WO2020140367A1 - 一种锡膏激光诱导前向转移设备与方法 - Google Patents

一种锡膏激光诱导前向转移设备与方法 Download PDF

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Publication number
WO2020140367A1
WO2020140367A1 PCT/CN2019/088109 CN2019088109W WO2020140367A1 WO 2020140367 A1 WO2020140367 A1 WO 2020140367A1 CN 2019088109 W CN2019088109 W CN 2019088109W WO 2020140367 A1 WO2020140367 A1 WO 2020140367A1
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Prior art keywords
solder paste
laser
receiving substrate
substrate
optical path
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Ceased
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PCT/CN2019/088109
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English (en)
French (fr)
Inventor
张宪民
单译琳
李凯
汤传刚
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South China University of Technology SCUT
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South China University of Technology SCUT
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Priority to JP2020503888A priority Critical patent/JP2021512481A/ja
Publication of WO2020140367A1 publication Critical patent/WO2020140367A1/zh
Anticipated expiration legal-status Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, electron beams [EB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B15/00—Systems controlled by a computer
    • G05B15/02—Systems controlled by a computer electric
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Definitions

  • the invention is a process and equipment for realizing solder paste transfer by using laser induced forward transfer technology (LIFT), which belongs to the field of laser application and solder paste printing technology, and particularly relates to a solder paste laser-induced forward transfer Equipment and methods.
  • LIFT laser induced forward transfer technology
  • SMT Surface Mount Technology
  • the solder paste printing is the first step in the entire SMT process.
  • the current solder paste printing technology mainly adopts the method of screen printing, and screen printing often needs to make different screens for different PCB boards. The relatively high cost and long cycle time cannot meet the needs of small-scale rapid production.
  • LIFT technology Laser induced forward transfer technology is a material deposition technology.
  • LIFT technology is to apply the target material to the transparent substrate in the form of a film in advance, and keep the target material film face down to maintain a certain distance from the receiving substrate, let the laser irradiate the target material through the transparent substrate, and cause localized areas Material transfer within. Therefore, the LIFT technology is a non-contact, high-precision micro-transfer technology that does not require a mask.
  • the LIFT technology does not require mask preparation, once applied to solder paste printing, it can greatly shorten the production cycle in small-scale production and reduce production costs, especially suitable for laboratory research and industrial small-scale trial production.
  • the use of laser galvanometer makes the beam can be scanned at a speed far exceeding the mechanical movement, thus meeting the production speed requirements in large-scale production.
  • the purpose of the present invention is to overcome the above-mentioned shortcomings and deficiencies of the prior art, and to provide a solder paste laser-induced forward transfer equipment and method.
  • a solder paste laser-induced forward transfer device includes a laser unit and a computer control system 14, characterized in that it also includes a solder paste transfer module; the computer control system 14 controls the laser beam exit of the laser unit and the solder paste transfer module movement;
  • the solder paste transfer module includes a transparent substrate 8, a fixture 10, a Z-axis lifting table 11, a receiving substrate 12, and an XYZ-axis moving platform 13;
  • the lower surface of the transparent substrate 8 is a concave surface for accommodating the solder paste film 9;
  • the receiving substrate 12 and the Z-axis lifting table 11 are placed on the XYZ-axis moving platform 13 to adjust the relative positions of the receiving substrate 12 and the laser beam spot;
  • the jig 10 is installed on the Z-axis lifting table 11; the concave surface of the transparent substrate 8 faces downward and is placed in parallel above the receiving substrate 12, and the jig 10 clamps the edge of the transparent substrate 8 and is lifted by the Z axis
  • the stage 11 carries its vertical lifting motion above the receiving substrate 12 to adjust the distance between the transparent substrate 8 and the receiving substrate 12.
  • the laser unit includes a laser 1, a beam shaping module, and an optical path adjustment module that are sequentially connected by an optical path;
  • the laser 1, the beam shaping module, the optical path adjustment module, and the solder paste transfer module are respectively connected to the computer control system 14.
  • the beam shaping module includes a beam expanding lens 2, an aperture 3, a flat-top beam shaper 4, and a spatial light modulator 5 connected in sequence to the optical path;
  • the optical path adjustment module includes a two-dimensional galvanometer 6 and an f- ⁇ lens 7 that are sequentially connected by an optical path.
  • the depth of the concave surface of the solder paste containing film 9 is 20 ⁇ m to 150 ⁇ m.
  • the receiving substrate 12 is a PCB board.
  • a solder paste laser-induced forward transfer method which includes the following steps:
  • Step 1 Import the circuit drawing of the receiving substrate 12 to be printed into the computer control system 14, the computer control system 14 plans the scanning route and scanning speed of the laser 15 according to the position of the pad on the receiving substrate 12 to be printed, and according to each The shape and size of the pad select laser parameters and beam shaping module parameters;
  • Step 2 According to the thickness of the solder paste required in actual production, select the transparent substrate 8 with the required concave depth, apply the solder paste to the entire concave surface by scraping, and form a solder paste film 9 in the concave surface;
  • the paste film 9 faces downward, and then the transparent substrate 8 is fixed on the jig 10 connected to the Z-axis lifting table 11 to adjust the distance between the transparent substrate 8 and the receiving substrate 12;
  • Step 3 Before each laser pulse is emitted, the computer control system 14 controls the rotation of the two-dimensional galvanometer 6 according to the pre-planned route to change the laser beam path;
  • Step 4 After the beam from the laser 1 is shaped by the beam shaping module, it enters the optical path adjustment module composed of the two-dimensional galvanometer 6 and the f- ⁇ lens 7, and after passing through the two-dimensional galvanometer 6 to change the direction of the optical path, it finally passes through the f- Theta lens 7 is then focused on the solder paste film 9 described in step 2; the laser 15 passes through the transparent substrate 8 and is absorbed by the solder paste film 9, causing partial vaporization of the irradiated part, forming bubbles 16 inside the solder paste film 9, and following The continuous expansion of the air bubble 16 will push the surrounding unvaporized portion toward the receiving substrate 12; and form a stable bridge structure 17 between the transparent substrate 8 and the receiving substrate 12;
  • Step 5 Repeat Step 3 and Step 4 until a stable bridge structure 17 is formed between all the pads on the receiving substrate 12 and the transparent substrate 8; then, the computer control system 14 controls the Z-axis lifting table 11 to rise, The transparent substrate 8 is vertically separated from the receiving substrate 12, so that all the bridge structures 17 are broken, leaving dotted solder paste 18, and then the entire receiving substrate 12 is printed.
  • the present invention has the following advantages and effects:
  • the solder paste transfer module of the present invention includes a transparent substrate 8, a fixture 10, a Z-axis lifting table 11, a receiving substrate 12, and an XYZ-axis moving platform 13; a concave surface for accommodating the solder paste film 9 is formed on the lower surface of the transparent substrate 8 ; Place the receiving substrate 12 and the Z-axis lifting table 11 on the XYZ-axis moving platform 13 to adjust the relative position of the receiving substrate 12 and the laser beam spot; when working, install the fixture 10 on the Z-axis lifting table 11
  • the concave surface of the transparent substrate 8 faces downwards and is placed in parallel above the receiving substrate 12, the clamp 10 clamps the edge of the transparent substrate 8, and is carried by the Z-axis lifting table 11 to vertically move above the receiving substrate 12, To adjust the distance between the transparent substrate 8 and the receiving substrate 12.
  • the solder paste film 9 on the transparent substrate 8 is transferred to the receiving substrate according to the planned path, and the precisely controlled local transfer and printing of
  • the present invention cleverly adopts a concave surface for accommodating the solder paste film 9 on the lower surface of the transparent substrate 8, and places the receiving substrate 12 and the Z-axis lifting table 11 on the XYZ-axis moving platform 13 to adjust the receiving substrate
  • the technical method of the invention is simple and easy to implement, effectively simplifies the production process, and greatly shortens the production cycle and reduces the production cost.
  • FIG. 1 is a schematic structural diagram of a solder paste laser-induced forward transfer device of the present invention.
  • FIG. 2 is a schematic structural diagram of the solder paste transfer module in FIG. 1.
  • 3 is a schematic illustration of the principle of the laser-induced forward transfer process of the solder paste of the present invention.
  • Fig. 4 is a photograph of a spot solder paste transferred by the present invention under a confocal microscope.
  • the invention discloses a solder paste laser-induced forward transfer device, which includes a laser unit and a computer control system 14, characterized in that it further includes a solder paste transfer module; the computer control system 14 controls the laser beam exit of the laser unit and tin The movement of the paste transfer module;
  • the solder paste transfer module includes a transparent substrate 8, a fixture 10, a Z-axis lifting table 11, a receiving substrate 12, and an XYZ-axis moving platform 13;
  • the lower surface of the transparent substrate 8 is a concave surface for accommodating the solder paste film 9; the transparent substrate 8 is quartz glass or other transparent objects.
  • the receiving substrate 12 and the Z-axis lifting table 11 are placed on the XYZ-axis moving platform 13 to adjust the relative positions of the receiving substrate 12 and the laser beam spot;
  • the jig 10 is installed on the Z-axis lifting table 11; the concave surface of the transparent substrate 8 faces downward and is placed in parallel above the receiving substrate 12, and the jig 10 clamps the edge of the transparent substrate 8 and is lifted by the Z axis
  • the stage 11 carries its vertical lifting motion above the receiving substrate 12 to adjust the distance between the transparent substrate 8 and the receiving substrate 12.
  • the laser unit includes a laser 1, a beam shaping module, and an optical path adjustment module that are sequentially connected by an optical path; the laser 1, the beam shaping module, the optical path adjustment module, and the solder paste transfer module are respectively connected to the computer control system 14.
  • the beam shaping module includes a beam-expanding lens 2, an aperture 3, a flat-top beam shaper 4, and a spatial light modulator 5 that are sequentially connected by an optical path; after the beam passes the beam-expanding lens 2, the aperture 3, the impurities of the spot can be removed, and the flat-top beam After the shaper 4, the spot of the original Gaussian energy distribution can be changed into a uniform circular distribution or a square distribution. Then through the spatial light modulator 5, under the control of the computer control system 14, the spatial light modulator 5 will convert the light spot into the shape and size required by the user.
  • the optical path adjustment module includes a two-dimensional galvanometer 6 and an f- ⁇ lens 7 that are sequentially connected by an optical path.
  • the computer control system 14 realizes the movement of the position of the light beam in the XY plane by controlling the two-dimensional galvanometer 6, and finally focuses on the target plane through the f- ⁇ lens 7.
  • the f- ⁇ lens 7 has an antireflection coating of 355 nm or 532 nm, a scanning angle of ⁇ 15°, and an effective focal length of 120 mm.
  • the depth of the concave surface of the solder paste containing film 9 is 20 ⁇ m to 150 ⁇ m.
  • the receiving substrate 12 is a PCB board, that is, a PCB board that needs to be printed with solder paste.
  • the solder paste film 9 uses a solder paste of No. 5 to No. 7 powder paste.
  • the particle size of the paste is 15 ⁇ m to 25 ⁇ m.
  • the particle size of the paste is 5 ⁇ m to 15 ⁇ m.
  • the particle size of No. 7 powder is 2 ⁇ m ⁇ 11 ⁇ m.
  • Laser 1 is a pulse laser, the wavelength of the output light source is 355 nm or 532 nm, the pulse width is 10 ns to 50 ns, and the repetition frequency is 10 khz to 100 khz.
  • the specific principle of solder paste transfer using the laser forward transfer method is shown in FIG. 3.
  • the laser light emitted by the laser 1 passes through the beam shaping module and the optical path adjustment module and is irradiated on the solder paste film 9 through the transparent substrate 8.
  • the solder paste is partially vaporized, and bubbles 16 are generated.
  • the bubble 16 continues to expand, the solder paste film 9 will come into contact with the receiving substrate 12 and form a stable bridge structure 17.
  • the bridge structure 17 will continue to rise until the structure breaks, leaving a spot-like solder paste 18 on the receiving substrate 12.
  • Fig. 4 shows an image of a spot-shaped solder paste transferred under the present invention under a confocal microscope.
  • solder paste laser-induced forward transfer method of the present invention can be achieved by the following steps:
  • Step 1 Import the circuit drawing of the receiving substrate 12 to be printed into the computer control system 14, the computer control system 14 plans the scanning route and scanning speed of the laser 15 according to the position of the pad on the receiving substrate 12 to be printed, and according to each The shape and size of the pad select laser parameters and beam shaping module parameters;
  • Step 2 According to the thickness of the solder paste required in actual production, select the transparent substrate 8 with the required concave depth, apply the solder paste to the entire concave surface by scraping, and form a solder paste film 9 in the concave surface; The paste film 9 faces downward, and then the transparent substrate 8 is fixed on the jig 10 connected to the Z-axis lifting table 11 to adjust the distance between the transparent substrate 8 and the receiving substrate 12; after the distance adjustment is completed, the solder paste can be started Transfer.
  • Step 3 Before each laser pulse is emitted, the computer control system 14 controls the rotation of the two-dimensional galvanometer 6 according to the pre-planned route to change the laser beam path; and according to the preset laser parameters and the parameters of the beam shaping module , Adjust the energy distribution of the laser spot;
  • Step 4 After adjusting the parameters, the beam emitted by the laser 1 is shaped by the beam shaping module, and then enters the optical path adjustment module composed of the two-dimensional galvanometer 6 and the f- ⁇ lens 7, and after the two-dimensional galvanometer 6 changes the direction of the optical path Finally, after passing through the f- ⁇ lens 7, it is focused on the solder paste film 9 described in step 2; the laser 15 passes through the transparent substrate 8 and is absorbed by the solder paste film 9, causing partial vaporization of the irradiated part, forming inside the solder paste film 9 The air bubble 16, and as the air bubble 16 continuously expands, it will push the surrounding unvaporized portion toward the receiving substrate 12; and form a stable bridge structure 17 between the transparent substrate 8 and the receiving substrate 12;
  • Step 5 Repeat Step 3 and Step 4 until a stable bridge structure 17 is formed between all the pads on the receiving substrate 12 and the transparent substrate 8; then, the computer control system 14 controls the Z-axis lifting table 11 to rise, The transparent substrate 8 is vertically separated from the receiving substrate 12, so that all the bridge structures 17 are broken, leaving dotted solder paste 18, and then the entire receiving substrate 12 is printed.

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  • Optics & Photonics (AREA)
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  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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Abstract

一种锡膏激光诱导前向转移设备与方法，包括激光器(1)、光束整形模块、光路调节模块、锡膏转移模块以及计算机控制系统(14)，激光器与光束整形模块相连接，紧接着光路调节模块，而锡膏转移模块位于光路调节模块的下方。光束整形模块包括扩束透镜(2)、光圈(3)、平顶光束整形器(4)以及空间光调制器(5)。光路调节模块包括二维振镜(6)和f-θ透镜(7)。锡膏转移模块由透明基片(8)、锡膏薄膜(9)、夹具(10)、Z轴升降台(11)、接收基片(12)、XYZ精密移动平台(13)组成。计算机控制系统由计算机和其他设备的驱动器组成。可以实现无需掩模、非接触式的高精度锡膏转移，能大大缩短生产周期，降低生产成本。

Description

一种锡膏激光诱导前向转移设备与方法 技术领域
本发明是利用激光诱导前向转移技术(Laser induced forward transfer,简称LIFT)来实现锡膏转移的工艺和设备，属于激光应用及锡膏印刷技术领域，尤其涉及一种锡膏激光诱导前向转移设备与方法。
背景技术
SMT(Surface Mount Technology)是一种将无引脚或短引线表面封装元器件，如电阻、电容、晶体管、集成电路等等安装到印刷电路板上，并通过回流焊形成电气联结的电路装连技术。而锡膏印刷则是整个SMT加工过程的第一步。目前的锡膏印刷技术主要是采用丝网印刷的方法，而丝网印刷对于不同的PCB板往往需要制作不同的丝网，相对成本高，周期长，并不能满足小规模快速生产的需求。
激光诱导前向转移技术(LIFT技术)是一种材料沉积技术。LIFT技术是将目标材料事先以薄膜的形式涂抹到透明基片上，并让目标材料薄膜面朝下方与接收基片保持一定距离，让激光透过透明基片照射到目标材料上，并引发局部区域内的材料转移。因此，LIFT技术是一种无需掩模、非接触式的高精度微量转移技术。
由于LIFT技术无需制备掩模，一旦应用于锡膏印刷中，可以大大缩短小规模生产中的生产周期，并降低生产成本，尤其适合于实验室研究以及工业小规模试产。而激光振镜的使用，使得光束能以远超机械运动的速度进行扫描，从而满足大规模生产中对于生产速度的需求。
发明内容
本发明的目的在于克服上述现有技术的缺点和不足，提供一种锡膏激光诱导前向转移设备与方法。
本发明通过下述技术方案实现：
一种锡膏激光诱导前向转移设备，包括激光单元、计算机控制系统14，其特征在于：还包括锡膏转移模块；所述计算机控制系统14控制激光单元的激光束出射以及锡膏转移模块的运动；
所述锡膏转移模块包括透明基片8、夹具10、Z轴升降台11、接收基片12、XYZ轴移动平台13；
所述透明基片8的下表面为用于容纳锡膏薄膜9的凹面；
所述接收基片12和Z轴升降台11放置在XYZ轴移动平台13上，以调整接收基片12与激光束光斑的相对工位；
所述夹具10安装在Z轴升降台11上；透明基片8的凹面朝下，并平行置于接收基片12的上方，所述夹具10夹持透明基片8的边缘，由Z轴升降台11搭载其在接收基片12上方垂直升降运动，以调整透明基片8相对于接收基片12之间的距离。
所述激光单元包括依次光路连接的激光器1、光束整形模块、光路调节模块；
所述激光器1、光束整形模块、光路调节模块、锡膏转移模块分别连接计算机控制系统14。
所述光束整形模块包括依次光路连接的扩束透镜2、光圈3、平顶光束整形器4、空间光调制器5；
所述光路调节模块包括依次光路连接的二维振镜6、f-θ透镜7。
所述容纳锡膏薄膜9的凹面深度为20μm～150μm。
所述接收基片12为PCB板。
一种锡膏激光诱导前向转移方法，其包括如下步骤：
步骤1：将待印刷的接收基片12的电路图纸导入计算机控制系统14，计算机控制系统14根据待印刷接收基片12上焊盘的位置规划激光15的扫描路线、扫描速度，并根据每个焊盘的形状尺寸选择激光参数以及光束整形模块的参数；
步骤2：根据实际生产中所需锡膏的厚度，选择所需凹面深度的透明基片8，利用刮涂的方法将锡膏涂抹在整个凹面内，在凹面内形成锡膏薄膜9；将锡膏薄膜9面朝下方，再将透明基片8固定在Z轴升降台11所连接的夹具10上，调整透明基片8和接收基片12的距离；
步骤3：在每一次激光脉冲发射前，计算机控制系统14根据预先规划好的路线，控制二维振镜6的转动，改变激光光束路径；
步骤4：激光器1发出的光束经过光束整形模块整形后，进入由二维振镜6和f-θ透镜7组成的光路调节模块，经过二维振镜6改变光路的走向后，最终通过f-θ透镜7后聚焦到步骤2所述锡膏薄膜9上方；激光15通过透明基片8，被锡膏薄膜9吸收后，导致照射部位部分汽化，在锡膏薄膜9内部形成气泡16，并且随着气泡16不断的膨胀，会推动周围未汽化部分冲向接收基片12；并在透明基片8和接收基片12之间形成稳定的桥式结构17；
步骤5：重复进行步骤3和步骤4直至接收基片12上所有焊盘和透明基片8之间都形成一个稳定的桥式结构17；之后，计算机控制系统14控制Z轴升降台11上升，使透明基片8垂直离开接收基片12，使所有桥式结构17断裂，留下点状锡膏18，进而整个接收基片12印刷完成。
本发明相对于现有技术，具有如下的优点及效果：
本发明锡膏转移模块包括透明基片8、夹具10、Z轴升降台11、接收基片12、XYZ轴移动平台13；在透明基片8的下表面开设有用于容纳锡膏薄膜9的凹面；将接收基片12和Z轴升降台11放置在XYZ轴移动平台13上，以调整接收基片12与激光束光斑的相对工位；作业时，将夹具10安装在Z轴升降台11上，透明基片8的凹面朝下，并平行置于接收基片12的上方， 夹具10夹持透明基片8的边缘，由Z轴升降台11搭载其在接收基片12上方垂直升降运动，以调整透明基片8相对于接收基片12之间的距离。通过高能量的脉冲激光，在激光及移动平台的协调运动下，将透明基片8上的锡膏薄膜9按照规划路径转移到接收基片上，实现精确控制的锡膏的局部转移和印刷。
本发明巧妙的采用了在透明基片8的下表面开设有用于容纳锡膏薄膜9的凹面，并将接收基片12和Z轴升降台11放置在XYZ轴移动平台13上，以调整接收基片12与激光束光斑的相对工位，结合高能量的脉冲激光，实现无需掩模、非接触式的高精度锡膏转移方案。
本发明技术手段简便易行，有效简化了生产工艺，而且大大缩短生产周期，降低了生产成本。
附图说明
图1是本发明锡膏激光诱导前向转移设备的结构示意图。
图2是图1中锡膏转移模块的结构示意图。
图3是本发明锡膏激光诱导前向转移工艺的原理图解。
图4是采用本发明转移的点状锡膏在共聚焦显微镜下的照片。
具体实施方式
下面结合具体实施例对本发明作进一步具体详细描述。
实施例
如图1-4所示。本发明公开了一种锡膏激光诱导前向转移设备，包括激光单元、计算机控制系统14，其特征在于：还包括锡膏转移模块；所述计算机控制系统14控制激光单元的激光束出射以及锡膏转移模块的运动；
所述锡膏转移模块包括透明基片8、夹具10、Z轴升降台11、接收基片12、XYZ轴移动平台13；
所述透明基片8的下表面为用于容纳锡膏薄膜9的凹面；透明基片8为 石英玻璃或者其他透明物体。
所述接收基片12和Z轴升降台11放置在XYZ轴移动平台13上，以调整接收基片12与激光束光斑的相对工位；
所述夹具10安装在Z轴升降台11上；透明基片8的凹面朝下，并平行置于接收基片12的上方，所述夹具10夹持透明基片8的边缘，由Z轴升降台11搭载其在接收基片12上方垂直升降运动，以调整透明基片8相对于接收基片12之间的距离。
所述激光单元包括依次光路连接的激光器1、光束整形模块、光路调节模块；激光器1、光束整形模块、光路调节模块、锡膏转移模块分别连接计算机控制系统14。光束整形模块包括依次光路连接的扩束透镜2、光圈3、平顶光束整形器4、空间光调制器5；光束经过扩束透镜2、光圈3后，可以去除光斑的杂质，经过平顶光束整形器4后可以使原本高斯能量分布的光斑变成均匀的圆形分布或是方形分布。然后经过空间光调制器5，在计算机控制系统14的操控下，空间光调制器5会将光斑转换成用户需要的形状尺寸。
所述光路调节模块包括依次光路连接的二维振镜6、f-θ透镜7。计算机控制系统14通过控制二维振镜6来实现光束在XY平面内位置的移动，并最终通过f-θ透镜7聚焦在目标平面上。f-θ透镜7有355nm增透膜或是532nm，扫描角±15°，有效焦距120mm。
所述容纳锡膏薄膜9的凹面深度为20μm～150μm。
所述接收基片12为PCB板，即需要印刷锡膏的PCB板。
锡膏薄膜9采用锡膏为5～7号粉锡膏，当为5号粉时锡膏的颗粒尺寸为15μm～25μm，当为6号粉时锡膏的颗粒尺寸为5μm～15μm，当为7号粉时颗粒尺寸为2μm～11μm。
激光器1为脉冲激光器，输出光源的波长为355nm或532nm，脉冲宽度为10ns～50ns，重复频率10khz～100khz。
本发明利用激光前向转移方法，进行锡膏转移的具体原理如图3所示，激光器1发出的激光通过光束整形模块以及光路调节模块后透过透明基片8 照射在锡膏薄膜9上，使得锡膏部分气化，产生气泡16。随着气泡16持续膨胀，锡膏薄膜9会和接收基片12相接触，并形成稳定的桥式结构17。当透明基片8垂直离开接收基片12时，桥式结构17会不断拉升，直到结构断裂，并在接收基片12上留下点状锡膏18。
图4显示了运用本发明所转移的点状锡膏在共聚焦显微镜下的图像。
本发明锡膏激光诱导前向转移方法，可通过如下步骤实现：
步骤1：将待印刷的接收基片12的电路图纸导入计算机控制系统14，计算机控制系统14根据待印刷接收基片12上焊盘的位置规划激光15的扫描路线、扫描速度，并根据每个焊盘的形状尺寸选择激光参数以及光束整形模块的参数；
步骤2：根据实际生产中所需锡膏的厚度，选择所需凹面深度的透明基片8，利用刮涂的方法将锡膏涂抹在整个凹面内，在凹面内形成锡膏薄膜9；将锡膏薄膜9面朝下方，再将透明基片8固定在Z轴升降台11所连接的夹具10上，调整透明基片8和接收基片12的距离；距离调整完成后，便可以开始锡膏的转移。
步骤3：在每一次激光脉冲发射前，计算机控制系统14根据预先规划好的路线，控制二维振镜6的转动，改变激光光束路径；并且按照预设的激光参数，以及光束整形模块的参数，调整激光光斑的能量分布；
步骤4：调整好参数后，激光器1发出的光束经过光束整形模块整形后，进入由二维振镜6和f-θ透镜7组成的光路调节模块，经过二维振镜6改变光路的走向后，最终通过f-θ透镜7后聚焦到步骤2所述锡膏薄膜9上方；激光15通过透明基片8，被锡膏薄膜9吸收后，导致照射部位部分汽化，在锡膏薄膜9内部形成气泡16，并且随着气泡16不断的膨胀，会推动周围未汽化部分冲向接收基片12；并在透明基片8和接收基片12之间形成稳定的桥式结构17；
步骤5：重复进行步骤3和步骤4直至接收基片12上所有焊盘和透明基 片8之间都形成一个稳定的桥式结构17；之后，计算机控制系统14控制Z轴升降台11上升，使透明基片8垂直离开接收基片12，使所有桥式结构17断裂，留下点状锡膏18，进而整个接收基片12印刷完成。
如上所述，便可较好地实现本发明。
本发明的实施方式并不受上述实施例的限制，其他任何未背离本发明的精神实质与原理下所作的改变、修饰、替代、组合、简化，均应为等效的置换方式，都包含在本发明的保护范围之内。

Claims (6)

  1. 一种锡膏激光诱导前向转移设备，包括激光单元、计算机控制系统(14)，其特征在于：还包括锡膏转移模块；所述计算机控制系统(14)控制激光单元的激光束出射以及锡膏转移模块的运动；
    所述锡膏转移模块包括透明基片(8)、夹具(10)、Z轴升降台(11)、接收基片(12)、XYZ轴移动平台(13)；
    所述透明基片(8)的下表面为用于容纳锡膏薄膜(9)的凹面；
    所述接收基片(12)和Z轴升降台(11)放置在XYZ轴移动平台(13)上，以调整接收基片(12)与激光束光斑的相对工位；
    所述夹具(10)安装在Z轴升降台(11)上；透明基片(8)的凹面朝下，并平行置于接收基片(12)的上方，所述夹具(10)夹持透明基片(8)的边缘，由Z轴升降台(11)搭载其在接收基片(12)上方垂直升降运动，以调整透明基片(8)相对于接收基片(12)之间的距离。
  2. 根据权利要求1所述锡膏激光诱导前向转移设备，其特征在于：所述激光单元包括依次光路连接的激光器(1)、光束整形模块、光路调节模块；
    所述激光器(1)、光束整形模块、光路调节模块、锡膏转移模块分别连接计算机控制系统(14)。
  3. 根据权利要求2所述锡膏激光诱导前向转移设备，其特征在于：所述光束整形模块包括依次光路连接的扩束透镜(2)、光圈(3)、平顶光束整形器(4)、空间光调制器(5)；
    所述光路调节模块包括依次光路连接的二维振镜(6)、f-θ透镜(7)。
  4. 根据权利要求3所述锡膏激光诱导前向转移设备，其特征在于：所述容纳锡膏薄膜(9)的凹面深度为20μm～150μm。
  5. 根据权利要求4所述锡膏激光诱导前向转移设备，其特征在于：所述接收基片(12)为PCB板。
  6. 一种锡膏激光诱导前向转移方法，其特征在于采用权利要求5所述锡膏激光诱导前向转移设备实现，其包括如下步骤：
    步骤(1)：将待印刷的接收基片(12)的电路图纸导入计算机控制系统(14)，计算机控制系统(14)根据待印刷接收基片(12)上焊盘的位置规划激光(15)的扫描路线、扫描速度，并根据每个焊盘的形状尺寸选择激光参数以及光束整形模块的参数；
    步骤(2)：根据实际生产中所需锡膏的厚度，选择所需凹面深度的透明基片(8)，利用刮涂的方法将锡膏涂抹在整个凹面内，在凹面内形成锡膏薄膜(9)；将锡膏薄膜(9)面朝下方，再将透明基片(8)固定在Z轴升降台(11)所连接的夹具(10)上，调整透明基片(8)和接收基片(12)的距离；
    步骤(3)：在每一次激光脉冲发射前，计算机控制系统(14)根据预先规划好的路线，控制二维振镜(6)的转动，改变激光光束路径；
    步骤(4)：激光器(1)发出的光束经过光束整形模块整形后，进入由二维振镜(6)和f-θ透镜(7)组成的光路调节模块，经过二维振镜(6)改变光路的走向后，最终通过f-θ透镜(7)后聚焦到步骤(2)所述锡膏薄膜(9)上方；激光(15)通过透明基片(8)，被锡膏薄膜(9)吸收后，导致照射部位部分汽化，在锡膏薄膜(9)内部形成气泡(16)，并且随着气泡(16)不断的膨胀，会推动周围未汽化部分冲向接收基片(12)；并在透明基片(8)和接收基片(12)之间形成稳定的桥式结构(17)；
    步骤(5)：重复进行步骤(3)和步骤(4)直至接收基片(12)上所有焊盘和透明基片(8)之间都形成一个稳定的桥式结构(17)；之后，计算机控制系统(14)控制Z轴升降台(11)上升，使透明基片(8)垂直离开接收基 片(12)，使所有桥式结构(17)断裂，留下点状锡膏(18)，进而整个接收基片(12)印刷完成。
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