Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
  • B23K26/03—Observing, e.g. monitoring, the workpiece
  • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01D—SEPARATION
  • B01D1/00—Evaporating
  • B01D1/0011—Heating features
  • B01D1/0017—Use of electrical or wave energy
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/20—Bonding
  • B23K26/21—Bonding by welding
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/70—Auxiliary operations or equipment
  • B23K26/702—Auxiliary equipment
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
  • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
  • B23K31/125—Weld quality monitoring
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
  • G01B11/00—Measuring arrangements characterised by the use of optical techniques
  • G01B11/22—Measuring arrangements characterised by the use of optical techniques for measuring depth
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
  • G01B9/00—Measuring instruments characterised by the use of optical techniques
  • G01B9/02—Interferometers
  • G01B9/02015—Interferometers characterised by the beam path configuration
  • G01B9/02029—Combination with non-interferometric systems, i.e. for measuring the object
  • G01B9/0203—With imaging systems
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
  • G01B9/00—Measuring instruments characterised by the use of optical techniques
  • G01B9/02—Interferometers
  • G01B9/0209—Low-coherence interferometers
  • G01B9/02091—Tomographic interferometers, e.g. based on optical coherence

Definitions

• Laser processing system for processing a workpiece by means of a laser beam and method for controlling a laser processing system
• the present invention relates to a laser processing system for processing a workpiece by means of a laser beam, in particular a laser welding system, and a method for controlling a laser processing system.
• the present invention preferably relates to a laser processing system with an optical coherence tomograph for interferometri see distance measurement, and a method for controlling the same.
• a processing system for processing a workpiece by means of a laser beam the laser beam emerging from a laser light source or one end of a laser guide fiber is focused or bundled onto the workpiece to be processed using beam guidance and focusing optics.
• the processing can include, for example, laser cutting, laser soldering or laser welding, in particular laser deep penetration welding.
• the laser processing system can for example include a laser processing head, in particular a welding head.
• the material of the workpiece for example metal
• the material of the workpiece for example metal
• This area is known as the so-called "vapor capillary" or "keyhole”.
• the depth of the vapor capillary is related, for example, to a welding depth, i.e. the depth to which the metal was melted during a welding process.
• the depth of the steam capillary is usually measured at the deepest point of the steam capillary. This point is also known as the “keyhole floor” or “processing floor”.
• “depth of the steam capillary” or “keyhole depth” denotes the maximum depth of the steam capillary.
• the depth of the steam capillary is of great interest: On the one hand, knowledge of the depth of the steam capillary allows conclusions to be drawn about the strength of a welded joint, i.e. whether the weld was sufficiently deep, on the other hand, knowledge of the fe the vapor capillary ensure that the weld seam is not visible on the underside, i.e. that there is no undesired penetration.
• Fig. 1 is a schematic cross-sectional view of a workpiece 10 to be processed during a laser processing process, in particular a welding process, which is carried out by a laser processing system.
• a laser machining head (not shown) of the laser machining system is used to radiate a laser beam 148 onto a surface 16 of a workpiece 10, the laser beam being moved along a so-called machining direction 80 over the surface 16.
• a vapor capillary 12 is formed in an area between the surface 16 of the workpiece 10, onto which the laser beam 148 is irradiated, up to a certain depth within the workpiece 10.
• the material of the workpiece 10 is heated so much by the radiated laser power that it evaporates.
• the material in the area of the vapor capillary 12 is in a vaporous state of aggregation.
• the vapor capillary 12 is surrounded by a region 14 in which the material is present in a molten state, ie in a liquid aggregate state.
• the area 14 is also referred to as a “melt pool”.
• optical coherence tomography optical coherence tomography
• OCT optical coherence tomography
• an optical measuring beam 126 of an optical coherence tomograph (not shown) for measuring the depth of the vapor capillary 12 is radiated onto the workpiece 10.
• the so-called measuring spot the measuring beam is reflected back from the workpiece 10 in the optical coherence tomograph.
• the measuring beam 126 can run essentially parallel or coaxial to the laser beam 148.
• the optical measuring beam In order to be able to measure the depth of the steam capillary correctly, the optical measuring beam must be aligned so that the light of the measuring beam reaches the lower end of the steam capillary and the light reflected from there returns to the optical coherence tomograph.
• the geometric properties of the steam capillary such as shape, size, etc.
• its position on the workpiece surface depend on the parameters tern of the laser machining process.
• parameters such as the processing direction, the focus size of the laser beam, the material of the workpiece and the welding geometry, ie the shape or the course of the weld seam, play a decisive role.
• a variation in the advance speed of the laser beam has the following effects on properties of the vapor capillary: increase or decrease in the angle of inclination of the front wall of the vapor capillary; Shifting the position of the lowest point of the steam capillary (so-called "keyhole bottom") or a lower opening of the steam capillary in the case of a weld through into the wake; Increasing or decreasing the opening of the vapor capillary in the processing direction; or shifting the position of the opening of the vapor capillary relative to the lateral focus position of the laser beam. This is because a point on the workpiece surface requires a certain amount of time to reach a sufficient temperature for the formation of a vapor capillary.
• the optical measuring beam must be adjustable to the respective laser machining process or it must be adjustable during the respective laser machining process.
• a point of impact of the measuring beam also referred to as the “position of the measuring beam” on the workpiece or the focus position of the measuring beam must be adjustable or controllable.
• the position of the measuring beam on the material surface or the point of impact of the measuring beam on the workpiece surface must be adjustable or controllable relative to the position of the vapor capillary on the workpiece surface, so that it is ensured that the measuring beam is always at the correct location for the welding depth measurement Workpiece hits.
• the position on the workpiece surface can also be referred to as the “lateral position”.
• a suitable position of the measurement spot relative to the position of the vapor capillary for the respective set process parameters can be determined or set in advance, and can then remain unchanged during the execution of the welding process. In the case of linear weld seams, it can therefore be a static position for the respective parameters.
• the optimal position of the optical measuring beam for the welding depth measurement must be determined for each set of parameters of the welding process before the welding process is carried out.
• the setting such as the alignment, focus position and / or position of the optical measuring beam relative to the laser beam or the laser processing head, must be determined beforehand.
• a change in the position of the measuring beam for example due to drifting of readings or other inaccuracies in the laser processing system, is not excluded and leads to a deviation from the ideal measuring position during the welding process.
• galvo scanners as a deflection unit for the measuring beam, it is difficult to prevent drift.
• the position of the measuring spot must be adjusted during the welding process.
• the optimal position for the welding depth measurement of the measuring spot must be known and precisely timed to be approached during the laser machining process in order not to receive incorrect depth information about the vapor capillary.
• the method for determining the deepest point of the vapor capillary is therefore significantly more complex, since each segment of the curved weld seam has a different optimal position of the measurement spot, which must be determined or set in advance for each segment. For a correct welding depth measurement, the segments must therefore either be selected to be very small, or interpolation must be made between the segments.
• An optical coherence tomograph typically has a single measuring beam. Accordingly, a distance measurement can only be carried out at a single point on the workpiece surface at a given point in time. This means that measurements can either be made at the deepest point of the steam capillary or in its vicinity (eg a side wall of the steam capillary, the workpiece surface or the upper seam). If the measuring beam is held unchanged at a predetermined position, the distance information obtained cannot be used to determine whether the position of the measuring beam is the deepest point of the steam capillary or whether the measuring beam hits a side wall of the steam capillary.
• FIG. 2 shows, by way of example, a measured depth profile of a vapor capillary along or parallel to the processing direction (FIG. 2A) and transversely to the processing direction of the laser beam (FIG. 2B).
• the vapor capillary can be seen as a top or peak.
• the optical measuring beam is therefore temporarily not located at the deepest point of the vapor capillary.
• this time can be kept short, but not reduced to zero.
• the welding depth is to be regulated to a predetermined value, it is advantageous or essential to receive information from the deepest point of the steam capillary in constant or as short periods of time as possible.
• the optical coherence tomograph should preferably measure the deepest point of the vapor capillary as continuously or without interruption as possible. This means that the position of the deepest point of the vapor capillary must be known for an uninterrupted welding depth measurement.
• An alternative to the described creation of a height profile of the workpiece surface with the help of the optical coherence tomograph is to set up a mathematical model with which the optimal position of the measuring beam can be calculated as a function of the given process parameters.
• a mathematical model is very complex due to the large number of different welding parameters.
• such a procedure requires a lot of effort to set up and evaluate the model on the basis of experiments.
• this approach does not solve the problem that e.g. in the event of a drift of the deflection unit or inaccuracies, an incorrect position of the measuring beam is not detected.
• Another alternative is to use a second optical coherence tomograph.
• the first optical coherence tomograph continuously scans the workpiece surface. i erlich to create a height profile or a topography of it.
• the second optical coherence tomograph continuously measures the depth of the vapor capillary.
• the two tomographs must be calibrated to each other and must not move relative to each other during operation, for example due to drift, since otherwise the correlation between the impact position of the first tomograph and the measured depth of the second tomograph is no longer given.
• this variant is uneconomical for reasons of cost.
• the measuring beam of an optical coherence tomograph could be split into two partial beams, the partial beams being adjustable independently of one another.
• the available measuring range of the optical coherence tomograph must then be divided into two areas, since two distance information items are available at the same time. This reduces the measuring range available for the welding depth measurement. Furthermore, there is also the problem with these alternatives that in the event of a drift the position of the measuring beam, which measures the depth of the vapor capillary, is no longer known exactly.
• the invention is based on the idea of using an image acquisition unit to acquire both a vapor capillary generated in a workpiece by a laser of the laser processing system and the point of incidence of an optical measuring beam of an optical measuring device of the laser processing system.
• the image capturing unit can capture light that is emitted or reflected by the vapor capillary, and light of the optical measuring beam that appears as a measurement spot at the point of impact on the workpiece and, based on this, generate an image that shows the vapor capillary and the point of impact Contains measuring beam.
• the position of the optical measuring beam for an accurate and continuous measurement of the depth of the vapor capillary for example by interferometric distance measurement and the position of the vapor capillary can be determined and set during a machining process, preferably in real time.
• the position of the measurement spot can be adjusted based on this on an ideal position relative to the position of the steam capillary for measuring the maximum depth of the steam capillary.
• An interruption in the measurement of the welding depth or the depth of the vapor capillary by the optical measuring device or the regulation of the measuring position is therefore not necessary.
• the point of incidence of the optical measuring beam on the workpiece and its alignment to a suitable position for measuring the depth of the vapor capillary can thus be carried out reliably, inexpensively and easily.
• a laser processing system preferably a laser welding system or a system for deep laser welding, comprises: a laser processing head for irradiating a laser beam onto a workpiece, in particular onto a workpiece surface, for generating a vapor capillary; an optical measuring device for distance measurement, in particular for measuring a depth of the vapor capillary, by means of an optical measuring beam; an image capturing unit that is configured to capture an image of a region of the workpiece or the workpiece surface that includes the vapor capillary and a measurement spot generated by irradiating the optical measuring beam, wherein the laser processing system or the image capturing unit is configured to use the captured image To determine the position of the measuring spot and a position of the steam capillary.
• the measuring spot is the location on the workpiece where the optical measuring beam strikes and can also be referred to as the point of incidence or the area of incidence of the optical measuring beam.
• a method for controlling a laser processing system comprises the following steps: irradiating the laser beam onto a workpiece surface to generate a vapor capillary; Radiation of an optical measuring beam on the workpiece surface to measure a depth of the vapor capillary; Acquiring an image of a region of the workpiece surface which comprises the vapor capillary and a measuring spot generated by irradiating the optical measuring beam; and determining, based on the captured image, a position of the measurement spot and a position of the vapor capillary.
• the method can in particular be set up to control a laser machining system according to embodiments of this disclosure.
• a laser processing system according to embodiments of this disclosure can in particular be set up to carry out a method according to the disclosure. Preferred aspects of the present disclosure which can be combined with one another are listed below.
• the image acquisition unit can be attached to the laser processing head or integrated in the same.
• the image acquisition unit can be a camera or digital camera that is set up to take photos of the workpiece, in particular of the area of the workpiece that includes the vapor capillary and the point of incidence of the optical measuring beam.
• the digital camera can also record or generate a video or a video stream.
• the image acquisition unit is preferably arranged coaxially on the laser processing head. In this way, parallax errors can be avoided in the image evaluation. In addition, this enables a compact and space-saving design for the laser processing system.
• Optical axes or beam paths of the image acquisition unit and of the measuring beam preferably run at least partially parallel and / or coaxially, preferably at least partially parallel and / or coaxially in the laser processing head.
• the image acquisition unit or a camera of the image acquisition unit can be arranged coaxially to a beam path of the laser beam and / or the measuring beam.
• the image acquisition unit is set up to acquire thermal radiation, in particular radiation between 950 nm and 1700 nm. Thermal radiation is emitted by the surface of the workpiece heated by the laser beam and in particular by the vapor capillary.
• the image acquisition unit can accordingly comprise an infrared camera.
• the image acquisition unit can be set up to detect light in the visible spectral range, preferably light between 300 nm and 100 nm, in particular light between 400 nm and 800 nm.
• the image acquisition unit can have a spectral sensitivity in the wavelength range of the thermal radiation generated by the vapor capillary or the melt pool and / or in the wavelength range of the optical measuring beam.
• the image capturing unit is preferably particularly sensitive in a wavelength range of the measuring beam. This leads to a stronger contrast in the captured image between the measurement spot and the workpiece surface. In this way, the measurement spot can be displayed particularly easily on the captured image and then evaluated. In particular, the position of the measurement spot can thereby be determined particularly reliably.
• suitable evaluation of the image or video for example by appropriate image processing, the position of the steam capillary on the workpiece and the geometry of the steam capillary and / or the melt pool can be recognized or determined.
• a contour of the weld pool can be recognized.
• melted areas and / or solidified areas of the workpiece can be recognized or distinguished.
• This recognition can be done with the help of texture analysis.
• the measurement spot can be determined.
• the geometric center of gravity of the measurement spot and / or the geometric center of gravity of the vapor capillary can be determined. This can be done using suitable image processing methods, for example texture analysis, evaluation of the shape of the weld pool, etc.
• the position of the measurement spot can thus be determined relative to the position of the vapor capillary, preferably relative to the deepest point of the vapor capillary.
• the evaluation can be carried out by the image acquisition unit itself or by a computing unit of the laser processing system.
• the evaluation of the captured image or the captured images can essentially be carried out in real time.
• the laser processing system can be set up to regulate the measuring beam in such a way that it is always correct for measuring the welding depth, i.e. is aligned or positioned at the optimal position on the workpiece.
• the position of the measuring beam can be regulated relative to the position of the vapor capillary and / or the position of the laser beam.
• the focus position and / or alignment of the optical measuring beam can be regulated.
• the measurement beam can be controlled in real time.
• the image evaluation can be used to check whether the measuring beam is correctly positioned or aligned.
• the position of the measuring spot can therefore be continuously, i.e. can be determined and / or adjusted without interruption. In other words, the position of the measurement spot can always be determined reliably and in real time. In addition, no additional optical measuring device is required, so that costs are saved.
• the optical measuring device can be set up to direct the optical measuring beam into the vapor capillary.
• a maximum depth of the steam capillary can be determined.
• a position of the vapor capillary with maximum depth can be determined or estimated on the basis of the image.
• the deepest point of the steam capillary in the processing direction is located at the rear edge of the steam capillary. In this case, if the measuring beam is controlled in such a way that it is directed at this position, a maximum depth of the vapor capillary can be determined.
• the laser processing system or the optical measuring device can furthermore have an adjusting device which is set up to adjust or align the optical measuring beam.
• the setting device can, for example, comprise a beam deflection unit, for example a mirror or galvano scanner, and can be controlled by a computing unit of the laser machining system or the optical measuring device.
• the image acquisition unit preferably has a notch filter which is set up to filter or block a wavelength range of the laser beam. This ensures that the image acquisition unit does not overdrive due to the high light output of the laser beam compared to the light output of the optical measuring beam and the vapor capillary. In addition, light that is emitted or reflected by the vapor capillary and light of the measuring beam that is reflected by the workpiece can be reliably detected by the image acquisition unit without being superimposed by the light of the laser beam.
• the measuring device preferably comprises an optical coherence tomograph.
• the image acquisition unit preferably comprises a camera, for example a CCD camera and / or a CMOS camera and / or an infrared camera.
• a lighting unit is provided on the laser processing head for illuminating the detected area of the workpiece surface, e.g. by means of visible light and / or infrared light.
• the evaluation of the image of the workpiece area captured by the image capture unit can be improved or simplified, since, for example, the vapor capillary stands out more strongly from the background and is therefore more visible.
• the wavelength range of the light that is reflected by the vapor capillary can be adapted to the wavelength range of the light in which the image acquisition unit is sensitive (so-called “spectral sensitivity”).
• the lighting unit can be set up to couple light into the beam path of the laser beam and / or the optical measuring beam and / or the image capture unit.
• the light from the lighting unit can be directed onto the workpiece on the same path or in the same way as the laser beam or the optical measuring beam.
• the light of the lighting unit runs at least in parts within the processing head of the laser processing system. Accordingly, an adjustment Solution of the laser processing head or an end section of the laser processing head to the lighting unit can be avoided.
• the laser processing system or the optical measuring device can have a visualization unit which is set up to generate a visualization beam for visualizing the point of impact of the optical measurement beam and to couple it into the beam path of the measurement beam.
• a visualization spot generated by the irradiation of the visualization beam is preferably concentric with the measurement spot.
• a wavelength of the visualization beam can be adapted to the spectral sensitivity of the image acquisition unit.
• the power of the visualization beam can be selected or adjusted in a targeted manner and independently of the power of the optical measuring beam. As a result, in particular a visualization beam with a significantly higher power than the power of the optical measuring beam can be selected.
• the wavelength of the visualization beam can be selected or set in such a way that reflected light of the visualization beam passes the notch filter of the image acquisition unit as unaffected as possible.
• the wavelength of the visualization beam can be selected such that the notch filter is essentially transparent for the visualization beam. Since the measurement spot and the visualization spot are concentric, the position of the measurement spot can be determined based on the position of the visualization spot in the captured image.
• the visualization beam preferably has a wavelength that is different from the wavelength of the laser beam.
• the visualization beam can be coupled into an optical fiber of the optical measuring device by means of a fiber coupler, in which the optical measuring beam is guided.
• the visualization beam is at least partially coupled into an optical fiber of the optical measuring device, i. E. at a point before the measuring beam is introduced into the laser processing head. Since the visualization beam is already coupled into the optical fiber of the optical measuring device, the visualization beam is mapped to the same position on the workpiece as the measuring beam. A lateral offset between the position of the visualization spot and the measurement spot due to adjustment errors, drift of deflection units or other inaccuracies in the processing head of the laser processing system can therefore be avoided.
• the laser processing system further comprises a computing unit.
• the computing unit can comprise or be a control unit of the laser processing system for controlling the same.
• the computing unit can be set up to perform one or more functions of the image acquisition unit and / or the optical measuring device.
• the computing unit can be set up to evaluate the image captured by the image capturing unit as described above or to determine a position of the measurement spot and / or a position of the vapor capillary based on the image captured by the image capturing unit.
• the computing unit can be set up to set or regulate a position of the optical measuring beam or a position of the measuring spot relative to the vapor capillary.
• the computing unit can be set up to carry out a method according to the disclosure.
• the position of the measurement spot relative to the position of the steam capillary is preferably regulated in real time and a maximum depth of the steam capillary is continuously determined.
• Figure 1 is a schematic cross-sectional view of a workpiece
• FIGS. 2A and 2B show exemplary measurements of a depth profile of a workpiece
• FIG. 3 shows a schematic view of a laser processing system according to a first embodiment of the invention
• FIG. 4 shows a schematic view of an image which is recorded by an image acquisition unit of a laser processing system according to embodiments
• FIGS. 5A and 5B show schematic views of a laser processing system according to further embodiments of the present invention.
• FIG. 6 shows a schematic view of a laser processing system according to a second embodiment of the present invention
• FIG. 7 shows a block diagram which illustrates a method for processing a workpiece by means of a laser beam according to an embodiment of the present invention.
• the laser processing system 100 comprises a processing head 122, for example a laser welding head or a laser cutting head.
• the laser processing system 100 further comprises a laser device (not shown) for providing a laser beam 148 (also referred to as “processing beam” or “processing laser beam”) and an optical measuring device 128 set up for interferometric distance measurement by means of an optical measurement beam 126.
• a distance is between a workpiece 10 to be machined and an end portion of the machining head 122, for example a nozzle or a cross jet, measured.
• the end section, or the nozzle or crossjet has an opening through which the laser beam 148, optionally together with a process gas, emerges from the processing head 122.
• the laser processing system 100 or parts thereof, for example the processing head 122, can be movable along at least one processing direction 80.
• the processing direction 80 can be a cutting or welding direction and / or a movement direction of the laser processing system 100, such as the processing head 122, with respect to the workpiece 10.
• the machining direction 80 can be a horizontal direction.
• the machining direction 80 can also be a lateral direction with respect to an upper surface of the workpiece 10 to be machined.
• the machining direction 80 can also be referred to as the “feed direction”.
• the laser processing system 100 can have collimator optics 130 for collimation of the laser beam 148.
• the laser beam 148 can be deflected or reflected by suitable optics (not shown) by approximately 90 ° in the direction of the workpiece 10.
• the optics for example a semi-transparent mirror, can be set up to, for example, light reflected back from the workpiece 10, such as light from the measuring beam 126 or from a lighting unit or visualization unit described later to pass through to the measuring device 128.
• the collimator optics 130 can be integrated into the processing head 122.
• the processing head 122 can comprise a collimator module 132 that is integrated into the processing head 122 or mounted on the processing head 122.
• the optical measuring device 128 can comprise a coherence tomograph or can be a coherence tomograph.
• the coherence tomograph can include an evaluation unit 134 with a broadband light source (e.g. a superluminescent diode, “SLD” for short) that couples the measuring light into an optical waveguide 136.
• a broadband light source e.g. a superluminescent diode, “SLD” for short
• the measuring light is typically split into a reference arm 140 and a measuring arm, which leads into the processing head 122 via an optical waveguide 142.
• the optical measuring device 128 can furthermore comprise collimator optics 144 which are set up to collimate an optical measuring beam 126.
• the collimator optics 144 can be integrated in the processing head 122.
• the processing head 122 can include a collimator module 150 that is integrated into the processing head 122 or mounted on the processing head 122.
• a focusing optics 124 is also provided, which is set up to focus the laser beam 148 and / or the optical measuring beam 126 on the workpiece 10.
• the focusing optics 124 can be a common focusing optics, such as, for example, a focus lens, for the laser beam 148 and the measuring beam 126.
• the laser beam 148 and the optical measuring beam 126 can run at least partially parallel or even coaxially, and in particular can be superimposed at least partially coaxially.
• the optical measuring device 128 can be set up to couple the optical measuring beam 126 into a beam path of the laser device 100.
• the merging of the optical measuring beam 126 and the laser beam 148 can take place after the collimator optics 144 and before the focusing optics 124.
• the beam paths of the measuring beam 126 and the laser beam 148 can be guided largely separately and only brought together after the focusing optics 124 and before the opening of the laser processing head 122.
• the beam axes of the laser beam 148 and the measuring beam 126 can run parallel to one another or even coaxially at the level of the opening or the end section of the laser processing head 122, and are preferably essentially perpendicular to the surface of the workpiece 10.
• a separate focus lens can be used for the measuring beam 126 and the laser beam 148 can be provided so that both beams can be focused on the workpiece 10.
• the principle described here for distance measurement is based on the principle of optical coherence tomography, which makes use of the coherence properties of light with the aid of an interferometer. To measure the distance, the optical measuring beam 126 is directed onto a surface of the workpiece 10.
• the light of the measuring beam reflected back from the surface is mapped onto the exit / entry surface of the optical waveguide 142, the light reflected back from the reference arm 140 is superimposed in the fiber coupler 138 and then directed back into the evaluation unit 134.
• the superimposed light contains information about the path length difference between the reference arm 140 and the measuring arm. This information is evaluated in the evaluation unit 134, whereby the user receives, for example, information about the distance between the surface of the workpiece and the machining head 122 or about a depth of a steam capillary.
• the optical measuring beam 126 is directed into the vapor capillary and reflected back to the measuring device 128 in the vapor capillary.
• a distance to the workpiece surface 16 or a position of the workpiece surface can be known.
• the measuring device 128 or the evaluation unit 134 can measure a depth of the vapor capillary, i.e. determine the distance of a reflective bottom of the vapor capillary to the surface 16 of the workpiece 10, based on the reflected measuring light.
• the measuring beam 126 must be directed to the lowest point of the steam capillary.
• the laser processing device 100 further comprises an image acquisition unit 152, for example a camera.
• the image acquisition unit 152 can, as shown in FIG. 3, be arranged coaxially on the laser processing head 122, or can be integrated coaxially in the laser processing head 122.
• a beam path 156 of the image acquisition unit 152 runs at least in sections through the processing head 122, so that the image acquisition unit 152 can acquire an image of the processing area of the workpiece 10, in particular an area of the workpiece 10 that includes the vapor capillary 12 and the measurement spot.
• an optical axis of the image acquisition unit 152 and the optical measuring beam 126 can run parallel at least in sections, or in particular can be superimposed coaxially at least in sections.
• the image capturing unit 152 may include a coaxial camera.
• the image acquisition unit 152 is set up to receive light or electromagnetic radiation reflected from the workpiece 10 to be processed or from the workpiece 10 to be processed Workpiece 10 to detect emitted light or electromagnetic radiation and based on it to capture or generate an image of the workpiece 10, in particular an image of a region of the surface of the workpiece 10.
• the emitted light or the emitted electromagnetic radiation includes, for example, thermal radiation emitted by the vapor capillary or molten bath, which occurs due to the increased temperature of the material of the workpiece 10.
• the reflected light or the reflected electromagnetic radiation includes, for example, light from the measuring beam 126, which is reflected from the surface of the workpiece 10 or the bottom of the vapor capillary.
• the image acquisition unit 152 is set up, in particular, to acquire an image of a region of the surface of the workpiece 10 to be processed, which includes the vapor capillary and the point of incidence or measurement spot of the measurement beam 126.
• the area can also include the melt pool.
• the image acquisition unit 152 can be set up to acquire an image of the area at regular time intervals or continuously.
• the image capture unit 152 may capture a video or a video stream of the area.
• the image acquisition unit 152 or the camera can be set up to generate thermal radiation, i.e. Detect infrared light and / or light of the visible spectral range.
• thermal radiation i.e. Detect infrared light and / or light of the visible spectral range.
• silicon-based camera chips for example CCD, CMOS
• InGaAs-based camera chips which are sensitive in a wavelength range of approx. 950 nm
• a wavelength range of the laser emission is preferably blocked, since otherwise there is a risk of the camera image being overdriven by the laser radiation, which generally has a few kilowatts.
• the image acquisition unit 152 or the camera is sensitive in the wavelength range of the light of the measuring beam 126.
• Typical wavelengths or wavelength ranges for an optical coherence tomograph based on the so-called Fourier domain OCT are 800 nm to 900 nm, 100 nm to 100 nm, 1310 nm or 1550 nm. Other emission wavelengths are possible.
• the image acquisition unit 152 can also have a so-called notch filter 154.
• the notch filter 154 is set up to block the processing laser, in particular reflected light from the laser beam 148, in order to avoid overdriving the captured image. In addition, it can be ensured with the aid of the notch filter 154 that the vapor capillary and the measuring spot of the optical measuring beam 126 are clearly recognizable on the captured image and are not superimposed by the light of the laser beam 148.
• Typical processing lasers emit narrow-band in the wavelength range from 1030 nm to 1070 nm, for example at 1030 nm, 1064 nm or 1070 nm. Other emission wavelengths are possible.
• the notch filter should therefore be designed or optimized to the effect of filtering out the wavelength or the wavelength range of the light of the laser beam 148 and not allowing it to pass through to the image acquisition unit 152.
• the wavelength or the wavelength range of the optical measuring beam 126 should be selected such that it is not filtered or blocked by the notch filter 154. Accordingly, the wavelength or the wavelength range of the optical measuring beam 126 is preferably different from the wavelength or the wavelength range of the light of the laser beam 148.
• the notch filter 154 can also be designed to be transparent not only for the wavelength range of the measuring beam 126, but also for the visible spectral range or the infrared range, so that the imaging unit 152 or the vapor capillary based on the thermal radiation in the infrared range based on visible light.
• the image acquisition unit 152 can also be set up in such a way that it is not sensitive to the wavelength range of the laser beam 148.
• the intensity of the measuring spot on the workpiece must be high enough to be captured with the image acquisition unit 152.
• the portion that is reflected or scattered back into the image acquisition unit 152 or into the camera is considerably reduced. Then there is only scattering or reflection on the side walls of the steam capillary or on particles that are located in the area of the opening of the steam capillary. If the laser device and the optical coherence tomograph emit at similar wavelengths (e.g.
• the requirements for the notch filter increase considerably, since it has to suppress the laser completely by several orders of magnitude, but the wavelength of the OCT completely must transmit.
• the optical coherence tomograph is operated with commercially available superluminescence diodes (SLD), a few tens or a few hundred milliwatts of light output are usually available. Compared to several kilowatts of light output with the processing laser, the output of the SLD is very low.
• SLD superluminescence diodes
• FIG. 4 shows an example of an image 400 as it can be captured or generated by the image capture unit according to embodiments of the present invention.
• the image 400 can be captured or generated as a digital image or photo.
• the image can have a plurality of pixels.
• the image 400 is a top view of a region or section of a workpiece 10 which is processed by a laser processing system according to embodiments of the present invention.
• the image 400 is recorded during a laser machining process that is carried out by the laser machining system according to embodiments of the present invention.
• the machining direction 80 of the laser machining process is indicated by an arrow.
• the image 400 shows the area or section of the workpiece 10, which comprises the steam capillary 12, the molten bath 14 surrounding the steam capillary 12 and the seam top bead 15 downstream of the molten bath 14, in plan view, i.e. from the perspective of the image capture unit 152.
• the image 400 contains the measuring spot 18, which is produced by the impingement of the optical measuring beam 126 on a surface.
• the measuring spot 18 has a round shape.
• the measuring spot 18 can, however, also have an oval or circular shape, depending on the angle of incidence on the surface. Since the lowest point of the steam capillary 12 is located at its edge at the rear in the machining direction (cf. FIG. 1), the optical measuring beam 126 must be aligned accordingly to this point in order to be able to correctly determine the depth of the steam capillary.
• the optical measuring device can comprise a controller which is set up to regulate the alignment of the optical measuring beam 126 to the lowest point of the vapor capillary 12 based on the data acquired by the image acquisition unit 152.
• the laser processing system or the image acquisition unit itself can be set up to carry out an image evaluation almost in real time in order to determine the position of the vapor capillary 12 on the workpiece and the position in the image acquired by the image acquisition unit of the measuring spot 18 to be determined.
• the geometric focus of the measurement spot and / or the geometric focus of the vapor capillary can be determined in the image evaluation.
• the position of the measurement spot can be determined relative to the position of the steam capillary, preferably relative to the deepest point of the steam capillary.
• the surroundings of the steam capillary 12 can also be recorded and, for example, a so-called topography measurement can be carried out.
• a seam can be found immediately before the welding process or the quality of the upper seam bead 15 can be measured immediately after the welding process.
• the geometry of the vapor capillary and / or the melt pool can be determined.
• a contour of the weld pool can be recognized.
• melted areas and / or solidified areas of the workpiece can be recognized or distinguished. This can be done using suitable image processing methods, for example filters, texture analysis, evaluation of the shape of the molten bath, etc.
• the laser processing system or the optical measuring device can be set up to regulate a position of the measuring beam 126 based on the determination of the position of the measuring spot or the measuring beam and the position of the vapor capillary such that it is always correctly aligned or positioned for the measurement of the welding depth is.
• the position of the measuring beam can be regulated relative to the position of the vapor capillary and / or the position of the laser beam.
• the position of the measuring beam can, for example, by means of beam deflection units, e.g. Mirrors, galvanoscanners or the collimator optics described above.
• the focus position and / or alignment of the optical measuring beam can be regulated. The regulation of the measuring beam can in particular take place in real time.
• FIGS. 5A and 5B show laser processing systems 200 and 200 ‘according to further embodiments of the present invention.
• the laser processing system 200 corresponds to the laser processing system 100, which is described above with reference to FIG. 3, but with a lighting unit 256 for illuminating the processing area, ie the area of the workpiece surface 16, the vapor capillary 12 (and optionally the molten bath 14) and the measuring spot 18 includes. If the visible spectral range is acquired by the image acquisition unit 152, it may be necessary to illuminate the processing zone by an illuminating unit 256. The image acquisition unit 152 of the laser processing system 200 is then preferably set up to detect light in the visible spectral range.
• the lighting can either coaxially through the machining head 122, as shown in Fig. 5A. Alternatively, the lighting unit can be arranged laterally, ie externally as shown in FIG. 5B, on the processing head.
• the lighting unit 256 can be arranged on the laser processing head 122 or integrated into the processing head 122.
• the lighting unit 256 is provided in order to improve an image of the area of the workpiece surface 16 with the vapor capillary and the point of impact of the measuring beam (the measuring spot 18) by the image acquisition unit 152.
• the lighting unit 256 is preferably set up to emit visible light and thus to illuminate the area captured by the image capturing unit 152. Since the steam capillary 12 and the molten bath 14 in particular only emit a small amount of light in the visible spectral range, the illumination by the illumination unit 256 can increase its visibility on the image captured by the image capture unit 152. Alternatively, the lighting could also emit in the infrared spectral range, in particular when using an infrared camera.
• the processing head 122 can comprise a lighting module 260 which is integrated into the processing head 122 or mounted on the processing head 122.
• the light emitted by the lighting unit 256 can be coupled into the beam path of the laser beam 148 and / or the optical measuring beam 126 and / or the image capturing unit 152.
• the lighting module 260 can include collimation optics 258 for collimating the light emitted by the lighting unit 256 into the beam path.
• the lighting unit 256 is arranged on the laser processing head 200 in such a way that the light emitted by it strikes the processing area directly, in particular the area of the workpiece which includes the steam capillary and / or the melt pool.
• the light emitted by the lighting unit 256 runs outside the beam path of the measurement beam 126 and the laser beam 148, that is, not through the processing head 122.
• FIG. 6 shows a laser processing system 300 according to a second embodiment of the invention.
• the laser processing system 300 corresponds to the laser processing system 100, which is described above with reference to FIG. 3, but with a visualization unit 370 for visualizing the optical measuring beam 126 or the measuring spot 18.
• the visualization Approximation unit 370 can have a light source 372 which is configured to generate a visualization beam (also called “visualization light beam”). Due to the limited light output of light sources for the optical measuring beam 126, for example conventional SLDs, the visualization unit 370 can be provided with the light source 372 in order to make the position of the optical measuring beam 126 visible in the image.
• Light of the visualization unit 370 is preferably coupled into the beam path of the optical measuring beam 126.
• the coupling is preferably carried out via a beam splitter, for example the fiber coupler 138, which is set up to couple the visualization beam into the optical fiber 142 of the measuring arm of the optical measuring device 128. Accordingly, a visualization spot that is created by the irradiation of the visualization beam on the workpiece 10 is superimposed with the measurement spot 18, and can in particular be concentric with the measurement spot 18.
• the visualization spot is imaged by the optical imaging in the processing head 122 on the same lateral position on the workpiece 10 as the measuring beam 126.
• there is no lateral offset due to adjustment errors or other inaccuracies when coupling into the optical fiber of the optical coherence tomograph.
• the optical coherence tomograph and the illuminating light source have un different wavelengths, the two focus positions may be axially shifted. A lateral shift of the focal points does not take place with a coaxial course of the two beams. Accordingly, the measurement spot and the visualization spot are concentric.
• a light source 372 with the highest possible light output can be selected.
• the wavelength or the wavelength range of the light generated by the light source 372 can be adapted to the spectral sensitivity range of the image acquisition unit 152.
• the wavelength of the light source 372 can be selected so that it is spectrally sufficiently far removed from the wavelength of the laser light.
• the notch filter 154 can thus be optimized in such a way that it maximally suppresses light of the laser beam 148 and at the same time is maximally transparent with regard to a wavelength of the light source 372.
• the visualization beam thus serves to visualize the point of incidence of the optical measuring beam 126 and makes the point of incidence of the measuring beam or the measuring spot 18 more visible in the camera image. This is because the visualization spot is concentric with the measurement spot and significantly brighter than the measurement spot and can therefore be more easily detected by the image acquisition unit 152.
• the wavelength of the light emitted by the light source 372 it is advantageous to choose the wavelength of the light emitted by the light source 372 to have a shorter wavelength than the wavelength of the optical coherence tomograph or the optical measuring beam 126. It is typically necessary for the optical coherence tomograph to use so-called monomode fibers. These fibers have a core diameter that corresponds approximately to a tenth of the wavelength that is to be transported by them. As a result, only the transverse basic mode “TEM00” can propagate in the waveguide. The so-called "cut-off wavelength" of an optical fiber indicates the wavelength up to which only the TEMOO mode can propagate. If shorter-wave light is coupled in, higher transverse modes can also develop and one speaks of a so-called multimode fiber.
• the wavelength of the light generated by the light source 372 For the wavelength of the light generated by the light source 372, this means that if the modes in the optical fiber are sufficiently mixed, the exit diameter is greater than in the case of a single-mode fiber. However, the center of the light distribution remains the same, which is why the center and thus the lateral position of the point of impact of the measuring beam can still be detected. If, on the other hand, the wavelength of the light source 372 is selected to be longer than the wavelength of the optical coherence tomograph, enormous losses occur when coupling into the optical fiber, which is why the effect of a powerful light source 372 is nullified.
• Fig. 7 shows a method for machining a workpiece by means of a laser beam according to an embodiment of the invention.
• the method can be carried out by a laser processing system according to the embodiments described herein and comprises the following steps.
• step 710 a laser beam 148 is radiated onto a workpiece surface 16 in order to generate a vapor capillary.
• step 720 an optical measuring beam 126 is radiated onto the workpiece 10 in order to measure a depth of the steam capillary 12.
• step 730 an image of a region of the workpiece surface 16 that includes the vapor capillary 12 and a measurement spot 18 generated by irradiating the optical measurement beam 126 is captured. Based on the captured image, step 740 determines a position of the measuring spot 18 and a position of the vapor capillary 12 on the workpiece 10, more precisely on the workpiece surface 16. Steps 710, 720, 730 and 740 can be carried out quasi simultaneously, so that a relative alignment of the measurement spot 18 to the vapor capillary 12 can be determined and / or set quasi in real time.
• the step of determining 740 can include an evaluation of the captured image. During the evaluation, among other things, geometric properties of the vapor capillary 12 and / or of the measuring spot 18 can be recognized or detected. The evaluation can also include the determination of a center point of the vapor capillary 12 and a center point of the measurement spot 18. The centers can be two-dimensional focal points.
• the method can further comprise a step (not shown) of regulating or adjusting the position of the measuring spot 18. In particular, the position of the measuring spot 18 in relation to the steam capillary 12 can be set such that a maximum depth of the steam capillary 12 can be measured or measured with the optical measuring beam 126.
• a point of incidence of the optical measuring beam i.e. the position of the measuring spot and the position of the steam capillary or steam capillary 12 can be determined at the same time in order to assign a depth measured by means of the optical measuring beam to a specific point of the steam capillary.
• the position of the measurement spot relative to the steam capillary can be set in such a way that a maximum depth of the steam capillary can be determined.
• the measuring beam can be directed to a point on the vapor capillary with maximum depth. This point is generally at the rear edge of the steam capillary in the machining direction.
• the position of the measuring spot and the steam capillary can be determined almost in real time and thus enable continuous and reliable depth measurement of the steam capillary. As a result, processing quality, in particular during laser welding, can be increased.

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