WO2020124649A1 - 一种高精细线路pcb电镀薄板的制作方法及系统 - Google Patents
一种高精细线路pcb电镀薄板的制作方法及系统 Download PDFInfo
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- WO2020124649A1 WO2020124649A1 PCT/CN2018/124092 CN2018124092W WO2020124649A1 WO 2020124649 A1 WO2020124649 A1 WO 2020124649A1 CN 2018124092 W CN2018124092 W CN 2018124092W WO 2020124649 A1 WO2020124649 A1 WO 2020124649A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
Definitions
- the invention relates to the technical field of manufacturing PCB electroplating thin plates, in particular to a method and system for manufacturing high-precision circuit PCB electroplating thin plates.
- High-precision circuit PCB electroplating thin plate (sometimes referred to as PCB board in this application) is mainly characterized by high integration, so the thickness of the board is relatively thin in the case of dense lines, usually in the process of electroplating circuit, it is easy to appear horizontal line card board , Bending plate, broken plate and other phenomena, for this phenomenon, after observation, it is found that the plate angle is mainly raised during the transportation process.
- the sheet warping is mainly due to the small transmission contact area between the two sides of the reel and the middle, and the uneven transmission strength on both sides of the board surface, resulting in different transmission speeds on both sides of the board, causing the board surface to be inclined, resulting in the board jamming In the middle of the walking reel, the back surface continues to move forward, resulting in a large number of pallets.
- a thin plate was found to be bent in the VCP electroplating copper plating. After emptying the potion, it was found that the floating frame structure was abnormal, the additional electroplating jet flow was uneven, and the copper balls fell.
- the invention provides a method and system for manufacturing a high-precision circuit PCB electroplating sheet.
- the technical problem to be solved is that the existing high-precision circuit PCB electroplating sheet is prone to jamming, bending and breaking during the manufacturing process.
- the present invention provides a method for manufacturing a high-precision circuit PCB electroplating sheet, including a PCB transfer step and/or PCB electroplating step, which
- the PCB transmission step specifically includes:
- the PCB plating step specifically includes:
- step S1 is specifically:
- step S3 the making of standard scales on both sides of the bearing of the driving reel includes:
- the standard scales are made on both sides of the bearing of the driving wheel, specifically:
- the standard scales are made on both sides of each of the transmission gears, and the transmission gears are installed symmetrically on both sides of the bearings of the transmission reel.
- step S4 is specifically:
- the row reels in the floating rack are vertically placed into two parallel rows, and the gaps formed by the two rows of the row reels are used for placing PCB thin plates for electroplating.
- the invention also provides a manufacturing system for high-precision circuit PCB electroplating thin plates, which includes a PCB conveying device and/or a PCB electroplating device.
- the PCB conveying device specifically includes a conveying reel and/or a driving reel; the conveying reel is provided There are a plurality of reel wheels; the transmission reel is provided with bearings, and standard scales are produced on both sides of the bearings;
- the PCB electroplating device specifically includes a row reel placed vertically in a floating rack.
- the plurality of wheel wheels provided in the transmission wheel includes a plurality of middle wheel wheels, and/or a plurality of symmetrical two-sided wheel wheels.
- symmetrical transmission gear installation positions are determined on both sides of the bearing of the transmission wheel, and the standard scales are made on both sides of the transmission gear installation position, and the transmission gear installation position is used to install the transmission gear.
- transmission gears are symmetrically installed on both sides of the bearing of the transmission wheel, and the standard scales are made on both sides of each transmission gear.
- the row reels in the floating rack are provided with two parallel rows, and the gaps formed by the two rows of the row reels are used for placing PCB thin plates for electroplating.
- the present invention provides a method and system for manufacturing a high-precision circuit PCB electroplating sheet, and its beneficial effects are as follows:
- Standard scales are made on both sides of the drive reel shaft, and then the position of the transmission gear on both sides of the drive reel shaft is recorded, that is, a drive reel with standard scales is used, which is convenient for checking the position during later inspection and maintenance to prevent
- the transmission gears are misaligned, and the reels of different installation positions are defined at the same time.
- the positions of the transmission gears are defined by standard scales, which is convenient for equipment assembly and equipment common, and reduces the difficulty of maintenance;
- FIG. 1 is a schematic diagram of a method for manufacturing a high-precision circuit PCB electroplated sheet provided by an embodiment of the present invention and a mechanism for transmitting a reel in a system;
- FIG. 2 is a schematic diagram of a method for manufacturing a high-precision circuit PCB electroplated sheet provided by an embodiment of the present invention and a mechanism for driving a reel in the system;
- FIG. 3 is a top view of a row reel and a floating frame in a method and system for manufacturing a high-precision circuit PCB plated sheet provided by an embodiment of the present invention.
- High-precision circuit PCB electroplating thin plate (sometimes referred to as PCB board in this application) is mainly characterized by high integration, so the thickness of the board is relatively thin in the case of dense lines, usually in the process of electroplating circuit, it is easy to appear horizontal line card board , Bending plate, broken plate and other phenomena, for this phenomenon, after observation, it is found that the plate angle is mainly raised during the transportation process.
- the sheet warping is mainly due to the small transmission contact area between the two sides of the reel and the middle, and the uneven transmission strength on both sides of the board surface, resulting in different transmission speeds on both sides of the board, causing the board surface to be inclined, resulting in the board jamming In the middle of the walking reel, the back surface continues to move forward, resulting in a large number of pallets.
- a method for manufacturing a high-precision circuit PCB plated sheet provided by an embodiment of the present invention increases the density of the wheel of the transmission wheel, and at the same time increases the transmission force applied to the transmission wheel; or In the case where the transmission force is already large, it only increases the density of the wheel of the transmission wheel.
- increasing the density of the wheel of the transmission wheel may increase the density of the middle wheel of the transmission wheel, or may be the same number and the same amount of the middle wheel and the left and right side of the wheel For interval installation, it is preferable to use three as shown in FIG. 1.
- the density of the transmission wheel in the middle and/or both sides of the transmission line is increased, and/or the transmission force of the PCB surface and the transmission plate is increased, so that the transmission force of the transmission line to the PCB board is more balanced, and the surface is transmitted There will be no tilting during the process; at the same time, the density of the rollers on the two sides and/or the middle of the transfer wheel will be increased, so that there is no space for the corner of the board to be caught in the process of the wheel, thereby ensuring the production yield of the board surface.
- this embodiment provides a method for manufacturing a high-precision circuit PCB electroplating thin plate.
- a standard scale is produced on both sides of the bearing of the transmission wheel.
- the so-called standard scales are produced on both sides of the bearing of the transmission wheel, and there may be two cases: the first is that no transmission gear is installed on both sides of the bearing, and the installation of the transmission gear is symmetrically determined on both sides of the bearing of the transmission wheel Position, and then make a standard scale according to the two sides of the installation position of the transmission gear; the second is that the transmission gear has been installed first, then use the transmission gear as a reference to make a standard scale, that is, on each of the transmission gears
- the standard scales are made on both sides of, and the transmission gears are symmetrically mounted on both sides of the bearing of the transmission reel.
- the standard position is the starting position of the scale, and it is also used as the check position during the later inspection and maintenance.
- standard scales are made on both sides of the transmission reel shaft, and then the position of the transmission gear on both sides of the reel shaft is recorded, which is convenient for post-point inspection and maintenance to check the position to prevent the transmission gear from being misaligned, and at the same time, the reel of different installation positions,
- the position of the transmission gear is defined by standard scales, which is convenient for equipment assembly and equipment common, and reduces the difficulty of maintenance.
- a thin plate was found to be bent in the VCP electroplating copper plating. After emptying the potion, it was found that the floating frame structure was abnormal, the additional electroplating jet flow was uneven, and the copper balls fell.
- this embodiment provides a method for manufacturing a high-precision circuit PCB electroplating thin plate, specifically, the row reels in the floating rack are placed vertically, and the row reels in the floating rack are further vertically placed in parallel Two rows, the gaps formed by the two rows of reels are used to place PCB thin plates for electroplating, as shown in Figure 3, wherein the reel wheels between one row of reels and the other can be staggered According to the thickness of the thin plate, the density of the reel wheel can be increased as in the embodiment (the thinner the thin plate, the higher the density of the reel wheel is set) to ensure the uniformity of electroplating.
- the row reels in the floating rack are placed vertically in two parallel rows, and the gap formed by the two rows of row reels becomes smaller, and the copper balls will not fall and get stuck in them; preventing the uneven flow of the PCB board surface and the floating rack Carry out friction and cause scratches; prevent the slab of the thin plate from being caused by uneven jet flow at the joint of the floating frame of the copper cylinder during the transfer process; at the same time, the transmission of the plate surface in the cylinder does not need to be driven by the reel, so the reel is simply carried out It is fixed and does not require complicated transmission devices. It can also increase the row reel density appropriately according to the thickness of the board surface, or stagger the row reel wheels without affecting the plating uniformity.
- This embodiment is the sum of Embodiments 1, 2, and 3, that is, in the specific implementation, strict control of each link can be achieved, which can maximize the yield of PCB plating thin plates and meet the actual processing needs.
- a high-precision circuit PCB plating thin plate manufacturing system provided by an embodiment of the present invention includes a PCB transmission device, and the transmission line is provided with multiple A reel wheel.
- the plurality of wheel wheels provided in the transmission wheel includes a plurality of middle wheel wheels, and/or a plurality of symmetrical two-sided wheel wheels. That is, the middle row wheel can be set to multiple, or the middle row wheel and the left and right side wheel wheels can be set to the same number and at the same interval. It is preferable to use 3 as shown in Figure 1 Pcs.
- the transmission wheel with a higher density of the walking wheel is used, and/or the transmission force of the PCB board surface and the walking wheel is increased, so that the transmission force of the transmission walking wheel to the PCB board is more balanced, and the board surface transmission process will not occur Tilt phenomenon; at the same time, increase the density of the rollers on both sides and/or the middle of the conveying reel, so that there is no space for the corner of the board to be stuck in the process of the reel, thus ensuring the production yield of the board surface.
- this embodiment corresponds to Embodiment 2.
- this embodiment provides a manufacturing system for high-precision circuit PCB electroplating thin plates, including a PCB conveying device.
- the PCB conveying device specifically includes a transmission line.
- the reel is provided with bearings, and standard scales are made on both sides of the bearings.
- symmetrical installation positions of the transmission gears are respectively determined on both sides of the bearing of the transmission wheel, the standard scales are made on both sides of the installation positions of the transmission gears, and the installation positions of the transmission gears are used to install the transmission gear.
- standard scales are made on both sides of the bearing of the transmission wheel.
- the so-called standard scales are produced on both sides of the bearing of the transmission wheel, and there may be two cases: the first is that no transmission gear is installed on both sides of the bearing, and the installation of the transmission gear is symmetrically determined on both sides of the bearing of the transmission wheel Position, and then make a standard scale according to the two sides of the installation position of the transmission gear; the second is that the transmission gear has been installed first, then use the transmission gear as a reference to make a standard scale, that is, on each of the transmission gears
- the standard scales are made on both sides of, and the transmission gears are symmetrically mounted on both sides of the bearing of the transmission reel.
- the standard position is the starting position of the scale, and it is also used as the check position during the later inspection and maintenance.
- a transmission wheel with a standard scale is made on both sides of the transmission wheel shaft, and then the position of the transmission gear on both sides of the shaft is recorded, which is convenient for post-point inspection and maintenance to check the position, prevent the transmission gear from being misaligned, and at the same time different installation
- the position of the reel, the position of the transmission gear is defined by the standard scale, which is convenient for equipment assembly and general equipment, and reduces the difficulty of maintenance.
- this embodiment corresponds to Embodiment 3.
- this embodiment provides a high-precision circuit PCB electroplating sheet manufacturing system, including a PCB electroplating device, and the PCB electroplating device specifically includes a vertical A walking reel placed in a floating stand.
- the row reels of the floating rack are provided with two parallel rows, and the gaps formed by the two rows of the row reels are used for placing PCB thin plates for electroplating, as shown in FIG. 3, wherein one row of reels of each row is The reel wheels between the other reels can be staggered.
- the density of the reel wheels can be increased as in the embodiment (the thinner the sheet, the higher the density of the reel wheels) to ensure uniform plating. Sex.
- the row reels in the floating rack are placed vertically in two parallel rows, and the gap formed by the two rows of row reels becomes smaller, and the copper balls will not fall and get stuck in them; preventing the uneven flow of the PCB board surface and the floating rack Carry out friction and cause scratches; prevent the slab of the thin plate from being caused by uneven jet flow at the joint of the floating frame of the copper cylinder during the transfer process; at the same time, the transmission of the plate surface in the cylinder does not need to be driven by the reel, so the reel is simply carried out It is fixed and does not require complicated transmission devices. It can also increase the row reel density appropriately according to the thickness of the board surface, or stagger the row reel wheels without affecting the plating uniformity.
- This example is the sum of Examples 5, 6, and 7, that is, in the specific implementation, the devices described in Examples 5, 6, and 7 are used in the corresponding links, which can achieve the yield of PCB plating thin plate. Maximize to meet the actual processing needs.
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Abstract
本发明涉及PCB电镀薄板的制作技术领域，具体公开了一种高精细线路PCB电镀薄板的制作方法及系统，所述系统包括PCB传送装置与/或PCB电镀装置，所述PCB传送装置具体包括传送行辘与/或传动行辘；所述传送行辘设有多个行辘轮；所述传动行辘设有轴承，所述轴承两边制作有标准刻度；所述PCB电镀装置具体包括竖直放置在浮架中的行辘。本发明的有益效果在于：减少高精细线路PCB电镀薄板在其制作过程中，出现卡板、弯板、断板等现象的几率，增大PCB电镀薄板的制作良率。
Description
本发明涉及PCB电镀薄板的制作技术领域，尤其涉及一种高精细线路PCB电镀薄板的制作方法及系统。
高精细线路PCB电镀薄板(本申请中有时也简称为PCB板)特点主要是高集成化，因而线路密集的情况下板的厚度也较薄，通常在电镀线路等工序中，容易出现水平线卡板、弯板、断板等现象，对于此现象，经过观察，发现主要是板角在输送过程中翘起产生。再经过仔细观察发现，薄板板翘主要是因为行辘两边与中间的传送接触面积小，板面两边传送力度不均匀，导致板两边传送速度不同，使板面传送倾斜，从而导致板面卡在行辘中间，后面的板面继续前进从而导致大量的卡板。
在具体制作过程中，也会发现行辘不转动也是薄板弯板与卡板的重要原因，经过观察发现行辘不转动的重要原因是传动齿轮错位造成。
在VCP电镀镀铜中发现有薄板弯折现象，经过排空药水发现是浮架架构异常、外加电镀喷流不均匀、铜球掉落导致。
发明内容
本发明提供一种高精细线路PCB电镀薄板的制作方法及系统，解决的技术问题是，现有高精细线路PCB电镀薄板在其制作过程中，容易出现卡板、弯板、断板等现象。
为解决以上技术问题，本发明提供一种高精细线路PCB电镀薄板的制作方法，包括PCB传送步骤与/或PCB电镀步骤，其特征在于，
所述PCB传送步骤具体包括：
S1.增大传送行辘的行辘轮的密度；
S2.与/或，增大施加在所述传送行辘上的传送力；
S3.与/或，以传动行辘的传动齿轮为参照，在所述传动行辘的轴承两边制作标准刻度；
所述PCB电镀步骤具体包括：
S4.将浮架中的行辘竖直放置。
进一步地，所述步骤S1具体为：
S11.增大传送行辘的中间行辘轮的密度；
S12.与/或，增大传送行辘的两边行辘轮的密度。
进一步地，在所述步骤S3中，所述在所述传动行辘的轴承两边制作标准刻度，具体包括：
S31.对称地在所述传动行辘的轴承两边分别确定传动齿轮安装位置；
S32.在所述传动齿轮安装位置的两侧制作所述标准刻度。
进一步地，在所述步骤S3中，所述在所述传动行辘的轴承两边制作标准刻度，具体为：
在每个所述传动齿轮的两侧制作所述标准刻度，所述传动齿轮对称地安装在所述传动行辘的轴承两边。
进一步地，所述步骤S4具体为：
将浮架中的行辘竖直放置为平行的两排，两排所述行辘形成的缝隙用于放入PCB薄板进行电镀。
本发明还提供一种高精细线路PCB电镀薄板的制作系统，包括PCB传送装置与/或PCB电镀装置，所述PCB传送装置具体包括传送行辘与/或传动行辘；所述传送行辘设有多个行辘轮；所述传动行辘设有轴承，所述轴承两边制作有标准刻度；
所述PCB电镀装置具体包括竖直放置在浮架中的行辘。
具体地，所述传送行辘设有的多个行辘轮包括多个中间行辘轮，与/或对称的多个两边行辘轮。
具体地，所述传动行辘的轴承两边分别确定有对称的传动齿轮安装位置，所述标准刻度制作在所述传动齿轮安装位置的两侧，所述传动齿轮安装位置用于装入所述传动齿轮。
具体地，所述传动行辘的轴承两边对称地安装有传动齿轮，所述标准刻度制作在每个所述传动齿轮的两侧。
具体地，所述浮架中的行辘设置有平行的两排，两排所述行辘形成的缝隙用于放入PCB薄板进行电镀。
本发明提供的一种高精细线路PCB电镀薄板的制作方法及系统，其有益效果在于：
1、将传送行辘中间与/或两边的行辘轮密度增加，也即是采用行辘轮密度更大的传送行辘，与/或增大PCB板面与行辘的传动力，使得传送行辘对PCB板的传动力更加均衡，板面传送过程不会出现倾斜现象；同时将传送行辘的两边与/或中间的滚轮密度增加，让板角没有空间卡在行辘过程中，从而保证板面的制作良率；
2、在传动行辘轴两边都制作有标准刻度，然后将传动齿轮在行辘轴两边的位置记录，也即是采用制作有标准刻度的传动行辘，便于后期点检保养时核对位置，防止传动齿轮错位，同时不同安装位置的行辘，通过标准刻度限定传动齿轮的位置，方便设备组装与设备通用，降低维修保养难度；
3、将浮架中的行辘竖直放置为平行的两排，两排行辘形成的缝隙变小，铜球不会掉落而卡入其中；防止喷流不均PCB板面与浮架进行摩擦，造成擦花；防止薄板在传送过程由于铜缸浮架中间的衔接处喷流不均而导致的卡板；同时板面在缸内传动不需要行辘传动，因而行辘只是简单进行固定，不需要复杂的传动装置，还可以根据板面的厚度适当增加行辘密度，或者将行辘轮交错设置，也不会影响电镀均匀性。
图1是本发明实施例提供的一种高精细线路PCB电镀薄板的制作方法及系统中传送行辘的机构示意图；
图2是本发明实施例提供的一种高精细线路PCB电镀薄板的制作方法及系统中传动行辘的机构示意图；
图3是本发明实施例提供的一种高精细线路PCB电镀薄板的制作方法及系统中的行辘与浮架的俯视图。
下面结合附图具体阐明本发明的实施方式，实施例的给出仅仅是为了说明目的，并不能理解为对本发明的限定，包括附图仅供参考和说明使用，不构成对本发明专利保护范围的限制，因为在不脱离本发明精神和范围基础上，可以对本发明进行许多改变。
实施例1
高精细线路PCB电镀薄板(本申请中有时也简称为PCB板)特点主要是高集成化，因而线路密集的情况下板的厚度也较薄，通常在电镀线路等工序中，容易出现水平线卡板、弯板、断板等现象，对于此现象，经过观察，发现主要是板角在输送过程中翘起产生。再经过仔细观察发现，薄板板翘主要是因为行辘两边与中间的传送接触面积小，板面两边传送力度不均匀，导致板两边传送速度不同，使板面传送倾斜，从而导致板面卡在行辘中间，后面的板面继续前进从而导致大量的卡板。
针对以上问题，本发明实施例提供的一种高精细线路PCB电镀薄板的制作方法，增大传送行辘的行辘轮的密度，同时增大施加在所述传送行辘上的传送力；或者，在传送力已经较大的情况下，只是增大传送行辘的行辘轮的密度。
进一步地，增大传送行辘的行辘轮的密度，可以是增大传送行辘的中间行辘轮的密度，可以是将中间行辘轮与左右两边的行辘轮都按照同等数量、同样 间隔安装，优选采用如图1所示的3个。
本实施例将传送行辘中间与/或两边的行辘轮密度增加，与/或增大PCB板面与行辘的传动力，使得传送行辘对PCB板的传动力更加均衡，板面传送过程不会出现倾斜现象；同时将传送行辘的两边与/或中间的滚轮密度增加，让板角没有空间卡在行辘过程中，从而保证板面的制作良率。
实施例2
在具体制作过程中，也会发现行辘不转动也是薄板弯板与卡板的重要原因，经过观察发现行辘不转动的重要原因是传动齿轮错位造成。
为解决该技术问题，本实施例提供一种高精细线路PCB电镀薄板的制作方法，具体是以传动行辘的传动齿轮为参照，在所述传动行辘的轴承两边制作标准刻度。所谓在所述传动行辘的轴承两边制作标准刻度，也可以是两种情况：第一种是轴承两边并未安装传动齿轮，先对称地在所述传动行辘的轴承两边分别确定传动齿轮安装位置，然后根据在该传动齿轮安装位置的两侧制作标准刻度；第二种是传动齿轮已经先安装好，这时以传动齿轮为参照，制作标准刻度，也即是在每个所述传动齿轮的两侧制作所述标准刻度，所述传动齿轮对称地安装在所述传动行辘的轴承两边。
如图2所示的刻度区域，标准位置也即刻度的起始位置，也作为后期点检保养时的核对位置。
本实施例在传动行辘轴两边都制作有标准刻度，然后将传动齿轮在行辘轴两边的位置记录，便于后期点检保养时核对位置，防止传动齿轮错位，同时不同安装位置的行辘，通过标准刻度限定传动齿轮的位置，方便设备组装与设备通用，降低维修保养难度。
实施例3
在VCP电镀镀铜中发现有薄板弯折现象，经过排空药水发现是浮架架构异常、外加电镀喷流不均匀、铜球掉落导致。
为解决该技术问题，本实施例提供一种高精细线路PCB电镀薄板的制作方法，具体是将浮架中的行辘竖直放置，进一步地将浮架中的行辘竖直放置为平行的两排，两排所述行辘形成的缝隙用于放入PCB薄板进行电镀，如图3所示，其中，每一排行辘中的一行辘与另一行辘之间的行辘轮可交错设置，根据薄板厚度，可如实施例一般增大行辘轮的密度(薄板越薄，行辘轮的密度设置得越高)，以保证电镀的均匀性。
本实施例将浮架中的行辘竖直放置为平行的两排，两排行辘形成的缝隙变小，铜球不会掉落而卡入其中；防止喷流不均PCB板面与浮架进行摩擦，造成擦花；防止薄板在传送过程由于铜缸浮架中间的衔接处喷流不均而导致的卡板；同时板面在缸内传动不需要行辘传动，因而行辘只是简单进行固定，不需要复杂的传动装置，还可以根据板面的厚度适当增加行辘密度，或者将行辘轮交错设置，也不会影响电镀均匀性。
实施例4
本实施例为实施例1、2、3的总和，也即是在具体实施方案时，做到每一个环节的严格把关，能够实现制作PCB电镀薄板良率的最大化，满足实际加工需求。
实施例5
本实施例对应于实施例1，针对与实施例1相同的技术问题，本发明实施例提供的一种高精细线路PCB电镀薄板的制作系统，包括PCB传送装置，所述传送行辘设有多个行辘轮。具体地，所述传送行辘设有的多个行辘轮包括多个中间行辘轮，与/或对称的多个两边行辘轮。也即是，可以是中间行辘轮设置为多个，可以是将中间行辘轮与左右两边的行辘轮都按照同等数量、同样间隔设置为多个，优选采用如图1所示的3个。
本实施例采用行辘轮密度更大的传送行辘，与/或增大PCB板面与行辘的传动力，使得传送行辘对PCB板的传动力更加均衡，板面传送过程不会出现倾斜 现象；同时将传送行辘的两边与/或中间的滚轮密度增加，让板角没有空间卡在行辘过程中，从而保证板面的制作良率。
实施例6
本实施例对应于实施例2，为解决与实施例2相同的技术问题，本实施例提供一种高精细线路PCB电镀薄板的制作系统，包括PCB传送装置，所述PCB传送装置具体包括传动行辘，所述传动行辘设有轴承，所述轴承两边制作有标准刻度。
优选地，所述传动行辘的轴承两边分别确定有对称的传动齿轮安装位置，所述标准刻度制作在所述传动齿轮安装位置的两侧，所述传动齿轮安装位置用于装入所述传动齿轮。
具体是以传动行辘的传动齿轮为参照，在所述传动行辘的轴承两边制作标准刻度。所谓在所述传动行辘的轴承两边制作标准刻度，也可以是两种情况：第一种是轴承两边并未安装传动齿轮，先对称地在所述传动行辘的轴承两边分别确定传动齿轮安装位置，然后根据在该传动齿轮安装位置的两侧制作标准刻度；第二种是传动齿轮已经先安装好，这时以传动齿轮为参照，制作标准刻度，也即是在每个所述传动齿轮的两侧制作所述标准刻度，所述传动齿轮对称地安装在所述传动行辘的轴承两边。
如图2所示的刻度区域，标准位置也即刻度的起始位置，也作为后期点检保养时的核对位置。
本实施例采用在传动行辘轴两边都制作有标准刻度的传动行辘，然后将传动齿轮在行辘轴两边的位置记录，便于后期点检保养时核对位置，防止传动齿轮错位，同时不同安装位置的行辘，通过标准刻度限定传动齿轮的位置，方便设备组装与设备通用，降低维修保养难度。
实施例7
本实施例对应于实施例3，为解决与实施例3相同的技术问题，本实施例提 供一种高精细线路PCB电镀薄板的制作系统，包括PCB电镀装置，所述PCB电镀装置具体包括竖直放置在浮架中的行辘。所述浮架中的行辘设置有平行的两排，两排所述行辘形成的缝隙用于放入PCB薄板进行电镀，如图3所示，其中，每一排行辘中的一行辘与另一行辘之间的行辘轮可交错设置，根据薄板厚度，可如实施例一般增大行辘轮的密度(薄板越薄，行辘轮的密度设置得越高)，以保证电镀的均匀性。
本实施例将浮架中的行辘竖直放置为平行的两排，两排行辘形成的缝隙变小，铜球不会掉落而卡入其中；防止喷流不均PCB板面与浮架进行摩擦，造成擦花；防止薄板在传送过程由于铜缸浮架中间的衔接处喷流不均而导致的卡板；同时板面在缸内传动不需要行辘传动，因而行辘只是简单进行固定，不需要复杂的传动装置，还可以根据板面的厚度适当增加行辘密度，或者将行辘轮交错设置，也不会影响电镀均匀性。
实施例8
本实施例为实施例5、6、7的总和，也即是在具体实施方案时，做到相应环节都采用实施例5、6、7所述的装置，能够实现制作PCB电镀薄板良率的最大化，满足实际加工需求。
上述实施例为本发明较佳的实施方式，但本发明的实施方式并不受上述实施例的限制，其他的任何未背离本发明的精神实质与原理下所作的改变、修饰、替代、组合、简化，均应为等效的置换方式，都包含在本发明的保护范围之内。
Claims (10)
- 一种高精细线路PCB电镀薄板的制作方法，包括PCB传送步骤与/或PCB电镀步骤，其特征在于，所述PCB传送步骤具体包括：S1.增大传送行辘的行辘轮的密度；S2.与/或，增大施加在所述传送行辘上的传送力；S3.与/或，以传动行辘的传动齿轮为参照，在所述传动行辘的轴承两边制作标准刻度；所述PCB电镀步骤具体包括：S4.将浮架中的行辘竖直放置。
- 如权利要求1所述的一种高精细线路PCB电镀薄板的制作方法，其特征在于，所述步骤S1具体为：S11.增大传送行辘的中间行辘轮的密度；S12.与/或，增大传送行辘的两边行辘轮的密度。
- 如权利要求1所述的一种高精细线路PCB电镀薄板的制作方法，其特征在于，在所述步骤S3中，所述在所述传动行辘的轴承两边制作标准刻度，具体包括：S31.对称地在所述传动行辘的轴承两边分别确定传动齿轮安装位置；S32.在所述传动齿轮安装位置的两侧制作所述标准刻度。
- 如权利要求1所述的一种高精细线路PCB电镀薄板的制作方法，其特征在于，在所述步骤S3中，所述在所述传动行辘的轴承两边制作标准刻度，具体为：在每个所述传动齿轮的两侧制作所述标准刻度，所述传动齿轮对称地安装 在所述传动行辘的轴承两边。
- 如权利要求4所述的一种高精细线路PCB电镀薄板的制作方法，其特征在于，所述步骤S4具体为：将浮架中的行辘竖直放置为平行的两排，两排所述行辘形成的缝隙用于放入PCB薄板进行电镀。
- 一种高精细线路PCB电镀薄板的制作系统，包括PCB传送装置与/或PCB电镀装置，其特征在于：所述PCB传送装置具体包括传送行辘与/或传动行辘；所述传送行辘设有多个行辘轮；所述传动行辘设有轴承，所述轴承两边制作有标准刻度；所述PCB电镀装置具体包括竖直放置在浮架中的行辘。
- 如权利要求6所述的一种高精细线路PCB电镀薄板的制作系统，其特征在于：所述传送行辘设有的多个行辘轮包括多个中间行辘轮，与/或对称的多个两边行辘轮。
- 如权利要求6所述的一种高精细线路PCB电镀薄板的制作系统，其特征在于：所述传动行辘的轴承两边分别确定有对称的传动齿轮安装位置，所述标准刻度制作在所述传动齿轮安装位置的两侧，所述传动齿轮安装位置用于装入所述传动齿轮。
- 如权利要求6所述的一种高精细线路PCB电镀薄板的制作系统，其特征在于：所述传动行辘的轴承两边对称地安装有传动齿轮，所述标准刻度制作在每个所述传动齿轮的两侧。
- 如权利要求1所述的一种高精细线路PCB电镀薄板的制作系统，其特征在于：所述浮架中的行辘设置有平行的两排，两排所述行辘形成的缝隙用于放入PCB薄板进行电镀。
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