CN201947597U - Shielding device - Google Patents
Shielding device Download PDFInfo
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- CN201947597U CN201947597U CN2010206475529U CN201020647552U CN201947597U CN 201947597 U CN201947597 U CN 201947597U CN 2010206475529 U CN2010206475529 U CN 2010206475529U CN 201020647552 U CN201020647552 U CN 201020647552U CN 201947597 U CN201947597 U CN 201947597U
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Abstract
本实用新型公开了一种屏蔽装置,该屏蔽装置包括:第一PCB板;第二PCB板,与第一PCB板相对且平行放置;第一屏蔽架和第二屏蔽架,与第一PCB板和第二PCB板连接,形成密闭腔体;以及连接器,位于第一PCB板和第二PCB板之间,与第一PCB板和第二PCB板连接。本实用新型降低了PCB板整体厚度,节省了PCB板整体的面积,减少了单独屏蔽罩的使用成本。
The utility model discloses a shielding device, which comprises: a first PCB board; a second PCB board placed opposite to and parallel to the first PCB board; a first shielding frame and a second shielding frame, connected to the first PCB board connected with the second PCB board to form a closed cavity; and a connector located between the first PCB board and the second PCB board and connected with the first PCB board and the second PCB board. The utility model reduces the overall thickness of the PCB board, saves the overall area of the PCB board, and reduces the use cost of a separate shielding cover.
Description
技术领域technical field
本实用新型涉及通信领域,具体而言,涉及一种屏蔽装置。The utility model relates to the communication field, in particular to a shielding device.
背景技术Background technique
随着大规模集成电路的发展与广泛使用,EMI已成为不可小视的问题。作为电磁抗干扰器件,屏蔽罩的使用也越来越普遍。屏蔽罩是用屏蔽体将元部件,电路,组合件,电缆或整个系统的干扰源包围起来,防止干扰电磁场向外扩散;用屏蔽体将接收电路,设备或系统包围起来,防止它们受到外界电磁场的影响。With the development and widespread use of large-scale integrated circuits, EMI has become a problem that cannot be underestimated. As an electromagnetic anti-interference device, the use of shielding covers is becoming more and more common. The shielding cover is to surround the interference source of components, circuits, assemblies, cables or the whole system with a shielding body to prevent the interference electromagnetic field from spreading outward; to surround the receiving circuit, equipment or system with a shielding body to prevent them from being subjected to external electromagnetic fields Impact.
屏蔽罩的材料通常采用0.2mm厚的不锈钢和洋白铜为材料,一般采用屏蔽架和屏蔽罩组合使用的方式。这样做既增加了占用的面积又增加了占用的厚度。The material of the shielding case is usually made of 0.2mm thick stainless steel and nickel nickel, and the combination of the shielding frame and the shielding case is generally used. Doing so not only increases the occupied area but also increases the occupied thickness.
实用新型内容Utility model content
为克服现有屏蔽罩方案中存在的屏蔽罩屏蔽架增加占用面积和厚度的缺陷,本实用新型提供一种屏蔽装置,同时减少屏蔽罩屏蔽架占用面积和厚度。In order to overcome the defect of increasing the occupied area and thickness of the shielding frame in the existing shielding case scheme, the utility model provides a shielding device, which simultaneously reduces the occupied area and thickness of the shielding frame of the shielding case.
为了实现上述目的,根据本实用新型的一个方面,提供了一种屏蔽装置。In order to achieve the above purpose, according to one aspect of the present utility model, a shielding device is provided.
根据本实用新型的屏蔽装置包括:第一PCB板;第二PCB板,与第一PCB板相对且平行放置;第一屏蔽架和第二屏蔽架,与第一PCB板和第二PCB板连接,形成密闭腔体;以及连接器,位于第一PCB板和第二PCB板之间,与第一PCB板和第二PCB板连接。The shielding device according to the present invention comprises: a first PCB board; a second PCB board placed opposite to and parallel to the first PCB board; a first shielding frame and a second shielding frame connected to the first PCB board and the second PCB board , forming a closed cavity; and a connector, located between the first PCB board and the second PCB board, connected with the first PCB board and the second PCB board.
进一步地,连接器位于密闭腔体之内。Further, the connector is located in the airtight cavity.
进一步地,连接器位于密闭腔体之外。Further, the connector is located outside the airtight cavity.
进一步地,屏蔽装置还包括:第三屏蔽架和第四屏蔽架,与第一PCB板和第二PCB板连接,形成第二密闭腔体;连接器位于第二密闭腔体之内。Further, the shielding device further includes: a third shielding frame and a fourth shielding frame connected to the first PCB board and the second PCB board to form a second airtight cavity; the connector is located in the second airtight cavity.
进一步地,第一屏蔽架、第二屏蔽架、第一PCB板和第二PCB板通过焊接连接。Further, the first shielding frame, the second shielding frame, the first PCB board and the second PCB board are connected by welding.
进一步地,第三屏蔽架、第四屏蔽架、第一PCB板和第二PCB板通过焊接连接。Further, the third shielding frame, the fourth shielding frame, the first PCB board and the second PCB board are connected by welding.
采用本实用新型的屏蔽装置,减少屏蔽罩屏蔽架占用面积和厚度,降低了印刷电路板(Printed Circuit Board,简称为PCB)板整体厚度,节省了PCB板整体的面积,减少了单独屏蔽罩的使用成本。Adopting the shielding device of the present utility model reduces the occupied area and thickness of the shielding frame of the shielding case, reduces the overall thickness of the printed circuit board (Printed Circuit Board, referred to as PCB) board, saves the overall area of the PCB board, and reduces the cost of a separate shielding case. The cost.
附图说明Description of drawings
此处所说明的附图用来提供对本实用新型的进一步理解,构成本申请的一部分,本实用新型的示意性实施例及其说明用于解释本实用新型,并不构成对本实用新型的不当限定。在附图中:The drawings described here are used to provide a further understanding of the utility model and constitute a part of the application. The schematic embodiments of the utility model and their descriptions are used to explain the utility model and do not constitute improper limitations to the utility model. In the attached picture:
图1是本实用新型实施例的屏蔽装置的剖面图;Fig. 1 is the sectional view of the shielding device of the utility model embodiment;
图2是本实用新型优选实施例一的屏蔽装置的剖面图;Fig. 2 is a cross-sectional view of the shielding device of the preferred embodiment 1 of the present invention;
图3是本实用新型优选实施例二的屏蔽装置的剖面图。Fig. 3 is a cross-sectional view of the shielding device according to the preferred embodiment 2 of the present invention.
具体实施方式Detailed ways
需要说明的是,在不冲突的情况下,本申请中的实施例及实施例中的特征可以相互组合。下面将参考附图并结合实施例来详细说明本实用新型。It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The utility model will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
本实用新型实施例提供了一种屏蔽装置。图1是本实用新型实施例的屏蔽装置的剖面图,包括第一PCB板11,第二PCB板12,第一屏蔽架13,第二屏蔽架14和连接器15。下面对其进行详细描述。The embodiment of the utility model provides a shielding device. 1 is a cross-sectional view of a shielding device according to an embodiment of the present invention, including a first PCB board 11 , a second PCB board 12 , a first shielding frame 13 , a second shielding frame 14 and a connector 15 . It is described in detail below.
第二PCB板12,与第一PCB板11相对且平行放置;第一屏蔽架13和第二屏蔽架14,与第一PCB板11和第二PCB板12连接,形成密闭腔体;连接器15,位于第一PCB板11和第二PCB板12之间,与第一PCB板11和第二PCB板12连接。The second PCB board 12 is placed opposite and parallel to the first PCB board 11; the first shielding frame 13 and the second shielding frame 14 are connected with the first PCB board 11 and the second PCB board 12 to form a closed cavity; the connector 15 , located between the first PCB board 11 and the second PCB board 12 , and connected to the first PCB board 11 and the second PCB board 12 .
相关技术中,屏蔽装置中的屏蔽罩屏蔽架增加了占用面积和厚度。本实用新型实施例中,第一PCB板和第二PCB板上有各自器件,第一屏蔽架、第二屏蔽架、第一PCB板、第二PCB板形成密闭腔体,起到屏蔽作用,第一PCB板相当于第二PCB板上器件的屏蔽罩,第二PCB板也相当于第一PCB板上器件的屏蔽罩,可以节省单独屏蔽罩,同时也可以作为地使用,增强密闭性、屏蔽性。In the related art, the shielding case and the shielding frame in the shielding device increase the occupied area and thickness. In the embodiment of the utility model, the first PCB board and the second PCB board have respective devices, and the first shielding frame, the second shielding frame, the first PCB board, and the second PCB board form a closed cavity to play a shielding role. The first PCB board is equivalent to the shielding cover of the device on the second PCB board, and the second PCB board is also equivalent to the shielding cover of the device on the first PCB board, which can save a separate shielding cover, and can also be used as a ground to enhance airtightness, shielding.
另外,在第二PCB板固定的基础上,第一PCB板也通过屏蔽架固定下来。In addition, on the basis of fixing the second PCB, the first PCB is also fixed by the shielding frame.
本实用新型实施例中,连接器用于第一PCB板和第二PCB板之间的电气连接。In the embodiment of the present invention, the connector is used for electrical connection between the first PCB board and the second PCB board.
优选地,连接器15位于密闭腔体之内。Preferably, the connector 15 is located within a closed cavity.
优选地,第一屏蔽架13、第二屏蔽架14、第一PCB板11和第二PCB板12通过焊接连接。Preferably, the first shielding frame 13 , the second shielding frame 14 , the first PCB board 11 and the second PCB board 12 are connected by welding.
本实用新型还提供两个优选的实施例:The utility model also provides two preferred embodiments:
优选实施例一Preferred embodiment one
图2是本实用新型优选实施例一的屏蔽装置的剖面图。Fig. 2 is a cross-sectional view of the shielding device according to the preferred embodiment 1 of the present invention.
优选地,连接器15位于密闭腔体之外,可以减少连接器产生的辐射对第一PCB板和第二PCB板内器件的干扰。Preferably, the connector 15 is located outside the airtight cavity, which can reduce the interference of the radiation generated by the connector on the devices in the first PCB board and the second PCB board.
优选实施例二Preferred embodiment two
图3是本实用新型优选实施例二的屏蔽装置的剖面图。Fig. 3 is a cross-sectional view of the shielding device according to the preferred embodiment 2 of the present invention.
优选地,上述屏蔽装置还包括第三屏蔽架16和第四屏蔽架17,与第一PCB板11和第二PCB板12连接,形成第二密闭腔体;连接器位于第二密闭腔体之内。Preferably, the above-mentioned shielding device further includes a third shielding frame 16 and a fourth shielding frame 17, which are connected to the first PCB board 11 and the second PCB board 12 to form a second airtight cavity; the connector is located between the second airtight cavity Inside.
本优选实施例中,在连接器的两侧设置有第三屏蔽架和第四屏蔽架,从而避免连接器产生辐射等干扰。In this preferred embodiment, a third shielding frame and a fourth shielding frame are arranged on both sides of the connector, so as to prevent the connector from generating interference such as radiation.
优选地,第三屏蔽架16、第四屏蔽架17、第一PCB板11和第二PCB板12通过焊接连接。Preferably, the third shielding frame 16 , the fourth shielding frame 17 , the first PCB board 11 and the second PCB board 12 are connected by welding.
以上所述仅为本实用新型的优选实施例而已,并不用于限制本实用新型,对于本领域的技术人员来说,本实用新型可以有各种更改和变化。凡在本实用新型的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本实用新型的保护范围之内。The above descriptions are only preferred embodiments of the utility model, and are not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present utility model shall be included in the protection scope of the present utility model.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206475529U CN201947597U (en) | 2010-12-08 | 2010-12-08 | Shielding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206475529U CN201947597U (en) | 2010-12-08 | 2010-12-08 | Shielding device |
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| CN201947597U true CN201947597U (en) | 2011-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010206475529U Expired - Lifetime CN201947597U (en) | 2010-12-08 | 2010-12-08 | Shielding device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102612260A (en) * | 2012-03-29 | 2012-07-25 | 上海华勤通讯技术有限公司 | Reinforced FPC (Flexible Printed Circuit) board and manufacturing method |
| CN108235832A (en) * | 2017-03-09 | 2018-06-29 | 华为技术有限公司 | The mainboard and terminal of a kind of consumption electronic product |
| WO2018161450A1 (en) * | 2017-03-09 | 2018-09-13 | 华为技术有限公司 | Motherboard and terminal for use with consumer electronic products |
| WO2020135732A1 (en) * | 2018-12-29 | 2020-07-02 | 比亚迪股份有限公司 | Vehicle-mounted power source structure |
| WO2020154915A1 (en) * | 2019-01-29 | 2020-08-06 | 华为技术有限公司 | Circuit module and electronic device |
-
2010
- 2010-12-08 CN CN2010206475529U patent/CN201947597U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102612260A (en) * | 2012-03-29 | 2012-07-25 | 上海华勤通讯技术有限公司 | Reinforced FPC (Flexible Printed Circuit) board and manufacturing method |
| CN108235832A (en) * | 2017-03-09 | 2018-06-29 | 华为技术有限公司 | The mainboard and terminal of a kind of consumption electronic product |
| WO2018161450A1 (en) * | 2017-03-09 | 2018-09-13 | 华为技术有限公司 | Motherboard and terminal for use with consumer electronic products |
| WO2020135732A1 (en) * | 2018-12-29 | 2020-07-02 | 比亚迪股份有限公司 | Vehicle-mounted power source structure |
| WO2020154915A1 (en) * | 2019-01-29 | 2020-08-06 | 华为技术有限公司 | Circuit module and electronic device |
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Granted publication date: 20110824 |
