WO2020138812A1

WO2020138812A1 - Apparatus for guiding drier for semiconductor wafer

Info

Publication number: WO2020138812A1
Application number: PCT/KR2019/017859
Authority: WO
Inventors: 조인숙; 안종팔
Original assignee: 조인숙; 에이제이텍 주식회사
Priority date: 2018-12-26
Filing date: 2019-12-17
Publication date: 2020-07-02
Also published as: KR102035626B1; CN112789715A

Abstract

The present invention relates to an apparatus for guiding a drier for a semiconductor wafer. When, in order to dry a semiconductor wafer, the semiconductor wafer is processed with a chemical solution such as a cleaning solution washed with DI water and moved from a rinsing bath to a drying bath for Marangoni drying while ascending/descending, a wafer guide device is provided on the internal circumferential surface of the rinsing bath so as to prevent wafers from sticking to each other due to a surface tension gradient while the wafers are out of the water surface, wherein the wafers are finely twisted or bent during a process of using a memory device, the process including many 3D processes having a large warpage, or a process of reclaiming the wafer. Therefore, damage to normal wafers due to fine twisting or bending of the wafers may be prevented.

Description

Guide device for semiconductor wafer dryer

The present invention relates to a guide device for a dryer for a semiconductor wafer, and more particularly, for drying a marangoni to dry a semiconductor wafer treated with a chemical solution such as a cleaning solution washed with DI water. When moving from the rinsing bath to the drying bath, the wafer guide device is installed on the inner circumferential surface of the rinsing bath to prevent the wafers from sticking to each other by surface tension gradients while moving off the water surface. By configuring the, it relates to a guide device for a semiconductor wafer dryer to prevent the wafer from being damaged.

In general, during the entire process of manufacturing a semiconductor, rinsing and drying processes are very often used. For example, in the cleaning process, impurities such as particles or natural oxide films are removed as a cleaning solution, and then a rinsing and drying process is used to remove the residual cleaning solution.

In addition, a rinsing and drying process is performed as a final step in an etching process or a nicking process for a predetermined material film. The rinse process is a process of washing a semiconductor wafer treated with a chemical solution such as a cleaning solution with deionized water (DI water), and a drying process is a process of drying a semiconductor wafer that has been subjected to a rinse process.

During the rinsing and drying process described above, it is important not to cause so-called water marks on the silicon wafer.

The above-mentioned water spot refers to a silicon oxide film formed by dissolving oxygen in the atmosphere in deionized water remaining on the wafer and reacting the dissolved oxygen with the silicon wafer.

Therefore, water spots are caused when the wafer is exposed to the atmosphere when the rinsed wafer is moved from a rinsing bath to a drying bath. Such water spots are generated as the time for which the wafer is exposed to the atmosphere increases.

In order to solve the above-mentioned problem that water spots are generated on the wafer, a cleaning solution treatment and rinsing process is generally performed sequentially in a bath loaded with a semiconductor wafer, and then a marangoni dryer installed on the top of the bath is used. To perform the drying process.

The above described Marangoni drying is based on surface tension gradient forces. In this technique, volatile organic compounds such as isopropyl alcohol (IPA) having a surface tension lower than that of water are introduced in the form of vapor when the substrate wafer is slowly recovered from water in the vicinity of the substrate semiconductor wafer.

Because a small amount of alcohol vapor comes into contact with the water meniscus, which is constantly replenished, the alcohol vapor is absorbed into the water and creates a surface tension gradient. This gradient causes the meniscus to partially contract and exhibits an apparent finite flow angle.

This allows a thin film of water to flow from the substrate surface and dry it. This flow will also help in removing non-volatile contaminants and suspended entrained particles.

In a known Marangoni dryer, semiconductor wafers are immersed in deionized water (DI water). A sealed cover or lid is placed over the bath containing the submerged wafers, creating a sealed process chamber. Air is removed from the chamber with nitrogen gas and an IPA (isopropyl alcohol) bubbler produces IPA vapor, which is introduced into the chamber along with nitrogen gas.

In another known approach, the wafers are immersed in a bath of diluted concentration of hydrofluoric acid. Following treatment with the acid bath, deionized water is introduced into the bath, washing the hydrofluoric acid through an overflow.

The drying of the marangoni described above is then carried out.

In the absence of Marangoni drying, the surface tension of DI water on small-sized semiconductor wafer features (e.g., 30 nanometer features) is due to the sticky, pulling, bending or cutting structures resulting from this surface tension. This may cause damage to the features.

That is, it is possible to prevent the feature from being caused by drying the marangoni.

In view of this, a wafer dryer apparatus and method have been published in Patent Application No. 10-2017-7028571.

Looking at the above, the conventional general semiconductor wafer drying apparatus is a wafer storage tank including a tank body defining an inner tank chamber, wherein the inner tank chamber includes a top chamber portion and a bottom chamber portion, a top portion, and a bottom portion. The uppermost portion has a wafer carrier storage opening communicating with the tank chamber and is sized to accommodate a first wafer carrier with one or more semiconductor wafers on the first wafer carrier, the tank being the lower tank chamber It further comprises a liquid inlet for communicating with a portion and connecting to a source of cleaning liquid, the tank chamber having at least one overflow outlet in the upper tank chamber portion, so that the liquid from the liquid inlet is the at least one Flowing upwards to an overflow outlet, the tank having a drain outlet communicating with the lower tank chamber portion, a wafer storage tank, and located in the tank chamber and a first wafer carrier thereon one or more semiconductor wafers A wafer carrier lifter arranged to receive together with the wafer carrier receiving opening, the wafer carrier lifter receiving the wafer carrier from the first wafer carrier and the one or more semiconductor wafers thereon from a first lower wafer carrier position. It can be operated to lift and lower the second raised wafer carrier transfer position over the opening, wherein the first wafer carrier and the one or more semiconductor wafers thereon in the first lower wafer carrier position are within the inner tank chamber. When submerged in liquid, the wafer carrier lifter also lifts the first wafer carrier from the first wafer carrier location to the second elevated wafer carrier transfer location at a controlled wafer lifting speed with the one or more semiconductor wafers. A first drying chamber, which is operable, and is connected to the tank and covers and covers the wafer carrier storage opening. A wafer drying chamber movable from a position to a second drying chamber position offset from the wafer carrier receiving opening, receiving the one or more wafers on the first wafer carrier lifted to the second elevated wafer carrier delivery position A second wafer carrier is placed in the wafer drying chamber operable to do so, and the wafer drying chamber is mixed when the wafers are pulled out of the liquid by the wafer carrier lifter towards the second lifted wafer transfer location. A first gas inlet for connecting to a source of mixed isopropyl alcohol and nitrogen to provide the isopropyl alcohol and nitrogen to the surfaces of the wafers, the surface tension when the wafers are lifted out of the liquid A wafer drying chamber in which there is sufficient IPA in the isopropyl alcohol and nitrogen mixture to at least partially dry the surfaces of the wafers by gradient drying, and the wafer drying chamber in the first drying chamber position and the second drying chamber A wafer drying chamber mover for moving between locations, the isopropyl alcohol and nitrogen of the first carrier and wafer lifter connected to the tank chamber and when the tank is discharged to expose the first carrier and wafer lifter. And a valve operable to discharge liquid from the tank through the drain at a rate to at least partially dry surfaces, the wafer drying chamber mover receiving the wafer drying chamber and the second wafer carrier from the received one The above wafers may be operated to move from the first drying chamber location to the second drying chamber location and from the second drying chamber location to the first drying chamber location and wafers in the second drying chamber location. Recall nitrogen to continue drying the first wafer carrier and wafer lifter following exposure of the wafer lifter and first wafer carrier with a drying chamber. It comprises at least one gas applicator disposed in the tank chamber for connection to a source of nitrogen for transport to a first wafer carrier.

However, the conventional general semiconductor wafer drying apparatus configured as described above solves the problem of depositing materials on the processed and dried wafers, such as the liquid leaving behind the material stations on the wafers due to the above-described configurations. However, still, when the wafer moves out of the water surface as it is lifted from the lower tank portion to the upper tank portion, the wafer is processed in multiple processes, for example, a process using a memory device with many warping 3D processes or using a wafer ( In the process of reclaim), there is a problem in that the wafers that are finely twisted or bent and stick to each other by surface tension gradients are still generated and are damaged to normal wafers.

(Patent Document 1) Patent Application No. 10-2017-7028571, filing date (international); March 03, 2016

Thus, the present invention was devised to solve the above-mentioned problems, and for rinsing for drying Marangoni to dry a semiconductor wafer treated with a chemical solution such as a cleaning solution washed with DI water. When moving from the bath to the drying bath, it is finely twisted or bent in the process of using a memory device that uses a large 3D process with large warpage or reclaiming the wafer. By configuring the wafer guide device on the inner circumferential surface of the rinse bath to prevent the wafers from sticking to each other by surface tension gradients while leaving the water surface, it is possible to prevent damage to a normal wafer due to fine twisted or curved wafers. An object of the present invention is to provide a guide device for a semiconductor wafer dryer.

Other objects of the present invention will become apparent as the technology progresses.

The guide device of the semiconductor wafer dryer of the present invention for achieving the above object is installed on the inner lower portion of the housing forming the exterior, the bottom can be stored when deionized water is supplied through a piped deionized water supply port It is formed so that the upper portion is opened so that the supplied deionized water is overflowed, the upper side of the outer surface is formed with a discharge portion for guiding the overflowed deionized water to the outlet side, and the rinsing bath and the rinsing bath A lifter that is positioned to lift a slotter having a plurality of seating grooves so as to seat a plurality of wafers at regular intervals on top, and the lifter located on the top of the rinse bath according to the inside of the housing. The wafer is dried by spraying the isopropyl alcohol and hot nitrogen through a spray supply unit to a plurality of wafers lifted by a drying bath configured to include a drying bath, and the wafers are dried when dried. In order to prevent sticking to each other by a tension gradient, a slotter having a plurality of wafers mounted on the inner circumferential surface of the rinsing bath can individually guide the plurality of wafers when moving to the drying bath side by driving a lifter. Each side is characterized in that it comprises a guide member provided to face each other with a plurality of guide grooves formed at regular intervals.

In addition, the guide member is provided to be movable to the discharge side of the rinse bath by moving means to guide the plurality of wafers only when the slotter on which a plurality of wafers are seated moves through the lifter to the drying bath side. It is characterized by.

According to the guide device of the dryer for a semiconductor wafer according to the present invention as described above, when the guide member is installed on the inner surface of the bath for rinsing, it is moved while being lifted from the bath for rinsing to drying bath for drying marangoni. In the process of using a memory device with a large 3D process with large warpage or in the process of reproducing a wafer, the small twisted or bent wafer and the normal wafers are individually guided and raised, so that they do not stick to each other by the surface tension gradient, so that the micro twisting or bending It has an effect of preventing damage to a normal wafer due to the wafer.

1 is a perspective view showing a dryer for a semiconductor wafer in which a guide device for a semiconductor wafer dryer according to the present invention is installed.

2 is a perspective view showing a state in which the guide device of the dryer for a semiconductor wafer according to the present invention is installed in a rinse bath.

3 is a view showing a slotter and a lifter of a semiconductor wafer dryer equipped with a guide device for a semiconductor wafer dryer according to the present invention.

FIG. 4 is a view showing a drying bath for a semiconductor wafer dryer equipped with a guide device for a semiconductor wafer dryer according to the present invention.

5 is a cross-sectional view showing a state in which the guide device of the dryer for a semiconductor wafer according to the present invention is installed in a bath for rinsing.

6 is a sectional view showing a state in which the guide device of the dryer for a semiconductor wafer according to the present invention is connected to a moving means.

Hereinafter, an embodiment of the guide device of the dryer for a semiconductor wafer according to the present invention will be described in detail.

First, it should be noted that, among the drawings, the same components or parts indicate the same reference numerals as possible. In describing the present invention, detailed descriptions of related known functions or configurations are omitted so as not to obscure the subject matter of the invention.

As shown, the guide device 100 of the dryer for a semiconductor wafer according to the present invention is installed at an inner lower portion of a housing 11 forming an exterior, and deionized through a deionized water supply port 12a piped to the bottom. When water (DI) is supplied, it is formed to be stored, and the upper part is opened so that the supplied deionized water (DI) is overflowed, and the overflowed deionized water (DI) is discharged to the outlet (12b) side at the upper side of the outer surface. A rinsing bath 12 provided with a discharge portion 12c for guiding is provided, and a plurality of wafers positioned at the rinsing bath 12 so that a plurality of wafers can be seated at regular intervals. The lifter 14 is provided so as to be able to lift the slotter 13 in which the seating groove is formed, and the lifter 14 is located above the bath 12 for rinsing as it is installed inside the housing 11. A semiconductor wafer including a drying bath 15 provided to be dried by spraying isopropyl alcohol (IPA) and hot nitrogen through a spray supply unit (not shown) to a plurality of lifted wafers. A slotter installed on the inner circumferential surface of the rinse bath 12 to prevent the wafers from sticking to each other by the surface tension gradient when drying the above-mentioned wafers through the drying dryer 10 ( When 13) is moved to the drying bath 15 side by the drive of the lifter 14, a plurality of guide grooves 111 are formed at regular intervals on each side so that each of the plurality of wafers can be individually guided. It comprises a guide member 110 provided to face.

Here, the guide member 110 of the moving means 130 to guide the plurality of wafers only when the plurality of wafer-mounted slotter 13 is moved to the drying bath 15 through the lifter 14 side. By the rinse bath 12 is provided to be movable to the discharge portion (12b) side.

Hereinafter, a dryer for a semiconductor wafer is known and a detailed description thereof is omitted, and the guide device of the dryer for a semiconductor wafer according to the present invention described above will be described in more detail with reference to FIGS. 1 to 6. As follows.

That is, the guide member 110 of the guide device of the semiconductor wafer dryer according to the present invention is formed in a plate shape of a square shape so as to be respectively installed on both inner sides facing each other of the rinse bath 12, each surface When the wafer leaves the surface of deionized water (DI), it responds to the seating groove formed in the slotter 13 so as to rise vertically while maintaining a spaced apart from each other without sticking to each other by a surface tension gradient. It is provided with a plurality of guide grooves 111 are formed at regular intervals in the longitudinal direction.

The moving means 130 is fixedly installed on the outer surface of the discharge portion of the rinse bath 12 and is provided with a pneumatic or hydraulic fluid that can be introduced and discharged under control of a control unit, and a movable cylinder 131 and the movable cylinder ( 131) one end is inserted and the other end is fixed to the guide member 110 located on both inner sides of the bath 12 for rinsing through a hole for movement 133 drilled to communicate with the discharge portion 12b, the moving cylinder It is composed of a connecting member (135) provided to move the guide member (110) toward the discharge portion (12b) to correspond to the driving (131).

The guide device of the dryer for a semiconductor wafer according to the present invention configured as described above is installed at a position facing each other on the inner circumferential surface of the rinse bath 12, is stored in the rinse bath 12 and is overflowed to the discharge section 12b side. After being rinsed through deionized water (DI), when the lifter 14 is driven to dry the plurality of rinsed wafers, the attached drawing is fixed to the seating groove as shown in FIGS. 1 to 5. The slotter 13 in which a plurality of wafers are seated at intervals is raised to move to the drying bath 15 side.

At this time, the plurality of wafers are guided to the guide grooves 111 of the guide member 110 installed on both inner sides of the rinse bath 12, respectively, and ascend.

Subsequently, the plurality of wafers are guided and ascended along the guide grooves 111 of the guide member 110 until they exit the surface of the deionized water (DI), so that they are different from each other by a surface tension gradient. It will not stick.

As a result, it is possible to prevent damage to a normal wafer due to a fine twisted or bent wafer.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and variations without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical spirits within the equivalent range should be interpreted as being included in the scope of the present invention.

Claims

The guide device of the semiconductor wafer dryer is

It is installed on the inner lower part of the housing 11 forming the exterior, and is formed to be stored when deionized water (DI) is supplied through the deionized water supply port 12a piped to the bottom, and the upper part is supplied. A rinse bath 12 and an rinse bath 12 are provided to open the ionized water so as to be overflowed, and an outlet 12c for guiding the overflowed deionized water to the outlet 12b side is formed on the upper side of the outer surface. A lifter 14 located at (12) and provided to lift a slotter 13 in which a plurality of seating grooves are formed so as to seat a plurality of wafers at regular intervals on the upper portion, and an interior of the housing 11 A drying bath provided to be dried by spraying isopropyl alcohol and high temperature nitrogen through a spray supply unit to a plurality of wafer sides lifted by the lifter 14, located on the rinse bath 12 according to the installation. Through the dryer (10) for a semiconductor wafer comprising 15,

The slotter 13 installed on the inner circumferential surface of the rinse bath 12 to prevent the wafers from sticking to each other by the surface tension gradient when drying the marangoni is driven by the lifter 14. When moving toward the drying bath 15 side, a plurality of guide grooves 111 are formed at regular intervals on each side so as to guide the plurality of wafers individually, and a guide member 110 provided to face each other is provided. A guide device for a semiconductor wafer dryer, characterized in that.
According to claim 1,

The guide member 110 is rinsed by the moving means 130 to guide the plurality of wafers only when the slotter 13 on which the plurality of wafers are seated moves through the lifter 14 toward the drying bath 15 side. Guide device for a dryer for a semiconductor wafer, characterized in that it is provided to be movable to the discharge portion (12b) side of the bath (12).
According to claim 2,

The moving means 130 is fixedly installed on the outer surface of the discharge portion of the rinse bath 12 and is provided with a pneumatic or hydraulic fluid that can be introduced and discharged under control of a control unit, and a movable cylinder 131 and the movable cylinder ( 131) one end is inserted and the other end is fixed to the guide member 110 located on both inner sides of the bath 12 for rinsing through a hole for movement 133 drilled to communicate with the discharge portion 12b, the moving cylinder Guide device for a semiconductor wafer dryer, characterized in that it comprises a connecting member (135) provided to move the guide member (110) toward the discharge portion (12b) to correspond to the driving (131).