WO2020135729A1

WO2020135729A1 - Vehicle-mounted power supply structure and circuit board layout structure thereof

Info

Publication number: WO2020135729A1
Application number: PCT/CN2019/129246
Authority: WO
Inventors: 刘宇; 王超
Original assignee: 比亚迪股份有限公司
Priority date: 2018-12-29
Filing date: 2019-12-27
Publication date: 2020-07-02
Also published as: CN209593902U

Abstract

A vehicle-mounted power supply structure (200) and a circuit board layout structure thereof (100). The circuit board layout structure (100) comprises a main PCB board (4), a first separator (10), a magnetic element module (20), and a switch tube module (30), the first separator (10) is fixed on the main PCB board (4), the magnetic element module (20) is located on one side of the first separator (10), the switch tube module (30) is located on the other side of the first separator (10), and both the magnetic element module (20) and the switch tube module (30) are fixed and electronically connected to the main PCB board (4).

Description

Vehicle-mounted power supply structure and circuit board layout structure

Cross-reference of related applications

This disclosure is based on a Chinese patent application with an application number of 201822279126.3 and an application date of December 29, 2018, and claims the priority of the Chinese patent application. The entire contents of the Chinese patent application are hereby incorporated by reference.

Technical field

The present disclosure relates to the technical field of electric vehicles, and more particularly, to a vehicle-mounted power supply structure and its circuit board layout structure.

Background technique

The electrical layout of the switching power supply of electric vehicles is an important link in the early stage of product development, and the layout design and peripheral structure design of the device are basically centered on the PCB. As shown in FIG. 1, most switching power supplies on the market are arranged on a single board plane, and all electronic devices 16 are soldered on the first PCB board 4, and then a shell 15 is added externally; or as shown in FIG. 2. With an upper and lower layer arrangement structure, a part of the electronic device 16 is soldered on the first PCB board 4, another part of the electronic device 16 is soldered on the second PCB board 5, and then an external case 15 is added. Interference between components soldered on the same PCB board will affect the overall performance of the vehicle power supply.

Summary of the invention

The present disclosure provides a circuit board layout structure to solve the technical problem existing in the prior art that interference occurs between components soldered on the same PCB board.

To achieve the above objective, the technical solution adopted by the present disclosure is to provide a circuit board layout structure including a main PCB board, a first isolator, a magnetic element module and a switch tube module, the first isolator is fixed on the main On the PCB, the magnetic element module is located on one side of the first isolator, the switch tube module is located on the other side of the first isolator, the magnetic element module and the switch tube module are both fixed And it is electrically connected to the main PCB board.

The beneficial effect of a circuit board layout structure provided by the present disclosure is that, compared with the prior art, the isolated PCB board of the present disclosure has the function of shielding the magnetic field, ensuring the normal operation of the switch tube module. By separating the PCB board, the switch tube module and the magnetic element module are separated, so that the switch tube module is not easy to generate magnetic field coupling and near field coupling under the action of the magnetic field of the magnetic element module.

The present disclosure also provides a vehicle-mounted power supply structure to solve the technical problems existing in the prior art that magnetic devices soldered on the same PCB board are likely to affect each other, and to optimize the performance of the vehicle-mounted power supply.

Other features and advantages of the present disclosure will be described in detail in the detailed description section that follows.

BRIEF DESCRIPTION

The drawings are used to provide a further understanding of the present disclosure, and constitute a part of the specification, together with the following specific embodiments to explain the present disclosure, but do not constitute a limitation of the present disclosure. In the drawings:

Figure 1 is a structural schematic diagram 1 of the prior art;

FIG. 2 is a schematic structural diagram 2 of the prior art;

3 is a schematic structural diagram of a circuit board layout structure provided by an embodiment of the present disclosure;

4 is a schematic structural diagram 1 of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure;

5 is a second structural diagram of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure;

6 is a schematic diagram of an explosion structure of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure;

7 is a schematic structural diagram 1 of a box of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure;

8 is a schematic structural diagram of a control PCB board of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure;

9 is a second schematic structural diagram of a car body structure provided by an embodiment of the present disclosure;

10 is a schematic structural diagram of a U-shaped sheet of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure.

detailed description

In order to make the technical problems, technical solutions, and beneficial effects to be solved by the present disclosure more clear, the disclosure will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present disclosure and are not intended to limit the present disclosure.

It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "Bottom", "Inner", "Outer", etc. indicate the orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, just to facilitate the description of the present disclosure and simplify the description, rather than indicating or implying the device Or elements must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as limiting the present disclosure.

In addition, the terms "first" and "second" are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless specifically defined otherwise.

Referring to FIG. 3, a circuit board layout structure 100 provided by the present disclosure will now be described. A circuit board layout structure 100 includes a main PCB board 4, a first isolator 10, a magnetic element module 20 and a switch tube module 30, and the first isolator 10 is an isolating PCB board 6. The magnetic element module 20 includes a transformer module 421 and an inductance module 422. The switch tube module 30 includes several identical switch tubes 424. The isolation PCB board 6 is vertically or obliquely arranged on the main PCB board 4, at least two isolation PCB boards 6 are oppositely arranged, and the switch tube 424 or the transformer module 421 and the inductance module 422 are arranged between the oppositely separated isolation PCB boards 6, In some embodiments of the present disclosure, the switch tube 424 is disposed between the oppositely arranged isolation PCB boards 6, and the transformer module 421 and the inductance module 422 are both disposed outside the isolation PCB board 6.

Compared with the prior art, the circuit board layout structure 100 provided by the present disclosure has the effect of shielding the magnetic field of the PCB board 6 while ensuring the normal operation of the switch tube 424. The isolation PCB board 6 separates the switch tube 424 from the transformer module 421 and the inductor module 422, so that the switch tube 424 is not easily affected by the magnetic fields of the inductor module 422 and the transformer module 421 and magnetic field coupling and near-field coupling occur. The two isolation PCB boards 6 enclose the switch tube 424 better, so that the switch tube 424 is located in a space with less magnetic field.

In some embodiments of the present disclosure, the transformer module 421 includes a plurality of closely-coupled transformers 4211, and the inductance module 422 includes a plurality of closely-coupled inductive components 4221.

In some embodiments of the present disclosure, the switch tube 424 is disposed on the main PCB board 4 or the isolation PCB board 6. When the switch tube 424 is disposed on the isolation PCB board 6, the use of the space of the main PCB board 4 is reduced, and it is convenient for the main PCB board 4 to set other components.

In some embodiments of the present disclosure, the isolation PCB 6 is provided with eight copper skin layers. The copper skin has a good magnetic field shielding effect.

In some embodiments of the present disclosure, please refer to FIG. 3, as a specific implementation of a circuit board layout structure 100 provided by the present disclosure, a second isolator 43 is provided between the transformer module 421 and the inductance module 422, The second isolator 43 is a capacitor module 423. The capacitor module 423 is disposed on the circuit board, and the circuit board is the main PCB board 4. The capacitor module 423 includes a capacitor PCB 9 and a plurality of capacitor elements 4231. The capacitor PCB 9 is fixed to the main PCB 4 vertically or obliquely, and the capacitor PCB 9 is electrically connected to the main PCB 4.

The magnetic field between the transformer module 421 and the inductor module 422 will affect each other. The capacitor module 423 and the capacitor PCB 9 block the magnetic field between the transformer module 421 and the inductor module 422, so that the magnetic field between the transformer module 421 and the inductor module 422 is weakened. The capacitor PCB 9 has a shielding function, which further prevents the transformer module 421 and the inductor module 422 from easily affecting each other. At the same time, the capacitive PCB board 9 utilizes the vertical space of the main PCB board 4 to enable the main PCB board 4 to solder more capacitive elements 4231, reducing the overall volume of the vehicle power supply. The cooperation of the capacitor PCB 9 and the capacitor element 4231 greatly reduces the influence between the transformer module 421 and the inductor module 422.

In some embodiments of the present disclosure, the capacitor PCB 9 is provided with eight copper skin layers.

In some embodiments of the present disclosure, the height of the capacitor PCB 9 is higher than the heights of the transformer module 421 and the inductor module 422.

In some embodiments of the present disclosure, please refer to FIG. 3, as a specific implementation of a circuit board layout structure 100 provided by the present disclosure, it also includes a powered heating module provided on the main PCB 4 and fixed on the capacitor The packaging surface of the capacitive element 4231 on the PCB 9 faces the outside of the energized heating module.

The inductance module 422 emits heat during use, and the packaging surface of the capacitive element 4231 on the capacitor PCB 9 faces the outer side of the energized heating module, which is convenient for reducing the influence of the energized heating module on the capacitor module 423.

In some embodiments of the present disclosure, the power-on heating module is a transformer module 421.

In some embodiments of the present disclosure, at least two energized heating modules are provided, and at least two energized heating modules generate different heat at the same time when energized, and the packaging surface of the capacitive element 4231 fixed on the capacitor PCB 9 Towards a low-temperature energized heating module.

In some embodiments of the present disclosure, please refer to FIG. 3, as a specific implementation of a circuit board layout structure 100 provided by the present disclosure, the pins of the capacitive element 4231 are vertically connected on the capacitive PCB board 9, and a number of capacitors The components 4231 are aligned on the capacitor PCB 9.

The capacitive elements 4231 are closely arranged on the capacitive PCB board 9 to improve the space utilization rate on the capacitive PCB board 9.

In some embodiments of the present disclosure, several capacitive elements 4231 are aligned in rows or columns.

In some embodiments of the present disclosure, the capacitor PCB 9 is provided with a first jack 91 and a second jack 92, the first jack 91 is used to connect a pin of the capacitive element 4231, and the second jack 92 is used It is connected to the other pin of the capacitive element 4231. The first insertion hole 91 and the second insertion hole 92 are provided in plurality, the plurality of first insertion holes 91 are provided in rows, and the plurality of second insertion holes 92 are provided in rows. When it is necessary to install or remove the capacitor, it is very convenient to insert or remove the capacitor element 4231 from the capacitor PCB 9.

In some embodiments of the present disclosure, please refer to FIG. 3, as a specific implementation of a circuit board layout structure 100 provided by the present disclosure, at least two sets of aligned capacitive elements 4231 are provided on the same capacitor PCB 9 At least two sets of aligned capacitive elements 4231 are provided with isolation plates 93, which are fixed on the main PCB board 4.

At least two groups of aligned capacitive elements 4231 of the isolation plate 93 are not likely to affect each other. At the same time, the isolation board 93 plays a role of supporting the capacitor PCB 9, so that the capacitor PCB 9 is stably connected to the main PCB 4.

In some embodiments of the present disclosure, the capacitive element 4231 is a chip capacitor.

In some embodiments of the present disclosure, the package of the capacitive element 4231 is a rectangular package.

In some embodiments of the present disclosure, please refer to FIG. 3, as a specific implementation of a circuit board layout structure 100 provided by the present disclosure, the capacitor module 423 further includes a cylindrical capacitor 4232, and the cylindrical capacitor 4232 is disposed in two Between isolated PCB boards 6.

The cylindrical capacitor 4232 is provided between the isolated PCB boards 6, so as to make full use of the area between the two isolated PCB boards 6, so that more components are soldered on the main PCB board 4.

Please refer to FIG. 4 to FIG. 10, the present disclosure also provides a vehicle power supply structure 200.

A vehicle power supply structure 200, as shown in FIGS. 4 and 5, includes a cabinet 1, a shielding plate 2, a water cooling mechanism 3, a main PCB board 4, a control PCB board 5, a power device 41, a non-power device 51, a low voltage The current signal device 52 and the high-voltage large-current signal device 42, the shielding plate 2 is provided in the cabinet 1, and the cabinet 1 is divided into the first area 11 and the second area 12 by the shielding plate 2, the first area 11 and the second area 12 Connected; the water cooling mechanism 3 is provided on the shielding plate 2 or/and the inner wall of the cabinet 1, the water cooling mechanism 3 radiates heat to at least one of the first area 11 and the second area 12; the main PCB board 4 and the control PCB board 5 Electrically connected, the main PCB board 4, the power device 41 and the high-voltage high-current signal device 42 are arranged in the first region 11, the control PCB board 5, the non-power device 51 and the low-voltage low-current signal device 52 are arranged in the second region 12, the power device 41 and the high-voltage high-current device 42 are electrically connected to the main PCB board 4, and the non-power device 51 and the low-voltage low-current signal device 52 are electrically connected to the control PCB board 5.

By adding a water cooling mechanism 3 and a shielding plate 2, the low voltage and small current signal device 52 and the high voltage and high current signal device 42 are separated, which prevents the high voltage and high current signal device 42 from being interfered by a weak signal and solves the EMC problem. The water cooling mechanism 3 simultaneously dissipates heat in the first area 11 and the second area 12, which provides a new way for heat dissipation in the cabinet 1 and thus speeds up the heat dissipation in the cabinet 1. The power device 41 has a small volume and is soldered on the main PCB 4 in a unified manner, so that the space in the first area 11 is fully utilized, and the space utilization rate is high, which helps to solve the power density problem of the electrical layout.

In some embodiments of the present disclosure, the water cooling mechanism 3 simultaneously dissipates heat to the first area 11 and the second area 12.

In some embodiments of the present disclosure, the shielding plate 2 is integrally formed with the box 1. The main PCB board 4 and the control PCB board 5 are arranged parallel to the shielding board 2. The box 1 is provided with a first opening 13 for placing the main PCB 4 in the first area 11. The cabinet 1 is provided with a second opening 14 for placing the control PCB 5 in the second area 12. The water cooling mechanism 3 is a metal mechanism. The switch tube 424 is a MOS tube, four MOS tubes are electrically connected to form an H bridge, and two MOS tubes are electrically connected to form a half bridge.

In some embodiments of the present disclosure, the control PCB board 5, the isolation PCB board 6, and the main PCB board 4 cooperate to perform signal acquisition, driving, control, communication, power transmission, and the like.

In some embodiments of the present disclosure, please refer to FIG. 6 and FIG. 7 together. As a specific embodiment of a vehicle-mounted power supply structure 200 provided by the present disclosure, the water cooling mechanism 3 includes a cooling tank 31, a water inlet pipe 32, and drainage The tube 33 and the sealing cover 34; the cooling tank 31 is provided with a water inlet 36 and a drain 37, the water inlet 36 and the drain 37 are located in the first area 11; the water inlet 32 is connected to the water inlet 36, and the drain 33 is connected to the drain Port 37; the cooling tank 31, the water inlet pipe 32 and the drain pipe 33 are all provided on the shielding plate 2 and integrally formed with the shielding board 2, the water inlet pipe 32, the drain pipe 33 and the cabinet 1 are integrally formed, the water inlet pipe 32 and the drain pipe 33 The cooling tank 31 is communicated with the outside of the case 1, and the sealing cover 34 is hermetically connected to the opening of the cooling tank 31.

The water inlet pipe 32 and the drain pipe 33 facilitate water inflow and water outflow, so that the cooling water in the cooling tank 31 is flowed, so that the heat in the first area 11 and the second area 12 can be quickly taken away, and the speed of heat dissipation is improved.

In some embodiments of the present disclosure, the opening of the cooling groove 31 is located in the first region 11 or the second region 12.

In some embodiments of the present disclosure, the sealing cover 34 is welded at the opening of the cooling groove 31.

In some embodiments of the present disclosure, a number of grid plates 35 are provided in the cooling tank 31, and the grid plates 35 are spaced apart. The grid plate 35 slows down the flow rate of the cooling water entering the cooling tank 31, so that the cooling water can absorb enough heat.

In some embodiments of the present disclosure, please refer to FIGS. 6 to 8. As a specific implementation of an on-vehicle power supply structure 200 provided by the present disclosure, the low-voltage small current signal device 52 includes a DC filter 521 and an AC filter 522. The shielding plate 2 or the box 1 is provided with a first groove 21 and a second groove 22. The water cooling mechanism 3 is located between the first groove 21 and the second groove 22. In some embodiments, the cooling groove 31 is located between the first groove 21 and the second groove 22. The DC filter 521 is located in the first groove 21 or the second groove 22, and the AC filter 522 is located in the second groove 22 or the first groove 21.

The cooling tank 31 isolates the DC filter 521 and the AC filter 522 so that the DC filter 521 and the AC filter 522 are less likely to interfere with each other.

In some embodiments of the present disclosure, the first groove 21 and the second groove 22 are integrally provided on the shielding plate 2.

In some embodiments of the present disclosure, the first groove 21 and the second groove 22 are covered with a sealing plate 23, and the wiring between the DC filter 521, the AC filter 522 and the control PCB 5 passes through the sealing plate 23. The sealing plate 23 allows the DC filter 521 and the AC filter 522 to be disposed in the relatively sealed first groove 21 or the second groove 22, which greatly reduces the mutual interference between the DC filter 521 and the AC filter 522.

In some embodiments of the present disclosure, the low voltage small current signal device 52 includes a battery pack module 523 DC filter 521 and an AC filter 522.

The non-power device 51 includes a battery pack module 523 DC filter 521 and an AC filter 522.

In some embodiments of the present disclosure, the high-voltage high-current signal device 42 includes a transformer module 421, an inductor module 422, and a capacitor module 423. The power device 41 is a switch 424.

In some embodiments of the present disclosure, the box 1 is a metal body.

In some embodiments of the present disclosure, please refer to FIG. 3 and FIG. 10, as a specific embodiment of a vehicle-mounted power supply structure 200 provided by the present disclosure, the relative arrangement of the control PCB board 5 and the shielding board 2 and the power device 41 are provided On the isolated PCB 6, the power device 41 is in contact with the water cooling mechanism 3 through the heat conduction mechanism 7.

The switch tube 424 easily generates a large amount of heat during use. The water cooling mechanism 3 rapidly cools the switch tube 424 to ensure the working performance of the switch tube 424. The heat-conducting mechanism 7 facilitates the rapid transfer of the heat from the switch tube 424 to the water-cooling mechanism 3 so that the heat is directionally transferred, thereby ensuring the speed of heat dissipation.

In some embodiments of the present disclosure, please refer to FIG. 3 and FIG. 10, as a specific embodiment of an in-vehicle power supply structure 200 provided by the present disclosure, further includes an elastic mechanism 8 through which the power device 41 interferes with Heat conduction mechanism 7. The power device 41 is a switch 424.

It is ensured that the switch tube 424 can be in good contact with the heat conduction mechanism 7, so that the connection between the switch tube 424 and the water cooling mechanism 3 is not easily affected by the environment and is disconnected. During driving, the on-board power supply vibrates due to the bumps of the vehicle, and the elastic mechanism 8 counteracts the impact of the vibration on the switch tube 424.

In some embodiments of the present disclosure, the heat conduction mechanism 7 is a heat conduction plate. The heat conduction plate is placed between the water cooling mechanism 3 and the switch tube 424.

In some embodiments of the present disclosure, the elastic mechanism 8 may be a spring or a bending piece. The spring or bending piece has a better ability to restore deformation.

In some embodiments of the present disclosure, please refer to FIGS. 3 to 10. As a specific embodiment of a vehicle power supply structure 200 provided by the present disclosure, the elastic mechanism 8 includes a grid baffle 81, a U-shaped sheet 82 and a fixed On the elastic sheet 83 outside the U-shaped sheet 82, the grid barrier 81 is fixed on the main PCB board 4, and the grid barrier 81 may be vertically arranged on the main PCB board 4. The side of the grid baffle 81 is located inside the U-shaped piece 82, and the elastic piece 83 abuts against the switch tube 424.

The grid baffle 81 is connected to the main PCB board 4 so that the elastic mechanism 8 is not easily separated from the main PCB board 4. The U-shaped piece 82 is connected to the grid baffle 81 to facilitate the installation and removal of the elastic piece 83. The elastic piece 83 makes the switch tube 424 interfere with the heat conduction mechanism 7, and the structure is simple and very practical. The U-shaped sheet 82 and the elastic sheet 83 may be integrally formed.

In some embodiments of the present disclosure, please refer to FIGS. 3 and 10. As a specific embodiment of a vehicle-mounted power supply structure 200 provided by the present disclosure, the U-shaped sheet 82 is disposed along the length direction of the grid baffle 81, A plurality of switch tubes 424 are provided, and a plurality of elastic sheets 83 are provided. The number of elastic sheets 83 corresponds to the number of switch tubes 424 in one-to-one correspondence.

The elastic mechanism 8 can simultaneously abut the plurality of switch tubes 424 on the heat-conducting mechanism 7 to facilitate the stable contact of the plurality of switch tubes 424 with the water cooling mechanism 3.

The above are only the preferred embodiments of the present disclosure and are not intended to limit the present disclosure. Any modification, equivalent replacement and improvement made within the spirit and principle of the present disclosure shall be included in the protection of the present disclosure Within range.

Claims

A circuit board layout structure is characterized by comprising a main PCB board, a first spacer, a magnetic element module and a switch tube module, the first spacer is fixed on the main PCB board, and the magnetic element module is located On one side of the first isolator, the switch tube module is located on the other side of the first isolator, the magnetic element module and the switch tube module are both fixed and electrically connected to the main PCB board .
The circuit board layout structure according to claim 1, wherein the first isolation member is an isolation PCB board, the isolation PCB board is electrically connected to the main PCB board, and the switch tube module includes a plurality of The same switch tube is fixed and electrically connected to the isolated PCB board.
The layout structure of a circuit board according to claim 2, wherein there are two opposing PCB boards, and the switch tube module or the magnetic element module is located between the two PCB boards .
The circuit board layout structure according to any one of claims 1 to 3, wherein the magnetic element module includes a transformer module and an inductance module, and the transformer module includes a plurality of closely-coupled transformers, the inductance The module includes several close inductive components.
The layout structure of a circuit board according to claim 4, wherein a second isolator is provided between the transformer module and the inductor module.
The layout structure of the circuit board according to claim 5, wherein the second isolator is a capacitor module, and the capacitor module is fixed and electrically connected to the main PCB board.
The layout structure of a circuit board according to claim 6, wherein the capacitor module comprises a capacitor PCB board and a plurality of capacitor elements arranged on the capacitor PCB board, the capacitor PCB board is fixed vertically or obliquely On the main PCB board, the capacitor PCB board is electrically connected to the main PCB board, and the capacitor PCB board is located on a side of the main PCB board.
The layout structure of a circuit board according to claim 7, wherein the packaging surface of the capacitor element faces the transformer module, and the capacitor PCB board faces the inductor module.
The circuit board layout structure according to claim 8, wherein at least two sets of the aligned capacitive elements are provided on the same capacitor PCB, and at least two sets of the aligned capacitive elements are provided between The isolation board is fixed on the main PCB board.
A vehicle-mounted power supply structure, characterized in that it includes a circuit board layout structure according to any one of claims 1-9.