US20050116801A1 - Sensor coil and method of manufacturing same - Google Patents
Sensor coil and method of manufacturing same Download PDFInfo
- Publication number
- US20050116801A1 US20050116801A1 US10/792,616 US79261604A US2005116801A1 US 20050116801 A1 US20050116801 A1 US 20050116801A1 US 79261604 A US79261604 A US 79261604A US 2005116801 A1 US2005116801 A1 US 2005116801A1
- Authority
- US
- United States
- Prior art keywords
- amorphous metal
- wire
- electronic component
- component according
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000005300 metallic glass Substances 0.000 claims abstract description 44
- 238000004804 winding Methods 0.000 claims abstract description 37
- 125000006850 spacer group Chemical group 0.000 claims abstract description 31
- 239000004033 plastic Substances 0.000 claims abstract description 12
- 239000000919 ceramic Substances 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims description 25
- 238000000576 coating method Methods 0.000 claims description 25
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000002313 adhesive film Substances 0.000 claims 1
- 230000000007 visual effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 15
- 230000035699 permeability Effects 0.000 abstract description 12
- 239000000696 magnetic material Substances 0.000 abstract description 6
- 239000004020 conductor Substances 0.000 abstract description 5
- 229910000859 α-Fe Inorganic materials 0.000 abstract description 4
- 229910045601 alloy Inorganic materials 0.000 abstract description 3
- 239000000956 alloy Substances 0.000 abstract description 3
- 239000011162 core material Substances 0.000 description 57
- 239000010408 film Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 7
- 230000001939 inductive effect Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 241000272184 Falconiformes Species 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012019 product validation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/20—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature
- G01D5/2006—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature by influencing the self-induction of one or more coils
- G01D5/2013—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature by influencing the self-induction of one or more coils by a movable ferromagnetic element, e.g. a core
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/028—Electrodynamic magnetometers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/045—Fixed inductances of the signal type with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/043—Fixed inductances of the signal type with magnetic core with two, usually identical or nearly identical parts enclosing completely the coil (pot cores)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/324—Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
An electronic component in accordance with the invention includes a body, such as a base, having a high magnetic permeability material applied to an external surface thereof and a wire winding wound about at least a portion of the high magnetic permeability material. In a preferred form, the body is made of a non-conducting material, such as ceramic or plastic, and the high magnetic permeability material is made of a magnetic material such as ferrite or a metallic glass alloy (i.e., an amorphous metal). The component further includes a spacer for separating the wire winding from the high magnetic permeability material in order to prevent the amorphous metal from damaging the wire winding. The resulting electronic component is capable of sensing magnetic fields and may be used in a variety of circuits such as compasses and magnetometers.
Description
- This invention relates generally to electronic components and more particularly concerns low profile surface mountable sensing coils having a structure that improves the manufacturability and performance of the component.
- The electronics industry provides a variety of wire wound components such as inductors which come in a variety of package types and configurations. For example, inductors may be provided in toroid, solenoidal, drum or sling-type packaging and in through-hole or surface mount configurations.
- Of these coil components, some are used as sensors for detecting magnetic fields and rely on the use of highly permeable materials to detect the presence of such fields. For example, in U.S. Pat. No. 4,851,775, issued Jul. 25, 1989 to Kim et al., a digital compass and magnetometer are disclosed which use a solenoidal sensor coil having a wire-wound bobbin with an amorphous metal having a high magnetic permeability inserted therein for detecting magnetic fields. Improvements on these compass and magnetometer designs, as well as new applications for such sensor coils, are disclosed in U.S. Pat. No. 5,239,264, issued Aug. 24, 1993 to Hawks; U.S. Pat. No. 5,642,046, issued Jun. 24, 1997 to Hawks; U.S. Pat. No. 5,744,956, issued Apr. 28, 1998 to Hawks; U.S. Pat. No. 6,084,406, issued Jul. 4, 2000 to James et al.; and U.S. Pat. No. 6,243,660, issued June 5, 2001. All of the above-mentioned patents are hereby incorporated herein by reference.
- Although many advances have been made in the application of such sensor coils, most (if not all) of the available components continue to use a coil component configuration wherein the highly permeable amorphous metal layer is inserted into a plastic bobbin. The reason for this is that amorphous metals are extremely sharp and must therefore be prevented from rubbing against the wire windings. For example, if the wire winding is placed directly on the amorphous metal, the amorphous metal will eventually cut through the outer insulation of the wire and cause the component to short. In extreme cases, the amorphous metal may even cut the wire of the component causing the component to open (or operate as an open circuit).
- To avoid such problems, the amorphous metal has traditionally been inserted into a plastic bobbin to isolate the amorphous metal from the wire winding. For example, in FIG. 1 of U.S. Pat. No. 6,084,406, a traditional sensor coil is disclosed in which plastic bobbin 13 isolates an elongated core of high dc permeability material 17 from electrically conductive wire 15. In another traditional coil sensor structure, a slot is provided in the bobbin for receiving the amorphous metal; however, in this configuration the amorphous metal is able to slide out of the slot and make contact with the wire winding hindering the use and marketability of this design.
- Another example of a traditional coil sensor is illustrated in FIGS. 5A-F herein, and is identified generally by
reference numeral 10. Thecoil sensor 10 includes abobbin 12 having first andsecond bobbin portions post members 14 a and post receivingrecesses 14 b. Anamorphous metal 16 is sandwiched between the first andsecond bobbin portions 12 a-b in order to isolate theamorphous metal 16 from the wire winding 18 which is wound about the interconnectedbobbin 12. - One problem associated with the use of the above-mentioned sensor coil structures is the large gap that is created between the amorphous metal and the wire winding. More particularly, the gap created between the amorphous metal and the wire winding requires the winding to have many more turns in order to achieve the desired sensitivity for detecting magnetic fields. In other words, the larger the gap, the more turns the wire winding must have. Thus, the gap present in existing structures hinders the ability to make smaller and more efficient sensor coils with fewer number of turns.
- Another problem associated with existing sensor coil structures is that it is difficult (if not impossible) to automate the assembly of such structures. More particularly, the necessity of inserting the amorphous metal into a bobbin to isolate it from the wire winding requires hand assembly of at least a portion of the component. This increases the amount of time and cost it takes to produce sensor coils and reduces the accuracy with which such components can be mass produced.
- Accordingly, it has been determined that the need exists for an improved wire wound component and method for manufacturing the same which overcome the aforementioned limitations and which further provide capabilities, features and functions, not available in current devices and methods for manufacturing.
-
FIG. 1A is a side elevational view of a coil component embodying features of the present invention; -
FIG. 1B is an end view of the component ofFIG. 1A ; -
FIG. 1C is a plan view of the component ofFIG. 1A ; -
FIG. 1D is a cross-sectional view of the component ofFIG. 1A taken along lines D-D inFIG. 1C ; -
FIG. 1E is an blown-up view of the portion of the component identified as E inFIG. 1D ; -
FIG. 2A is a side elevational view of an alternate coil component embodying features of the present invention; -
FIG. 2B is an end view of the component ofFIG. 2A ; -
FIG. 2C is a plan view of the component ofFIG. 2A ; -
FIG. 2D is a cross-sectional view of the component ofFIG. 2A taken along lines D-D inFIG. 2C ; -
FIG. 2E is an blown-up view of the portion of the component identified as E inFIG. 2D ; -
FIG. 3 is a cross-sectional view of an alternate coil component embodying features of the present invention illustrating a similar component to that of FIGS. 2A-E and taken along a similar line to that of D-D inFIG. 2C ; -
FIG. 4 is a block diagram illustrating a magnetic sensor using a sensing coil embodying features of the present invention; -
FIG. 5A is a side elevational view of a portion of a traditional sensor coil showing the lower portion of a plastic bobbin with an amorphous metal exploded therefrom; -
FIG. 5B is a plan view of the component ofFIG. 5A , showing the amorphous metal positioned between the posts of the lower portion of the plastic bobbin; -
FIG. 5C is a side elevational view of the component ofFIG. 5A showing the upper portion of the plastic bobbin exploded therefrom; -
FIG. 5D is a side elevational view of the component ofFIG. 5C showing the upper and lower portions of the bobbin interconnected with one another; -
FIG. 5E is a plan view of the component ofFIG. 5D showing the interconnected bobbin portions; and -
FIG. 5F is a perspective view of the component ofFIG. 5D showing wire wound around the interconnected bobbin portions. - An electronic component in accordance with the invention includes a body, such as a base, having a high magnetic permeability material applied to an external surface thereof and a wire winding wound about at least a portion of the high magnetic permeability material. In a preferred form, the body is made of a non-conducting material, such as ceramic or plastic, and the high magnetic permeability material is made of a magnetic material such as ferrite or a metallic glass alloy (i.e., an amorphous metal). The component further includes a spacer for separating the wire winding from the high magnetic permeability material in order to prevent the amorphous metal from damaging the wire winding. The resulting electronic component is capable of sensing magnetic fields and may be used in a variety of circuits such as compasses and magnetometers.
- Turning first to FIGS. 1A-E, there is illustrated a wire wound
inductive component 20 embodying features of the present invention. In the embodiment illustrated, theinductive component 20 is configured in a surface mount package for mounting on a PCB, which is, for convenience, described herein as it would be positioned on the upper surface of a PCB. For purposes of clarity, portions of the illustrations in FIGS. 1A-C are transparent in order to show the various parts of thecomponent 20. However, in actuality these parts of thecomponent 20 will likely be substantially or totally opaque. - The
inductive component 20 includes a body, such asbase 22, made of an insulating material, such as a non-conductive plastic or ceramic. Thebody 22 has a polygonal shape, such as a rectangle, and has first and second ends 22 a and 22 b, respectively, with anelongated portion 22 c extending therebetween. The ends 22 a-b andelongated portion 22 c have upper surfaces which collectively form a smooth planer top surface. - In the illustrated embodiment, a pair of supports, such as
legs body 22 and have metalized pads (e.g., soldering pads) located at the bottom thereof. The metalizedpads 26 are made of a conductive material and are fused or bonded to the base 22 so that thecomponent 20 may be electrically and mechanically attached to corresponding lands or traces located on the PCB via solder. More particularly, the metalizedpads 26 provide an electrically conductive surface to which the solder paste printed on the PCB can bond once thecomponent 20 and PCB are passed through a reflow oven. As is depicted inFIG. 1 , eachsoldering pad 26 is generally flat and covers at least a portion of the bottom surface of the associatedleg - In alternate embodiments, the
pads 26 may cover at least a portion of the bottom and side surfaces of thelegs 22 d-e (e.g., L-shaped solder pads) in order to increases the surface area of the metalizedpads 26, thereby strengthening the coupling between the metalizedpads 26 andbase 22, and between the metalizedpads 26 and corresponding lands on the PCB. In other embodiments, U-shaped pads may be used which may extend across the lower surface and sides oflegs 22 d-e. Such pads provide even more surface area and connection strength between the base 22,pads 26, and corresponding PCB lands. In yet other embodiments, thecomponent 20 may be designed without legs extending from theends 22 a-b of thebase 22. Thus, with this configuration the bottom surfaces ofends 22 a-b andelongated portion 22 c may collectively form a generally planar bottom surface with thepads 26 being connected directly to the bottom surface ofends 22 a-b. - The
inductive component 20 further includes a core 28, which is preferably made of a magnetic material having a high magnetic permeability, such as a metallic glass alloy or amorphous metal. In alternate embodiments, however, it should be understood that other magnetic materials, such as ferrite, may be used as thecore 28. In the illustrated embodiment of FIGS. 1A-E, thecore 28 has a thin and generally rectangular structure such as a foil and has a tape backing to strengthen, stiffen or provide shape to thefoil core 28 so that it can be worked with and installed more easily. - In order to avoid some of the problems associated with traditional sensor coils, the
core 28 is applied to the generally flat upper surface of the base 22 formed byends 22 a-b andelongate member 22 c and is preferably held in place via an adhesive such as glue, laminate or tape. This allows thecomponent 20 to be manufactured more easily and with an automated process because thecore 28 does not have to be inserted into the base 22 or any other external structure. Rather the core 28 is applied to an exterior surface of the base 22 which can be done more easily and via automated processes. - The
inductive component 10 also includes a wire winding 30 which is wound about at least a portion of thecore 28 and a portion of thebase 22. In order to avoid other problems associated with traditional sensor coils, thecore 28 is isolated from the wire winding 30 via aspacer 24. In the embodiment illustrated in FIGS. 1A-E, thespacer 24 includes a coating which encapsulates at least a portion of thecore 28 and prevents this portion from coming into contact with the wire winding 30. Although the adhesive located on the upper surface of the core 28 could serve as thespacer 24, in a preferred embodiment, an insulating material such as a high temperature and flexible urethane is applied over the core 28 to isolate the core 28 from the wire winding 30. - More particularly, in some applications, the adhesive layer located on the upper surface of the
core 28 shrinks due to its exposure to high temperatures. The shrinking of this adhesive layer can expose the wire winding 30 to the sharp edges of thecore 28 and can therefore risk damaging the winding 30. Thus, by using a hightemperature urethane coating 24, the possible shrinking of the adhesive layer located on the upper surface of the core 28 can be accounted for and can ensure that thespacer 24 continues to properly isolate the core 28 from the winding 30. High temperature urethanes are preferred because of their ability to withstand the extreme temperatures the component is exposed to, such as bonding and reflow oven temperatures, during product testing (e.g., product validation testing), and during operation of the component during its regular use (e.g., automotive temperature ranges). Adhesives are often incapable of withstanding such temperatures without experiencing some form of thermal stress (e.g., thermal expansion or contraction). Although, the adhesive layer located on top of thecore 28 makes the core material easier to work with and apply, it should be understood that the presence of the adhesive is not essential and thecomponent 20 can be constructed without this layer if need be. - In a preferred embodiment, the
urethane coating 24 is applied uniformly over the upper surface of thecore 28 and is of minimal height in order to minimize the amount of distance or gap between the core 28 and the wire winding 30. By providing a thin film ofcoating 24 and reducing the gap betweencore 28 and wire winding 30, thecomponent 20 requires fewer turns ofwire 30 in order to reach the same level of sensitivity as conventional sensor coils. Thus, thecomponent 20 is capable of being produced in a smaller, more low profile package. It should be understood however that additional windings may be added to achieve a desired component performance and/or component size. - In a preferred embodiment, the
wire 30 is an insulated wire such as a forty-four gauge copper wire having ends 30 a and 30 b connected to the bottom of the metalizedpads 26. The insulation prevents the turns of the wire winding 30 from shorting out and ensures current will pass through the wire and around thecore 28 in order to achieve the desired inductive effect. In the embodiment illustrated, the insulation ofwire 30 includes a nonconductive nylon coating. It should be understood, however, that any conductive material may be used for thewire 30 and that the wire size may be selected from a variety of wire gauges. For example, a preferred component may use wire ranging from thirty-four gauge wire to forty-eight gauge wire, while alternate components may use different wire gauge ranges. It should also be understood that any insulating or non-conducting material may be used for the wire coating, not just nylon. - The ends of the
wire 30 a-b are preferably flattened (not shown) and bonded to the metalizedpads 26 in order to minimize the amount of space between the lower surface of the metalizedpads 26 and the upper surface of the corresponding PCB lands. This helps maintain the low profile of thecomponent 20 and also helps ensure that the component will remain co-planar when positioned on the PCB so that thepads 26 and wire ends 30 a-b will make sufficient contact with the solder on the PCB and make solid electrical and mechanical connections to the circuit on the PCB. - In alternate embodiments, the wire ends 30 a-b may be connected to the outer side surfaces of L-shaped metalized pads, or inner or outer side surfaces of U-shaped metalized pads, in order to avoid disrupting the flat bottom surface of
pads 26 and in order to avoid increasing the height of thecomponent 20 and/or creating a gap between any portion of thepads 26 and the corresponding PCB lands. In yet other embodiments, notches or dimples may be present in the lower surfaces of thelegs 22 d-e and/orpads 26 in order to provide a designated location for the wire ends 20 a-b to be bonded to thepads 26 without raising the height of thecomponent 20 or creating an excessive gap between thepads 26 and corresponding PCB lands. - Once the
wire 30 is wound about theelongated portion 22 c andcore 28, acover 32 is applied over at least a portion of the upper most surface of thewire 30. In a preferred embodiment, thecover 32 may comprise an overmolding, a film or a cap, and is provided to form a generally flat upper surface with which thecomponent 20 may be picked and placed using traditional pick-and-place equipment, (e.g., vacuum or suction pick-and-place machines). In a preferred embodiment, thecover 32 is made of a non-conductive material and may also provide a surface upon which the component manufacturer may print indicia such as product numbers, trademarks, and other desirable information. In the embodiment illustrated in FIGS. 1A-E, thecover 32 is also a high temperature urethane coating which forms an overmolding over a portion of thewire 30 and thespacer coating 24. It should be understood that in alternate embodiments, thecover 32 may be a film similar to that which will be discussed with respect to FIGS. 2A-E or a plastic cap inserted onto the component. - In a preferred embodiment, the pieces of the
inductive component 20, are assembled by attaching metalized pads to thebase 22, applying thecore material 28 to an external surface of thebase 22, attaching aspacer 24 to an external upper surface of the core 28, wrappingwire 30 about at least a portion of thebase 22 andcore 28, and attaching acover 32 over a portion of thecomponent 20 to form a generally flat upper surface thereon. - In the embodiment illustrated, the metalized
pads 26 are attached to thebase 22 via a thick film metalization process and thecore material 28 is applied to the external surface of thebase 22 via an adhesive. Thecore 28 extends over at least a majority of the upper surface of thebase 22 and is preferably applied in a thin uniform layer. Thespacer coating 24 is molded onto thebase 22 andcore 28 and extends along the upper surface thereof and over a portion of the external side surfaces of theends 22 a-b ofbase 22. Thenwire 30 is wound about a portion of thecore 28 and thebase 22 and the wire ends 30 a-b are bonded to metalizedpads 26. More particularly,wire 30 is wound about theelongated portion 22 c ofbase 22 and the core material positioned thereon, and theends 30 a-b are bonded to thepads 26 located on the bottom surfaces oflegs 22 d-e, respectively. Lastly, thecover 32 is applied to the component via a molding process. The overmolded cover 32 (or overmolding) extends along the upper surfaces of thewire 30 and thespacer coating 24, and over the portion of thespacer coating 24 which extends over the external side surfaces ofends 22 a-b. With this configuration, thecomponent 20 overcomes the aforesaid problems associated with traditional sensor coils and provides an electronic component which can be efficiently manufactured and mass produced. - Turning now to FIGS. 2A-E, there is illustrated an alternate embodiment of the
component 20 embodying features in accordance with the present invention. In this embodiment, a differently shaped base is used in connection with thecomponent 20. For convenience, features of alternate embodiments illustrated in FIGS. 2A-E that correspond to features already discussed with respect to the embodiments of FIGS. 1A-E are identified using the same reference numeral in combination with an apostrophe or prime notation (′) merely to distinguish one embodiment form the other, but otherwise such features are similar. - The alternate embodiment of
component 20, (hereinaftercomponent 20′), includes a body such abase 22′ which is made of an insulating material, such as a non-conductive plastic or ceramic. Likebase 22 above,base 22′ has a polygonal shape, such as a rectangle, and has first and second ends 22 a′ and 22 b′, respectively, with anelongated portion 22 c′ extending therebetween. However,base 22′ has a general I-shape configuration with theends 22 a′-b′ forming opposed flanged ends of the base 22′. Whereasbase 22 discussed above has a general C-shape configuration which may be of a higher profile. - In a preferred embodiment, the ends 22 a′-b′ of
body 22′ definerecesses 22 f′ and 22 g′ to which metalizedpads 26′ are connected for electrically and mechanically attaching thecomponent 22′ to corresponding lands on a PCB. More particularly,body 22′ defines generallyrectangular recesses 22 f′-g′ which extend into and wrap about the upper, side and bottom external surfaces of the base 22′. Preferably, the metalizedpads 26′ are in the form of clips which, in the embodiment illustrated, are capable of frictionally engaging at least a portion of therecesses 22 f′-g′ so as to secure the metalizedpads 26′ thereto. The portion of clip recesses 22 f′ and 22 g′ which is defined on the lower surfaces of the base 22′ is tapered or angled in order to allow theclip 26′ to secure itself onto the base 22′. In other words, ends 22 a′-b′ ofbase 22′ form tenons which are inserted into mortises defined by the metalizedpads 26′. The lower surfaces of the tenons are angled to form a flanged surface to prevent theclip 26′ from unintentionally being removed. - It should be understood, however, that the metalized
pads 26′ may be secured to the base 22′ in a variety of other ways, such as by gluing, using a ball and detent system, or providing a tooth or teeth members to secure thepad 26′ to the base 22′. Moreover, in alternate embodiments, the base 22′ may not haverecesses 22 f′-g′ and the metalizedpads 26′ may be clipped on to the external surfaces of theends 22 a′-b′ or may be attached to the base in a manner similar to that discussed above with respect tocomponent 20, (e.g., using flat, L-shaped or U-shaped soldering pads). - In FIGS. 2A-E, the ends 22 a′-b′ further define
recesses 22h′ and 22i′ which are generally rectangular in shape and have inner surfaces which are generally flush with the upper surface of theelongated portion 22 c′ ofbase 22′. Thus, the upper surface ofelongated portion 22 c′ and recesses 22 h′-i′ collectively form a generally planar exterior surface of the base 22′. - The
component 20′ further includes a core 28′ which is preferably made of a magnetic material having a high magnetic permeability such as an amorphous metal. As discussed above with respect tocomponent 22, however, it should be understood that other magnetic materials such as ferrite may also be used forcore 28′. In the illustrated embodiment in FIGS. 2A-E, the core 28′ is preferably rectangular in shape and configured so that it may be applied to the generally planar exterior surface defined byelongated portion 22 c′ and recesses 22 h′-j′. This allows the component to be manufactured more easily and with an automated process. - A
spacer 24′ is attached to the core 28′ in order to isolate the core 28′ fromwire 30′ which is wound about at least a portion of the base 22′ andcore 28′. In a preferred embodiment, thespacer 24′ comprises a high temperature, flexible urethane coating which may be attached to the base 22′ andcore 28′ in a manner similar to that discussed above with respect tocomponent 22. Unlikecomponent 22, however, thespacer coating 24 illustrated in the embodiment of FIGS. 2A-E does not extend over the entire external upper surfaces of the core 28′ andbase 22′ and does not wrap around the sides of the base ends 22 a′-b′. Rather, in this embodiment, thecoating 24′ is only attached to the portion of the core 28′ which is directly below the windings ofwire 30′. This configuration reduces the amount of materials needed and the amount of time it takes to apply such materials. In other embodiments, thecoating 24′ may be attached to the entire upper surface ofcore 28′ if desired. - The
coating 24′ is preferably applied in a uniform and thin manner, such as a foil, in order to minimize the gap created between the core 28′ andwire 30′. Thus, thecomponent 22′ is also capable of being produced in a smaller, low profile package and is capable of reaching better sensitivity levels with less windings as compared to traditional sensor coils. - After the
spacer 24′ is attached to thecomponent 22′,wire 30′ is wound about theelongated portion 22 c′ andcore 28′ and itsends 30 a′-b′ are connected to the metalizedpads 26′. As discussed above, the wire ends 30 a′-b′ may be connected to any of the surfaces of the metalizedpads 26′ and are preferably flattened and bonded to the lower surface thereof to ensure optimal connection between thewire 30′ and PCB circuit via solder. As mentioned above, thewire 30′ may be selected from a variety of different gauge wires having appropriate insulation to prevent thecomponent 22′ from shorting out. - Once the
wire 30′ is wound about theelongated portion 22 c′ andcore 28′, acover 32′ is applied over at least a portion of the upper most surface of thewire 30′. Unlike thecomponent 20, thecover 32′ used in the illustrated embodiment of FIGS. 2A-E is a film rather than a coating. More particularly, in apreferred embodiment film 32′ is a fibrous material having an adhesive layer and may be positioned over the top ofbase 22′,core 28′ and/or winding 30′. Once attached to thecomponent 20′, thefilm 32′ provides a generally flat or planar top surface with which the component may be picked up out of a tape-and-reel packaging and placed on a PCB using industry standard pick-and-place equipment. - In one form,
film 32′ may have an adhesive layer on the bottom and a printable layer on the top. Thus, in addition to providing thecomponent 20′ with a generally flat upper surface, thefilm 32′ provides the component manufacturer with a surface for printing indicia such as product numbers, trademarks, and other desirable information. In a preferred embodiment,film 32′ may be a polyimide film, a polyetheretherketone (PEEK) film, a liquid crystal polymer (LCP) film or the like. This component configuration allows thecomponent 20′ to be manufacture more efficiently and in a manner that avoids the aforesaid problems associated with conventional sensor coils. - It should be understood, however, that in alternate forms the
film 32′ may be cut to different shapes and sizes. For example, in an alternate embodiment thefilm 32′ may extend over the entire upper surfaces of thewire 30′, the base ends 22 a′-b′, and the metalizedpads 26′. Alternatively, in other embodiments, thefilm 32′ may cover only a portion of the upper surface of thewire 30′. Furthermore, as mentioned above, thecover 32′ may alternatively be a cap or a coating instead of a film. - In
FIG. 3 , there is illustrated yet another embodiment of thecomponent 20′ embodying features in accordance with the present invention. In this embodiment, thespacer 24′ comprises a wall or pair of walls extending upward from the upper surface of the base 22′ (hereinafterspacer wall 22 j′) instead of a coating as discussed above. More particularly, in the embodiment shown, the spacer includesspacer walls 22 j′ extending up from opposite sides of theelongated portion 22 c′ ofbase 22′. Thewalls 22 j′ extend along the outer edge or partial perimeter of the upper surface of theelongated portion 22 c′ and support and prevent the windings ofwire 30′ from coming into contact with the core 28′. It should be understood, however, that in alternate embodiments a single wall or a plurality of walls or posts may be provided in place of the spacer walls illustrated. - As discussed above with respect to
component 20′, the core 28′ is applied to the generally flat or planar surface located between thewalls 22 j′ and defined by the upper surface of theelongated portion 22 c′ and therecesses 22 h′-i′. Thus,walls 22 j′ form a spanning structure which isolates the core 28′ from thewire 30′ by creating an air gap therebetween. In a preferred embodiment, the height ofspacer walls 22 j′ is set at the minimal amount needed in order to prevent the core 28′ andwire 30′ from contacting one another. This minimizes the air gap between the core 28′ andwire 30′ and allows the component to operate more efficiently with fewer windings. Thus, this configuration also allows thecomponent 20′ to overcome the problems set forth above with respect to traditional sensor coils. Another advantage to this configuration is that it uses existing materials for thespacer 24′ rather than requiring additional materials to be applied to thecomponent 20′. By eliminating the need for this material, thecomponent 20′ may be manufactured faster and at less cost. - In the embodiments illustrated in FIGS. 2A-E and 3, the metalized
pads 26′ are attached to the base 22′ via a thick film metalization process and thecore material 28′ is applied to the external surface of the base 22′ via an adhesive. The core extends over at least a majority of the upper surface of the base 22′ and is preferably applied in a thin uniform layer. If thespacer 24′ is a coating as illustrated in FIGS. 2A-E, the spacer coating may be molded onto the base 28′ and extends along the upper external surface of the core 28′. If thespacer 24′ is a wall, such asspacer wall 22 j′ inFIG. 3 , no additional steps are likely to be needed in order to apply thespacer 24′ to thecomponent 20′ as it will likely be an integral part of the base 22′. Thenwire 30 is wound about at least a portion of the core 28′ and the base 22′, and the wire ends 30 a′-b′ are bonded to metalizedpads 26′. More particularly,wire 30′ is wound about theelongated portion 22 c′ ofbase 22′ and the core material positioned thereon, and theends 30 a′-b′ are bonded to the portion of thepads 26′ located below the base 22′. Lastly, cover 32′ is applied to the component. In a preferred embodiment, thefilm 32′ is a film having an adhesive layer with which the film may be attached to thecomponent 20′. With this configuration, thecomponent 20′ overcomes the aforesaid problems associated with traditional sensor coils and provides an electronic component which can be efficiently manufactured and mass produced. - In a preferred embodiment, the
components components - The electronic component disclosed herein may be used in a variety of applications including those requiring the detection or sensing of magnetic fields. As illustrated in
FIG. 4 , theelectronic components component - Thus, in accordance with the present invention, a wire wound component is provided that fully satisfies the objects, aims, and advantages set forth above. While the invention has been described in conjunction with specific embodiments thereof, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations as fall within the spirit and broad scope of the appended claims.
Claims (18)
1. An electronic component for sensing magnetic fields comprising:
a body having first and second ends with an elongated portion extending therebetween;
an amorphous metal connected to an external surface of the elongated portion of the body;
a wire winding wrapped about at least a portion of the amorphous metal; and
a spacer for separating the wire from the amorphous metal in order to prevent the amorphous metal from damaging the wire.
2. An electronic component according to claim 1 wherein the spacer comprises a coating extending over an external surface of the amorphous metal for isolating the amorphous metal from the wire.
3. An electronic component according to claim 2 wherein the coating is a high temperature and flexible urethane.
4. An electronic component according to claim 2 wherein the coating is connected to the external surface of the amorphous metal via an adhesive.
5. An electronic component according to claim 2 further comprising an overnolding covering at least a portion of the wire winding and providing a generally flat surface to assist in positioning of the component on a printed circuit board (PCB).
6. An electronic component according to claim 5 wherein the overmolding comprises at least one of a high temperature urethane and an adhesive film.
7. An electronic component according to claim 1 wherein the body comprises at least one of a ceramic and a plastic.
8. An electronic component according to claim 2 wherein the ends of the body extend downward from the elongated portion and have metalized pads connected to a portion thereof for electrically and mechanically attaching the component to a PCB.
9. An electronic component according to claim 7 wherein the elongated portion and ends of the body form an external upper surface and the coating extends over at least a portion of the external upper surface and down external side portions of the ends.
10. An electronic component according to claim 2 wherein the ends of the body define generally rectangular recesses wherein the elongated portion and the recesses form a generally planar surface upon which the amorphous metal is positioned.
11. An electronic component according to claim 10 wherein the ends of the body further define a second set of recesses to which metalized pads are connected for electrically and mechanically attaching the component to a PCB.
12. An electronic component according to claim 11 wherein metalized pads are in the form of clips capable of frictionally engaging at least a portion of the second set of recesses defined by the ends of the body.
13. An electronic component according to claim 1 wherein the spacer comprises a pair of wall members extending from the elongated portion of the body for supporting at least a portion of the wire winding and creating an air gap between the amorphous metal and the wire winding.
14. An electronic component according to claim 13 wherein the ends of the body define generally rectangular recesses wherein the elongated portion located between the pair of wall members and the recesses form a generally planar surface upon which the amorphous metal is positioned.
15. An electronic component according to claim 14 wherein the ends of the body further define a second set of recesses to which metalized pads are connected for electrically and mechanically attaching the component to a PCB.
16. An electronic component according to claim 15 wherein metalized pads are in the form of clips capable of frictionally engaging at least a portion of the second set of recesses defined by the ends of the body.
17. A method of manufacturing an electronic component comprising the steps of:
providing a base, an amorphous metal, and a wire;
applying the amorphous metal to an external surface of the base;
wrapping the wire about at least a portion of the amorphous metal; and
isolating the amorphous metal from the wire in order to prevent the amorphous metal from damaging the wire.
18. A magnetic sensor comprising:
sensing circuitry for detecting magnetic fields and providing sensor data associated therewith, the sensing circuitry having a sensing coil comprising
a body having first and second ends with an elongated portion extending therebetween;
an amorphous metal connected to an external surface of the elongated portion of the body;
a wire winding wrapped about at least a portion of the amorphous metal; and
a spacer for separating the wire from the amorphous metal in order to prevent the amorphous metal from damaging the wire;
a controller connected to the sensing circuitry and capable of operating the sensing circuitry and processing the sensor data received therefrom and being further capable of outputting controller data corresponding to the processed data; and
a display connected to the controller for providing visual data corresponding to the controller data received therefrom.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/792,616 US20050116801A1 (en) | 2003-03-07 | 2004-03-03 | Sensor coil and method of manufacturing same |
US12/019,359 US7639109B2 (en) | 2003-03-07 | 2008-01-24 | Sensor coil and method of manufacturing same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US45269703P | 2003-03-07 | 2003-03-07 | |
US10/792,616 US20050116801A1 (en) | 2003-03-07 | 2004-03-03 | Sensor coil and method of manufacturing same |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/019,359 Continuation US7639109B2 (en) | 2003-03-07 | 2008-01-24 | Sensor coil and method of manufacturing same |
Publications (1)
Publication Number | Publication Date |
---|---|
US20050116801A1 true US20050116801A1 (en) | 2005-06-02 |
Family
ID=32990670
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/792,616 Abandoned US20050116801A1 (en) | 2003-03-07 | 2004-03-03 | Sensor coil and method of manufacturing same |
US12/019,359 Expired - Fee Related US7639109B2 (en) | 2003-03-07 | 2008-01-24 | Sensor coil and method of manufacturing same |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/019,359 Expired - Fee Related US7639109B2 (en) | 2003-03-07 | 2008-01-24 | Sensor coil and method of manufacturing same |
Country Status (2)
Country | Link |
---|---|
US (2) | US20050116801A1 (en) |
WO (1) | WO2004082341A2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050258926A1 (en) * | 2004-05-21 | 2005-11-24 | Robert Weger | Coil arrangement and method for its manufacture |
US20070041162A1 (en) * | 2005-08-19 | 2007-02-22 | Sedio Stephen M | An Integrated Electronic Assembly And Method For Conserving Space In A Circuit |
US20070040645A1 (en) * | 2005-08-19 | 2007-02-22 | Sedio Stephen M | Transformer And Method Of Winding Same |
US20090258511A1 (en) * | 2008-04-14 | 2009-10-15 | Lockheed Martin Corporation | Printed wiring board solder pad arrangement |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5101662B2 (en) * | 2010-06-17 | 2012-12-19 | 東光株式会社 | Coil parts and manufacturing method thereof |
DE102012224101A1 (en) * | 2012-12-20 | 2014-06-26 | Continental Teves Ag & Co. Ohg | Method of manufacturing a sensor |
WO2024041965A1 (en) | 2022-08-23 | 2024-02-29 | Sicpa Holding Sa | Security ink composition and machine-readable security feature derived therefrom |
Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3899834A (en) * | 1972-10-02 | 1975-08-19 | Westinghouse Electric Corp | Electronic compass system |
US3946691A (en) * | 1973-10-17 | 1976-03-30 | Metal Marine Pilot, Inc. | Autopilot employing improved hall-effect direction sensor |
US4033045A (en) * | 1975-10-14 | 1977-07-05 | Sperry Rand Corporation | Portable surveying gyrocompass apparatus |
US4139951A (en) * | 1977-03-23 | 1979-02-20 | Cunard Thomas L | Remote indicating compass |
US4179741A (en) * | 1976-08-26 | 1979-12-18 | C.I.E.R. Compagnia Importazioni Esportazioni Rappresentanze S.R.L. | Magnetic compasses |
US4277751A (en) * | 1978-09-29 | 1981-07-07 | Neil Brown Instruments Systems, Inc. | Low-power magnetometer circuit with constant current drive |
US4851775A (en) * | 1987-07-02 | 1989-07-25 | Precision Navigation, Incorporated | Digital compass and magnetometer having a sensor coil wound on a high permeability isotropic core |
US4859944A (en) * | 1987-08-25 | 1989-08-22 | Analog Devices, Inc. | Single-winding magnetometer with oscillator duty cycle measurement |
US5239264A (en) * | 1991-11-14 | 1993-08-24 | Precision Navigation, Inc. | Zero-offset magnetometer having coil and core sensor controlling period of an oscillator circuit |
US5383280A (en) * | 1992-11-20 | 1995-01-24 | Mcdermott; Kevin | Direction indicator for navigation |
US5521609A (en) * | 1995-01-13 | 1996-05-28 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Magnetic antenna using metallic glass |
US5642046A (en) * | 1994-06-08 | 1997-06-24 | Magknowledge Inc. | Low power magnetometer circuits requiring a single switching cycle |
US5757184A (en) * | 1995-09-29 | 1998-05-26 | Sony Corporation | Magnetic field detection apparatus with bilateral electrical switch for inverting magnetic sensor current |
US5764055A (en) * | 1995-11-02 | 1998-06-09 | Canon Denshi Kabushiki Kaisha | Magnetism sensor using a magnetism detecting device of a magnetic impedance effect type and control apparatus using the same |
US5875561A (en) * | 1997-02-24 | 1999-03-02 | Chen; Chi Chung | Digital compass |
US6084406A (en) * | 1997-04-01 | 2000-07-04 | Precision Navigation, Inc. | Half-cycle saturable-core magnetometer circuit |
US6121770A (en) * | 1997-07-14 | 2000-09-19 | Frontec Incorporated | Magnetic sensor using magnetic impedance of magnetic wire within biasing coil |
US6181130B1 (en) * | 1997-07-25 | 2001-01-30 | Tokin Corporation | Magnetic sensor having excitation coil including thin-film linear conductor sections formed on bobbin with detection coil wound thereon |
US6194897B1 (en) * | 1997-10-06 | 2001-02-27 | Tdk Corporation | Magnetic sensor apparatus |
US6243660B1 (en) * | 1999-10-12 | 2001-06-05 | Precision Navigation, Inc. | Digital compass with multiple sensing and reporting capability |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IL126210A (en) * | 1998-07-01 | 2002-12-01 | Israel Aircraft Ind Ltd | Low weight and low excitation force magnetotorquer |
DE19911803A1 (en) | 1999-03-17 | 2000-09-21 | Kaschke Kg Gmbh & Co | Miniature antenna coil, especially for electronic vehicle locking systems |
US7196514B2 (en) * | 2002-01-15 | 2007-03-27 | National University Of Singapore | Multi-conductive ferromagnetic core, variable permeability field sensor and method |
-
2004
- 2004-03-03 US US10/792,616 patent/US20050116801A1/en not_active Abandoned
- 2004-03-05 WO PCT/US2004/006899 patent/WO2004082341A2/en active Application Filing
-
2008
- 2008-01-24 US US12/019,359 patent/US7639109B2/en not_active Expired - Fee Related
Patent Citations (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3899834A (en) * | 1972-10-02 | 1975-08-19 | Westinghouse Electric Corp | Electronic compass system |
US3946691A (en) * | 1973-10-17 | 1976-03-30 | Metal Marine Pilot, Inc. | Autopilot employing improved hall-effect direction sensor |
US4033045A (en) * | 1975-10-14 | 1977-07-05 | Sperry Rand Corporation | Portable surveying gyrocompass apparatus |
US4179741A (en) * | 1976-08-26 | 1979-12-18 | C.I.E.R. Compagnia Importazioni Esportazioni Rappresentanze S.R.L. | Magnetic compasses |
US4139951A (en) * | 1977-03-23 | 1979-02-20 | Cunard Thomas L | Remote indicating compass |
US4277751A (en) * | 1978-09-29 | 1981-07-07 | Neil Brown Instruments Systems, Inc. | Low-power magnetometer circuit with constant current drive |
US4851775A (en) * | 1987-07-02 | 1989-07-25 | Precision Navigation, Incorporated | Digital compass and magnetometer having a sensor coil wound on a high permeability isotropic core |
US4859944A (en) * | 1987-08-25 | 1989-08-22 | Analog Devices, Inc. | Single-winding magnetometer with oscillator duty cycle measurement |
US5239264A (en) * | 1991-11-14 | 1993-08-24 | Precision Navigation, Inc. | Zero-offset magnetometer having coil and core sensor controlling period of an oscillator circuit |
US5383280A (en) * | 1992-11-20 | 1995-01-24 | Mcdermott; Kevin | Direction indicator for navigation |
US5749150A (en) * | 1992-11-20 | 1998-05-12 | Mcdermott; Kevin | Direction indicator for navigation |
US5642046A (en) * | 1994-06-08 | 1997-06-24 | Magknowledge Inc. | Low power magnetometer circuits requiring a single switching cycle |
US5744956A (en) * | 1994-06-08 | 1998-04-28 | Hawks; Timothy J. | Low power magnetometer circuits having zero offset compensation |
US5521609A (en) * | 1995-01-13 | 1996-05-28 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Magnetic antenna using metallic glass |
US5757184A (en) * | 1995-09-29 | 1998-05-26 | Sony Corporation | Magnetic field detection apparatus with bilateral electrical switch for inverting magnetic sensor current |
US5764055A (en) * | 1995-11-02 | 1998-06-09 | Canon Denshi Kabushiki Kaisha | Magnetism sensor using a magnetism detecting device of a magnetic impedance effect type and control apparatus using the same |
US5875561A (en) * | 1997-02-24 | 1999-03-02 | Chen; Chi Chung | Digital compass |
US6084406A (en) * | 1997-04-01 | 2000-07-04 | Precision Navigation, Inc. | Half-cycle saturable-core magnetometer circuit |
US6121770A (en) * | 1997-07-14 | 2000-09-19 | Frontec Incorporated | Magnetic sensor using magnetic impedance of magnetic wire within biasing coil |
US6181130B1 (en) * | 1997-07-25 | 2001-01-30 | Tokin Corporation | Magnetic sensor having excitation coil including thin-film linear conductor sections formed on bobbin with detection coil wound thereon |
US6194897B1 (en) * | 1997-10-06 | 2001-02-27 | Tdk Corporation | Magnetic sensor apparatus |
US6243660B1 (en) * | 1999-10-12 | 2001-06-05 | Precision Navigation, Inc. | Digital compass with multiple sensing and reporting capability |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050258926A1 (en) * | 2004-05-21 | 2005-11-24 | Robert Weger | Coil arrangement and method for its manufacture |
US7342475B2 (en) * | 2004-05-21 | 2008-03-11 | Minebea Co., Ltd. | Coil arrangement and method for its manufacture |
US20070041162A1 (en) * | 2005-08-19 | 2007-02-22 | Sedio Stephen M | An Integrated Electronic Assembly And Method For Conserving Space In A Circuit |
US20070040645A1 (en) * | 2005-08-19 | 2007-02-22 | Sedio Stephen M | Transformer And Method Of Winding Same |
US7690105B2 (en) | 2005-08-19 | 2010-04-06 | Coilcraft, Incorporated | Method for conserving space in a circuit |
US20100128434A1 (en) * | 2005-08-19 | 2010-05-27 | Coilcraft, Incorporated | Integrated electronic assembly for conserving space in a circuit |
US8945948B2 (en) | 2005-08-19 | 2015-02-03 | Coilcraft, Incorporated | Integrated electronic assembly for conserving space in a circuit |
US9554470B2 (en) | 2005-08-19 | 2017-01-24 | Coilcraft, Incorporated | Integrated electronic assembly for conserving space in a circuit |
US10098231B2 (en) | 2005-08-19 | 2018-10-09 | Coilcraft, Incorporated | Integrated electronic assembly for conserving space in a circuit |
US20090258511A1 (en) * | 2008-04-14 | 2009-10-15 | Lockheed Martin Corporation | Printed wiring board solder pad arrangement |
US8139369B2 (en) | 2008-04-14 | 2012-03-20 | Lockheed Martin Corporation | Printed wiring board solder pad arrangement |
Also Published As
Publication number | Publication date |
---|---|
WO2004082341A2 (en) | 2004-09-23 |
US7639109B2 (en) | 2009-12-29 |
US20080169894A1 (en) | 2008-07-17 |
WO2004082341A3 (en) | 2005-03-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7639109B2 (en) | Sensor coil and method of manufacturing same | |
US9846179B2 (en) | Electrical current transducer with electrostatic shield | |
US4490706A (en) | Electronic parts | |
EP0893699B1 (en) | Magnetic sensor having excitation coil including thin-film linear conductor sections formed on bobbin with detection coil wound thereon | |
US5552700A (en) | Current detecting device with a core having an integrally fixed engaging member | |
EP2073025B1 (en) | Current sensor with laminated magnetic core | |
EP1617228B1 (en) | Current sensor | |
US6545456B1 (en) | Hall effect current sensor package for sensing electrical current in an electrical conductor | |
US8222987B2 (en) | Supporting component, interference suppression coil device and method for the manufacture thereof | |
JP6612112B2 (en) | Current converter | |
US4748405A (en) | Current sensor arrangement | |
US9696349B2 (en) | Current sensing system | |
JPH05299252A (en) | Surface mounting type choke coil | |
JP2985079B2 (en) | Magnetic sensor | |
US20090160580A1 (en) | Coil leading structure and filter thereof | |
JPH0613496Y2 (en) | Clamp sensor | |
JP7326704B2 (en) | electronic components | |
JPS62278776A (en) | Plating connector for electric or electronic element | |
JPH088170B2 (en) | Small choke coil and manufacturing method thereof | |
CN116908761A (en) | Calibration method, calibration device and assembly method for a current sensor of an electrical switching apparatus, associated current sensor | |
EP1786004B1 (en) | Method of manufacturing an electronic component comprising an integrated circuit and a winding assembly | |
JPH0418447B2 (en) | ||
EP0032208A2 (en) | Magnetic bubble domain device package and method of assembly | |
JPS59190718A (en) | Proximity switch | |
JPH08191021A (en) | Inductance element |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: COILCRAFT, INCORPORATED, ILLINOIS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:PROEHL, GREGORY L.;VERDUNG, CRAIG;HICKMAN, STEVEN W.;REEL/FRAME:018242/0863;SIGNING DATES FROM 20040709 TO 20040712 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO PAY ISSUE FEE |