WO2020121379A1

WO2020121379A1 - Adhesive for semiconductor, cured product, and semiconductor component

Info

Publication number: WO2020121379A1
Application number: PCT/JP2018/045327
Authority: WO
Inventors: 健太奥山; 石井　学; 賢藤田; 名取　美智子; 慶子小林
Original assignee: 日立化成株式会社
Priority date: 2018-12-10
Filing date: 2018-12-10
Publication date: 2020-06-18
Also published as: JP7222400B2; CN113396471A; JPWO2020121379A1

Abstract

Provided is an adhesive for a semiconductor which comprises (A) silver particles and (B) a monomer having a (meth)acryloyl group, wherein the component (A) includes first silver particles, the first silver particles having a BET specific surface area of 0.3 m2/g or less and an average particle size of 7.0 μm or more.

Description

Adhesives for semiconductors, cured products and semiconductor parts

The present invention relates to a semiconductor adhesive, a cured product, and a semiconductor component.

Semiconductor components used in semiconductor devices are generally manufactured by bonding a semiconductor element such as a semiconductor chip to a supporting member such as a lead frame with an adhesive (die bonding material). Heretofore, gold-silicon eutectic, solder, paste resin composition, etc. have been known as semiconductor adhesives, but in recent years, paste resin compositions have been widely used from the viewpoint of workability and cost. Has been done.

▽Semiconductor elements such as semiconductor chips tend to have higher integration density with higher integration and miniaturization, and the amount of heat generated per unit area tends to increase. Therefore, in a semiconductor component mounted with a semiconductor element, it is necessary to efficiently dissipate the heat generated from the semiconductor element to the outside.

Also, conventionally, solder bonding has been the mainstream for the bonding of power device package elements, but from the perspective of environmental issues, there is a growing trend toward deleading solder. Along with this, in mounting applications or die bonding applications, there is an increasing demand for semiconductor adhesives containing resin components as adhesives that replace solder.

However, conventional semiconductor adhesives containing resin components have a smaller thermal conductivity than solder, and high thermal conductivity is desired. On the other hand, it has been proposed to use silver particles as a constituent component of an adhesive for semiconductors (see, for example, Patent Document 1 below).

JP, 2006-73812, A

By the way, for a semiconductor adhesive for adhering a semiconductor element to a supporting member, it is required to improve thermal conductivity from the viewpoint of more efficiently dissipating heat generated from the semiconductor element to the outside. There is.

The present invention aims to provide an adhesive for semiconductors having excellent thermal conductivity and a cured product thereof. An object of the present invention is to provide a semiconductor component using the adhesive for semiconductors or a cured product thereof.

An adhesive for semiconductors according to an aspect of the present invention contains (A) silver particles and (B) a monomer having a (meth)acryloyl group, and the (A) component is the first silver particle. The BET specific surface area of the first silver particles is 0.3 m ² /g or less, and the average particle diameter of the first silver particles is 7.0 μm or more.

Since the above-mentioned adhesive for semiconductors and its cured product have excellent thermal conductivity, the heat generated from the semiconductor element can be efficiently dissipated to the outside.

A semiconductor component according to another aspect of the present invention includes a support member, a semiconductor element, and an adhesive layer arranged between the support member and the semiconductor element, and the adhesive layer is the above-mentioned adhesive for semiconductors. Alternatively, it includes a cured product thereof.

According to the present invention, it is possible to provide a semiconductor adhesive having excellent thermal conductivity and a cured product thereof. According to the present invention, the heat generated from the semiconductor element can be efficiently dissipated to the outside. According to the present invention, it is possible to provide a semiconductor component using the semiconductor adhesive or a cured product thereof.

According to the present invention, it is possible to provide an application of a semiconductor adhesive or a cured product thereof to a semiconductor component or its manufacture. According to the present invention, it is possible to provide an application of an adhesive for semiconductors or a cured product thereof to adhesion between a semiconductor element and a support member. According to the present invention, an application of a semiconductor adhesive to a die bonding material can be provided.

FIG. 1 is a schematic sectional view showing an example of a semiconductor component. FIG. 2 is a schematic cross-sectional view showing another example of the semiconductor component.

In the present specification, the numerical range indicated by using "to" indicates the range including the numerical values before and after "to" as the minimum value and the maximum value, respectively. In the numerical ranges described stepwise in this specification, the upper limit value or the lower limit value of the numerical range of a certain stage can be arbitrarily combined with the upper limit value or the lower limit value of the numerical range of another stage. In the numerical range described in this specification, the upper limit value or the lower limit value of the numerical range may be replaced with the values shown in the examples. “A or B” may include either one of A and B, or may include both. Unless otherwise specified, the materials exemplified in the present specification can be used alone or in combination of two or more kinds. In the present specification, the use amount of each component in the composition is the total amount of the plurality of substances present in the composition, unless there is a plurality of substances corresponding to each component in the composition, unless otherwise specified. Means In the present specification, the term “layer” includes not only a structure having a shape formed on the entire surface but also a structure having a partly formed shape when observed as a plan view. In the present specification, the term “process” is included in this term as long as the intended action of the process is achieved not only when it is an independent process but also when it cannot be clearly distinguished from other processes. .. “(Meth)acrylate” means at least one of acrylate and corresponding methacrylate. The same applies to other similar expressions such as “(meth)acryloyl”.

Hereinafter, embodiments of the present invention will be described in detail. However, the present invention is not limited to the following embodiments, and various modifications can be carried out within the scope of the gist thereof.

<Semiconductor adhesives and cured products>
The adhesive for semiconductors according to the present embodiment is a single particle having (A) silver particles (hereinafter, sometimes referred to as “(A) component”. Particles containing silver, for example, silver powder) and (B) (meth)acryloyl group. And (B) a BET specific surface area of the first silver particles is 0.3 m ² /g. And the average particle size of the first silver particles is 7.0 μm or more.

The semiconductor adhesive according to the present embodiment is a conductive composition, and can be used as a conductive composition for bonding a semiconductor element to a supporting member. The semiconductor adhesive according to the present embodiment is, for example, a curable (for example, thermosetting) composition. The semiconductor adhesive according to the present embodiment can be used as a paste resin composition. The cured product according to this embodiment is a cured product of the semiconductor adhesive according to this embodiment.

Since the semiconductor adhesive and the cured product thereof according to the present embodiment have excellent thermal conductivity, the heat generated from the semiconductor element can be efficiently dissipated to the outside. The reason why the adhesive for semiconductors and the cured product thereof according to the present embodiment have excellent thermal conductivity is not clear, but the present inventors presume as follows. However, the cause is not limited to the following contents. That is, when the first silver particles having a small BET specific surface area and a large average particle diameter are used, it is easy to prevent the number of contact points between silver particles from increasing excessively. It is presumed that excellent heat conductivity can be obtained because the loss is easily suppressed.

By the way, when the adhesive for semiconductors contains many silver particles, the coating workability becomes low due to the increase in viscosity, or the cured product of the adhesive for semiconductors becomes brittle and the adhesion between the semiconductor element and the supporting member is increased. The strength may be low. On the other hand, according to the adhesive for semiconductors of the present embodiment, even when the adhesive for semiconductors contains many silver particles, it is easy to suppress the increase in viscosity, so that the coating workability is kept high. In addition, since the cured product of the semiconductor adhesive can be easily prevented from becoming brittle, the adhesive strength between the semiconductor element and the supporting member can be kept high. That is, according to the present embodiment, it is possible to provide a semiconductor adhesive having excellent thermal conductivity, coating workability, and adhesive strength, and a cured product thereof.

(Component (A): silver particles)
From the viewpoint of obtaining excellent thermal conductivity, the component (A) is a first silver particle having a BET specific surface area of 0.3 m ² /g or less and an average particle size of 7.0 μm or more (hereinafter, depending on the case). "(A1) component") is included. From the viewpoint of easily obtaining excellent adhesive strength, the component (A) further contains second silver particles having a BET specific surface area of more than 0.3 m ² /g (hereinafter, sometimes referred to as “component (A2)”). Good. As the component (A), one type may be used alone, or two or more types may be used in combination.

The content of silver in at least one particle of the component (A1) or the component (A2) is preferably 80% by mass or more, more preferably 90% by mass or more, further preferably 95% by mass or more, particularly preferably 98% by mass or more. , 99 mass% or more is extremely preferable. At least one particle of the component (A1) or the component (A2) may be a mode in which the particle is substantially composed of silver (substantially 100% by mass of the particle is silver).

Examples of the shape of the component (A1) include scaly, spherical, lumpy, dendritic, and plate-like shapes, but scaly shape is preferable from the viewpoint of easily obtaining excellent thermal conductivity. Examples of the shape of the component (A2) include a scaly shape, a spherical shape, a lump shape, a dendritic shape, and a plate shape, but the scaly shape is preferable from the viewpoint of easily obtaining excellent thermal conductivity.

Examples of the component (A2) include AgC-271B (BET specific surface area: 0.50 m ² /g), AgC-221Q3 (BET specific surface area: 0.35 m ² /g) and AgC- manufactured by Fukuda Metal Foil & Powder Co., Ltd. 212DH (BET specific surface area: ^1m 2 / g); CO., LTD Tokuriki chemical Laboratory, Ltd. of the TC-88 (BET specific surface ^{area: 1.05m 2 / g), TC} -505C (BET specific surface area: 0.65m ² / g ) and TC-87 (BET specific surface area: 0.25m ² / g); Co. ferro Japan in SF-125 (BET specific surface area: 0.17 m ² / g), and the like.

(A1) BET surface area of the component, from easily obtained excellent thermal conductivity standpoint, is preferably less than 0.3 m ² / g, more preferably 0.275M ² / g or less, still is 0.25 m ² / g or less preferably, particularly preferably 0.225 m ² / g or less, very preferably 0.2 m ² / g. (A1) BET surface area of the component, the easier the viewpoint of give excellent viscosity semiconductor adhesive (viscosity when the paste used), preferably at least 0.1 m ² / g, more preferably at least 0.125 m ² / g , more preferably not less than ^{^{0.15m 2 / g, 0.175m 2 /}} g or more is particularly preferable. From these viewpoints, the BET surface area of the component (A1) is preferably 0.1 ~ 0.3m ² / g, more preferably 0.1 ~ 0.25m ² / g.

(A2) BET surface area of the component, the easier the viewpoint of give excellent viscosity semiconductor adhesive (viscosity when the paste used), preferably at least 0.35 m ² / g, more preferably at least 0.375 M ² / g , more preferably at least 0.4 m ² / g, particularly preferably not less than 0.425m ² / g, very preferably more than 0.45 m ² / g, very preferably at least 0.475m ^² / g, 0.5m ² /G or more is even more preferable. (A2) BET surface area of the component, from easily obtained excellent thermal conductivity standpoint, preferably ^{1 m} 2 / g or less, more preferably 0.9 m ² / g, still more preferably 0.8 m ² / g or less, 0.7 m ² /g or less is particularly preferable, and 0.6 m ² /g or less is extremely preferable. From these viewpoints, the BET surface area of the component (A2) is preferably more than 0.3 m ² /g and 1 m ² /g or less, and more preferably 0.35 to 1 m ² /g.

The average particle size of the component (A1) is such that excellent thermal conductivity is easily obtained (excessive heat loss at the contact points of the silver particles is suppressed by easily suppressing an excessive increase in the contact points between the silver particles. From the viewpoint of (easy to do), it is preferably 7.0 μm or more, more preferably more than 7.0 μm, further preferably 7.25 μm or more, and particularly preferably 7.5 μm or more. The average particle size of the component (A1) is preferably 10 μm or less, more preferably 9.5 μm or less, and further preferably 9 μm or less, from the viewpoint of easily obtaining excellent dischargeability (dischargeability during dispensing) of the adhesive for semiconductors. , 8.5 μm or less is particularly preferable, 8.25 μm or less is extremely preferable, and 8.0 μm or less is very preferable. From these viewpoints, the average particle size of the component (A1) is preferably 7.0 to 10 μm, more preferably 7.0 to 8.5 μm, and further preferably 7.5 to 8.0 μm. The average particle size of the component (A1) can be measured by a laser diffraction type particle size distribution measuring device (laser diffraction method).

The average particle size of the component (A2) is preferably 1 μm or more, more preferably 1.5 μm or more, still more preferably 2 μm or more, from the viewpoint of easily obtaining excellent thermal conductivity. The average particle diameter of the component (A2) is preferably 20 μm or less, more preferably 15 μm or less, further preferably 10 μm or less, particularly preferably 8 μm or less, and particularly preferably 5 μm or less, from the viewpoint of easily obtaining excellent thermal conductivity. 4 μm or less is very preferable, and 3 μm or less is even more preferable. From these viewpoints, the average particle diameter of the component (A2) is preferably 1 to 20 μm, more preferably 2 to 5 μm. The average particle size of the component (A2) can be measured by a laser diffraction type particle size distribution measuring device (laser diffraction method).

The content of component (A1) is preferably in the following range based on the total amount of component (A). The content of the component (A1) is preferably 40% by mass or more, more preferably 50% by mass or more, and more than 50% by mass from the viewpoint of easily obtaining excellent thermal conductivity and easily reducing the viscosity. Is more preferable, 60% by mass or more is particularly preferable, and 70% by mass or more is extremely preferable. The content of the component (A1) is 100% by mass or less, preferably less than 100% by mass, more preferably 95% by mass or less, still more preferably 90% by mass or less, from the viewpoint of easily obtaining excellent adhesive strength. Particularly preferably, it is 80% by mass or less, very preferably 75% by mass or less. From these viewpoints, the content of the component (A1) is preferably 40 to 100% by mass, more preferably 50 to 95% by mass.

The content of the component (A2) is preferably in the following range based on the total amount of the component (A). The content of the component (A2) is preferably more than 0% by mass, more preferably 5% by mass or more, further preferably 10% by mass or more, particularly preferably 15% by mass or more, from the viewpoint of easily obtaining excellent adhesive strength. It is preferably 20% by mass or more and very preferably 25% by mass or more. The content of the component (A2) is preferably 60% by mass or less, more preferably 50% by mass or less, and further less than 50% by mass from the viewpoint of easily obtaining excellent thermal conductivity and the viewpoint of easily reducing the viscosity. It is preferably 40% by mass or less, particularly preferably 30% by mass or less. From these viewpoints, the content of the component (A2) is preferably more than 0% by mass and 60% by mass or less, and more preferably 5 to 50% by mass.

The content of the component (A1) is preferably in the following range based on the total amount of the adhesive for semiconductors (total amount of solids. The same applies below). The content of the component (A1) is preferably 30% by mass or more, more preferably 35% by mass or more, further preferably 40% by mass or more from the viewpoint of easily obtaining excellent thermal conductivity and the viewpoint of easily reducing the viscosity. 50% by mass or more is particularly preferable, 55% by mass or more is extremely preferable, and 60% by mass or more is very preferable. From the viewpoint of easily obtaining excellent adhesive strength, the content of the component (A1) is preferably 95% by mass or less, more preferably 90% by mass or less, further preferably 85% by mass or less, particularly preferably less than 85% by mass, 80 mass% or less is very preferable, 75 mass% or less is very preferable, 70 mass% or less is still more preferable, and 65 mass% or less is further preferable. From these viewpoints, the content of the component (A1) is preferably 30 to 95% by mass, more preferably 50 to 90% by mass, further preferably 55 to 85% by mass, and particularly preferably 60 to 80% by mass.

The content of the component (A2) is preferably in the following range based on the total amount of the adhesive for semiconductors. From the viewpoint of easily obtaining excellent adhesive strength, the content of the component (A2) is preferably 2% by mass or more, more preferably 5% by mass or more, further preferably 10% by mass or more, particularly preferably 15% by mass or more, 20 mass% or more is extremely preferable. The content of the component (A2) is preferably 50% by mass or less, more preferably less than 50% by mass, and further preferably 45% by mass or less from the viewpoint of easily obtaining excellent thermal conductivity and the viewpoint of easily reducing the viscosity. It is particularly preferably 40% by mass or less, very preferably 35% by mass or less, and very preferably 30% by mass or less. From these viewpoints, the content of the component (A2) is preferably 2 to 50% by mass, more preferably 10 to 40% by mass, and further preferably 20 to 35% by mass.

The mass ratio of the content of the (A1) component to the content of the (A2) component (content of the (A1) component/content of the (A2) component) is preferably in the following range. From the viewpoint of easily reducing the viscosity, the mass ratio is preferably 0.1 or more, more preferably 0.5 or more, further preferably 1.0 or more, particularly preferably 1.5 or more, and very preferably 2.0 or more. Preferably, 2.5 or more is very preferable. From the viewpoint of easily obtaining excellent adhesive strength, the mass ratio is preferably 5.0 or less, more preferably 4.0 or less, further preferably 3.0 or less, particularly preferably 2.0 or less, and 1.5 or less. Is extremely preferable, and 1.0 or less is very preferable. From these viewpoints, the mass ratio is preferably 0.1 to 5.0.

The content of the component (A) (the total amount of the components (A1) and (A2)) is preferably in the following range based on the total amount of the adhesive for semiconductors. From the viewpoint of easily obtaining excellent thermal conductivity, the content of the component (A) is preferably 30% by mass or more, more preferably 40% by mass or more, further preferably 50% by mass or more, particularly preferably 60% by mass or more. , 70 mass% or more is extremely preferable, 80 mass% or more is very preferable, and 85 mass% or more is even more preferable. From the viewpoint of easily reducing the viscosity of the adhesive for semiconductors, the content of the component (A) is preferably less than 100 mass%, more preferably 98 mass% or less, further preferably 95 mass% or less, and 92 mass% or less. Particularly preferable, and 90% by mass or less is extremely preferable. From these viewpoints, the content of the component (A) is preferably 30% by mass or more and less than 100% by mass, more preferably 80 to 92% by mass, and further preferably 85 to 90% by mass.

The content of silver particles having an average particle size of 1 μm or more and less than 4 μ may be 2% by mass or less, may be less than 2% by mass, or may be 1% by mass or less, based on the total amount of the adhesive for semiconductors. Well, it may be less than 1% by mass. The component (A) may not include silver particles having an average particle size of 1 μm or more and less than 4 μm.

(Component (B): monomer having a (meth)acryloyl group)
As the component (B), (meth)acrylic acid, (meth)acrylic acid ester or the like can be used. The component (B) may not include an imide skeleton and/or a siloxane skeleton. The number of (meth)acryloyl groups in the component (B) is preferably 3 or less, more preferably 2 or less, and even more preferably 1 from the viewpoint of easily obtaining excellent adhesive strength. The number of (meth)acryloyl groups in the component (B) is 1 or more, and may be 2 or more. The molecular weight of the component (B) may be 2000 or less, 1500 or less, 1000 or less, 800 or less, or 600 or less. When the component (B) has two (meth)acryloyl groups, the molecular weight of the component (B) may be 400 or less and 300 or less.

The component (B) preferably contains a compound represented by the following general formula (b1) from the viewpoint of easily obtaining excellent adhesive strength.

[In the formula, R ¹¹ represents a hydrogen atom or a methyl group, R ¹² represents a group represented by the following formula, X represents an alkylene group having 1 to 5 carbon atoms, and n 1 represents 0 to 10 Indicates an integer. ]

Examples of the compound represented by the formula (b1) include dicyclopentenyloxyethyl (meth)acrylate, dicyclopentanyloxyethyl (meth)acrylate, dicyclopentenyl (meth)acrylate and dicyclopentanyl (meth)acrylate. Is mentioned. Dicyclopentenyl acrylate as FA-511A, dicyclopentenyloxyethyl acrylate as FA-512A, dicyclopentanyl acrylate as FA-513A, dicyclopentenyloxyethyl methacrylate as FA-512M, dicyclopentanyl methacrylate Are commercially available as FA-513M from Hitachi Chemical Co., Ltd.

The content of the compound represented by the formula (b1) is preferably within the following range based on the total amount of the component (B). The content of the compound represented by the formula (b1) is preferably 10% by mass or more, more preferably 20% by mass or more, further preferably 25% by mass or more, and 30% by mass from the viewpoint of easily obtaining excellent thermal conductivity. % Or more is particularly preferable, and 35% by mass or more is extremely preferable. From the viewpoint of easily obtaining excellent thermal conductivity, the content of the compound represented by the formula (b1) is preferably 95% by mass or less, more preferably 90% by mass or less, further preferably 85% by mass or less, and 80% by mass. % Or less is particularly preferable, and 75% by mass or less is extremely preferable. From these viewpoints, the content of the compound represented by the formula (b1) is preferably 10 to 95% by mass, more preferably 20 to 90% by mass.

The content of the compound represented by the formula (b1) is preferably within the following range based on the total amount of the adhesive for semiconductors. From the viewpoint of easily obtaining excellent thermal conductivity, the content of the compound represented by the formula (b1) is preferably 0.5% by mass or more, more preferably 1% by mass or more, further 1.2% by mass or more. It is particularly preferably 1.5% by mass or more, and particularly preferably 1.8% by mass or more. The content of the compound represented by the formula (b1) is preferably 10% by mass or less, more preferably 8% by mass or less, further preferably 6% by mass or less, from the viewpoint of easily obtaining excellent thermal conductivity. % Or less is particularly preferable, and 4% by mass or less is extremely preferable. From these viewpoints, the content of the compound represented by the formula (b1) is preferably 0.5 to 10% by mass, more preferably 1 to 8% by mass.

The component (B) is represented by the following general formula (b22) as a compound represented by the following general formula (b21) as a (meth)acrylic acid ester from the viewpoint of easily obtaining excellent coating workability and adhesive strength. And a compound represented by the following general formula (b23).

[In the formula, R ²¹ , R ²² and R ²³ each independently represent a hydrogen atom or a methyl group, and n ²² and n ²³ each independently represent an integer of 1 to 3. ]

As a compound represented by the formula (b21) to (b23) (a compound represented by the formula (b21), a compound represented by the formula (b22), or a compound represented by the formula (b23). The same applies hereinafter) Examples include benzyl (meth)acrylate and phenoxyethyl (meth)acrylate. Benzyl acrylate is commercially available as FA-BZA (manufactured by Hitachi Chemical Co., Ltd.), phenoxyethyl acrylate is SR-339A (manufactured by Sartomer), and phenoxyethyl methacrylate is commercially available as CD9087 (manufactured by Sartomer).

The content of the compounds represented by the formulas (b21) to (b23) is preferably within the following range based on the total amount of the component (B). The content of the compounds represented by the formulas (b21) to (b23) is preferably 10% by mass or more, more preferably 20% by mass or more, and further preferably 25% by mass or more, from the viewpoint of easily obtaining excellent thermal conductivity. It is preferably 30% by mass or more, particularly preferably 35% by mass or more. The content of the compounds represented by the formulas (b21) to (b23) is preferably 80% by mass or less, more preferably 70% by mass or less, and further preferably 60% by mass or less, from the viewpoint of easily obtaining excellent thermal conductivity. It is preferably 50% by mass or less, particularly preferably 40% by mass or less. From these viewpoints, the content of the compounds represented by the formulas (b21) to (b23) is preferably 10 to 80% by mass, and more preferably 20 to 70% by mass.

The content of the compounds represented by the formulas (b21) to (b23) is preferably within the following range based on the total amount of the adhesive for semiconductors. The content of the compounds represented by the formulas (b21) to (b23) is preferably 0.5% by mass or more, more preferably 1% by mass or more, and 1.2% by mass from the viewpoint of easily obtaining excellent thermal conductivity. % Or more is more preferable, 1.5% by mass or more is particularly preferable, and 1.8% by mass or more is extremely preferable. The content of the compounds represented by the formulas (b21) to (b23) is preferably 5% by mass or less, more preferably 4% by mass or less, and further preferably 3% by mass or less, from the viewpoint of easily obtaining excellent thermal conductivity. It is particularly preferably 2.5% by mass or less, particularly preferably 2% by mass or less. From these viewpoints, the content of the compounds represented by the formulas (b21) to (b23) is preferably 0.5 to 5% by mass, more preferably 1 to 4% by mass.

The component (B) is different from the compound represented by the formula (b1), the compound represented by the formula (b21), the compound represented by the formula (b22), and the compound represented by the formula (b23). It may include a monofunctional (meth)acrylic acid ester. Examples of such monofunctional (meth)acrylic acid esters include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate. ) Acrylate, t-butyl(meth)acrylate, amyl(meth)acrylate, isoamyl(meth)acrylate, hexyl(meth)acrylate, heptyl(meth)acrylate, octyl(meth)acrylate, 2-ethylhexyl(meth)acrylate, nonyl (Meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, lauryl (meth)acrylate, tridecyl (meth)acrylate, hexadecyl (meth)acrylate, stearyl (meth)acrylate, isostearyl (meth)acrylate, cyclohexyl ( (Meth)acrylate, isobornyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, dimer diol mono (meth)acrylate, diethylene glycol (meth)acrylate, polyethylene glycol (meth)acrylate, polypropylene Glycol (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, 2-butoxyethyl (meth)acrylate, methoxydiethylene glycol (meth)acrylate, methoxypolyethylene glycol (meth)acrylate, phenoxydiethylene glycol (Meth)acrylate, phenoxy polyethylene glycol (meth)acrylate, 2-benzoyloxyethyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 2-cyanoethyl (meth)acrylate, γ-(meth)acry Roxypropyltrimethoxysilane, glycidyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, tetrahydropyranyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, (meth)acryloxyethyl phosphate , (Meth)acryloxyethyl phenyl acid phosphate, β-(meth)acryloyloxyethyl hydrogen phthalate, β-(meth)acryloyloxyethyl hydrogen succinate, and the like. Be done.

The component (B) may or may not contain the compound represented by the following general formula (b3). The content of the compound represented by the formula (b3) may be 1% by mass or less, 0.1% by mass or less, and 0.01% by mass or less based on the total amount of the component (B). May be The content of the compound represented by the formula (b3) may be 1% by mass or less, 0.1% by mass or less, and 0.01% by mass or less based on the total amount of the adhesive for semiconductors. May be

[Wherein R ³¹ represents a hydrogen atom or a methyl group, Y represents an alkylene group having 1 to 5 carbon atoms, R ³² to R ³⁶ represent an alkyl group having 1 to 20 carbon atoms, and n3 represents , An integer of 0 to 10 is shown. ]

The component (B) may include a polyfunctional (meth)acrylic acid ester. The component (B) preferably contains, as a polyfunctional (meth)acrylic acid ester, a compound having two (meth)acryloyloxy groups in one molecule. In this case, it is easy to reduce the generation of bubbles in the adhesive, which causes a reduction in reflow resistance during thermosetting.

Examples of compounds having two (meth)acryloyloxy groups in one molecule include ethylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, and 1,6-hexanediol di(meth)acrylate. , 1,9-nonanediol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, dimer diol di(meth)acrylate, dimethylol tricyclodecane di(meth) ) Acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, polypropylene glycol di(meth ) A di(meth)acrylate compound such as an acrylate; a reaction product of 1 mol of bisphenol A, bisphenol F or bisphenol AD and 2 mol of glycidyl (meth)acrylate; a di(meth)polyethylene oxide adduct of bisphenol A, bisphenol F or bisphenol AD. ) Acrylate; di(meth)acrylate of polypropylene oxide adduct of bisphenol A, bisphenol F or bisphenol AD; bis(acryloxypropyl)polydimethylsiloxane, bis(acryloxypropyl)methylsiloxane-dimethylsiloxane copolymer, bis(methacryloxy) Examples thereof include a siloxane compound such as propyl)polydimethylsiloxane and bis(methacryloxypropyl)methylsiloxane-dimethylsiloxane copolymer.

The component (B) may contain a compound represented by the following general formula (b4) as a compound having two (meth)acryloyloxy groups in one molecule from the viewpoint of easily obtaining excellent adhesive strength. preferable.

[In the formula, R ⁴¹ , R ⁴² , R ⁴³ and R ⁴⁴ each independently represent a hydrogen atom or a methyl group, Z ⁴¹ and Z ⁴² each independently represent an alkylene group having 1 to 5 carbon atoms, and n 41 And n42 each independently represent an integer of 1 to 20. ]

As the component (B), a compound having three or more (meth)acryloyloxy groups in one molecule can be used as a polyfunctional (meth)acrylic acid ester. Examples of the compound having three or more (meth)acryloyloxy groups in one molecule include trimethylolpropane tri(meth)acrylate, ethylene oxide-modified trimethylolpropane tri(meth)acrylate, and propylene oxide-modified trimethylolpropane tri(meth). Acrylate, ethylene oxide/propylene oxide modified trimethylolpropane tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth) Examples thereof include acrylate and pentaerythritol tri(meth)acrylate.

The content of the polyfunctional (meth)acrylic acid ester is preferably in the following range based on the total amount of the component (B). The content of the polyfunctional (meth)acrylic acid ester is preferably 5% by mass or more, more preferably 10% by mass or more, further preferably 15% by mass or more, and 20% by mass from the viewpoint of easily obtaining excellent thermal conductivity. % Or more is particularly preferable, and 25% by mass or more is extremely preferable. The content of the polyfunctional (meth)acrylic acid ester is preferably 50% by mass or less, more preferably 45% by mass or less, further preferably 40% by mass or less, and 35% by mass, from the viewpoint of easily obtaining excellent thermal conductivity. % Or less is particularly preferable, and 30% by mass or less is extremely preferable. From these viewpoints, the content of the polyfunctional (meth)acrylic acid ester is preferably 5 to 50% by mass, more preferably 10 to 45% by mass.

The content of polyfunctional (meth)acrylic acid ester is preferably in the following range based on the total amount of the adhesive for semiconductors. The content of the polyfunctional (meth)acrylic acid ester is preferably 0.5% by mass or more, more preferably 0.8% by mass or more, still more preferably 1% by mass or more, from the viewpoint of easily obtaining excellent thermal conductivity. It is preferably 1.2% by mass or more, particularly preferably 1.4% by mass or more. The content of the polyfunctional (meth)acrylic acid ester is preferably 3% by mass or less, more preferably 2.5% by mass or less, still more preferably 2% by mass or less, from the viewpoint of easily obtaining excellent thermal conductivity. 1.8% by mass or less is particularly preferable, and 1.5% by mass or less is extremely preferable. From these viewpoints, the content of the polyfunctional (meth)acrylic acid ester is preferably 0.5 to 3% by mass, more preferably 0.8 to 2.5% by mass.

The content of the component (B) is preferably in the following range based on the total amount of the adhesive for semiconductors. From the viewpoint of easily obtaining excellent thermal conductivity, the content of the component (B) is preferably 1% by mass or more, more preferably 2% by mass or more, further preferably 3% by mass or more, and particularly preferably 4% by mass or more. 5% by mass or more is extremely preferable. From the viewpoint of easily obtaining excellent thermal conductivity, the content of the component (B) is preferably 10% by mass or less, more preferably less than 10% by mass, further preferably 9% by mass or less, particularly preferably 8% by mass or less. , 7 mass% or less is very preferable, and 6 mass% or less is very preferable. From these viewpoints, the content of the component (B) is preferably 1 to 10% by mass, more preferably 2 to 9% by mass.

The content of the component (B) is preferably in the following range with respect to 100 parts by mass of the component (A). From the viewpoint of easily obtaining excellent thermal conductivity, the content of the component (B) is preferably 1 part by mass or more, more preferably 3 parts by mass or more, further preferably 4 parts by mass or more, particularly preferably 5 parts by mass or more. , 6 parts by mass or more is extremely preferable. From the viewpoint of easily obtaining excellent thermal conductivity, the content of the component (B) is preferably 20 parts by mass or less, more preferably 15 parts by mass or less, further preferably 10 parts by mass or less, and particularly preferably 8 parts by mass or less. , 7 parts by mass or less is extremely preferable. From these viewpoints, the content of the component (B) is preferably 1 to 20 parts by mass, more preferably 3 to 15 parts by mass.

(Component (C): radical polymerization initiator)
The adhesive for semiconductors according to this embodiment may contain a radical polymerization initiator (hereinafter, sometimes referred to as “component (C)”). The component (C) preferably contains a peroxide from the viewpoint of easily suppressing the generation of voids and the like. The decomposition temperature of the peroxide in the rapid heating test is preferably 70 to 170° C. from the viewpoint of easily obtaining excellent curability and viscosity stability of the adhesive for semiconductors.

Examples of the component (C) include 1,1,3,3-tetramethylperoxy 2-ethylhexanoate, 1,1-bis(t-butylperoxy)cyclohexane and 1,1-bis(t-butylperoxy). (Oxy) cyclododecane, di-t-butylperoxyisophthalate, t-butylperbenzoate, dicumyl peroxide, t-butylcumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy) ) Hexane, 2,5-dimethyl-2,5-di(t-butylperoxy)hexyne, cumene hydroperoxide and the like.

The content of the component (C) is preferably in the following range with respect to 100 parts by mass of the component (B). From the viewpoint of easily obtaining excellent thermal conductivity, the content of the component (C) is preferably 3 parts by mass or more, more preferably 4 parts by mass or more, further preferably 5 parts by mass or more, particularly preferably 8 parts by mass or more. 10 parts by mass or more is extremely preferable. From the viewpoint of easily obtaining excellent thermal conductivity, the content of the component (C) is preferably 30 parts by mass or less, more preferably 20 parts by mass or less, and further preferably 15 parts by mass or less. From these viewpoints, the content of the component (C) is preferably 3 to 30 parts by mass, more preferably 4 to 20 parts by mass, still more preferably 5 to 15 parts by mass.

(Component (D): softening agent)
The semiconductor adhesive according to the present embodiment may contain a softening agent (hereinafter sometimes referred to as “component (D)”, excluding compounds corresponding to components (A) to (C)). The component (D) preferably contains at least one selected from the group consisting of liquid rubber and thermoplastic resins (excluding compounds corresponding to liquid rubber).

Examples of the liquid rubber include polybutadiene, epoxidized polybutadiene, maleated polybutadiene, acrylonitrile butadiene rubber, acrylonitrile butadiene rubber having a carboxy group (for example, acrylonitrile polybutadiene copolymer having a carboxy group), amino-terminated acrylonitrile-butadiene rubber, vinyl-terminated acrylonitrile-butadiene rubber. Examples thereof include resins having a polybutadiene skeleton such as rubber and styrene-butadiene rubber.

The liquid rubber preferably contains at least one selected from the group consisting of epoxidized polybutadiene and acrylonitrile butadiene rubber having a carboxy group, from the viewpoint of easily reducing the elastic modulus of the adhesive for semiconductors. From the viewpoint of easily obtaining excellent coating workability and adhesive strength, it is preferable to use epoxidized polybutadiene and acrylonitrile butadiene rubber having a carboxy group together.

Epoxidized polybutadiene can be easily obtained by epoxidizing commercially available polybutadiene with hydrogen peroxide solution or peracids. The epoxidized polybutadiene is, for example, B-1000, B-3000, G-1000, G-3000 (or more, manufactured by Nippon Soda Co., Ltd.), B-1000, B-2000, B-3000, B-4000 (or more, Nippon Oil Co., Ltd.), R-15HT, R-45HT, R-45M (above, Idemitsu Petroleum Co., Ltd.), Epolide PB-3600, Epolide PB-4700 (above, Daicel Chemical Industries Ltd.), etc. are commercially available. Available as a product. The oxirane oxygen concentration of the epoxidized polybutadiene is preferably 3 to 18%, more preferably 6 to 12%.

By using an acrylonitrile butadiene rubber having a carboxy group, it is easy to obtain excellent adhesive strength. The acrylonitrile butadiene rubber having a carboxy group preferably contains a compound represented by the following general formula (d1) from the viewpoint of easily obtaining excellent adhesive strength.

[Wherein, x and y are each independently a number of 0 or more indicating the average value of the number of repetitions, x/y is 95/5 to 50/50, and m is an integer of 5 to 50. .. ]

As acrylonitrile polybutadiene having a carboxy group, Hycar CTBN-2009×162, CTBN-1300×31, CTBN-1300×8, CTBN-1300×13, CTBN-1009SP-S, CTBNX-1300×9 (all are Ube Industries Etc.) are available as commercial products.

The number average molecular weight of the liquid rubber is preferably 500 or more, more preferably 1000 or more, from the viewpoint of easily obtaining a sufficient flexibility effect. The number average molecular weight of the liquid rubber is preferably 10,000 or less, more preferably 5,000 or less, from the viewpoint of suppressing an excessive increase in the viscosity of the adhesive for semiconductors and easily obtaining excellent coating workability. From these viewpoints, the number average molecular weight of the liquid rubber is preferably 500 to 10000, more preferably 1000 to 5000. The number average molecular weight of the liquid rubber can be measured by gel permeation chromatography (GPC) under the following conditions and converted from a calibration curve using standard polystyrene.
[GPC conditions]
Pump: Hitachi L-6000 (manufactured by Hitachi, Ltd.)
Detector: Hitachi L-3300 RI (manufactured by Hitachi, Ltd.)
Column: Gelpack GL-R420 + Gelpack GL-R430 + Gelpack GL-R430 (3 in total) (Hitachi Chemical Co., Ltd., trade name)
Eluent: THF
Sample concentration: 250mg/5mL
Injection volume: 50 μL
Pressure: 441 Pa (45 kgf/cm ² )
Flow rate: 1.75 mL/min

The liquid rubber content is preferably in the following range based on the total amount of component (D). The content of the liquid rubber is preferably 5% by mass or more, more preferably 8% by mass or more, and further preferably 10% by mass or more, from the viewpoint of easily obtaining excellent thermal conductivity and easily obtaining excellent adhesive strength. It is preferably 14% by mass or more and particularly preferably. The content of the liquid rubber is preferably 50% by mass or less, more preferably 40% by mass or less, and further preferably 35% by mass or less from the viewpoint of easily obtaining excellent thermal conductivity and easily obtaining excellent adhesive strength. It is preferably 30% by mass or less, and particularly preferably 30% by mass or less. From these viewpoints, the content of the liquid rubber is preferably 5 to 50% by mass, more preferably 8 to 40% by mass.

Examples of the thermoplastic resin include polyvinyl acetate, polymethyl acrylate, ε-caprolactone modified polyester, phenoxy resin, polyimide, and the copolymer represented by the following general formula (d2).

[In the formula, R ⁵¹ and R ⁵² are each independently a hydrogen atom or a methyl group, r, s, t, and u are each independently a number of 0 or more indicating the average value of the number of repetitions, and r+t is It is 0.1 or more (preferably 0.3 to 5), and s+u is 1 or more (preferably 1 to 100). ]

The number average molecular weight of the thermoplastic resin is preferably 10,000 or more, and more preferably 20,000 or more from the viewpoint that a sufficient flexibility effect is easily obtained. The number average molecular weight of the thermoplastic resin is preferably 300,000 or less, and more preferably 200,000 or less from the viewpoint that an excessive increase in the viscosity of the adhesive for semiconductors is suppressed and excellent coating workability is easily obtained. From these viewpoints, the number average molecular weight of the thermoplastic resin is preferably 10,000 to 300,000, and more preferably 20,000 to 200,000. The number average molecular weight of the thermoplastic resin can be measured by the same method as the number average molecular weight of liquid rubber.

The thermoplastic resin content is preferably in the following range based on the total amount of component (D). The content of the thermoplastic resin is preferably 50% by mass or more, more preferably 60% by mass or more, and 65% by mass or more from the viewpoint of easily obtaining excellent thermal conductivity and the viewpoint of easily obtaining excellent adhesive strength. More preferably, 70% by mass or more is particularly preferable. The content of the thermoplastic resin is preferably 95% by mass or less, more preferably 92% by mass or less, and 90% by mass or less from the viewpoint of easily obtaining excellent thermal conductivity and easily obtaining excellent adhesive strength. More preferably, 86% by mass or less is particularly preferable. From these viewpoints, the content of the thermoplastic resin is preferably 50 to 95% by mass, more preferably 60 to 92% by mass.

The content of the component (D) is preferably in the following range with respect to 100 parts by mass of the component (B). The content of the component (D) is preferably 30 parts by mass or more, more preferably 40 parts by mass or more, further preferably 50 parts by mass or more, and 60 parts by mass or more from the viewpoint that a sufficient softening effect is easily obtained. Particularly preferred. The content of the component (D) is preferably 100 parts by mass or less, more preferably 80 parts by mass or less, from the viewpoint that an excessive increase in viscosity of the semiconductor adhesive is suppressed and excellent coating workability is easily obtained. It is more preferably 70 parts by mass or less. From these viewpoints, the content of the component (D) is preferably 30 to 100 parts by mass, more preferably 40 to 80 parts by mass, and further preferably 50 to 70 parts by mass.

(Component (E): coupling agent)
The adhesive for semiconductors according to the present embodiment may contain a coupling agent (hereinafter, sometimes referred to as “(E) component”). Examples of the component (E) include a silane coupling agent, a titanate coupling agent, an aluminum coupling agent, a zirconate coupling agent, and a zircoaluminate coupling agent.

Examples of silane coupling agents include methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltriacetoxysilane, and vinyl-tris(2-methoxyethoxy). ) Silane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, methyltri(methacryloxyethoxy)silane, γ-acryloxypropyltrimethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyl Triethoxysilane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, N-β-(aminoethyl)-γ-aminopropylmethyldimethoxysilane, N-β-(N-vinylbenzylaminoethyl) -Γ-aminopropyltrimethoxysilane, γ-anilinopropyltrimethoxysilane, γ-ureidopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, 3-(4,5-dihydroimidazolyl)propyltriethoxysilane, β -(3,4-Epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, γ-glycidoxypropylmethyldiisopropenoxysilane, methyltrigly Sidoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, γ-mercaptopropylmethyldimethoxysilane, trimethylsilylisocyanate, dimethylsilylisocyanate, phenylsilyltriisocyanate, tetraisocyanatesilane, methylsilyltriisocyanate, vinyl Examples thereof include silyl triisocyanate and ethoxysilane triisocyanate. Examples of titanate coupling agents include isopropyl triisostearoyl titanate, isopropyl tridodecylbenzenesulfonyl titanate, isopropyl tris(dioctyl pyrophosphate) titanate, tetraisopropyl bis(dioctyl phosphite) titanate, tetraoctyl bis(ditridecyl phosphite) titanate. , Tetra(2,2-diallyloxymethyl-1-butyl)bis(di-tridecyl)phosphite titanate, bis(dioctylpyrophosphate)oxyacetate titanate, bis(dioctylpyrophosphate)ethylene titanate, isopropyl trioctanoyl titanate, Examples thereof include isopropyl dimethacryl isostearoyl titanate, isopropyl (dioctyl phosphate) titanate, isopropyl tricumyl phenyl titanate, isopropyl tri(N-aminoethyl aminoethyl) titanate, dicumyl phenyloxyacetate titanate, and diisostearoyl ethylene titanate. Examples of the aluminum-based coupling agent include acetoalkoxyaluminum diisopropionate. Examples of the zirconate coupling agent include tetrapropyl zirconate, tetrabutyl zirconate, tetra(triethanolamine) zirconate, tetraisopropyl zirconate, zirconium acetylacetonate, acetylacetone zirconium butyrate, zirconium stearate butyrate. ..

The content of the component (E) is preferably in the following range with respect to 100 parts by mass of the component (B). The content of the component (E) is preferably 3 parts by mass or more, more preferably 5 parts by mass or more, and further preferably 8 parts by mass or more, from the viewpoint of easily obtaining excellent adhesive strength. The content of the component (E) is preferably 30 parts by mass or less, more preferably 20 parts by mass or less, and further preferably 10 parts by mass or less, from the viewpoint of easily obtaining excellent adhesive strength. From these viewpoints, the content of the component (E) is preferably 3 to 30 parts by mass, more preferably 5 to 20 parts by mass.

(Other ingredients)
The semiconductor adhesive according to the present embodiment is, if necessary, a moisture absorbent such as calcium oxide or magnesium oxide; a fluorosurfactant, a nonionic surfactant, a wettability improver such as a higher fatty acid; a silicone oil or the like. Defoaming agent; an ion trap agent such as an inorganic ion exchanger; a solvent and the like. The viscosity may be adjusted by using a solvent. When a solvent is used, the content of the solvent is preferably 3% by mass or less based on the total amount of the adhesive for semiconductors, from the viewpoint of easily suppressing the generation of voids and the like. The semiconductor adhesive according to the present embodiment does not need to contain a solvent from the viewpoint of easily suppressing the generation of outgas and easily obtaining good wettability of the adhesive with respect to the supporting member (there is no solvent. Good).

The viscosity (25° C.) of the semiconductor adhesive according to the present embodiment at a rotation speed of 0.5 rpm is preferably 300 Pa·s or less, more preferably 200 Pa·s or less, from the viewpoint of easily obtaining excellent coating workability. It is more preferably 150 Pa·s or less, particularly preferably 100 Pa·s or less, extremely preferably 80 Pa·s or less, very preferably 70 Pa·s or less, and even more preferably 65 Pa·s or less. The viscosity (25° C.) at a rotation speed of 0.5 rpm of the adhesive for a semiconductor according to the present embodiment is 30 Pa from the viewpoint that it is easy to obtain the excellent storage stability of the adhesive for a semiconductor because the sedimentation of silver particles is easily suppressed. ·S or more is preferable, 40 Pa·s or more is more preferable, and 50 Pa·s or more is further preferable. From these viewpoints, the viscosity (25° C.) of the adhesive for semiconductors at a rotation speed of 0.5 rpm is preferably 30 to 300 Pa·s. The viscosity (25° C.) at the rotation speed of 5 rpm of the adhesive for a semiconductor according to the present embodiment is preferably 40 Pa·s or less, more preferably 35 Pa·s or less, and 30 Pa·s from the viewpoint of easily obtaining excellent coating workability. s or less is more preferable, and 25 Pa·s or less is particularly preferable. The viscosity (25° C.) of the adhesive for semiconductors according to the present embodiment at a rotation speed of 5 rpm is 10 Pa·s from the viewpoint that it is easy to suppress sedimentation of silver particles, and thus it is easy to obtain excellent storage stability of the adhesive for semiconductors. The above is preferable, 15 Pa·s or more is more preferable, and 20 Pa·s or more is further preferable. From these viewpoints, the viscosity (25° C.) of the semiconductor adhesive at a rotation speed of 5 rpm is preferably 10 to 40 Pa·s. The viscosity can be measured using a Brookfield viscometer.

<Semiconductor parts>
The semiconductor component according to the present embodiment includes a support member, a semiconductor element, and an adhesive layer disposed between the support member and the semiconductor element, and the adhesive layer is the semiconductor adhesive according to the present embodiment. Alternatively, it includes a cured product thereof. The semiconductor element is mounted on the support member via the adhesive layer. The adhesive layer is in contact with the support member and the semiconductor element. In the semiconductor component according to the present embodiment, by using the adhesive for a semiconductor according to the present embodiment, heat generated from the semiconductor element can be efficiently dissipated to the outside, and the semiconductor element and the supporting member are highly expensive. Adhesive strength can be obtained. The semiconductor device according to this embodiment includes the semiconductor component according to this embodiment.

As the supporting member (supporting member for mounting a semiconductor element), a lead frame such as 42 alloy lead frame, copper lead frame, palladium PPF lead frame; glass epoxy substrate (substrate made of glass fiber reinforced epoxy resin), BT substrate (cyanate monomer) And an organic substrate such as a BT resin substrate comprising an oligomer thereof and bismaleimide). Examples of semiconductor elements include ICs, LSIs, LED chips and the like. The thickness of the semiconductor element may be 600 μm or less, 500 μm or less, and 400 μm or less.

The semiconductor component according to the present embodiment may include a sealing portion that seals a part or all of the semiconductor element. A transparent resin can be used as a constituent material of the sealing portion. The sealing portion may seal a part or all of the support member.

The method for manufacturing a semiconductor component according to this embodiment includes an adhesive layer forming step of disposing the semiconductor adhesive according to this embodiment between a support member and a semiconductor element to form an adhesive layer. The adhesive for semiconductors according to the present embodiment can be obtained by collectively or dividing the constituent components and mixing them using a stirrer, a hybrid mixer, a liquor machine, a three-roll, a planetary mixer or the like.

The method for manufacturing a semiconductor component according to the present embodiment may include a step of curing (thermosetting, etc.) the adhesive layer to obtain a cured product after the adhesive layer forming step. The method for manufacturing a semiconductor component according to this embodiment may include a wire bonding step of wire bonding a semiconductor element after the adhesive layer forming step. The method for manufacturing a semiconductor component according to this embodiment may include a step of sealing the semiconductor element after the adhesive layer forming step.

To bond the semiconductor element to the support member using the semiconductor adhesive, for example, first, apply the semiconductor adhesive on the support member by a dispensing method, a screen printing method, a stamping method, or the like, and then press-bond the semiconductor element. Then, the adhesive for semiconductors is heated and cured using a heating device (oven, heat block, etc.). Furthermore, after the wire bonding step, the semiconductor element can be sealed by a usual method.

The temperature of the above-mentioned heat curing varies depending on the conditions such as long-time curing at low temperature and fast curing at high temperature, but is, for example, 150 to 220° C. (preferably 180 to 200° C.) for 30 seconds to 2 hours (preferably 1 hour to 1 hour 30 minutes).

FIG. 1 is a schematic cross-sectional view showing an example of a semiconductor component according to this embodiment. As shown in FIG. 1, the semiconductor component 10 includes a support member 11, a semiconductor element 13, an adhesive layer 15, and a sealing portion 17. The adhesive layer 15 is disposed between the support member 11 and the semiconductor element 13, and contains the semiconductor adhesive according to the present embodiment or a cured product thereof. The sealing portion 17 seals the support member 11, the semiconductor element 13, and the adhesive layer 15. The semiconductor element 13 is connected to the lead frame 19b via the wire 19a.

FIG. 2 is a schematic cross-sectional view showing another example of the semiconductor component according to this embodiment. As shown in FIG. 2, the semiconductor component 20 includes a support member 21, a semiconductor element (LED chip) 23, an adhesive layer 25, and a sealing portion 27. The support member 21 has a substrate 21a and a lead frame 21b formed so as to surround the substrate 21a. The adhesive layer 25 is disposed between the support member 21 and the semiconductor element 23, and includes the semiconductor adhesive according to the present embodiment or a cured product thereof. The sealing portion 27 seals the semiconductor element 23 and the adhesive layer 25. The semiconductor element 23 is connected to the lead frame 21b via a wire 29.

Hereinafter, the contents of the present invention will be described in more detail using examples and comparative examples, but the present invention is not limited to the following examples.

<Components of adhesive for semiconductors>
(Silver particles)
AgC-221PA (manufactured by Fukuda Metal Foil & Powder Co., Ltd., trade name, shape: scaly, BET specific surface area: 0.20 m ² /g, average particle size: 7.5 μm)
AgC-271B (manufactured by Fukuda Metal Foil & Powder Co., Ltd., trade name, shape: scaly, BET specific surface area: 0.50 m ² /g, average particle diameter: 2.1 μm)
AgC-221Q3 (manufactured by Fukuda Metal Foil & Powder Co., Ltd., trade name, shape: scaly, BET specific surface area: 0.35 m ² /g)
TC-88 (manufactured by Tokuriki Kagaku Kenkyusho Co., Ltd., trade name, shape: scaly, BET specific surface area: 1.05 m ² /g)

(Monomer having (meth)acryloyl group)
FA-512A (dicyclopentenyloxyethyl acrylate, manufactured by Hitachi Chemical Co., Ltd., trade name, compound represented by the following formula (b51))
SR-339A (2-phenoxyethyl acrylate, manufactured by Sartomer Co., Ltd., trade name, compound represented by the following formula (b52))
SR-349 (EO-modified bisphenol A diacrylate, manufactured by Sartomer, trade name, compound represented by the following formula (b53))

(Radical polymerization initiator)
Trigonox 22-70E (1,1-bis(t-butylperoxy)cyclohexane, manufactured by Kayaku Akzo Co., Ltd.)

(Flexibility agent)
EPORIDE PB-4700 (Epoxidized polybutadiene, manufactured by Daicel Chemical Industries, Ltd., trade name, epoxy equivalent: 152.4 to 177.8, number average molecular weight: 3500)
CTBN-1009SP-S (acrylonitrile polybutadiene copolymer having a carboxy group, Ube Industries, Ltd., trade name, number average molecular weight: 3600)

(Coupling agent)
KBM-403 (γ-glycidoxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd., trade name)

<Preparation of adhesive for semiconductors>
The components shown in Table 1 (unit of blending amount: parts by mass) were mixed and then kneaded using a hybrid mixer. Next, defoaming treatment was performed at 666.61 Pa (5 Torr) or less for 3 minutes to obtain a semiconductor adhesive (conductive composition).

<Evaluation>
The thermal conductivity, viscosity and die shear strength (adhesive strength) were evaluated by the methods shown below. The results are shown in Table 1. The die shear strength was evaluated only for the examples.

(Thermal conductivity)
A cured product was obtained by heating the adhesive for semiconductors to 180° C. for 1 hour using an oven and then holding it at 180° C. for 1 hour. Then, after measuring the thermal diffusivity, the specific gravity and the specific heat using the following measuring device, the thermal conductivity was calculated by the following formula.
[measuring device]
Thermal diffusivity: Laser flash method thermal constant measurement device (Netzsch, LFA 467 HyperFlash)
Specific heat: DSC (QA-200, manufactured by TA Instruments Japan Co., Ltd.)
Specific gravity: Electronic hydrometer (Alpha Mirage, SD-200L)
[Calculation formula]
λ=α×ρ×C _p
λ: thermal conductivity (W/m/K)
α: thermal diffusivity (mm ² /s)
ρ: Specific gravity (g/cm ³ )
C _p : Specific heat (J/g/K)

(viscosity)
Using a Brookfield viscometer (manufactured by Brookfield Engineering Laboratories, HADV-III U CP), the amount of the adhesive was 0.5 mL, the temperature was 25° C., the rotation speed was 0.5 rpm or 5 rpm. The viscosity was obtained.

(Die shear strength)
About 1.5 mg of the adhesive for semiconductors was applied onto the copper lead frame with silver ring plating, and then a 5 mm×5 mm silicon chip (thickness: 400 μm) was pressure-bonded onto the adhesive for semiconductor. Further, the temperature was raised to 180° C. in 30 minutes using an oven, and the temperature was kept at 180° C. for 1 hour to cure the adhesive for semiconductors to obtain a semiconductor component. The shear adhesive strength (MPa) at 250° C. of the semiconductor component was measured using an automatic adhesive strength tester (BT4000, manufactured by Dage). The average value of the measurement results of 10 semiconductor components was obtained as the measurement result of the die shear strength.

As shown in Table 1, it is confirmed that the example has higher thermal conductivity than the comparative example. In addition, in the examples, it is confirmed that excellent thermal conductivity, coating workability (viscosity) and adhesive strength are obtained.

10, 20... Semiconductor parts, 11, 21... Support member, 13, 23... Semiconductor element, 15, 25... Adhesive layer, 17, 27... Sealing part, 19a, 29... Wire, 19b, 21b... Lead frame, 21a... Substrate.

Claims

Containing (A) silver particles and (B) a monomer having a (meth)acryloyl group,
The component (A) contains first silver particles,
The BET specific surface area of the first silver particles is 0.3 m 2 /g or less,
An adhesive for semiconductors, wherein the average particle size of the first silver particles is 7.0 μm or more.
The adhesive for a semiconductor according to claim 1, wherein the first silver particles have a scaly shape.
The adhesive for a semiconductor according to claim 1 or 2, wherein the first silver particles have an average particle size of 7.0 to 8.5 μm.
The adhesive for semiconductors according to any one of claims 1 to 3, wherein the content of the first silver particles is 50% by mass or more based on the total amount of the component (A).
The adhesive for semiconductors according to any one of claims 1 to 4, wherein the content of the first silver particles is 30 to 95 mass% based on the total amount of the adhesive for semiconductors.
The component (A) further contains second silver particles,
The adhesive for semiconductors according to any one of claims 1 to 5, wherein the BET specific surface area of the second silver particles exceeds 0.3 m 2 /g.
The component (B) is selected from the group consisting of a compound represented by the following general formula (b21), a compound represented by the following general formula (b22), and a compound represented by the following general formula (b23). The semiconductor adhesive according to any one of claims 1 to 6, containing at least one kind.

[In the formula, R 21 , R 22 and R 23 each independently represent a hydrogen atom or a methyl group, and n 22 and n 23 each independently represent an integer of 1 to 3. ]
The semiconductor adhesive according to any one of claims 1 to 7, wherein the content of the component (B) is 1 to 20 parts by mass relative to 100 parts by mass of the component (A).
Further contains a radical polymerization initiator,
The adhesive for semiconductors according to any one of claims 1 to 8, wherein the content of the radical polymerization initiator is 3 to 30 parts by mass with respect to 100 parts by mass of the component (B).
A cured product of the adhesive for semiconductors according to any one of claims 1 to 9.
A support member, a semiconductor element, and an adhesive layer disposed between the support member and the semiconductor element,
A semiconductor component, wherein the adhesive layer contains the adhesive for semiconductors according to any one of claims 1 to 9 or a cured product thereof.