WO2020135732A1

WO2020135732A1 - Vehicle-mounted power source structure

Info

Publication number: WO2020135732A1
Application number: PCT/CN2019/129253
Authority: WO
Inventors: 刘宇; 王超
Original assignee: 比亚迪股份有限公司
Priority date: 2018-12-29
Filing date: 2019-12-27
Publication date: 2020-07-02
Also published as: CN111386022A

Abstract

Disclosed is a vehicle-mounted power source structure 100, comprising a box 1, a shield plate 2, a main PCB 4 and a control PCB 5, wherein the shield plate 2 is arranged inside the box 1; the box 1 is divided into a first area 11 and a second area 12 by means of the shield plate 2, and the first area 11 is in communication with the second area 12; the main PCB 4 is electrically connected to the control PCB 5; the first area 11 is further provided with a power device 41 and a high-voltage and high-current signal device 42 that are electrically connected to the main PCB 4; and the second area 12 is further provided with a non-power device 51 and a low-voltage and low-current signal device 52 that are electrically connected to the control PCB 5.

Description

Vehicle-mounted power supply structure

Cross-reference of related applications

This disclosure is based on a Chinese patent application with an application number of 201811647710.8 and an application date of December 29, 2018, and claims the priority of the Chinese patent application. The entire content of the Chinese patent application is hereby incorporated by reference.

Technical field

The present disclosure belongs to the technical field of electric vehicles, and more specifically, relates to a vehicle-mounted power supply structure.

Background technique

The electrical layout of the switching power supply of electric vehicles is an important link in the early stage of product development, and the layout design and peripheral structure design of the device are basically centered on the PCB. As shown in FIG. 1, most switching power supplies on the market are arranged on a single board plane, and all electronic devices 16 are soldered on the first PCB board 17, and then a shell 15 is added externally; or as shown in FIG. 2 In an arrangement structure of upper and lower layers, a part of the electronic device 16 is soldered on the first PCB board 17, another part of the electronic device 16 is soldered on the second PCB board 18, and then a housing 15 is added on the outside.

However, the electrical layout of existing switching power supplies is prone to the following problems:

1. EMC issues. Because there is no electric field or magnetic field shield between the devices, the problem of electromagnetic interference is difficult to solve. 2. Power density problem. Since most devices are attached to the PCB, different heights will cause a lot of wasted space, resulting in poor product volume and weight indicators, making the product uncompetitive.

Summary of the invention

The present disclosure provides a vehicle power supply structure to solve the EMC problem, heat dissipation problem and power density problem of the vehicle power supply layout existing in the prior art.

In order to achieve the above purpose, the technical solution adopted by the present disclosure is to provide a vehicle-mounted power supply structure, including a box, a shielding board, a main PCB board, and a control PCB board, the shielding board is disposed in the box body, and the box body The shielding plate is divided into a first area and a second area, the first area and the second area are in communication, the main PCB board and the control PCB board are electrically connected; the first area is also provided There are power devices and high-voltage large-current signal devices electrically connected to the main PCB board; non-power devices and low-voltage low-current signal devices electrically connected to the control PCB board are also provided on the second area.

The beneficial effect of a vehicle-mounted power supply structure provided by the present disclosure is that, compared with the prior art, the present disclosure separates the low-voltage small current signal device from the high-voltage large current signal device by adding a water cooling mechanism and a shield plate to prevent high voltage The large current signal device is interfered by the weak signal, which solves the EMC problem. The power device has a small volume and is soldered on the main PCB board uniformly, which is convenient for making full use of the space in the first area and has a high space utilization rate, which helps to solve the power density problem of the electrical layout.

In some embodiments, it further includes a water cooling mechanism provided in the cabinet, and the water cooling mechanism radiates heat to at least one of the first area and the second area.

In some embodiments, the water cooling mechanism is provided on the shielding plate.

In some embodiments, the water cooling mechanism includes a cooling tank and a sealing cover. The cooling tank is provided with a water inlet and a drain. The water inlet and the drain are located in the first area. The cooling tank Set on the shielding plate, the sealing cover seals the connection with the opening of the cooling tank.

In some embodiments, the water inlet is connected with a water inlet pipe, and the water inlet is connected with a drain pipe; the box body and/or the shielding plate and the water inlet pipe are integrally formed; the box body and/or The shield plate and the drain pipe are integrally formed; the water inlet pipe and the drain pipe make the cooling tank communicate with the outside of the box body.

In some embodiments, the low-voltage low-current signal device includes a DC filter and an AC filter; the first area is provided with a first groove and a second groove; the DC filter is located in the first groove The AC filter is located in the second groove; the water cooling mechanism is located between the first groove and the second groove.

In some embodiments, the openings of the first groove and the second groove are provided with a sealing plate, and the wirings of the DC filter, the AC filter, and the control PCB pass through the sealing plate.

In some embodiments, the main PCB board is also vertically or obliquely provided with an isolation PCB board, and the isolation PCB board is electrically connected to the main PCB board and the control PCB board.

In some embodiments, the power device is disposed on the isolated PCB board, and the power device is in contact with the water cooling mechanism through a heat conduction mechanism.

In some embodiments, an elastic mechanism is further included, and the power device is in contact with the heat conduction mechanism through the elastic mechanism.

BRIEF DESCRIPTION

The above and/or additional aspects and advantages of the present disclosure will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

In order to more clearly explain the technical solutions in the embodiments of the present disclosure, the following will briefly introduce the drawings required in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only the disclosure In some embodiments, for those of ordinary skill in the art, without paying creative labor, other drawings may be obtained based on these drawings.

Figure 1 is a structural schematic diagram 1 of the prior art;

FIG. 2 is a schematic structural diagram 2 of the prior art;

3 is a schematic structural diagram 1 of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure;

4 is a second structural diagram of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure;

5 is a schematic diagram of an explosion structure of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure;

FIG. 6 is a schematic structural diagram 1 of a box of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure;

7 is a schematic structural diagram of a main PCB board of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure;

8 is a second schematic structural diagram of a box of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure;

9 is a schematic structural diagram of a control PCB board of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure;

10 is a schematic structural diagram of a U-shaped sheet of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure.

Among them, the reference signs in the figure:

100. On-board power supply structure; 1. Box; 11. First area; 12. Second area; 13. First opening; 14. Second opening; 15, Housing; 16, Electronic device; 17, First PCB board ; 18, second PCB board; 2, shielding board; 21, first groove; 22, second groove; 23, sealing plate; 3. water cooling mechanism; 31, cooling groove; 32, water inlet pipe; 33, drainage Pipe; 34, sealed cover; 35, grille plate; 36, water inlet; 37, drain; 4, main PCB board; 41, power device; 42, high voltage and high current signal device; 421, transformer module; 422, inductance Module; 423, capacitor module; 4231, capacitor element; 4232, cylindrical capacitor; 424, switch tube; 5, control PCB board; 51, non-power device; 52, low voltage small current signal device; 521, DC filter; 522 , AC filter; 523, battery pack module; 6, isolation PCB board; 7, thermal conduction mechanism; 8, elastic mechanism; 81, grid baffle; 82, U-shaped sheet; 83, elastic sheet; 9, capacitor PCB board; 91. The first jack; 92. The second jack; 93. The isolation board.

detailed description

In order to make the technical problems, technical solutions, and beneficial effects to be solved by the present disclosure more clear, the disclosure will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present disclosure and are not intended to limit the present disclosure.

It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "Bottom", "Inner", "Outer", etc. indicate the orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, just to facilitate the description of the present disclosure and simplify the description, rather than indicating or implying the device Or elements must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as limiting the present disclosure.

In addition, the terms "first" and "second" are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise specifically limited.

Referring to FIG. 3, a vehicle-mounted power supply structure 100 provided by the present disclosure will now be described. An on-board power supply structure 100 includes a cabinet 1, a shielding plate 2, a water cooling mechanism 3, a main PCB board 4, a control PCB board 5, a power device 41, a non-power device 51, a low voltage small current signal device 52, and a high voltage large current signal Device 42, the shielding plate 2 is provided in the cabinet 1, the cabinet 1 is divided into the first area 11 and the second area 12 by the shielding plate 2, the first area 11 and the second area 12 are connected; the water cooling mechanism 3 is provided with the shielding plate 2 On or on the inner wall of the cabinet 1, the water cooling mechanism 3 radiates heat to at least one of the first area 11 and the second area 12; the main PCB board 4 and the control PCB board 5 are electrically connected, the main PCB board 4, the power The device 41 and the high-voltage high-current signal device 42 are arranged in the first region 11, the control PCB 5, the non-power device 51 and the low-voltage low-current signal device 52 are arranged in the second region 12, and the power device 41 and the high-voltage high-current device are electrically connected at On the main PCB board 4, the non-power device 51 and the low-voltage low-current signal device 52 are electrically connected to the control PCB board 5.

Compared with the prior art, a vehicle power supply structure 100 provided by the present disclosure, by adding a water cooling mechanism 3 and a shielding plate 2, separates the low voltage small current signal device 52 and the high voltage large current signal device 42 to prevent high voltage The current signal device 42 is interfered by the weak signal, which solves the EMC problem. The water cooling mechanism 3 simultaneously dissipates heat in the first area 11 and the second area 12, which provides a new way for heat dissipation in the cabinet 1 and thus speeds up the heat dissipation in the cabinet 1. The power device 41 has a small volume and is soldered on the main PCB 4 in a unified manner, so that the space in the first area 11 is fully utilized, and the space utilization rate is high, which helps to solve the power density problem of the electrical layout.

In some embodiments, the water cooling mechanism 3 simultaneously dissipates heat from the first area 11 and the second area 12.

In some embodiments, the shielding plate 2 is integrally formed with the box 1. The main PCB board 4 and the control PCB board 5 are arranged parallel to the shielding board 2. The box 1 is provided with a first opening 13 for placing the main PCB 4 in the first area 11. The cabinet 1 is provided with a second opening 14 for placing the control PCB 5 in the second area 12. The water cooling mechanism 3 is a metal mechanism.

In some embodiments, please refer to FIG. 3 and FIG. 4 together. As a specific embodiment of a vehicle-mounted power supply structure 100 provided by the present disclosure, the main PCB board 4 is also provided with an isolation PCB board 6 vertically or obliquely. The isolation PCB 6 is electrically connected to the main PCB 4 and the control PCB 5.

Some devices are arranged on the isolation PCB board 6, which reduces the volume of the main PCB board 4, thereby improving the space utilization of the first area 11.

In some embodiments, the control PCB board 5, the isolation PCB board 6, and the main PCB board 4 cooperate to perform signal acquisition, driving, control, communication, and power transmission.

In some embodiments, please refer to FIGS. 5 and 6 together. As a specific embodiment of an on-board power supply structure 100 provided by the present disclosure, the water cooling mechanism 3 includes a cooling tank 31, an inlet pipe 32, and a drain pipe 33. And the sealing cover 34; the cooling tank 31 is provided with a water inlet 36 and a drain 37, the water inlet 36 and the drain 37 are located in the first region 11; the water inlet 32 is connected to the water inlet 36, and the drain 33 is connected to the drain 37; The cooling tank 31, the water inlet pipe 32 and the drain pipe 33 are all provided on the shielding plate 2 and integrally formed with the shielding board 2, the water inlet pipe 32, the drain pipe 33 and the tank body 1 are integrally formed, and the water inlet pipe 32 and the drain pipe 33 make the cooling tank 31 communicates with the outside of the cabinet 1, and the sealing cover 34 seals the opening of the cooling tank 31.

The water inlet pipe 32 and the water drainage pipe 33 facilitate water inflow and outflow, make the cooling water in the cooling tank 31 flow, enable the heat in the first area 11 and the second area 12 to be quickly taken away, and increase the speed of heat dissipation.

In some embodiments, the opening of the cooling tank 31 is located in the first region 11 or the second region 12.

In some embodiments, the sealing cover 34 is welded at the opening of the cooling groove 31.

In some embodiments, a plurality of grid plates 35 are provided in the cooling tank 31, and the plurality of grid plates 35 are spaced apart. The grid plate 35 slows down the flow rate of the cooling water entering the cooling tank 31, so that the cooling water can absorb enough heat.

In some embodiments, please refer to FIG. 5 to FIG. 7. As a specific implementation of an on-vehicle power supply structure 100 provided by the present disclosure, the low-voltage small-current signal device 52 includes a DC filter 521 and an AC filter 522. The shielding plate 2 or the box 1 is provided with a first groove 21 and a second groove 22. The water cooling mechanism 3 is located between the first groove 21 and the second groove 22. In some embodiments, the cooling groove 31 is located between the first groove 21 and the second groove 22. The DC filter 521 is located in the first groove 21 or the second groove 22, and the AC filter 522 is located in the second groove 22 or the first groove 21.

The cooling tank 31 isolates the DC filter 521 and the AC filter 522 so that the DC filter 521 and the AC filter 522 are less likely to interfere with each other.

In some embodiments, the first groove 21 and the second groove 22 are integrally provided on the shielding plate 2.

In some embodiments, the first groove 21 and the second groove 22 are covered with a sealing plate 23, and the wiring between the DC filter 521, the AC filter 522 and the control PCB 5 passes through the sealing plate 23. The sealing plate 23 allows the DC filter 521 and the AC filter 522 to be disposed in the relatively sealed first groove 21 or the second groove 22, which greatly reduces the mutual interference between the DC filter 521 and the AC filter 522.

The low voltage small current signal device 52 includes a battery pack module 523 DC filter 521 and an AC filter 522.

The non-power device 51 includes a battery pack module 523 DC filter 521 and an AC filter 522.

In some embodiments, the high-voltage high-current signal device 42 includes a transformer module 421, an inductor module 422, and a capacitor module 423. The power device 41 is a switch 424.

In some embodiments, the box 1 is a metal body.

In some embodiments, please refer to FIG. 8 and FIG. 9, as a specific embodiment of an on-board power supply structure 100 provided by the present disclosure, the control PCB board 5 is oppositely disposed with the shielding board 2, and the power device 41 is disposed on the isolated PCB On the board 6, the power device 41 is in contact with the water cooling mechanism 3 through the heat conduction mechanism 7.

The switch tube 424 easily generates a large amount of heat during use. The water cooling mechanism 3 rapidly cools the switch tube 424 to ensure the working performance of the switch tube 424. The heat-conducting mechanism 7 facilitates the rapid transfer of the heat from the switch tube 424 to the water-cooling mechanism 3 so that the heat is directionally transferred, thereby ensuring the speed of heat dissipation.

In some embodiments, please refer to FIGS. 8 and 9. As a specific embodiment of an on-board power supply structure 100 provided by the present disclosure, it further includes an elastic mechanism 8 through which the power device 41 interferes with the heat conduction mechanism 7 on. The power device 41 is a switch 424.

It is ensured that the switch tube 424 can be in good contact with the heat conduction mechanism 7, so that the connection between the switch tube 424 and the water cooling mechanism 3 is not easily affected by the environment and is disconnected. During driving, the on-board power supply vibrates due to the bumps of the vehicle, and the elastic mechanism 8 counteracts the impact of the vibration on the switch tube 424.

In some embodiments, the heat conduction mechanism 7 is a heat conduction plate. The heat conduction plate is placed between the water cooling mechanism 3 and the switch tube 424.

In some embodiments, the elastic mechanism 8 may be a spring or a bending piece. The spring or bending piece has a better ability to restore deformation.

In some embodiments, please refer to FIG. 8 to FIG. 10, as a specific embodiment of an on-board power supply structure 100 provided by the present disclosure, the elastic mechanism 8 includes a grid baffle 81, a U-shaped piece 82 and a U-shaped fixed The elastic sheet 83 on the outer side of the sheet 82 and the grid baffle 81 are fixed on the main PCB board 4, and the grid baffle 81 may be vertically arranged on the main PCB board 4. The side of the grid baffle 81 is located inside the U-shaped piece 82, and the elastic piece 83 abuts against the switch tube 424.

The grid baffle 81 is connected to the main PCB board 4 so that the elastic mechanism 8 is not easily separated from the main PCB board 4. The U-shaped piece 82 is connected to the grid baffle 81 to facilitate the installation and removal of the elastic piece 83. The elastic piece 83 makes the switch tube 424 interfere with the heat conduction mechanism 7, and the structure is simple and very practical. The U-shaped sheet 82 and the elastic sheet 83 may be integrally formed.

In some embodiments, please refer to FIG. 8 to FIG. 10, as a specific embodiment of a vehicle-mounted power supply structure 100 provided by the present disclosure, the U-shaped sheet 82 is disposed along the length direction of the grid baffle 81, and the switch tube 424 A plurality is provided, and a plurality of elastic pieces 83 is provided. The number of the elastic pieces 83 corresponds to the number of the switch tubes 424 in one-to-one correspondence.

The elastic mechanism 8 can simultaneously abut the plurality of switch tubes 424 on the heat-conducting mechanism 7 to facilitate the stable contact of the plurality of switch tubes 424 with the water cooling mechanism 3.

In some embodiments, the switch 424 is a MOS tube, four MOS tubes are electrically connected to form an H-bridge, and two MOS tubes are electrically connected to form a half-bridge.

In some embodiments, please refer to FIG. 9, as a specific embodiment of a vehicle-mounted power supply structure 100 provided by the present disclosure, two isolation PCB boards 6 are oppositely disposed, and a switch tube 424 is located between the two isolation PCB boards 6 In the meantime, the transformer module 421 and the inductance module 422 are disposed outside the isolation PCB 6 respectively.

The isolation PCB 6 has the function of shielding the magnetic field, and at the same time ensures the normal operation of the switch tube 424. The isolation PCB board 6 separates the switch tube 424 from the transformer module 421 and the inductor module 422, so that the switch tube 424 is not easily affected by the magnetic fields of the inductor module 422 and the transformer module 421 and magnetic field coupling and near-field coupling occur. The two isolation PCB boards 6 enclose the switch tube 424 better, so that the switch tube 424 is located in a space with less magnetic field.

In some embodiments, the switch tube 424 is disposed on the main PCB board 4 or the isolation PCB board 6. When the switch tube 424 is disposed on the isolation PCB board 6, the use of the space of the main PCB board 4 is reduced, and it is convenient for the main PCB board 4 to set other components.

In some embodiments, the isolation PCB 6 is provided with eight copper skin layers. The copper skin has a good magnetic field shielding effect.

In some embodiments, please refer to FIG. 9. As a specific implementation of an on-board power supply structure 100 provided by the present disclosure, a capacitor module 423 is further provided between the transformer module 421 and the inductance module 422.

The magnetic field between the transformer module 421 and the inductor module 422 will affect each other. The capacitor module 423 and the capacitor PCB 9 block the magnetic field between the transformer module 421 and the inductor module 422, so that the magnetic field between the transformer module 421 and the inductor module 422 is weakened. The capacitor PCB 9 has a shielding function, which further prevents the transformer module 421 and the inductor module 422 from easily affecting each other. At the same time, the capacitive PCB board 9 utilizes the vertical space of the main PCB board 4 to enable the main PCB board 4 to solder more capacitive elements 4231, reducing the overall volume of the vehicle power supply. The cooperation of the capacitor PCB 9 and the capacitor element 4231 greatly reduces the influence between the transformer module 421 and the inductor module 422.

In some embodiments, the height of the capacitor module 423 is higher than the transformer module 421 and the inductor module 422.

In some embodiments, please refer to FIG. 9. As a specific embodiment of an on-board power supply structure 100 provided by the present disclosure, the capacitor module 423 is disposed on the circuit board, and the circuit board is the main PCB board 4. The capacitor module 423 includes a capacitor PCB 9 and a plurality of capacitor elements 4231. The capacitor PCB 9 is fixed to the main PCB 4 vertically or obliquely. The capacitor PCB 9 is electrically connected to the main PCB 4. The capacitor PCB 9 is located on the side of the main PCB 4.

The capacitor PCB 9 has a shielding function, which further prevents the transformer module 421 and the inductor module 422 from easily affecting each other. At the same time, the capacitive PCB board 9 utilizes the vertical space of the main PCB board 4, enabling the main PCB board 4 to solder more capacitive elements 4231, reducing the overall volume of the vehicle power supply. The cooperation of the capacitor PCB 9 and the capacitor element 4231 greatly reduces the influence between the transformer module 421 and the inductor module 422.

In some embodiments, the capacitor PCB 9 is provided with eight copper skin layers.

In some embodiments, the height of the capacitor PCB 9 is higher than the height of the transformer module 421 and the inductor module 422.

In some embodiments, please refer to FIG. 9, as a specific embodiment of an on-board power supply structure 100 provided by the present disclosure, it further includes a powered heating module provided on the main PCB 4 and fixed on the capacitor PCB 9 The package surface of the capacitive element 4231 faces the outside of the energized heating module.

The inductance module 422 emits heat during use, and the packaging surface of the capacitive element 4231 faces the outer side of the energized heating module, which is convenient for reducing the influence of the energized heating module on the capacitor module 423.

In some embodiments, the energized heating module is a transformer module 421.

In some embodiments, there are at least two energized heating modules, at least two energized heating modules generate different heat at the same time when energized, and the capacitive element 4231 fixed on the capacitor PCB 9 faces the energized heating module with low temperature .

In some embodiments, please refer to FIG. 9, as a specific embodiment of an on-board power supply structure 100 provided by the present disclosure, the pins of the capacitive element 4231 are vertically connected on the capacitive PCB board 9, and among the multiple capacitive elements 4231 The alignment is set on the capacitor PCB 9.

The capacitive elements 4231 are closely arranged on the capacitive PCB board 9 to improve the space utilization rate on the capacitive PCB board 9.

In some embodiments, the plurality of capacitive elements 4231 are aligned in rows or columns.

In some embodiments, the capacitor PCB 9 is provided with a first jack 91 and a second jack 92, the first jack 91 is used to connect a pin of the capacitive element 4231, and the second jack 92 is used to connect a capacitor The other pin of component 4231. The first insertion hole 91 and the second insertion hole 92 are provided in plurality, the plurality of first insertion holes 91 are provided in rows, and the plurality of second insertion holes 92 are provided in rows. When it is necessary to install or remove the capacitor, it is very convenient to insert or remove the capacitor element 4231 from the capacitor PCB 9.

In some embodiments, please refer to FIG. 9, as a specific embodiment of a vehicle power supply structure 100 provided by the present disclosure, at least two sets of aligned capacitive elements 4231 are provided on the same capacitor PCB 9, and at least two sets An isolation plate 93 is provided between the aligned capacitive elements 4231, and the isolation plate 93 is fixed on the main PCB board 4.

At least two groups of aligned capacitive elements 4231 of the isolation plate 93 are not likely to affect each other. At the same time, the isolation board 93 plays a role of supporting the capacitor PCB 9, so that the capacitor PCB 9 is stably connected to the main PCB 4.

In some embodiments, the capacitive element 4231 is a chip capacitor.

In some embodiments, the package of the capacitive element 4231 is a rectangular package.

In some embodiments, please refer to FIG. 9, as a specific embodiment of a vehicle power supply structure 100 provided by the present disclosure, the capacitor module 423 further includes a cylindrical capacitor 4232, and the cylindrical capacitor 4232 is disposed on two isolated PCB boards Between 6.

The cylindrical capacitor 4232 is disposed between the isolated PCB boards 6, so as to make full use of the area between the two isolated PCB boards 6, so that more components are soldered on the main PCB board 4.

The above are only the preferred embodiments of the present disclosure and are not intended to limit the present disclosure. Any modification, equivalent replacement and improvement made within the spirit and principle of the present disclosure shall be included in the protection of the present disclosure Within range.

Claims

A vehicle-mounted power supply structure, characterized by comprising a box body, a shielding board, a main PCB board and a control PCB board, the shielding board is provided in the box body, and the box body is divided into a first area by the shielding board And a second area, the first area and the second area are in communication, and the main PCB and the control PCB are electrically connected;

The first area is also provided with power devices and high-voltage high-current signal devices electrically connected to the main PCB board;

The second area is also provided with non-power devices and low-voltage low-current signal devices electrically connected to the control PCB board.
The on-vehicle power supply structure according to claim 1, further comprising a water cooling mechanism provided in the cabinet, the water cooling mechanism facing at least one of the first area and the second area Conduct heat dissipation.
The vehicle power supply structure according to claim 2, wherein the water cooling mechanism is provided on the shielding plate.
The vehicle-mounted power supply structure according to claim 3, wherein the water cooling mechanism includes a cooling tank and a sealing cover, and the cooling tank is provided with a water inlet and a drain, the water inlet and the drain Located in the first area, the cooling groove is provided on the shielding plate, and the sealing cover is sealingly connected to the opening of the cooling groove.
The vehicle-mounted power supply structure according to claim 4, wherein the water inlet is connected with a water inlet pipe, and the water inlet is connected with a drain pipe;

The box body and the water inlet pipe are integrally formed; or,

The shielding plate and the water inlet pipe are integrally formed; or,

The box body, the shielding plate and the water inlet pipe are integrally formed;

The box body and the drain pipe are integrally formed; or,

The shielding plate and the drain pipe are integrally formed; or,

The box body, the shielding plate and the drain pipe are integrally formed;

The water inlet pipe and the drain pipe communicate the cooling tank with the outside of the box.
The vehicle-mounted power supply structure according to claim 2, wherein the low-voltage small-current signal device includes a DC filter and an AC filter;

The first area is provided with a first groove and a second groove;

The DC filter is located in the first groove, and the AC filter is located in the second groove;

The water cooling mechanism is located between the first groove and the second groove.
The vehicle-mounted power supply structure according to claim 6, wherein the openings of the first groove and the second groove are provided with a sealing plate, the DC filter, the AC filter and the The wiring of the control PCB board passes through the sealing board.
An on-board power supply structure according to claim 2, wherein the main PCB board is also vertically or obliquely provided with an isolation PCB board, the isolation PCB board is electrically connected to the main PCB board and the control PCB board.
The vehicle-mounted power supply structure according to claim 8, wherein the power device is disposed on the isolated PCB board, and the power device is in contact with the water cooling mechanism through a heat conduction mechanism.
The vehicle-mounted power supply structure according to claim 9, further comprising an elastic mechanism, and the power device resists the heat conduction mechanism through the elastic mechanism.