WO2020151140A1 - 噪声系数较小的驻极体电容传声器及其制作方法 - Google Patents

噪声系数较小的驻极体电容传声器及其制作方法 Download PDF

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Publication number
WO2020151140A1
WO2020151140A1 PCT/CN2019/088219 CN2019088219W WO2020151140A1 WO 2020151140 A1 WO2020151140 A1 WO 2020151140A1 CN 2019088219 W CN2019088219 W CN 2019088219W WO 2020151140 A1 WO2020151140 A1 WO 2020151140A1
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WO
WIPO (PCT)
Prior art keywords
pcb board
electret
spring
variable capacitor
asic amplifier
Prior art date
Application number
PCT/CN2019/088219
Other languages
English (en)
French (fr)
Inventor
郑虎鸣
温增丰
张余
童锋
Original Assignee
东莞泉声电子有限公司
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Application filed by 东莞泉声电子有限公司 filed Critical 东莞泉声电子有限公司
Publication of WO2020151140A1 publication Critical patent/WO2020151140A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2410/00—Microphones
    • H04R2410/03—Reduction of intrinsic noise in microphones

Definitions

  • the invention relates to the technical field of an electret condenser microphone, in particular to an electret condenser microphone with a small noise coefficient and a manufacturing method thereof.
  • the existing electret condenser microphone generally includes a diaphragm assembly, a back plate and a PCB board, and the PCB board is connected with a field effect tube.
  • ECM electret condenser microphone
  • the existing electret condenser microphone directly connects the grid of the field effect tube of the PCB board to the back plate, which has a large noise coefficient and is difficult to ensure the normal transmission of effective sound.
  • the main purpose of the present invention is to provide an electret condenser microphone with a small noise figure and a manufacturing method thereof, which can effectively reduce the noise figure and ensure the normal transmission of effective sound, especially to ensure the ASIC
  • the amplifier is stable and reliable during use, and the process flow is simple, the process efficiency is high, and the processing cost is low.
  • An electret condenser microphone with a small noise figure comprising a shell, an electret variable capacitor and an ASIC amplifier installed in the shell, wherein the ASIC amplifier is installed on a PCB board and is arranged on the PCB board There is an output terminal; the electret type variable capacitor is electrically connected to the ASIC amplifier, and the ASIC amplifier is electrically connected to the output terminal on the PCB board.
  • the ASIC amplifier is an integrated chip bonded on a PCB board.
  • the electret variable capacitor is electrically connected to the ASIC amplifier through a conductive member, the conductive member is installed in the housing, and the conductive member includes a first spring, a second spring, and The two ends of the first spring are respectively connected to the electret variable capacitor and the contact electrode, the two ends of the second spring are respectively connected to the PCB board and the contact electrode, and the ASIC amplifier is electrically connected to the second spring.
  • the electret variable capacitor includes a back plate, an insulating ring gasket and a diaphragm assembly that can vibrate up and down, the back plate has an electret layer;
  • a mounting cavity with an opening at one end, the diaphragm assembly, the insulating ring gasket and the back plate are all loaded into the mounting cavity from the opening, and the PCB board is installed in the mounting cavity and covering the opening;
  • the ring gasket is sandwiched between the diaphragm assembly and the back electrode plate to separate the diaphragm assembly and the back electrode plate to form a sound cavity for collecting sound.
  • it also includes a back electrode holder installed in the mounting cavity, the back electrode holder is arranged between the PCB board and the insulating ring gasket, the back electrode holder has a back electrode plate mounting position, and The back electrode plate is installed at the back electrode plate installation position, and the insulating ring gasket is pressed between the back electrode seat and the diaphragm assembly.
  • the back electrode plate is provided with a first sound outlet hole
  • the back electrode base is provided with a second sound outlet hole
  • the first sound outlet hole and the second sound outlet hole are intersected
  • the first sound outlet hole and/or the second sound outlet hole are provided with a damping sheet.
  • the PCB board is also provided with a charge pump and a voltage stabilizer, one end of the electret variable capacitor is electrically connected to one end of the charge pump and one end of the voltage stabilizer, and one end of the charge pump is connected to the stabilizer.
  • One end of the voltage stabilizer is grounded, one end of the voltage stabilizer is also grounded through the first capacitor, the other end of the charge pump is connected to the voltage stabilizer, and the other end of the voltage stabilizer is connected to the ASIC amplifier.
  • the other end of the variable capacitor is grounded; the output end of the PCB board is also electrically connected with a second capacitor, a resistor, and an operational amplifier.
  • a method for manufacturing an electret condenser microphone with a small noise coefficient includes the following steps:
  • Preparation steps prepare the case, electret variable capacitor, and ASIC amplifier, among which the ASIC amplifier is bonded on the PCB board using COB technology;
  • a back electrode holder is also prepared, the back electrode holder has a back electrode plate mounting position, and the electret type variable capacitor includes a back electrode plate, an insulating ring gasket and an upper and lower back plate.
  • the housing has a mounting cavity with an open end;
  • the diaphragm assembly, the insulating ring gasket and the back plate are sequentially installed in the mounting cavity of the housing, and the back plate is positioned corresponding to the mounting position of the back plate, and then the PCB board is installed in the mounting cavity Inside and the PCB board covers the opening.
  • the electret variable capacitor is electrically connected to the ASIC amplifier through a conductive member, the conductive member is installed in the housing, and the conductive member includes a first spring, a second spring, and Contact electrode; when assembling, connect one end of the first spring to the contact electrode, and connect one end of the second spring to the contact electrode;
  • the assembling step first install the contact electrode in the second spring installation groove and extend into the first spring installation groove, install the first spring in the first spring installation groove of the back electrode base, and One end of the spring is connected to the contact electrode, and then the back electrode holder, the contact electrode and the first spring are installed together in the mounting cavity of the housing.
  • the back electrode plate is positioned corresponding to the mounting position of the back electrode plate, and the other end of the first spring is connected The back plate and the back plate are pressed down so that the back plate, the insulating ring gasket and the diaphragm assembly are in close contact;
  • the second spring in the second spring mounting groove and install the PCB board in the mounting cavity of the housing.
  • the two ends of the second spring are electrically connected to the PCB board and the contact electrode, and finally the upper periphery of the housing is inward Bending to form a curled part, and finally the upper peripheral edge of the shell is bent inward to form a curled part, so that the PCB board, the conductive member, the back electrode plate, the insulating ring gasket and the diaphragm assembly are fixed in the shell.
  • the present invention has obvious advantages and beneficial effects. Specifically, it mainly uses an ASIC amplifier to replace the existing field effect tube, which effectively reduces the noise figure and ensures the normal transmission of effective sound.
  • the ASIC amplifier is bonded on the PCB board using COB technology to ensure the stability and reliability of the ASIC amplifier during use, and the process flow is simple, the process efficiency is high, and the processing cost is low;
  • Figure 1 is a schematic diagram of a three-dimensional assembly structure of an embodiment of the present invention.
  • FIG 2 is another perspective view of the three-dimensional assembly structure of the embodiment of the present invention.
  • FIG. 3 is a schematic diagram of an exploded structure of an embodiment of the present invention.
  • Fig. 4 is a schematic diagram of another perspective exploded structure of the embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional structure diagram of an embodiment of the present invention.
  • Figure 6 is a block diagram of the signal transmission principle of the embodiment of the present invention.
  • Fig. 7 is a schematic circuit diagram of an embodiment of the present invention.
  • the first spring 82 The first spring 82.
  • an electret condenser microphone with a small noise figure includes a housing 10 and an electret variable capacitor 100 installed in the housing 10, an ASIC amplifier 41, and a dust-proof net 93,
  • the ASIC amplifier 41 is installed on a PCB board 40, and an output terminal 401 is provided on the PCB board 40;
  • the electret variable capacitor 100 is electrically connected to the ASIC amplifier 41, and the ASIC amplifier 41 is electrically connected to the PCB board. 40 on the output 401.
  • the ASIC amplifier 41 is an integrated chip bonded on the PCB board 40.
  • the ASIC amplifier 41 is an analog chip or a digital chip.
  • the PCB board 40 is further provided with a charge pump 101 and a voltage stabilizer 102.
  • One end of the electret variable capacitor 100 is electrically connected to one end of the charge pump 101 and one end of the voltage stabilizer 102, respectively.
  • One end of the charge pump 101 and one end of the regulator 102 are both grounded, one end of the regulator 102 is also grounded through the first capacitor, the other end of the charge pump 101 is connected to the regulator 102, and the other end of the regulator 102 is connected to the ASIC amplifier 41.
  • the output terminal 401 on the PCB board 40 and the other end of the electret variable capacitor 100 are both grounded.
  • the output terminal 401 of the PCB board 40 is also electrically connected with a second capacitor, a resistor, and an operational amplifier.
  • the electret variable capacitor 100 includes a back plate 20, an insulating ring gasket 30, and a diaphragm assembly 70 that can vibrate up and down.
  • the back plate 20 has an electret layer
  • the housing 10 has For the installation cavity 11 with an open end, preferably, the opening of the installation cavity 11 is downward. It also includes a back electrode base 60 installed in the following installation cavity 11, the diaphragm assembly 70, insulating ring gasket 30, back electrode plate 20, and dust-proof net 93 are all inserted into the installation cavity 11 from the opening ,
  • the PCB board 40 is installed in the mounting cavity 11 and covers the opening;
  • the insulating ring gasket 30 is sandwiched between the diaphragm assembly 70 and the back plate 20 to separate the diaphragm assembly 70 and the back plate 20 to form a sound cavity for collecting sound, and the dust-proof net 93 is provided Above the diaphragm assembly 70 and covering the aforementioned fourth sound hole 12, dust can be prevented from entering the inside of the microphone through the fourth sound hole 12.
  • the dust-proof net 93 is made of metal material and adopts a micro-hole sound inlet design to satisfy the sound
  • the head is waterproof and dustproof, and it also has the shielding function, which can significantly improve the shielding effect.
  • the back pole holder 60 is disposed between the PCB board 40 and the insulating ring gasket 30.
  • the back pole holder 60 is disposed above the PCB board 40.
  • the PCB board 40 is provided with a third sound outlet 94.
  • the back pole seat 60 has a back plate installation position 61, a damper plate installation position 62, a first spring installation groove 63 and a second spring installation groove 64, the first spring installation groove 63 and the second spring installation groove 64 are located At the center position of the back pole seat 60, the first spring installation groove 63 is located above the second spring installation groove 64, and the first spring installation groove 63 is connected to the second spring installation groove 64;
  • a spring mounting groove 63 is provided on the periphery, the back plate mounting position 61 is set on the periphery of the damper plate mounting position 62; the back plate 20 is mounted on the back plate mounting position 61, and the insulating ring gasket 30 is It is pressed between the back pole base 60 and the diaphragm assembly
  • the back plate 20 is provided with a first sound hole 21, the back electrode base 60 is provided with a second sound hole 65, the first sound hole 21 and the second sound hole 65 are connected, and, The first sound outlet 21 and/or the second sound outlet 65 are provided with a damper 50.
  • the first sound outlet 21 is connected to the second sound outlet 65 through the damper installation position 62.
  • the lower end surface of the back pole base 60 is concavely formed with an annular groove 66 upwardly, and the annular groove 66 is located at the periphery of the second spring mounting groove 64.
  • the ASIC amplifier 41 is disposed on the upper end surface of the PCB board 40 and the ASIC amplifier 41 is located in the annular groove 66.
  • the upper and lower ends of the conductive member 80 are respectively connected to the back plate 20 and the ASIC amplifier 41.
  • the PCB board 40 has an output terminal 401, and the output terminal 401 is electrically connected to the ASIC amplifier 41.
  • the ASIC amplifier 41 has a signal amplifying module 411 and a filter module 412, the signal amplifying module 411 is respectively connected to the conductive element 80 and the filter module 412, and the filter module 412 is electrically connected to the output of the PCB board 40 ⁇ 401.
  • the electret variable capacitor 100 is electrically connected to the ASIC amplifier 41 through a conductive member, the conductive member 80 is installed in the housing 10, and the conductive member 80 includes a first spring arranged separately. 81.
  • the back pole seat 60 has a first spring installation groove 63 and a second spring installation groove 64.
  • the first spring installation groove 63 is located above the second spring installation groove 64 and is first The spring installation groove 63 is connected to the second spring installation groove 64;
  • the contact electrode 83 is installed in the second spring installation groove 64 and extends into the first spring installation groove 63, and the first spring 81 is installed in the first spring installation groove 63 at both ends of the first spring 81
  • the electret variable capacitor 100 and the contact electrode 83 are respectively connected.
  • the two ends of the first spring 81 are respectively connected to the back plate 20 and the contact electrode 83
  • the second spring 82 is installed in the second spring mounting groove 64 and the two ends of the second spring 82 are respectively connected to the PCB board 40 and the contact electrode 83, and the ASIC amplifier 41 and the second spring 82 are electrically connected.
  • a method for manufacturing an electret condenser microphone with a small noise coefficient includes the following steps:
  • the adhesive glue is applied on the PCB board 40, the ASIC amplifier 41 is pasted on the PCB board 40, and then the wiring terminal of the ASIC amplifier 41 is connected to the circuit on the PCB board 40.
  • the glue is sealed on the PCB board 40, and finally baked and cured.
  • the PCB board 40 needs to be cleaned before the adhesive is applied on the PCB board 40. After cleaning, the PCB board 40 still has oil stains or oxide layers and other unclean parts. Use a skin wipe to test the positioning or test the needle position. The PCB board 40 must be cleaned with a brush or blown with an air gun before it can flow into the next process. For products with strict anti-static properties, use an ion blower. The purpose of cleaning is to remove dust and oil on the PCB board 40 bond pads to improve the quality of the bonding.
  • the purpose of the adhesive glue is to prevent the ASIC amplifier during the transfer and bonding of the product 41 fell off.
  • the needle transfer method is to use a needle to take a small drop of adhesive from the container and apply it on the PCB board 40, which is a very fast dispensing method ;
  • the pressure injection method is to put the glue into the syringe, apply a certain air pressure to squeeze the glue out, the size of the glue point is determined by the nozzle diameter of the syringe and the pressure time and pressure and is related to the viscosity. This process is generally used in dripping machine or DIE BOND automatic equipment.
  • the size and height of the glue drop depend on the type, size and weight of the ASIC amplifier 41. Large size and weight ASIC amplifier 41.
  • the amount of glue drop required is larger, and it should not be too big to ensure sufficient viscosity.
  • the adhesive glue can not pollute the bonding pad.
  • the adhesive glue is red glue.
  • the hardness of the vacuum suction pen is required to be small (a cotton swab is also used for sticking).
  • the diameter of the nozzle is based on the ASIC amplifier
  • the tip of the tip must be flat to avoid scratching the surface of the ASIC amplifier 41.
  • the ASIC amplifier 41 must be pasted to the PCB board 40 to be “smooth and positive", where: “flat” refers to the ASIC amplifier 41 and the PCB board 40 are in close contact with each other in parallel; “stable” is the ASIC amplifier 41 and the PCB board 40 are not easy to fall off in the whole process; “positive” refers to the ASIC amplifier 41 and PCB board 40 reserved positions are pasted upright, not twisted. It should be noted that the direction of the ASIC amplifier 41 must not be reversed.
  • the sealant is made of vinyl, which should completely cover the bonding ASIC amplifier 41 aluminum wire, there should be no rusty phenomenon, if there is any leakage, wipe it off immediately with a cloth strip. Do not touch the ASIC amplifier during the entire dispensing process 41 and well-bonded line.
  • the surface of the dried vinyl shall be free of pores and uncured vinyl.
  • the height of the black glue should not exceed 1.8MM, and the special requirement should be less than 1.5MM.
  • the temperature of the preheating plate and the drying temperature should be strictly controlled when sealing.
  • the sealing method usually also adopts the needle transfer method and the pressure injection method. Some also use glue dispensers, but their cost is high and efficiency is low. Usually, cotton swabs and syringes are used for glue, but the operators must have skilled operation ability and strict process requirements. If the chip is damaged, it will be very difficult to repair it.
  • Non-contact detection has developed from manual visual inspection to automatic optical image analysis (AOI) and X-ray analysis. From appearance circuit pattern inspection to inner layer solder joint quality inspection, and from a single inspection to a combination of quality monitoring and defect repair.
  • AOI optical image analysis
  • X-ray analysis From appearance circuit pattern inspection to inner layer solder joint quality inspection, and from a single inspection to a combination of quality monitoring and defect repair.
  • the automatic bonding wire quality inspection function of the bonding machine mainly adopts two methods of design rule detection (DRC) and pattern recognition.
  • DRC design rule detection
  • pattern recognition compares the stored digitized image with the actual work. But both of these are affected by process control, process regulations, parameter changes, etc. Which method is used should be determined according to the specific conditions of each production line and the product. But no matter what the conditions are, visual inspection is the basic detection method.
  • a back pole base 60 is also prepared.
  • the back pole base 60 has a back plate installation position 61, a damper plate installation position 62, a first spring installation groove 63, and a second spring installation groove 64.
  • the pole body variable capacitor 100 includes a back plate 20, an insulating ring gasket 30, and a diaphragm assembly 70 that can vibrate up and down.
  • the housing 10 has a mounting cavity 11 with an opening at one end, and the opening of the mounting cavity 11 is downward;
  • the diaphragm assembly 20, the insulating ring gasket 30, and the back plate 20 are sequentially installed in the mounting cavity 11 of the housing 10, and the back plate 20 corresponds to the mounting position of the back plate.
  • the PCB board 40 is installed in the mounting cavity 11 and the PCB board 40 covers the opening.
  • the electret variable capacitor 100 is electrically connected to the ASIC amplifier 41 through a conductive member, the conductive member 80 is installed in the housing 10, and the conductive member 80 includes a first spring arranged separately. 81.
  • the assembly step first install the contact electrode 83 in the second spring installation groove 64 and extend into the first spring installation groove 63, and install the first spring 81 on the first spring installation of the back pole seat 60
  • the groove 63 one end of the first spring 81 is connected to the contact electrode 83, and then the back electrode holder 60, the contact electrode 83 and the first spring 81 are installed together in the mounting cavity 11 of the housing 10, and the back electrode plate 20 corresponds to the back
  • the plate mounting position 61 is positioned, and the other end of the first spring 81 is connected to the back plate 20 and presses the back plate 20 downward, so that the back plate 20, the insulating ring gasket 30 and the diaphragm assembly 70 are in close contact;
  • the second spring 82 in the second spring mounting groove 64, and then install the PCB board 40 in the mounting cavity 11 of the housing 10.
  • the two ends of the second spring 82 are respectively electrically connected to the PCB board 40 and the contact electrode 83, Finally, the upper peripheral edge of the housing 10 is bent inward to form a curled portion 95, and finally the upper peripheral edge of the housing 10 is bent inwardly to form a curled portion 95, so that the PCB board 40, the conductive member 80, the back plate 20, the insulating ring gasket 30 and The diaphragm assembly 70 is fixed in the housing 10.
  • a fixed electrode plate (back electrode plate 20), a movable electrode plate (diaphragm assembly 70) and an insulating ring gasket 30 constitute a flat capacitor with air as the medium, and it is a Variable capacitor.
  • the electret material is charged to establish an internal electric field.
  • the diaphragm assembly 70 When the diaphragm assembly 70 is affected by the sound signal 91, the diaphragm assembly 70 vibrates, thereby changing the distance between the diaphragm assembly 70 and the back plate 20, resulting in a change of ⁇ d. It can be seen from the formula that the change of ⁇ d produces a change of ⁇ C, because the charging charge is fixed, so the change of ⁇ C produces a change of ⁇ V. In this way, a conversion from the sound signal 91 to the electric signal 92 is initially completed.
  • the converted electrical signal 92 cannot be directly transmitted to the circuit on the back-end PCB board 40 for use. Therefore, the electrical signal 92 obtained initially passes through the conductive member 80 (the conductive adhesive includes a separate set The first spring 81, the second spring 82 and the contact electrode 83) are conducted to the ASIC amplifier on the PCB board 40 41 signal input port, through ASIC amplifier After processing by the signal amplifying module 411 and the filtering module 412 integrated inside 41, the clean and useful electrical signal 92 that has been amplified is output through the output terminal 401 of the PCB board 40 for use by the next-stage amplifying circuit of the client.
  • the main point of the design of the present invention is that it mainly uses an ASIC amplifier to replace the existing field effect tube, which effectively reduces the noise figure and ensures the normal transmission of effective sound.
  • the ASIC amplifier adopts COB technology to bond on the PCB board to ensure The stability and reliability of the ASIC amplifier during use, moreover, the process flow is simple, the process efficiency is high, and the processing cost is low;

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

本发明涉及一种噪声系数较小的驻极体电容传声器及其制作方法，包括有外壳和安装于外壳内的驻极体式可变电容器、ASIC放大器，ASIC放大器是装设于PCB板，PCB板设输出端；所述驻极体式可变电容器电连接于ASIC放大器，ASIC放大器电连接于PCB板上的输出端；制作方法包括有如下步骤：准备步骤：准备外壳、驻极体式可变电容器、ASIC放大器，ASIC放大器是采用COB工艺邦定在PCB板上；组装步骤：先将驻极体式可变电容器装入外壳内，再将ASIC放大器连同PCB板一起装入外壳内，并将ASIC放大器、驻极体式可变电容器形成电性连接；其有效降低噪声系数，保证有效声音的正常传送，尤其是，确保ASIC放大器在使用过程中的稳定性和可靠性，而且，工艺流程简便和制程效率较高，加工成本较低。

Description

噪声系数较小的驻极体电容传声器及其制作方法 技术领域
本发明涉及一种驻极体电容传声器技术领域，尤其是指一种噪声系数较小的驻极体电容传声器及其制作方法。
背景技术
现有的驻极体电容传声器（简称ECM）中，一般包括振膜组件、背极板和PCB板，PCB板连接有场效应管。当振膜组件遇到声波振动时，引起电容的电场发生变化，从而产生随声波变化而变化的交变电压。现有的驻极体电容传声器是将PCB板的场效应管的栅极直接与背极板连接，噪声系数大，很难保证有效声音的正常传送。
因此，本发明专利申请中，申请人精心研究了一种噪声系数较小的驻极体电容传声器及其制作方法来解决上述问题。
发明内容
本发明针对上述现有技术所存在不足，主要目的在于提供一种噪声系数较小的驻极体电容传声器及其制作方法，其有效降低噪声系数，保证有效声音的正常传送，尤其是，确保ASIC放大器在使用过程中的稳定性和可靠性，而且，工艺流程简便和制程效率较高，加工成本较低。
为实现上述之目的，本发明采取如下技术方案：
一种噪声系数较小的驻极体电容传声器，包括有外壳和安装于外壳内的驻极体式可变电容器、ASIC放大器，其中，ASIC放大器是装设于一PCB板上，在PCB板上设置有输出端；所述驻极体式可变电容器电连接于ASIC放大器，ASIC放大器电连接于PCB板上的输出端。
作为一种优选方案，所述ASIC放大器为邦定于PCB板上的集成芯片。
作为一种优选方案，所述驻极体式可变电容器通过导电件电连接于ASIC放大器，所述导电件装设于外壳内，所述导电件包括分体设置的第一弹簧、第二弹簧和接触电极，第一弹簧的两端分别连接驻极体式可变电容器和接触电极，所述第二弹簧的两端分别连接PCB板和接触电极，且，ASIC放大器和第二弹簧电性连接。
作为一种优选方案，所述驻极体式可变电容器包括背极板、绝缘环形垫片和可上下振动的振膜组件，所述背极板上具有驻极体层；所述外壳的内部具有一端开口的安装腔，所述振膜组件、绝缘环形垫片及背极板均自开口处装入安装腔内，所述PCB板装设于安装腔内且遮覆于开口处；所述绝缘环形垫片夹设于振膜组件和背极板之间以将振膜组件和背极板隔开形成用于收集声音的音腔。
作为一种优选方案，还包括有装设于安装腔内的背极座，所述背极座设置于PCB板与绝缘环形垫片之间，所述背极座具有背极板安装位，所述背极板装设于背极板安装位，所述绝缘环形垫片被压设于背极座、振膜组件之间。
作为一种优选方案，所述背极板设置有第一出音孔，所述背极座设置有第二出音孔，所述第一出音孔、第二出音孔相贯通，且，所述第一出音孔和/或第二出音孔设置有阻尼片。
作为一种优选方案，所述PCB板还设置有电荷泵和稳压器，所述驻极体式可变电容器的一端分别电连接电荷泵的一端和稳压器的一端，电荷泵的一端和稳压器的一端均接地，稳压器的一端还通过第一电容接地，电荷泵的另一端连接稳压器，稳压器的另一端连接ASIC放大器，PCB板上的输出端和驻极体式可变电容器的另一端均接地；所述PCB板的输出端还电连接有第二电容、电阻、运算放大器。
一种噪声系数较小的驻极体电容传声器的制作方法，包括有如下步骤：
（1）准备步骤：准备外壳、驻极体式可变电容器、ASIC放大器，其中，ASIC放大器是采用COB工艺邦定在PCB板上；
（2）组装步骤：先将驻极体式可变电容器装入外壳内，再将ASIC放大器连同PCB板一起装入外壳内，并将ASIC放大器、驻极体式可变电容器形成电性连接。
作为一种优选方案，所述准备步骤中，还准备背极座，所述背极座具有背极板安装位，所述驻极体式可变电容器包括背极板、绝缘环形垫片和可上下振动的振膜组件，所述外壳具有一端开口的安装腔；
所述组装步骤中，在外壳的安装腔内依次安装振膜组件、绝缘环形垫片和背极板，所述背极板对应背极板安装位形成定位，接着将PCB板装设于安装腔内且PCB板遮覆于开口处。
作为一种优选方案，所述驻极体式可变电容器通过导电件电连接于ASIC放大器，所述导电件装设于外壳内，所述导电件包括分体设置的第一弹簧、第二弹簧和接触电极；组装时，将第一弹簧的一端与接触电极连接，将第二弹簧的一端与接触电极连接；
在组装步骤中，先将接触电极装设于第二弹簧安装槽内且伸入第一弹簧安装槽内，将所述第一弹簧装设于背极座的第一弹簧安装槽内，第一弹簧的一端连接接触电极，接着将背极座、接触电极和第一弹簧共同装设于外壳的安装腔内，所述背极板对应背极板安装位形成定位，第一弹簧的另一端连接背极板并将背极板往下压，使得背极板、绝缘环形垫片和振膜组件紧密接触；
然后将第二弹簧装设于第二弹簧安装槽内后将PCB板装设于外壳的安装腔内，第二弹簧的两端分别电连接PCB板和接触电极，最后将外壳的上端周缘向内弯曲形成卷曲部，最后将外壳的上端周缘向内弯曲形成卷曲部，使得PCB板、导电件、背极板、绝缘环形垫片和振膜组件固定于外壳内。
本发明与现有技术相比具有明显的优点和有益效果，具体而言：其主要是利用ASIC放大器代替了现有的场效应管，有效降低噪声系数，保证有效声音的正常传送，尤其是，通过ASIC放大器采用COB工艺邦定在PCB板上，确保ASIC放大器在使用过程中的稳定性和可靠性，而且，工艺流程简便和制程效率较高，加工成本较低；
其次是，通过导电件的具体设计，在背极板和PCB板之间釆取弹性连接，一方面保证两者之间安装牢固，另一方面避免了使用导线对电信号的衰减与干扰，减小接触电阻，有效提高信号输出效能；
以及，整体结构设计巧妙合理，各零件之间组装方便和牢固，确保了整体的运行的可靠性和稳定性。
附图说明
图1是本发明之实施例的立体组装结构示意图；
图2是本发明之实施例的另一角度立体组装结构示意图；
图3是本发明之实施例的分解结构示意图；
图4是本发明之实施例的另一角度分解结构示意图；
图5是本发明之实施例的截面结构示意图；
图6是本发明之实施例的信号传输原理框图；
图7是本发明之实施例的电路原理图。
附图标号说明：
10、外壳 11、安装腔
12、第四出音孔 20、背极板
21、第一出音孔 30、绝缘环形垫片
40、PCB板 401、输出端
41、ASIC放大器 411、信号放大模块
412、滤波模块 50、阻尼片
60、背极座 61、背极板安装位
62、阻尼片安装位 63、第一弹簧安装槽
64、第二弹簧安装槽 65、第二出音孔
66、环形凹槽
70、振膜组件 80、导电件
81、第一弹簧 82、第二弹簧
83、接触电极 91、声音信号
92、电信号 93、防尘网
94、第三出音孔 95、卷曲部
100、驻极体式可变电容器 101、电荷泵
102、稳压器
具体实施方式
下面结合附图与具体实施方式对本发明作进一步描述。
如图1至图7所述，一种噪声系数较小的驻极体电容传声器，包括有外壳10和安装于外壳10内的驻极体式可变电容器100、ASIC放大器41、防尘网93，其中，ASIC放大器41是装设于一PCB板40上，在PCB板40上设置有输出端401；所述驻极体式可变电容器100电连接于ASIC放大器41，ASIC放大器41电连接于PCB板40上的输出端401。所述ASIC放大器41为邦定于PCB板40上的集成芯片，优选地，所述ASIC放大器41为模拟芯片或数字芯片。
如图7所述，所述PCB板40还设置有电荷泵101和稳压器102，所述驻极体式可变电容器100的一端分别电连接电荷泵101的一端和稳压器102的一端，电荷泵101的一端和稳压器102的一端均接地，稳压器102的一端还通过第一电容接地，电荷泵101的另一端连接稳压器102，稳压器102的另一端连接ASIC放大器41，PCB板40上的输出端401和驻极体式可变电容器100的另一端均接地。所述PCB板40的输出端401还电连接有第二电容、电阻、运算放大器。
所述驻极体式可变电容器100包括背极板20、绝缘环形垫片30、可上下振动的振膜组件70，所述背极板20上具有驻极体层，所述外壳10的内部具有一端开口的安装腔11，优选地，安装腔11的开口向下。还包括有装设于下述安装腔11内的背极座60，所述振膜组件70、绝缘环形垫片30、背极板20、防尘网93均自开口处装入安装腔11内，所述PCB板40装设于安装腔11内且遮覆于开口处；
所述绝缘环形垫片30夹设于振膜组件70和背极板20之间以将振膜组件70和背极板20隔开形成用于收集声音的音腔，所述防尘网93设置在振膜组件70的上方且遮覆前述第四出音孔12，可防止灰尘由第四出音孔12进入传声器内部，该防尘网93选用金属材料，采取微孔进声设计，即可满足音头防水、防尘功能，同时有兼顾到屏蔽功能，可显著提升屏蔽效果。
所述背极座60设置于PCB板40与绝缘环形垫片30之间，优选地，所述背极座60设置于PCB板40的上方。所述PCB板40上设有第三出音孔94。所述背极座60具有背极板安装位61、阻尼片安装位62、第一弹簧安装槽63和第二弹簧安装槽64，所述第一弹簧安装槽63和第二弹簧安装槽64位于背极座60的中心位置，所述第一弹簧安装槽63位于第二弹簧安装槽64的上方且第一弹簧安装槽63连通第二弹簧安装槽64；所述阻尼片安装位62设置于第一弹簧安装槽63的外围，所述背极板安装位61设置于阻尼片安装位62的外围；所述背极板20装设于背极板安装位61，所述绝缘环形垫片30被压设于背极座60、振膜组件70之间。
所述背极板20设置有第一出音孔21，所述背极座60设置有第二出音孔65，所述第一出音孔21、第二出音孔65相贯通，且，所述第一出音孔21和/或第二出音孔65设置有阻尼片50，优选地，第一出音孔21通过阻尼片安装位62连通第二出音孔65。
在本实施例中，所述背极座60的下端面往上凹设有环形凹槽66，所述环形凹槽66位于第二弹簧安装槽64的外围。所述ASIC放大器41设置于PCB板40的上端面且ASIC放大器41位于环形凹槽66内。
所述导电件80的上、下端分别连接于背极板20和ASIC放大器41，所述PCB板40具有输出端401，所述输出端401电连接于ASIC放大器41。在本实施例中，所述ASIC放大器41具有信号放大模块411和滤波模块412，所述信号放大模块411分别连接导电件80和滤波模块412，所述滤波模块412电连接于PCB板40的输出端401。
在本实施例中，所述驻极体式可变电容器100通过导电件电连接于ASIC放大器41，所述导电件80装设于外壳10内，所述导电件80包括分体设置的第一弹簧81、第二弹簧82和接触电极83，背极座60具有第一弹簧安装槽63和第二弹簧安装槽64，所述第一弹簧安装槽63位于第二弹簧安装槽64的上方且第一弹簧安装槽63连通第二弹簧安装槽64；
所述接触电极83装设于第二弹簧安装槽64内且伸入第一弹簧安装槽63内，所述第一弹簧81装设于第一弹簧安装槽63内且第一弹簧81的两端分别连接驻极体式可变电容器100和接触电极83，具体而言，第一弹簧81的两端分别连接背极板20和接触电极83，所述第二弹簧82装设于第二弹簧安装槽64内且第二弹簧82的两端分别连接PCB板40和接触电极83，且，ASIC放大器41和第二弹簧82电性连接。
一种噪声系数较小的驻极体电容传声器的制作方法，包括有如下步骤：
（1）准备步骤：准备外壳10、驻极体式可变电容器100、ASIC放大器41，其中，ASIC放大器41是采用COB工艺邦定在PCB板40上；
（2）组装步骤：先将驻极体式可变电容器100装入外壳内，再将ASIC放大器41连同PCB板40一起装入外壳10内，并将ASIC放大器41、驻极体式可变电容器100形成电性连接。
在本实施例中，所述准备步骤中，先于PCB板40上滴粘接胶，将ASIC放大器41粘贴于PCB板40，然后打线连接ASIC放大器41的接线端和PCB板40上的线路焊盘上，打线完成后在PCB板40上封胶，最后烘烤固化。
需要说明的是，PCB板40上滴粘接胶前需要对PCB板40进行清洁，清洗后的PCB板40仍有油污或氧化层等不洁部分用皮擦试帮定位或测试针位对擦拭的PCB板40要用毛刷刷干净或用气枪吹净方可流入下一工序。对于防静电严格的产品要用离子吹尘机。清洁的目的的为了把PCB板40邦线焊盘上的灰尘和油污等清除干净以提高邦定的品质。
滴粘接胶的目的是为了防止产品在传递和邦线过程中ASIC放大器 41脱落。在COB工序中通常采用针式转移和压力注射法；其中，针式转移法为用针从容器里取一小滴粘剂点涂在PCB板40上，这是一种非常迅速的点胶方法；压力注射法为将胶装入注射器内，施加一定的气压将胶挤出来，胶点的大小由注射器喷口口径的大小及加压时间和压力大小决定与与粘度有关。此工艺一般用在滴粘机或DIE BOND自动设备上。胶滴的尺寸与高度取决于ASIC放大器 41的类型、尺寸和重量而定。尺寸和重量大的ASIC放大器 41所需胶滴量大一些，也不宜过大以保证足够的粘度为准，同时粘接胶不能污染邦线焊盘。优选地，粘接胶采用红胶。
将ASIC放大器 41粘贴于PCB板40的过程中，要求真空吸笔（吸咀）材质硬度要小（也有采用棉签粘贴）。吸咀的直径根据ASIC放大器 41大小而定，咀尖必须平整以免刮伤ASIC放大器 41表面。在粘贴时须检查ASIC放大器 41与PCB板40的型号，粘贴方向是否正确。
ASIC放大器 41粘贴到到PCB板40上必须做到“平稳正”，其中：“平”就是指ASIC放大器 41与PCB板40平行贴紧无虚位；“稳”是ASIC放大器 41与PCB板40在整个流程中不易脱落；“正”是指ASIC放大器 41与PCB板40预留位正贴，不可偏扭。需要注意ASIC放大器 41的方向不得有贴反向之现象出现。
封胶采用的是黑胶，黑胶应完全盖住邦定ASIC放大器 41的铝线，不可有露丝现象，如有漏胶应用布条即时擦拭掉。在整个滴胶过程中针咀或毛签都不可碰到ASIC放大器 41及邦定好的线。烘干后的黑胶表面不得有气孔，及黑胶未固化现象。黑胶高度不超过1.8MM为宜，特别要求的应小于1.5MM。封胶时预热板温度及烘干温度都应严格控制。封胶方法通常也采用针式转移法和压力注射法。有些也用滴胶机，但其成本较高和效率低下。通常都采用棉签和针筒滴胶，但对操作人员要有熟练的操作能力及严格的工艺要求。如果碰坏芯片再返修就会非常困难。
因在邦定过程中会出现一些如断线，卷线，假焊等不良现象的而导致ASIC放大器 41故障，所以芯片级封装都要进行性能检测。根据检测方式可分为非接触式检测（检查）方式和接触式检测（测试）方式两大类，非接触式检测方式已经从人工目测发展到自动光学图象分析（AOI）及X射分析，从外观电路图形检查发展到内层焊点质量检查，并从单独的检查向质量监控和缺陷修补相结合的方向发展。
虽然邦定机装有自动焊线质量检测功能（BQM），但是邦定机自动焊线质量检测功能主要采用设计规则检测（DRC）和图形识别两种方法。DRC是按照一些给定的规则如熔点小于线径的多少或大于多少一些设定标准来检查焊线质量。图形识别法是将储存的数字化图象与实际工作进行比较。但这两者都受工艺控制，工艺规程，参数更改等方面影响。具体采用哪一种方法应根据各生产线具体条件，以及产品而定。但无论具备什么条件，目视检验是基本检测方法。
所述准备步骤中，还准备背极座60，所述背极座60具有背极板安装位61、阻尼片安装位62、第一弹簧安装槽63和第二弹簧安装槽64，所述驻极体式可变电容器100包括背极板20、绝缘环形垫片30和可上下振动的振膜组件70，所述外壳10具有一端开口的安装腔11，安装腔11的开口向下；
所述组装步骤中，将外壳10倒置后，在外壳10的安装腔11内依次安装振膜组件20、绝缘环形垫片30和背极板20，所述背极板20对应背极板安装位61形成定位，接着将PCB板40装设于安装腔11内且PCB板40遮覆于开口处。
在本实施例中，所述驻极体式可变电容器100通过导电件电连接于ASIC放大器41，所述导电件80装设于外壳10内，所述导电件80包括分体设置的第一弹簧81、第二弹簧82和接触电极83；
在组装步骤中，先将接触电极83装设于第二弹簧安装槽64内且伸入第一弹簧安装槽63内，将所述第一弹簧81装设于背极座60的第一弹簧安装槽63内，第一弹簧81的一端连接接触电极83，接着将背极座60、接触电极83和第一弹簧81共同装设于外壳10的安装腔11内，所述背极板20对应背极板安装位61形成定位，第一弹簧81的另一端连接背极板20并将背极板20往下压，使得背极板20、绝缘环形垫片30和振膜组件70紧密接触；
然后将第二弹簧82装设于第二弹簧安装槽64内后将PCB板40装设于外壳10的安装腔11内，第二弹簧82的两端分别电连接PCB板40和接触电极83，最后将外壳10的上端周缘向内弯曲形成卷曲部95，最后将外壳10的上端周缘向内弯曲形成卷曲部95，使得PCB板40、导电件80、背极板20、绝缘环形垫片30和振膜组件70固定于外壳10内。
接下来大致简述下工作原理：由一个固定电极板（背极板20）和一个活动电极板(振膜组件70)及绝缘环形垫片30构成一个以空气为介质的平板电容器，而且是一个可变电容器。对驻极体材料充电建立起内电场。由静电学可知，对于平板电容器有如下的关系式：V=Q/C；C=ε•S/d（其中V：电压；Q：电荷量；C：静电容量；ε：介电系数；S：电极的面积；d：电极之间的距离）。当振膜组件70受到声音信号91的作用时，振膜组件70产生振动，从而改变了振膜组件70与背极板20之间的距离，产生了一个Δd的变化。由公式可知，Δd变化产生了一个ΔC的变化，因为充电电荷是固定不变的，所以ΔC的变化又产生了一个ΔV的变化。这样初步完成了一个由声音信号91到电信号92的转换。
由于可变电容容抗很高，转换的电信号92无法直接传送到后端PCB板40上的电路使用，因此，初步得到的电信号92经过接导电件80（导电胶包括有分体设置的第一弹簧81、第二弹簧82和接触电极83）传导到PCB板40上ASIC放大器 41的信号输入端口，经过ASIC放大器 41内部集成的信号放大模块411和滤波模块412处理后，然后通过PCB板40的输出端401输出已经被放大了的干净且有用的电信号92，供客户端下一级放大电路使用。
本发明设计要点在于，其主要是利用ASIC放大器代替了现有的场效应管，有效降低噪声系数，保证有效声音的正常传送，尤其是，通过ASIC放大器采用COB工艺邦定在PCB板上，确保ASIC放大器在使用过程中的稳定性和可靠性，而且，工艺流程简便和制程效率较高，加工成本较低；
其次是，通过导电件的具体设计，在背极板和PCB板之间釆取弹性连接，一方面保证两者之间安装牢固，另一方面避免了使用导线对电信号的衰减与干扰，减小接触电阻，有效提高信号输出效能；
以及，整体结构设计巧妙合理，各零件之间组装方便和牢固，确保了整体的运行的可靠性和稳定性。
以上所述，仅是本发明较佳实施例而已，并非对本发明的技术范围作任何限制，故凡是依据本发明的技术实质对以上实施例所作的任何细微修改、等同变化与修饰，均仍属于本发明技术方案的范围内。

Claims (10)

  1. 一种噪声系数较小的驻极体电容传声器，其特征在于：包括有外壳和安装于外壳内的驻极体式可变电容器、ASIC放大器，其中，ASIC放大器是装设于一PCB板上，在PCB板上设置有输出端；所述驻极体式可变电容器电连接于ASIC放大器，ASIC放大器电连接于PCB板上的输出端。
  2. 根据权利要求1所述的噪声系数较小的驻极体电容传声器，其特征在于：所述ASIC放大器为邦定于PCB板上的集成芯片。
  3. 根据权利要求1所述的噪声系数较小的驻极体电容传声器，其特征在于：所述驻极体式可变电容器通过导电件电连接于ASIC放大器，所述导电件装设于外壳内，所述导电件包括分体设置的第一弹簧、第二弹簧和接触电极，第一弹簧的两端分别连接驻极体式可变电容器和接触电极，所述第二弹簧的两端分别连接PCB板和接触电极，且，ASIC放大器和第二弹簧电性连接。
  4. 根据权利要求1所述的噪声系数较小的驻极体电容传声器，其特征在于：所述驻极体式可变电容器包括背极板、绝缘环形垫片和可上下振动的振膜组件，所述背极板上具有驻极体层；所述外壳的内部具有一端开口的安装腔，所述振膜组件、绝缘环形垫片及背极板均自开口处装入安装腔内，所述PCB板装设于安装腔内且遮覆于开口处；所述绝缘环形垫片夹设于振膜组件和背极板之间以将振膜组件和背极板隔开形成用于收集声音的音腔。
  5. 根据权利要求4所述的噪声系数较小的驻极体电容传声器，其特征在于：还包括有装设于安装腔内的背极座，所述背极座设置于PCB板与绝缘环形垫片之间，所述背极座具有背极板安装位，所述背极板装设于背极板安装位，所述绝缘环形垫片被压设于背极座、振膜组件之间。
  6. 根据权利要求5所述的噪声系数较小的驻极体电容传声器，其特征在于：所述背极板设置有第一出音孔，所述背极座设置有第二出音孔，所述第一出音孔、第二出音孔相贯通，且，所述第一出音孔和/或第二出音孔设置有阻尼片。
  7. 根据权利要求1所述的噪声系数较小的驻极体电容传声器，其特征在于：所述PCB板还设置有电荷泵和稳压器，所述驻极体式可变电容器的一端分别电连接电荷泵的一端和稳压器的一端，电荷泵的一端和稳压器的一端均接地，稳压器的一端还通过第一电容接地，电荷泵的另一端连接稳压器，稳压器的另一端连接ASIC放大器，PCB板上的输出端和驻极体式可变电容器的另一端均接地；所述PCB板的输出端还电连接有第二电容、电阻、运算放大器。
  8. 一种如权利要求1所述的噪声系数较小的驻极体电容传声器的制作方法，其特征在于：包括有如下步骤：
    （1）准备步骤：准备外壳、驻极体式可变电容器、ASIC放大器，其中，ASIC放大器是采用COB工艺邦定在PCB板上；
    （2）组装步骤：先将驻极体式可变电容器装入外壳内，再将ASIC放大器连同PCB板一起装入外壳内，并将ASIC放大器、驻极体式可变电容器形成电性连接。
  9. 根据权利要求8所述的噪声系数较小的驻极体电容传声器的制作方法，其特征在于：所述准备步骤中，还准备背极座，所述背极座具有背极板安装位，所述驻极体式可变电容器包括背极板、绝缘环形垫片和可上下振动的振膜组件，所述外壳具有一端开口的安装腔；
    所述组装步骤中，在外壳的安装腔内依次安装振膜组件、绝缘环形垫片和背极板，所述背极板对应背极板安装位形成定位，接着将PCB板装设于安装腔内且PCB板遮覆于开口处。
  10. 根据权利要求9所述的噪声系数较小的驻极体电容传声器的制作方法，其特征在于：所述驻极体式可变电容器通过导电件电连接于ASIC放大器，所述导电件装设于外壳内，所述导电件包括分体设置的第一弹簧、第二弹簧和接触电极；组装时，将第一弹簧的一端与接触电极连接，将第二弹簧的一端与接触电极连接；
    在组装步骤中，先将接触电极装设于第二弹簧安装槽内且伸入第一弹簧安装槽内，将所述第一弹簧装设于背极座的第一弹簧安装槽内，第一弹簧的一端连接接触电极，接着将背极座、接触电极和第一弹簧共同装设于外壳的安装腔内，所述背极板对应背极板安装位形成定位，第一弹簧的另一端连接背极板并将背极板往下压，使得背极板、绝缘环形垫片和振膜组件紧密接触；
    然后将第二弹簧装设于第二弹簧安装槽内后将PCB板装设于外壳的安装腔内，第二弹簧的两端分别电连接PCB板和接触电极，最后将外壳的上端周缘向内弯曲形成卷曲部，最后将外壳的上端周缘向内弯曲形成卷曲部，使得PCB板、导电件、背极板、绝缘环形垫片和振膜组件固定于外壳内。
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