TWI737048B - Method for manufacturing film-forming product and sputtering device - Google Patents

Abstract

The present invention provides a method for manufacturing a film-formed product, which can suppress the occurrence of unevenness in a thin film formed on a workpiece. The present invention includes a workpiece holding step of holding the workpiece W so as to be able to revolve around the first rotating shaft (rotating shaft 20) and being able to rotate around the second rotating shaft (work holding portion 60). The second rotating shaft (work holding portion 60) is inclined with respect to the target 6 (sputtering target); and the film forming step is performed while revolving around the first rotating shaft and centering on the second rotating shaft As the center rotates, the target 6 is used to form a film on the workpiece W.

Description

Method for manufacturing film-forming product and sputtering device

The present invention relates to a method for manufacturing a film-forming product and the technology of a sputtering device.

The technology of the conventional film-forming product manufacturing method and sputtering apparatus is as described in patent document 1, for example.

In Patent Document 1, a coating device has been disclosed, which performs coating while rotating a small-diameter tool. The coating device includes: a rotation jig (jig), which can hold a small diameter tool and rotate (rotation); a small revolving jig, which makes the rotation jig rotate around a small revolving axis (small revolving); and a large revolving jig , Make the small revolution fixture rotate around the big revolution axis (large revolution). The axes (rotation center lines) of the rotation jig, the small revolution jig, and the big revolution jig are arranged parallel to each other. In addition, a target is arranged on the side of the large revolution jig and the like.

In the coating device configured as described above, while the small diameter tool is rotated, the small revolution, and the large revolution are performed, the small diameter tool is coated with the material emitted from the target. By performing the above-mentioned rotation and revolution, the entire surface of the small-diameter tool can be coated.

However, in the technique described in Patent Document 1, when the small diameter tool is rotated (rotation and revolution (small revolution and large revolution)), although the side surface of the small diameter tool faces the target, the upper surface is not Will face the target. Therefore, uneven coating may occur on the side and upper surface of the small-diameter tool, and there is room for improvement in this respect. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2007-77469

[The problem to be solved by the invention]

The present invention was completed in view of the above-mentioned situation, and its object to be solved is to provide a method for manufacturing a film-formed product and a sputtering apparatus that can suppress the occurrence of unevenness in the thin film formed on the work. [Means to solve the problem]

The problem to be solved by the present invention is as described above. In order to solve the problem, the method of manufacturing a film-formed product of the present invention includes a workpiece holding step, which can revolve around the first rotation axis and can rotate around the second axis. The workpiece is held by rotating the axis of rotation as the center, and the second axis of rotation is inclined with respect to the sputtering target; The rotation axis is centered on the autorotation, and the sputtering target is used to form a film on the workpiece.

In addition, the sputtering device of the present invention includes: a rotating shaft; a sputtering target material arranged on the side of the rotating shaft; a rotating part capable of rotating around the rotating shaft; and a plurality of workpiece holding parts capable of holding The workpieces are arranged so as to be arranged on a circumference centered on the rotating shaft, and are arranged in the rotating part so as to be rotatable about an axis inclined with respect to the sputtering target material as the center; and The driving part is formed in a disk shape centered on the rotating shaft, and is arranged in contact with a plurality of the workpiece holding parts, and rotates the workpiece holding part as the rotating part rotates.

In addition, the method of manufacturing a film-formed product of the present invention is a method of manufacturing a film-formed product using the sputtering apparatus. [Effects of the invention]

According to the present invention, it is possible to suppress the occurrence of unevenness in the thin film formed on the workpiece.

Hereinafter, the directions indicated by arrows U, D, L, R, F, and B in the figure are defined as up, down, left, right, front, and back, respectively. illustrate.

Hereinafter, the outline of the sputtering apparatus 1 of this embodiment will be described with reference to FIGS. 1 and 2.

The sputtering device 1 is a vacuum processing device (vacuum film forming device) that performs film forming processing in a vacuum. In the sputtering apparatus 1 of the present embodiment, a processing tool is assumed as a workpiece (processed product) W to be a target of film formation. The sputtering apparatus 1 mainly includes a film forming chamber 2, a workpiece holding portion rotating unit 3, a motor 4, an exhaust device 5, a target (sputtering target) 6, and a heater 7.

The film forming chamber 2 forms a space for performing a film forming process on the workpiece W. The film formation chamber 2 is formed in a substantially cylindrical shape with an axis directed in the up-down direction (refer to FIG. 2 ). The film forming chamber 2 is formed in a hollow shape.

The workpiece holding portion rotating unit 3 rotates the workpiece holding portion 60 described later. The workpiece holding portion rotating unit 3 is arranged in the film forming chamber 2.

The motor 4 (refer to FIG. 1) is a driving source for driving the workpiece holding portion rotating unit 3 to rotate. The motor 4 is arranged outside the film formation chamber 2. The power of the motor 4 is transmitted to the workpiece holding portion rotating unit 3 via an appropriate power transmission mechanism (for example, a shaft, etc.).

The exhaust device 5 (refer to FIG. 1) exhausts the air in the film formation chamber 2 to adjust the inside of the film formation chamber 2 to a degree of vacuum suitable for the film formation process.

The target 6 is a material (film-forming material) formed into a film on the workpiece W. The target 6 is formed in a flat plate shape. The target 6 is arranged in the film formation chamber 2. The target material 6 is a pair provided with the workpiece holding part rotation unit 3 interposed therebetween. The target 6 has the plate surface arranged in the vertical direction. In addition, the target material 6 is arranged so that its plate surface faces the center of the film formation chamber 2 (that is, the workpiece holding portion rotating unit 3).

The heater 7 is a member for heating the workpiece W to improve the film formation quality (uniformity, etc.). The heater 7 is arranged in the film formation chamber 2. The heater 7 is provided as a pair with the workpiece holding portion rotating unit 3 interposed therebetween. The target 6 and the heater 7 are arranged around the workpiece holding portion rotating unit 3 at equal intervals.

Next, the workpiece holding portion rotating unit 3 will be described in more detail.

The workpiece holding portion rotating unit 3 shown in FIGS. 3 and 4 mainly includes a rotating shaft 20, an upper rotating body 30, a rotating wheel 40, a mounting member 50, a workpiece holding portion 60, a fixed disc 70, a restricting portion 80, and a cover ( cover) 90.

The rotating shaft 20 becomes the rotation center of the rotating wheel 40 mentioned later. The rotating shaft 20 is formed in a substantially cylindrical shape. The rotating shaft 20 is arranged with its axis facing the vertical direction (up-down direction). The outer cylindrical member 21 is fitted to the rotating shaft 20 so as to be integrally rotatable, and the outer cylindrical member 21 is formed in a cylindrical shape so as to cover the side surface of the rotating shaft 20. At the upper end of the outer cylinder member 21, a key groove 21a is formed.

The upper rotating body 30 can rotate integrally with the rotating shaft 20. The upper rotating body 30 is formed in a circular shape in a plan view. At the center of the bottom surface of the upper rotating body 30, the upper end of the rotating shaft 20 is fixed. In the vicinity of the center of the bottom surface of the upper rotating body 30, the key member 31 is fixed. By engaging the key member 31 with the key groove 21 a of the outer cylindrical member 21, the relative rotation of the upper rotating body 30 and the rotating shaft 20 is restricted. That is, the upper rotating body 30 can rotate integrally with the rotating shaft 20. The upper part of the upper rotating body 30 is rotatably supported on the upper surface of the film formation chamber 2. To the upper rotating body 30, the power of the motor 4 (refer to FIG. 1) can be transmitted. The upper rotating body 30 can rotate together with the rotating shaft 20 by the power from the motor 4.

The rotating wheel 40 shown in FIGS. 3 to 6 is a member that rotates (revolves) the work holding portion 60 described later about the rotating shaft 20. The rotating wheel 40 mainly includes a boss portion 41, a rib 42 and an outer peripheral portion 43.

The boss portion 41 is a portion formed in the center of the rotating wheel 40. The boss portion 41 is formed in a substantially cylindrical shape whose axis is directed in the vertical direction (up and down direction). In the center of the boss portion 41, a through hole 41a that penetrates the boss portion 41 up and down is formed.

The rib 42 is a rod-shaped portion formed to extend from the boss portion 41 toward the outside of the boss portion 41 in the radial direction of the rotating wheel 40. A plurality of ribs 42 (five in this embodiment) are formed at equal intervals around the boss portion 41 (refer to FIG. 6).

The outer peripheral part 43 is a part which supports the workpiece holding part 60 mentioned later. The outer peripheral portion 43 is formed in an annular shape centered on the boss portion 41 in a plan view. The inner peripheral surface of the outer peripheral portion 43 is an end portion fixed to the outside of the rib 42 in the radial direction of the rotating wheel 40. In this way, the outer peripheral portion 43 is connected to the boss portion 41 via the rib 42. Furthermore, in this embodiment, the boss portion 41, the rib 42 and the outer peripheral portion 43 are formed integrally. In the outer peripheral portion 43, an inclined surface 43a and a through hole 43b are mainly formed.

The inclined surface 43 a shown in FIGS. 5 and 6 is formed on the upper surface of the outer peripheral portion 43. The inclined surface 43a is formed to face a direction inclined with respect to the vertical direction (the axial direction of the rotating shaft 20). Specifically, the inclined surface 43a is formed to be inclined downward toward the radially outer side of the rotating wheel 40.

The through hole 43b is formed to penetrate the outer peripheral portion 43 up and down. The upper end of the through hole 43b is formed to open on the inclined surface 43a. The through hole 43b is formed so as to extend perpendicularly to the inclined surface 43a. That is, the through hole 43b is formed so as to extend in a direction inclined with respect to the vertical direction (up and down direction). More specifically, the through hole 43b is formed so as to extend toward the radially outer side of the rotating wheel 40 as it goes upward. The lower end (the opening on the lower side) of the through hole 43b is blocked by the plate-shaped blocking member 43c.

As shown in FIG. 6, the inclined surface 43a and the through-hole 43b are formed in plural at equal intervals along the circumferential direction of the outer peripheral part 43. As shown in FIG.

As shown in FIG. 4, the rotating wheel 40 is provided in the rotating shaft 20 (outer cylinder member 21). Specifically, the boss portion 41 (through hole 41 a) of the rotating wheel 40 is inserted into the rotating shaft 20. At this time, the rotating wheel 40 and the rotating shaft 20 are engaged so as to be integrally rotatable. In addition, the rotating shaft 20 is provided with rotating wheels 40 so as to be arranged in a plurality of up and down at equal intervals. In FIGS. 1, 3, and 4, as an example, two rotating wheels 40 are shown.

The attachment member 50 shown in FIGS. 4 and 5 is a member for attaching the workpiece holding portion 60 to the rotating wheel 40 described later. The mounting member 50 mainly includes a body portion 51 and a flange portion 52.

The main body 51 is a part formed in a cylindrical shape. The outer diameter of the main body 51 is formed to be substantially the same as the inner diameter of the through hole 43 b of the rotating wheel 40.

The flange portion 52 is a disc-shaped portion, and is formed such that the diameter thereof expands from the vicinity of the upper end portion of the main body portion 51.

The main body 51 is a through hole 43b inserted into the rotating wheel 40 from above. The flange portion 52 is fixed to the inclined surface 43 a of the rotating wheel 40 by an appropriate fastening member (bolt or the like). In this way, the mounting member 50 is provided in each through hole 43 b of the rotating wheel 40. The axis of the attachment member 50 (the main body portion 51) is arranged to be inclined at the same angle as the through hole 43b.

The workpiece holding unit 60 holds the workpiece W rotatably (rotatably). The workpiece holding portion 60 mainly includes a rotation support portion 61 and a driven portion 62 to be rotated.

The rotation support 61 holds the workpiece W. The rotation support part 61 mainly includes a holding part 61a and a support part 61b.

The holding portion 61a is a portion that holds the workpiece W. The holding portion 61a is formed in a substantially cylindrical shape (bottomed cylindrical shape) having a bottom surface (lower surface). The upper opening of the holding portion 61a can hold the work W inserted from the opening. Furthermore, the holding portion 61a can not only directly hold the workpiece W, but also can hold the workpiece W via an appropriate member (a cap for holding the workpiece W, etc.).

The support portion 61b is a portion that is supported by the rotating wheel 40 via the mounting member 50. The support portion 61b is formed in a substantially cylindrical shape. The outer diameter of the support portion 61 b is formed to be smaller than the inner diameter of the mounting member 50. The support portion 61b is formed to protrude downward from the bottom surface of the holding portion 61a. The supporting portion 61b and the holding portion 61a are formed on the same axis.

The supporting portion 61b is inserted into the main body portion 51 of the mounting member 50 from above. The support portion 61b is rotatably supported by the mounting member 50 (main body portion 51) via an appropriate bearing member 61c. By inserting the support part 61b into the main body part 51, the holding part 61a is arrange|positioned so that it may protrude upward from the rotating wheel 40. As shown in FIG. The axis of the rotation support portion 61 is arranged to be inclined at the same angle as the axis of the mounting member 50 (body portion 51). In other words, as shown in FIG. 1, the rotation support part 61 is arrange|positioned so that it may incline with respect to the plate surface of the target material 6 arrange|positioned at the side. The rotation support portion 61 can rotate (rotate) around an axis that is inclined with respect to the axis (up-down direction) of the rotation shaft 20.

In addition, as the bearing member 61c, any member can be used. For example, arbitrary members, such as a ball bearing (ball bearing), a roller bearing (roller bearing), and a sliding bearing (sliding bearing), can be selected suitably. In addition, a plurality of bearing members 61c may be provided for one support portion 61b.

In addition, the inclination angle of the axis of the support portion 61b (the inclination angle α described later (refer to FIG. 5)) can be arbitrarily set. For example, the support portion 61b can be set to be inclined at 20° to 80° with respect to the rotating shaft 20 or the target 6 (based on the vertical direction).

The driven portion 62 to be rotated is a portion that is in contact with a fixed disk 70 described later. The rotationally driven portion 62 is formed in a substantially circular flat plate shape when viewed in the axial direction of the self-rotating support portion 61. A through hole 62 a is formed in the center of the rotationally driven portion 62. The through hole 62 a of the rotationally driven portion 62 is above the rotating wheel 40 and is fitted into the holding portion 61 a of the rotation support portion 61. Therefore, the driven portion 62 can be rotated integrally with the rotation support portion 61.

In this way, the workpiece holding portion 60 is provided on the outer peripheral portion 43 of the rotating wheel 40 via the mounting member 50. In addition, the workpiece holding portion 60 is provided in a plurality of rows along the outer peripheral portion 43 (that is, on the circumference with the rotation shaft 20 as the center).

The fixed disk 70 shown in FIGS. 3 to 5 and 7 is a member for rotating the workpiece holding portion 60. The fixed disk 70 is formed in a circular plate shape (disc shape) in a plan view. In the center of the fixed disk 70, a through hole 70a is formed.

As shown in FIG. 4, the fixed disk 70 is provided on the rotating shaft 20 via a fixed member 71 and a bearing member 72. Specifically, the outer ring of the bearing member 72 is fixed to the inner side (through hole 70 a) of the fixed disk 70 via the fixing member 71. The inner wheel of the bearing member 72 is inserted into the rotating shaft 20 and fixed to the rotating shaft 20. As described above, the fixed disk 70 is relatively rotatably provided on the rotating shaft 20 via the bearing member 72. The fixed disk 70 is above the rotating wheel 40 and is provided at an appropriate interval from the rotating wheel 40. That is, the fixed discs 70 are provided corresponding to the respective rotating wheels 40 and the same number as the rotating wheels 40 are provided. The outer peripheral end portion of the fixed disk 70 is arranged to be in contact with the rotationally driven portion 62 of the workpiece holding portion 60 provided on the corresponding rotating wheel 40.

In addition, as the bearing member 72, any member can be used. For example, arbitrary members such as ball bearings, roller bearings, and sliding bearings can be appropriately selected.

The fixed disk 70 and the driven portion 62 to be rotated are configured in such a manner that the work holding portion 60 rotates (revolves) around the rotating shaft 20, and the power for rotating the work holding portion 60 is transmitted to the work Holding part 60. For example, the fixed disc 70 and the driven portion 62 to be rotated may be formed by gears (for example, bevel gears, etc.) having teeth that mesh with each other. Thereby, the fixed disk 70 can continuously rotate (rotate) the workpiece holding portion 60 (particularly, the workpiece W is continuously rotated in a state where the workpiece W and the target 6 face each other). In addition, the fixed disk 70 and the driven portion 62 to be rotated may be configured to be capable of contacting each other to transmit power. For example, it may also be a structure that uses a gear, a combination of a chain and a sprocket, a combination of a hole and a protrusion to transmit power, and a structure that uses friction between the contact surfaces The composition of power to transmit power, etc. In addition, the fixed disk 70 and the driven part 62 may be brought into contact via an interposer that does not include a mechanical mechanism. At this time, the fixed disc 70, which is the rotating part, is in contact with the part of the workpiece holding part 60, which is the rotated driving part 62, without interfering with the mechanical mechanism.

In addition, the fixed disk 70 and the driven portion 62 to be rotated are not limited to members that continuously transmit power such as gears and continuously rotate the workpiece holding portion 60. For example, the fixed disk 70 and the driven portion 62 to be rotated may intermittently rotate (rotate) the workpiece holding portion 60 by intermittently transmitting power using a cam or the like.

The restricting portion 80 restricts the rotation of the fixed disk 70. The restricting portion 80 mainly includes a first restricting member 81 and a second restricting member 82.

The first restricting member 81 is fixed to each fixed disc 70. The first restricting member 81 is formed by bending a rectangular plate. Specifically, the first restricting member 81 includes a left portion 81a extending horizontally, a midway portion 81b extending vertically upward from the right end of the left portion 81a, and a right portion 81c extending rightward from the upper end of the midway portion 81b. As described above, the first restricting member 81 is formed such that the radially outer portion (right portion 81c) of the fixed disk 70 is higher than the radially inner portion (left portion 81a). Therefore, interference with the workpiece holding portion 60 and the workpiece W can be avoided.

The left portion 81a of the first restricting member 81 is fixed to the vicinity of the right end portion of the upper surface of the fixed disc 70 by an appropriate fastening member (bolt or the like). The right portion 81c of the first restricting member 81 is arranged so as to protrude to the right from the fixed disk 70. In the right part 81c, a notch part 81d is formed.

The second restricting member 82 is engaged with the first restricting member 81. The second restricting member 82 is formed in a substantially cylindrical shape. The second restricting member 82 is arranged such that the axis is directed in the vertical direction (up and down direction). The upper end of the second restricting member 82 is fixed to the upper surface of the film formation chamber 2 via a bracket 82a. The second restricting member 82 is engaged with the notch portion 81d of the first restricting member 81 provided in each fixed disc 70. More specifically, the second restricting member 82 is fitted into the notch 81d of the first restricting member 81 to restrict the rotation of the fixed disk 70.

As described above, the first restricting member 81 provided on the fixed disc 70 engages with the second restricting member 82 fixed to the film forming chamber 2 to restrict the rotation of the fixed disc 70. Therefore, even if the rotating shaft 20 rotates, the fixed disk 70 does not rotate.

The cover 90 shown in FIGS. 3 to 5 covers the workpiece holding portion 60. The cover 90 is formed by appropriately bending a plate-shaped member. The cover 90 is arranged to cover the workpiece holding portion 60 from the side (the radially outer side of the fixed disk 70) and from above. In the lid body 90, a through hole 91 is formed. The work W held by the work holding portion 60 can be exposed to the outside of the cover 90 through the through hole 91. The cover 90 is fixed to the rotating wheel 40 by an appropriate method.

Next, a case where the work holding portion rotating unit 3 is operated using the power of the motor 4 will be described.

When the motor 4 is driven, the rotating shaft 20 is rotated by the power of the motor 4. The rotating wheel 40 rotates integrally with the rotating shaft 20. Thereby, the workpiece holding part 60 provided in the outer peripheral part 43 of the rotating wheel 40 rotates (revolution) with the rotating shaft 20 as a center.

On the other hand, the rotation of the fixed disc 70 is restricted by the restricting portion 80, and the fixed disc 70 is relatively rotatably provided on the rotating shaft 20. Therefore, the fixed disk 70 does not rotate with the rotation of the rotating shaft 20.

The rotationally driven portion 62 of the workpiece holding portion 60 is in contact with the fixed (non-rotating) fixed disc 70 while rotating (revolving) with the rotation shaft 20 as the center. Thereby, the workpiece holding part 60 rotates (revolves) around the rotating shaft 20 as a center, and rotates (rotates) around the axis of the workpiece holding part 60 as a center (refer to FIG. 2 ).

In addition, when the workpiece holding portion 60 rotates (revolving) around the rotating shaft 20, when viewed in the direction of the rotating shaft 20 from the outside of the workpiece holding portion 60 (in other words, as shown in FIGS. 4 and 5) When viewed in a cross-section that passes through the rotating shaft 20 and is parallel to the rotating shaft 20, the inclination angle α is always fixed. In addition, the so-called inclination angle α refers to the cross-section shown in FIGS. 4 and 5 (a cross-section viewed from the circumferential direction of a virtual circle centered on the rotation shaft 20) relative to the axis of the rotation shaft 20 and the target material. 6. The angle of the board surface. In this embodiment, the axis of the rotating shaft 20 and the plate surface of the target 6 are parallel in the vertical direction (vertical direction), so the inclination angle α is relative to the vertical direction in the cross-section shown in FIGS. 4 and 5 The angle of the virtual line X of the direction (vertical direction). The cross section viewed in the circumferential direction of the virtual circle centered on the rotation axis 20 can also be expressed as a cross section viewed from the periphery of the virtual circle centered on the rotation axis 20.

Therefore, if the workpiece holding portion 60 rotates (revolves) around the rotating shaft 20, at a position where the workpiece W and the target 6 are opposed to each other, the particles of the film-forming material collide with the workpiece W from the target 6 to form a larger film. In the thick film formation area, the inclination angle α of the workpiece holding portion 60 (work W) with respect to the target 6 is substantially constant. In addition, by rotating around the axis of the workpiece holding portion 60 at this time, the film quality of the film formed on the entire exposed surface of the workpiece W can be made uniform.

Next, the manufacturing method (sputtering method) of the film-formed product using the sputtering apparatus 1 comprised as mentioned above is demonstrated.

As shown in FIG. 8, the method of manufacturing a film-forming product of the present embodiment mainly includes a workpiece holding step S1, an exhaust step S2, a workpiece heating step S3, and a film forming step S4.

The workpiece holding step S1 is a step in which the workpiece holding unit 60 holds the workpiece W. In the workpiece holding step S1, the operator inserts the workpiece W into the holding portion 61a of the workpiece holding portion 60, and the workpiece W is held by the workpiece holding portion 60.

The exhaust step S2 is a step of exhausting the air in the film forming chamber 2. In the exhaust step S2, when the exhaust device 5 is operated, the air in the film forming chamber 2 is exhausted. By appropriately controlling the exhaust device 5, the inside of the film forming chamber 2 is adjusted to a degree of vacuum suitable for the film forming process.

The work heating step S3 is a step of heating the work W. In the workpiece heating step S3, when the motor 4 is driven, the workpiece holding portion rotating unit 3 is operated, and the rotation (revolution and rotation) of the workpiece holding portion 60 is started. In addition, in the workpiece heating step S3, the heater 7 is operated to heat the workpiece W held in the workpiece holding portion 60 to an appropriate temperature.

The film forming step S4 is a step of applying a film forming process to the workpiece W. In the film forming step S4, the work holding portion rotating unit 3 is continuously operated. In addition, in the film formation step S4, a sputtering gas (for example, an inert gas such as Ar) is supplied into the film formation chamber 2. Glow discharge is generated by applying a negative voltage or a high-frequency (Radio Frequency, RF) voltage to the target 6 in this state. Thus, by ionizing the sputtering gas, the ions collide with the surface of the target 6 at a high speed, thereby knocking out the particles (sputtering particles) of the film-forming material constituting the target 6. The particles of the film-forming material knocked out from the target 6 adhere to the surface of the workpiece W. By depositing the particles on the surface of the workpiece W, a thin film can be formed. In this way, it is possible to manufacture the workpiece W (film-forming product) that has been subjected to the film-forming process.

In addition, in the present embodiment, for convenience, the workpiece holding step S1, the exhaust step S2, the workpiece heating step S3, and the film forming step S4 have been sequentially described, but the method of manufacturing the film formed product is not necessarily limited to this. For example, the order of a part of the steps may be changed (for example, the order of the exhaust step S2 and the workpiece heating step S3, etc.), or the steps may be performed at the same time (for example, the exhaust step S2 and the workpiece heating step S3 may be performed at the same time).

Here, using FIGS. 9( a) and 9 (b ), a case will be described in which the production method of a film-formed product using the sputtering device 1 suppresses the occurrence of unevenness in the thin film formed on the workpiece W. In addition, in FIGS. 9( a) and 9 (b ), for convenience of explanation, the shape of the workpiece W is simplified, and the figure shows a cylindrical workpiece W.

As a comparative example, as shown in FIG. 9( a ), it is assumed that the workpiece W is not tilted, but rotates around an axis facing the vertical direction as the center. At this time, the workpiece W rotates, so the entire side surface of the workpiece W faces the target 6 arranged on the side of the workpiece W. Thereby, the particles of the film-forming material from the target 6 can be attached to the entire side surface of the workpiece W.

On the other hand, even if the work W rotates, since the upper surface of the work W does not face the target 6, the particles of the film-forming material from the target 6 hardly adhere to the upper surface of the work W. That is, there is a possibility that unevenness may occur in the formed thin film on the side and upper surface of the workpiece W.

Especially in the film forming process by sputtering (sputtering method), the compressive stress (internal stress) of the thin film formed on the side and upper surface of the workpiece W is different. The difference in compressive stress causes This may result in a decrease in the adhesion and homogeneity of the film.

In contrast, in this embodiment, as shown in FIG. 9( b ), the workpiece W is configured to rotate around an axis inclined with respect to the target 6. At this time, not only the side surface of the workpiece W but also the upper surface may face the target 6. Therefore, it is possible to suppress unevenness in the formed thin film on the side and upper surface of the workpiece W. In addition, on the side surface and the upper surface of the workpiece W, it is possible to suppress the generation of a difference in the compressive stress of the film, so that the adhesion and homogeneity of the film can be improved.

Hereinafter, using FIGS. 10 and 11, an example of evaluation of a tool for forming a film by the sputtering apparatus 1 (a method of manufacturing a film-forming product) of the present embodiment will be described.

In FIG. 10, a tool for forming a film by the sputtering apparatus 1 of the present embodiment (hereinafter referred to as "the application tool"), and a tool for forming a film by a conventionally known method as a comparative example (hereinafter referred to as "Comparative example") is an example of life evaluation.

Here, as the sputtering conditions in this embodiment, an AlCr-based alloy is used as a sputtering target by an RF sputtering method using an RF power source, and a film is formed by reactive sputtering. The sputtering gas used for sputtering is a mixed gas in which nitrogen is contained in argon.

Furthermore, the tool to be evaluated is the "R0.5 ball end mill (ball end mill)". The tool is a "super-hard material (super-hard alloy)" whose base material is a WC-Co alloy, and is subjected to AlCrN-based film formation (coating).

In addition, as an evaluation test, cutting was performed using the two tools described above. The type of material to be cut (the type of material to be cut) is SUS420J2 (HRC55). The processing conditions are that the speed is 30,000 (min ^-1 ), the feed speed is 1,500 (mm/min), and the cutting Rd (XY): 0.05 (mm).

In addition, as the standard of the life at the time of evaluation (the amount of wear of the tool used to judge the life of the tool), two types of standards are set, namely, (A): the amount of wear 0.005 (mm), (B): the amount of wear 0.01 (Mm). The horizontal axis of FIG. 10 represents the machining distance, and the vertical axis represents the amount of wear.

As shown in FIG. 10, when the life standard is set to (A): the amount of wear 0.005 (mm), the life of the comparative example is 104.8 (m), on the contrary, the life of the tool of the present application is 200.1 (m). That is, it can be seen that when the life criterion is set to (A): the amount of wear 0.005 (mm), the tool life of the present application is approximately doubled compared with the comparative example.

Moreover, when the life standard is set to (B): the amount of wear 0.01 (mm), the life of the comparative example is 109.8 (m), on the contrary, the life of the tool of the present application is 293.5 (m). That is, it can be seen that when the life criterion is set to (B): the amount of wear 0.01 (mm), the tool life of the present application is approximately three times longer than that of the comparative example.

FIG. 11 shows an example of the evaluation of the occurrence of defects between the tool of the present application and the comparative example.

In addition, as an evaluation regarding the occurrence of defects, the number of occurrences of tool defects when cutting with 200 (m) is performed under the same conditions as in the example shown in FIG. 10 has been compared. The number of evaluations (the number of cutting processes) is ten. After the cutting process, the tool is observed with a factory microscope at a magnification of 20 times. When a defect is confirmed regardless of the size of the defect, it is counted as having a defect.

As a result, as shown in FIG. 11, in the comparative example, out of ten evaluation times, the occurrence of defects was confirmed eight times. In contrast, in the tool of this application, out of the ten times of evaluation, only two of the defects were confirmed. That is, it can be seen that the rate of occurrence of defects in the tool of the present application is one quarter of that of the comparative example.

As described above, it can be seen that the tool for forming a film by the sputtering apparatus 1 (method of manufacturing a film-forming product) of this embodiment can achieve an extension of life and an improvement in the adhesion and homogeneity of the film (coating). Inhibition of defects.

In addition, in this embodiment, as an example of a vacuum processing apparatus (vacuum film forming apparatus), an apparatus for sputtering (sputtering apparatus 1) has been exemplified, but the present invention is not limited to this, and can also be applied to various Vacuum treatment. For example, it can be applied to a physical vapor deposition method (Physical Vapor Deposition (Physical Vapor Deposition, PVD)) other than the sputtering method that uses the physical movement of particles.

Furthermore, in PVD, as an evaporation system that heats a vapor deposition source to evaporate to form a film, there are vacuum vapor deposition, molecular beam vapor deposition, ion plating (ion plating), ion beam vapor deposition, plasma mine Laser deposition (plasma laser deposition, PLD), etc. Also, as the sputtering system exemplified in this embodiment, there are conventional sputtering, magnetron sputtering, ion beam sputtering, and electron cyclotron resonance (Electron Cyclotron Resonance). , ECR) sputtering, reactive sputtering (introduction of reactive gases (O ₂ , N _2, etc.), sputtering for film formation of oxides and nitrides), etc. In addition, depending on the material of the workpiece W, RF sputtering using an RF (high frequency) power supply may also be used.

In addition, as the thin film formed on the workpiece W according to this embodiment, a thin film composed of a single layer or multiple layers including at least one of _{AlCrN, AlN, TiCrN, TiN, TiAlN, TiAlCrN, and Al 2} O _{3 is particularly assumed.} , But other arbitrary thin films can also be formed.

Furthermore, in addition to the above-mentioned film-forming material, additives may be added as appropriate. For example, as additives, Nb, Ta, Mo, V, Y, Si, etc. can be added.

As described above, the manufacturing method of the film-forming product of this embodiment includes: The workpiece holding step S1 is to hold the workpiece W so that it can revolve around the first rotating shaft (rotating shaft 20) and can rotate around the second rotating shaft (work holding portion 60). The second rotation The shaft (work holding portion 60) is inclined with respect to the target 6 (sputtering target); and In the film forming step S4, while performing revolution around the first rotation axis and rotation around the second rotation axis, the target 6 is used to form a film on the workpiece W.

By configuring as described above, it is possible to suppress the occurrence of unevenness in the thin film formed on the workpiece W. For example, as in the present embodiment, by setting the workpiece holding portion 60 to be able to rotate (rotate) around an axis inclined with respect to the target material 6, it is possible to easily apply not only to the side surface of the workpiece W, but also to the upper surface. Film forming treatment. Thereby, the occurrence of unevenness in the formed film can be suppressed, and even the adhesion and uniformity of the film (coating) can be improved.

In addition, in the workpiece holding step S1, the workpiece W is held in such a manner that the inclination angle α with respect to the target material 6 in a state facing the target material 6 is constant.

By being configured as described above, the plurality of workpiece holding portions 60 are subjected to the film forming process in a state of being inclined at a fixed angle with respect to the target material 6, which is arranged on the radially outer side of the rotating wheel 40 . Thereby, it is possible to suppress the occurrence of the dependence of the processing surface angle of the workpiece W (defects such as unevenness due to the change in the inclination angle α).

In addition, the film forming step S4 is to form a film on the workpiece W by high-frequency sputtering.

By constituting as described above, the film quality of the formed film can be improved.

In addition, the film forming step S4 is to form a film on the workpiece by reactive sputtering.

By being configured as described above, it is possible to form a thin film of reactive gas and constituent substances of the target 6 (for example, oxides, nitrides, etc.).

In addition, in the workpiece holding step S1, a machining tool is used as the workpiece W.

By configuring as described above, it is possible to appropriately perform the film forming process on a tool for processing having a complicated shape.

In addition, the film forming step S4 is to form a film on the workpiece W, the film includes _{at least one of AlCrN, AlN, TiCrN, TiN, TiAlN, TiAlCrN, Al 2} O ₃ , and is composed of a single layer or multiple layers .

By configuring as described above, a hard film can be formed on the workpiece W, and abrasion resistance, heat resistance, etc. can be improved.

In addition, in the film forming step S4, in a state where the workpiece W and the target 6 are opposed by the revolution centered on the first rotation axis, the workpiece W is moved to the second The rotating shaft rotates continuously around the center.

By configuring as described above, the uniformity of the film (coating) can be improved.

In addition, the sputtering apparatus 1 of this embodiment includes: Rotating shaft 20; The target 6 (sputtering target) is arranged on the side of the rotating shaft 20; The rotating wheel 40 (rotating part) is capable of rotating around the rotating shaft 20; The plurality of workpiece holding parts 60 are capable of holding the workpieces W, are arranged so as to be arranged on a circumference centered on the rotating shaft 20, and are rotatable about an axis inclined with respect to the target 6 as the center Set on the rotating wheel 40; and The fixed disk 70 (rotation drive portion) is formed in a disk shape centered on the rotating shaft 20, and is arranged in contact with the plurality of workpiece holding portions 60, and is accompanied by the rotation of the rotating wheel 40 The rotation causes the workpiece holding portion 60 to rotate.

By configuring as described above, by rotating the workpiece holding portion 60 on one side, and performing a film forming process on the workpiece W using the target 6 while facing the workpiece W, the occurrence of unevenness of the thin film formed on the workpiece W can be suppressed. For example, as in the present embodiment, by setting the workpiece holding portion 60 to be able to rotate (rotate) around an axis inclined with respect to the target material 6, it is possible not only to easily align the side surface of the workpiece W, but also to the upper surface. Carry out the film forming process. Thereby, the occurrence of unevenness in the formed film can be suppressed, and even the adhesion and uniformity of the film (coating) can be improved.

In addition, the method of manufacturing a film-formed product of this embodiment uses the sputtering apparatus 1 to manufacture a film-formed product.

By configuring as described above, it is possible to suppress the occurrence of unevenness in the formed film, and even to improve the adhesion and homogeneity of the film (coating).

In addition, the workpiece holding portion rotating unit 3 of this embodiment includes: Rotating shaft 20; The rotating wheel 40 (rotating part) is capable of rotating around the rotating shaft 20; The plurality of work holding parts 60 are capable of holding the work W, are arranged so as to be arranged on a circumference centered on the rotating shaft 20, and are rotatable about an axis inclined with respect to the axis of the rotating shaft 20 as the center , Set on the rotating wheel 40; and The fixed disk 70 (rotation drive portion) is formed in a disk shape centered on the rotating shaft 20, and is arranged in contact with the plurality of workpiece holding portions 60, and is accompanied by the rotation of the rotating wheel 40 The rotation causes the workpiece holding portion 60 to rotate.

With the configuration as described above, by rotating the workpiece holding portion 60 on one side, and performing the film forming process on the workpiece W, the unevenness of the thin film formed on the workpiece W can be suppressed. For example, as in this embodiment, by setting the workpiece holding portion 60 to be able to rotate (rotate) around an axis inclined with respect to the rotating shaft 20, it is possible to easily apply not only to the side surface of the workpiece W, but also to the upper surface. Film forming treatment. Thereby, the occurrence of unevenness in the formed film can be suppressed, and even the adhesion and uniformity of the film (coating) can be improved.

In particular, in the present embodiment, a configuration is adopted in which the plurality of workpiece holding portions 60 are rotated (rotated) by the disk-shaped fixed disk 70 that is in contact with the plurality of workpiece holding portions 60. In the above-mentioned configuration, the plurality of workpiece holding portions 60 rotate and revolve while maintaining the posture inclined at a fixed angle toward the radially outer side of the rotating wheel 40. That is, the plurality of workpiece holding parts 60 are subjected to the film forming process in a state of being inclined at a fixed angle with respect to the target material 6 which is arranged on the radially outer side of the rotating wheel 40. Thereby, it is possible to suppress the occurrence of the dependence of the processing surface angle of the workpiece W (defects such as unevenness due to the change in the inclination angle α).

In addition, the rotating shaft 20 is formed to be able to rotate using power from a motor 4 (power source), The rotating wheel 40 is provided on the rotating shaft 20 in a manner capable of rotating integrally with the rotating shaft 20, The fixed disc 70 is relatively rotatably disposed on the rotating shaft 20, It further includes a restricting portion 80 that restricts the rotation of the fixed disc 70.

By configuring as described above, by fixing (restricting rotation) the fixed disk 70, the rotating wheel 40 and the fixed disk 70 are relatively rotated, and the workpiece holding portion 60 can be rotated by the relative rotation ( rotation). Furthermore, by restricting the rotation of the fixed disc 70 by the restricting portion 80, the fixed disc 70 can be prevented from rotating together with the rotating shaft 20, and the workpiece holding portion 60 can be rotated at a stable speed (fixed speed).

In addition, the rotating wheel 40, the workpiece holding portion 60 provided on the rotating wheel 40, and the fixed disk 70 that rotates the workpiece holding portion 60 are provided along the axial direction of the rotating shaft 20 Multiple.

By configuring as described above, a plurality of workpieces W can be rotated at a time, and the efficiency of the film forming process can be improved.

In addition, the workpiece holding unit 60 includes: The rotation support part 61 holds the workpiece W and is rotatably supported by the rotation wheel 40; and The driven portion 62 to be rotated is fixed to the rotation support portion 61 and is arranged so as to be in contact with the fixed disk 70.

By configuring as described above, by forming the rotation support portion 61 and the driven portion 62 to be rotated as separate members, it is possible to suppress the complication of the shape of each part.

Moreover, the said rotation support part 61 is rotatably supported by the said rotation wheel 40 via the bearing member 61c.

By configuring as described above, the workpiece holding portion 60 can be rotated smoothly. Thereby, the driving force required for the rotation of the workpiece holding portion 60 can be reduced.

In addition, the rotation support portion 61 is arranged such that the lower part is inserted into the rotating wheel 40, and the upper part protrudes upward from the rotating wheel 40, The driven portion 62 to be rotated is provided on the rotation support portion 61 above the rotating wheel 40.

By configuring as described above, the mechanism (rotationally driven portion 62) for rotating (rotating) the workpiece holding portion 60 can be arranged at a relatively high position (above the rotating wheel 40), thereby enabling the mechanism Improved maintainability.

In addition, the sputtering apparatus 1 (vacuum processing apparatus) of the present embodiment includes the workpiece holding portion rotating unit 3.

With the configuration as described above, by rotating the workpiece holding portion 60 on one side, and performing the film forming process on the workpiece W, the unevenness of the thin film formed on the workpiece W can be suppressed.

In addition, the rotating wheel 40 of this embodiment is an embodiment of a rotating part. In addition, the fixed disk 70 of this embodiment is an embodiment of the rotation drive part. In addition, the target 6 of this embodiment is an embodiment of a sputtering target. In addition, the motor 4 of this embodiment is an embodiment of a power source. In addition, the rotating shaft 20 and the workpiece holding portion 60 of this embodiment are an embodiment of the first rotating shaft and the second rotating shaft. In addition, the sputtering apparatus 1 of this embodiment is an embodiment of a vacuum processing apparatus.

As mentioned above, one embodiment of the present invention has been described, but the present invention is not limited to the above-mentioned embodiment, and can be appropriately modified within the scope of the technical idea of the invention described in the scope of the patent application.

For example, in the present embodiment, machining tools (tools for machining such as cutting, grinding, and polishing) have been exemplified as an example of the workpiece W, but the present invention is not limited to this. That is, the workpiece W to be the target of film formation can be arbitrarily selected. For example, as other examples of the workpiece W, various items such as punch parts (a knife used for drilling), die cast parts, cutter knives, and the like are conceivable.

In addition, the shape of the workpiece W is not limited, and a workpiece of any shape can be used. For example, it may not only be a rod-shaped, columnar, or prismatic member extending in one direction, but may also be a member having a complicated three-dimensional shape. In addition, a member having a complicated surface shape (for example, the tip of a tool, etc.) may be used as the workpiece W.

In addition, in the present embodiment, the workpiece W is held in a state of being inclined with respect to the rotating shaft 20 and the target material 6, but the angle and direction of the inclination can be changed arbitrarily. For example, by replacing the rotating wheel 40 with another rotating wheel 40 having a different inclination angle from the through hole 43b, the inclination angle α of the workpiece holding portion 60 (even the inclination angle α of the workpiece W) can be changed. In addition, it is not limited to the rotating wheel 40, and the inclination angle α of the workpiece W may be changed by replacing another member (for example, the mounting member 50).

In addition, in this embodiment, the following situation has been illustrated in the figure. That is, the rotating wheel 40, the workpiece holding portion 60 provided on the rotating wheel 40, and the fixed disk 70 corresponding to the workpiece holding portion 60 are arranged in two up and down rows. The number of the rotating wheels 40 and the like is not limited. That is, only one or three or more of the rotating wheels 40 and the like may be installed in the sputtering device 1.

In addition, in this embodiment, the said rotating wheel 40 etc. are arrange|positioned so that it may not overlap with other rotating wheels 40 etc. which adjoin up and down when it sees from a side. For example, as shown in FIG. 4, the rotating wheel 40, the workpiece holding portion 60, and the fixed disk 70 installed below (lower stage) are arranged to be located below the rotating wheel 40 installed above (upper stage) or the like. As described above, by arranging the two so as not to overlap when viewed from the side, the maintainability from the side can be improved.

In addition, in the present embodiment, the configuration in which the target 6 and the heater 7 are arranged around the workpiece holding portion rotating unit 3 has been exemplified, but the present invention is not limited to this. For example, an ion gun may be further installed to perform pretreatment (for example, argon ions are injected to remove oxides on the surface of the workpiece W, etc.). In addition, depending on the type of the workpiece W, etc., the film forming process may be performed without using the heater 7.

In addition, in the present embodiment, the motor 4 has been exemplified as an example of the power source, but the present invention is not limited to this. That is, other power sources (engines, actuators, etc.) may also be used.

In addition, the speed (rotation speed) of the rotation (revolution and rotation) of the workpiece holding portion 60 can be appropriately set. For example, it is set such that while the workpiece holding portion 60 passes through the front surface of the target 6 (the period facing the target 6) by rotation (revolution) centered on the rotating shaft 20, the workpiece holding portion 60 rotates at least More than one circle (360°). Thereby, the film-forming material from the target 6 can be adhered to the entire area of the workpiece W, and the adhesiveness and homogeneity of the film can be further improved.

1: Sputtering device 2: Film forming chamber 3: Rotating unit of workpiece holding part 4: motor 5: Exhaust device 6: Target (sputtering target) 7: heater 20: Rotation axis 21: Outer cylinder member 21a: Keyway 31: Key member 30: Upper rotating body 40: rotating wheel 41: boss 41a, 43b, 62a, 70a, 91: through hole 42: rib 43: Peripheral 43a: Inclined surface 43c: blocking member 50: Installation components 51: body part 52: Flange 60: Workpiece holding part 61: Rotation support part 61a: Holding part 61b: Support Department 61c, 72: bearing components 62: Driven by rotation 70: fixed disc 71: fixed component 80: Restricted Department 81: The first restricting member 81a: left 81b: Midway 81c: right 81d: Notch 82: second restricting member 82a: bracket 90: Lid α: Tilt angle B: Backward D: Downward F: Forward direction L: Left direction R: Right direction S1: Workpiece holding step S2: Exhaust step S3: Workpiece heating step S4: Film forming step U: Upward W: Workpiece X: virtual line

Fig. 1 is a schematic cross-sectional view taken along A-A showing the schematic structure of the sputtering apparatus. Fig. 2 is a schematic plan cross-sectional view of the general structure of the sputtering device. Fig. 3 is a front cross-sectional view showing the internal structure of the film forming chamber. Fig. 4 is an enlarged front cross-sectional view showing the internal structure of the film forming chamber. Fig. 5 is a front cross-sectional view showing the periphery of the workpiece holding portion. Fig. 6 is a plan view showing the structure of a rotating wheel. Fig. 7 is a plan view showing the configuration of a fixed disk and a restricting portion. Fig. 8 is a diagram showing each step of a method of manufacturing a film-formed product. Fig. 9(a) is a schematic diagram showing a state where the film forming process is performed in a state where the work is not tilted. Fig. 9(b) is a schematic diagram showing a state where the film forming process is performed in a state where the work is inclined. FIG. 10 is a diagram showing an example of the evaluation of the lifetime of the tool of the present application. FIG. 11 is a diagram showing an example of the evaluation of the defect caused by the tool of the present application.

1: Sputtering device

2: Film forming chamber

3: Rotating unit of workpiece holding part

20: Rotation axis

21: Outer cylinder member

21a: Keyway

30: Upper rotating body

31: Key member

40: rotating wheel

41: boss

41a, 70a: Through hole

42: rib

43: Peripheral

50: Installation components

60: Workpiece holding part

70: fixed disc

71: fixed component

72: bearing components

80: Restricted Department

81: The first restricting member

82: second restricting member

82a: bracket

90: Lid

α: Tilt angle

D: Downward

L: Left direction

R: Right direction

U: Upward

W: Workpiece

X: virtual line

Claims (9)

A method of manufacturing a film-formed product includes: a workpiece holding step of holding the workpiece in a manner capable of revolving around a first rotating shaft and being able to rotate around a second rotating shaft, the second rotating shaft being relative to The sputtering target is inclined; and the film forming step includes performing revolution centered on the first rotation axis and rotation centered on the second rotation axis, while using the sputtering target to perform the The workpiece is formed into a film, and in the workpiece holding step, in each of the plurality of layers divided along the direction of the first rotation axis, the workpiece is set so that one end side is held, and the other end side is always held by the The first rotating shaft is centered and faces radially outward, wherein the workpiece provided in each of the plurality of layers is arranged on a circle having the same radius as the first rotating shaft as the center. In the method of manufacturing a film-formed product described in the first item of the scope of the patent application, in the workpiece holding step, the workpiece is held in a state facing the sputtering target The inclination angle relative to the sputtering target is fixed. The method for manufacturing a film-forming product as described in item 1 or item 2 of the scope of patent application, wherein the film-forming step is to use high-frequency sputtering to form a film on the workpiece. The method for manufacturing a film-forming product as described in item 1 or item 2 of the scope of patent application, wherein the film-forming step is to form a film on the workpiece by reactive sputtering. Such as the manufacturer of the film-forming product described in item 1 or item 2 of the scope of patent application Method, wherein the workpiece holding step is to use a machining tool as the workpiece. The method for manufacturing a film-forming product as described in item 1 or item 2 of the scope of patent application, wherein the film-forming step is to form a film on the workpiece, and the film includes AlCrN, AlN, TiCrN, TiN, TiAlN, TiAlCrN , _{At least one of Al 2} O ₃ , and is composed of a single layer or multiple layers. The method of manufacturing a film-formed product as described in item 1 or item 2 of the scope of the patent application, wherein the film-forming step is performed by revolving around the first rotation axis to make the workpiece and the In a state where the sputtering target materials face each other, the workpiece is continuously rotated around the second rotation axis. A sputtering device includes: a rotating shaft; a sputtering target material arranged on the side of the rotating shaft; a rotating part capable of rotating around the rotating shaft; a plurality of workpiece holding parts arranged on the rotating shaft Part, which can hold the workpiece, is arranged so as to be arranged on a circumference centered on the rotating shaft, can be rotated around an axis inclined with respect to the sputtering target, and is held in the direction of the axis One end side of the workpiece, and the other end side of the workpiece can be held so as to always face radially outward with the rotation shaft as the center; and a rotation driving portion formed as a disk centered on the rotation shaft It is arranged so as to be in contact with a plurality of the workpiece holding portions that are fixed so as not to rotate. As the rotation portion rotates, the workpiece holding portion is rotated, and the rotating portion, more Each of the workpiece holding portion and the rotation driving portion are arranged at Among a plurality of layers divided in the direction of the rotation axis, and the workpiece holding portion provided in each of the plurality of layers is arranged on a circle having the same radius as the rotation axis as a center. A method for manufacturing a film-forming product, using the sputtering device as described in item 8 of the scope of patent application to manufacture the film-forming product.

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