WO2020118846A1 - 有机发光二极管（ｏｌｅｄ）面板及制作方法 - Google Patents

有机发光二极管（ｏｌｅｄ）面板及制作方法 Download PDF

Info

Publication number
WO2020118846A1
WO2020118846A1 PCT/CN2019/071814 CN2019071814W WO2020118846A1 WO 2020118846 A1 WO2020118846 A1 WO 2020118846A1 CN 2019071814 W CN2019071814 W CN 2019071814W WO 2020118846 A1 WO2020118846 A1 WO 2020118846A1
Authority
WO
WIPO (PCT)
Prior art keywords
organic light
light emitting
emitting diode
flexible substrate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/071814
Other languages
English (en)
French (fr)
Inventor
商纶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US16/349,620 priority Critical patent/US20210184166A1/en
Publication of WO2020118846A1 publication Critical patent/WO2020118846A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/16—Electron transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to the technical field of a flexible substrate, in particular to a flexible substrate of an organic light emitting diode (OLED) display device.
  • OLED organic light emitting diode
  • the OLED display device does not require a backlight, and uses a very thin organic material coating and a glass substrate. These organic materials emit light when current passes, and the OLED display screen is lighter and thinner than the traditional liquid crystal display screen, the viewing angle is also larger, and it can significantly save power.
  • OLED panels are required to reduce the failure of the results in the bending area, but also have the characteristics of flexibility, environmental protection, high extension and high stability.
  • the flexible substrate in the OLED display device undergoes multiple dynamic bending, defects such as breakage are prone to occur. Therefore, it is necessary to provide a flexible substrate to solve the problems in the prior art.
  • the present invention provides a method for manufacturing an organic light-emitting diode (OLED) panel, which includes providing a glass substrate and a flexible substrate.
  • the flexible substrate is composed of a thermoplastic polyurethane elastic rubber, and the flexible substrate and the glass substrate are correspondingly laminated and heated
  • the flexible substrate is to bond the flexible substrate and the glass substrate, form an organic light emitting diode assembly on the flexible substrate, form an encapsulation layer on the organic light emitting diode assembly, and separate the flexible substrate and the glass substrate.
  • the organic light emitting diode panel further includes forming a metal layer on the edge of the glass substrate and forming a support layer on the inner side of the metal layer.
  • the support layer includes silicon nitride or silicon dioxide.
  • the metal layer includes iron, zinc or chromium.
  • the flexible substrate includes a first surface and a second surface opposite to each other, and the first surface and the second surface are coated with ink.
  • the organic light emitting diode assembly includes an anode, an organic material layer and a cathode, and the organic material layer is disposed between the anode and the cathode.
  • the organic material layer includes a hole transport layer, an organic light emitting layer, and an electron transport layer, and the organic light emitting layer is disposed between the hole transport layer and the electron transport layer.
  • the hole transport layer is disposed between the anode and the organic light-emitting layer.
  • the electron transport layer is disposed between the organic light-emitting layer and the cathode.
  • the method further includes coating plastic polyurethane elastic rubber on the bottom plate, and performing soft baking and cutting to form a flexible substrate.
  • another embodiment of the present invention further provides an organic light emitting diode (OLED) panel, which includes a flexible substrate composed of a thermoplastic polyurethane elastic rubber, an organic light emitting diode assembly disposed on the flexible substrate, and an organic light emitting diode assembly disposed on the light emitting diode assembly Encapsulation layer.
  • OLED organic light emitting diode
  • the flexible substrate includes a first surface and a second surface opposite to each other, and the first surface and the second surface are coated with ink.
  • the organic light emitting diode assembly includes an anode, an organic material layer and a cathode, and the organic material layer is disposed between the anode and the cathode.
  • the organic material layer includes a hole transport layer, an organic light emitting layer, and an electron transport layer, and the organic light emitting layer is disposed between the hole transport layer and the electron transport layer.
  • the hole transport layer is disposed between the anode and the organic light-emitting layer.
  • the electron transport layer is disposed between the organic light-emitting layer and the cathode.
  • it further includes forming a flexible substrate by coating plastic polyurethane elastic rubber on the bottom plate, and performing soft baking and cutting.
  • the flexible substrate in the organic light emitting diode panel of the present invention has good stability and ductility, and can also reduce the probability of bending failure of the flexible substrate, thereby saving manufacturing costs.
  • OLED organic light emitting diode
  • a flexible substrate composed of a thermoplastic polyurethane elastic rubber
  • an organic light emitting diode assembly disposed on the flexible substrate
  • an encapsulation layer disposed on the light emitting diode assembly.
  • the flexible substrate includes a first surface and a second surface opposite to each other, the first surface and the second surface are coated with ink
  • the organic light emitting diode assembly includes an anode, an organic material layer, and a cathode.
  • the organic material layer is provided between the anode and the cathode.
  • the organic material layer includes a hole transport layer, an organic light emitting layer, and an electron transport layer, and the organic light emitting layer is disposed between the hole transport layer and the electron transport layer.
  • it further includes forming a flexible substrate by coating plastic polyurethane elastic rubber on the bottom plate, and performing soft baking and cutting.
  • the flexible substrate in the organic light emitting diode panel of the present invention has good stability and ductility, and can also reduce the probability of bending failure of the flexible substrate, thereby saving manufacturing costs.
  • FIG. 1 is a schematic view of the side structure of a flexible substrate corresponding to a glass substrate according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of a first area and a second area of a flexible substrate according to an embodiment of the present invention
  • 3 is a flexible substrate in an embodiment of the present invention showing a bent state
  • FIG. 4 is a schematic structural view of an organic light emitting diode assembly formed on a flexible substrate according to an embodiment of the present invention.
  • An embodiment of the present invention provides a method for manufacturing an organic light emitting diode (OLED) panel.
  • the method for manufacturing an organic light emitting diode panel includes providing a glass substrate, forming a metal layer on the edge of the glass substrate, forming a support layer on the inner side of the metal layer, providing Flexible substrate 20, correspondingly bonding the flexible substrate 20 and the glass substrate, heating the flexible substrate 20, bonding the flexible substrate 20 and the glass substrate, forming the organic light emitting diode assembly 100 on the flexible substrate 20, forming the package on the organic light emitting diode assembly 100 Layer (not shown) and separate the flexible substrate 20 and the glass substrate 10.
  • the organic light emitting diode assembly 100 includes an anode 30, an organic material layer 101 and a cathode 70.
  • the organic material layer 101 is disposed between the anode 30 and the cathode 70, wherein the organic material layer 101 includes a hole transport layer 40, an organic light emitting layer 50 and Electron transport layer 60.
  • the flexible substrate 20 of the embodiment of the present invention is coated with a curing adhesive, and then the flexible substrate 20 is laminated to the glass substrate correspondingly, the first One area 5 corresponds to the side of the support layer on the glass substrate, the second area 6 of the flexible substrate 20 corresponds to the upper surface of the support layer on the glass substrate, and the first area 5 and the second area 6 of the flexible substrate 20 The area can be adjusted as needed.
  • the fixing member 13 is attached to fix.
  • the flexible substrate 20 of the embodiment of the present invention is composed of plastic polyurethane elastic rubber.
  • the flexible substrate 20 has good stability and ductility, and can also reduce the probability of bending failure of the flexible substrate.
  • the flexible substrate 20 is prepared by coating plastic polyurethane elastic rubber on the bottom plate, and performing soft baking and cutting, thereby forming a flexible substrate 20 composed of plastic polyurethane elastic rubber.
  • the flexible substrate 20 has a first surface and a second surface opposed to each other, ink is coated on the first surface and the second surface, and the thickness of the flexible substrate 20 is equal to or less than 10 ⁇ m.
  • the support layer includes silicon nitride or silicon dioxide.
  • the metal layer includes iron, zinc or chromium.
  • the organic light emitting diode assembly 100 is formed on the flexible substrate 20, and an encapsulation layer (not shown) is formed on the organic light emitting diode assembly 100 and the flexible substrate 20 and the glass substrate are separated.
  • the organic light emitting diode assembly 100 includes an anode 30, an organic material layer 101 and a cathode 70.
  • the organic material layer 101 is disposed between the anode 30 and the cathode 70.
  • the organic material layer 101 includes a hole transport layer 40 provided between the anode 30 and the organic light emitting layer 70, an organic light emitting layer 50 provided between the hole transport layer 40 and the electron transport layer 60, and an organic light emitting layer 50 and The electron transport layer 60 between the cathode 70.
  • the organic light emitting diode panel includes a flexible substrate 20 composed of a thermoplastic polyurethane elastic rubber, an organic light emitting diode assembly 100 disposed on the flexible substrate 20, and a The encapsulation layer on the LED assembly 100.
  • the flexible substrate in the organic light emitting diode panel of the present invention has good stability and ductility, and can also reduce the probability of bending failure of the flexible substrate, thereby saving manufacturing costs.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种有机发光二极管(OLED)面板及有机发光二极管面板的制作方法。有机发光二极管面板的制作方法包括提供玻璃基板、形成金属层在玻璃基板的边缘上、形成支撑层在金属层的内侧、提供由热塑性聚氨酯弹性橡胶组成柔性基板（20）、将柔性基板（20）与玻璃基板对应贴合、加热柔性基板（20）使柔性基板（20）与玻璃基板黏合、形成有机发光二极管组件（100）在柔性基板（20）上、在有机发光二极管组件（100）上形成封装层以及分离柔性基板（20）与玻璃基板。

Description

有机发光二极管（ＯＬＥＤ）面板及制作方法 技术领域
本发明是有关于一种柔性基板的技术领域，特别是有关于一种有机发光二极管（ＯＬＥＤ）显示装置的柔性基板。
 背景技术
ＯＬＥＤ显示装置无需背光灯，且采用非常薄的有机材料涂层和玻璃基板。当有电流通过时这些有机材料就会发光，且OLED显示屏幕比传统的液晶显示屏幕更轻更薄，可视角度也更大，并且能够显著节省电能。
ＯＬＥＤ面板要求在弯折区能降低结果的失效，同时还能具有柔韧、环保、高延展及高稳定等性质。目前OLED显示设备中的柔性基板经过多次动态弯折时，容易发生断裂等缺陷，故，有必要提供一种柔性基板，以解决现有技术所存在的问题。
 技术问题
目前ＯＬＥＤ显示设备中的柔性基板经过多次动态弯折时，容易发生断裂等缺陷
 技术解决方案
有鉴于此，本发明提供一种有机发光二极管（ＯＬＥＤ）面板的制作方法，包括提供玻璃基板、提供柔性基板，柔性基板是由热塑性聚氨酯弹性橡胶组成、将柔性基板与玻璃基板对应贴合、加热柔性基板，使柔性基板与玻璃基板黏合、形成有机发光二极管组件在柔性基板上、在有机发光二极管组件上形成封装层以及分离柔性基板与玻璃基板。
在本发明的一实施例中，有机发光二极管面板还包括形成金属层在玻璃基板的边缘上及形成支撑层在金属层的内侧。
在本发明的一实施例中，支撑层包括氮化硅或二氧化硅。
在本发明的一实施例中，金属层包括铁、锌或铬。
在本发明的一实施例中，柔性基板包括彼此相对的第一表面和第二表面，第一表面和第二表面涂布油墨。
在本发明的一实施例中，有机发光二极管组件包括阳极、有机材料层及阴极，以及有机材料层设置在阳极与阴极之间。
在本发明的一实施例中，有机材料层包括空穴传输层、有机发光层及电子传输层，以及有机发光层设置在空穴传输层和电子传输层之间。
在本发明的一实施例中，空穴传输层设置在阳极和有机发光层之间。
在本发明的一实施例中，电子传输层设置在有机发光层和阴极之间。
在本发明的一实施例中，还包括涂布塑性聚氨酯弹性橡胶在底板上，并进行软烤和切割形成柔性基板。
再者，本发明另一实施例另提供一种有机发光二极管（ＯＬＥＤ）面板，包括由热塑性聚氨酯弹性橡胶组成的柔性基板、设置在柔性基板上的有机发光二极管组件以及设置在发光二极管组件上的封装层。
在本发明的一实施例中，柔性基板包括彼此相对的第一表面和第二表面，第一表面和第二表面涂布油墨。
在本发明的一实施例中，有机发光二极管组件包括阳极、有机材料层及阴极，以及有机材料层设置在阳极与阴极之间。
在本发明的一实施例中，有机材料层包括空穴传输层、有机发光层及电子传输层，以及有机发光层设置在空穴传输层和电子传输层之间。
在本发明的一实施例中，空穴传输层设置在阳极和有机发光层之间。
在本发明的一实施例中，电子传输层设置在有机发光层和阴极之间。
在本发明的一实施例中，还包括通过涂布塑性聚氨酯弹性橡胶在底板上，并进行软烤和切割形成柔性基板。
本发明的有机发光二极管面板中的柔性基板具有良好的稳定性及延展性，还能降低柔性基板弯折失效的机率，进而节省制作成本。
本发明另一实施例還提供一种有机发光二极管（ＯＬＥＤ）面板，包括由热塑性聚氨酯弹性橡胶组成的柔性基板、设置在柔性基板上的有机发光二极管组件以及设置在发光二极管组件上的封装层。柔性基板包括彼此相对的第一表面和第二表面，第一表面和第二表面涂布油墨，有机发光二极管组件包括阳极、有机材料层及阴极。有机材料层设置在阳极与阴极之间。
在本发明的一实施例中，有机材料层包括空穴传输层、有机发光层及电子传输层，以及有机发光层设置在空穴传输层和电子传输层之间。
在本发明的一实施例中，还包括通过涂布塑性聚氨酯弹性橡胶在底板上，并进行软烤和切割形成柔性基板。
 有益效果
本发明的有机发光二极管面板中的柔性基板具有良好的稳定性及延展性，还能降低柔性基板弯折失效的机率，进而节省制作成本。
 附图说明
图1是本发明实施例的柔性基板对应贴合玻璃基板的侧面结构示意图；
图2是本发明实施例的柔性基板的第一区及第二区的结构示意图；
图3是本发明实施例的柔性基板呈现弯折状态；及
图4是本发明实施例的柔性基板上形成有机发光二极管组件的结构示意图。
 本发明的实施方式
为让本发明的上述内容能更明显易懂，下文特举优选实施例，并配合所附图式作详细说明。
本发明实施例提供一种有机发光二极管（ＯＬＥＤ）面板的制作方法，有机发光二极管面板的制作方法包括提供玻璃基板、形成金属层在玻璃基板的边缘上、形成支撑层在金属层的内侧、提供柔性基板20、将柔性基板20与玻璃基板对应贴合、加热柔性基板20，使柔性基板20与玻璃基板黏合、形成有机发光二极管组件100在柔性基板20上、在有机发光二极管组件100上形成封装层(未图式)以及分离柔性基板20与玻璃基板10。另外，有机发光二极管组件100包括阳极30、有机材料层101及阴极70，有机材料层101设置在阳极30与阴极70之间，其中有机材料层101包括空穴传输层40、有机发光层50及电子传输层60。
详言之，请参照图1至图3，本发明实施例的玻璃基板上的支撑层的侧面涂上固化胶着剂，接着将柔性基板20与玻璃基板对应贴合时，其中柔性基板20的第一区5对应贴合玻璃基板上的支撑层侧面，柔性基板20的第二区6对应贴合玻璃基板上的支撑层的上表面，另外柔性基板20的第一区5与第二区6的面积可以依据需要进行适当调整。当柔性基板20与玻璃基板对应贴合完成时，贴上固定件13以进行固定。值得注意的是，本发明实施例的柔性基板20是由塑性聚氨酯弹性橡胶组成，柔性基板20具有良好的稳定性及延展性，还能降低柔性基板弯折失效的几率。
具体而言，柔性基板20的制备是通过涂布塑性聚氨酯弹性橡胶在底板上，并进行软烤与切割，进而形成由塑性聚氨酯弹性橡胶组成的柔性基板20。柔性基板20具有彼此相对的第一表面和第二表面，在第一表面和第二表面涂布油墨，且柔性基板20的厚度小于等于10微米。支撑层包括氮化硅或二氧化硅。金属层包括铁、锌或铬。
当柔性基板20对应贴合玻璃基板后，在的柔性基板20上形成有机发光二极管组件100，并在有机发光二极管组件100上形成封装层(未图示)以及分离柔性基板20与玻璃基板。请参照图4，有机发光二极管组件100包括阳极30、有机材料层101及阴极70，有机材料层101设置在阳极30与阴极70之间。有机材料层101包括设置在阳极30和有机发光层70之间的空穴传输层40、设置在空穴传输层40和电子传输层60之间的有机发光层50及设置在有机发光层50和阴极70之间的电子传输层60。
本发明另一实施例提供一种有机发光二极管（ＯＬＥＤ）面板，有机发光二极管面板包括由热塑性聚氨酯弹性橡胶组成的柔性基板20、设置在所述柔性基板20上的有机发光二极管组件100以及设置在所述发光二极管组件100上的封装层。
本发明的有机发光二极管面板中的柔性基板具有良好的稳定性及延展性，还能降低柔性基板弯折失效的机率，进而节省制作成本。
虽然本发明结合其具体实施例而被描述，应该理解的是，许多替代、修改及变化对于那些本领域的技术人员将是显而易见的。因此，其意在包含落入所附权利要求书的范围内的所有替代、修改及变化。

Claims (17)

  1. 一种有机发光二极管（ＯＬＥＤ）面板的制作方法，其特征在于，包括：
    提供玻璃基板；
    提供柔性基板，所述柔性基板是由热塑性聚氨酯弹性橡胶组成；
    将所述柔性基板与所述玻璃基板对应贴合；
    加热所述柔性基板，使所述柔性基板与所述玻璃基板黏合；
    形成有机发光二极管组件在所述柔性基板上；
    在所述有机发光二极管组件上形成封装层；以及
    分离所述柔性基板与玻璃基板。
  2. 如权利要求１所述的有机发光二极管面板的制作方法，其特征在于，还包括形成金属层在所述玻璃基板的边缘上及形成支撑层在所述金属层的内侧。
  3. 如权利要求2所述的有机发光二极管面板的制作方法，其特征在于，所述支撑层包括氮化硅或二氧化硅。
  4. 如权利要求2所述的有机发光二极管面板的制作方法，其特征在于，所述金属层包括铁、锌或铬。
  5. 如权利要求１所述的有机发光二极管面板的制作方法，其特征在于，所述柔性基板包括彼此相对的第一表面和第二表面，所述第一表面和所述第二表面涂布油墨。
  6. 如权利要求１所述的有机发光二极管面板的制作方法，其特征在于，所述有机发光二极管组件包括阳极、有机材料层及阴极，以及所述有机材料层设置在所述阳极与所述阴极之间。
  7. 如权利要求6所述的有机发光二极管面板的制作方法，其特征在于，所述有机材料层包括空穴传输层、有机发光层及电子传输层，以及所述有机发光层设置在所述空穴传输层和所述电子传输层之间。
  8. 如权利要求7所述的有机发光二极管面板的制作方法，其特征在于，所述空穴传输层设置在所述阳极和所述有机发光层之间。
  9. 如权利要求7所述的有机发光二极管面板的制作方法，其特征在于，所述电子传输层设置在所述有机发光层和所述阴极之间。
  10. 如权利要求１所述的有机发光二极管面板的制作方法，其特征在于，还包括涂布塑性聚氨酯弹性橡胶在底板上，并进行软烤和切割形成所述柔性基板。
  11. 一种有机发光二极管（ＯＬＥＤ）面板，其特征在于，包括：
    柔性基板，所述柔性基板是由热塑性聚氨酯弹性橡胶组成；
    设置在所述柔性基板上的有机发光二极管组件；以及
    设置在所述发光二极管组件上的封装层。
  12. 如权利要求11所述的有机发光二极管面板，其特征在于，所述柔性基板包括彼此相对的第一表面和第二表面，所述第一表面和所述第二表面涂布油墨。
  13. 如权利要求11所述的有机发光二极管面板，其特征在于，所述有机发光二极管组件包括阳极、有机材料层及阴极，以及有机材料层设置在所述阳极与所述阴极之间。
  14. 如权利要求13所述的有机发光二极管面板，其特征在于，所述有机材料层包括空穴传输层、有机发光层及电子传输层，以及所述有机发光层设置在所述空穴传输层和所述电子传输层之间。
  15. 如权利要求14所述的有机发光二极管面板，其特征在于，所述空穴传输层设置在所述阳极和所述有机发光层之间。
  16. 如权利要求14所述的有机发光二极管面板，其特征在于，所述电子传输层设置在所述有机发光层和所述阴极之间。
  17. 如权利要求11所述的有机发光二极管面板，其特征在于，还包括通过涂布塑性聚氨酯弹性橡胶在底板上，并进行软烤和切割形成所述柔性基板。
PCT/CN2019/071814 2018-12-12 2019-01-15 有机发光二极管（ｏｌｅｄ）面板及制作方法 Ceased WO2020118846A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/349,620 US20210184166A1 (en) 2018-12-12 2019-01-15 Organic light-emitting diode panel and method for fabricating thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811517109.7 2018-12-12
CN201811517109.7A CN109860431A (zh) 2018-12-12 2018-12-12 有机发光二极管(oled)面板及制作方法

Publications (1)

Publication Number Publication Date
WO2020118846A1 true WO2020118846A1 (zh) 2020-06-18

Family

ID=66891012

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/071814 Ceased WO2020118846A1 (zh) 2018-12-12 2019-01-15 有机发光二极管（ｏｌｅｄ）面板及制作方法

Country Status (3)

Country Link
US (1) US20210184166A1 (zh)
CN (1) CN109860431A (zh)
WO (1) WO2020118846A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110491295B (zh) * 2019-08-26 2020-07-17 苹果公司 织物覆盖的电子设备中的显示器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070059854A1 (en) * 2005-09-14 2007-03-15 Chin-Jen Huang Flexible pixel array substrate and method for fabricating the same
CN103682177A (zh) * 2013-12-16 2014-03-26 深圳市华星光电技术有限公司 柔性oled面板的制作方法
CN105283311A (zh) * 2013-03-28 2016-01-27 诺基亚技术有限公司 用于将柔性显示器的多个功能层接合到一起的方法和设备
CN107291297A (zh) * 2017-07-05 2017-10-24 张家港康得新光电材料有限公司 触控传感器、其制备方法及触控显示装置
CN107545848A (zh) * 2017-08-25 2018-01-05 武汉华星光电半导体显示技术有限公司 柔性盖板及其制作方法、柔性oled显示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070059854A1 (en) * 2005-09-14 2007-03-15 Chin-Jen Huang Flexible pixel array substrate and method for fabricating the same
CN105283311A (zh) * 2013-03-28 2016-01-27 诺基亚技术有限公司 用于将柔性显示器的多个功能层接合到一起的方法和设备
CN103682177A (zh) * 2013-12-16 2014-03-26 深圳市华星光电技术有限公司 柔性oled面板的制作方法
CN107291297A (zh) * 2017-07-05 2017-10-24 张家港康得新光电材料有限公司 触控传感器、其制备方法及触控显示装置
CN107545848A (zh) * 2017-08-25 2018-01-05 武汉华星光电半导体显示技术有限公司 柔性盖板及其制作方法、柔性oled显示装置

Also Published As

Publication number Publication date
CN109860431A (zh) 2019-06-07
US20210184166A1 (en) 2021-06-17

Similar Documents

Publication Publication Date Title
WO2019037220A1 (zh) 柔性盖板及其制作方法、柔性oled显示装置
CN104465479B (zh) 柔性显示基板母板及柔性显示基板的制备方法
WO2020118908A1 (zh) 显示装置及其制造方法
US20160343963A1 (en) Flexible oled display device and manufacturing method thereof
TWI583562B (zh) 一種柔性電子器件的製備方法
WO2020155384A1 (zh) 柔性oled模组堆叠结构及其制备方法
US20180182840A1 (en) Display panel based on flexible organic light-emitting diode, seamless splicing display device and method for manufacturing the same
CN104600092B (zh) Oled触控显示装置及其制造方法
TWM564755U (zh) 柔性顯示器
WO2016086535A1 (zh) Oled封装结构及其封装方法
CN105552247A (zh) 复合基板、柔性显示装置及其制备方法
US11476420B2 (en) Method of fabricating flexible OLED display panel and flexible OLED display panel
CN101300899A (zh) 制备具有柔性基板的器件的方法以及采用该方法制备的具有柔性基板的器件
CN106773206A (zh) 显示面板的制造方法
CN106773207B (zh) 显示面板的制造方法
WO2016101399A1 (zh) 双面oled显示装置及其制作方法
CN107195802B (zh) 一种柔性显示装置及其制作方法
WO2018179261A1 (ja) 貼り付け方法及び貼り付け装置
KR20150077829A (ko) 측부 구부림 구조를 갖는 사이드뷰 표시소자의 제조방법
WO2019029044A1 (zh) 一种柔性显示面板及其基板pi层结构、制备方法
US20150207099A1 (en) Organic light emitting diode display device
WO2019179431A1 (zh) 热转印基板、触控显示面板及其制造方法、显示装置
WO2020118846A1 (zh) 有机发光二极管（ｏｌｅｄ）面板及制作方法
WO2019014994A1 (zh) 硬化膜及其制备方法、柔性amoled显示装置
KR102397800B1 (ko) 측변 구부림 구조를 갖는 표시 장치 및 그 제조 방법

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19895363

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19895363

Country of ref document: EP

Kind code of ref document: A1