WO2020158606A1 - Procédé de production de plusieurs éléments stratifiés, et assemblage d'éléments stratifiés - Google Patents

Procédé de production de plusieurs éléments stratifiés, et assemblage d'éléments stratifiés Download PDF

Info

Publication number
WO2020158606A1
WO2020158606A1 PCT/JP2020/002535 JP2020002535W WO2020158606A1 WO 2020158606 A1 WO2020158606 A1 WO 2020158606A1 JP 2020002535 W JP2020002535 W JP 2020002535W WO 2020158606 A1 WO2020158606 A1 WO 2020158606A1
Authority
WO
WIPO (PCT)
Prior art keywords
laminated
adhesive tape
opto
optical waveguide
manufacturing
Prior art date
Application number
PCT/JP2020/002535
Other languages
English (en)
Japanese (ja)
Inventor
直幸 田中
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Publication of WO2020158606A1 publication Critical patent/WO2020158606A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
    • B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method

Definitions

  • the present invention relates to a method for manufacturing a plurality of laminated members and a laminated member assembly.
  • Patent Document 1 when packaging the optical waveguide, the individualized individual optical waveguides are mounted on each of the plurality of mounting portions of the packaging member.
  • the present invention provides a method for manufacturing a plurality of laminated members and a laminated member assembly capable of easily processing the plurality of laminated members.
  • the present invention (1) is arranged between the plurality of stacked portions so as to connect the plurality of stacked portions that are aligned and arranged in the first direction with a space between each other and the plurality of stacked portions.
  • a connecting sheet including a connecting portion and a member laminated on the plurality of laminated portions, and a laminated member assembly sheet including a laminated member formed of the laminated portion and the member.
  • a method of manufacturing a plurality of laminated members comprising: a step of adhering an adhesive tape to at least one of the one surface and the other surface in the thickness direction of the plurality of laminated members along the first direction. ..
  • the plurality of laminated members are collectively adhered by the adhesive tape in the second step, so that the plurality of laminated members adhered by the adhesive tape can be collectively and easily processed.
  • the present invention (2) includes the method for manufacturing a plurality of laminated members according to (1), further including a third step of separating the connecting portion from the connecting sheet after the second step.
  • a separating portion for separating the connecting portion from the connecting sheet is formed at or near the boundary between the connecting portion and the layered portion, (2) The manufacturing method of the some laminated member as described in 1) is included.
  • the connecting member can be reliably separated from the connecting sheet by the separating portion in the third step.
  • the present invention (4) is the plurality of laminated members according to any one of (1) to (3), wherein a part of the connecting portion partitioned by the separating portion overlaps with the member in the thickness direction. Including the manufacturing method of.
  • the connecting part protruding from the outer shape of the member remains on the outside of the member, so that the accuracy of the outer shape of the laminated member decreases.
  • the connecting portion since a part of the connecting portion overlaps with the member in the thickness direction, the arrangement of the connecting portion can be held by the member.
  • the present invention (5) is the production of the plurality of laminated members according to any one of (1) to (4), wherein in the second step, the adhesive tape is adhered to one surface in the thickness direction of the member. Including the method.
  • the adhesive tape If the adhesive tape is adhered to the other surface in the thickness direction of the laminated member, the adhesive tape will be adhered to the connecting portion, and when the connecting member is separated from the connecting sheet, the connecting member also needs to be peeled from the adhesive tape. Therefore, the connecting member cannot be smoothly separated from the connecting sheet.
  • the adhesive tape is adhered to one side in the thickness direction of the member, so that the adhesive tape can be prevented from adhering to the connecting member. Therefore, the connecting member can be smoothly separated from the connecting sheet.
  • the present invention (6) includes the method for manufacturing a plurality of laminated members according to any one of (1) to (5), wherein the connecting sheet has a continuous portion that is continuous with the plurality of connecting portions.
  • the present invention (7) includes the method for manufacturing a plurality of laminated members according to any one of (1) to (6), wherein the member is an optical waveguide.
  • a plurality of optical waveguides adhered by an adhesive tape can be collectively and simply processed in the third step.
  • the present invention (8) includes the method for manufacturing a plurality of laminated members according to (7), wherein the portion to be laminated is an electric circuit board.
  • the transmission direction of light in the optical waveguide is orthogonal to the first direction, and in the second step, the adhesive tape is positioned between both ends of the optical waveguide in the transmission direction.
  • the adhesive tape is adhered to the intermediate portion located between both ends of the optical waveguide in the transmission direction, the optical tape is attached to both ends in the transmission direction of the optical waveguide.
  • the member can be reliably mounted.
  • the adhesive strength of the adhesive tape to a stainless steel plate is 0.5 N when the adhesive tape is peeled from the stainless steel plate at an angle of 90 degrees and a speed of 300 mm/min.
  • the peel strength of the adhesive tape is 0.5 N/20 mm or more, the laminated members can be reliably processed collectively by the adhesive tape. Moreover, since the peel strength of the adhesive tape is less than 2 N/20 mm, the adhesive tape can be smoothly peeled from the laminated member while suppressing damage to the laminated member.
  • the present invention (11) is a plurality of laminated members configured by a plurality of laminated portions arranged in alignment with each other in the first direction at intervals, and a member laminated on the plurality of laminated portions,
  • a laminated member assembly comprising: an adhesive tape that adheres to at least one of the one surface and the other surface in the thickness direction of the plurality of laminated members and is arranged along the first direction.
  • a plurality of laminated members adhered to the adhesive tape can be collectively and simply processed.
  • the present invention (12) includes the laminated member assembly according to (11), wherein the member is an optical waveguide.
  • a plurality of optical waveguides can be collectively processed easily.
  • the present invention (13) includes the laminated member assembly according to (12), wherein the portion to be laminated is an electric circuit board.
  • the light transmission direction in the optical waveguide is orthogonal to the first direction, and the adhesive tape adheres to an intermediate portion located between both ends of the optical waveguide in the transmission direction.
  • the laminated member assembly according to (12) or (13) is included.
  • the plurality of laminated members adhered by the adhesive tape can be collectively and simply processed.
  • FIGS. 1A to 1D are front cross-sectional views of steps of a method of manufacturing a plurality of opto-electric hybrid boards, which is an embodiment of a method of manufacturing a plurality of laminated members of the present invention.
  • 1B shows the second step
  • FIG. 1C shows the fourth step
  • FIG. 1D shows the third step.
  • 2A to 2D are side sectional views corresponding to the steps shown in FIGS. 1A to 1D, respectively.
  • FIG. 2A is a first step
  • FIG. 2B is a second step
  • FIG. 2C is a fourth step.
  • FIG. 2D shows the third step.
  • 3A to 3B are views corresponding to the first step shown in FIGS. 1A and 2A, where FIG. 3A is a plan view and FIG.
  • 3B is a bottom view.
  • 4A to 4B are diagrams corresponding to the second step shown in FIGS. 1B and 2B, FIG. 4A showing a plan view and FIG. 4B showing a bottom view.
  • 5A to 5B are views corresponding to the fourth step shown in FIGS. 1C and 2C.
  • FIG. 5A shows a plan view and FIG. 5B shows a bottom view.
  • 6A to 6B are views corresponding to the fourth step shown in FIGS. 1D and 2D, FIG. 6A showing a plan view and FIG. 6B showing a bottom view.
  • 7A and 7B are front views of a mode in which the connector is mounted on the second end of the opto-electric hybrid board.
  • FIG. 7A shows a state in which the connector is mounted on the opto-electric hybrid board
  • FIG. Indicates the state.
  • 8A to 8C are plan views of a modified example (a modified example in which the opto-electric hybrid board has a shape elongated in the first direction) of the embodiment shown in FIGS. 1A to 1D
  • FIG. 8A shows a first step
  • 8B shows the second step
  • FIG. 8C shows the third step.
  • 9A to 9C are front sectional views of a modified example (a modified example in which an adhesive tape is adhered to the other surface of the opto-electric hybrid board) of the embodiment shown in FIGS. 1A to 1D
  • 10A to 10C are plan views of modified examples of the embodiment shown in FIGS. 1A to 1D (modified examples in which the continuous portion independently has one side continuous portion and the other side continuous portion).
  • 10A shows the first step
  • FIG. 10B shows the second step
  • FIG. 10C shows the third step.
  • 11A to 11C are plan views of a modified example (a modified example in which the connecting sheet does not have a continuous portion) of the embodiment shown in FIGS. 1A to 1D, in which FIG. 11A shows the first step and FIG. 11B shows The second step, FIG. 11C, shows the third step.
  • a method for manufacturing a plurality of opto-electric hybrid boards which is an embodiment of a method for manufacturing a plurality of laminated members of the present invention, will be described with reference to FIGS. 1A to 7.
  • an electric circuit board portion 5 as an example of a plurality of stacked portions arranged in alignment in the first direction at intervals, and An example of a connecting sheet 31 including a connecting portion 33 arranged between the plurality of electric circuit board portions 5 so as to connect the plurality of electric circuit board portions 5 and a member laminated on the plurality of electric circuit board portions 5.
  • the optical-electrical hybrid substrate assembly as an example of the laminated member assembly sheet, which includes the optical waveguide 6 as a component, and the electrical-circuit board portion 5 and the optical waveguide 6 constitute the optical-electrical hybrid substrate 2 as an example of the laminated member.
  • a first step of preparing the sheet 1 and a second step of adhering the adhesive tape 7 to the plurality of opto-electric hybrid boards 2 are provided. Further, in this manufacturing method, after the second step, the fourth step of forming the slit 8 as an example of the separating section, and the third step of separating the coupling section 33 from the plurality of opto-electric hybrid boards 2 after the fourth step. With. In this opto-electric hybrid board manufacturing method, for example, the first step, the second step, the fourth step, and the third step are sequentially performed.
  • an opto-electric hybrid board assembly sheet 1 is prepared.
  • the opto-electric hybrid board assembly sheet 1 has a sheet shape extending in a plane direction orthogonal to the thickness direction, as shown in FIGS. 3A and 3B. Specifically, the opto-electric hybrid board assembly sheet 1 has a substantially rectangular shape (strip shape) in a plan view that extends long in the first direction included in the surface direction.
  • the opto-electric hybrid board assembly sheet 1 includes a plurality of opto-electric hybrid boards 2 and a connecting portion 33.
  • a plurality of opto-electric hybrid boards 2 are aligned and arranged in the first direction at intervals.
  • the opto-electric hybrid board 2 has a substantially rectangular shape in plan view extending long in a second direction orthogonal to the first direction and the thickness direction.
  • the first direction length (width) of the first end portion 11 which is one end portion in the second direction (transmission direction) of the opto-electric hybrid board 2 is equal to that of the second end portion 12 which is the other end portion in the second direction. It is longer than the length in one direction and the length in the first direction of the intermediate portion 13 located between the first end portion 11 and the second end portion 12. Moreover, the first direction length of the second end portion 12 in the second direction and the first direction length of the intermediate portion 3 in the second direction are the same. The first end 11 and the second end 12 correspond to both ends of the opto-electric hybrid board 2 in the second direction (light transmission direction).
  • each of the plurality of opto-electric hybrid boards 2 includes an electric circuit board portion 5 and an optical waveguide 6 in order toward one side in the thickness direction.
  • the opto-electric hybrid board 2 comprises an electric circuit board portion 5 and an optical waveguide 6.
  • the optical waveguide 6 is laminated on the electric circuit board portion 5 on one side in the thickness direction.
  • the electric circuit board portion 5 forms the other surface in the thickness direction of the opto-electric hybrid board 2.
  • the electric circuit board portion 5 has the same planar view shape as the opto-electric hybrid board 2.
  • the electric circuit board portion 5 includes a metal supporting layer 51, a base insulating layer 52, a conductor pattern 53, and a cover insulating layer 54 in order toward the other side in the thickness direction.
  • Examples of the material of the insulating base layer 52 and the insulating cover layer 54 include insulating resins such as polyimide.
  • the insulating base layer 52 and the insulating cover layer 54 have flexibility, for example.
  • the conductor pattern 53 has a first terminal 55, a second terminal 56, and a wiring 57 connecting them.
  • the thickness of the electric circuit board portion 5 is, for example, 5 ⁇ m or more and 1,000 ⁇ m or less.
  • the electric circuit board portion 5 can be partitioned into an electric circuit board 58 by slits 8 described later, as shown in FIGS. 1C and 2C. Note that the configurations, dimensions, physical properties, and the like of the electric circuit board portion 5 and the electric circuit board 58 are described in detail in, for example, JP-A-2018-151570, JP-A-2018-173635, and JP-A-2018-106095. Stated.
  • the optical waveguide 6 forms one surface in the thickness direction of the opto-electric hybrid board 2.
  • the optical waveguide 6 is arranged on one surface in the thickness direction of the electric circuit board portion 5.
  • the optical waveguide 6 is a strip type optical waveguide and includes an under-cladding layer 61, a core layer 62, and an over-cladding layer 63 in order toward one side in the thickness direction.
  • the core layer 62 extends along the light transmission direction (second direction).
  • the optical waveguide 6 is configured to be able to transmit light in the second direction.
  • the optical waveguide 6 has flexibility. Examples of the material of the optical waveguide 6 include transparent resin such as epoxy resin.
  • the thickness of the optical waveguide 6 is, for example, 5 ⁇ m or more and 200 ⁇ m or less.
  • the configuration, dimensions, physical properties, etc. of the optical waveguide 6 are described in detail, for example, in JP-A-2018-173635 and JP-A-2018-106095.
  • connection part 33 is arranged between the plurality of electric circuit board parts 5 so as to connect the plurality of electric circuit board parts 5.
  • the connecting sheet 31 includes a plurality of connecting portions 33.
  • the plurality of connecting portions 33, the plurality of electric circuit board portions 5, and the continuous portion 32 continuously form one connecting sheet 31.
  • the connecting portion 33 separates the plurality of opto-electric hybrid boards 2 in the first direction. As a result, the opto-electric hybrid board 2 and the connecting portions 33 are arranged alternately in the first direction. As shown in FIG. 3A, each of the plurality of connecting portions 33 has a shape extending in the second direction.
  • the other end of the connecting portion 33 in the second direction is flush with the other end of the opto-electric hybrid board 2 in the second direction. Specifically, the other end surface of the coupling portion 33 in the second direction and the other end surface of the opto-electric hybrid board 2 form a single flat side surface.
  • the connecting sheet 31 further has a continuous portion 32 that is continuous with the plurality of connecting portions 33.
  • the continuous portion 32 has a strip shape (strip shape) that extends long along the first direction.
  • the continuous portion 32 is arranged on one side in the second direction of the plurality of electric circuit board portions 5 and the plurality of connecting portions 33.
  • the other end edge of the continuous portion 32 in the second direction is continuous with one end edge of the plurality of electric circuit board portions 5 and the plurality of connecting portions 33 in the second direction.
  • the plurality of connecting portions 33 and the continuous portion 32 form one removal portion 3.
  • the removed portion 3 integrally has a plurality of connecting portions 33 and a continuous portion 32.
  • the removed portion 3 is a member that is removed from the connecting sheet 31 in a third step (see FIGS. 1D and 2D) described later, and is added to the optoelectronic substrate assembly 10 (see FIGS. 1D and 6) described later. Is not provided.
  • the removed portion 3 is formed in the connection sheet 31 in a region other than the region in which the opto-electric hybrid board 2 is formed.
  • the removed portion 3 is an area excluding the opto-electric hybrid board 2 as described above, and has a substantially comb-like shape in plan view as shown in FIG. 3A.
  • the removed portion 3 is formed of the same layer as the electric circuit board portion 5, and specifically, is formed of the same layer as the insulating base layer 52.
  • the opto-electric hybrid board assembly sheet 1 for example, first, a connecting sheet 31 including a plurality of electric circuit board portions 5, a continuous portion 32, and a plurality of connecting portions 33 is prepared. After that, the plurality of optical waveguides 6 are formed in the connecting sheet 31 on one surface in the thickness direction corresponding to the plurality of electric circuit board portions 5. As a result, a plurality of opto-electric hybrid boards 2 in which the optical waveguides 6 are laminated on the electric circuit board section 5 are manufactured. As a result, the opto-electric hybrid board assembly sheet 1 including the plurality of opto-electric hybrid boards 2 is manufactured.
  • ⁇ Second step> As shown in FIGS. 1B, 2B, and 4A, in the second step, the adhesive tape 7 is adhered to the intermediate portion 13 on one surface in the thickness direction of the plurality of opto-electric hybrid boards 2 along the first direction.
  • the adhesive tape 7 has the property of being able to adhere (pressure-sensitive adhesion) to a plurality of opto-electric hybrid boards 2.
  • the adhesive tape 7 has a tape shape (strip shape) (strip shape) extending in the first direction.
  • at least the other surface in the thickness direction is an adhesive surface (pressure-sensitive adhesive surface).
  • the adhesive tape 7 includes a base film (not shown) and an adhesive layer (not shown) arranged on the other surface in the thickness direction thereof.
  • the adhesive tape 7 has flexibility.
  • the base film has flexibility and supports the adhesive layer.
  • Examples of the material of the base film include polymers such as polyolefins (eg, polyethylene, polypropylene, etc.).
  • the thickness of the base film is, for example, 1 ⁇ m or more and 200 ⁇ m or less.
  • Examples of materials for the adhesive layer include adhesive resins such as acrylic resin, silicone resin, and urethane resin.
  • the thickness of the adhesive layer is, for example, 5 ⁇ m or more, preferably 20 ⁇ m or more, and for example, 500 ⁇ m or less, preferably 200 ⁇ m or less.
  • peel strength at 25° C. peel strength at 25° C.
  • peel strength at 25° C. of the adhesive tape 7 is, for example, 0.5 N/20 mm or more, preferably 1 N/20 mm or more, for example, 3 N/20 mm or less, preferably 2 N/20 mm. Is less than.
  • the method for measuring the peel strength of the adhesive tape 7 will be described in detail in Examples below.
  • the adhesive tape 7 can reliably process a plurality of opto-electric hybrid boards 2 together.
  • the peel strength of the adhesive tape 7 is equal to or less than the above upper limit, the adhesive tape 7 can be smoothly peeled from the plurality of opto-electric hybrid boards 2 while suppressing damage to the opto-electric hybrid board 2.
  • the length in the first direction (longitudinal length) of the adhesive tape 7 is not particularly limited as long as it is a length that can overlap all of the plurality of opto-electric hybrid boards 2.
  • the length (width) of the adhesive tape 7 in the second direction is, for example, a length that can overlap with the intermediate portion 13 but does not overlap with either the first end portion 11 or the second end portion 12.
  • the length of the adhesive tape 7 in the second direction is, for example, 0.8 or less, preferably 0.6 or less, more preferably the length in the second direction of the opto-electric hybrid board 2. , 0.4 or less, and, for example, 0.1 or more.
  • the length of the adhesive tape 7 in the second direction is not particularly limited and is appropriately set with respect to the length of the opto-electric hybrid board 2 in the second direction, and is, for example, 450 mm or less, preferably 50 mm or less. Further, for example, it is 1 mm or more.
  • the other surface in the thickness direction of the adhesive tape 7 is brought into contact with the intermediate portion 13 of the one surface in the thickness direction of the plurality of opto-electric hybrid boards 2. Further, the adhesive tape 7 is adhered only to the intermediate portion 13 so as to avoid (do not contact) the first end 11 and the second end 12 of the plurality of opto-electric hybrid boards 2. Furthermore, when the adhesive tape 7 is projected in the thickness direction, the adhesive tape 7 adheres to one surface in the thickness direction of the plurality of opto-electric hybrid boards 2 so as to cover both edges in the first direction of the connecting sheet 31.
  • the plurality of opto-electric hybrid boards 2 are securely adhered and supported by the adhesive tape 7.
  • the other surface in the thickness direction of the adhesive tape 7 may be separated from the one surface in the thickness direction of the connecting portion 33.
  • the other surface in the thickness direction of the adhesive tape 7 may contact the one surface in the thickness direction of the connecting portion 33 exposed from the optical waveguide 6.
  • the slit 8 is formed at the boundary between the removed portion 3 and the electric circuit board portion 5 in the connection sheet 31 or in the vicinity thereof (for example, within 5 mm from the boundary). To do.
  • the slit 8 for example, laser processing, cutting processing, or the like is used.
  • the slit 8 penetrates the connecting sheet 31 in the thickness direction.
  • the slit 8 is a groove that separates the removing unit 3 from the plurality of opto-electric hybrid boards 2, and is provided on the connecting sheet 31 to separate the removing unit 3 from the electric circuit board unit 5. Further, the slit 8 partitions the electric circuit board 58 into the electric circuit board portion 5 in the connecting sheet 31.
  • the electric circuit board 58 partitioned by the slit 8 is smaller than the optical waveguide 6. Specifically, the electric circuit board 58 is shorter than the optical waveguide 6 in at least the first direction length.
  • the connecting portion 33 is formed in the vicinity of the boundary between the removing portion 3 and the electric circuit board portion 5, so that the connecting portion 33 has an outer periphery of the optical waveguide 6 when projected in the thickness direction. It has an inner peripheral end 14 that overlaps the end 15.
  • One surface in the thickness direction of the inner peripheral end portion 14 of the connecting portion 33 is in contact (close contact) with the other surface in the thickness direction of the outer peripheral end portion 15 of the optical waveguide 6.
  • the width W1 of the slit 8 is set so that the connecting portion 33 can be easily removed in the third step, and is, for example, 0.001 mm or more, preferably 0.01 mm or more, and, for example, 5.0 mm or less. It is preferably 0.5 mm or less.
  • the width W2 at which one surface in the thickness direction of the inner peripheral end portion 14 and the other surface in the thickness direction of the outer peripheral end portion 15 of the optical waveguide 6 are in contact with each other is the optical waveguide 6. It is adjusted so that the arrangement of the portion 33 can be maintained, and is, for example, 5.0 mm or less, preferably 0.5 mm or less, and, for example, 0.001 mm or more, preferably 0.01 mm or more.
  • ⁇ Third step> As shown in FIGS. 1D, 2D, 6A, and 6B, in the third step, the removed portion 3 is separated from the connecting sheet 31.
  • one end of the continuous portion 32 in the removed portion 3 in the first direction is gripped, and this is separated toward the other side in the thickness direction.
  • the inner peripheral end portion 14 of the removed portion 3 is easily peeled off from the other surface in the thickness direction of the optical waveguide 6.
  • the plurality of opto-electric hybrid boards 2 are adhered by the adhesive tape 7. More specifically, each of the plurality of opto-electric hybrid boards 2 is independent, but is adhered by the adhesive tape 7, cannot be separated, and is kept in a state of being collected by the adhesive tape 7.
  • the opto-electric board assembly 10 including the plurality of opto-electric hybrid boards 2 and the adhesive tape 7 that adheres to one surface in the thickness direction thereof is manufactured. That is, the plurality of opto-electric hybrid boards 2 are in a state of being adhered by the adhesive tape 7.
  • the opto-electrical board assembly 10 does not include the removing part 3 (connecting part 33).
  • the plurality of opto-electric hybrid boards 2 are arranged at intervals in the first direction, but since the adhesive tape 7 that adheres to them has flexibility, the opto-electric board assembly 10 as a whole is acceptable. It has flexibility.
  • the opto-electric board assembly 10 is not the opto-electric hybrid board 2 (see FIG. 2D) provided with the optical element 16 (described later) or the connector 17 (described later), that is, does not include the optical element 16 and/or the connector 17. ..
  • the opto-electric board assembly 10 includes a plurality of opto-electric hybrid boards 2 (see FIG. 2C) on which the optical element 16 and the connector 17 are not yet provided, and the adhesive tape 7.
  • the optoelectric substrate assembly 10 is a device that is distributed by itself and is industrially applicable.
  • the plurality of opto-electric hybrid boards 2 in the opto-electric board assembly 10 are processed.
  • the opto-electric board assembly 10 is packed in a packing member (not shown).
  • the packing member has, for example, a plurality of mounting parts.
  • Each of the plurality of opto-electric hybrid boards 2 is collectively (at once) mounted on each of the plurality of mounting portions while being adhered by the adhesive tape 7.
  • the optical element 16 is mounted on the first end portion 11, and the first end portion 11 and the optical element 16 of the opto-electric hybrid board 2 (optical waveguide 6) are connected to each other. Connect electrically. Further, the second end 12 is fixed to the connector 17, and the connector 17 is used to optically connect the second end 12 of the opto-electric hybrid board 2 (optical waveguide 6) and the optical fiber 20.
  • the connector 17 examples include those described in Japanese Unexamined Patent Application Publication No. 2018-151570. Specifically, as shown in FIG. 7B, the connector 17 has a substantially U-shape when viewed from the front and is opened toward one side in the thickness direction. It has a main body 18 and a lid 19 having a flat plate shape.
  • the other surface in the thickness direction of the electric circuit board 58 contacts the bottom surface 21 of the bottom wall of the main body 18, and The second end 12 is attached to the main body 18 so that the outer side surfaces (both side surfaces in the first direction) of the waveguide 6 contact the inner side surface 22 of the side wall of the main body 18.
  • the lid 19 is brought into contact with one surface of the optical waveguide 6 in the thickness direction.
  • the main body 18 is filled with an adhesive agent (not shown).
  • the adhesive tape 7 is peeled off from one surface in the thickness direction of the plurality of opto-electric hybrid boards 2.
  • the plurality of opto-electric hybrid boards 2 are collectively adhered by the adhesive tape 7 in the second step.
  • a plurality of opto-electric hybrid boards 2 can be collectively processed easily.
  • a plurality of opto-electric hybrid boards 2 can be collectively packaged in a packing member, and the optical elements 16 and the connectors 17 can be mounted on the plurality of opto-electric hybrid boards 2.
  • the connecting portion 33 is separated from the connecting sheet 31 in the third step, so that the plurality of opto-electric hybrid boards 2 adhered by the adhesive tape 7 are independent of each other. Obtainable.
  • the connecting portion 33 can be reliably separated from the connecting sheet 31 by the slit 8 in the third step.
  • the coupling portion 33 protruding from the outer shape of the optical waveguide 6 remains outside the optical waveguide 6. Therefore, the outer shape accuracy of the opto-electric hybrid board 2 is reduced.
  • the opto-electric hybrid board is separated by separating the connecting portion 33. 2 does not have the connecting portion 33 as described above, and therefore, the outer shape accuracy of the opto-electric hybrid board 2 is excellent.
  • the removed portion 3 partitioned by the slit 8 does not overlap with the optical waveguide 6 in the thickness direction and is displaced (not shown), the removed portion 3 does not contact the optical waveguide 6, and then the optical waveguide 6 is connected to the connecting member. In some cases, the arrangement of 3 cannot be retained.
  • the inner peripheral end portion 14 of the connecting portion 33 partitioned by the slit 8 overlaps with the outer peripheral end portion 15 of the optical waveguide 6 in the thickness direction.
  • the outer peripheral end 15 of 6 can be contacted (adhered). Therefore, the optical waveguide 6 can hold the arrangement of the connecting member 3.
  • the peel strength of the adhesive tape 7 is 0.5 N/20 mm or more, a packing member (not shown) for packing the plurality of opto-electric hybrid boards 2 depending on the peel strength of the adhesive tape 7. Then, each of the plurality of opto-electric hybrid boards 2, the optical element 16 and the optical fiber 20 can be reliably mounted.
  • the peel strength of the adhesive tape 7 is less than 2N/20 mm, the adhesive tape 7 can be smoothly peeled from the opto-electric hybrid board 2 while suppressing damage to the opto-electric hybrid board 2.
  • a plurality of opto-electric hybrid boards 2 adhered by the adhesive tape 7 can be collectively and simply processed.
  • the adhesive tape 7 adheres to the intermediate portion 13 of the opto-electric hybrid board 2, the first and second ends 11 and 12 in the transmission direction of the opto-electric hybrid board 2, The optical element 16 and the optical fiber 20 can be reliably connected optically.
  • the opto-electric hybrid board 2 in which the portion to be laminated is the electric circuit board portion 5 and the member is the optical waveguide 6 is given as an example of the laminated member.
  • an example of the stacked portion may be a stacked portion that does not include an electric circuit.
  • optical waveguide 6 is illustrated as an example of the member, the present invention is not limited to this, and the electric circuit board portion 5 (electric circuit board 58) is illustrated as an example of a laminated portion, but the present invention is not limited to this. ..
  • an optical module member and a sensor member can be cited.
  • the connecting portion 33 is separated and is not provided, and the adhesive tape 7 and the plurality of laminated members 70 adhered by the adhesive tape 7 are provided as shown in FIG. 1D.
  • a laminated member assembly 75 (reference numeral in parentheses) is obtained.
  • the plurality of laminated members 70 are collectively adhered by the adhesive tape 7 in the second step, the plurality of laminated members 70 adhered by the adhesive tape 7 can be collectively and simply processed.
  • the shape and size of the laminated member 70 prepared in the first step are not particularly limited, and, for example, as shown in FIG. 8A, a shape (long) along the first direction, specifically, It can also have a first-direction length that is longer than the two-direction length.
  • the adhesive tape 7 is adhered to one surface in the thickness direction of the plurality of laminated members 70 so as to include all of the plurality of laminated members 70.
  • the connecting portion 33 is separated and removed from the plurality of laminated members 70.
  • the direction in which the adhesive tape 7 extends and the direction in which the plurality of laminated members 70 extend are the same.
  • the removed portion 3 is formed of the same layer as the insulating base layer 52, but may be formed of the same layer as the insulating cover layer 54 shown in FIG. 2A.
  • the cover insulating layer 54 may be formed of two layers. Alternatively, it can be formed from the same layer as the metal supporting layer 51 or the conductor pattern 53 as long as the pattern avoids the area where the slits 8 are formed.
  • the removed portion 3 can be formed from two layers of the insulating base layer 52 or the insulating cover layer 54 and the metal supporting layer 51 or the conductor pattern 53.
  • the removed portion 3 can be formed from three layers including the insulating base layer 52, the insulating cover layer 54, and the metal supporting layer 51 or the conductor pattern 53.
  • the adhesive tape 7 is adhered to one surface in the thickness direction of the opto-electric hybrid board 2, but as shown in FIG. It is also possible to adhere to the other surface of the mixed substrate 2 in the thickness direction.
  • the adhesive tape 7 adheres to the other surface in the thickness direction of the electric circuit board portion 5 and also adheres to the other surface in the thickness direction of the removed portion 3 to connect the removed portion 3 including the connecting portion 33.
  • the removed portion 3 needs to be peeled off from the adhesive tape 7 as well, and accordingly, the removed portion 3 cannot be smoothly separated from the connecting sheet 31.
  • the adhesive tape 7 is adhered to one side in the thickness direction of the optical waveguide 6, so that the adhesive tape 7 adheres to the connecting portion 33. Can be suppressed. Therefore, the removed portion 3 including the connecting portion 33 can be smoothly separated from the connecting sheet 31.
  • the slits 8 are selectively formed not on the adhesive tape 7 but on the connecting sheet 31 by, for example, laser processing.
  • the adhesive tape 7, the inner peripheral end portion 14 of the connecting portion 33 partitioned by the slit 8, and the outer peripheral end portion 15 of the optical waveguide 6 larger than the electric circuit board 58 are formed on one side in the thickness direction. It is arranged in order on the side. That is, the inner peripheral end 14 of the connecting portion 33 is sandwiched in the thickness direction by the outer peripheral end 15 of the optical waveguide 6 and the adhesive tape 7.
  • the connecting portion 33 is separated toward one side in the thickness direction, and the inner peripheral end portion 14 and the adhesive of the connecting portion 33 are adhered.
  • the inner peripheral end portion 14 of the connecting portion 33 is caught by the outer peripheral end portion 15 of the optical waveguide 6 as shown by the solid line and solid line arrow in FIG. 9C, and the connecting portion 33 is removed from the adhesive tape 7. It becomes difficult to peel off smoothly. That is, the removal of the connecting portion 33 may be hindered by the outer peripheral end portion 15.
  • the adhesive tape 7 is adhered to one surface in the thickness direction of the opto-electric hybrid board 2 (one surface in the thickness direction of the optical waveguide 6).
  • the slit 8 is formed in the connecting sheet 31. Then, the inner peripheral end portion 14 of the connecting member 3 partitioned by the slit 8, the outer peripheral end portion 15 of the optical waveguide 6, and the adhesive tape 7 are sequentially arranged on one side in the thickness direction. That is, the inner peripheral end 14 of the connecting member 3 is located on the opposite side of the adhesive tape 7 with respect to the outer peripheral end 15 of the optical waveguide 6.
  • the adhesive tape 7 has adhesiveness (pressure-sensitive adhesiveness) for a predetermined period of time, and after the predetermined period of time, is peeled off (pressure-sensitive adhesive force) by heating or irradiation of ultraviolet rays (progress of curing of thermosetting resin). ) May be reduced.
  • adhesiveness pressure-sensitive adhesiveness
  • examples of the material of such an adhesive tape 7 include epoxy resin and acrylic resin.
  • the slit 8 is illustrated as an example of the separating portion, but the present invention is not limited to this, and although not shown, for example, a perforation, for example, a recessed portion from one surface or the other surface to the middle portion in the thickness direction. May be
  • the slit 8 is formed in the fourth step after the second step, but the formation time is not particularly limited as long as it is before the third step.
  • the slit 8 may be formed at the same time as the production of the connecting sheet 31. In this case, after the slits 8 are formed, the optical waveguide 6 having the outer peripheral end portion 15 contacting (contacting) the inner peripheral end portion 14 prevents the connecting portion 33 from falling off, and disposes the connecting portion 33. Can be held.
  • the adhesive tape 7 is adhered to the intermediate portion 13 of the optical waveguide 6 as shown by the solid line in FIG. 2B and FIG. 4, but for example, as shown by the phantom line in FIG. 2B. Can be adhered to all the one surfaces in the thickness direction of the optical waveguide 6 including the first end portion 11, the second end portion 12 and the intermediate portion 13.
  • the adhesive tape 7 is adhered to the intermediate portion 13 of the optical waveguide 6 in the second step, so that the first end portion of the optical waveguide 6 is formed. It is possible to ensure the respective arrangement (mounting or attachment) of the optical element 16 and the connector 17 with respect to each of 11 and the second end 12.
  • slit 8 is formed in one embodiment, a plurality of opto-electric hybrid boards 2 can be collectively processed without forming the slit 8.
  • the continuous portion 32 of the removing portion 3 is arranged only at one end portion in the second direction of the optoelectronic substrate assembly sheet 1, but as shown in FIG. 8A, for example, It may be arranged at both one end and the other end in the second direction of the optoelectric substrate assembly sheet 1.
  • the continuous portion 32 is provided on the one side continuous portion 34 arranged on one side in the second direction of the one opto-electric hybrid board 2A and the one opto-electric hybrid board 2A.
  • the other side continuous portion 35 arranged on the other side in the second direction of the other opto-electric hybrid board 2B adjacent to each other may be independently provided.
  • one side continuous portion 34 and the other side continuous portion 35 are alternately arranged on the projection surface projected in the second direction.
  • the one-side continuous portion 34 and the other-side continuous portion 35 are connected by the connecting portion 33.
  • the first end 11 and the second end 12 are arranged at one end and the other end in the second direction, respectively.
  • the first end 11 and the second end 12 are arranged at the other end and one end in the second direction, respectively.
  • the removing unit 3 has the continuous portion 32 as shown in FIG. 3, but the removing unit 3 does not have to have the continuous portion 32 as shown in FIG. 11A.
  • the removing unit 3 includes a plurality of connecting portions 33.
  • Each of the plurality of connecting portions 33 is independent of each other.
  • the plurality of connecting portions 33 are removed one by one.
  • the removing part 3 has a continuous part 32 and a plurality of connecting parts 33 as in the embodiment shown in FIG. 3A. Accordingly, when the continuous portion 32 is separated from the opto-electric hybrid board 2, the plurality of connecting portions 33 continuous with the continuous portion 32 can be separated from the laminated member 70 at once. Therefore, the connecting member 33 can be efficiently separated from the laminated member 70.
  • a plurality of connecting portions 33 are provided. For example, although not shown, if there are two electric circuit board portions 5, one connecting portion 33 is provided between them. May be.
  • each of the two adhesive tapes 7 can be adhered to each of the one surface and the other surface in the thickness direction of the opto-electric hybrid board 2.
  • Examples 1 to 5 As shown in FIG. 1A, FIG. 2A, FIG. 3A, and FIG. 3B, first, between the plurality of electric circuit board units 5 so as to connect the plurality of electric circuit board units 5 and the plurality of electric circuit board units 5.
  • the connecting sheet 31 having the connecting portion 33 disposed on the optical circuit board 5 and the optical waveguide 6 stacked on the plurality of electric circuit board portions 5 are provided, and the electric circuit board portion 5 and the optical waveguide 6 constitute the opto-electric hybrid board 2.
  • the opto-electric hybrid board assembly sheet 1 to be prepared was prepared (implementation of the first step).
  • the material of the optical waveguide 6 was an epoxy resin and had a thickness of 100 ⁇ m.
  • the thickness of the electric circuit board portion 5 was 100 ⁇ m.
  • the removing portion 3 including the connecting portion 33 was formed from the same layer as the insulating base layer 52 made of polyimide.
  • the adhesive tape 7 having a width of 20 mm shown in Table 1 is first formed on the intermediate portion 13 on one surface in the thickness direction of the plurality of optical waveguides 6. Sticking along the direction (performing the second step).
  • the adhesive tapes 7 of Examples 1 to 5 are single-sided adhesive tapes manufactured by Nitto Denko Corporation.
  • the slit 8 was formed by laser processing, and the electric circuit board 58 was partitioned on the connection sheet 31 (implementation of the fourth step).
  • the removing unit 3 was removed from the connecting sheet 31. (Implementation of the third step). As a result, the optoelectric substrate assembly 10 was obtained.
  • the displacement of the opto-electric hybrid board 2 from the adhesive tape 7 due to the arrangement of the optical element 16 and the connector 17 was visually observed and evaluated according to the following criteria. ⁇ : The opto-electric hybrid board 2 was not displaced with respect to the adhesive tape 7. ⁇ : The opto-electric hybrid board 2 was slightly displaced from the adhesive tape 7.
  • the method for manufacturing a plurality of laminated members of the present invention is used, for example, for manufacturing a plurality of opto-electric hybrid boards.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Optical Integrated Circuits (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

La présente invention a trait à un procédé de production de cartes hybrides opto-électriques 2, le procédé comprenant: une première étape de préparation d'une feuille d'assemblage de cartes hybrides opto-électriques 1 dans laquelle des cartes hybrides opto-électriques 2 sont configurées à partir d'une partie de carte de circuit électrique 5 et d'un guide d'ondes optiques 6, et qui comprend une pluralité de guides d'ondes optiques 6 qui sont stratifiés sur une pluralité de parties de carte de circuit électrique 5, et une feuille de liaison 31 qui comprend une pluralité de parties de carte de circuit électrique 5 disposées en réseau et espacées les unes des autres dans une première direction et des parties de liaison 33 disposées entre la pluralité de parties de carte de circuit électrique 5 de façon à connecter la pluralité de parties de carte de circuit électrique 5; et une seconde étape consistant à faire adhérer une bande adhésive 7 à une pluralité de cartes hybrides opto-électriques 2.
PCT/JP2020/002535 2019-01-31 2020-01-24 Procédé de production de plusieurs éléments stratifiés, et assemblage d'éléments stratifiés WO2020158606A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-015388 2019-01-31
JP2019015388A JP2020121774A (ja) 2019-01-31 2019-01-31 複数の積層部材の製造方法、および、積層部材集合体

Publications (1)

Publication Number Publication Date
WO2020158606A1 true WO2020158606A1 (fr) 2020-08-06

Family

ID=71839981

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/002535 WO2020158606A1 (fr) 2019-01-31 2020-01-24 Procédé de production de plusieurs éléments stratifiés, et assemblage d'éléments stratifiés

Country Status (3)

Country Link
JP (1) JP2020121774A (fr)
TW (1) TW202039325A (fr)
WO (1) WO2020158606A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7404180B2 (ja) * 2020-07-16 2023-12-25 株式会社三共 遊技機
JP7469202B2 (ja) * 2020-09-28 2024-04-16 株式会社三共 遊技機

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57157164U (fr) * 1981-03-27 1982-10-02
JPS63134958U (fr) * 1987-02-25 1988-09-05
JPH10319264A (ja) * 1997-05-20 1998-12-04 Tokin Corp 光導波路素子の製造方法
JP2005234501A (ja) * 2004-02-23 2005-09-02 Matsushita Electric Works Ltd 光導波路モジュール
JP2006073653A (ja) * 2004-08-31 2006-03-16 Shinko Electric Ind Co Ltd 積層型基板、積層型基板の製造方法および半導体装置
US20130292052A1 (en) * 2011-01-17 2013-11-07 Pusan National University Industry-University Cooperation Foundation Method for manufacturing photoaligning integrated large area metallic stamp, and method for manufacturing polymer optical device using same
JP2016066054A (ja) * 2014-09-24 2016-04-28 日東電工株式会社 光電気混載基板およびその製法
JP2017203807A (ja) * 2016-05-09 2017-11-16 日東電工株式会社 光回路基板シートおよびそれを備えた光電気混載基板シート

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57157164U (fr) * 1981-03-27 1982-10-02
JPS63134958U (fr) * 1987-02-25 1988-09-05
JPH10319264A (ja) * 1997-05-20 1998-12-04 Tokin Corp 光導波路素子の製造方法
JP2005234501A (ja) * 2004-02-23 2005-09-02 Matsushita Electric Works Ltd 光導波路モジュール
JP2006073653A (ja) * 2004-08-31 2006-03-16 Shinko Electric Ind Co Ltd 積層型基板、積層型基板の製造方法および半導体装置
US20130292052A1 (en) * 2011-01-17 2013-11-07 Pusan National University Industry-University Cooperation Foundation Method for manufacturing photoaligning integrated large area metallic stamp, and method for manufacturing polymer optical device using same
JP2016066054A (ja) * 2014-09-24 2016-04-28 日東電工株式会社 光電気混載基板およびその製法
JP2017203807A (ja) * 2016-05-09 2017-11-16 日東電工株式会社 光回路基板シートおよびそれを備えた光電気混載基板シート

Also Published As

Publication number Publication date
JP2020121774A (ja) 2020-08-13
TW202039325A (zh) 2020-11-01

Similar Documents

Publication Publication Date Title
JP4418508B2 (ja) 光電気混載フィルムおよびそれを収納した電子機器
WO2020158606A1 (fr) Procédé de production de plusieurs éléments stratifiés, et assemblage d'éléments stratifiés
KR100388763B1 (ko) 광섬유 연결 장치 및 이를 제조하는 방법
KR20150039712A (ko) 광파이버 커넥터, 그의 제조 방법, 광파이버 커넥터와 광파이버의 접속 방법, 광파이버 커넥터와 광파이버의 조립체
KR102523319B1 (ko) 광전기 혼재 기판 및 그 제법
KR100926733B1 (ko) 캐리어 테이프를 구비한 플렉시블 플랫 케이블 및 그 제조방법
US10168495B1 (en) Optical waveguide and optical circuit board
US7801399B2 (en) Method of forming optical waveguide
JP5522076B2 (ja) フレキシブルフラット光ケーブル
EP3048462A1 (fr) Substrat hybride opto-électrique, et procédé de fabrication de ce substrat
JP2014115480A (ja) 光導波路及びその製造方法
CN113823654B (zh) 一种驱动基板、发光装置及其制作方法
JP2015035377A (ja) フラットケーブル
US8718479B2 (en) Fiber optic cable assembly for optical transceiver
JP4703441B2 (ja) 光導波路素子および光電気混載素子
JP7298612B2 (ja) フラットケーブルおよびフラットケーブルの製造方法
US11229116B2 (en) Board assembly sheet
WO2014073707A1 (fr) Guide d'ondes optique, procédé de fabrication de guide d'ondes optique et module optique
WO2022107762A1 (fr) Structure de connexion optique
US7680365B2 (en) Optical fiber sheet and its manufacturing method
EP3226046A1 (fr) Structure de connexion de réseau de fibre optique et module optique
WO2020022423A1 (fr) Connecteur d'élément à guide d'ondes optique, et procédé associé
WO2020022428A1 (fr) Connecteur d'élément à guide d'onde optique et procédé permettant de fabriquer ce connecteur
TW202131035A (zh) 光電複合傳送模組
KR101022943B1 (ko) 기판 제조용 캐리어 부재 및 이를 이용한 기판의 제조방법

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20748710

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20748710

Country of ref document: EP

Kind code of ref document: A1