WO2020149362A1 - Produit durci et element d'affichage electroluminescent organique - Google Patents
Produit durci et element d'affichage electroluminescent organique Download PDFInfo
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- WO2020149362A1 WO2020149362A1 PCT/JP2020/001259 JP2020001259W WO2020149362A1 WO 2020149362 A1 WO2020149362 A1 WO 2020149362A1 JP 2020001259 W JP2020001259 W JP 2020001259W WO 2020149362 A1 WO2020149362 A1 WO 2020149362A1
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- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- 229910000288 alkali metal carbonate Inorganic materials 0.000 description 1
- 150000008041 alkali metal carbonates Chemical class 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000005349 anion exchange Methods 0.000 description 1
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Natural products C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 1
- 150000001454 anthracenes Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- NKWPZUCBCARRDP-UHFFFAOYSA-L calcium bicarbonate Chemical compound [Ca+2].OC([O-])=O.OC([O-])=O NKWPZUCBCARRDP-UHFFFAOYSA-L 0.000 description 1
- 229910000020 calcium bicarbonate Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 150000001934 cyclohexanes Chemical class 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- PESYEWKSBIWTAK-UHFFFAOYSA-N cyclopenta-1,3-diene;titanium(2+) Chemical class [Ti+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 PESYEWKSBIWTAK-UHFFFAOYSA-N 0.000 description 1
- ZWLIYXJBOIDXLL-UHFFFAOYSA-N decanedihydrazide Chemical compound NNC(=O)CCCCCCCCC(=O)NN ZWLIYXJBOIDXLL-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- URQUNWYOBNUYJQ-UHFFFAOYSA-N diazonaphthoquinone Chemical compound C1=CC=C2C(=O)C(=[N]=[N])C=CC2=C1 URQUNWYOBNUYJQ-UHFFFAOYSA-N 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- ULHAZGTYRWYHBZ-UHFFFAOYSA-N fluoroform;triphenylsulfanium Chemical compound FC(F)F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 ULHAZGTYRWYHBZ-UHFFFAOYSA-N 0.000 description 1
- 125000001207 fluorophenyl group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
- 229940083094 guanine derivative acting on arteriolar smooth muscle Drugs 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000001976 improved effect Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- 150000003458 sulfonic acid derivatives Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C08L23/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
Definitions
- the present invention relates to a cured product that can be used for a sealing wall formed around a laminate having an organic light emitting material layer to suppress deterioration of performance of an in-plane sealant for an organic EL display element.
- the present invention also relates to an organic EL display device having the cured product.
- a resin composition for organic EL display element encapsulation is applied to a non-alkali glass having a length of 200 mm, a width of 200 mm, and a thickness of 1 mm so as to have a thickness of 10 ⁇ m. Then, irradiation with ultraviolet rays having a wavelength of 365 nm and an integrated light amount of 3000 mJ/cm 2 and/or heating at 100° C. for 30 minutes is performed to obtain a cured product of the resin composition for organic EL display element encapsulation on non-alkali glass. Form. The alkali-free glass on which the cured product has been formed is immersed in 10 g of the resin composition 1, 2 or 3 at 20° C.
- the preferable lower limit of the content of the polyolefin in the total 100 parts by weight of the polyolefin and the curable resin described below is 10 parts by weight, and the preferable upper limit is 80 parts by weight.
- the content of the polyolefin is 10 parts by weight or more, the obtained resin composition for organic EL display element encapsulation becomes more excellent in the moisture permeability of the cured product.
- the content of the polyolefin is 80 parts by weight or less, the obtained resin composition for organic EL display element encapsulation becomes more excellent in coating property and adhesiveness.
- the more preferable lower limit of the content of the polyolefin is 20 parts by weight, and the more preferable upper limit thereof is 70 parts by weight.
- Examples of the (meth)acrylic compound include isobornyl (meth)acrylate, adamantyl (meth)acrylate, methylcyclohexyl (meth)acrylate, norbornylmethyl (meth)acrylate, and dicyclopenta(meth)acrylate.
- Nyl dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, cyclodecyl (meth)acrylate, 4-t-butylcyclohexyl (meth)acrylate, trimethylcyclohexyl (meth)acrylate, etc.
- the solubility at 20° C. in the liquid resin composition 1 the solubility at 20° C.
- the content of the tackifying resin is preferably 0.01 parts by weight and 100 parts by weight with respect to 100 parts by weight of the total of the polyolefin and the curable resin.
- the more preferable lower limit of the content of the tackifying resin is 0.2 parts by weight, and the more preferable upper limit thereof is 20 parts by weight.
- photoradical polymerization initiator examples include benzophenone compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, oxime ester compounds, benzoin ether compounds, thioxanthone compounds, and the like.
- Specific examples of the photoradical polymerization initiator include 1-hydroxycyclohexyl phenyl ketone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone, 1,2-(dimethylamino).
- sulfonium salt examples include triphenylsulfonium tetrafluoroborate and triphenylsulfonium hexafluoroantimonate.
- the content of the polymerization initiator has a preferable lower limit of 0.05 parts by weight and a preferable upper limit of 10 parts by weight with respect to 100 parts by weight of the total of the polyolefin and the curable resin.
- the content of the polymerization initiator is 0.05 parts by weight or more, the obtained resin composition for organic EL display element encapsulation has more excellent curability.
- the content of the polymerization initiator is 10 parts by weight or less, the curing reaction of the obtained resin composition for organic EL display element encapsulation does not become too fast, the workability becomes excellent, and the cured product becomes more uniform. It can be anything.
- the more preferable lower limit of the content of the polymerization initiator is 1 part by weight, and the more preferable upper limit thereof is 3 parts by weight.
- Examples of the surface modifier include silicone-based, acrylic-based, and fluorine-based agents.
- Examples of commercially available surface modifiers include, for example, a surface modifier manufactured by Big Chemie Japan, a surface modifier manufactured by Kusumoto Kasei, and a surface modifier manufactured by AGC Seimi Chemical. Can be mentioned.
- Examples of the surface modifier manufactured by Big Chemie Japan include BYK-300, BYK-302, and BYK-331.
- Examples of the surface modifier manufactured by Kusumoto Chemicals include UVX-272.
- Examples of the surface modifier manufactured by AGC Seimi Chemical Co., Ltd. include Surflon S-611.
- the resin composition for encapsulating an organic EL display element according to the present invention is, as necessary, a curing retarder, a reinforcing agent, a softening agent, a plasticizer, a viscosity modifier, and an ultraviolet absorbing agent within a range that does not impair the object of the present invention.
- a curing retarder e.g., a curing retarder, a reinforcing agent, a softening agent, a plasticizer, a viscosity modifier, and an ultraviolet absorbing agent within a range that does not impair the object of the present invention.
- Various known additives such as agents and antioxidants may be contained.
- the organic EL display element encapsulating resin compositions obtained in Examples 1 to 5 and Comparative Examples 1 to 3 were cured by heating at 100° C. for 30 minutes.
- the organic EL display element encapsulating resin compositions obtained in Examples 6 to 8 and Comparative Examples 4 to 6 were cured by irradiating them with ultraviolet rays having a wavelength of 365 nm at 3000 mJ/cm 2 with a UV-LED irradiation device. ..
- the alkali-free glass on which the cured product was formed was immersed in 10 g of the resin composition 1, 2, or 3 at 20° C. for 1 minute.
- the alkali-free glass was taken out from the resin composition 1, 2, or 3 and immersed in 10 g of methanol at 20° C.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Materials Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
L'invention concerne un produit durci permettant de supprimer la détérioration des capacités d'un produit de scellement dans le plan pour un élément d'affichage électroluminescent organique, grâce à l'utilisation d'une paroi de scellement formée à la circonférence d'un produit stratifié possédant une couche de matériau luminescent organique. L'invention concerne également un élément d'affichage électroluminescent organique possédant ledit produit durci. Ce produit durci de composition de résine pour scellement d'un élément d'affichage électroluminescent organique contient une polyoléfine, une résine durcissable, et un initiateur de polymérisation et/ou un agent thermodurcissant. Ce produit durci se caractérise en ce que: le degré de solubilité à 20℃ par rapport à une composition (1) de résine liquide constituée de 70 parties en poids d'un composé époxy représenté par la formule générale (1), 30 parties en poids d'un composé oxétane représenté par la formule générale (2), 1,5 parties enpoids de diméthyl phényl (4-méthoxy benzyl) ammonium hexafluoroantimonate, et 0,2 partie en poids de benzylamine; le degré de solubilité à 20℃ par rapport à une composition (2) de résine liquide constituée de 70 parties en poids d'un composé époxy représenté par la formule générale (3), 30 parties en poids d'un composé oxétane représenté par la formule générale (2), 1 partie en poids de triphényl sulfonium trifluorométhane sulfonate, 0,5 partie en poids de 4-isopropyl-4'-méthyl diphényl iodium Tetrakis (pentafluorophényl) borate, et 0,2 partie en poids de benzylamine; et le degré de solubilité à 20℃ par rapport à une composition (3) de résine liquide constituée de 70 parties en poids d'un composé époxy représenté par la formule générale (3), 20 parties en poids d'un composé oxétane représenté par la formule générale (2), 10 parties en poids de diéthylène glycol diglycide éther, 1,5 parties en poids de diméthyl phényl (4- méthoxy benzyl) ammonium hexafluoroantimonate, et 0,2 partie en poids de benzylamine, sont tous les trois inférieurs ou égaux à 1% en poids.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020217012036A KR20210116423A (ko) | 2019-01-18 | 2020-01-16 | 경화물 및 유기 el 표시 소자 |
JP2020512073A JPWO2020149362A1 (ja) | 2019-01-18 | 2020-01-16 | 硬化物及び有機el表示素子 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2019007083 | 2019-01-18 | ||
JP2019-007083 | 2019-01-18 |
Publications (1)
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WO2020149362A1 true WO2020149362A1 (fr) | 2020-07-23 |
Family
ID=71613150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2020/001259 WO2020149362A1 (fr) | 2019-01-18 | 2020-01-16 | Produit durci et element d'affichage electroluminescent organique |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2020149362A1 (fr) |
KR (1) | KR20210116423A (fr) |
WO (1) | WO2020149362A1 (fr) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014017524A1 (fr) * | 2012-07-26 | 2014-01-30 | 電気化学工業株式会社 | Composition de résine |
JP2016066471A (ja) * | 2014-09-24 | 2016-04-28 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス表示素子封止用樹脂組成物、有機エレクトロルミネッセンス表示素子封止用樹脂シート、及び、有機エレクトロルミネッセンス表示素子 |
JP2018513891A (ja) * | 2015-03-24 | 2018-05-31 | エルジー・ケム・リミテッド | 接着剤組成物 |
JP2018513889A (ja) * | 2015-03-24 | 2018-05-31 | エルジー・ケム・リミテッド | 接着剤組成物 |
WO2018151002A1 (fr) * | 2017-02-14 | 2018-08-23 | 積水化学工業株式会社 | Composition de résine photodurcissable, agent d'étanchéité pour éléments d'affichage électroluminescents organiques, élément d'affichage électroluminescent organique, agent d'étanchéité pour dispositifs à points quantiques et dispositif à points quantiques |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6098091B2 (ja) | 2012-09-26 | 2017-03-22 | 凸版印刷株式会社 | 有機エレクトロルミネッセンスパネルの製造方法 |
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2020
- 2020-01-16 WO PCT/JP2020/001259 patent/WO2020149362A1/fr active Application Filing
- 2020-01-16 JP JP2020512073A patent/JPWO2020149362A1/ja active Pending
- 2020-01-16 KR KR1020217012036A patent/KR20210116423A/ko unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014017524A1 (fr) * | 2012-07-26 | 2014-01-30 | 電気化学工業株式会社 | Composition de résine |
JP2016066471A (ja) * | 2014-09-24 | 2016-04-28 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス表示素子封止用樹脂組成物、有機エレクトロルミネッセンス表示素子封止用樹脂シート、及び、有機エレクトロルミネッセンス表示素子 |
JP2018513891A (ja) * | 2015-03-24 | 2018-05-31 | エルジー・ケム・リミテッド | 接着剤組成物 |
JP2018513889A (ja) * | 2015-03-24 | 2018-05-31 | エルジー・ケム・リミテッド | 接着剤組成物 |
WO2018151002A1 (fr) * | 2017-02-14 | 2018-08-23 | 積水化学工業株式会社 | Composition de résine photodurcissable, agent d'étanchéité pour éléments d'affichage électroluminescents organiques, élément d'affichage électroluminescent organique, agent d'étanchéité pour dispositifs à points quantiques et dispositif à points quantiques |
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KR20210116423A (ko) | 2021-09-27 |
JPWO2020149362A1 (ja) | 2021-11-25 |
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