WO2020135225A1 - 射频转接组件及具有其的射频连接器 - Google Patents

射频转接组件及具有其的射频连接器 Download PDF

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Publication number
WO2020135225A1
WO2020135225A1 PCT/CN2019/126650 CN2019126650W WO2020135225A1 WO 2020135225 A1 WO2020135225 A1 WO 2020135225A1 CN 2019126650 W CN2019126650 W CN 2019126650W WO 2020135225 A1 WO2020135225 A1 WO 2020135225A1
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WIPO (PCT)
Prior art keywords
radio frequency
outer conductor
insulator
center conductor
conductor
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PCT/CN2019/126650
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English (en)
French (fr)
Inventor
刘明非
张林林
陈少华
安绍银
寿祖刚
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中兴通讯股份有限公司
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Publication of WO2020135225A1 publication Critical patent/WO2020135225A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/627—Snap or like fastening
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency

Definitions

  • the present disclosure relates to the technical field of base station systems in wireless communication systems.
  • RF connectors are an important part of wireless communication systems. At present, in 5G equipment, the cost of RF connectors has increased significantly. For example, in the standard 64-channel 5GAAU, the number of RF connectors will reach 128, which is 10 times that of 4GRRU, and the proportion of connector costs will increase significantly.
  • the existing RF connectors have both internal and external conductors machined and machined, with high processing efficiency and low cost.
  • the RF connector generally includes an RF adapter component, a first socket, and a second socket.
  • the existing radio frequency switching component has the problem that it is not convenient to adjust the impedance matching.
  • the main purpose of the present disclosure is to provide a radio frequency adapter component and a radio frequency connector having the same.
  • a radio frequency adapter assembly including: a first center conductor; a first outer conductor, sleeved on the first center conductor; and a first insulator, the first insulator is disposed at the first center Between the conductor and the first outer conductor, the first insulator includes a first positioning part, the first positioning part includes a plurality of first positioning pieces, the plurality of first positioning pieces are arranged at intervals in the circumferential direction, and each of the first positioning pieces and the first The outer conductor abuts to position the first center conductor, and a plurality of first positioning members are used to form a low-impedance area to complement the high-impedance area.
  • a radio frequency connector including: a socket component; a radio frequency adapter component, the radio frequency adapter component is the radio frequency adapter component provided above, and the socket component is connected to the radio frequency adapter component.
  • FIG. 1 shows a schematic structural diagram of a first insulator provided according to Embodiment 1 of the present disclosure
  • FIG. 2 shows a schematic structural diagram of a radio frequency connection component provided according to Embodiment 1 of the present disclosure
  • FIG. 3 shows an exploded view of the radio frequency connection assembly provided according to Embodiment 1 of the present disclosure
  • FIG. 4 shows a schematic structural diagram of a first outer conductor provided according to Embodiment 1 of the present disclosure
  • FIG. 5 shows a schematic structural diagram of a first socket provided according to Embodiment 2 of the present disclosure
  • FIG. 6 shows a schematic structural diagram of a second outer conductor provided according to Embodiment 2 of the present disclosure
  • FIG. 7 shows a schematic structural diagram of a second center conductor provided according to Embodiment 2 of the present disclosure
  • FIG. 8 shows a schematic structural diagram of a second insulator provided according to Embodiment 2 of the present disclosure
  • FIG. 9 shows a schematic structural diagram of a second socket provided according to Embodiment 2 of the present disclosure.
  • FIG. 10 shows a schematic structural diagram of a third outer conductor according to Embodiment 2 of the present disclosure
  • FIG. 11 shows a schematic structural diagram of a third center conductor provided according to Embodiment 2 of the present disclosure
  • FIG. 12 shows a schematic structural view of a third insulator provided according to Embodiment 2 of the present disclosure
  • FIG. 13 shows a schematic structural diagram of a guide sleeve provided according to Embodiment 2 of the present disclosure
  • FIG. 14 shows an exploded view of a radio frequency connector provided according to Embodiment 2 of the present disclosure
  • FIG. 15 shows a front view of FIG. 14
  • FIG. 16 shows a schematic structural diagram of a radio frequency connector provided according to Embodiment 2 of the present disclosure
  • FIG. 17 shows a cross-sectional view of a radio frequency connector provided according to Embodiment 2 of the present disclosure
  • FIG. 18 shows a partial schematic diagram of a radio frequency connector provided according to Embodiment 2 of the present disclosure
  • FIG. 19 shows a schematic structural diagram of a printed circuit board corresponding to a socket according to the present disclosure
  • FIG. 20 shows a schematic structural view of a package opening of a printed circuit board corresponding to a socket according to the present disclosure
  • FIG. 21 shows a schematic structural diagram of a molding rod provided according to Embodiment 2 of the present disclosure
  • FIG. 23 is a graph showing the relationship between the standing wave and the frequency of the radio frequency connector according to the second embodiment of the present disclosure.
  • RF adapter assembly 11. First center conductor; 12. First outer conductor; 121, Clamping part; 1211, Claw; 13, First insulator; 131, First positioning part; 1311, First positioning 1312, raised part; 132, second positioning part; 133, connecting post; 14, ring sleeve; 20, first socket; 21, second outer conductor; 22, second center conductor; 23, second insulator 30, the second socket; 31, the third outer conductor; 32, the third center conductor; 33, the third insulator; 34, the guide sleeve; 40, the molding rod; 50, the printed circuit board.
  • Embodiment 1 of the present disclosure provides an RF adapter assembly 10 including: a first center conductor 11, a first outer conductor 12 and a first insulator 13.
  • the first outer conductor 12 is sleeved on the first center conductor 11.
  • the first insulator 13 is disposed between the first center conductor 11 and the first outer conductor 12, the first insulator 13 includes a first positioning portion 131, and the first positioning portion 131 includes a plurality of first positioning members 1311, a plurality of first positioning The pieces 1311 are arranged at intervals in the circumferential direction, at least part of each first positioning piece 1311 abuts the first outer conductor 12 to position the first center conductor 11, and a plurality of first positioning pieces 1311 are used to form a low-impedance area, Complementary to the high-impedance area (to be described below).
  • the first center conductor 11 can be positioned by a plurality of first positioning members 1311 arranged at intervals in the circumferential direction, and at the same time, the plurality of first positioning members 1311 can form a low-impedance region.
  • the shape and size of the plurality of first positioning members 1311 By adjusting the shape and size of the plurality of first positioning members 1311, a reasonable ratio between the insulating material and the air can be obtained, so that the low-impedance area and the high-impedance area complement each other, so that the impedance reaches a better matching value, The effect of adjusting impedance matching is achieved and the standing wave is guaranteed. Therefore, the technical solution provided by this embodiment can solve the technical problem that the radio frequency switching component 10 in the prior art is not convenient for adjusting impedance matching.
  • the first outer conductor 12 has a cylindrical structure.
  • the outer surface of the first positioning member 1311 in this embodiment is arc-shaped.
  • impedance matching can be achieved to ensure a standing wave.
  • the first positioning member 1311 in this embodiment has a protrusion 1312, a groove is provided on the inner wall of the first outer conductor 12, and the protrusion 1312 is provided in the corresponding groove to face the first center The conductor 11 is positioned. With such an arrangement, the stability of positioning can be improved.
  • the groove is a circular arc groove
  • the protrusion 1312 is a circular ring protrusion
  • the circular ring protrusion is in contact with the groove wall of the circular arc groove.
  • the first insulator 13 in this embodiment may further include a second positioning portion 132.
  • the second positioning portion 132 is spaced apart from the first positioning portion 131, and at least a portion of the second positioning portion 132 abuts the first outer conductor 12 to pass the second positioning portion 132 to the first center conductor 11 To be targeted.
  • the second positioning portion 132 in this embodiment is a circular truncated cone structure, and the end portion of the first outer conductor 12 is provided with a clamping portion 121. A central conductor 11 is positioned.
  • the engaging portion 121 includes a plurality of claws 1211, and the engaging end of the engaging portion 121 is disposed on the claw 1211.
  • the first outer conductor 12 has a cylindrical structure, and the end of the first outer conductor 12 has a plurality of opening grooves, and the plurality of opening grooves extend along the extending direction of the first outer conductor 12 so as to pass through the plurality of opening grooves
  • a plurality of claws 1211 are formed at the end of the first outer conductor 12.
  • the engaging end of the claw 1211 is arc-shaped.
  • the first insulator 13 may further include a connecting post 133, one end of the connecting post 133 is connected to the first positioning portion 131, and the other end of the connecting post 133 is connected to the second positioning portion 132, so that the connecting post 133 The first positioning portion 131 and the second positioning portion 132 are connected.
  • the three connecting posts 133 are respectively provided in one-to-one correspondence with the three first positioning members 1311. Each first positioning member 1311 passes through the corresponding connecting post 133 and the first Two positioning pieces are connected.
  • first insulators 13 there are two first insulators 13, and the two first insulators 13 are respectively disposed at both ends of the first center conductor 11 to position the first center conductor 11.
  • the first center conductor 11 may be wrapped by a punching process; or, the first outer conductor 12 may be wrapped by a punching process; or, both the first center conductor 11 and the first outer conductor 12 may be used
  • the punching process is made by wrapping.
  • both the first center conductor 11 and the first outer conductor 12 are made by the punching process.
  • the punching process can not only improve The efficiency can also reduce the processing cost, thereby reducing the overall cost of the RF adapter assembly 10.
  • the radio frequency adapter assembly 10 in this embodiment may further include a ring sleeve 14 which is sleeved on the first outer conductor 12 to reinforce the first outer conductor 12.
  • the ring sleeve 14 is a cylindrical structure, and the surface of the ring sleeve 14 may be colored by anodizing process, and different colors may be plated according to different lengths of the ring sleeve 14 to identify the adapter components of different lengths by color, which is convenient Production operations.
  • the ring sleeve 14 in this embodiment is sleeved on the middle of the first outer conductor 12.
  • the first outer conductor 12 has a cylindrical configuration, the outer diameter of the first conductor 12 is d 5, 3.85mm ⁇ d 5 ⁇ 3.95mm.
  • the first center conductor 11 has a cylindrical structure, and the outer diameter of the first center conductor 11 is C, 1.4 mm ⁇ C ⁇ 1.6 mm.
  • the end width of the first insulator 13 is F, and 0.52mm ⁇ F ⁇ 0.58mm.
  • Embodiment 2 of the present disclosure provides a radio frequency connector.
  • the radio frequency connector includes: a socket component and a radio frequency adapter component 10.
  • the radio frequency switching component 10 is the radio frequency switching component 10 provided in the first embodiment, and the socket component is connected to the radio frequency switching component 10 to ensure the normality of the radio frequency channel.
  • the socket assembly and the single board are installed by perforation welding or patch. As shown in FIG. 19 and FIG. 20, the size of the package opening of the socket assembly in this embodiment corresponding to the printed circuit board 50 is fully compatible with the size of the RF connector in the prior art, and can be interchanged as a whole.
  • the socket assembly includes a first socket 20, the first socket 20 is connected to the first end of the RF adapter assembly 10, and the first socket 20 includes a second outer conductor 21 and Second insulator 23.
  • the second outer conductor 21 is processed by the shaped rod 40.
  • the second insulator 23 is a stepped cylindrical structure to ensure the index performance of the first socket 20.
  • the second outer conductor 21 having a first inner mounting hole of the second insulator 23, the inner diameter of the first hole is d 1, 4.5mm ⁇ d 1 ⁇ 4.6mm.
  • the depth of the first bore is h 1, 3.58mm ⁇ h 1 ⁇ 3.62mm.
  • the second outer conductor 21 also has a second inner hole for mounting the second insulator 23, the diameter of the second inner hole is smaller than the diameter of the first inner hole, and there is between the first inner hole and the second inner hole
  • the first positioning step is to position the second insulator 23.
  • the inner diameter of the second hole is d 2, 3.92mm ⁇ d 2 ⁇ 3.98mm.
  • the first socket 20 further includes a second center conductor 22, and the second center conductor 22 is machined.
  • the first insulator 13 and the first center conductor 11 are matched with each other, and then mounted on the second outer conductor 21.
  • the second central conductor 22 has a cylindrical configuration, the outer diameter of the second central conductor 22 is D 1, 1.2mm ⁇ D 1 ⁇ 1.6mm.
  • the socket assembly further includes a second socket 30, the second socket 30 is connected to the second end of the RF adapter assembly 10, and the second socket 30 includes a third outer conductor 31 ⁇ third insulator 33.
  • the third outer conductor 31 is processed by the shaped rod 40.
  • the third insulator 33 is a stepped cylindrical structure, and the structure of the shaped rod 40 is shown in FIG. 21.
  • the outer conductor 31 has a third mounting hole 33 of the third insulator, the inner diameter of the third hole is d 3, 4.6mm ⁇ d 3 ⁇ 4.8mm.
  • Third bore depth is h 2, 3.58mm ⁇ h 2 ⁇ 3.62mm.
  • the third outer conductor 31 has a fourth inner hole for mounting the third insulator 33, the diameter of the fourth inner hole is smaller than the diameter of the third inner hole, and there is a third inner hole between the third inner hole and the fourth inner hole Two positioning steps to position the third insulator 33.
  • the inner diameter of the fourth hole is d 4, 3.92mm ⁇ d 4 ⁇ 3.98mm.
  • the second socket 30 further includes a third center conductor 32 and a guide sleeve 34.
  • the third center conductor 32 is machined
  • the third insulator 33 is a stepped cylindrical structure
  • the guide sleeve 34 is machined.
  • the guide sleeve 34 and the third outer conductor 31 are press-fitted.
  • the third insulator 33 and the third center conductor 32 are matched with each other, and then the third insulator 33 and the third center conductor 32 are installed in the third outer conductor 31 with the guide sleeve 34.
  • the third central conductor 32 is a cylindrical configuration
  • the outer diameter of the third central conductor 32 is D 2, 1.2mm ⁇ D 2 ⁇ 1.6mm.
  • the first socket 20 in this embodiment is a half-escape type socket. After the RF adapter assembly 10 is inserted into the first socket 20, it will be escaped into the first socket 20 and keep the end face tight Contact, and the gap created by the assembly tolerance will be between the RF adapter assembly 10 and the bottom of the second socket 30. This gap will form a high-impedance area that affects the performance of the connector, and the area where the first insulator 13 of the RF adapter assembly 10 forms a low-impedance area. In this way, a high-impedance area is adjacent to a low-impedance area and can form a complement.
  • the uniformity of the impedance of the complete channel of the first socket 20 and the second socket 30 assembled with the RF adapter assembly 10 is ensured, thereby improving the performance of the overall RF connector.
  • the structure of the first insulator 13 in the RF adapter plays a key role.
  • the low impedance level determined by the structure directly affects the matching with the high impedance, so that the impedance reaches a better matching value.
  • FIG. 22 shows the voltage standing wave ratio curve of the radio frequency connector in the prior art at different frequencies
  • FIG. 23 shows the voltage standing wave ratio curve of the radio frequency connector in this embodiment at different frequencies.
  • the above two different RF connectors have similar and highest voltage standing wave ratios at two extreme positions (ie, air gap 0 and maximum), while the voltage standing wave ratios at the remaining positions will be lower than those at the extreme positions.
  • Wave ratio that is, in the required mating state, the voltage standing wave ratio of the RF connector in this embodiment will be lower than the voltage standing wave ratio of the limit position, so as to meet the actual performance requirements of the whole machine.
  • the above-described embodiments of the present disclosure achieve the following technical effects: reduced processing costs, easy adjustment of impedance matching, and guaranteed standing wave performance.
  • the RF adapter components and RF connectors provided in the embodiments of the present disclosure are very suitable for the number of connectors increased exponentially compared to 4G devices, but the performance requirements of the connectors are Reduced 5G equipment.

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  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

本公开提供了一种射频转接组件及具有其的射频连接器，射频转接组件包括：第一中心导体；第一外导体，套设在第一中心导体上；第一绝缘体，第一绝缘体设置在第一中心导体和第一外导体之间，第一绝缘体包括第一定位部，第一定位部包括多个第一定位件，多个第一定位件沿圆周方向间隔设置，各个第一定位件与第一外导体抵接以对第一中心导体进行定位，多个第一定位件用于形成低阻抗区域。摘要附图：图1

Description

射频转接组件及具有其的射频连接器 技术领域
本公开涉及无线通讯系统中的基站系统技术领域。
背景技术
射频连接器是无线通讯系统中的重要组成部分。目前，在5G设备中，射频连接器的成本占比大幅度增加。例如，在标准的64通道5GAAU中，射频连接器用量会达到128个，是4GRRU中的10倍，连接器成本占比大幅增加。
现有的射频连接器为了满足原场景下大功率需求，转接连接器的内外导体均是机加加工，加工效率低成本较高。此外，射频连接器一般包括射频转接组件、第一插座和第二插座。现有的射频转接组件存在不便于调节阻抗匹配的问题。
发明内容
本公开的主要目的在于提供一种射频转接组件及具有其的射频连接器。
根据本公开的一个方面，提供了一种射频转接组件，包括：第一中心导体；第一外导体，套设在第一中心导体上；以及第一绝缘体，第一绝缘体设置在第一中心导体和第一外导体之间，第一绝缘体包括第一定位部，第一定位部包括多个第一定位件，多个第一定位件沿圆周方向间隔设置，各个第一定位件与第一外导体抵接以对第一中心导体进行定位，多个第一定位件用于形成低阻抗区域，以与高阻抗区域进行互补。
根据本公开的另一方面，提供了一种射频连接器，包括：插座组件；射频转接组件，射频转接组件为上述提供的射频转接组件，插座组件与射频转接组件连接。
附图说明
构成本申请的一部分的说明书附图用来提供对本公开的进一步理解，本公开的示意性实施例及其说明用于解释本公开，并不构成对本公开的不当限定。在附图中：
图1示出了根据本公开的实施例一提供的第一绝缘体的结构示意图；
图2示出了根据本公开的实施例一提供的射频连接组件的结构示意图；
图3示出了根据本公开的实施例一提供的射频连接组件的爆炸图；
图4示出了根据本公开的实施例一提供的第一外导体的结构示意图；
图5示出了根据本公开的实施例二提供的第一插座的结构示意图；
图6示出了根据本公开的实施例二提供的第二外导体的结构示意图；
图7示出了根据本公开的实施例二提供的第二中心导体的结构示意图；
图8示出了根据本公开的实施例二提供的第二绝缘体的结构示意图；
图9示出了根据本公开的实施例二提供的第二插座的结构示意图；
图10示出了根据本公开的实施例二提供的第三外导体结构示意图；
图11示出了根据本公开的实施例二提供的第三中心导体的结构示意图；
图12示出了根据本公开的实施例二提供的第三绝缘体的结构示意图；
图13示出了根据本公开的实施例二提供的导向套的结构示意图；
图14示出了根据本公开的实施例二提供的射频连接器的爆炸图；
图15示出了图14的主视图；
图16示出了根据本公开的实施例二提供的射频连接器的结构示意图；
图17示出了根据本公开的实施例二提供的射频连接器的剖视图；
图18示出了根据本公开的实施例二提供的射频连接器的局部示意图；
图19示出了根据本公开的插座对应的印制电路板的结构示意图；
图20示出了根据本公开的插座对应的印制电路板的封装开孔的结构示意图；
图21示出了根据本公开的实施例二提供的成型棒的结构示意图；
图22示出了现有技术中的射频连接器的驻波与频率的关系的曲线图；
图23示出了根据本公开的实施例二提供的射频连接器的驻波与频率的关系的曲线图。
其中，上述附图包括以下附图标记：
10、射频转接组件；11、第一中心导体；12、第一外导体；121、卡接部；1211、卡爪；13、第一绝缘体；131、第一定位部；1311、第一定位件；1312、凸起部；132、第二定位部；133、连接柱；14、环套；20、第一插座；21、第二外导体；22、第二中心导体；23、第二绝缘体；30、第二插座；31、第三外导体；32、第三中心导体；33、第三绝缘体；34、导向套；40、成型棒；50、印制电路板。
具体实施方式
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。下面将参考附图并结合实施例来详细说明本公开的实施例。如图1至图4所示，本公开的实施例一提供了一种射频转接组件10，该射频转接组件10包括：第一中心导体11、第一外导体 12和第一绝缘体13。其中，第一外导体12套设在第一中心导体11上。第一绝缘体13设置在第一中心导体11和第一外导体12之间，第一绝缘体13包括第一定位部131，第一定位部131包括多个第一定位件1311，多个第一定位件1311沿圆周方向间隔设置，各个第一定位件1311的至少部分与第一外导体12抵接以对第一中心导体11进行定位，多个第一定位件1311用于形成低阻抗区域，以与高阻抗区域(将在下文中介绍)进行互补。
应用本公开提供的射频转接组件10，通过沿圆周方向间隔设置的多个第一定位件1311能够对第一中心导体11进行定位，同时，多个第一定位件1311能够形成低阻抗区域。通过调节多个第一定位件1311的形状和尺寸能够使绝缘材料与空气之间具有合理的比例，以使低阻抗区域与高阻抗区域进行互补，从而使得阻抗达到一个较好匹配的值，以达到调节阻抗匹配的效果并保证驻波。因此，采用本实施例提供的技术方案，能够解决现有技术中的射频转接组件10不便于调节阻抗匹配的技术问题。
在本实施例中，第一外导体12为圆筒结构，为了便于与第一外导体12的配合，本实施例中的第一定位件1311的外表面为圆弧状。本实施例中的第一定位件1311为3个，3个第一定位件1311沿圆周方向均匀布置以与第一外导体12的内壁配合定位。同时，通过调整第一定位件1311的结构和尺寸能够实现阻抗匹配，保证驻波。
可选地，本实施例中的第一定位件1311上具有凸起部1312，第一外导体12的内壁上设置有凹槽，凸起部1312设置在对应的凹槽内以对第一中心导体11进行定位。采用这样的设置方式，能够提高定位的稳定性。
在本实施例中，凹槽为圆弧槽，凸起部1312为圆环凸起，圆环凸起与圆弧槽的槽壁抵接。
为了进一步提高定位的稳定性，本实施例中的第一绝缘体13还可包括第二定位部132。在本实施例中，第二定位部132与第一定位部131间隔设置，第二定位部132的至少部分与第一外导体12抵接，以通过第二定位部132对第一中心导体11进行定位。
可选地，本实施例中的第二定位部132为圆台结构，第一外导体12的端部设置有卡接部121，卡接部121的卡接端抵接在圆台结构上以对第一中心导体11进行定位。
在本实施例中，卡接部121包括多个卡爪1211，卡接部121的卡接端设置在卡爪1211上。可选地，第一外导体12为圆筒结构，第一外导体12的端部具有多个开口槽，多个开口槽沿第一外导体12的延伸方向延伸，以通过多个开口槽使第一外导体12的端部形成多个卡爪1211。本实施例中的卡爪1211的卡接端为弧形。
在本实施例中，第一绝缘体13还可包括连接柱133，连接柱133的一端与第一定位部131连接，连接柱133的另一端与第二定位部132连接，以通过连接柱133使第一定位部131和第二定位部132连接。可选地，本实施例中的连接柱133为三个，三个连接柱133分别与三个第一定位件1311一一对应地设置，各个第一定位件1311通过相应的连接柱133与第二定位件连接。
在本实施例中，第一绝缘体13为两个，两个第一绝缘体13分别设置在第一中心导体11的两端，以对第一中心导体11进行定位。
可选地，第一中心导体11可以采用冲制工艺包卷制成；或者，第一外导体12采用冲制工艺包卷制成；或者，第一中心导体11和第一外导体12均采用冲制工艺包卷制成。在本实施例中，第一中心导体11和第一外导体12均采用冲制工艺包卷制成，相比于现有技术中的机加方式而言，采用冲制工艺包卷不仅能够提升效率，还能够降低加工成本，进而降低射频转接组件10的整体成本。
本实施例中的射频转接组件10还可包括环套14，环套14套设在第一外导体12上以对第一外导体12进行加固。可选地，环套14为圆筒结构，可以采用阳极氧化工艺在环套14的表面镀色，根据环套14的不同长度镀不同的颜色，以通过颜色识别不同长度的转接组件，便于生产操作。本实施例中的环套14套设在第一外导体12的中部。
在本实施例中，第一外导体12为圆筒结构，第一外导体12的内径为d 5，3.85mm≤d 5≤3.95mm。第一中心导体11为圆柱结构，第一中心导体11的外径为C，1.4mm≤C≤1.6mm。如图18所示，第一绝缘体13的端部宽度为F，0.52mm≤F≤0.58mm。采用这样的设置，通过优化尺寸能够使绝缘材料与空气之间具有更合理的比例，以更好地使低阻抗和高阻抗区域进行互补，从而使得阻抗达到一个更好匹配的值，以达到调节阻抗匹配的效果并保证驻波。
本公开实施例二提供了一种射频连接器，该射频连接器包括：插座组件和射频转接组件10。射频转接组件10为实施例一中提供的射频转接组件10，插座组件与射频转接组件10连接，以保证射频通道的正常。本实施例中的插座组件与单板之间采用穿孔焊接或贴片安装。如图19和图20所示，本实施例中的插座组件对应印制电路板50的封装开孔的尺寸与现有技术中的射频连接器的尺寸完全兼容，可以进行整体互换。
如图5至图8所示，在本实施例中，插座组件包括第一插座20，第一插座20与射频转接组件10的第一端连接，第一插座20包括第二外导体21和第二绝缘体23。在本实施例中第二外导体21采用成型棒40加工，相较于常规的铜棒加工方式，成型棒40加工能够提升加工效率。第二绝缘体23为阶梯圆柱结构，以保证第一插座20的指标性能。第二外导体21具有安装第二绝缘体23的第一内孔，第一内孔的直径为d 1，4.5mm≤d 1≤4.6mm。在本实施例中，第一内孔的深度为h 1，3.58mm≤h 1≤3.62mm。
在本实施例中，第二外导体21还具有安装第二绝缘体23的第二内孔，第二内孔的直径小于第一内孔的直径，第一内孔和第二内孔之间具有第一定位台阶，以对第二绝缘体23进行定位。第二内孔的直径为d 2，3.92mm≤d 2≤3.98mm。
在本实施例中，第一插座20还包括第二中心导体22，第二中心导体22采用机加方式。将第一绝缘体13与第一中心导体11互配，再安装至第二外导体21上。第二中心导体22为圆柱结构，第二中心导体22的外径为D 1，1.2mm≤D 1≤1.6mm。
如图9至图13所示，在本实施例中，插座组件还包括第二插座30，第二插座30与射频转接组件10的第二端连接，第二插座30包括第三外导体31和第三绝缘体33。在本实施例中第三外导体31采用成型棒40加工，相较于常规的铜棒加工方式，成型棒40加工能够提升加工效率。第三绝缘体33为阶梯圆柱结构，成型棒40的结构如图21所示。本实施例中的第三外导体31具有安装第三绝缘体33的第三内孔，第三内孔的直径为d 3，4.6mm≤d 3≤4.8mm。第三内孔的深度为h 2，3.58mm≤h 2≤3.62mm。
在本实施例中，第三外导体31具有安装第三绝缘体33的第四内孔，第四内孔的直径小于第三内孔的直径，第三内孔与第四内孔之间具有第二定位台阶，以对第三绝缘体33进行定位。第四内孔的直径为d 4，3.92mm≤d 4≤3.98mm。
在本实施例中，第二插座30还包括第三中心导体32和导向套34。其中，第三中心导体32采用机加方式，第三绝缘体33采用阶梯圆柱结构，导向套34采用机加方式，导向套34与第三外导体31挤压过盈配合。通过将导向套34与第三外导体31分开加工的加工方式，能够节省原材料，以进一步降低成本。可选地，将第三绝缘体33与第三中心导体32互配，再将第三绝缘体33和第三中心导体32装入带有导向套34的第三外导体31内。第三中心导体32为圆柱结构，第三中心导体32外径为D 2，1.2mm≤D 2≤1.6mm。
如图14至18所示，本实施例中的第一插座20为半擒纵式插座，射频转接组件10插入第一插座20后会被擒纵于第一插座20内并保持端面的紧密接触，而装配公差所产生的空隙将会在射频转接组件10与第二插座30的底部之间。这个空隙将形成影响连接器性能的高阻抗区域，而射频转接组件10的第一绝缘体13所在区域形成一个低阻抗区域，这样，一个高阻抗区域与一个低阻抗区域相邻，可以形成互补，从而保证了第一插座20和第二插座30与射频转接组件10装配成的完整通道的阻抗的均匀性，从而提高整体射频连接器的性能。在整个环节中，射频转接器中的第一绝缘体13的结构起到了关键作用，其结构决定的低阻抗程度直接影响了与高阻抗的匹配性，以使阻抗达到一个较好的匹配值。
如图22所示为现有技术中的射频连接器在不同频率下的电压驻波比曲线，如图23所示为本实施例中的射频连接器在不同频率下的电压驻波比曲线。上述两种不同的射频连接器在两个极限位置处(即空气间隙0和最大时)的电压驻波比相近且最高，而在其余的位置的电压驻波比会低于极限位置的电压驻波比，即在需要的插合状态下，本实施例中的射频连接器的电压驻波比会低于极限位置的电压驻波比，从而能够满足整机实际的性能要求。
从以上的描述中，可以看出，本公开上述的实施例实现了如下技术效果：降低了加工成本，便于调节阻抗匹配，保证了驻波的性能。此外，由于可不必采用机加加工，本公开实施例所提供的射频转接组件和射频连接器非常适用于相对于4G设备来说，连接器数量成倍增加，但对连接器的性能要求有所降低的5G设备。
以上所述仅为本公开的优选实施例而已，并不用于限制本公开，对于本领域的技术人员来说，本公开可以有各种更改和变化。凡在本公开的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本公开的保护范围之内。

Claims (22)

  1. 一种射频转接组件，包括：
    第一中心导体(11)；
    第一外导体(12)，套设在所述第一中心导体(11)上；以及
    第一绝缘体(13)，所述第一绝缘体(13)设置在所述第一中心导体(11)和所述第一外导体(12)之间，所述第一绝缘体(13)包括第一定位部(131)，所述第一定位部(131)包括多个第一定位件(1311)，多个所述第一定位件(1311)沿圆周方向间隔设置，各个所述第一定位件(1311)与所述第一外导体(12)抵接以对所述第一中心导体(11)进行定位，多个所述第一定位件(1311)用于形成低阻抗区域。
  2. 根据权利要求1所述的射频转接组件，其中，所述第一定位件(1311)上具有凸起部(1312)，所述第一外导体(12)的内壁上设置有凹槽，所述凸起部(1312)设置在对应的凹槽内以对所述第一中心导体(11)进行定位。
  3. 根据权利要求2所述的射频转接组件，其中，所述凹槽为圆弧槽，所述凸起部(1312)为圆环凸起，所述圆环凸起与所述圆弧槽的槽壁抵接。
  4. 根据权利要求1所述的射频转接组件，其中，所述第一绝缘体(13)还包括第二定位部(132)，所述第二定位部(132)与所述第一定位部(131)间隔设置，所述第二定位部(132)与所述第一外导体(12)抵接，以通过所述第二定位部(132)对所述第一中心导体(11)进行定位。
  5. 根据权利要求4所述的射频转接组件，其中，所述第二定位部(132)为圆台结构，所述第一外导体(12)的端部设置有卡接部(121)，所述卡接部(121)的卡接端抵接在所述圆台结构上以对所述第一中心导体(11)进行定位。
  6. 根据权利要求5所述的射频转接组件，其中，所述卡接部(121)包括多个卡爪(1211)，所述卡接部(121)的卡接端设置在所述卡爪(1211)上。
  7. 根据权利要求4所述的射频转接组件，其中，所述第一绝缘体(13)还包括连接柱(133)，所述连接柱(133)的一端与所述第一定位部(131)连接，所述连接柱(133)的另一端与所述第二定位部(132)连接，以通过所述连接柱(133)使所述第一定位部(131)和所述第二定位部(132)连接。
  8. 根据权利要求1所述的射频转接组件，其中，所述第一绝缘体(13)为两个，两个所述第一绝缘体(13)分别设置在所述第一中心导体(11)的两端。
  9. 根据权利要求1所述的射频转接组件，其中，所述第一中心导体(11)和/或所述第一外导体(12)采用冲制工艺包卷制成。
  10. 根据权利要求1所述的射频转接组件，其中，所述射频转接组件还包括环套(14)，所述环套(14)套设在所述第一外导体(12)上以对所述第一外导体(12)进行加固。
  11. 根据权利要求1所述的射频转接组件，其中，所述第一外导体(12)为圆筒结构，所述第一外导体(12)的内径为d 5，3.85mm≤d 5≤3.95mm。
  12. 根据权利要求1所述的射频转接组件，其中，所述第一中心导体(11)为圆柱结构，所述第一中心导体(11)的外径为C，1.4mm≤C≤1.6mm。
  13. 根据权利要求1所述的射频转接组件，其中，所述第一绝缘体(13)的端部宽度为F，0.52mm≤F≤0.58mm。
  14. 一种射频连接器，包括：
    插座组件；以及
    根据权利要求1至13中任一项所述的射频转接组件(10)，所述插座组件与所述射频转接组件(10)连接。
  15. 根据权利要求14所述的射频连接器，其中，所述插座组件包括第一插座(20)，所述第一插座(20)与所述射频转接组件(10)的第一端连接，所述第一插座(20)包括第二外导体(21)和第二绝缘体(23)，所述第二外导体(21)具有安装所述第二绝缘体(23)的第一内孔，所述第一内孔的直径为d 1，4.5mm≤d 1≤4.6mm。
  16. 根据权利要求15所述的射频连接器，其中，所述第一内孔的深度为h 1，3.58mm≤h 1≤3.62mm。
  17. 根据权利要求15所述的射频连接器，其中，所述第二外导体(21)具有安装所述第二绝缘体(23)的第二内孔，所述第二内孔的直径为d 2，3.92mm≤d 2≤3.98mm。
  18. 根据权利要求15所述的射频连接器，其中，所述第一插座(20)还包括第二中心导体(22)，所述第二中心导体(22)为圆柱结构，所述第二中心导体(22)的外径为D 1，1.2mm≤D 1≤1.6mm。
  19. 根据权利要求14所述的射频连接器，其中，所述插座组件包括第二插座(30)，所述第二插座(30)与所述射频转接组件(10)的第二端连接，所述第二插座(30)包括第三外导体(31)和第三绝缘体(33)，所述第三外导体(31)具有安装所述第三绝缘体(33)的第三内孔，所述第三内孔的直径为d 3，4.6mm≤d 3≤4.8mm。
  20. 根据权利要求19所述的射频连接器，其中，所述第三内孔的深度为h 2，3.58mm≤h 2≤3.62mm。
  21. 根据权利要求19所述的射频连接器，其中，所述第三外导体(31)具有安装所述第三绝缘体(33)的第四内孔，所述第四内孔的直径为d 4，3.92mm≤d 4≤3.98mm。
  22. 根据权利要求19所述的射频连接器，其中，所述第二插座(30)还包括第三中心导体(32)，所述第三中心导体(32)为圆柱结构，所述第三中心导体(32)外径为D 2，1.2mm≤D 2≤1.6mm。
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