WO2020133688A1

WO2020133688A1 - Heat dissipation system for on-board server, on-board server, and self-driving car

Info

Publication number: WO2020133688A1
Application number: PCT/CN2019/077044
Authority: WO
Inventors: 马志华
Original assignee: 北京图森未来科技有限公司
Priority date: 2018-12-29
Filing date: 2019-03-05
Publication date: 2020-07-02
Also published as: CN111381645A

Abstract

A heat dissipation system for an on-board server, an on-board server, and a self-driving car, pertaining to the technical field of self-driving vehicles. The heat dissipation system comprises: at least one heat dissipation unit comprising a heat conduction mechanism (5), a heat pipe (3), and a heat sink (4). The heat conduction mechanism (5) comprises a heat pipe base (51) and a heat pipe cover (52), the heat pipe base (51) presses against a heat generating component (2) in an on-board server to absorb heat from the heat generating component (2). The heat pipe base (51) is provided with a first recess (511) thereon, and the heat pipe cover (52) is provided with a second recess (521) thereon. One end of the heat pipe (3) is held within the first recess (511) and the second recess (521), and the other end of the heat pipe (3) is connected to the heat sink (4) to transfer heat to the heat sink (4). A terminal end of the end of the heat pipe (3) extending beyond the heat pipe cover (52) has a length greater than 0 mm and less than or equal to 30 mm. The invention further improves the capacity of the heat pipe (3) to dissipate heat for electronic components in on-board servers.

Description

Heat dissipation system for vehicle-mounted server, vehicle-mounted server and self-driving car

This application requires the priority of the Chinese patent application submitted to the Chinese Patent Office on December 29, 2018, with the application number 201811639928.9 and the invention titled "Cooling System for Onboard Servers, Onboard Servers, and Autonomous Vehicles". Incorporated by reference in this application.

Technical field

The invention relates to the technical field of automatic driving, and in particular to a heat dissipation system for an on-board server, an on-board server and an autonomous driving car.

Background technique

At present, in order to realize the automatic driving of the vehicle, a vehicle-mounted server is usually provided in the automatic driving vehicle, and the vehicle-mounted server is electrically connected to the image acquisition device installed on the autonomous driving vehicle and to the control system of the autonomous driving vehicle. The on-board server is used to calculate and analyze the timely road image or video collected by the image collection device, and then make decisions to control the autonomous driving vehicle, and finally realize safe and reliable automatic driving.

Summary of the invention

For the on-board server, due to the complicated technology involved in automatic driving, the on-board computer server that needs to be set is very powerful, which not only has strong computing power and high processing efficiency, so compared with the ordinary computer server, the on-board computer server The number of electronic components that may be installed inside is even greater. A large number of electronic components will generate a lot of heat during high-speed operation, which will cause the temperature of the electronic components and the internal server of the vehicle to increase significantly, especially for electronic components, such as CPU, GPU, etc., will generate a lot of The heat causes a sharp rise in its own temperature, which will later cause a decrease in its operating speed, and may even cause malfunction or damage to the electronic component. Therefore, the heat dissipation of this type of electronic component is particularly important.

In the prior art, the heat dissipation of this type of electronic components is generally carried out by means of heat pipe heat transfer. Specifically, the end of one end of the heat pipe is closely attached to this type of electronic component or is adhered through thermal grease. Different types of heat sinks are provided at the other end, and then fans are used to blow the heat sinks. The heat dissipation capacity of the above method can meet the electronic components under ordinary conditions, but for autonomous vehicles, they often drive in outdoor sunlight in high temperature summer days, and the temperature of the entire vehicle will rise rapidly under sun exposure. In addition, during the exercise of the autonomous vehicle, the GPU in the electronic components realizes the automatic operation of the vehicle in order to meet the algorithmic processing of the collected road surface image video by the autonomous vehicle, and it has basically been in the working state of full load, so the heat dissipation And the heating rate is extremely fast. Based on the above two points, further optimization is needed to improve and control the heat dissipation capacity of electronic components to meet the current higher heat dissipation requirements.

In order to overcome the above-mentioned defects of the prior art, the technical problem to be solved by the embodiments of the present invention is to provide a heat dissipation system for an on-board server, an on-board server and an autonomous vehicle, which can further improve the heat pipe to the electronic components in the on-board server The ability to dissipate heat.

The specific technical solutions of the embodiments of the present invention are:

A heat dissipation system for a vehicle-mounted server. The heat dissipation system includes:

At least one heat dissipation unit. The heat dissipation unit includes: a heat conduction mechanism, a heat pipe, and a heat sink. The heat conduction mechanism includes a heat pipe seat and a heat pipe cover. The heat pipe seat is used to lean against a heat generating component in the vehicle server to absorb the heat generating element. For the heat of the device, the heat pipe base has a first groove, and the heat pipe cover has a second groove. One end of the heat pipe is sandwiched between the first groove and the second groove. The other end of the heat pipe is connected to the heat sink to transfer heat to the heat sink. The length of the end of one end of the heat pipe protruding from the heat pipe cover is greater than 0 mm and less than or equal to 30 mm.

In some embodiments, the length of one end of the heat pipe protruding from the heat pipe cover is greater than or equal to 10 mm and less than or equal to 18 mm.

In some embodiments, the heat pipe cover includes a body provided with the second groove and a fin portion for heat dissipation.

In some embodiments, the heat generating component is a GPU chip or a CPU chip.

In some embodiments, one end of the heat pipe extends in a horizontal direction, the other end of the heat pipe extends in a vertical direction, and there is a bent section between one end and the other end of the heat pipe.

In some embodiments, the bending section of the heat pipe includes at least a first bending portion closest to one end of the heat pipe and a second bending portion closest to the heat sink, the first bending portion is tight Rely on the heat pipe cover.

In some embodiments, there are multiple heat pipes in one heat dissipation unit, and the diameter of the heat pipes ranges from 6 mm to 10 mm.

In some embodiments, the diameter of the heat pipe ranges from 6 mm to 8 mm.

In some embodiments, the heat dissipation system further includes: a first fan group installed at the air inlet of the chassis shell; a second fan group installed at the air outlet of the chassis shell, the air inlet and the air outlet The first fan group and the second fan group are relatively arranged so that a high-pressure air flow from the air inlet to the air outlet is formed between the air inlet and the air outlet, and the fin portion of the heat pipe cover There is a gap between them, and the high-pressure wind flows through the gap between the fin parts.

In some embodiments, thermal grease is filled between the heat pipe base and the heat-generating component.

In some embodiments, the heat sink is disposed at the air outlet, the heat sink includes a plurality of heat dissipation fins, the heat dissipation fins extend in a horizontal direction and are arranged in a vertical direction to make the high pressure The wind flows through the gap between the heat dissipation fins.

An in-vehicle server includes: heat-generating components and a heat dissipation system for the in-vehicle server as described in any one of the above.

In some embodiments, the heat generating component is a GPU chip or a CPU chip.

A self-driving car, the self-driving car is installed with the vehicle-mounted server as described above.

The technical solution of the present invention has the following significant beneficial effects:

By extending the end of one end of the heat pipe out of the heat pipe cover, the extension length needs to be greater than 0 mm and less than or equal to 30 mm. The extension length specifically refers to the heat pipe extending after removing the semi-spherical portion existing in the processing of the end of the heat pipe The length distance of the heat pipe cover. In this way, even if the working medium in the heat pipe cannot reach the end of the end of the heat pipe, it can reach the range under the entire heat pipe cover, so that there is no heat accumulation in all areas of the heat pipe cover, thereby improving the heat pipe to the heating element Heat dissipation effect, the heat transfer power of the heat pipe is increased.

With reference to the following description and drawings, specific embodiments of the present invention are disclosed in detail, and the manner in which the principles of the present invention can be adopted is indicated. It should be understood that the embodiments of the present invention are not thus limited in scope. Within the scope of the spirit and terms of the appended claims, the embodiments of the present invention include many changes, modifications, and equivalents. Features described and/or illustrated for one embodiment may be used in one or more other embodiments in the same or similar manner, combined with features in other embodiments, or substituted for features in other embodiments .

BRIEF DESCRIPTION

The drawings described herein are for explanatory purposes only and are not intended to limit the scope of the present disclosure in any way. In addition, the shapes, proportions, etc. of the components in the drawings are only schematic, and are used to help the understanding of the present invention, and do not specifically limit the shapes and proportions of the components of the present invention. Under the teaching of the present invention, those skilled in the art can select various possible shapes and proportions to implement the present invention according to specific situations.

FIG. 1 is a perspective schematic view of the interior of a chassis of a vehicle-mounted server in an embodiment of the present application;

2 is a cross-sectional view of a heat conduction mechanism and a heat pipe in a heat dissipation system according to an embodiment of the present application.

Reference numbers of the above drawings:

1. Chassis; 11. Air inlet; 12. Air outlet; 2. Heating element; 3. Heat pipe; 31. First bending part; 32. Second bending part; 4. Radiator; 5. Heat conduction mechanism; 51, heat pipe base; 511, first groove; 52, heat pipe cover; 521, body; 5210, second groove; 522, fin part; 6, first fan group; 7, second fan group.

detailed description

The details of the present invention can be understood more clearly with reference to the drawings and the description of specific embodiments of the present invention. However, the specific embodiments of the present invention described herein are only for the purpose of explaining the present invention, and should not be construed as limiting the present invention in any way. Under the teaching of the present invention, the skilled person can conceive of any possible modification based on the present invention, which should be regarded as falling within the scope of the present invention. It should be noted that when an element is referred to as being “disposed on” another element, it can be directly on the other element or there can also be a centered element. When an element is considered to be “connected” to another element, it may be directly connected to another element or may be centered at the same time. The terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it may be a mechanical connection or an electrical connection, or it may be an internal connection between two components, either directly connected or indirectly connected through an intermediate medium. Those of ordinary skill in the art can understand the specific meaning of the above terms according to specific situations. As used herein, the terms "vertical", "horizontal", "upper", "lower", "left", "right", and similar expressions are for illustrative purposes only and are not meant to be the only embodiments.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present application. The terminology used in the specification of the present application herein is for the purpose of describing specific embodiments only, and is not intended to limit the present application. The term "and/or" as used herein includes any and all combinations of one or more related listed items.

In order to further improve the heat pipe's ability to dissipate heat from electronic components in the on-board server, a heat dissipation system for the on-board server is proposed in this application. FIG. 1 is a perspective schematic view of the interior of the on-board server chassis in the embodiment of the present application. 2 is a cross-sectional view of a heat conduction mechanism and a heat pipe in a heat dissipation system according to an embodiment of the present application. As shown in FIGS. 1 to 2, the heat dissipation system for a vehicle-mounted server may include: at least one heat dissipation unit, and the heat dissipation unit includes: a heat conduction mechanism 5. The heat pipe 3 and the heat sink 4. The heat conduction mechanism 5 includes a heat pipe seat 51 and a heat pipe cover 52. The heat pipe seat 51 is used to lean against the heating element 2 in the on-board server to absorb the heat of the heating element 2. The heat pipe base 51 There is a first groove 511, a second groove 5210 on the heat pipe cover 52, one end of the heat pipe 3 is sandwiched between the first groove 511 and the second groove 5210, the other end of the heat pipe 3 is connected to the radiator 4 to connect The heat is transferred to the radiator 4, and the length of the end of one end of the heat pipe 3 protruding from the heat pipe cover 52 is greater than 0 mm and less than or equal to 30 mm.

Since various heating components 2 are provided on the circuit board of the vehicle-mounted server, the heating components 2 generate a large amount of heat during operation. In order to avoid the heating components 2 being damaged or reduced in efficiency due to high temperature, the heat pipe 3 is required to be The heat generated by the heat-generating component 2 is quickly and efficiently conducted to the heat sink 4, so that the heat is dissipated to the air through the heat sink 4. Since the cross section of the heat pipe 3 is circular, in order to enable the heat of the heating element 2 to be efficiently transferred to one end of the heat pipe 3, the heat pipe base 51 and the heat pipe cover 52 are used. The devices 2 are bonded together, thereby increasing the contact area of the heating element 2 and the heat pipe base 51, so that the heat of the heating element 2 is first conducted to the heat pipe base 51. Then, the heat pipe 3 is sandwiched between the first groove 511 of the heat pipe base 51 and the second groove 5210 of the heat pipe cover 52 to ensure the contact area of the heat pipe 3 with the heat pipe base 51 and the heat pipe cover 52, thereby making the heat of the heat pipe base 51 It is quickly and efficiently transferred to the heat pipe 3, and finally transferred to the radiator 4 through the heat pipe 3. The working fluid filled in the heat pipe 3 evaporates at one end of the heating element 2 to absorb heat, and then the gaseous working fluid flows to the end of the heat pipe 3 at the radiator 4 to condense and release heat, and the heat is absorbed by the radiator 4 When it is gone, it is released into the air through the radiator 4 and the condensed working fluid is in a liquid state. It returns to the end of the heat-generating component 2 of the heat pipe 3 through the liquid-absorbing core provided on the inner wall of the heat pipe 3. However, in the process of working fluid reflow, the end of the heat pipe 3 located at the heating element 2 is sandwiched by the heat pipe base 51 and the heat pipe cover 52. If the heat generated by the heating element 2 is high and the temperature is high, the entire heat pipe base 51. Both the heat pipe cover 52 and one end of the heat pipe 3 will be at a relatively high temperature. When the working fluid recirculates in the wick in the heat pipe 3, it does not reach the end of the end of the heat pipe 3, and just flows to the heat pipe base 51 When the heat pipe cover 52 or the middle of the heat pipe base 51 and the heat pipe cover 52 flows, the working fluid has completely evaporated due to the high temperature of the heat pipe base 51 and the heat pipe cover 52. In this case, most of the heat absorbed by the evaporation of the working medium is the heat in the middle of the heat pipe base 51 and the heat pipe cover 52, and the working medium does not flow to the end of the end of the heat pipe 3 at all. Therefore, the heat pipe at the end of the end of the heat pipe 3 The heat on the seat 51 and the heat pipe cover 52 cannot be completely absorbed, which will cause the accumulation of heat there, so that the temperature of the heating element 2 near the end of the end of the heat pipe 3 is higher, thereby reducing to a certain extent The heat dissipation effect of the heat pipe 3 on the heating element 2 and the heat transfer power of the heat pipe 3 are also limited.

The applicant discovered through experimental research that the end of one end of the heat pipe 3 needs to protrude from the heat pipe cover 52, the length of the protrusion needs to be controlled within a range of greater than 0mm and less than or equal to 30mm, preferably, it can be controlled to be greater than or equal to 10mm and less than or equal to In the range of 18 mm, the protruding length specifically refers to the length of the heat pipe 3 protruding from the heat pipe cover 52 after removing the semi-spherical portion existing during the processing of the end of the heat pipe 3. In the above manner, even if the working medium in the heat pipe 3 cannot reach the end of the end of the heat pipe 3, it can reach the range covered by the entire heat pipe cover 52, so that there is no heat accumulation phenomenon in all areas of the heat pipe cover 52, thereby improving the heat pipe 3 The heat dissipation effect on the heating element 2 makes the heat transfer power of the heat pipe 3 increase.

As shown in FIG. 1, the casing of the chassis 1 of the vehicle-mounted server has an air inlet 11 and an air outlet 12 on both sides in the horizontal direction, and the air inlet 11 and the air outlet 12 are oppositely arranged. The heat dissipation system may further include: a first fan group 6, which is installed at the air inlet 11 of the casing of the chassis 1, and a second fan group 7, which is installed at the air outlet 12 of the casing of the chassis 1. In a manner that the air inlet 11 and the air outlet 12 are arranged oppositely, the first fan group 6 and the second fan group 7 form a high-pressure air flow from the air inlet 11 to the air outlet 12 between the air inlet 11 and the air outlet 12.

As shown in FIG. 1, the heat pipe cover 52 may include a body 521 provided with a second groove 5210 and a fin portion 522 extending in the vertical direction for heat dissipation. The second groove 5210 is located on the lower end surface of the body 521, and the fin portion 522 is located on the upper end surface of the body 521. There is a gap between the fin portions 522 of the heat pipe cover 52, and high-pressure wind flows through the gap between the fin portions 522. In the above manner, the high-pressure wind flow can accelerate the heat convection heat exchange between the air and the fin part 522, thereby accelerating the heat on the heat pipe cover 52 to be radiated into the air through the fin part 522, to a certain extent, improve the heat-generating components 2 Cooling effect.

As shown in FIG. 1, in a heat dissipation unit, a plurality of heat pipes 3 can be used, so that the heat transfer between the heat conduction mechanism 5 and the heat sink 4 can be accelerated. The diameter of the heat pipe 3 can be selected between 6mm and 10mm, including 6mm and 10mm, and preferably, between 6mm and 8mm, including 6mm and 8mm, which can facilitate the heat pipe base 51 and the heat pipe cover 52 sandwiching the heat pipe 3 does not make the thickness of the heat pipe base 51 and the heat pipe cover 52 too large, and can also facilitate sandwiching a plurality of heat pipes 3 between the heat pipe base 51 and the heat pipe cover 52.

As shown in FIG. 2, the lower end surface of the heat pipe base 51 is close to the heating element 2 in the in-vehicle server. In order to increase the contact between the two and enhance heat conduction, the lower end surface of the heat pipe base 51 and the heating element 2 The room can be coated or filled with thermal grease. The heat pipe base 51 has a first groove 511, and the heat pipe cover 52 has a second groove 5210. The first groove 511 and the second groove 5210 sandwich the heat pipe 3. In order to improve the heat pipe 3 and the heat pipe cover 52, the heat pipe The degree of contact between the seat 51 may be coated or filled with thermal grease between the heat pipe 3 and the heat pipe cover 52 and the heat pipe seat 51 to enhance the heat conduction between the heat pipe 3 and the heat pipe cover 52 and the heat pipe seat 51. The heat pipe base 51 and the heat pipe cover 52 can be fixedly connected together by means of screws or bolts. Since the heat pipe cover 52 also needs to perform certain heat dissipation, the length of the heat pipe cover 52 in the direction of high-pressure air flow will be much larger than that of the heat pipe The length of the seat 51.

As shown in FIG. 1, the radiator 4 is provided at the air outlet 12. The heat sink 4 may include a plurality of heat dissipation fins. The heat dissipation fins extend in the horizontal direction and are arranged in the vertical direction, so that high-pressure wind flows through the gap between the heat dissipation fins, thereby improving the heat dissipation fins and the heat pipe 3 Thermal convection intensity.

As shown in FIG. 1, the end of the heat pipe 3 in contact with the heat pipe base 51 and the heat pipe cover 52 extends in the horizontal direction, and the other end of the heat pipe 3 in contact with the radiator 4 extends in the vertical direction. Bending section. The bending section of the heat pipe 3 includes a plurality of bending sections. The bending section of the heat pipe 3 includes at least a first bending section 31 closest to one end of the heat pipe 3 and a second bending section 32 closest to the radiator 4. Among them, the first bending portion 31 abuts the heat pipe cover 52. Since the heights of the first bending portion 31 and the second bending portion 32 are higher than the end of the heat pipe 3 in contact with the heat pipe base 51 and the heat pipe cover 52, the working medium in the heat pipe 3 undergoes endothermic transformation at one end of the heat pipe 3 After being in a gaseous state, it needs to rise through the first bending portion 31 as early as possible, and then passes through the second bending portion 32 to reach the other end of the heat pipe 3 for exothermic transformation into a liquid state. If the first bending part 31 is far away from the heat pipe cover 52, the gaseous working substance may not reach the first bending part 31, and this part will be transformed into a liquid state due to temperature. It cannot rise as the gaseous working fluid through the first turning part and finally reaches the other end of the heat pipe 3, which will reduce the heat transfer power of the heat pipe 3, which is not conducive to the heat pipe 3 dissipating heat to the heating element 2.

In general, the heating element 2 in this embodiment is a GPU chip or a CPU chip. Because these two chips will generate a large amount of heat instantaneously during high-speed operation, their temperature will rise sharply, and the operating speed of these two chips has certain requirements on temperature, so they must be cooled with a heat dissipation unit.

In this application, a vehicle-mounted server is also proposed. The vehicle-mounted server may include: a heat-generating component, and a heat dissipation system for the vehicle-mounted server as described above. The heating element may be a GPU chip or a CPU chip.

In this application, an autonomous vehicle is also proposed. The autonomous vehicle may include: any one of the on-board servers mentioned above.

The "autonomous vehicle" referred to in this application refers to the use of self-driving technology to carry people (such as family cars, buses, etc.), and cargo (such as ordinary trucks, vans, enclosed trucks, tank trucks, Flatbed trucks, container trucks, dump trucks, special structure trucks, etc.) or vehicles with special rescue functions (such as fire trucks, ambulances, etc.).

The above-mentioned embodiments in this specification are described in a progressive manner. The same and similar parts between the embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments. All articles and references disclosed, including patent applications and publications, are incorporated by reference for various purposes. The term "consisting essentially of" describing a combination should include the identified elements, ingredients, components or steps and other elements, ingredients, components or steps that do not substantially affect the basic novel features of the combination. The use of the term "comprising" or "including" to describe combinations of elements, ingredients, components or steps herein also contemplates embodiments that consist essentially of these elements, ingredients, components or steps. By using the term "may" here, it is intended to illustrate that any described attributes included in "may" are optional. Multiple elements, ingredients, components or steps can be provided by a single integrated element, ingredient, component or step. Alternatively, a single integrated element, ingredient, component or step may be divided into separate multiple elements, ingredients, components or steps. The disclosure of "a" or "an" used to describe an element, ingredient, component, or step is not intended to exclude other elements, ingredients, components, or steps.

Obviously, those skilled in the art can make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. In this way, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and equivalent technologies thereof, the present invention is also intended to include these modifications and variations.

Claims

A heat dissipation system for a vehicle-mounted server, characterized in that the heat dissipation system includes:

At least one heat dissipation unit. The heat dissipation unit includes: a heat conduction mechanism, a heat pipe, and a heat sink. The heat conduction mechanism includes a heat pipe seat and a heat pipe cover. The heat pipe seat is used to lean against a heat generating component in the vehicle server to absorb the heat generating element. For the heat of the device, the heat pipe base has a first groove, and the heat pipe cover has a second groove. One end of the heat pipe is sandwiched between the first groove and the second groove. The other end of the heat pipe is connected to the heat sink to transfer heat to the heat sink. The length of the end of one end of the heat pipe protruding from the heat pipe cover is greater than 0 mm and less than or equal to 30 mm.
The heat dissipation system for a vehicle-mounted server according to claim 1, wherein the length of the end of one end of the heat pipe extending beyond the heat pipe cover is greater than or equal to 10 mm and less than or equal to 18 mm.
The heat dissipation system for a vehicle-mounted server according to claim 1, wherein the heat pipe cover includes a body provided with the second groove and a fin portion for heat dissipation.
The heat dissipation system for a vehicle-mounted server according to claim 1, wherein the heat generating component is a GPU chip or a CPU chip.
The heat dissipation system for a vehicle-mounted server according to claim 1, wherein one end of the heat pipe extends in a horizontal direction, the other end of the heat pipe extends in a vertical direction, and one end of the heat pipe and the other end There is a bending section.
The heat dissipation system for an in-vehicle server according to claim 4, wherein the bending section of the heat pipe includes at least a first bending portion closest to one end of the heat pipe and a second closest to the radiator Two bending parts, the first bending part abuts the heat pipe cover.
The heat dissipation system for a vehicle-mounted server according to claim 1, wherein there are multiple heat pipes in one heat dissipation unit.
The heat dissipation system for a vehicle-mounted server according to claim 1, wherein the diameter of the heat pipe ranges from 6 mm to 10 mm.
The heat dissipation system for a vehicle-mounted server according to claim 8, wherein the diameter of the heat pipe ranges from 6mm to 8mm.
The heat dissipation system for a vehicle-mounted server according to claim 1, wherein the heat dissipation system further comprises: a first fan group, which is installed at the air inlet of the chassis casing; a second fan group, which is installed at the chassis casing The air outlet, the air inlet and the air outlet are oppositely arranged, and the first fan group and the second fan group make the air inlet and the air outlet form the air inlet toward the air outlet In the direction of high-pressure wind flow, there is a gap between the fins of the heat pipe cover, and the high-pressure wind flow passes through the gap between the fins.
The heat dissipation system for a vehicle-mounted server according to claim 1, wherein a thermally conductive silicone grease is filled between the heat pipe base and the heat generating component.
The heat dissipation system for a vehicle-mounted server according to claim 10, wherein the heat sink is disposed at the air outlet, the heat sink includes a plurality of heat dissipation fins, and the heat dissipation fins are horizontal Extend and arrange in the vertical direction so that the high-pressure wind flows through the gap between the heat dissipation fins.
An on-board server is characterized by comprising: heat-generating components and a heat dissipation system for the on-board server; the heat dissipation system includes:

At least one heat dissipation unit. The heat dissipation unit includes: a heat conduction mechanism, a heat pipe, and a heat sink. The heat conduction mechanism includes a heat pipe seat and a heat pipe cover. The heat pipe seat is used to lean against a heat generating component in the vehicle server to absorb the heat generating element. For the heat of the device, the heat pipe base has a first groove, and the heat pipe cover has a second groove. One end of the heat pipe is sandwiched between the first groove and the second groove. The other end of the heat pipe is connected to the heat sink to transfer heat to the heat sink. The length of the end of one end of the heat pipe protruding from the heat pipe cover is greater than 0 mm and less than or equal to 30 mm.
The vehicle-mounted server according to claim 13, wherein the heat generating component is a GPU chip or a CPU chip.
A self-driving car, characterized in that the self-driving car includes: a vehicle-mounted server, the vehicle-mounted server includes heating components, and a heat dissipation system for the vehicle-mounted server; the heat dissipation system includes:

At least one heat dissipation unit. The heat dissipation unit includes: a heat conduction mechanism, a heat pipe, and a heat sink. The heat conduction mechanism includes a heat pipe seat and a heat pipe cover. The heat pipe seat is used to lean against a heat generating component in the vehicle server to absorb the heat generating element. For the heat of the device, the heat pipe base has a first groove, and the heat pipe cover has a second groove. One end of the heat pipe is sandwiched between the first groove and the second groove. The other end of the heat pipe is connected to the heat sink to transfer heat to the heat sink. The length of the end of one end of the heat pipe protruding from the heat pipe cover is greater than 0 mm and less than or equal to 30 mm.