WO2020166167A1

WO2020166167A1 - Method for manufacturing film formation product and sputtering method

Info

Publication number: WO2020166167A1
Application number: PCT/JP2019/046043
Authority: WO
Inventors: 竹内　慎; 武男浅田; 宏祐荒木; 大助東; 智子岸本; 琢磨保田; 和男森山; 裕貴清水
Original assignee: Ｔｏｗａ株式会社
Priority date: 2019-02-14
Filing date: 2019-11-26
Publication date: 2020-08-20
Also published as: JP2020132906A; KR102615201B1; KR20210103509A; TW202045758A; CN113330140A; TWI737048B; JP6772315B2

Abstract

Provided is a method for manufacturing a film formation product with which the occurrence of thin-film non-uniformity formed on a workpiece can be suppressed. The present invention includes: a workpiece holding step for holding a workpiece W so that the workpiece W can revolve about a first rotating shaft (rotating shaft 20) and rotate about a second rotating shaft (workpiece holding unit 60) that is tilted with respect to a target 6 (sputtering target); and a film forming step for forming a film on the workpiece W using the target 6 while the workpiece W is revolving about the first rotating shaft and rotating about the second rotating shaft.

Description

Film-forming product manufacturing method and sputtering apparatus

The present invention relates to a method of manufacturing a film-formed product and a technique of a sputtering device.

The conventional method of manufacturing a film-formed product and the technique of a sputtering apparatus are as described in Patent Document 1, for example.

Patent Document 1 discloses a coating device that performs coating while rotating a small-diameter tool. This coating device holds a small-diameter tool and can rotate (rotate) the rotation jig, the small revolution jig that rotates the rotation jig around the small revolution axis (small revolution), and the small revolution jig around the large revolution axis. It is equipped with a large revolution jig that rotates (large revolution). The axes of the rotation jig, the small revolution jig and the large revolution jig are arranged so as to be parallel to each other. Further, a target is arranged on the side of the large revolution jig or the like.

In the coating device configured in this way, the small-diameter tool is coated with the material emitted from the target while rotating the small-diameter tool on its own axis, small revolution and large revolution. By performing such rotation and revolution, the entire surface of the small diameter tool can be coated.

However, in the technique described in Patent Document 1, when the small diameter tool is rotated (revolving and revolving (small revolving and large revolving)), the side surface of the small diameter tool faces the target, but the upper surface does not face the target. Absent. Therefore, there is room for improvement in that the coating may be uneven on the side surface and the upper surface of the small diameter tool.

JP, 2007-77469, A

The present invention has been made in view of the above circumstances, and an object thereof is to provide a method for manufacturing a film-formed product and a sputtering apparatus capable of suppressing the occurrence of unevenness of a thin film formed on a work. Is to provide.

The problem to be solved by the present invention is as described above, and in order to solve this problem, the method for manufacturing a film-formed product according to the present invention is capable of revolving around the first rotation axis and with respect to a sputtering target. While holding the work holding step of holding the work so as to be rotatable about the inclined second rotation axis, the revolution about the first rotation axis, and the rotation about the second rotation axis, And a film forming step of forming a film on the work by using the sputtering target.

Further, the sputtering apparatus according to the present invention, a rotating shaft, a sputtering target disposed on the side of the rotating shaft, a rotating unit rotatable about the rotating shaft, capable of holding a work, the rotating A plurality of work holding portions arranged in a line around a circumference centered on an axis and provided on the rotating portion so as to be rotatable about an axis inclined with respect to the sputtering target, and the rotating shaft. And a rotation drive unit that is formed in a disk shape centering on the center of the workpiece and that is arranged so as to contact the plurality of work holding units and that rotates the work holding unit in accordance with the rotation of the rotating unit. Is.

Moreover, the method for producing a film-formed product according to the present invention is to produce a film-formed product using the sputtering apparatus.

According to the present invention, it is possible to suppress the occurrence of unevenness of the thin film formed on the work.

FIG. 3 is a schematic cross-sectional view taken along the line AA showing a schematic configuration of a sputtering device. Similarly, a schematic plan sectional view. FIG. 3 is a front cross-sectional view showing the internal structure of a film forming chamber. FIG. 3 is an enlarged front cross-sectional view showing the internal structure of a film forming chamber. FIG. 3 is a front cross-sectional view showing the periphery of a work holding unit. The top view which showed the structure of the rotating wheel. The top view which showed the structure of a fixed disc and the control part. The figure which showed each process of the manufacturing method of a film-formed product. (A) A schematic diagram showing how a film forming process is performed in a state where a work is not tilted. (B) A schematic view showing how the film forming process is performed in a state where the work is inclined. The figure which showed an example of the evaluation regarding the lifetime of the tool of this application. The figure which showed an example of the evaluation regarding the generation|occurrence|production of the chip|tip of this application tool.

Hereinafter, the directions indicated by arrows U, D, L, R, F, and B in the drawings are defined as upward, downward, leftward, rightward, forward, and backward, respectively. And explain.

The outline of the sputtering apparatus 1 according to the present embodiment will be described below with reference to FIGS. 1 and 2.

The sputtering apparatus 1 is a vacuum processing apparatus (vacuum film forming apparatus) that performs film forming processing in vacuum. The sputtering apparatus 1 according to the present embodiment assumes a working tool as the work (processed article) W to be film-formed. The sputtering apparatus 1 mainly includes a film forming chamber 2, a work holding unit rotating unit 3, a motor 4, an exhaust device 5, a target (sputtering target) 6, and a heater 7.

The film forming chamber 2 forms a space for performing a film forming process on the work W. The film forming chamber 2 is formed in a substantially columnar shape with its axis oriented in the vertical direction (see FIG. 2). The film forming chamber 2 is formed in a hollow shape.

The work holding unit rotating unit 3 rotates a work holding unit 60 described later. The work holder rotating unit 3 is arranged in the film forming chamber 2.

The motor 4 (see FIG. 1) is a drive source for rotationally driving the work holding unit rotation unit 3. The motor 4 is arranged outside the film forming chamber 2. The power of the motor 4 is transmitted to the work holding unit rotation unit 3 via an appropriate power transmission mechanism (for example, a shaft).

The exhaust device 5 (see FIG. 1) exhausts the air in the film forming chamber 2 to adjust the inside of the film forming chamber 2 to a vacuum degree suitable for the film forming process.

The target 6 is a material (film forming material) for forming a film on the work W. The target 6 is formed in a flat plate shape. The target 6 is arranged in the film forming chamber 2. A pair of targets 6 are provided with the workpiece holding unit rotating unit 3 interposed therebetween. The target 6 is arranged such that the plate surface is along the vertical direction. The target 6 is arranged so that the plate surface faces the center of the film forming chamber 2 (that is, the work holding unit rotating unit 3).

The heater 7 is for heating the work W to improve film formation quality (uniformity, etc.). The heater 7 is arranged in the film forming chamber 2. A pair of heaters 7 are provided with the work holder rotating unit 3 interposed therebetween. The target 6 and the heater 7 are arranged at equal intervals around the work holding unit rotation unit 3.

Next, the work holder rotating unit 3 will be described more specifically.

The work holding unit rotation unit 3 shown in FIGS. 3 and 4 mainly includes a rotary shaft 20, an upper rotary body 30, a rotary wheel 40, a mounting member 50, a work holding unit 60, a fixed disk 70, a restricting unit 80, and a cover 90. To do.

The rotary shaft 20 serves as the center of rotation of the rotary wheel 40 described later. The rotating shaft 20 is formed in a substantially columnar shape. The rotating shaft 20 is arranged with its axis oriented in the vertical direction (vertical direction). An outer cylindrical member 21 formed in a cylindrical shape is fitted to the rotating shaft 20 so as to cover the side surface of the rotating shaft 20 so as to be integrally rotatable. A key groove 21 a is formed on the upper end of the outer cylinder member 21.

The upper rotary body 30 is rotatable integrally with the rotary shaft 20. The upper rotating body 30 is formed in a circular shape in plan view. The upper end of the rotary shaft 20 is fixed to the center of the bottom surface of the upper rotary body 30. A key member 31 is fixed near the center of the bottom surface of the upper rotating body 30. By engaging the key member 31 with the key groove 21a of the outer tubular member 21, the relative rotation between the upper rotary body 30 and the rotary shaft 20 is restricted. That is, the upper rotary body 30 can rotate integrally with the rotary shaft 20. The upper part of the upper rotating body 30 is rotatably supported on the upper surface of the film forming chamber 2. The power of the motor 4 (see FIG. 1) can be transmitted to the upper rotating body 30. The upper rotary body 30 can rotate together with the rotary shaft 20 by the power from the motor 4.

The rotary wheel 40 shown in FIGS. 3 to 6 rotates (revolves) a work holding unit 60 described later about the rotary shaft 20. The rotary wheel 40 mainly includes a boss portion 41, a rib 42, and an outer peripheral portion 43.

The boss portion 41 is a portion formed at the center of the rotating wheel 40. The boss portion 41 is formed in a substantially cylindrical shape with its axis oriented in the vertical direction (vertical direction). At the center of the boss portion 41, a through hole 41a that vertically penetrates the boss portion 41 is formed.

The rib 42 is a rod-shaped portion formed so as to extend from the boss portion 41 toward the outside of the boss portion 41 in the radial direction of the rotating wheel 40. A plurality of ribs 42 (five in the present embodiment) are formed around the boss portion 41 at equal intervals (see FIG. 6 ).

The outer peripheral portion 43 is a portion that supports a work holding portion 60 described later. The outer peripheral portion 43 is formed in an annular shape centered on the boss portion 41 in a plan view. The inner peripheral surface of the outer peripheral portion 43 is fixed to the outer end portion of the rib 42 in the radial direction of the rotating wheel 40. In this way, the outer peripheral portion 43 is connected to the boss portion 41 via the rib 42. In addition, in this embodiment, the boss portion 41, the rib 42, and the outer peripheral portion 43 are integrally formed. An inclined surface 43a and a through hole 43b are mainly formed in the outer peripheral portion 43.

The inclined surface 43a shown in FIGS. 5 and 6 is formed on the upper surface of the outer peripheral portion 43. The inclined surface 43a is formed so as to face a direction inclined with respect to the vertical direction (axial direction of the rotating shaft 20). Specifically, the inclined surface 43a is formed so as to incline downward toward the outer side in the radial direction of the rotary wheel 40.

The through hole 43b is formed so as to vertically penetrate the outer peripheral portion 43. The upper end of the through hole 43b is formed so as to open to the inclined surface 43a. The through hole 43b is formed so as to extend perpendicularly to the inclined surface 43a. That is, the through hole 43b is formed so as to extend in a direction inclined with respect to the vertical direction (vertical direction). More specifically, the through hole 43b is formed so as to extend radially outward of the rotary wheel 40 as it extends upward. The lower end (lower opening) of the through hole 43b is closed by a plate-like closing member 43c.

As shown in FIG. 6, a plurality of inclined surfaces 43a and through holes 43b are formed at equal intervals along the circumferential direction of the outer peripheral portion 43.

As shown in FIG. 4, the rotating wheel 40 is provided on the rotating shaft 20 (outer cylinder member 21). Specifically, the boss portion 41 (through hole 41 a) of the rotary wheel 40 is inserted into the rotary shaft 20. At this time, the rotary wheel 40 and the rotary shaft 20 are engaged so as to be integrally rotatable. Further, a plurality of rotating wheels 40 are provided on the rotating shaft 20 so as to be vertically arranged at equal intervals. In FIGS. 1, 3 and 4, two rotating wheels 40 are shown as an example.

The mounting member 50 shown in FIGS. 4 and 5 is for mounting a work holding portion 60, which will be described later, on the rotary wheel 40. The mounting member 50 mainly includes a main body portion 51 and a flange portion 52.

The main body 51 is a portion formed in a cylindrical shape. The outer diameter of the main body portion 51 is formed to be substantially the same as the inner diameter of the through hole 43b of the rotary wheel 40.

The flange portion 52 is a disk-shaped portion formed so as to expand in diameter from the vicinity of the upper end portion of the main body portion 51.

The body 51 is inserted into the through hole 43b of the rotary wheel 40 from above. The flange portion 52 is fixed to the inclined surface 43a of the rotating wheel 40 by an appropriate fastening member (bolt or the like). In this way, the mounting member 50 is provided in each through hole 43b of the rotary wheel 40. The axis of the mounting member 50 (main body 51) is arranged so as to be inclined at the same angle as the through hole 43b.

The work holding unit 60 holds the work W rotatably (rotatably). The work holding part 60 mainly includes a rotation support part 61 and a rotation driven part 62.

The rotation support portion 61 holds the work W. The rotation support portion 61 mainly includes a holding portion 61a and a support portion 61b.

The holding portion 61a is a portion that holds the work W. The holding portion 61a is formed in a substantially cylindrical shape (bottomed cylindrical shape) having a bottom surface (lower surface). The upper portion of the holding portion 61a is opened, and the work W inserted through this opening can be held. The holder 61a can not only directly hold the work W, but can also hold the work W via an appropriate member (a cap or the like that holds the work W).

The support portion 61b is a portion supported by the rotating wheel 40 via the mounting member 50. The support portion 61b is formed in a substantially columnar shape. The outer diameter of the support portion 61b is formed to be smaller than the inner diameter of the mounting member 50. The support portion 61b is formed so as to protrude downward from the bottom surface of the holding portion 61a. The support portion 61b and the holding portion 61a are formed on the same axis.

The support portion 61b is inserted into the main body portion 51 of the mounting member 50 from above. The support portion 61b is rotatably supported by the mounting member 50 (main body portion 51) via an appropriate bearing member 61c. By inserting the support portion 61b into the main body portion 51, the holding portion 61a is arranged so as to project upward from the rotary wheel 40. The axis of the rotation support portion 61 is arranged so as to be inclined at the same angle as the axis of the mounting member 50 (main body portion 51). In other words, the rotation support portion 61 is arranged so as to be inclined with respect to the plate surface of the target 6 arranged laterally, as shown in FIG. The rotation support portion 61 can rotate (rotate) about an axis inclined with respect to the axis (vertical direction) of the rotation shaft 20.

Note that any member can be used as the bearing member 61c. For example, any member such as a ball bearing, a roller bearing, and a slide bearing can be appropriately selected. Further, it is possible to provide a plurality of bearing members 61c for one support portion 61b.

Also, the inclination angle of the axis of the support portion 61b (inclination angle α described later (see FIG. 5)) can be set arbitrarily. For example, the support portion 61b can be set so as to be tilted by 20 to 80° with respect to the rotary shaft 20 and the target 6 (based on the vertical direction).

The rotation driven part 62 is a part that comes into contact with a fixed disk 70 described later. The driven portion 62 is formed in a substantially circular flat plate shape when viewed in the axial direction of the rotation support portion 61. A through hole 62 a is formed at the center of the driven portion 62. The through hole 62 a of the rotation driven portion 62 is fitted to the holding portion 61 a of the rotation support portion 61 above the rotation wheel 40. As a result, the rotation driven portion 62 can rotate integrally with the rotation support portion 61.

In this way, the work holding portion 60 is provided on the outer peripheral portion 43 of the rotary wheel 40 via the mounting member 50. Further, the plurality of work holding portions 60 are provided so as to be arranged along the outer peripheral portion 43 (that is, on the circumference around the rotation shaft 20).

The fixed disk 70 shown in FIGS. 3 to 5 and 7 is for rotating the work holding unit 60. The fixed disk 70 is formed in a plate shape (disk shape) having a circular shape in plan view. A through hole 70a is formed at the center of the fixed disk 70.

As shown in FIG. 4, the fixed disk 70 is provided on the rotary shaft 20 via a fixed member 71 and a bearing member 72. Specifically, the outer ring of the bearing member 72 is fixed to the inside of the fixed disk 70 (through hole 70a) via the fixing member 71. The inner ring of the bearing member 72 is inserted into the rotary shaft 20 and fixed to the rotary shaft 20. As described above, the fixed disk 70 is provided so as to be rotatable relative to the rotary shaft 20 via the bearing member 72. The fixed disk 70 is provided above the rotating wheel 40 with an appropriate gap from the rotating wheel 40. That is, the fixed disks 70 are provided in the same number as the rotating wheels 40 so as to correspond to the rotating wheels 40. The outer peripheral end portion of the fixed disk 70 is arranged so as to come into contact with the rotation driven portion 62 of the work holding portion 60 provided on the corresponding rotary wheel 40.

Note that any member can be used as the bearing member 72. For example, any member such as a ball bearing, a roller bearing, and a slide bearing can be appropriately selected.

The fixed disk 70 and the driven part 62 rotate so that the work holding part 60 rotates (revolves) about the rotation shaft 20 so that the power for rotating the work holding part 60 is transmitted to the work holding part 60. Is configured. For example, the fixed disk 70 and the rotationally driven portion 62 can be formed by a gear (for example, a bevel gear) having teeth that mesh with each other. Accordingly, the fixed disk 70 can continuously rotate (rotate) the work holding portion 60 (in particular, the work W can be continuously rotated in a state where the work W faces the target 6 ). In addition, the fixed disk 70 and the rotationally driven portion 62 may be configured to be in contact with each other and capable of transmitting power. For example, gears, a combination of a chain and a sprocket, a structure for transmitting power by using a meshing structure such as a combination of holes and protrusions, and a structure for transmitting power by using frictional force between contact surfaces may be used. ..
Further, the fixed disk 70 and the driven part 62 may be in contact with each other via an inclusion that does not include a mechanical mechanism. In this case, the fixed disk 70, which is a rotating part, and the driven part 62, which is a part of the work holding part 60, come into contact with each other without interposing a mechanical mechanism.

Further, the fixed disk 70 and the rotation driven portion 62 are not limited to those that continuously transmit power and rotate the work holding portion 60 continuously like a gear. For example, the fixed disk 70 and the rotationally driven portion 62 can intermittently rotate (spin) the work holding portion 60 by intermittently transmitting power using a cam or the like.

The regulation unit 80 regulates the rotation of the fixed disc 70. The restriction portion 80 mainly includes a first restriction member 81 and a second restriction member 82.

The first regulation member 81 is fixed to each fixed disc 70. The first regulating member 81 is formed by bending a rectangular plate material. Specifically, the first regulating member 81 includes a horizontally extending left portion 81a, a midway portion 81b extending vertically upward from the right end of the left portion 81a, and a right portion 81c extending rightward from the upper end of the midway portion 81b, It is equipped with. Thus, the first restricting member 81 is formed such that the radially outer portion (right portion 81c) of the fixed disk 70 is higher than the radially inner portion (left portion 81a). This makes it possible to avoid interference with the work holding unit 60 and the work W.

The left portion 81a of the first regulating member 81 is fixed near the right end portion of the upper surface of the fixed disc 70 by an appropriate fastening member (bolt or the like). The right portion 81c of the first regulating member 81 is arranged so as to project rightward from the fixed disc 70. A cutout portion 81d is formed in the right portion 81c.

The second restricting member 82 engages with the first restricting member 81. The second regulation member 82 is formed in a substantially columnar shape. The second restricting member 82 is arranged with its axis in the vertical direction (vertical direction). The upper end of the second regulation member 82 is fixed to the upper surface of the film forming chamber 2 via the bracket 82a. The second regulation member 82 is engaged with the cutout portion 81d of the first regulation member 81 provided on each fixed disk 70. More specifically, the second regulating member 82 is fitted into the cutout portion 81d of the first regulating member 81, and the rotation of the fixed disc 70 is regulated.

As described above, the rotation of the fixed disk 70 is restricted by engaging the first restriction member 81 provided on the fixed disk 70 with the second restriction member 82 fixed to the film forming chamber 2. As a result, even if the rotary shaft 20 rotates, the fixed disk 70 does not rotate.

The cover 90 shown in FIGS. 3 to 5 covers the work holding unit 60. The cover 90 is formed by appropriately bending a plate-shaped member. The cover 90 is arranged so as to cover the work holding portion 60 from the side (outside in the radial direction of the fixed disc 70) and from above. A through hole 91 is formed in the cover 90. The work W held by the work holding portion 60 can be exposed to the outside of the cover 90 via the through hole 91. The cover 90 is fixed to the rotating wheel 40 by an appropriate method.

Next, how the work holding unit rotation unit 3 operates by the power of the motor 4 will be described.

When the motor 4 is driven, the power of the motor 4 causes the rotating shaft 20 to rotate. The rotary wheel 40 rotates integrally with the rotary shaft 20. As a result, the work holding portion 60 provided on the outer peripheral portion 43 of the rotating wheel 40 rotates (revolves) about the rotating shaft 20.

On the other hand, the rotation of the fixed disk 70 provided so as to be rotatable relative to the rotary shaft 20 is restricted by the restriction unit 80. Therefore, the fixed disk 70 does not rotate with the rotation of the rotary shaft 20.

The rotation driven part 62 of the work holding part 60 rotates (revolves) about the rotating shaft 20 while contacting with the fixed (non-rotating) fixed disk 70. As a result, the work holding unit 60 rotates (revolves) about the rotation shaft 20 and rotates (rotates) about the axis of the work holding unit 60 (see FIG. 2 ).

Further, when the work holding unit 60 rotates (revolves) about the rotation shaft 20, the work holding unit 60 is viewed from the outside of the work holding unit 60 toward the rotation shaft 20 (in other words, as shown in FIGS. 4 and 5 ). It should be noted that the tilt angle α is always constant in a sectional view passing through the rotary shaft 20 and parallel to the rotary shaft 20. The inclination angle α is an angle with respect to the axis of the rotary shaft 20 and the plate surface of the target 6 in the cross section shown in FIGS. 4 and 5 (the cross section viewed from the circumferential direction of the virtual circle around the rotary shaft 20). means. In the present embodiment, since the axis of the rotary shaft 20 and the plate surface of the target 6 are parallel to the vertical direction (vertical direction), the inclination angle α is the vertical direction (vertical direction) in the cross sections shown in FIGS. 4 and 5. It is an angle with respect to the imaginary line X along the line. The cross section viewed from the circumferential direction of the virtual circle centering on the rotation axis 20 can also be expressed as a cross section viewed from the circumference of the virtual circle centering on the rotation axis 20.

Therefore, when the work holding unit 60 rotates (revolves) about the rotation shaft 20, particles of the film-forming material collide with the work W from the target 6 at a position where the work W faces the target 6 to form a relatively thick film. In the formed film forming region, the inclination angle α of the work holding part 60 (work W) with respect to the target 6 becomes substantially constant. Further, at this time, the film quality of the film formed on the entire exposed surface of the work W can be made uniform by rotating itself around the axis of the work holding unit 60.

Next, a method of manufacturing a film-formed product (sputtering method) using the sputtering apparatus 1 configured as described above will be described.

As shown in FIG. 8, the method for manufacturing a film-formed product according to this embodiment mainly includes a work holding step S1, an exhaust step S2, a work heating step S3, and a film forming step S4.

The work holding step S1 is a step of causing the work holding unit 60 to hold the work W. In the work holding step S1, the worker inserts the work W into the holding portion 61a of the work holding portion 60 and holds the work W by the work holding portion 60.

The exhaust step S2 is a step of exhausting the air in the film forming chamber 2. In the exhaust step S2, when the exhaust device 5 is operated, the air in the film forming chamber 2 is exhausted. By appropriately controlling the exhaust device 5, the inside of the film forming chamber 2 is adjusted to a vacuum degree suitable for the film forming process.

The work heating step S3 is a step of heating the work W. In the work heating step S3, when the motor 4 is driven, the work holding unit rotating unit 3 is operated and the rotation (revolution and rotation) of the work holding unit 60 is started. Further, in the work heating step S3, the heater 7 is operated to heat the work W held by the work holding unit 60 to an appropriate temperature.

The film forming step S4 is a step of performing a film forming process on the work W. In the film forming step S4, the work holder rotating unit 3 is continuously operated. Further, in the film forming step S4, a sputtering gas (for example, an inert gas such as Ar) is supplied into the film forming chamber 2. In this state, by applying a negative voltage or a high frequency (RF: Radio Frequency) voltage to the target 6, glow discharge is generated. As a result, the sputtering gas is ionized, and the ions are made to collide with the surface of the target 6 at high speed to knock out particles (sputtering particles) of the film-forming material forming the target 6. The particles of the film forming material knocked out from the target 6 adhere to the surface of the work W. By depositing these particles on the surface of the work W, a thin film can be formed. In this way, the work W (film-formed product) that has been subjected to the film-forming treatment can be manufactured.

In the present embodiment, the work holding step S1, the exhaust step S2, the work heating step S3, and the film forming step S4 have been described in order for convenience, but the method for manufacturing the film formed article is not necessarily limited to this. For example, the order of some steps can be changed (for example, the order of the exhaust step S2 and the work heating step S3 can be changed) or can be performed simultaneously (for example, the exhaust step S2 and the work heating step S3 can be performed at the same time). is there.

Here, with reference to FIG. 9, description will be made on how the method of manufacturing a film-formed product using the sputtering apparatus 1 suppresses the occurrence of unevenness of the thin film formed on the work W. Note that, in FIG. 9, for convenience of description, the shape of the work W is simplified and shown as a cylindrical shape.

As a comparative example, as shown in FIG. 9A, it is assumed that the workpiece W is not tilted and rotates about an axis oriented in the vertical direction. In this case, since the work W is rotating, the entire side surface of the work W faces the target 6 arranged on the side of the work W. Thereby, the particles of the film forming material from the target 6 can be attached to the entire side surface of the work W.

On the other hand, even if the work W rotates, the upper surface of the work W does not face the target 6, so that the particles of the film-forming material from the target 6 are unlikely to adhere to the upper surface of the work W. That is, there is a possibility that unevenness may occur in the formed thin film on the side surface and the upper surface of the work W.

Particularly, in the film forming process by sputtering (sputtering method), a difference occurs in the compressive stress (internal stress) of the thin film formed on the side surface and the upper surface of the work W, and the difference in the compressive stress lowers the adhesion and homogeneity of the thin film. Etc. are a concern.

On the other hand, in the present embodiment, as shown in FIG. 9B, the work W is configured to rotate about an axis inclined with respect to the target 6. In this case, not only the side surface of the work W but also the upper surface can be made to face the target 6. Therefore, it is possible to prevent unevenness in the formed thin film on the side surface and the upper surface of the work W. Further, it is possible to suppress a difference in compressive stress of the thin film between the side surface and the upper surface of the work W, and improve the adhesion and homogeneity of the thin film.

An example of evaluation of a tool formed by the sputtering apparatus 1 (method for manufacturing a film-formed product) according to this embodiment will be described below with reference to FIGS. 10 and 11.

FIG. 10 shows a tool formed by the sputtering apparatus 1 according to the present embodiment (hereinafter, referred to as “tool of the present application”) and a tool formed by a conventionally known method as a comparative example (hereinafter, referred to as “comparative example”). “)” is shown as an example.

Here, as the sputtering conditions in the present embodiment, an RF sputtering method using an RF power source is used, an AlCr-based alloy is used as a sputtering target, and a sputtering gas is a reactivity with a mixed gas in which a nitrogen gas is contained in an argon gas. A film was formed by sputtering.

Note that the tool targeted for evaluation is the "R0.5 carbide ball end mill". In this tool, the base material is a "hard metal (hard metal)" of WC-Co alloy, and an AlCrN-based film (coating) is applied.

As an evaluation test, cutting was performed using the above-mentioned two types of tools. The material type (working material type) to be cut is SUS420J2 (HRC55). The processing conditions are: rotation speed: 30,000 (min ⁻¹ ), feed rate: 1,500 (mm/min), and cut Rd(XY): 0.05 (mm).

In addition, as the standard of the life at the time of evaluation (the wear amount of the tool for judging the life of the tool), (A): wear amount 0.005 (mm), (B): wear amount 0.01 (mm) Two patterns of criteria were set. The horizontal axis in FIG. 10 represents the processing distance, and the vertical axis represents the amount of wear.

As shown in FIG. 10, when the life standard is (A): wear amount is 0.005 (mm), the life of the comparative example is 104.8 (m), while the life of the tool of the present application is 200. It is 1 (m). That is, it can be seen that, when the life standard is (A): wear amount is 0.005 (mm), the tool life of the tool of the present application is approximately doubled as compared with the comparative example.

Further, when the life standard is (B): the wear amount is 0.01 (mm), the life of the comparative example is 109.8 (m), while the life of the tool of the present application is 293.5 (m). is there. That is, it can be seen that when the life criterion is (B): wear amount 0.01 (mm), the tool life of the tool of the present application is extended to about three times that of the comparative example.

FIG. 11 shows an example of evaluation regarding occurrence of a chip between the tool of the present application and a comparative example.

As an evaluation of the occurrence of chipping, the number of occurrences of tool chipping was compared when 200 (m) cutting was performed under the same conditions as the example shown in FIG. The number of evaluations (the number of times of cutting) was 10, and after cutting, the tool was observed using a factory microscope at a magnification of 20 times. When a chip was confirmed regardless of the size of the chip, the chip was counted as having occurred.

As a result, as shown in FIG. 11, in the comparative example, occurrence of chipping was confirmed in 8 out of 10 evaluations. On the other hand, in the tool of the present application, occurrence of chipping was confirmed only twice out of 10 times of evaluation. That is, it can be seen that the occurrence rate of chipping of the tool of the present application is one-fourth that of the comparative example.

As described above, the tool formed by the sputtering apparatus 1 (method for producing a film-formed product) according to the present embodiment has a long life and suppresses the occurrence of chipping due to improvement in adhesion and homogeneity of the thin film (coating). It has been found that it is possible to achieve.

Note that, in the present embodiment, the apparatus (sputtering apparatus 1) that performs sputtering is illustrated as an example of the vacuum processing apparatus (vacuum film forming apparatus), but the present invention is not limited to this and may be applied to various other vacuum processing. Is possible. For example, it can be applied to a physical vapor deposition method (physical vapor deposition method: PVD) other than the sputtering method using the physical movement of particles.

In PVD, vacuum evaporation, molecular beam evaporation, ion plating, ion beam evaporation, PLD (plasma laser deposition), etc. are used as evaporation systems for heating evaporation sources to evaporate films. is there. Further, as the sputtering system as exemplified in this embodiment, conventional sputtering, magnetron sputtering, ion beam sputtering, ECR sputtering, reactive sputtering (reactive gas (O ₂ , N _2, etc.) is introduced, and oxidation is performed. Thing and the film formation of nitride). Further, it is also possible to use RF sputtering using an RF (high frequency) power source depending on the material of the work W.

Further, the thin film formed on the work W according to the present embodiment is composed of a single layer or a plurality of laminated layers including at least one of AlCrN, AlN, TiCrN, TiN, TiAlN, TiAlCrN, and Al ₂ O ₃ in particular. However, it is possible to form any other thin film.

In addition to the above film-forming materials, it is possible to add additives as appropriate. For example, Nb, Ta, Mo, V, Y, Si or the like can be added as an additive.

As described above, the method for manufacturing a film-formed product according to this embodiment is
Holds the work W so that it can revolve around the first rotation shaft (rotation shaft 20) and can rotate around the second rotation shaft (work holding unit 60) inclined with respect to the target 6 (sputtering target). Work holding step S1
A film forming step S4 of forming a film on the work W by using the target 6 while performing revolution about the first rotation axis and rotation about the second rotation axis;
Is included.

With this configuration, it is possible to suppress the occurrence of unevenness of the thin film formed on the work W. For example, as in the present embodiment, by making the work holding unit 60 rotatable (spin) about an axis inclined with respect to the target 6, not only the side surface of the work W, but also the film forming process is performed on the upper surface. Can be applied easily. This makes it possible to suppress the occurrence of unevenness in the thin film formed, and thus to improve the adhesion and homogeneity of the thin film (coating).

Further, in the work holding step S1, the work W is held such that the inclination angle α with respect to the target 6 in a state of facing the target 6 is constant.

With such a configuration, the plurality of work holding portions 60 are subjected to the film forming processing in a state of being inclined at a constant angle with respect to the target 6 arranged on the outer side in the radial direction of the rotating wheel 40. Become. As a result, it is possible to suppress the dependency of the angle of the processing surface of the work W (a defect such as unevenness due to the change of the inclination angle α).

Further, in the film forming step S4, a film is formed on the work W by using high frequency sputtering.

With this configuration, the quality of the film to be formed can be improved.

Further, the film forming step S4 is to form a film on the work by using reactive sputtering.

With this configuration, a substance (for example, an oxide or a nitride) generated by the reactive gas and the constituent material of the target 6 can be formed as a thin film.

Further, the work holding step S1 uses a machining tool as the work W.

With this configuration, it is possible to suitably perform the film forming process even on a machining tool having a complicated shape.

In the film forming step S4, a film composed of a single layer or a plurality of layers is formed on the work W, the film including at least one of AlCrN, AlN, TiCrN, TiN, TiAlN, TiAlCrN, and Al ₂ O _3. To do.

With this configuration, a hard film can be formed on the work W, and wear resistance, heat resistance, etc. can be improved.

In the film forming step S4, the work W is continuously rotated about the second rotation axis in a state where the work W faces the target 6 by the revolution about the first rotation axis. It is something that rotates.

By configuring in this way, it is possible to improve the homogeneity of the thin film (coating).

Further, the sputtering device 1 according to the present embodiment is
The rotating shaft 20,
A target 6 (sputtering target) arranged laterally of the rotary shaft 20;
A rotating wheel 40 (rotating portion) rotatable about the rotating shaft 20;
Workpieces W can be held, and they are arranged on the circumference around the rotation shaft 20 so as to be aligned, and provided on the rotation wheel 40 so as to be rotatable about an axis inclined with respect to the target 6. A plurality of work holding parts 60,
A fixed disk that is formed in a disk shape around the rotation shaft 20 and that is arranged so as to contact the plurality of work holding portions 60 and that rotates the work holding portions 60 as the rotation wheel 40 rotates. 70 (rotary drive unit),
It is equipped with.

With such a configuration, while the work holding unit 60 is being rotated, the target W is subjected to the film forming process by using the target 6 to suppress the occurrence of the unevenness of the thin film formed on the work W. You can For example, as in the present embodiment, by making the work holding unit 60 rotatable (spin) about an axis inclined with respect to the target 6, not only the side surface of the work W, but also the film forming process is performed on the upper surface. Can be applied easily. This makes it possible to suppress the occurrence of unevenness in the thin film formed, and thus to improve the adhesion and homogeneity of the thin film (coating).

In addition, the method for manufacturing a film-formed product according to the present embodiment is to manufacture a film-formed product using the sputtering apparatus 1.

With this configuration, it is possible to suppress the occurrence of unevenness in the formed thin film, which in turn can improve the adhesion and homogeneity of the thin film (coating).

Further, the work holding unit rotation unit 3 according to the present embodiment is
The rotating shaft 20,
A rotating wheel 40 (rotating portion) rotatable about the rotating shaft 20;
The work W can be held, arranged so as to be lined up on a circumference centered on the rotation shaft 20, and rotated so as to be rotatable about an axis inclined with respect to the axis of the rotation shaft 20. A plurality of work holding portions 60 provided on the wheel 40,
A fixed disk that is formed in a disk shape around the rotation shaft 20 and that is arranged so as to contact the plurality of work holding portions 60 and that rotates the work holding portions 60 as the rotation wheel 40 rotates. 70 (rotary drive unit),
It is equipped with.

With this configuration, it is possible to suppress the occurrence of unevenness of the thin film formed on the work W by performing the film forming process on the work W while rotating the work holding unit 60. For example, as in the present embodiment, the work holding unit 60 can be rotated (rotated) about an axis inclined with respect to the rotation axis 20, so that not only the side surface of the work W but also the film formation process Can be easily applied. This makes it possible to suppress the occurrence of unevenness in the thin film formed, and consequently to improve the adhesion and homogeneity of the thin film (coating).

Particularly, in the present embodiment, the plurality of work holding portions 60 are rotated (rotated) by the disk-shaped fixed disk 70 that is in contact with the plurality of work holding portions 60. With such a configuration, the plurality of work holding portions 60 rotate and revolve while maintaining a posture inclined toward the outer side in the radial direction of the rotary wheel 40 at a constant angle. That is, the plurality of work holding portions 60 are subjected to the film forming process in a state of being inclined at a constant angle with respect to the target 6 arranged on the outer side in the radial direction of the rotating wheel 40. As a result, it is possible to suppress the dependency of the angle of the processing surface of the work W (a defect such as unevenness due to the change of the inclination angle α).

Further, the rotary shaft 20 is formed so as to be rotatable by using power from the motor 4 (power source),
The rotating wheel 40 is provided on the rotating shaft 20 so as to be rotatable integrally with the rotating shaft 20,
The fixed disk 70 is provided so as to be rotatable relative to the rotary shaft 20,
It further comprises a restricting portion 80 for restricting the rotation of the fixed disk 70.

With this configuration, by fixing the fixed disk 70 (regulating rotation), the rotary wheel 40 and the fixed disk 70 rotate relative to each other, and the relative rotation rotates the work holding portion 60 ( It can be rotated. Further, by restricting the rotation of the fixed disk 70 by the restriction unit 80, it is possible to prevent the fixed disk 70 from rotating together with the rotary shaft 20, and rotate the work holding unit 60 at a stable speed (constant speed). Can be made.

Further, the rotary wheel 40, the work holding part 60 provided on the rotary wheel 40, and the fixed disk 70 for rotating the work holding part 60 are provided in plural along the axial direction of the rotary shaft 20. is there.

With this configuration, a large number of works W can be rotated at one time, and the efficiency of the film forming process can be improved.

Further, the work holding section 60 is
A rotation support portion 61 that holds the work W and is rotatably supported by the rotation wheel 40,
A rotation driven portion 62 fixed to the rotation support portion 61 and arranged so as to come into contact with the fixed disk 70;
It is equipped with.

With this configuration, by forming the rotation support portion 61 and the rotation driven portion 62 as separate members, it is possible to prevent the shapes of individual components from becoming complicated.

The rotation support portion 61 is rotatably supported by the rotation wheel 40 via a bearing member 61c.

With this configuration, the work holding unit 60 can be smoothly rotated. As a result, the driving force required to rotate the work holding unit 60 can be reduced.

Further, the rotation support portion 61 is arranged such that a lower portion thereof is inserted into the rotation wheel 40 and an upper portion thereof projects upward from the rotation wheel 40.
The rotation driven portion 62 is provided on the rotation support portion 61 above the rotation wheel 40.

With this configuration, the mechanism (rotationally driven portion 62) for rotating (spinning) the work holding portion 60 can be arranged at a relatively high position (above the rotating wheel 40), and this mechanism The maintainability can be improved.

Further, the sputtering apparatus 1 (vacuum processing apparatus) according to this embodiment includes the work holding unit rotating unit 3.

With this configuration, it is possible to suppress the occurrence of unevenness of the thin film formed on the work W by performing the film forming process on the work W while rotating the work holding unit 60.

The rotary wheel 40 according to the present embodiment is an embodiment of the rotary unit.
Further, the fixed disk 70 according to the present embodiment is an embodiment of the rotation drive unit.
The target 6 according to this embodiment is an embodiment of a sputtering target.
The motor 4 according to the present embodiment is an embodiment of a power source.
Further, the rotary shaft 20 and the work holding unit 60 according to the present embodiment are an embodiment of the first rotary shaft and the second rotary shaft.
Moreover, the sputtering apparatus 1 according to the present embodiment is an embodiment of a vacuum processing apparatus.

Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and appropriate modifications can be made within the scope of the technical idea of the invention described in the claims. is there.

For example, in the present embodiment, a tool for machining (a tool for machining such as cutting, grinding, and polishing) is illustrated as an example of the work W, but the present invention is not limited to this. That is, the work W that is the target of film formation can be arbitrarily selected. For example, as other examples of the work W, various articles such as punch parts (blades for punching), die parts for die casting, blades of cutters, and the like are assumed.

Also, the shape of the work W is not limited, and any shape can be used. For example, a member having a complicated three-dimensional shape may be used as well as a rod-shaped, columnar, or prismatic member extending in one direction. It is also possible to use a member having a complicated surface shape (for example, the cutting edge of a tool) as the work W.

Further, in the present embodiment, the work W is held in a state of being inclined with respect to the rotary shaft 20 and the target 6, but the angle and direction of this inclination can be arbitrarily changed. For example, by exchanging the rotating wheel 40 with another rotating wheel 40 having a different inclination angle of the through hole 43b, the inclination angle α of the work holding portion 60 (and thus the inclination angle α of the work W) can be changed. .. Further, the inclination angle α of the work W can be changed by replacing not only the rotating wheel 40 but also other members (for example, the mounting member 50).

Further, in the present embodiment, the rotary wheel 40, the work holding part 60 provided on the rotary wheel 40, and the fixed disks 70 corresponding to the work holding part 60 are arranged vertically (two in a row). Although the situation is illustrated and described, the number of the rotating wheels 40 and the like is not limited. That is, it is possible to provide only one rotary wheel 40 or the like in the sputtering apparatus 1 or three or more rotary wheels 40 or the like.

Note that, in the present embodiment, the rotating wheel 40 and the like are arranged so as not to overlap with other rotating wheels 40 and the like that are vertically adjacent when viewed from the side. For example, as shown in FIG. 4, the rotary wheel 40, the work holding unit 60, and the fixed disk 70 provided below (lower stage) are located below the rotary wheel 40 and the like provided above (upper stage). It is arranged to be located. Thus, by arranging the two so that they do not overlap when viewed from the side, it is possible to improve the maintainability from the side.

Further, in the present embodiment, the configuration in which the target 6 and the heater 7 are arranged around the work holding unit rotation unit 3 has been illustrated, but the present invention is not limited to this. For example, it is possible to further provide an ion gun and perform pretreatment (for example, the oxide on the surface of the work W is bombarded with argon ions to be removed). Further, depending on the type of the work W, it is possible to perform the film forming process without using the heater 7.

Further, in the present embodiment, the motor 4 is illustrated as an example of the power source, but the present invention is not limited to this. That is, it is possible to use other power sources (engine, actuator, etc.).

The speed (rotation speed) of rotation (revolution and rotation) of the work holding unit 60 can be set appropriately. For example, while the work holding unit 60 passes the front surface of the target 6 by rotation (revolution) about the rotation axis 20 (while facing the target 6), the work holding unit 60 makes at least one rotation (360). °) It is set to rotate more than that. As a result, the film forming material from the target 6 can be attached to the entire area of the work W, and the adhesion and homogeneity of the thin film can be further improved.

DESCRIPTION OF SYMBOLS 1 Sputtering device 4 Motor 6 Target 20 Rotating shaft 40 Rotating wheel 60 Work holding part 61 Rotation supporting part 62 Rotated drive part 70 Fixed disk 80 Regulation part

Claims

A work holding step of holding the work so as to be revolvable about the first rotation axis and to be rotatable about the second rotation axis inclined with respect to the sputtering target.
A film forming step of forming a film on the work by using the sputtering target while performing revolution about the first rotation axis and rotation about the second rotation axis.
including,
Method for manufacturing film-formed product.
In the work holding step, the work is held so that a tilt angle with respect to the sputtering target in a state of facing the sputtering target becomes constant.
The method for manufacturing a film-formed product according to claim 1.
In the film forming step, a film is formed on the work using high frequency sputtering.
The method for producing a film-formed product according to claim 1 or 2.
In the film forming step, a film is formed on the work using reactive sputtering,
The method for producing a film-formed product according to claim 1 or 2.
In the work holding step, a tool for processing is used as the work,
The method for producing a film-formed product according to any one of claims 1 to 4.
In the film forming step, a film composed of a single layer or a plurality of layers is formed on the work, the film including at least one of AlCrN, AlN, TiCrN, TiN, TiAlN, TiAlCrN, and Al 2 O 3 .
The method for producing a film-formed product according to any one of claims 1 to 5.
The film forming step, in a state in which the work is opposed to the sputtering target by the revolution around the first rotation axis, continuously rotating the work around the second rotation axis.
The method for producing a film-formed product according to any one of claims 1 to 6.
A rotation axis,
A sputtering target arranged on the side of the rotating shaft,
A rotating portion rotatable about the rotation axis,
A plurality of workpieces capable of holding a work, arranged so as to be lined up on a circumference centered on the rotation axis, and provided on the rotation unit so as to be rotatable about an axis inclined with respect to the sputtering target. And the work holding part of
While being formed in a disk shape centering on the rotation axis, arranged to be in contact with the plurality of work holders, a rotation drive unit that rotates the work holders with the rotation of the rotating unit,
Equipped with,
Sputtering equipment.
A method for manufacturing a film-formed product, which comprises manufacturing a film-formed product using the sputtering apparatus according to claim 8.