WO2020124417A1 - 柔性面板及柔性面板制作方法 - Google Patents

柔性面板及柔性面板制作方法 Download PDF

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Publication number
WO2020124417A1
WO2020124417A1 PCT/CN2018/121997 CN2018121997W WO2020124417A1 WO 2020124417 A1 WO2020124417 A1 WO 2020124417A1 CN 2018121997 W CN2018121997 W CN 2018121997W WO 2020124417 A1 WO2020124417 A1 WO 2020124417A1
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WO
WIPO (PCT)
Prior art keywords
flexible
flexible panel
binding area
panel according
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/121997
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English (en)
French (fr)
Inventor
张瑶
袁泽
朱林
陈鑫
李贺
胡康军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Royole Technologies Co Ltd
Original Assignee
Shenzhen Royole Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Priority to PCT/CN2018/121997 priority Critical patent/WO2020124417A1/zh
Priority to CN201880097633.5A priority patent/CN113168790A/zh
Publication of WO2020124417A1 publication Critical patent/WO2020124417A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements

Definitions

  • the present application relates to the field of flexible equipment, in particular to a flexible panel and a method of manufacturing the flexible panel.
  • the base material of the flexible display panel or the flexible touch panel is easily deformed under the action of heat and pressure.
  • the substrate is easily deformed during the hot pressing process, resulting in the inability of the electronic device on the substrate to be effectively connected to the functional element at the binding area, which affects the functional stability of the flexible panel.
  • the application provides a flexible panel and a method for manufacturing the flexible panel.
  • the present application provides a flexible panel, wherein the flexible panel includes a base material and an electronic device, the base material is provided with a flexible portion and a hard portion connected to the flexible portion, and the hard portion is provided with binding Area, the electronic device is fixed to the flexible portion, and the electronic device is connected to a wire extending to the binding area.
  • This application provides a method for manufacturing a flexible panel, wherein,
  • the manufacturing method of the flexible panel includes the following steps:
  • the substrate having a portion to be processed and a flexible portion connected to the portion to be processed;
  • An electronic device is formed on the flexible portion, and a wire connecting the electronic device is formed, the wire extending to the binding area.
  • the flexible panel and the manufacturing method of the flexible panel of the present application are provided with a flexible part and a hard part connected with the flexible part through the base material, and the hard part is provided with a binding area, so that the base material of the binding area is not easily deformed and prevents electricity
  • the wire connecting the electronic device fails to connect with the functional element in the binding area, which improves the functional stability of the flexible panel.
  • FIG. 1 is a schematic diagram of a flexible panel provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a flexible touch display screen provided by an embodiment of the present application.
  • FIG. 3 is a schematic diagram of a flexible display screen provided by another embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional view of a flexible panel provided by an embodiment of the present application.
  • FIG. 5 is another schematic diagram of the flexible panel provided by the embodiment of the present application.
  • FIG. 6 is a schematic diagram of a flexible panel provided by another embodiment of the present application.
  • FIG. 7 is another schematic cross-sectional view of a flexible panel provided by an embodiment of the present application.
  • FIG. 8 is another schematic cross-sectional view of a flexible panel provided by an embodiment of the present application.
  • FIG. 9 is another schematic cross-sectional view of a flexible panel provided by an embodiment of the present application.
  • FIG. 10 is a processing schematic diagram of step 101 of manufacturing a flexible panel provided by an embodiment of the present application.
  • FIG. 11 is another processing schematic diagram of step 101 of manufacturing a flexible panel provided by an embodiment of the present application.
  • FIG. 12 is a schematic diagram of the processing from step 101 to step 106 of manufacturing a flexible panel provided by an embodiment of the present application.
  • FIG. 13 is a schematic flowchart of manufacturing a flexible panel provided by an embodiment of the present application.
  • FIG. 14 is a schematic view of the manufacturing process of a flexible panel provided by another embodiment of the present application.
  • 15 is a schematic flowchart of manufacturing a flexible panel provided by another embodiment of the present application.
  • 16 is a schematic view of the manufacturing process of a flexible panel provided by another embodiment of the present application.
  • FIG. 17 is a schematic flowchart of manufacturing a flexible panel provided by another embodiment of the present application.
  • a component when a component is said to be “fixed” to another component, it can be directly on another component or there can also be a centered component. When a component is considered to be “connected” to another component, it can be directly connected to another component or there may be a centered component at the same time.
  • the present application provides a flexible panel 100.
  • the flexible panel 100 includes a base material 10 and an electronic device 20.
  • the base material 10 is provided with a flexible portion 11 and a hard portion 12 connected to the flexible portion 11.
  • the hard portion 12 is provided with a binding area 121.
  • the electronic device 20 is fixed to the flexible portion 11, and the electronic device 20 is connected to the wire 30 extending to the binding area 121.
  • the flexible panel 100 may be a flexible sensor such as a flexible sensor, a flexible display panel, or a flexible touch panel.
  • the flexible panel 100 may be applied to a bendable or stretchable electronic device, and the bendable or stretchable electronic device may be a wearable device such as a mobile phone, a watch, a wristband, or the like.
  • the flexible panel 100 can also be used in bendable or stretchable electronic devices in the fields of monitoring, entertainment interaction, and smart wear.
  • the base material 10 is provided with a flexible portion 11 and a hard portion 12 connected to the flexible portion 11, and the hard portion 12 is provided with a binding area 121, so that the binding area 121 is not easily deformed, and the connection between the electronic device 20 and the functional element is prevented , The functional stability of the flexible panel 100 is improved.
  • the substrate 10 is a substrate having flexibility and flexibility or a substrate having elasticity and being stretchable.
  • the base material 10 includes a first short side 13 and a second short side 14 disposed opposite to the first short side 13, and two opposite long sides 15 connected between the first short side 13 and the second short side 14.
  • the flexible portion 11 occupies a larger area of the base material 10, and the hard portion 12 is substantially adjacent to the first short side 13.
  • the hard portion 12 is substantially elongated.
  • the hard portion 12 extends substantially parallel to the first short side 13.
  • the length of the hard portion 12 is approximately equal to the length of the first short side 13.
  • the hardness of the hard portion 12 is greater than the hardness of the flexible portion 11.
  • the thickness of the flexible portion 11 coincides with the thickness of the hard portion 12.
  • the thickness of the substrate 10 is approximately 5 ⁇ m to 80 ⁇ m.
  • the flexible portion 11 can be bent arbitrarily according to requirements to meet the bending requirements of the base material 10, and can also be arbitrarily stretched according to requirements to meet the stretching requirements of the base material 10.
  • the hard portion 12 has strong internal stress, and the hard portion 12 is not likely to deform under the action of heat and pressure.
  • the hard portion 12 can provide a more stable connection structure for the binding area 121 to facilitate the reliable connection of the substrate 10 and the functional element in the binding area 121 and prevent the substrate 10 from being in the binding area 121 during the hot pressing process
  • the electronic device 20 is disconnected from the functional element to improve the functional stability of the flexible panel 100.
  • the hard portion 12 may extend substantially parallel to the long side 15.
  • the electronic device 20 is a touch electrode. That is, the flexible panel 100 is a flexible touch panel, and the flexible panel 100 can be applied to electronic devices such as folding mobile phones, flexible wearable devices, and flexible detection devices that can sense external signals.
  • the electronic device 20 may be composed of a plurality of capacitance sensing units 21. A plurality of capacitive sensing units 21 are arranged in an array on the flexible portion 11. The plurality of capacitive sensing units 21 may be printed on the substrate 10 by a screen printing process. The plurality of capacitive sensing units 21 may move closer to or move away from each other as the flexible portion 11 bends or stretches.
  • the wire 30 includes a plurality of signal lines 31.
  • the signal line 31 is connected to the capacitance sensing unit 21, and one end of the signal line 31 extends to the binding area 121, so that the functional element is connected to the signal line 31 in the binding area 121, and the sensing signals of the plurality of capacitance sensing units 21 are obtained.
  • the signal line 31 can be bent and stretched along with the flexible portion 11, so that the flexible panel 100 can sense a signal when it is bent or stretched.
  • the signal line 31 located at one end of the binding area 121 constitutes the leading end of the electronic device 20.
  • the hard portion 12 reinforces the base material 10 located in the binding area 121 to prevent the binding area 121 from making poor contact with the functional element during the hot pressing process, thereby increasing the functional stability of the flexible panel 100.
  • the flexible panel 100 is a flexible touch panel.
  • a flexible touch display 1000 is provided.
  • the flexible touch display 1000 includes a transparent cover 1001, a flexible panel 100, and a display panel 1002. .
  • the flexible panel 100 is attached between the light-transmitting cover plate 1001 and the display panel 1002.
  • the flexible portion 11 of the flexible panel 100 is substantially aligned with the display area of the display panel 1002, so that the flexible panel 100 can form a virtual key in combination with the display area of the display panel 1002.
  • the binding area 121 of the flexible panel 100 may protrude from the display panel 1002 to facilitate binding with the flexible circuit board 70, so that the flexible touch display screen 1000 has a touch function.
  • the flexible panel 100 may also be attached to the side of the display panel 1002 facing away from the light-transmitting cover plate 1001, or integrated into the light-transmitting cover plate 1001.
  • the flexible panel 100 can also be applied to wearable devices such as wristbands, watches, straps and the like that need to be provided with a touch function.
  • FIG. 3 is different from the embodiment shown in FIG. 2 in that the flexible panel 100 is a flexible display panel.
  • a flexible display screen 2000 is provided.
  • the flexible display screen 2000 includes a light-transmitting cover plate 2001 and a flexible panel 100.
  • the flexible panel 100 is attached to the light-transmitting cover plate 2001.
  • the flexible panel 100 further includes a display layer 110, and the display layer 110 is attached to the side of the substrate 10 where the electronic device 20 is arranged.
  • the display layer 110 has a plurality of light emitting cells in an array.
  • the electronic device 20 is a driving electrode.
  • the electronic device 20 can drive the plurality of light emitting units of the display layer 110 to emit light.
  • the electronic device 20 may be composed of a plurality of drive units 22 in an array.
  • Each driving unit 22 is directly opposite to each light emitting unit of the display layer 110.
  • Each driving unit 22 may be composed of a thin film crystal diode switch.
  • the flexible portion 11 is substantially aligned with the display area of the display layer 110 to facilitate driving the display area of the display layer 110 through the electronic device 20 to display an image in a light-emitting manner.
  • the binding area 121 protrudes from the display layer 110 to facilitate binding with the flexible circuit board 70, so that the flexible display screen 2000 can obtain the display signal through the flexible circuit board 70.
  • the flexible panel 100 may also be applied to electronic devices with flexible display functions such as foldable tablet computers, foldable displays, and the like.
  • the substrate 10 is provided with a groove 122, and the hard portion 12 is provided in the groove 122.
  • the groove 122 may be formed by a hot press mold, or may be formed by laser engraving, or may be formed by solvent etching.
  • the substrate 10 has a first surface 115 and a second surface 116 opposite to the first surface 115.
  • the binding area 121 is located on the first surface 115.
  • the groove 122 may extend through the first surface 115 toward the second surface 116.
  • the groove 122 has an opening 124 in the first surface 115.
  • the bottom of the groove 122 may also penetrate the second surface 116, that is, the groove 122 may completely penetrate the substrate 10.
  • the hard portion 12 may be filled in the groove 122 through an injection process.
  • the hard portion 12 forms a fixed block with higher hardness in the groove 122 through a curing process.
  • the hard portion 12 may be silicone, epoxy resin, acrylic resin or other resin containing inorganic nanoparticles.
  • the hard portion 12 has an upper surface 125 substantially flush with the first surface 115.
  • a wire 30 extending to the binding area 121 may be provided on the upper surface 125.
  • the upper surface 125 of the hard portion 12 provides a stable connection platform for the wire 30.
  • the hard portion 12 can be formed in the groove 122 by a mold, and can be integrally formed with the base material 10. By increasing the structural stability of the base material 10, the functional stability of the flexible panel 100 is increased.
  • the groove 122 is filled with the material to be hardened, and the hard portion 12 is formed after the hardened material is hardened, and finally the binding area 121 is formed on the hard portion 12.
  • the periphery of the opening 124 of the groove 122 is spaced from the periphery of the binding area 121, and the edge of the opening 124 of the groove 122 is parallel to the edge of the binding area 121. That is, the peripheral edge of the opening 124 is spaced from the peripheral edge of the binding area 121.
  • the binding area 121 occupies a part of the hard portion 12.
  • the hard portion 12 provides a high-rigidity support structure for the binding area 121 to facilitate the conduction of the wires 30 and the functional elements in the binding area 121.
  • the area of the hard portion 12 beyond the binding area 121 can still provide a support structure with high hardness for the wire 30, further enhancing the functional stability of the flexible panel 100.
  • FIG. 6 is different from the embodiment shown in FIG. 5 in that the groove 122 forms a plurality of spaced sub-grooves 126 around the binding area 121.
  • the opening 124 has a plurality of inner edges 1241 substantially aligned with the peripheral edge of the binding area 121 and a plurality of outer edges 1242 opposite the peripheral edge of the binding area 121.
  • a plurality of inner edges 1241 and a plurality of outer edges 1242 are staggered along the circumferential direction of the binding area 121. That is, a plurality of sub-grooves 126 form a zigzag groove on the peripheral side of the binding area 121.
  • a plurality of sub-grooves 126 are arranged on the peripheral side of the binding area 121 to reduce the material cost of the hard portion 12 and ensure the structural rigidity of the hard portion 12 to improve the functional stability of the flexible panel 100.
  • the flexible panel 100 further includes a smoothing layer 40 coated on the substrate 10, and the smoothing layer 40 covers the boundary between the hard portion 12 and other adjacent areas.
  • the wires 30 are arranged on the side of the smoothing layer 40 facing away from the substrate 10.
  • the smoothing layer 40 is formed on the upper surface 125 of the hard portion 12 and a portion of the first surface 115 of the base material 10.
  • the smoothing layer 40 covers the opening 124.
  • the smooth layer 40 is formed after the hard portion 12 is filled in the groove 122.
  • the smoothing layer 40 compensates for the gap between the hard portion 12 and other adjacent areas, so that the flexible panel 100 can obtain a flat surface at the junction of the hard portion 12 and other adjacent areas, so as to facilitate the wire 30 in the hard portion 12 and wiring on other adjacent areas.
  • the smoothing layer 40 also covers the bonding area 121 so that the wire 30 extends to the bonding area 121 on the smoothing layer 40 to facilitate the connection of the wire 30 of the bonding area 121 with external devices.
  • the wire 30 covers the smooth layer 40.
  • the thickness of the smoothing layer 40 is relatively thin, and the thickness of the smoothing layer 40 is smaller than the thickness of the hard portion 12.
  • the thickness difference between the flexible portion 11 and the hard portion 12 of the smoothing layer 40 is negligible to ensure the smoothness of the surface of the flexible panel 100.
  • the flexible panel 100 further includes a reinforcing layer 50.
  • the reinforcing layer 50 covers the binding area 121.
  • the reinforcing layer 50 is located on the side of the substrate 10 facing away from the wire 30.
  • the reinforcing layer 50 and the smoothing layer 40 are located on opposite sides of the substrate 10 respectively. That is, the reinforcing layer 50 is attached to the second surface 116.
  • the reinforcing layer 50 covers the groove 122. When the groove 122 has an opening penetrating the second surface 116, the reinforcing layer 50 can cover the opening of the groove 122 on the second surface 116.
  • the reinforcing layer 50 may be attached to the substrate 10 before the groove 122 is formed.
  • the reinforcing layer 50 is used to attach the substrate 10, and a groove 122 is formed on the substrate 10 corresponding to the position of the reinforcing layer 50, which can reduce the damage to the substrate 10 and prevent the opening of the groove 122 in the substrate 10 During the process, the base material 10 is deformed by the impact of stress.
  • the reinforcing layer 50 can cover the opening of the groove 122 on the second surface 116 to facilitate filling the hard portion 12 into the groove 122 through the opening 124.
  • the reinforcing layer 50 may be a metal steel sheet or a resin film.
  • the reinforcing layer 50 may cover the binding area 121 to improve the hardness of the binding area 121, ensure that the wire 30 is firmly connected to external devices in the binding area 121, and ensure the functional stability of the flexible panel 100.
  • the flexible panel 100 further includes a flexible circuit board 70.
  • a part of the flexible circuit board 70 is fixed to the binding area 121 and connected to the wire 30.
  • the flexible circuit board 70 includes a first end 71 fixedly connected to the base material 10 and a second end 72 provided opposite to the first end 71.
  • the first end 71 is fixed to the binding area 121.
  • the first end 71 covers the binding area 121.
  • the first end 71 is provided with a plurality of exposed copper.
  • the plurality of exposed copper is connected to the plurality of wires 30 in the bonding area 121 so that the electronic device 20 can be connected to the flexible circuit board 70 via the wires 30.
  • the second end 72 is offset from the substrate 10.
  • the second end 72 may be provided with a connector 721.
  • the connector 721 and the plurality of exposed copper are connected through a copper foil cable, so that the connector 721 can be connected to the electronic device 20 through the wire 30.
  • the electronic device 20 can transmit the sensing signal to the external device via the flexible circuit board 70, so that the flexible panel 100 can send the sensing signal to the outside.
  • the hard portion 12 in the groove 122 can be used to strengthen the binding area 121 to ensure that the wire 30 opposite to the binding area 121 can firmly contact the first end 71 of the flexible circuit board 70 to increase the conduction performance.
  • the flexible circuit board 70 is fixed to the binding area 121 via the conductive adhesive 80, and is connected to the wire 30 via the conductive adhesive 80.
  • the conductive adhesive 80 is bonded between the smooth layer 40 and the first end 71 of the flexible circuit board 70, so that the flexible circuit board 70 and the substrate 10 are firmly bonded, and the exposed copper of the flexible circuit board 70 and the wire 30 can be effectively guided through.
  • the flexible circuit board 70 and the substrate 10 are firmly connected by the conductive adhesive 80, the flexible circuit board 70, the conductive adhesive 80 and the substrate 10 need to be heated, and the flexible circuit board 70 and the substrate 10 are under greater pressure
  • the conductive adhesive 80 is squeezed under the action to make the conductive particles in the conductive adhesive 80 conduct up and down, so that the conductive adhesive 80 can exhibit stable bonding and conduction performance.
  • the hard portion 12 in the groove 122 reinforces the binding area 121, and the reinforcing layer 50 reinforces the binding area 121, so that the hardness of the binding area 121 increases, and the base material 10 is not easily deformed at the binding area 121 To improve the connection reliability of the flexible circuit board 70 and the electronic device 20 of the base material 10.
  • the present application also provides a method for manufacturing a flexible panel, which includes the steps of:
  • a base material 10 is provided.
  • the base material 10 to be processed has a portion 111 to be processed and a flexible portion 11 connected to the portion 111 to be processed.
  • the base material 10 may be obtained through a cutting process.
  • the base material 10 may have a rectangular shape.
  • the portion to be processed 111 may be located at one end of the base material 10 in the longitudinal direction. By setting the area to be processed in advance on the portion to be processed 111, it is convenient for subsequent processing of the portion to be processed 111.
  • the thickness of the substrate 110 may be 5 ⁇ m to 80 ⁇ m.
  • the substrate 10 has a first short side 13 and a second short side 14 disposed opposite to the first short side 13 and two opposite long sides 15 connected between the first short side 13 and the second short side 14.
  • the portion to be processed 111 is adjacent to the first short side 13.
  • the portion to be processed 111 is provided integrally with the flexible portion 11.
  • the processed part 111 is processed to obtain a base material with a certain hardness, thereby improving the safety of the flexible panel.
  • this step 102 includes the steps of:
  • the groove 122 is machined in the portion to be processed 111.
  • the groove 122 may be formed by a hot press mold, or may be formed by laser engraving, or may be formed by solvent etching.
  • the groove 122 is formed by setting a molding area of the groove 122 on the portion to be processed 111 in advance and processing the portion to be processed 111 using a mold.
  • the depth of the groove 122 can be adjusted as needed.
  • the groove 122 may completely penetrate the substrate 110 to be processed, or the depth of the groove 122 is less than the thickness of the substrate 10.
  • the groove 122 is filled with the material to be hardened.
  • the material to be hardened may be filled in the groove 122 by injection molding, or may be filled in the groove 122 by a coating process, or may be filled in the groove 122 by a printing process.
  • the hardened material is filled in the groove 122, it is generally in the form of a fluid gel.
  • the hardened material does not have hardness and cannot meet the strength requirements of the flexible panel.
  • the hardened material needs to be further processed.
  • the material to be hardened may be silicone, epoxy resin, acrylic resin or other resin containing inorganic nanoparticles.
  • the hardened material is processed to form the hard portion 12.
  • the material to be hardened is cured so that the material to be hardened forms a fixed block with a certain hardness.
  • the material to be hardened may be cured through a light curing process, or may be cured through a thermal curing process, or may be cured through a combination of light curing and thermal curing, so that the hardness of the hard portion 12 may be performed as needed.
  • the adjustment makes the flexible panel 100 meet the requirements of use, that is, it can ensure a certain hardness, and can also meet the bending and tensile deformation properties.
  • a binding area 121 may be provided on the hard portion 12 to use the hard portion 12 to enhance the hardness of the binding area 121 to prevent the binding area 121 from being generated under the action of heat and pressure deformation.
  • the flexible panel manufacturing method also includes steps:
  • a smooth layer 40 is formed on the base material 10, and the smooth layer 40 covers the boundary between the hard portion 12 and other adjacent regions.
  • the smoothing layer 40 may be formed on the substrate 10 by a printing or coating process.
  • the smoothing layer 40 covers the gap between the hard portion 12 and other adjacent areas, so that the flexible panel can obtain a relatively flat surface, which facilitates the arrangement of the wires 30 of the flexible panel 100.
  • the electronic device 20 and the wire 30 can be printed on the base material 10 using processes such as screen printing.
  • the electronic device 20 may be composed of a plurality of capacitive sensing units 21 arranged in an array.
  • the electronic device 20 is molded on the flexible portion 11.
  • the wire 30 is partially formed on the flexible portion 11, and the other part is formed on the side of the smoothing layer 40 facing away from the substrate 10, that is, the wire 30 is covered on the smoothing layer 40.
  • a reinforcing layer 50 is formed on the base material 10, and the reinforcing layer 50 may be made of a metal sheet, a plastic sheet, or a resin sheet.
  • the reinforcing layer 50 is attached to the side of the base material 10 facing away from the smoothing layer 40.
  • the reinforcing layer 50 is opposite to the binding area 121 to enhance the hardness of the binding area 121.
  • 106 Provide a flexible circuit board 70, and fix the flexible circuit board 70 to the binding area 121 of the base material 10 through the conductive adhesive 80.
  • the conductive adhesive 80 is applied to the binding region 121 on the smoothing layer 40, and one end of the flexible circuit board 70 is attached to the conductive adhesive 80.
  • a certain squeezing force is applied to the flexible circuit board 70 and the substrate 10 to make the conductive particles in the conductive glue conduct up and down, and the conductive glue 80 is heated to facilitate the conductive glue 80 to firmly connect the flexible circuit board 70 and the substrate 10 , And make the flexible circuit board 70 communicate with the wire 30.
  • the reinforcing layer 50 enhances the hardness of the binding area 121, prevents the deformation of the base material 10, and ensures the functional stability of the flexible panel 100.
  • the method for manufacturing a flexible panel includes the steps of:
  • a base material 10 having a portion 111 to be processed and a flexible portion 11 connected to the portion 111 to be processed.
  • the reinforcing layer 50 is attached to the to-be-processed part 111 to facilitate the to-be-processed part 111 to provide the to-be-processed part 111 with a rigid support structure during the processing process
  • the part to be processed 111 is prevented from being damaged due to excessive processing stress.
  • the method for manufacturing a flexible panel includes the steps of:
  • a base material 10 having a portion to be processed 111 and a flexible portion 11 connected to the portion to be processed 111.
  • the base material is provided with a flexible portion and a hard portion connected with the flexible portion, and the hard portion is provided with a binding area, so that the binding area is not easily deformed, preventing the failure of the connection of electronic devices and functional elements in the binding area, and improving the flexible panel Functional stability.

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Abstract

本申请提供一种柔性面板及柔性面板制作方法，所述柔性面板(100)包括基材(10)和电子器件(20)，所述基材(100)设有柔性部(11)和与所述柔性部(11)连接的硬质部(12)，所述硬质部(12)设有绑定区(121)，所述电子器件(20)固定于所述柔性部(11)，所述电子器件(20)与延伸至所述绑定区(121)的导线(30)连接。通过基材(10)设有柔性部(11)和柔性部连接的硬质部(12)，硬质部(12)设有绑定区(121)，使得绑定区(121)不易产生变形，防止电子器件(20)和绑定区(121)的基材(10)与功能元件连接失效，提高了柔性面板(100)功能稳定性。

Description

柔性面板及柔性面板制作方法 技术领域
本申请涉及柔性设备领域，具体涉及一种柔性面板及柔性面板制作方法。
背景技术
目前柔性显示面板或柔性触摸面板的基材在受热、受压作用下，容易产生变形。比如，基材在热压过程中，容易引起变形，导致基材上的电子器件在绑定区处与功能元件无法有效的连接，影响柔性面板功能稳定性。
发明内容
本申请提供一种柔性面板及柔性面板制作方法。
本申请提供一种柔性面板，其中，所述柔性面板包括基材和电子器件，所述基材设有柔性部和与所述柔性部连接的硬质部，所述硬质部设有绑定区，所述电子器件固定于所述柔性部，所述电子器件与延伸至所述绑定区的导线连接。
本申请提供一种柔性面板制作方法，其中，
所述柔性面板制作方法包括步骤：
提供基材，所述基材具有待加工部和与所述待加工部连接的柔性部；
对所述待加工部进行加工，以使所述待加工部形成具有绑定区的硬质部；
在所述柔性部上形成电子器件，并形成连接所述电子器件的导线，所述导线延伸至所述绑定区。
本申请的柔性面板及柔性面板的制作方法，通过基材设有柔性部和柔性部连接的硬质部，硬质部设有绑定区，使得绑定区的基材不易产生变形，防止电连接电子器件的导线在绑定区与功能元件连接失效，提高了柔性面板功能稳定性。
附图说明
图1是本申请实施例提供的柔性面板的示意图。
图2是本申请实施例提供的柔性触摸显示屏的示意图。
图3是本申请另一实施例提供的柔性显示屏的示意图。
图4是本申请实施例提供的柔性面板的截面示意图。
图5是本申请实施例提供的柔性面板的另一示意图。
图6是本申请另一实施例提供的柔性面板的示意图。
图7是本申请实施例提供的柔性面板的另一截面示意图。
图8是本申请实施例提供的柔性面板的另一截面示意图。
图9是本申请实施例提供的柔性面板的另一截面示意图。
图10是本申请实施例提供的柔性面板制作的步骤101的加工示意图。
图11是本申请实施例提供的柔性面板制作的步骤101的另一加工示意图。
图12是本申请实施例提供的柔性面板制作的步骤101～步骤106的加工示意图。
图13是本申请实施例提供的柔性面板制作的流程示意图。
图14是本申请另一实施例提供的柔性面板制作的加工示意图。
图15是本申请另一实施例提供的柔性面板制作的流程示意图。
图16是本申请另一实施例提供的柔性面板制作的加工示意图。
图17是本申请另一实施例提供的柔性面板制作的流程示意图。
具体实施例
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明的是，当组件被称为“固定于”另一个组件，它可以直接在另一个组件上或者也可以存在居中的组件。当一个组件被认为是“连接”另一个组件，它可以是直接连接到另一个组件或者可能同时存在居中组件。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
下面结合附图，对本发明的一些实施方式作详细说明。在不冲突的情况下，下述的实施例及实施例中的特征可以相互组合。
请参阅图1，本申请提供一种柔性面板100，柔性面板100包括基材10和电子器件20，基材10设有柔性部11和与柔性部11连接的硬质部12。硬质部12设有绑定区121。电子器件20固定于柔性部11，电子器件20与延伸至绑定区121的导线30连接。可以理解的是，柔性面板100可以是柔性传感器、或柔性显示面板、或柔性触摸面板等柔性面板。柔性面板100可以应用于可弯曲或可拉伸的电子设备中，可弯曲或可拉伸的电子设备可以是手机、手表、护腕等可穿戴设备。柔性面板100还可以用于检测监测、娱乐交互和智能穿戴等领域的可弯曲或可拉伸电子设备中。
通过基材10设有柔性部11和与柔性部11连接的硬质部12，硬质部12设有绑定区121，使得绑定区121不易产生变形，防止电子器件20与功能元件连接失效，提高了柔性面板100功能稳定性。
本实施方式中，基材10为具有柔性性能可弯曲的基材或具有弹性性能可拉伸的基材。基材10包括第一短边13和相对第一短边13设置的第二短边14，以及连接于第一短边13和第二短边14之间的两个相对的长边15。柔性部11占据基材10较大的面积，硬质部12大致邻近于第一短边13。硬质部12大致呈长条状。硬质部12大致沿平行于第一短边13的方向延伸。硬质部12的长度大致与第一短边13的长度相等。硬质部12的硬度大于柔性部11的硬度。柔性部11的厚度与硬质部12的厚度一致。基材10的厚度大致为5μm～80μm。柔性部11可以根据需求任意弯曲，以满足基材10的弯曲要求，还可以根据需求任意拉伸，以满足基材10的拉伸要求。硬质部12具有较强的内应力，硬质部12在受热、受压作用下，不易产生变形。硬质部12可以为绑定区121提供较稳固的连接结构，以方便基材10在绑 定区121与功能元件可靠连接，防止基材10在热压过程中基材10在绑定区121的电子器件20与功能元件断开连接，提高柔性面板100功能稳定性。当然，在其他实施方式中，硬质部12也可以大致沿平行于长边15的方向延伸。
本实施方式中，电子器件20为触控电极。即柔性面板100为柔性触控面板，柔性面板100可以应用于可感应外部信号的折叠手机、柔性可穿戴设备、柔性检测设备等电子设备。作为一种实施方式，电子器件20可以是由多个电容感应单元21构成。多个电容感应单元21在柔性部11上阵列排布。多个电容感应单元21可以是丝网印刷工艺印刷于基材10上。多个电容感应单元21可以随柔性部11弯曲或拉伸而相互靠拢或相互远离。导线30包括多条信号线31。信号线31连接电容感应单元21，信号线31的一端延伸至绑定区121，方便功能元件在绑定区121与信号线31导通，并实现获取多个电容感应单元21的感应信号。信号线31可以随柔性部11弯曲、拉伸，以方便柔性面板100在弯曲、拉伸形变状态下可以感应信号。信号线31位于绑定区121的一端构成电子器件20的引导端。硬质部12对位于绑定区121的基材10补强，防止绑定区121在热压过程与功能元件接触不良，增加柔性面板100功能稳定性。
本实施方式中，所述柔性面板100为柔性触控面板，如图2所示，提供一种柔性触摸显示屏1000，柔性触摸显示屏1000包括透光盖板1001、柔性面板100和显示面板1002。所述柔性面板100贴合于所述透光盖板1001和所述显示面板1002之间。所述柔性面板100的柔性部11大致与所述显示面板1002的显示区域相对齐，以使得所述柔性面板100可以结合所述显示面板1002的显示区域形成虚拟按键。所述柔性面板100的绑定区121可以相对显示面板1002凸出，方便与柔性电路板70绑定，以使得所述柔性触摸显示屏1000具有触控功能。当然，在其他实施方式中，所述柔性面板100还可以贴合于显示面板1002背离透光盖板1001一侧，或者是集成于透光盖板1001。当然，所述柔性面板100也可以应用于护腕、手表、绑带等具有需要设置触控功能的可穿戴设备。
在另一个实施例中，请参阅图3，与图2所示实施例不同的是，所述柔性面板100为柔性显示面板。提供了一种柔性显示屏2000，柔性显示屏2000包括透光盖板2001和柔性面板100。柔性面板100贴合于所述透光盖板2001，柔性面板100还包括显示层110，显示层110贴合于所述基材10排布所述电子器件20一侧。显示层110具有阵列的多个发光单元。电子器件20为驱动电极。电子器件20可以驱动所述显示层110的多个发光单元发光。电子器件20可以由阵列的多个驱动单元22构成。每一驱动单元22与显示层110的每一发光单元正对。每一驱动单元22可以由薄膜晶体二极管开关构成。柔性部11与显示层110的显示区域大致对齐，以方便通过电子器件20驱动显示层110的显示区域发光显示图像。绑定区121相对显示层110凸出，方便与柔性电路板70绑定，以使得柔性显示屏2000可以经柔性电路板70获取显示信号。当然，在其他实施方式中，柔性面板100也可以是应用于可折叠平板电脑、可折叠显示器等具有柔性显示功能的电子设备中。
进一步地，请参阅图4和图5，基材10开设有凹槽122，硬质部12设置于凹槽122内。
本实施方式中，凹槽122可以是经热压模具加工成型，也可以是经激光雕刻成型，也可以是溶剂蚀刻成型。基材10具有第一表面115和相对第一表面115的第二表面116。绑定区121位于第一表面115。凹槽122可以是经第一表面115向第二表面116延伸。凹槽 122在第一表面115具有开口124。凹槽122的底部距离第二表面116可以存在间距，即凹槽122部分开设于基材10。凹槽122的底部也可以是贯穿第二表面116，即凹槽122可完全贯穿基材10。硬质部12可以是经注射工艺填充于凹槽122内。硬质部12经固化工艺在凹槽内122形成具有较高硬度的固定块。硬质部12可以是硅氧烷，环氧树脂，丙烯酸树脂或者含有无机纳米颗粒的其他树脂。硬质部12具有大致与第一表面115平齐的上表面125。上表面125上可以设置延伸至绑定区121的导线30，硬质部12的上表面125为导线30提供稳固连接平台。硬质部12可以经模具成型于凹槽122内，可以与基材10一体成型，通过增加基材10的结构稳固性，以增加柔性面板100的功能稳定性。
在一个实施例中，在基材10开设凹槽122后，向凹槽122内填充待硬化材料，待硬化材料硬化后形成硬质部12，最后在硬质部12上形成绑定区121。凹槽122的开口124的周缘距离绑定区121的周缘存在间距，且凹槽122的开口124边缘与绑定区121边缘相平行。即开口124的周侧边缘与绑定区121的周侧边缘间隔。绑定区121占据硬质部12一部分，硬质部12为绑定区121提供硬度较高的支撑结构，以方便绑定区121内的导线30与功能元件导通。硬质部12在超出绑定区121之外的区域仍然可以为导线30提供硬度较高的支撑结构，进一步增强柔性面板100的功能稳定性。
在另一个实施例中，请参阅图6，与图5所示的实施例不同之处在于，凹槽122在绑定区121周侧形成多个间隔排布的子凹槽126。开口124具有多条内边缘1241大致与绑定区121的周侧边缘对齐，以及具有多条外边缘1242与绑定区121的周侧边缘相对。多条内边缘1241和多条外边缘1242沿绑定区121的周向交错排布。即多个子凹槽126在绑定区121的周侧形成锯齿状凹槽。多个子凹槽126排布于绑定区121周侧，以减小硬质部12的用料成本，并保证硬质部12的结构硬度，以使柔性面板100的功能稳定性提高。
进一步地，请参阅图7，柔性面板100还包括涂布于基材10的平滑层40，平滑层40覆盖硬质部12与其他相邻区域的交界处。导线30排布于平滑层40背离基材10一侧。
本实施方式中，平滑层40形成于硬质部12的上表面125和基材10的部分第一表面115上。平滑层40遮盖开口124。平滑层40在硬质部12填充于凹槽122内之后成型。平滑层40弥补硬质部12与其他相邻区域之间的缝隙，以使得柔性面板100在硬质部12与其他相邻区域的交界处可以获得平整的表面，以方便导线30在硬质部12和其他相邻区域上布线。平滑层40还覆盖绑定区121，使得导线30在平滑层40上延伸至绑定区121，方便绑定区121的导线30与外部器件连接。即导线30覆盖于平滑层40上。平滑层40厚度较薄，平滑层40的厚度小于硬质部12的厚度，平滑层40在柔性部11与硬质部12的厚度差可以忽略不计，以保证柔性面板100的表面平整性能。
进一步地，请参阅图8，柔性面板100还包括补强层50，补强层50覆盖绑定区121，补强层50位于基材10背离导线30一侧。补强层50与平滑层40分别位于基材10相对的两侧。即补强层50贴合于第二表面116。补强层50覆盖凹槽122。在凹槽122具有贯穿第二表面116的开口时，补强层50可以遮盖凹槽122在第二表面116的开口。补强层50可以在凹槽122形成之前贴合于基材10。利用补强层50贴合基材10，并在基材10上对应补强层50的位置开设凹槽122，可以减小对基材10的损坏，防止在对基材10开设凹槽122的过程中，基材10受应力冲击而变形。补强层50可以遮盖凹槽122在第二表面116的开 口，以方便经开口124向凹槽122内填充硬质部12。补强层50可以是金属钢片，也可以是树脂胶片。补强层50可以覆盖绑定区121，以提高绑定区121的硬度，保证导线30在绑定区121与外部器件稳固连接，并且保证柔性面板100的功能稳定性。
进一步地，请参阅图9，柔性面板100还包括柔性电路板70，柔性电路板70的一部分固定于绑定区121，并与导线30连接。
本实施方式中，柔性电路板70包括固定连接基材10的第一端71和相对第一端71设置的第二端72。第一端71固定于绑定区121。第一端71覆盖绑定区121。第一端71设置有多个露铜。多个露铜在绑定区121与多条导线30连接，以使得电子器件20可以经导线30与柔性电路板70导通。第二端72与基材10相错开。第二端72可以设有连接器721。连接器721与多个露铜经铜箔线缆导通，以使得连接器721可以经导线30与电子器件20导通。在连接器721与外部器件连接时，电子器件20可以将感应信号经柔性电路板70传送至外部器件，以使得柔性面板100可以对外发送感应信号。利用凹槽122内的硬质部12可以对绑定区121进行强化，以保证与绑定区121相对的导线30与柔性电路板70的第一端71可以稳固接触，以增加导通性能。
柔性电路板70经导电胶80固定于绑定区121，并经导电胶80与导线30导通。导电胶80粘接于平滑层40与柔性线路板70的第一端71之间，使得柔性电路板70与基材10粘接稳固，以及使得柔性电路板70的露铜与导线30可有效导通。在柔性电路板70与基材10经导电胶80稳固连接的过程中，需要对柔性电路板70、导电胶80和基材10进行加热，并使得柔性电路板70和基材10在较大压力作用下挤压导电胶80，使得导电胶80内的导电粒子上下导通，以使得导电胶80可以呈现稳固粘接和导通性能。利用凹槽122内的硬质部12对绑定区121补强，以及补强层50对绑定区121补强，使得绑定区121硬度增加，基材10在绑定区121处不易变形，提高柔性电路板70与基材10电子器件20的连接可靠性。
请参阅图10、图11、图12和图13，本申请还提供一种柔性面板制作方法，该制作方法包括步骤：
101:提供基材10，待加工基材10具有待加工部111和与待加工部111连接的柔性部11。
本实施方式中，基材10可以是通过裁切工艺获得。基材10可以呈矩形状。待加工部111可以位于基材10长度方向的一端。通过在待加工部111上预先设置待加工区域，以方便后续对待加工部111进行加工。基材110的厚度可以是5μm～80μm。基材10具有第一短边13和相对第一短边13设置的第二短边14，以及连接于第一短边13和第二短边14之间的两个相对的长边15。待加工部111邻近于第一短边13。待加工部111与柔性部11一体设置。通过对待加工部111加工，以获得具有一定硬度的基材，进而提高柔性面板的安全性。
102：对待加工部111进行加工，以形成具有绑定区121的硬质部12。
本实施方式中，该步骤102包括步骤：
在待加工部111加工出凹槽122。
凹槽122可以是经热压模具加工成型，也可以是经激光雕刻成型，也可以是经溶剂蚀 刻成型。通过预先在待加工部111上设置凹槽122的成型区域，并利用模具对待加工部111加工，以形成凹槽122。凹槽122的深度可以根据需要进行调整。凹槽122可以是完全贯穿待加工基材110，或者凹槽122的深度小于基材10的厚度。
在凹槽122内填充待硬化材料。
本实施方式中，待硬化材料可以是经模具注塑填充于凹槽122内，也可以是经涂布工艺填充于凹槽122内，还可以是经印刷工艺填充于凹槽122内。待硬化材料刚填充于凹槽122内后，大致呈流体胶状，待硬化材料不具备硬度，无法满足柔性面板的强度需求，需要对待硬化材料进一步加工。待硬化材料可以是硅氧烷，环氧树脂，丙烯酸树脂或者含有无机纳米颗粒的其他树脂。
对待硬化材料加工，以形成硬质部12。
本实施方式中，对待硬化材料进行固化，以使得待硬化材料形成具有一定硬度的固定块。待硬化材料可以是经光照固化工艺进行固化，也可以是经热固化工艺进行固化，还可以是经光照固化和热固化相结合的方式进行固化，以使得硬质部12的硬度可以根据需要进行调整，使得柔性面板100满足使用要求，即可以保证一定硬度，又可以满足弯曲及拉伸形变性能。硬质部12形成于凹槽122后，可以在硬质部12上设置绑定区121以利用硬质部12增强绑定区121的硬度，防止绑定区121在受热、受压作用下产生形变。
柔性面板制作方法还包括步骤：
103：在基材10上成型平滑层40，平滑层40覆盖硬质部12与其他相邻区域的交界处。
本实施方式中，平滑层40可以是采用印刷或涂布工艺成型于基材10。平滑层40覆盖硬质部12与其他相邻区域之间缝隙，以使得柔性面板可以获得较平整的表面，方便柔性面板100的导线30进行排布。
104：在柔性部11上成型电子器件20，并成型连接电子器件20的导线30，导线30延伸至绑定区121。
本实施方式中，电子器件20和导线30可以采用丝网印刷等工艺印刷于基材10上。电子器件20可以由多个阵列排布的电容感应单元21构成。电子器件20成型于柔性部11上。导线30部分成型于柔性部11上，另一部分成型于平滑层40背离基材10的一侧，即导线30覆盖于平滑层40上。
105：在基材10上成型补强层50，补强层50可以是金属薄片、塑胶片或树脂片等材质。补强层50贴合于基材10背离平滑层40一侧。补强层50与绑定区121相对，以增强绑定区121的硬度。
106：提供柔性电路板70，将柔性电路板70通过导电胶80固定连接于基材10的绑定区121处。
本实施方式中，在平滑层40上对应绑定区121处涂刷导电胶80，将柔性电路板70的一端贴合于导电胶80上。对柔性电路板70和基材10施加一定挤压作用力，使得导电胶内的导电粒子上下导通，并对导电胶80进行加热，以方便导电胶80稳固连接柔性电路板70和基材10，以及使得柔性电路板70与导线30导通。补强层50增强绑定区121的硬度，防止基材10形变，保证柔性面板100的功能稳定性。
在另一个实施方式中，请参阅图14和图15，柔性面板制作方法包括步骤：
201:提供基材10，基材10具有待加工部111和与待加工部111连接的柔性部11。
202：在待加工部111的一侧成型补强层50。
本实施方式中，在待加工部111未加工之前，将补强层50贴合于待加工部111，以方便待加工部111在加工过程中，为待加工部111提供具有硬度的支撑结构，防止待加工部111因加工应力过大而损坏。
203：对待加工部111进行加工，以使待加工部111形成具有绑定区121的硬质部12。
204：在基材10上成型平滑层40，平滑层40覆盖绑定区121。
205：在柔性部12上成型电子器件20，并成型连接电子器件20的导线30，导线30延伸至绑定区121。
206：提供柔性电路板70，将柔性电路板70通过导电胶80固定连接基材10的绑定区121处。
在另一个实施方式中，请参阅图16和图17，柔性面板制作方法包括步骤：
301:提供基材10，基材10具有待加工部111和与待加工部111连接的柔性部11。
302：对待加工部111进行加工，以使待加工部111形成具有绑定区121的硬质部12。
303：在基材10上成型平滑层40，平滑层40覆盖绑定区121。
304：在基材10背离平滑层40一侧成型补强层50，补强层50覆盖绑定区121。
305：在柔性部12上成型电子器件20，并成型连接电子器件20的导线30，导线30延伸至绑定区121。
306：提供柔性电路板70，将柔性电路板70通过导电胶80固定连接基材10的绑定区121处。
通过基材设有柔性部和柔性部连接的硬质部，硬质部设有绑定区，使得绑定区不易产生变形，防止电子器件与功能元件在绑定区连接失效，提高了柔性面板的功能稳定性。
以上对本申请实施例所提供的一种柔性面板及柔性面板制作方法进行了详细介绍，本文中应用了具体个例对本申请的原理及实施例进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的一般技术人员，依据本申请的思想，在具体实施例及应用范围上均会有改变之处，综上，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种柔性面板，其特征在于，所述柔性面板包括基材和电子器件，所述基材设有柔性部和与所述柔性部连接的硬质部，所述硬质部设有绑定区，所述电子器件固定于所述柔性部，所述电子器件与延伸至所述绑定区的导线连接。
  2. 如权利要求1所述的柔性面板，其特征在于，所述硬质部的硬度大于所述柔性部的硬度。
  3. 如权利要求1所述的柔性面板，其特征在于，所述基材开设有凹槽，所述硬质部设置于所述凹槽内。
  4. 如权利要求3所述的柔性面板，其特征在于，所述凹槽贯穿所述柔性基材，或所述凹槽的深度小于所述基材的厚度。
  5. 如权利要求3所述的柔性面板，其特征在于，所述凹槽的开口边缘距离所述绑定区边缘存在间距，且所述凹槽的开口边缘与所述绑定区边缘相平行。
  6. 如权利要求1～5任意一项所述的柔性面板，其特征在于，所述柔性面板还包括涂布于所述基材的平滑层，所述平滑层覆盖所述硬质部与其他相邻区域的交界处。
  7. 如权利要求6所述的柔性面板，其特征在于，所述平滑层的厚度小于硬质部的厚度。
  8. 如权利要求6所述的柔性面板，其特征在于，所述导线覆盖于所述平滑层上。
  9. 如权利要求1～5任意一项所述的柔性面板，其特征在于，所述柔性面板还包括补强层，所述补强层覆盖所述绑定区，所述补强层位于所述基材背离所述导线一侧。
  10. 如权利要求1～5任意一项所述的柔性面板，其特征在于，所述柔性面板还包括柔性电路板，所述柔性电路板的一部分固定于所述绑定区，并与所述导线电连接。
  11. 如权利要求10所述的柔性面板，其特征在于，所述柔性电路板经导电胶固定于所述绑定区，并经所述导电胶与所述导线导通。
  12. 一种柔性面板制作方法，其特征在于，所述柔性面板制作方法包括步骤：
    提供基材，所述基材具有待加工部和与所述待加工部连接的柔性部；
    对所述待加工部进行加工，以使所述待加工部形成具有绑定区的硬质部；
    在所述柔性部上形成电子器件，并形成连接所述电子器件的导线，所述导线延伸至所述绑定区。
  13. 如权利要求12所述的柔性面板制作方法，其特征在于，对所述待加工部进行加工的步骤包括：
    在所述待加工部加工出凹槽；
    在所述凹槽内填充待硬化材料；
    对所述待硬化材料加工，以形成硬质部。
  14. 如权利要求13所述的柔性面板制作方法，其特征在于，对所述待硬化材料加工的步骤中，对所述待硬化材料进行光固化或/和热固化。
  15. 如权利要求13所述的柔性面板制作方法，其特征在于，所述待硬化材料可以是硅氧烷，环氧树脂，丙烯酸树脂或者含有无机纳米颗粒的其他树脂。
  16. 如权利要求12所述的柔性面板制作方法，其特征在于，形成硬质部之后，还包括步骤：
    在所述基材上形成平滑层，所述平滑层覆盖所述硬质部与其他相邻区域的交界处。
  17. 如权利要求16所述的柔性面板制作方法，其特征在于，所述导线覆盖于平滑层上。
  18. 如权利要求12所述的柔性面板制作方法，其特征在于，所述的柔性面板制作方法还包括步骤：
    在对应待加工部的位置形成补强层；
    所述电子器件位于所述基材背离所述补强层一侧，所述补强层覆盖所述绑定区。
  19. 如权利要求18所述的柔性面板制作方法，其特征在于，形成补强层的步骤在对所述待加工部进行加工的步骤之前。
  20. 如权利要求18所述的柔性面板制作方法，其特征在于，形成补强层的步骤在对所述待加工部进行加工的步骤之后。
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