WO2020133682A1 - 一种显示面板及其制备方法 - Google Patents
一种显示面板及其制备方法 Download PDFInfo
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- WO2020133682A1 WO2020133682A1 PCT/CN2019/076829 CN2019076829W WO2020133682A1 WO 2020133682 A1 WO2020133682 A1 WO 2020133682A1 CN 2019076829 W CN2019076829 W CN 2019076829W WO 2020133682 A1 WO2020133682 A1 WO 2020133682A1
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- Prior art keywords
- layer
- flexible substrate
- display panel
- molecular solution
- buffer layer
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- 238000002360 preparation method Methods 0.000 title claims description 7
- 239000010410 layer Substances 0.000 claims abstract description 172
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 230000007704 transition Effects 0.000 claims abstract description 39
- 239000010409 thin film Substances 0.000 claims abstract description 27
- 239000002346 layers by function Substances 0.000 claims abstract description 26
- 238000005538 encapsulation Methods 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 24
- 229920000620 organic polymer Polymers 0.000 claims description 9
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 9
- PMNLUUOXGOOLSP-UHFFFAOYSA-N 2-mercaptopropanoic acid Chemical compound CC(S)C(O)=O PMNLUUOXGOOLSP-UHFFFAOYSA-N 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- -1 diphenylene ether Chemical compound 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000231 atomic layer deposition Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- DKIDEFUBRARXTE-UHFFFAOYSA-N 3-mercaptopropanoic acid Chemical compound OC(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-N 0.000 claims description 4
- RQPNXPWEGVCPCX-UHFFFAOYSA-N 3-sulfanylbutanoic acid Chemical compound CC(S)CC(O)=O RQPNXPWEGVCPCX-UHFFFAOYSA-N 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 4
- 238000005229 chemical vapour deposition Methods 0.000 claims description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- 238000007641 inkjet printing Methods 0.000 claims description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 229920005591 polysilicon Polymers 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 abstract description 8
- 230000004048 modification Effects 0.000 abstract description 4
- 238000012986 modification Methods 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 4
- 239000000243 solution Substances 0.000 description 19
- 238000002347 injection Methods 0.000 description 14
- 239000007924 injection Substances 0.000 description 14
- 230000005525 hole transport Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000007385 chemical modification Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 150000003573 thiols Chemical class 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002715 modification method Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- the invention relates to a display panel and a preparation method thereof.
- the main flat panel display device market includes liquid crystal (LCD) display devices, plasma display panels, organic light emitting diode (OLED) display devices, etc. Due to its low power consumption, high contrast ratio, wide viewing angle, light and thin flexibility, OLED display devices have rapidly occupied the small and medium size and large size display market in recent years and will become the next generation of mainstream display technology.
- LCD liquid crystal
- OLED organic light emitting diode
- the OLED display device is an active light-emitting device, and its thickness is generally less than 0.2um. Therefore, by selecting a substrate with an appropriate thickness and material, an ultra-thin and flexible display device can be realized. This is also one of the important advantages of OLED display devices to distinguish other display devices.
- the substrates currently used in OLED display products on the market are mainly glass substrates. This is because flexible OLED display devices still have some problems, especially in the field of large-size display. Among them, an important reason is the development of stable and easily peelable flexible substrates.
- the traditional manufacturing method of a flexible display device is to stick a flexible substrate to a rigid carrier through an adhesive, and then perform a series of preparations on the substrate to obtain a flexible display device.
- this flexible substrate (such as polyacetamide) is easily separated from the driving layer during subsequent use, resulting in device problems and reduced product quality.
- the purpose of the present invention is to provide a display panel and a preparation method thereof, which can effectively solve the phenomenon that the substrate is separated between the flexible substrate and the driving layer in the process of evaporation and other processes or in the later use of the OLED device.
- the present invention provides a display panel, which includes a flexible substrate, a transition layer, a buffer layer, a driving layer, a functional layer, and a thin film encapsulation layer;
- the transition layer covers one side of the flexible substrate;
- the buffer layer covers the side of the transition layer away from the rigid carrier;
- the driving layer covers the side of the buffer layer away from the transition layer;
- the functional layer covers the side of the driving layer away from the buffer layer ;
- the thin film encapsulation layer covers the surface of the functional layer.
- the transition layer includes organic molecules containing mercapto groups.
- the material of the flexible substrate includes, but is not limited to, polyimide, diphenylene ether resin, or polyethylene dinaphthalate.
- the buffer layer includes but is not limited to titanium dioxide or silicon dioxide.
- the thickness of the buffer layer is 0.5-500um.
- Still another object of the present invention is to provide a method for preparing a display panel, comprising the steps of: coating a layer of organic polymer on a surface of a rigid carrier, the organic polymer being dried to form a flexible substrate; The bottom is placed in an organic molecular solution containing a mercapto group. After the flexible substrate is taken out, the organic molecular solution is dried to form a transition layer; a buffer layer is prepared on the upper surface of the transition layer; a driving layer is prepared on the The upper surface of the buffer layer; preparing a functional layer on the upper surface of the driving layer; and coating a thin film encapsulation layer on the upper surface of the functional layer.
- the flexible substrate in the step of placing the flexible substrate in an organic molecular solution containing a mercapto group, the flexible substrate is placed in the organic molecular solution for 5-30 minutes; the temperature of the organic molecular solution is At 20-50°C, the pH of the organic molecular solution is 2-8, and the drying time of the organic molecular solution is 15-30 minutes.
- organic molecular solution includes but is not limited to 2-mercaptopropionic acid, mercaptopropionic acid, or 3-mercaptobutanoic acid.
- the driving layer is a low temperature polysilicon thin film transistor, a thin film transistor or an oxide thin film transistor.
- the coating method is a chemical vapor deposition method, an atomic layer deposition method, or an inkjet printing method.
- the invention proposes a display panel and a preparation method thereof.
- a thiol modification method is used to modify a transition layer containing a thiol group on a flexible substrate to strengthen the tight adsorption between the flexible substrate and the buffer layer in the driving layer.
- the use of chemical adsorption greatly enhances the adsorption force between the flexible substrate and the buffer layer, which can effectively avoid the separation of the flexible substrate and the driving layer during the substrate evaporation process or the device's later use. Improve product quality and yield.
- FIG. 1 is a schematic structural diagram of a display panel pair provided by the present invention.
- FIG. 2 is a flowchart of a method for manufacturing a display panel provided by the present invention
- FIG. 3 is a schematic diagram of the structure of the flexible substrate and the transition layer of the present invention.
- FIG. 4 is a schematic structural view of a flexible substrate, transition layer and buffer layer of the present invention.
- FIG. 5 is a schematic diagram of the structure of the flexible substrate, transition layer, buffer layer and driving layer of the present invention.
- FIG. 6 is a schematic diagram of the longitudinal cross-sectional structure of the flexible substrate, transition layer, buffer layer, driving layer and functional layer of the present invention.
- the present invention provides a display panel 100 including a flexible substrate 101, a transition layer 102, a buffer layer 103, a driving layer 104, a functional layer 105, and a thin film encapsulation layer 106.
- the material of the flexible substrate 101 includes but is not limited to polyimide, diphenylene ether resin or polyethylene dinaphthalate.
- the transition layer 102 covers one side of the rigid carrier.
- the transition layer 102 is an organic molecule containing a mercapto group; the transition layer 102 mainly uses an organic molecular solution and the flexible substrate 101
- An organic polymer reacts to form the transition layer 102, and the organic molecular solution includes but is not limited to 2-mercaptopropionic acid, mercaptopropionic acid, or 3-mercaptobutanoic acid, wherein the speed and uniformity of chemical modification can be performed by temperature and pH Controlling, this can make the adsorption force of the transition layer 102 and the flexible substrate 101 stronger.
- the buffer layer 103 covers the side of the transition layer 102 away from the hard carrier; the buffer layer 103 is prepared on the surface of the transition layer 102 by CVD, ALD, etc.
- the material of the buffer layer 103 includes but is not limited to TiO2, SiO2, etc., the thickness is 0.5 ⁇ 500 um. In other embodiments, the thickness of the buffer layer 103 may be 10 um, 50 um, 100 um, 250 nm, or 400 nm, and the present invention is preferably 100 nm.
- the driving layer 104 covers the side of the buffer layer 103 away from the transition layer 102; the driving layer 104 is a low temperature polysilicon thin film transistor (LTPS-TFT), a thin film transistor (TFT) or an oxide thin film transistor.
- the driving layer 104 can be used to drive the panel display.
- the functional layer 105 covers the side of the driving layer 104 away from the buffer layer 103; the functional layer 105 may be an OLED display device, mainly including an anode, a hole injection layer, a hole transport layer, and a light emitting layer electron transport layer , An electron injection layer and a cathode; the anode covers the side of the driving layer 104 away from the buffer layer 103; the hole injection layer covers the side of the anode away from the driving layer 104, and the hole transport layer Covering the hole injection layer away from the anode side, the light emitting layer covering the hole transport layer away from the hole injection layer, the electron transport layer covering the light emitting layer away from the On the side of the hole transport layer, the electron injection layer covers the side of the electron transport layer away from the light emitting layer, and the cathode covers the side of the electron injection layer away from the electron transport layer.
- the functional layer 105 may also be a liquid crystal display structure of an LCD, which plays a role of pixel development, and does not
- the thin-film encapsulation layer 106 covers the surface of the functional layer 105.
- the preparation method of the thin film encapsulation layer 106 may be a chemical vapor deposition method, an atomic layer deposition method or an inkjet printing method, and the present invention is preferably a chemical meteorological deposition method.
- the thin film encapsulation mainly plays a role of isolating water and oxygen, and can be used to protect related devices of the functional layer 105.
- the present invention also provides a method for manufacturing a display panel 100 according to another purpose, which includes the following steps S1 to S6.
- a layer of organic polymer is coated on the surface of the rigid carrier, and the organic polymer is dried to form a flexible substrate 101;
- the rigid carrier is glass or rigid resin
- the organic Polymers include, but are not limited to, but not limited to, polyimide, diphenylene ether resin, or polyethylene dinaphthalate.
- the flexible substrate 101 in an organic molecular solution containing a mercapto group. After the flexible substrate is taken out, the organic molecular solution is dried to form a transition layer 102; the flexible substrate 101 is placed for a period of time 5 to 30 minutes, preferably 20 minutes, in other embodiments may also be 10 minutes, 15 minutes or 25 minutes; the flexible substrate 101 is placed in the organic molecular solution for 20 to 50 °C, preferably 30 °C, In other embodiments, the temperature may be 25°C or 40°C; the pH value of the organic molecular solution is 2-8, preferably the pH value is 5, in other embodiments it may be 3, 4 or 6; the organic The molecular solution is dried for 15-30 minutes, preferably 25 minutes, and in other embodiments may be 20 minutes, 24 minutes or 28 minutes.
- the transition layer 102 mainly uses an organic molecular solution to react with the organic polymer of the flexible substrate 101 to form the transition layer 102.
- the organic molecular solution includes but is not limited to 2-mercaptopropionic acid and mercaptopropionic acid , Or 3-mercaptobutyric acid, where the speed and uniformity of the chemical modification can be controlled by temperature and pH, which can make the transition layer 102 and the flexible substrate 101 more attractive.
- a buffer layer 103 is prepared on the upper surface of the transition layer 102; the buffer layer 103 is prepared on the surface of the transition layer 102 by CVD, ALD, etc.
- the material of the buffer layer 103 includes But not limited to TiO2, SiO2, etc., the thickness is 0.5 ⁇ 500 um. In other embodiments, the thickness of the buffer layer 103 may be 10 um, 50 um, 100 um, 250 nm, or 400 nm, and the present invention is preferably 100 nm.
- a driving layer 104 is prepared on the upper surface of the buffer layer 103; the driving layer 104 is a low temperature polysilicon thin film transistor (LTPS-TFT), a thin film transistor (TFT) or an oxide thin film transistor.
- the driving layer 104 can drive the panel display.
- a functional layer 105 is prepared on the upper surface of the driving layer 104;
- the functional layer 105 may be an OLED display device, mainly including an anode, a hole injection layer, a hole transport layer, and a light emitting layer electron Transport layer, electron injection layer and cathode;
- the anode covers the side of the driving layer 104 away from the buffer layer 103;
- the hole injection layer covers the side of the anode away from the driving layer 104, the holes
- the transport layer covers the side of the hole injection layer away from the anode, the light emitting layer covers the side of the hole transport layer away from the hole injection layer, and the electron transport layer covers the light emitting layer
- the electron injection layer covers the side of the electron transport layer away from the light emitting layer, and the cathode covers the side of the electron injection layer away from the electron transport layer.
- the functional layer 105 may also be a liquid crystal display structure of an LCD, which is used for pixel imaging and does
- the coating method is a chemical vapor deposition method, an atomic layer deposition method or an inkjet printing method.
- the thin film encapsulation layer 106 mainly plays a role of isolating water and oxygen, and can protect the device of the functional layer 105.
- the present invention proposes to use a simple chemical modification to modify a thiol-containing transition layer 102 on a flexible substrate with a thiol modification method for tight adsorption between the flexible substrate and the buffer layer 103 in the drive layer 104
- the use of chemical adsorption greatly enhances the adsorption between the flexible substrate and the buffer layer 103, which can effectively prevent the substrate from separating between the flexible substrate and the driving layer 104 during the evaporation process or the device during the later use of the device Phenomenon, improve product quality and yield.
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Abstract
提供一种显示面板,包括柔性衬底、过渡层、缓冲层、驱动层、功能层和薄膜封装层;所述过渡层覆于所述柔性衬底的一侧;所述缓冲层覆于所述过渡层远离硬性载体的一侧;所述驱动层覆于所述缓冲层远离过渡层的一侧;所述功能层覆于所述驱动层远离缓冲层的一侧;所述薄膜封装层覆于所述功能层的表面。其通过在柔性衬底上利用巯基修饰的方法修饰一层含有巯基的过渡层,用以柔性衬底和驱动层中的缓冲层之间的紧密吸附,利用化学吸附使得柔性衬底和缓冲层之间吸附力大大加强。
Description
本发明涉及一种显示面板及其制备方法。
目前,平板显示器件市场主包括液晶(LCD)显示器件、等离子体显示面板、有机发光二极管(OLED)显示器件等。OLED显示器件的由于其低功耗、高对比度、广视角、轻薄柔性等特点,在最近几年迅速占领着中小尺寸以及大尺寸显示市场并将成为下一代主流的显示技术。
OLED显示器件是主动型发光器件,其厚度一般小于0.2um,因此,通过选择合适厚度和材料的基板,可以实现超薄柔性的显示器件。这同时也是OLED显示器件区别其他显示器件的重要优势之一。但是,目前市场上的OLED显示产品使用的衬底主要为玻璃衬底。这是由于柔性OLED显示器件仍存在一些问题,尤其是在大尺寸显示领域的应用。其中,一个重要的原因是稳定、易剥离柔性衬底的开发。
传统的柔性显示器件制备方法为将柔性衬底通过胶黏剂黏贴到硬性载体上,然后在基板上进行一系列的制备,以此获得柔性的显示器件。但是这种柔性衬底(比如聚乙酰胺)在后续使用过程中容易与驱动层发生分离,导致器件出问题,产品品质降低等。
本发明的目的在于,提供一种显示面板及其制备方法,可以有效解决了基板在蒸镀等工艺过程中或者是OLED器件在后期使用过程中发生柔性衬底和驱动层之间分离的现象。
为解决上述技术问题,本发明提供一种显示面板,包括柔性衬底、过渡层、缓冲层、驱动层、功能层和薄膜封装层;所述过渡层覆于所述柔性衬底的一侧;所述缓冲层覆于所述过渡层远离硬性载体的一侧;所诉驱动层覆于所述缓冲层远离过渡层的一侧;所述功能层覆于所述驱动层远离缓冲层的一侧;所述薄膜封装层覆于所述功能层的表面。
进一步地,所述过渡层包括含有巯基的有机分子。
进一步地,所述柔性衬底的材质包括但不限于聚酰亚胺、二亚苯基醚树脂或聚萘二甲酸二乙酯。
进一步地,所述缓冲层包括但不限于二氧化钛或二氧化硅。
进一步地,所述缓冲层的厚度为0.5~500um。
本发明又一目的提供一种显示面板制备方法,包括以下步骤:在硬性载体上表面涂覆一层有机聚合物,所述有机聚合物被烘干后形成一柔性衬底;将所述柔性衬底置于含巯基的有机分子溶液中,所述柔性衬底取出后,所述有机分子溶液被烘干形成一过渡层;制备一缓冲层于所述过渡层上表面;制备一驱动层于所述缓冲层上表面;制备一功能层于所述驱动层上表面;以及涂覆一薄膜封装层于所述功能层上表面。
进一步地,在所述柔性衬底置于含巯基的有机分子溶液中的步骤中,所述柔性衬底置于所述有机分子溶液内的时间为5~30min;所述有机分子溶液的温度为20~50℃,所述有机分子溶液的PH值为2~8,所述有机分子溶液被烘干的时长为15~30min。
进一步地,所述有机分子溶液包括但不限于2-巯基丙酸、巯基丙酸、或3-巯基丁酸。
进一步地,所述驱动层为低温多晶硅薄膜晶体管、薄膜晶体管或氧化物薄膜晶体管。
进一步地,在所述涂覆薄膜封装层于所述功能层上表面的步骤中,其涂覆方法为化学气相沉积方法、原子层沉积方法或喷墨打印方法。
本发明提出一种显示面板及其制备方法,在柔性衬底上利用巯基修饰的方法修饰一层含有巯基的过渡层,用以加强柔性衬底和驱动层中的缓冲层之间的紧密吸附,利用化学吸附使得柔性衬底和缓冲层之间吸附力大大加强,可以有效的避免基板在蒸镀等工艺过程中或者是器件在后期使用过程中发生柔性衬底和驱动层之间分离的现象,提高产品品质和良率。
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本发明提供的显示面板对的结构示意图;
图2为本发明提供的显示面板的制备方法的流程图;
图3为本发明的柔性衬底和过渡层的结构示意图;
图4为本发明的柔性衬底、过渡层和缓冲层的结构示意图;
图5为本发明的柔性衬底、过渡层、缓冲层和驱动层的结构示意图;
图6为本发明的柔性衬底、过渡层、缓冲层、驱动层和功能层的纵向剖面结构示意图。
以下是各实施例的说明是参考附加的图式,用以例示本发明可以用实施的特定实施例。本发明所提到的方向用语,例如上、下、前、后、左、右、内、外、侧等,仅是参考附图式的方向。本发明提到的元件名称,例如第一、第二等,仅是区分不同的元部件,可以更好的表达。在图中,结构相似的单元以相同标号表示。
本文将参照附图来详细描述本发明的实施例。本发明可以表现为许多不同形式,本发明不应仅被解释为本文阐述的具体实施例。本发明提供实施例是为了解释本发明的实际应用,从而使本领域其他技术人员能够理解本发明的各种实施例和适合于特定预期应用的各种修改方案。
如图1所示,本发明提供一种显示面板100,包括柔性衬底101、过渡层102、缓冲层103、驱动层104、功能层105以及薄膜封装层106。
所述柔性衬底101的材质包括但不限于聚酰亚胺、二亚苯基醚树脂或聚萘二甲酸二乙酯。
所述过渡层102覆于所述硬性载体的一侧,所述过渡层102为含有巯基的有机分子;所述过渡层102主要是利用一有机分子溶液与所述柔性衬底101上的所述有机聚合物进行反应形成过渡层102,所述有机分子溶液包括但不限于2-巯基丙酸、巯基丙酸、或3-巯基丁酸,其中化学修饰的速度和均一性可以通过温度和酸碱度进行控制,这可以使得过渡层102与柔性衬底101的吸附力更加大。
所述缓冲层103覆于所述过渡层102远离硬性载体的一侧;所述缓冲层103通过CVD、ALD等方法在过渡层102表面制备而成,所述缓冲层103的材质包括但不限于TiO2,SiO2等,厚度为0.5~500 um。在其他实施例中,所述缓冲层103厚度可以为10um、50um、100um、250nm或400nm,本发明优选100nm。
所述驱动层104覆于所述缓冲层103远离过渡层102的一侧;所述驱动层104为低温多晶硅薄膜晶体管(LTPS-TFT)、薄膜晶体管(TFT)或氧化物薄膜晶体管。所述驱动层104可用于驱动面板显示。
所述功能层105覆于所述驱动层104远离缓冲层103的一侧;所述功能层105可以为OLED显示器件,主要包括阳极、空穴注入层、空穴传输层、发光层电子传输层、电子注入层和阴极;所述阳极覆于所述驱动层104远离缓冲层103一侧;所述空穴注入层覆于所述阳极远离所述驱动层104一侧,所述空穴传输层覆于所述空穴注入层远离所述阳极一侧,所述发光层覆于所述空穴传输层远离所述空穴注入层一侧,所述电子传输层覆于所述发光层远离所述空穴传输层一侧,所述电子注入层覆于所述电子传输层远离所述发光层一侧,所述阴极覆于所述电子注入层远离所述电子传输层一侧。在其他实施例中功能层105还可以为LCD的液晶显示结构,起到像素显像的作用,并不会影响到本发明的发明点。
所述薄膜封装层106覆于所述功能层105的表面。所述薄膜封装层106的制备方法可为化学气相沉积方法、原子层沉积方法或喷墨打印方法,本发明优选为化学气象沉积方法。薄膜封装主要起到隔绝水和氧气的作用,可用于保护功能层105的相关器件。
如图2所示,本发明另以目的提供一种显示面板100制备方法,包括如下步骤S1~S6。
S1、如图3所示,在硬性载体上表面涂覆一层有机聚合物,所述有机聚合物被烘干后形成一柔性衬底101;所述硬性载体为玻璃或硬性树脂,所述有机聚合物包括但不限于不限于聚酰亚胺、二亚苯基醚树脂或聚萘二甲酸二乙酯。
S2、将所述柔性衬底101置于含巯基的有机分子溶液中,所述柔性衬底取出后,所述有机分子溶液被烘干形成一过渡层102;所述柔性衬底101置于时间为5~30min,优选为20min,在其他实施例中也可以为10min、15min或者25min;所述柔性衬底101置于所述有机分子溶液内的时间为20~50℃,优选为30℃,在其他实施例中也可以为25℃或40℃;所述有机分子溶液的PH值为2~8,优选为PH值为5,在其他实施例中可以为3、4或6;所述有机分子溶液被烘干时长为15~30min,优选的为25min,在其他实施例中也可以为20min、24min或28min。
所述过渡层102主要是利用一有机分子溶液与所述柔性衬底101的所述有机聚合物进行反应形成过渡层102,所述有机分子溶液包括但不限于2-巯基丙酸、巯基丙酸、或3-巯基丁酸,其中化学修饰的速度和均一性可以通过温度和酸碱度进行控制,这可以使得过渡层102与柔性衬底101的吸附力更加的大。
S3、如图4所示,制备一缓冲层103于所述过渡层102上表面;所述缓冲层103通过CVD、ALD等方法在过渡层102表面制备而成,所述缓冲层103的材质包括但不限于TiO2,SiO2等,厚度为0.5~500 um。在其他实施例中,所述缓冲层103厚度可以为10um、50um、100um、250nm或400nm,本发明优选100nm。
S4、如图5所示,制备一驱动层104于所述缓冲层103上表面;所述驱动层104为低温多晶硅薄膜晶体管(LTPS-TFT)、薄膜晶体管(TFT)或氧化物薄膜晶体管。所述驱动层104用以可以驱动面板显示。
S5、如图6所示,制备一功能层105于所述驱动层104上表面;所述功能层105可以为OLED显示器件,主要包括阳极、空穴注入层、空穴传输层、发光层电子传输层、电子注入层和阴极;所述阳极覆于所述驱动层104远离缓冲层103一侧;所述空穴注入层覆于所述阳极远离所述驱动层104一侧,所述空穴传输层覆于所述空穴注入层远离所述阳极一侧,所述发光层覆于所述空穴传输层远离所述空穴注入层一侧,所述电子传输层覆于所述发光层远离所述空穴传输层一侧,所述电子注入层覆于所述电子传输层远离所述发光层一侧,所述阴极覆于所述电子注入层远离所述电子传输层一侧。在其他实施例中功能层105还可以为LCD的液晶显示结构,这都是起到像素显像,并不会影响到本发明的发明点。
S6、涂覆一薄膜封装层106于所述功能层105上表面。所述涂覆的方法为化学气相沉积方法、原子层沉积方法或喷墨打印方法。薄膜封装层106主要起到隔绝水氧的作用,可以保护所述功能层105的器件。
本发明提出了通过利用简单的化学修饰,在柔性衬底上利用巯基修饰的方法修饰一层含有巯基的过渡层102,用以柔性衬底和驱动层104中的缓冲层103之间的紧密吸附,利用化学吸附使得柔性衬底和缓冲层103之间吸附力大大加强,可以有效的避免基板在蒸镀等工艺过程中或者是器件在后期使用过程中发生柔性衬底和驱动层104之间分离的现象,提高产品品质和良率。
本发明的技术范围不仅仅局限于所述说明中的内容,本领域技术人员可以在不脱离本发明技术思想的前提下,对所述实施例进行多种变形和修改,而这些变形和修改均应当属于本发明的范围内。
Claims (10)
- 一种显示面板,其中,包括:柔性衬底;过渡层,覆于所述柔性衬底的一侧;缓冲层,覆于所述过渡层远离硬性载体的一侧;驱动层,覆于所述缓冲层远离过渡层的一侧;功能层,覆于所述驱动层远离缓冲层的一侧;薄膜封装层,覆于所述功能层的表面。
- 根据权利要求1所述的显示面板,其中,所述过渡层包括含有巯基的有机分子。
- 根据权利要求1所述的显示面板,其中,所述柔性衬底的材质包括但不限于聚酰亚胺、二亚苯基醚树脂或聚萘二甲酸二乙酯。
- 根据权利要求1所述的显示面板,其中,所述缓冲层包括但不限于二氧化钛或二氧化硅。
- 根据权利要求1所述的薄膜封装结构,其中,所述缓冲层的厚度为0.5~500um。
- 一种显示面板制备方法,其中,包括以下步骤:在硬性载体上表面涂覆一层有机聚合物,所述有机聚合物被烘干后形成一柔性衬底;将所述柔性衬底置于含巯基的有机分子溶液中,所述柔性衬底取出后,所述有机分子溶液被烘干形成一过渡层;制备一缓冲层于所述过渡层上表面;制备一驱动层于所述缓冲层上表面;制备一功能层于所述驱动层上表面;以及涂覆一薄膜封装层于所述功能层上表面。
- 根据权利要求6所述的显示面板制备方法,其中,在所述柔性衬底置于含巯基的有机分子溶液中的步骤中,所述柔性衬底置于所述有机分子溶液内的时间为5~30min;所述有机分子溶液的温度为20~50℃,所述有机分子溶液的PH值为2~8,所述有机分子溶液被烘干的时长为15~30min。
- 根据权利要求6所述的显示面板制备方法,其中,所述有机分子溶液包括但不限于2-巯基丙酸、巯基丙酸、或3-巯基丁酸。
- 根据权利要求6所述的显示面板制备方法,其中,所述驱动层为低温多晶硅薄膜晶体管、薄膜晶体管或氧化物薄膜晶体管。
- 根据权利要求6所述的显示面板制备方法,其中,在所述涂覆薄膜封装层于所述功能层上表面的步骤中,其涂覆方法为化学气相沉积方法、原子层沉积方法或喷墨打印方法。
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