 does not shift. Further, since the lead wire 3 is fixed to the base body 6, when the temperature sensing component 50 with the base body is housed in the case 8 or when the filling material 9 is filled in the case 8, the lead wire 3 is attached. Line 3 never bends.
  • the temperature sensor 100 according to the first embodiment can be manufactured, for example, by the following method.
  • FIG. 4 (8), FIG. 4 (Mi), FIG. 5 ( ⁇ ), FIG. 6 (0), and FIG. 6 (Mi) are respectively implemented in an example of the method for manufacturing the temperature sensor according to the first embodiment. It is explanatory drawing which shows a process.
  • Figure 5 ( ⁇ ) is a continuation of Figure 4 (Mimi).
  • Figure 6 (mouth) is a continuation of Figure 5 ( ⁇ ).
  • an electronic component string 70 is prepared.
  • the electronic component string 70 is provided with a plate-shaped elongated base body 76. Long substrate
  • the material of 7 6 is arbitrary, but in the present embodiment, paper is used as the material of the long substrate 76.
  • the long substrate 76 made of paper is sometimes called a mount.
  • an elongated body 7 6 is provided with a plurality of openings 7 6 3.
  • the 6 is provided with a plurality of feed holes 76 which are used when the long substrate 76 is conveyed by an automatic machine.
  • a plurality of temperature detection components 1 are fixed to the long base body 76. More specifically ⁇ 0 2020/175 587 9 (: 170? 2020/007867
  • each temperature detecting component 1 is fixed to the long base body 76.
  • the long holding tape 77 is also provided with feed holes at positions corresponding to the feed holes 7613 of the long substrate 76.
  • a plurality of temperature detection components with a substrate 50 are produced from the electronic component string 70 by cutting the electronic component string 70.
  • the long base body 76 and the base body 6 are formed, and the long holding tape 77 and the holding tape 7 are formed.
  • the long base (mounting paper) and the long holding tape after the electronic parts are removed are discarded as industrial waste. Since it is not necessary to discard the long holding tape 77, it can be said that this is a temperature sensor manufacturing method that is preferable for the environment.
  • the temperature detecting component 50 with the substrate is housed inside the case 8.
  • the lead wire 3 extends outside the case 8 as shown in Fig. 6 (0).
  • FIG. 7 (8) is a perspective view of the temperature sensor according to the second embodiment.
  • FIG. 7 (Mimi) is a perspective sectional view of the temperature sensor according to the second embodiment.
  • Fig. 7 (Min) shows the part indicated by the alternate long and short dash line arrow in Fig. 7 (eight).
  • FIGS. 7 (8) and (M) show a temperature sensor 200 according to the second embodiment.
  • the temperature sensor 200 changes the shape of the base 6 of the temperature sensor 100, and uses a base 26 of a different shape. ⁇ 0 2020/175 587 10 ⁇ (: 170? 2020 /007867
  • the base 6 was provided with the opening 63, but the base 26 was omitted.
  • the width of the base 26 was smaller than that of the base 6.
  • the base body 26 has a rectangular shape in plan view, and has first sides parallel to each other.
  • the bases 26 are parallel to each other and extend in a direction perpendicular to the first side 2 61 and the second side 2 62, and the third side 2 6 3 and the fourth side 2 6 4 It has and.
  • the temperature sensor 100 includes a temperature detection component 80 with a base, in which the temperature detection component 1 is fixed to the base 26. Specifically, the temperature detecting component 1 is fixed to the base body 26 with a holding tape 7 having an adhesive property. By fixing the lead wire 3 to the base body 26 with the holding tape 7 while the temperature detecting element 2 is arranged on the fourth side 2 6 4 side of the base body 26, the temperature detecting component 1 is attached to the base body 2 6. It is fixed. The lead wire 3 extends to the side of the third side 6 3 of the base body 26.
  • the temperature detecting component 80 with a substrate is housed in a bottomed cylindrical case 8.
  • the first side 2 61 and the second side 2 62 of the substrate 26 are in contact with the inner wall surface of the case 8, respectively. ..
  • the fourth side 2 64 of the base body 26 is not in contact with the inner bottom surface of the case 8.
  • Other configurations of the temperature sensor 200 are the same as those of the temperature sensor 100.
  • the temperature sensor 200 has the first side 2 61 and the second side 2 6 2 of the base 26 when the temperature detecting component 80 with the base is housed in the case 8. Respectively contact the inner wall surface of case 8 and the movement of the base body 26 in the horizontal direction in FIG. 7 (Mimi) is the first side 2 61, the second side 2 6 2 and the inner wall surface of case 8. It is regulated by As a result, in the temperature sensor 200, the base body 26 is always accurately arranged at a predetermined position inside the case 8 without variation among the individual bodies.
  • the base body 26 is always accurately arranged at a predetermined position inside the case 8 without variation among the individual bodies, and thus the base body 26 is ⁇ 0 2020/175 587 1 1 ⁇ (: 170? 2020 /007867
  • the temperature sensing element 2 fixed to 26 is also accurately arranged at a predetermined position inside the case 8 without any variation among the individual cases. Therefore, the temperature sensor 200 has uniform detection sensitivity without variation among individuals.
  • FIG. 8 (8) is a front view of a temperature detecting component included in the temperature sensor according to the third embodiment.
  • FIG. 8 (Mimi) is an exploded front view of the temperature detecting component included in the temperature sensor according to the third embodiment.
  • FIG. 8 (Mimi) shows a state in which the molding resin 35 described later is omitted.
  • Fig. 8 ( ⁇ is a perspective sectional view of the temperature sensor according to the third embodiment.
  • Figs. 8 (8) to ( ⁇ ) show the temperature sensor 300 and the temperature sensor 3 according to the third embodiment.
  • the temperature detection component 3 1 provided in 0 0 is shown.
  • the temperature detecting element 2 has a plate shape, and the electrodes 23 are provided on the two surfaces facing each other.
  • a temperature detection element 32 having a rectangular parallelepiped shape and provided with electrodes 3 23 at two ends facing each other was used.
  • the temperature sensing element 32 is also a thermistor, and has internal electrodes (not shown) inside.
  • the core 3 33 of the lead wire 3 is connected to the electrode 3 23 of the temperature detecting element 32 by the solder 4, respectively. Further, the temperature detecting element 32 to which the lead wire 3 is connected is covered with the molding resin 35. Then, the temperature detecting component 31 is fixed to the base body 6 to form a temperature detecting component 90 with a base body.
  • Other configurations of the temperature sensor 300 are the same as those of the temperature sensor 100.
  • the temperature detection element is not limited to the plate shape like the temperature detection element 2 and may be a rectangular parallelepiped shape like the temperature detection element 32.
  • the temperature sensors 100, 200 according to the first to third embodiments,
  • the temperature detecting elements 2, 3 are provided in the temperature sensors 100, 200, 300.
  • Thermistors can be replaced by other types of thermistors and other types of thermistors. It may be a temperature sensing element.
  • the case 8 has a cylindrical outer shape and the case 8 has a cylindrical shape.
  • the outer shape and the inner shape of the case 8 are arbitrary.
  • the outer shape of the case 8 may be a polygonal prism shape.
  • the temperature sensor according to one embodiment of the present invention is as described in the section “Means for solving the problem”.
  • the inside of the case is filled with a filler.
  • the filling material can protect the temperature sensing element from humidity and external force.
  • the lead wire can be fixed to the substrate by, for example, an adhesive holding tape.
  • the substrate can be, for example, paper or resin.
  • the temperature detecting element is a thermistor.
  • the temperature can be detected by measuring the resistance value of the thermistor.
  • the base has a rectangular shape, and has a third side and a fourth side extending in a direction perpendicular to the first side and the second side, and the base has a thickness direction.
  • the temperature sensing element is located inside the opening when viewed from the thickness direction, the lead wire is pulled out to the third side, and the fourth side contacts the inner surface of the case.
  • the base body is housed in the case in a state of being in contact with each other. In this case, the base body is accurately placed at a predetermined position inside the case.
  • the method of manufacturing the temperature sensor according to the embodiment of the present invention is as described in the section “Means for Solving the Problems”.
  • this temperature sensor manufacturing method it is also preferable to further include a step of filling the inside of the case accommodating the temperature detecting element with a filling material.
  • ⁇ 02020/175587 13 ⁇ (: 170? 2020 /007867
  • the filler can protect the temperature sensing element from humidity and external force.
  • the base has a rectangular shape, and has a third side and a fourth side extending in a direction perpendicular to the first side and the second side, and the base has a thickness direction.
  • the temperature sensing element is located inside the opening when viewed from the thickness direction, the lead wire is pulled out to the third side, and the fourth side of the substrate is It is also preferable that the base body is housed in the case while being in contact with the inner surface. In this case, the base body is accurately placed at a predetermined position inside the case.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Thermistors And Varistors (AREA)

Abstract

La présente invention concerne un capteur de température dans lequel un élément de détection de température est disposé avec précision à une position prescrite à l'intérieur d'un boîtier.　La présente invention comprend : un élément de détection de température (2) ; un fil de connexion (3) qui est relié à l'élément de détection de température (2) ; un substrat (6) qui présente un premier bord (61) et un second bord (62) qui s'étendent parallèlement l'un par rapport à l'autre, le fil de connexion (3) étant fixé au substrat (6) ; et un boîtier (8) qui reçoit l'élément de détection de température (2) et le substrat (6), le premier bord (61) et le second bord (62) venant chacun en butée contre la surface interne du boîtier (8).
PCT/JP2020/007867 2019-02-28 2020-02-26 Capteur de température et procédé permettant de fabriquer un capteur de température WO2020175587A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-037062 2019-02-28
JP2019037062 2019-02-28

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WO2020175587A1 true WO2020175587A1 (fr) 2020-09-03

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07218349A (ja) * 1994-01-31 1995-08-18 Ooizumi Seisakusho:Kk 温水センサ
JP2566039Y2 (ja) * 1991-11-01 1998-03-25 ナイルス部品株式会社 温度センサの構造
JPH10208906A (ja) * 1997-01-27 1998-08-07 Murata Mfg Co Ltd 温度センサ
JP2012112808A (ja) * 2010-11-25 2012-06-14 Semitec Corp 温度センサ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2566039Y2 (ja) * 1991-11-01 1998-03-25 ナイルス部品株式会社 温度センサの構造
JPH07218349A (ja) * 1994-01-31 1995-08-18 Ooizumi Seisakusho:Kk 温水センサ
JPH10208906A (ja) * 1997-01-27 1998-08-07 Murata Mfg Co Ltd 温度センサ
JP2012112808A (ja) * 2010-11-25 2012-06-14 Semitec Corp 温度センサ

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