WO2020154915A1

WO2020154915A1 - Circuit module and electronic device

Info

Publication number: WO2020154915A1
Application number: PCT/CN2019/073754
Authority: WO
Inventors: 占奇志; 朱董宜; 钱泽旭; 阳美文
Original assignee: 华为技术有限公司
Priority date: 2019-01-29
Filing date: 2019-01-29
Publication date: 2020-08-06
Also published as: CN112292913A

Abstract

Provided in embodiments of the present application are a circuit module and an electronic device, the circuit module comprising: a base board, a frame board and a sub board. A first surface of the base board is used for arranging a functional device, a second surface of the base board is used for signal connection, and the first surface of the base board and a first surface of the frame board are attached and connected. At the same time, a first surface of the sub board and a second surface of the frame board are attached and connected, and at least one surface of the sub board is used for arranging the functional device. The design means of the described circuit module may significantly decrease the probability of the warping of the circuit module due to the area being excessively large, which thereby increases the pass rate of the circuit module and reduces the production costs of the circuit module.

Description

Circuit module and electronic equipment

Technical field

The embodiments of the application relate to electronic communication technology, and in particular to a circuit module and electronic equipment.

Background technique

Modular design is an important method in the structural design of electronic equipment. Through modular design, the product structure of electronic equipment can be divided into a series of circuit modules. In modular design, how to design the structure of circuit modules is a problem that needs to be solved.

In the prior art, a method for structural design of circuit modules in electronic equipment is proposed. In this method, the circuit modules adopt a large ground array (LGA) module, and the LGA module adopts a single-sided layout. Specifically, the LGA module includes two sides, one side is where a printed circuit board (PCB) is located, and the functional devices of the LGA module are all placed on the PCB. The other side is the surface where the pads are located. No functional devices are placed on the surface where the pads are located. The pads only realize signal connection with the bottom plate and heat dissipation.

However, using the method of the prior art, when the circuit module requires more functional devices and the circuit module area is larger, the circuit module may be warped during production, resulting in a decrease in the yield rate of the circuit module during production. Rising production costs.

Summary of the invention

The embodiments of the present application provide a circuit module and electronic equipment.

The first aspect of the embodiments of the present application provides a circuit module, which includes a bottom board, a frame board, and a sub board. Wherein, the first surface of the bottom plate is used for arranging functional devices, the second surface of the bottom plate is used for signal connection, and the first surface of the bottom plate is connected to the first surface of the frame plate. At the same time, the first surface of the sub-board is attached to the second surface of the frame board, and at least one surface of the sub-board is used for setting functional devices.

In this circuit module, because functional devices can be placed on one side of the bottom board and at least one side of the daughter board, compared with the existing LGA module, the area of the circuit module is only the current area under the premise that the functional devices that need to be placed are the same. There are half or one third of the LGA module, which can significantly reduce the area of the circuit module, thereby significantly reducing the probability of warpage of the circuit module due to the excessive area, thereby improving the qualification rate of the circuit module and reducing the circuit module Production costs.

In a possible design, the first side of the daughter board is used to set up functional devices.

In a possible design, the second side of the daughter board is used to set up functional devices.

In the above two designs, since the bottom board and the daughter board have one side where functional devices can be placed, compared with the existing LGA module, the area of the circuit module is only the existing LGA module under the premise of the same functional devices. Half of the LGA module can significantly reduce the area of the circuit module, thereby significantly reducing the probability of warping of the circuit module due to the excessive area, thereby improving the qualification rate of the circuit module and reducing the production cost of the circuit module.

In a possible design, both the first side and the second side of the daughter board are used for setting functional devices.

In this design, because functional devices can be placed on one side of the bottom board and on both sides of the daughter board, compared with the existing LGA module, the area of the circuit module is only the existing LGA module under the premise that the functional devices need to be placed are the same. One-third of the LGA module, which can significantly reduce the area of the circuit module, thereby significantly reducing the probability of warping of the circuit module due to the excessive area, thereby improving the qualification rate of the circuit module and reducing the production cost of the circuit module .

In a possible design, pads are arranged on the first surface of the bottom plate, pads are arranged on the first surface of the frame board, and the first surface of the bottom plate and the first surface of the frame board are connected by bonding pads.

In a possible design, pads are provided on the first side of the daughter board, pads are provided on the second side of the frame board, and the first side of the daughter board and the second side of the frame board are connected by bonding pads.

In the above two designs, since the bottom plate, the frame plate and the sub-board can all be connected by bonding pads, the contact area between each other is large, which can ensure better heat dissipation performance. In addition, since the bottom board, the frame board and the daughter board can all be connected through the bonding pads, the firmness of the connection can be ensured. When the circuit module is applied to equipment such as vehicle-mounted equipment, the reliability of such equipment can be guaranteed .

In a possible design, the frame plate includes four sides, and the four sides are connected two by two to form a hollow square, and the frame plate is connected to the bottom plate and the sub-board through the four sides.

Through this design, it is possible to ensure better consistency of the thickness of the frame plate.

In one possible design, the frame board is composed of at least one printed circuit board PCB.

In one possible design, the frame board is composed of two PCBs, which are parallel to each other.

In a possible design, the frame board is composed of two PCBs, which are connected in an L shape.

In a possible design, the frame board is composed of two PCBs, which are connected in a T-shape.

In one possible design, the bottom plate is an LGA bottom plate.

In one possible design, the bottom plate is an LCC bottom plate.

In a possible design, the circuit module further includes a filling medium, which is filled between the bottom plate and the sub-board, and the filling medium is a medium with thermal conductivity.

In this design, by providing a filling medium with thermal conductivity in the circuit module, the heat dissipation performance of the circuit module can be greatly improved. At the same time, by adding a filling medium to the circuit module, the robustness and reliability of the circuit module can be greatly enhanced.

A second aspect of the embodiments of the present application provides a circuit module, which includes a sub board and a frame board. Wherein, the first surface and the second surface of the sub-board are both used for setting functional devices, and the first surface of the sub-board is attached to the second surface of the frame board.

The circuit module includes a frame board and a daughter board. Since functional devices can be placed on both sides of the daughter board, compared with the existing LGA module, under the premise that the functional devices need to be placed are the same, the area of the circuit module is only It is half of the existing LGA module. Because the circuit module can significantly reduce the area of the circuit module, it can significantly reduce the probability of warping of the circuit module due to the excessive area, thereby increasing the qualification rate of the circuit module and reducing The production cost of the circuit module.

In a possible design, the above-mentioned circuit module further includes a backplane. The first surface of the bottom plate is used for setting functional devices, the second surface of the bottom plate is used for signal connection, and the first surface of the bottom plate is connected to the first surface of the frame plate.

In one possible design, the bottom plate is an LGA bottom plate.

In one possible design, the bottom plate is an LCC bottom plate.

A third aspect of the embodiments of the present application provides an electronic device, which includes the circuit module described in the first aspect or the second aspect. Since the circuit modules described in the first and second aspects above have the advantages of reduced production costs, good heat dissipation performance, and good robustness, after they are applied to electronic equipment, the electronic equipment can also have low production costs, The advantages of good heat dissipation and solidity.

Description of the drawings

Figure 1 is a schematic diagram of the structure of an LGA module provided in the prior art;

2 is a schematic structural diagram of Embodiment 1 of the circuit module provided by this application;

Figure 3 is a side view of the first embodiment of the circuit module;

4 is a schematic structural diagram of Embodiment 2 of the circuit module provided by this application,

Figure 5 is a side view of the second embodiment of the circuit module;

6 is a schematic structural diagram of Embodiment 3 of the circuit module provided by this application;

Figure 7 is a side view of the third embodiment of the circuit module;

8 is a schematic structural diagram of Embodiment 4 of the circuit module provided by this application;

Figure 9 is a side view of the fourth embodiment of the circuit module;

10 is a schematic structural diagram of Embodiment 6 of a circuit module provided by this application;

11 is a schematic structural diagram of Embodiment 7 of the circuit module provided by this application;

FIG. 12 is a schematic structural diagram of Embodiment 8 of the circuit module provided by this application.

detailed description

Fig. 1 is a schematic structural diagram of an LGA module provided in the prior art, and the LGA module adopts a single-sided layout. Specifically, as shown in FIG. 1, the LGA includes two sides, one of which is the side where the PCB is located, and the functional devices of the LGA module are all placed on the PCB. The other side is the surface where the pads are located. No functional devices are placed on the surface where the pads are located, and only the pads are used to achieve signal connection with the motherboard and heat dissipation functions.

In the LGA module illustrated in Figure 1 above, since functional devices can only be placed on one side of the LGA module, if the LGA module requires more functional devices, the area of the LGA module needs to be designed in the module design Is large enough to ensure that all required functional devices can be placed. When the LGA module is processed and soldered by surface mount technology (SMT), the temperature during the soldering process is often higher. If the area of the LGA module is large, the LGA module may appear at a higher temperature. The warpage phenomenon will lead to a decrease in the yield rate during the production of circuit modules and an increase in production costs.

In addition to the LGA module shown in FIG. 1, the prior art also provides circuit modules in the form of "golden fingers" and board-to-board connectors. Among them, the "golden finger" module is connected to the motherboard through a plug-in part arranged at the edge of the module, which can support a double-sided layout. The circuit module in the form of board-to-board connector is plugged into the motherboard through the connector provided on the side of the module, which can also support double-sided layout. Although these two types of circuit modules can support double-sided layouts, the plugs and connectors generally use expensive gold-plated materials. Therefore, the use of these two types of circuit modules in electronic equipment will cause The cost of electronic equipment is too high. At the same time, these two types of circuit modules are plugged into the motherboard through a plug-in manner, so the contact area with the motherboard is small, so the heat dissipation performance is poor. In addition, the robustness of the plug-in method is lower than that of the welding method. Therefore, if these two types of circuit modules are applied to equipment such as vehicle-mounted devices, there may be a problem of poor reliability.

In summary, the prior art circuit module design methods all have defects. The technical solutions provided in the embodiments of the present application aim to solve these defects.

The circuit modules provided in the embodiments of the present application can be applied to various types of electronic devices. Exemplarily, these electronic devices may be mobile phones (or “cellular” phones), smart phones, self-service payment terminals, near field communication devices, etc., for example, vehicle-mounted devices, wearable devices, etc., for example, personal digital Assistant (personal digital assistant, PDA), artificial intelligence equipment, virtual reality/augmented reality/mixed reality equipment, terminal in the future 5G network or terminal equipment in the future evolution of the public land mobile network (PLMN) Etc., the embodiment of the present application does not limit this.

In addition, the circuit modules provided in the embodiments of the present application may be modules that implement various functions in the electronic device. In an example, the circuit module may be a communication module in an electronic device, and a radio frequency device or the like may be provided on the communication module for communicating with an external device. In another example, the circuit module may be a module that completes specific calculation processing in an electronic device. The embodiments of the present application do not limit the specific functions of the circuit module.

FIG. 2 is a schematic structural diagram of Embodiment 1 of the circuit module provided by this application, and FIG. 3 is a side view of Embodiment 1 of the circuit module. As shown in FIGS. 2 and 3, the above-mentioned circuit module includes a base plate 1, a frame plate 2 and a sub-board 3. Among them, the first surface 11 of the base plate 1 is used for setting functional devices, and the second surface 12 of the base plate 1 is used for signal connection. The first surface 21 of the frame plate 2 and the first surface 11 of the bottom plate 1 are attached and connected. The first surface 31 of the sub-board 3 is used for arranging functional devices, and the first surface 31 of the sub-board 3 and the second surface 22 of the frame board 2 are attached and connected.

In this embodiment, the functional devices on the sub-board 3 are arranged on the first surface 31, that is, the functional devices are arranged on the side close to the frame board 2.

In this embodiment, the second surface 32 of the sub-board 3 may be a vacant surface, that is, the second surface 32 of the sub-board 3 is not provided with functional devices or the like.

Optionally, in this embodiment, the functional devices can be arranged on the first surface of the base plate 1 and the first surface 31 of the sub-board 3 through SMT. In the following embodiments of the present application, functional devices can be set via SMT, which will not be described in detail below.

FIG. 4 is a schematic structural diagram of the second embodiment of the circuit module provided by this application, and FIG. 5 is a side view of the second embodiment of the circuit module, as shown in FIGS. 4 and 5, the above-mentioned circuit module includes a base plate 1, a frame plate 2 and a sub-board 3. Among them, the first surface 11 of the base plate 1 is used for setting functional devices, and the second surface 12 of the base plate 1 is used for signal connection. The first surface 21 of the frame plate 2 and the first surface 11 of the bottom plate 1 are attached and connected. The first surface 31 of the sub-board 3 is used for setting functional devices, and the second surface 32 of the sub-board 3 is attached to the second surface 22 of the frame board 2.

In this embodiment, the functional devices on the sub-board 3 are arranged on the second surface 32, that is, the functional devices are arranged on the side of the principle frame board 2.

In this embodiment, the first surface 31 of the sub-board 3 may be a vacant surface, that is, the first surface 31 of the sub-board 3 is not provided with functional devices or the like.

In the first and second embodiments described above, the two sides of the frame plate 2 are respectively attached to the bottom plate 1 and the sub-board 3 to realize the signal connection between the bottom plate 1 and the sub-board 3.

Optionally, in addition to providing functional devices on the first surface 11 of the base plate 1, pads may also be provided in areas other than the area where the functional devices are placed. Exemplarily, as shown in FIG. 2 and FIG. 4, if functional devices are placed in the middle area of the first surface 11 of the base plate 1, then pads can be arranged in the peripheral edge area to be attached to the frame board 2.

Correspondingly, the first surface 21 of the frame board 2 is also provided with pads, and the first surface 11 of the bottom plate 1 and the first surface 21 of the frame board 2 are welded together by the pads, so as to achieve a bonding connection.

Optionally, the first surface 31 of the daughter board 3 may be welded to the second surface 22 of the frame board 2 by setting pads to achieve a fit connection. Exemplarily, as shown in Fig. 2 above, in addition to providing functional devices on the first surface 31 of the sub-board 3, pads can also be provided in areas other than the area where the functional devices are placed. Correspondingly, the second surface 22 of the frame board 2 is also provided with pads, and the first surface 31 of the sub-board 3 and the second surface 22 of the frame board 2 are welded together by the pads, so as to achieve a bonding connection.

In the first and second embodiments described above, the frame plate 2 may include four sides, which are connected two by two to form a hollow square, and the frame plate 2 is connected to the bottom plate 1 and the sub-board 3 through the four sides. Taking base plate 1 as an example, when functional devices are installed on the base plate 1, because the functional devices have a certain height, after the functional devices are installed, they will be higher than the surface of the base plate 1. By setting the frame plate 2 into a hollow square shape, The functional devices of the bottom plate 1 penetrate into the hollow part of the frame plate 2 so as not to affect the bonding of the pads of the bottom plate 1 and the pads of the frame plate 2.

Optionally, on the first surface 21 of the frame board 2, a pad is provided on each of the four sides, and the pads on the four sides are soldered to the pads on the first surface 11 of the base plate 1. . In the specific implementation process, the positions of the pads on the first side 11 of the bottom plate 1 can be determined in advance according to the width of the four sides of the frame plate 2 to ensure that the positions of the pads on the first side 11 of the bottom plate 1 are the same as those of the frame plate 2. The positions of the pads on the first surface 21 are the same.

Optionally, on the second surface 22 of the frame board 2, a pad is also provided on each of the four sides, and the pads on the four sides are welded to the first surface 31 of the daughter board 3. Disk welding. In the specific implementation process, the positions of the pads on the first surface 31 of the sub-board 3 can be determined in advance according to the width of the four sides of the frame board 2 to ensure that the position of the pads on the first surface 31 of the sub-board 3 is consistent with that of the frame board. The positions of the pads on the second side 22 of 2 are the same.

Optionally, in each embodiment of the present application, when welding the bottom plate 1 and the frame plate 2, and the frame plate 2 and the sub-board 3, SMT can be used for welding.

In a specific embodiment, a PCB can be used as a frame board. Corresponding to this embodiment, the PCB can be processed into the hollow square as shown in FIG. 2 or FIG. 4, and pads are provided on each side of each side of the square. In this embodiment, the frame board 2 is an integral PCB. Through such a design, the thickness of the frame board 2 can be better consistent.

Optionally, in the embodiments of the present application, the shapes of the bottom plate, the sub-board, and the frame plate can all be the same, and the size can also be the same, so that the dimensions of the circuit module formed after the three are attached and connected are the same, which is convenient for the circuit. The application of the module in electronic equipment. In addition, the shapes of the bottom plate, the sub-board and the frame plate may be rectangular or square, and the embodiment of the present application does not specifically limit the specific shapes of the three. In the following embodiments of the present application, the circuit modules can be implemented in this manner, and details are not described herein again.

Optionally, the backplane 1 may be an LGA backplane. When the backplane 1 is an LGA backplane, in the pads on the second surface 12 of the backplane 1, the signal pins and ground pins are both set inside the backplane, not on the backplane the edge of. Alternatively, the backplane 1 can also be a leadless chip carrier (LCC). When the backplane 1 is an LCC backplane, the signal pins and ground pins can be set in the pads on the second surface 12 of the backplane 1 In the edge area of the bottom plate. In the following embodiments of the present application, the bottom plate 1 can be set in the above-mentioned two ways, and will not be repeated.

In the above-mentioned embodiment and the second embodiment, the circuit module includes a bottom board, a frame board and a sub-board. The bottom board and the sub-board each have one side where functional devices can be placed. At the same time, the bottom board and the sub-board can be signal connected through the frame board. Each has one side where functional devices can be placed. Therefore, compared with the existing LGA module, under the premise that the functional devices to be placed are the same, the area of the circuit module of this embodiment is only half of that of the existing LGA module. For example, the area of the circuit module can be significantly reduced, and therefore, the probability of warping of the circuit module due to the excessive area can be significantly reduced, thereby improving the pass rate of the circuit module and reducing the production cost of the circuit module.

Further, in this embodiment, the bottom plate, the frame plate and the sub-board can all be connected by bonding pads. Therefore, the contact area between each other is large, which can ensure better heat dissipation performance. In addition, since the bottom board, the frame board and the daughter board can all be connected through the bonding pads, the firmness of the connection can be ensured. When the circuit module is applied to equipment such as vehicle-mounted equipment, the reliability of such equipment can be guaranteed .

Fig. 6 is a schematic structural diagram of the third embodiment of the circuit module provided by this application, and Fig. 7 is a side view of the third embodiment of the circuit module. As shown in Figs. 6 and 7, the above-mentioned circuit module includes a base plate 1, a frame plate 2, and a sub-board 3. Among them, the first surface 11 of the base plate 1 is used for setting functional devices, and the second surface 12 of the base plate 1 is used for signal connection. The first surface 21 of the frame plate 2 and the first surface 11 of the bottom plate 1 are attached and connected. The first surface 31 of the sub-board 3 is used for arranging functional devices, and the first surface 31 of the sub-board 3 and the second surface 22 of the frame board 2 are attached and connected. At the same time, in this embodiment, the second surface 32 of the sub-board 3 is also used for setting functional devices.

In this embodiment, the two sides of the frame plate 2 are respectively attached to the bottom plate 1 and the sub-board 3, so as to realize the signal connection between the bottom plate 1 and the sub-board 3.

In addition, in this embodiment, pads can be provided on the first surface 11 of the base plate 1, the first surface 21 and the second surface 22 of the frame plate 2, and the first surface 31 of the sub-board 3 to realize the connection between the base plate 1 and For the bonding connection of the frame board 2 and the bonding connection between the frame board 2 and the sub-board 3, the specific connection method is the same as that in the above-mentioned first embodiment. You can refer to the above-mentioned first embodiment, and will not be repeated here.

In addition, in this embodiment, the frame plate 2 can be set in a hollow square shape, and the specific setting method is the same as that of the above-mentioned first embodiment. You can refer to the above-mentioned first embodiment, which will not be repeated here.

In a specific embodiment, a PCB can be used as a frame board. Corresponding to this embodiment, the PCB can be processed into a hollow square as shown in FIG. 6 above, and pads can be provided on each side of each side of the square. In this embodiment, the frame board 2 is an integral PCB. Through such a design, the thickness of the frame board 2 can be better consistent. .

In this embodiment, the circuit module includes a bottom board, a frame board, and a sub-board. Among them, one side of the bottom board can place functional devices, and both sides of the sub-board can place functional devices. Therefore, compared with the existing LGA module, the On the premise that the functional devices are the same, the area of the circuit module of this embodiment is only one-third of that of the existing LGA module. Since this embodiment can significantly reduce the area of the circuit module, the circuit module can be made too large due to its area. The probability of warping is significantly reduced, thereby improving the pass rate of the circuit module and reducing the production cost of the circuit module.

FIG. 8 is a schematic structural diagram of the fourth embodiment of the circuit module provided by this application, and FIG. 9 is a side view of the fourth embodiment of the circuit module. As shown in FIGS. 8 and 9, the above-mentioned circuit module includes a frame board 2 and a sub-board 3. Wherein, the first surface 31 and the second surface 32 of the sub-board 3 are both used for setting functional devices, and the first surface 31 of the sub-board 3 is attached to and connected to the second surface 22 of the frame board 2.

In this embodiment, the first surface 21 of the frame plate 2 can be used for signal connection. Specifically, pads may be provided on the first surface 21 of the frame board 2 to make signal connections with other components on the electronic device.

In addition, in this embodiment, both the second surface 22 of the frame board 2 and the first surface 31 of the daughter board 3 can be provided with pads to realize the bonding connection between the frame board 2 and the daughter board 3. The specific connection method is It is the same as in the first embodiment and the second embodiment, and can refer to the first embodiment, which will not be repeated here.

In addition, in this embodiment, the frame plate 2 can be set in a hollow square shape, and the specific setting method is the same as the above-mentioned Embodiment 1 and Embodiment 2, and can refer to the above-mentioned Embodiment 1 or Embodiment 2, which will not be repeated here.

In a specific embodiment, a PCB can be used as a frame board. Corresponding to this embodiment, the PCB can be processed into the hollow square shown in FIG. 8 above, and pads can be provided on each side of each side of the square. In this embodiment, the frame board 2 is an integral PCB. Through such a design, the thickness of the frame board 2 can be better consistent. .

In this embodiment, the circuit module includes a frame board and a sub board, where functional devices can be placed on both sides of the sub board, and at the same time, one side of the sub board is attached to the frame board. Since functional devices can be placed on both sides of the daughter board, compared with the existing LGA module, under the premise that the functional devices that need to be placed are the same, the area of the circuit module of this embodiment is only half that of the existing LGA module. This embodiment can significantly reduce the area of the circuit module. Therefore, the probability of warping of the circuit module due to the excessive area can be significantly reduced, thereby improving the qualification rate of the circuit module and reducing the production cost of the circuit module.

Furthermore, in this embodiment, the frame board and the sub-board can be connected by bonding pads. Therefore, the contact area between each other is large, which can ensure better heat dissipation performance. In addition, since the bottom board, the frame board and the daughter board can all be connected through the bonding pads, the firmness of the connection can be ensured. When the circuit module is applied to equipment such as vehicle-mounted equipment, the reliability of such equipment can be guaranteed .

On the basis of the fourth embodiment described above, further, in the fifth embodiment of the present application, the circuit module may further include the base plate 1. The first surface 11 of the base plate 1 is used for setting functional devices, the second surface 12 of the base plate 1 is used for signal connection, and the first surface 11 of the base plate 1 and the first surface 21 of the frame plate 2 are attached and connected. As a result, the structure shown in FIGS. 6 and 7 is formed.

It is worth noting that, in this embodiment, the first surface 21 of the frame plate 2 is no longer used for signal connection, but is used for bonding connection with the first surface 11 of the bottom plate 1, and at the same time, the second surface of the bottom plate 1 Surface 12 makes signal connections.

The specific settings and connection manners of this embodiment are the same as those of the third embodiment, which can be referred to the third embodiment, which will not be repeated here.

In this embodiment, in addition to the frame board and the daughter board, the circuit module also includes a bottom board. One side of the bottom board can place functional devices, and both sides of the daughter board can place functional devices. Therefore, compared with the existing LGA module, it needs Under the premise that the functional devices are the same, the area of the circuit module of this embodiment is only one third of that of the existing LGA module. Since this embodiment can significantly reduce the area of the circuit module, it can make the circuit module excessively large. The probability of warping is significantly reduced, which improves the pass rate of the circuit module and reduces the production cost of the circuit module.

In the above embodiments, the frame plate 2 is a hollow square as an example for description, that is, in the above embodiments, the frame plate 2 is an integral structure. In the specific implementation process, the structure of the frame plate 2 may not be limited to the structure described in the foregoing embodiments.

Optionally, the frame board 2 may consist of at least one PCB.

In an optional manner, the frame board 2 may be a PCB. The length of the PCB can be the same as the length of one side of the bottom board 1 or the daughter board 3 to which the PCB is connected. The thickness of the PCB can be greater than the sum of the heights of the functional devices placed on the bottom board 1 and the sub-board 3.

FIG. 10 is a schematic structural diagram of Embodiment 6 of the circuit module provided by this application. As shown in FIG. 10, the frame board 2 is a PCB, and both sides of the PCB are provided with pads, and are respectively connected to the first surface 11 of the base plate 1. And the first surface 31 of the daughter board 3 is attached and connected.

In another alternative, the frame board 2 can be composed of two PCBs. The two PCBs may be parallel to each other, or the two PCBs may be connected in an L shape, or the two PCBs may be connected in a T shape, or the two PCBs may be connected in a cross shape. The lengths of the two PCBs may be the same as the lengths of the sides of the bottom board 1 or the sub-board 3 to which the two PCBs are connected. The thickness of the PCB can be greater than the sum of the heights of the functional devices placed on the bottom board 1 and the sub-board 3.

FIG. 11 is a schematic structural diagram of Embodiment 7 of the circuit module provided by this application. As shown in FIG. 11, the frame board is composed of two PCBs, which are parallel to each other and opposite to the first surface 11 of the base plate 1. The two sides are attached and connected, and at the same time, are attached and connected to the two opposite sides of the first surface 31 of the sub-board 3.

FIG. 12 is a schematic structural diagram of Embodiment 8 of the circuit module provided by this application. As shown in FIG. 11, the frame board is composed of two PCBs, which are connected in an L-shape, and are connected to the first side 11 of the bottom plate 1 Adjacent two sides are attached and connected, and at the same time, are attached and connected to the adjacent two sides of the first surface 31 of the sub-board 3.

In addition to the structures shown in Figures 10, 11, and 12, in another alternative embodiment, the frame board 2 is composed of two PCBs, and the two PCBs can be connected in a T-shape. The board 2 is attached and connected to the first surface 11 of the bottom plate, and at the same time, is attached and connected to the first surface 31 of the sub-board 3.

It is worth noting that the above-mentioned Figures 10, 11, and 12 are obtained by replacing the frame plate 2 on the basis of the above-mentioned Embodiment 3. In the specific implementation process, the above-mentioned Embodiment 1 and Embodiment 2. On the basis of the fourth embodiment and the fifth embodiment, the frame plate 2 is replaced, and the replacement method can refer to the above-mentioned FIG. 10, FIG. 11, and FIG.

In another embodiment, the circuit module provided in the embodiment of the present disclosure further includes a filling medium.

Optionally, in the above-mentioned Embodiment 1, Embodiment 2, Embodiment 3, Embodiment 5, Embodiment 6, Embodiment 7 and Embodiment 8, the above-mentioned filling medium may be filled between the bottom plate 1 and the sub-board 3. Specifically, it can be filled in the gap between the bottom plate 1 and the sub-board 3.

Optionally, in the third embodiment, the above-mentioned filling medium may be filled between the first surface 31 of the sub-board 3 and the first surface 21 of the frame plate 2, that is, the filling range of the filling medium does not exceed the edge of the frame plate.

Optionally, the aforementioned filling medium may be a medium with thermal conductivity.

By arranging a filling medium with thermal conductivity in the circuit module, the heat dissipation performance of the circuit module can be greatly improved. At the same time, by adding a filling medium to the circuit module, the robustness and reliability of the circuit module can be greatly enhanced.

Claims

A circuit module, which is characterized by comprising: a bottom board, a frame board and a sub board;

The first surface of the bottom board is used for setting functional devices, and the second surface of the bottom board is used for signal connection;

The first surface of the bottom plate and the first surface of the frame plate are in a fit connection;

The first surface of the sub-board is attached to the second surface of the frame board, and at least one surface of the sub-board is used for setting functional devices.
The circuit module according to claim 1, wherein the first surface of the sub-board is used for setting functional devices.
The circuit module according to claim 1, wherein the second surface of the sub-board is used for setting functional devices.
The circuit module according to claim 1, wherein both the first surface and the second surface of the sub-board are used for setting functional devices.
The circuit module according to any one of claims 1-4, wherein a pad is provided on a first surface of the bottom plate, a pad is provided on a first surface of the frame plate, and a pad is provided on the first surface of the bottom plate. It is connected to the first surface of the frame board through bonding pads.
The circuit module according to any one of claims 1-5, wherein a pad is provided on a first surface of the sub-board, a pad is provided on a second surface of the frame board, and a pad is provided on the second surface of the sub-board. One side is connected to the second side of the frame board through bonding pads.
The circuit module according to any one of claims 1-6, wherein the frame board includes four sides, and the four sides are connected by two to form a hollow square shape, and the frame board is connected to each other through the four sides. The bottom plate and the daughter board are connected.
The circuit module according to any one of claims 1-6, wherein the frame board is composed of at least one printed circuit board (PCB).
The circuit module according to claim 8, wherein the frame board is composed of two PCBs, and the two PCBs are parallel to each other.
The circuit module according to claim 8, wherein the frame board is composed of two PCBs, and the two PCBs are connected in an L shape.
The circuit module according to claim 8, wherein the frame board is composed of two PCBs, and the two PCBs are connected in a T-shape.
The circuit module according to any one of claims 1-11, wherein the backplane is a large-scale grounded array LGA backplane.
The circuit module according to any one of claims 1-11, wherein the backplane is a leadless chip carrier LCC backplane.
The circuit module according to any one of claims 1-13, wherein the circuit module further comprises: a filling medium;

The filling medium is filled between the bottom plate and the sub-board;

The filling medium is a medium with thermal conductivity.
An electronic device, characterized in that it comprises the circuit module according to any one of claims 1-14.